JP2005158957A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a life-time and efficiency by improving the heat dissipation of a light emitting element in a light emitting device using an LED. <P>SOLUTION: The light emitting device is constituted by mounting one or a plurality of light emitting element submount structures 3 which are provided with mounting boards 30 having wearing portions 31 and LED chips 33 mounted on the mounting boards 30, on a first substrate 1 for heat dissipation serving as the wiring board. The surface of a side different from the surface facing the substrate 1 for first heat dissipation of the light emitting element submount structure 3 is made to be in contact with or to be joined to a second substrate 2 for heat dissipation. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light emitting device using an LED (light emitting diode).

In recent years, LED chips that emit blue light or ultraviolet light have been developed using gallium nitride-based compound semiconductors. An attempt has been made to develop an LED light-emitting device that can emit light having a color different from the emission color of the LED chip, including white, by combining the LED chip with various phosphors. This LED light emitting device has advantages such as small size, light weight, and power saving, and is currently widely used as a light source for display, an alternative light source for a small light bulb, or a light source for a liquid crystal panel. However, since the current LED has a small brightness per chip, when used for an illumination light source, a liquid crystal panel light source, etc., an LED in which an LED chip is mounted and sealed on a mounting substrate having a wiring portion Generally, a plurality of packages are mounted on a printed wiring board to obtain a necessary brightness. In order to obtain a large light output, it is necessary to increase the injection current. Patent Document 1 discloses a structure in which a metal block in which an LED chip is housed in a recess is attached on a metal flat plate.
JP 2002-141558 A

  Since the current LED has an efficiency of about 10%, it has a characteristic that most of the input electric energy becomes heat, and the calorific value increases when a large amount of current flows. It is known that when the temperature of the LED rises due to heat generation, characteristics such as life and efficiency are adversely affected. However, since the printed wiring board as described above is generally formed using a resin material such as polyimide or epoxy having low thermal conductivity, there is a problem that heat generated in the LED package cannot be efficiently dissipated. It was.

  Therefore, the present applicant previously filed a patent application for a structure plan for solving this problem in Japanese Patent Application No. 2003-148050. A light emitting element submount structure composed of a mounting substrate having a wiring portion and an LED chip mounted on the mounting substrate is mounted on a wiring substrate composed of a wiring pattern formed on a metal plate via an insulating layer to emit light. Made with equipment. In this light emitting device, the wiring portion on the mounting board is drawn out in the direction of the wiring board and electrically connected to the wiring pattern, and a part of the metal plate is exposed and is in contact with the mounting board. Since the heat radiation performance is improved by bringing the exposed portion of the metal plate into contact with the mounting substrate, the heat generated in the LED chip can be quickly released to the wiring substrate side. Furthermore, since the mounting substrate and the wiring substrate are joined and the heat radiation path can be formed by a single reflow process, the manufacturing process can be simplified as compared with the conventional example.

  However, in the above-described light emitting device, there is no heat dissipation path other than the contact portion with the wiring substrate on the back surface side of the light emitting element submount structure. Therefore, if the current injected into the LED chip is increased beyond a certain limit in order to obtain the light output required for illumination, the temperature of the LED chip rises due to heat generation, which adversely affects the characteristics such as the lifetime and efficiency of the light emitting device. There was a problem of giving.

  According to the present invention, in order to solve the above-mentioned problem, as shown in FIGS. 1 and 2, a mounting substrate 30 having a wiring portion 31 and an LED chip 33 mounted on the mounting substrate 30 are provided. A light-emitting device in which one or a plurality of light-emitting element submount structures 3 are mounted on a first heat dissipation substrate 1 that also serves as a wiring board, wherein the first heat dissipation of the light-emitting element submount structure 3 is performed. The surface on the side different from the side facing the working substrate 1 is contacted or joined to the second heat dissipating substrate 2.

According to the first aspect of the present invention, since the heat dissipation path from the light emitting element submount structure is increased, the heat dissipation of the light emitting element submount structure is improved, and the temperature of the LED chip is reduced.
According to the second aspect of the present invention, heat is dissipated from the high-temperature side heat dissipation substrate to the low-temperature side heat dissipation substrate via the heat transfer section, so that the temperature distribution on the heat dissipation substrate is made uniform. As a result, the temperature of each LED chip is made uniform, and the chip temperature is further lowered as a whole.
According to the invention of claim 3, by providing the function of the light reflecting portion on the side wall surface of the opening provided in the heat dissipation substrate in the vicinity of the LED mounting portion, such a reflecting portion is provided on the mounting substrate itself. Since it is not necessary, the light emitting device can be made more compact. Further, if the heat dissipation substrate is made of a metal plate having excellent light reflectivity, the light extraction rate can be further improved.

According to the invention of claim 4, since the light-emitting element submount structure is composed of the conductive block having excellent thermal conductivity, the heat transferred from the LED chip to the mounting substrate is promptly first and second. Diffuses toward the heat dissipation substrate. Thereby, the heat dissipation of the light emitting element submount structure is improved, and the temperature of the LED chip is further reduced.
According to the invention of claim 5 or 6, the heat transferred from the LED chip to the mounting substrate is promptly first and second by including the heat dissipating member having higher heat conductivity than the mounting substrate body inside the mounting substrate. Diffuses toward the heat dissipation substrate. Thereby, the heat dissipation of the light emitting element submount structure is improved, and the temperature of the LED chip is further reduced.
According to the seventh aspect of the present invention, the distance between adjacent light emitting element submount structures can be maximized. Therefore, the temperature of the light emitting element submount can be lowered, and the temperature of the LED chip is further lowered.

  FIG. 1 shows a schematic structure of a preferred embodiment of the light emitting device of the present invention. FIG. 1 is a cross-sectional view, and the upper part of the drawing is the light emission direction. The structure of the light emitting element submount structure 3 used in the light emitting device of FIG. 1 is shown in FIG. The light emitting element submount structure 3 includes a mounting substrate 30 having a wiring portion 31 and an LED chip 33 mounted on the mounting substrate 30. The mounting substrate 30 has a concave shape, and wiring portions 31 are formed in the concave portion 35 and on the upper surface of the mounting substrate 30. However, the shape of the mounting substrate 30 is not limited to the illustrated concave shape, and may be a flat plate shape or the like. The LED chip 33 is mounted on the wiring portion 31 on the inner bottom surface of the recess 35 of the mounting substrate 30 via the bonding member 34, and the entire structure of FIG. 2 is formed as the light emitting element submount structure 3. For example, aluminum nitride is used as the material of the mounting substrate 30, but is not limited thereto. The LED chip 33 uses a gallium nitride compound semiconductor, but is not limited thereto.

  The light-emitting device of FIG. 1 is obtained by sandwiching one or a plurality of light-emitting element submount structures 3 shown in FIG. 2 between a first heat dissipation substrate 1 and a second heat dissipation substrate 2.

  A metal wiring board is used for the first heat dissipation board 1. That is, the metal wiring board which consists of the metal plate 11, the insulating layer 12 formed on the said metal plate 11, and the wiring pattern 13 further formed on the said insulating layer 12 is used. The positive and negative ends of the wiring portion 31 of the mounting substrate 30 are wiring land portions 32 formed on the upper surface of the mounting substrate 30. The wiring land portion 32 and the wiring pattern 13 on the first heat dissipation substrate 1 Are joined by solder 15. A portion of the first heat dissipation substrate 1 facing the LED chip 33 is an opening 10. In the opening 10, a wavelength conversion member including a phosphor that absorbs at least the wavelength of the peak of the light emitted from the LED chip 33 and converts it into light having a different wavelength may be installed.

  A metal plate is used for the second heat dissipation substrate 2. On the lower surface (back surface) of the mounting substrate 30, a land portion 36 for solder bonding (electrically isolated) is formed. The second heat dissipation substrate 2 and the land portion 36 on the lower surface of the mounting substrate 30 are joined by solder 25. A heat transfer portion 24 connected to the second heat dissipation substrate 2 was formed on the surface side of the second heat dissipation substrate 2 facing the first heat dissipation substrate 1. Further, the heat transfer section 24 is in contact with the second heat dissipation substrate 2 or more preferably joined using solder. The heat transfer section 24 may be joined as an independent member to each of the first heat dissipation substrate 1 and the second heat dissipation substrate 2 with solder or the like, or the first heat dissipation substrate 1 and the second heat dissipation substrate 2. Any one of the substrates 2 may be used. Further, the heat transfer section 24 may be bonded to the side surface of the light emitting element submount structure 3 by using contact or solder.

  According to the structure of FIG. 1, the heat diffused in the mounting substrate 30 can be dissipated through the second heat dissipation substrate 2 in addition to the first heat dissipation substrate 1, so that the temperature of the LED chip 33 is set to the conventional example. It can be further reduced as compared. Further, by using a ceramic material such as aluminum nitride having excellent thermal conductivity for the mounting substrate 30 itself, there is an effect that heat dissipation is further improved and chip temperature is lowered.

  The method of installing the heat dissipation substrates 1 and 2 on the light emitting element submount structure 3 is not limited. In the structure of FIG. 1, the two heat dissipating substrates 1 and 2 are disposed above and below the light emitting element submount structure 3, but the present invention is not limited to this.

  If, for example, an MID substrate is used as the mounting substrate, there is almost no restriction on the routing of the wiring portion. Therefore, the method of installing the heat dissipation substrate can be set according to the conditions of the space in the appliance in which the light emitting device is installed, for example, The two side surfaces of the mounting structure or the back surface and the side surface can be selected as appropriate. The same applies to each embodiment described below.

  Further, the number of heat dissipation substrates is not particularly limited to two, and in the structure example of FIG. 1, third and fourth heat dissipation substrates are further installed on two side surfaces of the light emitting element submount structure. This can further improve the heat dissipation and reduce the chip temperature.

  In the following embodiments, portions having the same functions as those of the basic structure example shown in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 3 shows a schematic structure of the first embodiment. FIG. 3 is a cross-sectional view, and the upper side of the drawing is the light emission direction. FIG. 4 shows a cross-sectional view of the light emitting device of FIG. 3 as viewed from the right side of the sheet of FIG. 4 and 5 respectively show the structures of the light-emitting element submount structure 3 and the first heat dissipation substrate 1 used in the light-emitting device of FIG.

  Since the light emitting device of this embodiment is substantially the same as the basic structure example shown in FIGS. 1 and 2, different points will be described. In this embodiment, as shown in FIG. 6, a part of the insulating layer 12 on which the wiring pattern 13 is not formed is formed on the surface in contact with the upper surface of the mounting substrate 30 in the metal wiring substrate used as the first heat dissipation substrate 1. The metal plate 11 was exposed to be removed, and the metal plate 11 was in contact with the upper surface of the mounting substrate 30. As shown in FIG. 5, a groove portion 37 is formed on the upper surface of the mounting substrate 30, and a wiring land portion 32 connected to the wiring portion 31 is formed in the groove portion 37. The portion of the first heat dissipation substrate 1 where the wiring pattern 13 is formed fits into the groove portion 37 on the upper surface of the mounting substrate 30. The wiring land portion 32 connected to the wiring portion 31 of the mounting substrate 30 is joined to the wiring pattern 13 on the first heat dissipation substrate 1 by the solder 15.

  Also in the present embodiment, the portion facing the LED chip 33 of the first heat dissipation substrate 1 is the opening 10. Further, by using a metal plate having a higher thermal conductivity than the metal wiring substrate for the second heat dissipation substrate 2, the heat diffused in the mounting substrate 30 formed of a ceramic material having a high thermal conductivity is further dissipated. Therefore, the temperature of the LED chip 33 can be further reduced.

  In addition, if the metal plate portion of the heat dissipation substrate is in contact with or joined to the light emitting element submount structure as in this embodiment, the heat dissipation is improved and the temperature of the LED chip is reduced. By using the metal wiring board as the heat dissipation board, there is an effect of increasing the degree of freedom of wiring to the light emitting element submount structure.

  FIG. 7 shows a schematic structure of the second embodiment. FIG. 7 is a cross-sectional view, and the upper part of the drawing is the light emission direction. The structure of the light emitting element submount structure 3 used in the light emitting device of FIG. 7 is shown in FIG. The mounting substrate 30 is a flat plate-like multilayer substrate on which wiring portions 31 are formed. However, the shape of the mounting substrate 30 is not limited to a flat plate shape, and may be a shape having a recess. The wiring portion 31 communicates from the upper surface of the mounting substrate 30 to the end portion of the lower surface of the mounting substrate 30 via the inner layer through the through hole 31a. A wiring land portion 32 to be bonded to the wiring pattern 13 on the circuit board 1 is formed. On the lower surface of the mounting substrate 30, a heat dissipation land portion 36 (electrically isolated) for soldering to the first heat dissipation substrate 1 is also formed. Aluminum nitride is used as the material of the mounting substrate 30, but is not particularly limited thereto. The LED chip 33 is mounted on the wiring portion 31 on the upper surface of the mounting substrate 30 via the bonding member 34 to form the light emitting element submount structure 3.

  The first heat dissipation substrate 1 is a metal wiring board including a metal plate 11, an insulating layer 12 formed on the metal plate 11, and a wiring pattern 13 formed on the insulating layer 12. In addition, the metal plate 11 is exposed by removing a part of the insulating layer 12 on the surface in contact with the lower surface (back surface) of the mounting substrate 30. In the first heat dissipation substrate 1, the exposed metal plate 11 is bonded to the heat dissipation land portion 36 on the lower surface of the mounting substrate 30 with the solder 16. Further, the land portion at the end of the wiring pattern 13 of the first heat dissipation substrate 1 is joined to the wiring land portion 32 at the end of the mounting substrate 30 by the solder 15.

  The second heat dissipation substrate 2 is a metal plate, and is bonded to the upper surface of the mounting substrate 30 in this embodiment. The material of the metal plate of the second heat dissipation substrate 2 is preferably copper, aluminum or the like, but is not particularly limited to these materials. In this example, a copper plate was used. A portion of the second heat dissipation substrate 2 facing the LED chip 33 is an opening 20. The side surface shape of the opening 20 is particularly preferably a tapered shape, but is not limited to the tapered shape. In this example, the shape of the opening 20 was tapered, and Ag was vapor-deposited on the surface, followed by polishing. When the mounting substrate 30 is a ceramic substrate, the surface in contact with the second heat dissipation substrate 2 is metallized (for example, tungstenized), and the heat dissipation metallized portion 38 is connected to the second heat dissipation substrate 2 without using solder. You may join directly.

  Also in the present embodiment, the heat diffused in the mounting substrate 30 formed of the ceramic material having high thermal conductivity can be dissipated through the metal plate having excellent thermal conductivity, so that the temperature of the LED chip 33 can be further reduced. . Moreover, the wiring part 13 can be formed in the both sides which oppose the light emitting element submount structure 3 of the 1st thermal radiation board | substrate 1, and normally there is no wiring part in the 2nd thermal radiation board | substrate which needs fixing to an instrument. Since it can be structured, there is an effect that the degree of freedom of design for electrical insulation can be increased.

  9 and 10 show a schematic structure of the third embodiment. 9 shows the structure of the light emitting device main body, and FIG. 10 shows the structure of the light emitting element submount structure. A metal wiring board (metal plate 11, insulating layer 12, wiring pattern 13), which is the first heat dissipation substrate 1, is installed on the lower surface side of the light emitting element submount structure 3. A concave portion 35 and a groove portion 37 are formed on the upper surface of the light emitting element submount structure 3, and a wiring portion 31 is formed on the bottom thereof. On the surface (upper surface) side of the light emitting element submount structure 3 facing the first heat dissipation substrate 1, a metal plate as the second heat dissipation substrate 2 is installed. The second heat dissipating substrate 2 is provided with an opening 20 having substantially the same size as the opening of the recess 35 in which the LED chip 33 of the light emitting element submount structure 3 is mounted. The second heat dissipating substrate 2 can be provided with a cover 26 that is transparent or contains a member (phosphor etc.) that converts the wavelength of light emitted from the LED chip 33 in the opening 20. Also serves as a mounting jig. Since the wiring portion 31 formed in the light emitting element submount structure 3 is in the groove portion 37, it does not contact the second heat dissipation substrate 2.

  In this embodiment, the heat generated in the LED chip 33 is transferred from the mounting substrate 30 of the light emitting element submount structure 3 to the second heat dissipation substrate 2 and is radiated from the surface. Thus, since heat dissipation from the second heat dissipation substrate 2 is also promoted, the heat dissipation of the light emitting element submount structure 3 is improved, and the temperature of the LED chip 33 can be reduced. As a result, the lifetime is improved and a larger current can flow, so that the luminous flux is increased. Furthermore, since the second heat dissipation substrate 2 also serves as an installation jig for the phosphor cover 26, the manufacturing cost is reduced.

  11 and 12 show a schematic structure of the fourth embodiment. FIG. 11 shows the structure of the light emitting device body, and FIG. 12 shows the structure of the light emitting element submount structure. A plurality of thermal vias 39 made of a metal (copper, solder, gold) having excellent thermal conductivity are installed in a resin (or ceramic) base portion forming the mounting substrate 30 of the light emitting element submount structure 3. The thermal via 39 is not in contact with the wiring portion 31 formed on the light emitting element submount structure 3 and is electrically insulated. The upper surface of the thermal via 39 is exposed on the upper surface of the light emitting element submount structure 3. A concave portion 35 and a groove portion 37 are formed on the upper surface of the light emitting element submount structure 3, and a wiring portion 31 is formed on the bottom thereof. On the surface (upper surface) side of the light emitting element submount structure 3 facing the metal wiring substrate 1 side, a metal plate as the second heat dissipation substrate 2 is installed.

  The second heat dissipating substrate 2 is provided with an opening 20 having substantially the same size as the opening of the recess 35 in which the LED chip 33 of the light emitting element submount structure 3 is mounted. The second heat dissipation substrate 2 is bonded to the thermal via 39 via solder. The second heat dissipating substrate 2 can be provided with a cover 26 containing a member (phosphor etc.) for converting the wavelength of light emitted from the LED chip in the opening 20 thereof. Also serves as a jig. Since the wiring portion 31 formed in the light emitting element submount structure 3 is in the groove portion 37, it does not contact the second heat dissipation substrate 2. The thermal via 39 may be formed by making a hole from the upper surface of the light emitting element submount structure 3, applying gold plating to the side surface of the hole, and filling with solder.

  Since the thermal via 39 is arranged closer to the LED chip 33 than the side surface of the light emitting element submount structure 3, the heat generated from the LED chip 33 is transmitted to the side surface of the light emitting element submount structure 3. Heat is easily transferred to the thermal via 39. Heat generated in the LED chip 33 is transmitted from the mounting substrate 30 of the light emitting element submount structure 3 to the thermal via 39, and further transferred to the second heat dissipation substrate 2 to be dissipated from the surface.

  Thus, according to the present embodiment, heat radiation from the second heat radiation substrate is also promoted, so that the heat radiation property of the light emitting element submount structure is improved and the temperature of the LED chip can be reduced. Thereby, the lifetime can be improved. In addition, since a larger current can be passed, the luminous flux is increased. Furthermore, since the second heat dissipation substrate also serves as a phosphor cover installation jig, the manufacturing cost is reduced.

  13 and 14 show a schematic structure of the fifth embodiment. FIG. 13 shows the structure of the light-emitting element submount, and FIG. 14 shows the structure of the light-emitting device body. On the lower surface of the light emitting element submount structure 3, a metal panel 36 a is installed on the substantially entire surface. The lower surfaces of the thermal vias 39a to 39f embedded in the mounting substrate 30 are in contact with the upper surface of the metal panel 36a. The lower surface of the metal panel 36a is joined to the metal plate which is the second heat dissipation substrate 2 by the solder 25 over almost the entire surface. Accordingly, the thermal vias 39a to 39f are installed in thermal and tight coupling with the second heat dissipation substrate 2. In addition, the lower surface of each thermal via 39a-39f may penetrate the 2nd thermal radiation board | substrate 2, and may be on the substantially the same surface as the outer surface. The upper surfaces of the thermal vias 39a to 39d embedded in the four corners of the mounting substrate 30 are exposed from the upper surface of the light emitting element submount structure 3 in a portion not in contact with the wiring portion 31, and the metal of the first heat dissipation substrate 1 is exposed. It is in contact with the plate 11. The wiring part 31 formed in the recess 35 of the light emitting element submount structure 3 is arranged up to the upper surface of the mounting substrate 30 of the light emitting element submount structure 3 and is connected to the wiring pad part 32.

  The metal wiring board that is the first heat dissipation substrate 1 includes a metal plate 11, an insulating layer 12, and a wiring pattern 13, and is installed so that the surface having the wiring pattern 13 faces the upper surface of the light emitting element submount structure 3. Has been. The wiring pattern 13 is bonded to the wiring pad portion 32 connected to the wiring portion 31 of the light emitting element submount structure 3 via the solder 15. The upper surfaces of the thermal vias 39a to 39d exposed from the upper surface of the light emitting element submount structure 3 are joined to the metal surface 11 of the metal wiring board via the solder 16. The metal plate 11 of the metal wiring board also serves as an attachment jig for the (phosphor) cover 26.

  In the present embodiment, the second heat dissipation substrate 2 and the light emitting element submount structure 3 are joined in a larger area, and heat transfer in the main heat dissipation path is further promoted. In general, when an LED is used as a lighting device or a display device, the substrate positioned on the lower surface side of the light emitting element submount structure is fixed to the device main body after being subjected to insulation treatment. In the structure of the present embodiment, the second heat dissipation substrate 2 corresponds to this, which is electrically insulated from the LED chip, so that it is not necessary to perform insulation treatment for fixing to the apparatus main body. For this reason, since it is not necessary to insulate by installation in a lighting (display) apparatus main body, manufacturing cost can be reduced. In addition, the thermal resistance between the second heat dissipation substrate and the apparatus main body can be reduced, and the heat dissipation can be further improved.

  FIG. 15 shows a schematic structure of the sixth embodiment. In the mounting substrate 30a of the light emitting element submount structure 3, a metal foil (heat radiation wiring) 31a having a high thermal conductivity is disposed in a plurality of layers. The installation direction does not have to be horizontal as shown in the figure, but it is preferable that the installation direction is arranged in a balanced manner in the mounting substrate 30. The metal foil is not exposed to the outside of the light emitting element submount structure 3. The lower surface of the light emitting element submount structure 3 is a metal plate 36b, and a wiring portion 31 is provided via an insulating layer 30b. The vicinity of the lower surface of the light emitting element submount structure 3 protrudes in the side surface direction, and a wiring pad portion 32 is disposed on the upper surface of the protruding portion. A metal layer 31b made of plating or the like is provided on the side surface of the concave portion 35 at the center of the light emitting element submount structure 3, and the metal foil (heat radiation wiring) 31a and the wiring portion 31 are joined to each other.

  The metal plate 11 is exposed at a part of the metal wiring board that is the first heat dissipation substrate 1, and the metal plate 36 b of the light emitting element submount structure 3 is joined to the part through the solder 16. The wiring pad portion 32 of the protruding portion below the light emitting element submount structure 3 is connected to the wiring pattern 13 of the first heat dissipation substrate 2 by wire bonding. The wiring method is not limited. In the illustrated example, one end of a wire 32 a is bonded to the wiring pad portion 32, and the other end of the wire 32 a is connected to the wiring pattern 13 by solder 15.

  The metal foil 31a connected to the p-side electrode and the n-side electrode of the LED chip 33 and the metal layer 31b formed by plating on the side surface of the recess 35 of the light-emitting element submount structure 3 are independent from each other and do not contact on the p-side and the n-side. . As a method for forming the wiring portion 31 and the heat radiation wiring (metal foil) 31a in the light-emitting element submount structure 3, as shown in FIG. 15C, the metal is formed on the ceramic foil formed by controlling the shape in advance. A pattern of the foil 31a may be formed, stacked on the metal plate 36b in multiple layers, and fired.

  Also in the present embodiment, the heat generated from the LED chip is transferred to the entire light emitting element submount structure through the heat dissipation wiring, so that heat dissipation from the outer surface of the light emitting element submount structure is promoted. Since there is no wiring pattern on the first heat dissipation substrate at a position facing the lower surface of the light emitting element submount structure, a large bonding area between the light emitting element submount structure and the metal wiring board can be obtained. Heat transfer is promoted and heat dissipation in this path is increased.

  According to the present embodiment, heat dissipation to the first heat dissipation substrate is promoted and heat dissipation from the surface of the light emitting element submount structure is improved, so that the temperature of the LED chip can be reduced. Thereby, the lifetime can be improved. In addition, since a larger current can be passed, the luminous flux is increased.

  FIG. 16 shows a schematic structure of the seventh embodiment. In the present example, the structure of Example 6 is used as the light emitting element submount structure 3, and the heat dissipation substrate 2 installed on the upper surface of the light emitting element submount structure 3 includes the phosphor 26 and the light control lens 27. Also serves as a fixed frame. A thermal via 39 is provided through the heat radiation wiring (metal foil) 31a. The upper surface of the thermal via 39 is not exposed on the upper surface of the light emitting element submount structure 3. The upper surface of the light emitting element submount structure 3 is gold-plated, and the lens fixing frame 2 is joined via solder. As shown in FIG. 16B, the upper heat-dissipating substrate 2 may also serve as an attachment jig for the phosphor cover 26, and the light control lens 27 may be a separate member. Reference numeral 40 denotes an electronic component.

  The thermal via may be exposed on the upper surface of the light emitting element submount structure. In this case, the metal wiring board is disposed on the upper surface of the light emitting element submount structure, and the thermal vias serve as the respective electrodes and are bonded to the metal wiring board as the first heat dissipation board.

  In any structure, heat transfer to the light emitting element submount structure is made more uniform through the thermal vias, and heat transfer is also promoted to the heat dissipation substrate provided above the submount structure. In addition, although the same effect is shown even if it provides the metal plate for thermal radiation on the upper surface of a light emitting element submount structure, the direction of installing a thermal via can promote the thermal radiation effect more. According to the present embodiment, there is an effect that heat radiation is further promoted by the heat radiation wiring pattern and the thermal via.

  17 and 18 show a schematic structure of the eighth embodiment. As the light-emitting element submount structure 3, as shown in FIG. 17, the mounting substrate 30 is composed of two conductor blocks 301 and 302 that sandwich the insulating member 300, and the p-side electrode and the n-side electrode of the LED chip 33 are The one connected to each of the two conductor blocks 301 and 302 is used.

  As shown in FIG. 18, the first and second heat dissipating substrates 1 and 2 are arranged in parallel, and the light emitting element submount structure 3 is arranged between the two heat dissipating substrates 1 and 2. The light emitting element submount structure 3 and the heat dissipating substrates 1 and 2 are contacted or joined. Further, the second and third heat radiation substrates 2 and 4 are arranged in parallel, and the light emitting element submount structure 3 is arranged between the two heat radiation substrates 2 and 4. The light-emitting element submount structure 3 and the heat dissipation substrates 2 and 4 are contacted or joined.

  The light emitting element submount structures 3 are arranged in a staggered pattern as shown in FIG. That is, in the heat dissipation substrate 2 that connects the light emitting element submount structure 3 on both sides, the light emitting element submount structure 3 on the other surface is disposed on the back side of the contact surface with the light emitting element submount structure 3 on one side. Do not place. The number of the heat dissipating substrates, the material, and the arrangement interval of the light emitting element submounts are not limited to those illustrated.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. In addition, heat dissipation is improved by arranging the light emitting element submount structures in a staggered pattern.

  FIG. 19 shows a schematic structure of the ninth embodiment. The light emitting element submount structure 3 and the heat dissipation substrates 1 and 2 are alternately arranged. The p-pole side of the light-emitting element submount structure 3 is connected to one end of the heat dissipation substrates 1 and 2 and the n-pole side is connected to the other end. An assembly including the light emitting element submount structure 3 and the heat dissipation substrates 1 and 2 that are electrically connected in series is formed. The number of the heat dissipation substrates, the material, and the arrangement interval of the light emitting element submount structures are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. In addition, since a uniform current flows through the LEDs constituting the assembly, there is little variation in light output between individual LED chips.

  FIG. 20 shows a schematic structure of Example 10. The heat dissipating substrates 1 and 2 are configured by fixing the lead frames 5 arranged at regular intervals with the resin material 6. The light-emitting element submount structure 3 and the heat-dissipating substrate 1 are electrically connected in series by connecting the light-emitting element submount structure 3 to the lead frame 5 with the lead frame surfaces of the heat-dissipating substrates 1 and 2 facing each other. 2 constitutes an aggregate. The number of heat dissipation substrates, the material, the arrangement interval of the light emitting element submount structures, the material and thickness of the lead frame, and the material of the resin material are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. Since a uniform current flows through the LEDs constituting the assembly, there is little variation in light output between individual LED chips.

  FIG. 21 shows a schematic structure of Example 11. The heat dissipating substrates 1 and 2 are configured by fixing the lead frames 5 arranged at regular intervals with the resin material 6. The light emitting element submount structure 3 is joined to the lead frame 5 with the lead frame surfaces of the heat dissipation substrates 1 and 2 facing each other. An assembly including the light emitting element submount structure 3 and the heat dissipation substrates 1 and 2 that are electrically connected in series is formed. Further, metal plates 11 and 21 are joined to the opposite surfaces of the heat dissipation substrates 1 and 2 to the lead frame 5. In this way, at least one of the first and second heat dissipation substrates is a substrate using a metal lead frame on the side facing the submount structure, so that the light emitting element sub-layer is interposed via the lead frame. Heat dissipation from the mount structure is improved. In addition, since the lead frame has good workability, the degree of freedom of wiring to each light emitting element submount structure increases. The number of heat-dissipating substrates, the material, the arrangement interval of the light emitting element submounts, the material and thickness of the lead frame, the material of the resin material, the material and the shape of the metal plate are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. Since a uniform current flows through the LEDs constituting the assembly, there is little variation in light output between individual LED chips. By joining the metal plate to the outer surface, the heat dissipation can be further improved.

  FIG. 22 shows a schematic structure of Example 12. A heat radiating substrate 1 formed by forming a wiring pattern 13 on an insulating layer 12 on a metal plate 11 is provided. Further, a heat dissipation substrate 2 formed by forming a wiring pattern 23 on an insulating layer 22 on a metal plate 21 is provided. The wiring patterns 13 and 23 are opposed to each other and arranged in parallel, and the light emitting element submount structure 3 is arranged between the substrates 1 and 2. The wiring patterns 13 and 23 and the light emitting element submount structure 3 are in contact with or bonded to each other. An assembly including the light emitting element submount structure 3 and the heat dissipation substrates 1 and 2 that are electrically connected in series is formed. The number of the heat dissipating substrates 1 and 2, the material, and the arrangement interval of the light emitting element submount structures are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. In addition, since a uniform current flows through the LED chips constituting the assembly, there is little variation in light output between the individual LED chips. Furthermore, since the insulating member of the heat dissipation substrate can be made thin, the heat dissipation effect to the metal plate is improved. In addition, it is possible to arrange electronic components other than the light emitting elements by using an arbitrary pattern configuration.

  FIG. 23 shows a schematic structure of Example 13. The heat dissipating substrates 1 and 2 configured around the resin material 6 are arranged in parallel. A lead frame 5 for connecting the opposing heat dissipating substrates 1 and 2 is configured. An assembly including the light emitting element submount structure 3 and the heat dissipation substrates 1 and 2 that are electrically connected in series is formed. The number of heat dissipation substrates, the material, the arrangement interval of the light emitting element submount structures, the material and thickness of the lead frame, and the material of the resin material are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. In addition, since a uniform current flows through the LEDs constituting the assembly, there is little variation in light output between individual LED chips. Furthermore, since the polarity of the light emitting element submount structure connected to the heat dissipation substrate is unified to the p-pole or the n-pole, the mountability is improved.

  FIG. 24 shows a schematic structure of Example 14. Metal heat dissipating substrates 1 and 2 are provided concentrically. The light emitting element submount structure 3 is disposed between the two heat dissipating substrates 1 and 2. The light emitting element submount structure 3 and the heat dissipating substrates 1 and 2 are in contact with or bonded to each other. The number of the heat dissipation substrates, the material, and the arrangement interval of the light emitting element submount structures are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. Moreover, the light output suitable for a circular instrument apparatus is attained.

  FIG. 25 shows a schematic structure of Example 15. Polygonal metal heat dissipating substrates 1 and 2 are provided concentrically. The light emitting element submount structure 3 is disposed between the two heat dissipating substrates 1 and 2. The light emitting element submount structure 3 and the heat dissipating substrates 1 and 2 are contacted or joined. The number of heat dissipation substrates, the material, the arrangement interval of the light emitting element submount structures, and the number of polygonal corners (hexagons, octagons, etc.) are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. Further, in a circular shape having a relatively small radius, the bonding property between the light emitting element submount structure and the heat dissipation substrate can be improved.

  FIG. 26 shows a schematic structure of Example 16. Circular heat dissipation substrates 1 and 2 are arranged in parallel. The light emitting element submount structure 3 is disposed between the two heat dissipating substrates 1 and 2. The light emitting element submount structure 3 and the heat dissipating substrates 1 and 2 are contacted or joined. Each of the polarities in contact with the bottom of the light emitting element submount structure 3 was connected to the heat dissipation substrates 1 and 2. In addition, as shown to the same figure (b), you may provide metal ring-shaped members 7. FIG. The number of the heat dissipation substrates, the material, and the arrangement interval of the light emitting element submount structures are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. Further, light emission in all directions can be performed using a highly directional LED. Furthermore, when a metal ring-shaped member is used, it is possible to further improve heat dissipation.

  FIG. 27 shows a schematic structure of Example 17. At least two heat dissipating substrates 1 and 2 made of a flexible conductive material are provided. The p-pole side of the plurality of light-emitting element submount structures 3 is connected to one heat dissipation substrate 1, and the n-pole side is connected to another heat dissipation substrate 2. The light emitting element submount structure 3 and the heat dissipating substrates 1 and 2 are contacted or joined. The number of heat dissipation substrates, the material, and the arrangement interval of the light emitting element submounts are not limited.

  According to the present embodiment, the heat generated by the light emitting element submount structure can be efficiently transferred to the two heat dissipation substrates. Further, high-density mounting is possible because the heat dissipation substrate also serves as electrical connection. Compared to the conventional example, the injection current can be increased while suppressing the temperature rise of the LED chip, and the light output can be increased. Furthermore, since the structure has flexibility, it is possible to realize a light emitter having a shape according to the needs of the user.

  The light emitting device of the present invention can be used as a light source of a display device or a lighting device.

It is sectional drawing which shows preferable embodiment of the light-emitting device of this invention. It is a figure which shows the light emitting element submount structure used for the light-emitting device of FIG. 1, (a) is a front view, (b) is the A-A 'sectional view taken on the line. It is sectional drawing of Example 1 of this invention. It is sectional drawing when the structure of FIG. 3 is seen from the paper right side. It is a figure which shows the light emitting element submount structure used for the light-emitting device of FIG. 3, (a) is a front view, (b) is a right view. It is a figure which shows the 1st board | substrate for thermal radiation used for the light-emitting device of FIG. 3, (a) is a front view, (b) is a right view. It is sectional drawing of Example 2 of this invention. 8A and 8B are views showing a light-emitting element submount structure used in the light-emitting device of FIG. 7, wherein FIG. 8A is a front view and FIG. It is sectional drawing of Example 3 of this invention. It is a figure which shows the light emitting element submount structure used for the light-emitting device of FIG. 9, (a) is a front view, (b) is the A-A 'sectional view taken on the line. It is sectional drawing of Example 4 of this invention. It is a figure which shows the light emitting element submount structure used for the light-emitting device of FIG. 11, (a) is a front view, (b) is the A-A 'line sectional drawing. It is a figure which shows the light emitting element submount structure used for the light-emitting device of Example 5 of this invention, (a) is a front view, (b) is the sectional view on the A-A 'line. It is sectional drawing of the light-emitting device using the light emitting element submount structure of FIG. 13, (a) is sectional drawing about the AA 'line of Fig.13 (a), (b) is FIG.13 (a). It is sectional drawing about a BB 'line. It is a figure which shows the light emitting element submount structure used for the light-emitting device of Example 6 of this invention, (a) is sectional drawing, (b) is sectional drawing of the state mounted in the metal wiring board, (c) is a multilayer It is sectional drawing for demonstrating the manufacturing method of the heat radiation wiring. It is a figure which shows the light-emitting device of Example 7 of this invention, (a) is sectional drawing at the time of providing the lens for light control in the board | substrate for heat radiation, (b) is separate from the board | substrate for heat radiation for the light control lens. It is sectional drawing at the time of providing. It is sectional drawing of the light emitting element submount structure used for the light-emitting device of Example 8 of this invention. It is sectional drawing of the light-emitting device of Example 8 of this invention. It is sectional drawing of the light-emitting device of Example 9 of this invention. It is sectional drawing of the light-emitting device of Example 10 of this invention. It is sectional drawing of the light-emitting device of Example 11 of this invention. It is sectional drawing of the light-emitting device of Example 12 of this invention. It is sectional drawing of the light-emitting device of Example 13 of this invention. It is sectional drawing of the light-emitting device of Example 14 of this invention. It is sectional drawing of the light-emitting device of Example 15 of this invention. It is a figure which shows the light-emitting device of Example 16 of this invention, (a) is a front view, (b) is sectional drawing. It is a figure which shows the manufacturing process of the light-emitting device of Example 17 of this invention, (a) is sectional drawing of a semi-finished product, (b) is sectional drawing of a finished product.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st board | substrate for heat radiation 10 Opening part 11 Metal plate 12 Insulating layer 13 Wiring pattern 15 Solder (for wiring)
2 Second heat dissipation substrate 24 Heat transfer portion 25 Solder (for heat dissipation)
DESCRIPTION OF SYMBOLS 3 Light emitting element submount structure 30 Mounting board 31 Wiring part 32 Wiring land part 33 LED chip 34 Joining member 35 Concave part 36 Radiation land part

Claims (7)

One or a plurality of light emitting element submount structures each including a mounting substrate having a wiring portion and an LED chip mounted on the mounting substrate are mounted on a first heat dissipation substrate that also serves as the wiring substrate. A light-emitting device, wherein a surface of the light-emitting element submount structure that is different from the side facing the first heat-dissipating substrate is in contact with or bonded to the second heat-dissipating substrate. . The first heat dissipation substrate and the second heat dissipation substrate are in thermal contact with each other via one or a plurality of heat transfer portions different from the light emitting element submount structure. The light-emitting device according to claim 1. At least one of the first and second heat dissipation substrates is disposed on an upper surface of the light emitting element submount structure, and an opening for transmitting light of the LED chip is formed. 2. The light emitting device according to claim 1, wherein the side wall surface also serves as a light reflecting portion. The mounting substrate in the light emitting element submount structure is composed of two conductor blocks sandwiching an insulating member therebetween, and the p-side electrode and the n-side electrode of the LED chip are connected to each of the two conductor blocks. The light emitting device according to claim 1, wherein The light-emitting device according to claim 1, wherein a heat dissipation member having higher thermal conductivity than the mounting substrate body is included inside the mounting substrate in the light-emitting element submount structure. 6. The light emitting device according to claim 5, wherein the heat radiating member is in contact with the first heat radiating substrate and / or the second heat radiating substrate. A plurality of light emitting element submount structures are provided, and at least a third heat radiating substrate is provided to sandwich a part of the light emitting element submount structures, and is sandwiched between the first and second heat radiating substrates. The light emitting element submount structures and the light emitting element submount structures sandwiched between the second and third heat dissipating substrates are alternately arranged in a staggered pattern. The light emitting device according to 1.

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