JP2014071224A - Exposure equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide exposure equipment in which the sticking of foreign matter to the back face of a substrate is prevented.SOLUTION: Exposure equipment 1 comprises: a receiving stand 21; a first substrate floating-up part; a holding stand 34; a second substrate floating-up part; a substrate movement part 8; and an exposure part. The receiving stand 21 is fed with a substrate 101. The first substrate floating-up part floats up the substrate to the upper part of the receiving stand 21. The holding stand 34 is arranged in parallel with the receiving stand 21. The second substrate floating-up part floats up the substrate to the upper part of the holding stand 34. The substrate movement part 8 is contacted with the edge of the substrate 101 and moves the substrate 101 floated up to the upper part of the receiving stand 21 to the upper part of the holding stand 34. The exposure part performs exposure to the substrate 101 arranged at the upper part of the holding stand 34.

Description

  The present invention relates to an exposure apparatus for exposing a display substrate to form a pattern in manufacturing a display panel such as a liquid crystal display device.

  Examples of the display substrate of the display panel include a TFT (Thin Film Transistor) substrate, a color filter substrate, a plasma display panel substrate, and an organic EL (Electroluminescence) display panel substrate of a liquid crystal display device. Such a display substrate is manufactured by forming a pattern on the substrate by photolithography using an exposure apparatus.

  As an exposure apparatus, generally, a projection method or a proximity method is employed. In the projection method, a pattern of a photomask (hereinafter referred to as “mask”) is projected onto a substrate and transferred using a lens or a mirror. In the proximity method, a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Such an exposure apparatus can be adapted to manufacture various types of display substrates by changing drawing data and scanning programs. In addition, since the pattern is directly drawn on the substrate by scanning the light beam, an expensive mask is not necessary.

  These exposure apparatuses include a substrate transport mechanism that transports the substrate from the supply position to the exposure position. As a board | substrate conveyance mechanism, it describes in patent document 1, for example. The substrate transport mechanism described in Patent Document 1 includes a plurality of rollers that are in contact with the back surface of the substrate and a plurality of air nozzles for blowing compressed air onto the back surface of the substrate. The plurality of air nozzles include a nozzle that injects upward compressed air and a nozzle that injects compressed air obliquely in the moving direction of the substrate.

  Moreover, as an exposure apparatus provided with a board | substrate conveyance mechanism, it describes in the patent document 2, for example. The exposure apparatus described in Patent Document 2 includes a first substrate mounting portion and a second substrate mounting portion for mounting a substrate, a first substrate floating portion, a second substrate floating portion, a transport portion, and the like. It has. The first substrate floating portion causes the substrate to float with respect to the first substrate mounting portion, and the second substrate mounting portion causes the substrate to float with respect to the second substrate mounting portion. The transport unit sucks the back surface of the substrate and transports the substrate from the first substrate mounting unit to the second substrate mounting unit.

JP 2011-168363 A JP 2012-38874 A

  However, in the substrate transport mechanism described in Patent Document 1, foreign matter such as dust attached to a plurality of rollers may adhere to the back surface of the substrate. For example, in a substrate such as glass that transmits light, the light transmitted through the substrate at the time of exposure is reflected by a foreign substance adhering to the back surface, and passes through the substrate again to reach the surface of the substrate. This causes a problem that a phenomenon (back surface transfer) in which the shape of the foreign matter is burned onto the surface of the substrate occurs.

  In addition, the exposure apparatus described in Patent Document 2 has a problem that foreign matter such as dust attached to the suction pad in the transport unit adheres to the back surface of the substrate and back surface transfer occurs.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure apparatus that prevents foreign matters from adhering to the back surface of a substrate in consideration of the actual situation in the prior art.

In order to solve the above problems and achieve the object of the present invention, an exposure apparatus of the present invention comprises a receiving table, a first substrate floating part, a holding table, a second substrate floating part, a substrate moving part, And an exposure unit.
The substrate is supplied to the receiving table. The first substrate floating portion causes the substrate to float above the receiving table. The holding table is arranged side by side on the receiving table. The second substrate floating portion causes the substrate to float above the holding table. The substrate moving unit contacts the edge of the substrate and moves the substrate floating above the receiving table to above the holding table. The exposure unit exposes the substrate disposed above the holding table.

  In the exposure apparatus of the present invention, the substrate moving unit comes into contact with the edge of the substrate floating above the receiving table, and moves the substrate above the holding table. Thereby, the board | substrate movement part can move a board | substrate, without contacting the back surface of a board | substrate. As a result, it is possible to prevent or suppress adhesion of foreign matters such as dust to the back surface of the substrate.

  According to the exposure apparatus of the present invention, foreign matter can be prevented from adhering to the back surface of the substrate.

1 is a plan view showing an outline of the overall configuration of an exposure apparatus according to a first embodiment of the present invention. 1 is a front view showing an outline of the overall configuration of an exposure apparatus according to a first embodiment of the present invention. It is a top view of the receiving stand of the exposure apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the 1st board | substrate floating part of the exposure apparatus which concerns on the 1st Embodiment of this invention. It is a top view of the holding stand of the exposure apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the 2nd board | substrate floating part of the exposure apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the holding stand cooling part of the exposure apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the substrate moving part and substrate discharge part of the exposure apparatus which concern on the 1st Embodiment of this invention. It is explanatory drawing which shows the outline of a structure of the exposure apparatus which concerns on the 2nd Embodiment of this invention.

  Hereinafter, an exposure apparatus according to an embodiment of the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the common member in each figure.

<Configuration of Exposure Apparatus According to First Embodiment>
First, the configuration of the exposure apparatus according to the first embodiment will be described with reference to FIGS. 1 and 2.
FIG. 1 is a plan view of an exposure apparatus according to the first embodiment. FIG. 2 is a front view of the exposure apparatus according to the first embodiment. In FIG. 2, the discharge unit 6 and the supply / recovery unit 7 are omitted.

  The exposure apparatus 1 shown in FIGS. 1 and 2 transfers a pattern onto the surface 101 a of the substrate 101. The exposure apparatus 1 includes a receiving unit 2, a holding unit 3, a base 4, an exposure unit 5, a discharge unit 6, a supply and recovery unit 7, a substrate moving unit 8 and a substrate discharge unit 9 (see FIG. 8). ) And a control unit (not shown) for controlling the driving of each unit.

[Acceptance unit]
As shown in FIG. 2, the receiving unit 2 includes a receiving table 21, a receiving table support part 22 that supports the receiving table 21, and a first substrate floating portion 23 (see FIG. 4). The configuration of the receiving table 21 will be described later with reference to FIG. 3, and the first substrate floating portion 23 will be described later with reference to FIG.

Below the receiving table 21, a plurality of push-up pins 25 and a pin lifting / lowering unit 26 that lifts and lowers the plurality of push-up pins 25 are disposed. The plurality of push-up pins 25 are raised by the pin elevating part 26 and penetrate the receiving table 21 in the vertical direction. The tip portions of the plurality of push-up pins 25 support the substrate 101.
Further, the plurality of push-up pins 25 are lowered by the pin elevating part 26. Thereby, the front-end | tip part of the some pushing-up pin 25 is arrange | positioned inside the receiving stand 21. FIG.

  Hereinafter, the vertical direction is defined as the Z direction. One direction orthogonal to the Z direction is defined as the X direction, and a direction orthogonal to the Z direction and the X direction is defined as the Y direction.

[Holding unit]
The holding unit 3 and the receiving unit 2 are arranged side by side in the X direction. The holding unit 3 includes an X stage 31, a Y stage 32, a θ stage 33, a holding table 34, and a second substrate floating portion 35 (see FIG. 6).

  The X stage 31 moves along an X-axis guide 41 (described later) of the base 4. The lower part of the X stage 31 is movably engaged with the X axis guide 41. A Y-axis guide 36 extending in the Y direction is provided on the upper surface of the X stage 31. The Y-axis guide 36 guides the Y stage 32 in the Y direction.

  The Y stage 32 moves in the Y direction along the Y axis guide 36. The lower part of the Y stage 32 is movably engaged with the Y-axis guide 36. The θ stage 33 is fixed to the upper surface of the Y stage 32. The θ stage 33 rotates about a rotation axis parallel to the Z direction. A Z-tilt mechanism 38 is provided on the upper surface of the θ stage 33. The Z-tilt mechanism 38 moves the holding table 34 in the Z direction. The Z-tilt mechanism 38 tilts (tilts) the holding base 34 with respect to the Z direction about an axis parallel to the Y direction.

  As a drive source for operating the X stage 31 and the Y stage 32, for example, a linear motor can be applied, but other drive sources such as a stepping motor can also be used. Further, as a drive source for operating the θ stage 33 and the Z-tilt mechanism 38, for example, a stepping motor can be applied.

  The holding table 34 and the receiving table of the receiving unit 2 are arranged side by side in the X direction. The upper surface of the holding table 34 is located at substantially the same height as the upper surface of the receiving table 21. The configuration of the holding table 34 will be described later with reference to FIG. 5, and the second substrate floating portion 35 will be described later with reference to FIG.

[base]
The base 4 is formed in a rectangular plate shape that is long in the X direction. An X-axis guide 41 extending along the X direction is provided on the upper surface of the base 4. The X-axis guide 41 guides the X stage 31 in the X direction.

  The holding unit 3 including the X stage 31 is disposed at a delivery position adjacent to the receiving unit 2 in the X direction and an exposure position that moves in the X direction from the delivery position and faces the exposure unit 5 in the Z direction.

[Exposure unit]
The exposure unit 5 is a specific example of the exposure unit according to the present invention, and is disposed above the base 4. The exposure unit 5 includes a mask, a mask holder that holds the mask, and an exposure light source.

[Discharge unit]
The discharge unit 6 is disposed at a position facing the holding unit 3 disposed at the delivery position in the Y direction. That is, the discharge unit 6 and the holding unit 3 arranged at the delivery position are arranged side by side in the Y direction. The discharge unit 6 has a discharge table 61. On the discharge table 61, the substrate 101 exposed by the exposure unit 5 is arranged.
The discharge table 61 has the same configuration as the receiving table 21 of the receiving unit 2.

[Supply and recovery unit]
The supply and recovery unit 7 supplies the substrate 101 before being exposed onto the receiving table 21 of the receiving unit 2. The supply and recovery unit 7 recovers (receives) the exposed substrate 101 disposed on the discharge table 61 of the discharge unit 6.

[Acceptance stand]
Next, the structure of the receiving stand 21 in the receiving unit 2 is demonstrated with reference to FIG.
FIG. 3 is a plan view of the receiving table 21.

  As shown in FIG. 3, the receiving table 21 is formed in a rectangular plate shape that is long in the X direction. One end in the X direction of the receiving table 21 is an end far from the holding unit 3, and the other end in the X direction faces the holding table 34 of the holding unit 3.

  A plurality of pin through holes 211, a plurality of air intake holes 212, a plurality of substrate floating holes 213, and a plurality of substrate feed holes 214 are formed in the receiving table 21. The plurality of pin through holes 211, the plurality of intake holes 212, the plurality of substrate floating holes 213, and the plurality of substrate feeding holes 214 are opened on the upper surface 21 a of the receiving table 21.

  The plurality of pin through-holes 211 are arranged in a lattice pattern on the upper surface 21a of the receiving table 21, and are arranged at equal intervals along the X direction and the Y direction. Each push-up pin 25 raised by the pin elevating part 26 passes through each pin through-hole 211.

  The plurality of intake holes 212 are arranged in a lattice pattern on the upper surface 21a of the receiving table 21, and are arranged at equal intervals along the X direction and the Y direction. A pin through hole 211 is disposed between two intake holes 212 facing each other in a direction inclined with respect to the X direction and the Y direction among the plurality of intake holes 212.

  The plurality of intake holes 212 are connected to a vacuum pump (not shown) via a pipe (not shown). When the vacuum pump is driven in a state where the substrate 101 is disposed above the upper surface 21 a of the receiving table 21, the air around the plurality of intake holes 212 is sucked, and between the upper surface 21 a of the receiving table 21 and the back surface of the substrate 101. A plurality of vacuum zones are formed. Thereby, it is possible to prevent the substrate 101 from moving in a direction parallel to the upper surface 21 a of the receiving table 21.

  The plurality of substrate levitation holes 213 are arranged so as to be distributed over the entire upper surface 21 a of the receiving table 21, and are arranged along the X direction and the Y direction. Each of the plurality of substrate levitation holes 213 extends substantially perpendicular to the upper surface 21 a of the receiving table 21, and communicates with a pipe 231 (see FIG. 4) described later of the first substrate levitation portion 23.

  The plurality of substrate feed holes 214 are arranged so as to be distributed in the center portion in the Y direction on the upper surface 21a of the receiving table 21, and are arranged along the X direction and the Y direction. Each of the plurality of substrate feed holes 214 is inclined to the other side in the X direction and communicates with a pipe 232 (see FIG. 4) described later of the first substrate floating portion 23. The other in the X direction is the direction in which the substrate 101 moves from the receiving table 21 to the holding table 34 (see FIG. 1).

[First floating substrate]
Next, the configuration of the first substrate floating portion 23 will be described with reference to FIG.
FIG. 4 is an explanatory view showing the first substrate floating portion 23.

  As shown in FIG. 4, the first substrate floating portion 23 causes the substrate 101 to float on the receiving table 21. The first substrate floating portion 23 includes a pipe 231, a pipe 232, a low compressed air supply unit 234, and a high compressed air supply unit 235.

The pipe 231 is connected to the plurality of substrate floating holes 213 using pipe joints 233, and one end communicates with the plurality of substrate floating holes 213. The other end of the pipe 231 is connected to the low compressed air supply unit 234 and the high compressed air supply unit 235.
The low compressed air supply unit 234 and the high compressed air supply unit 235 show a specific example of the gas supply unit according to the present invention. The low compressed air supply unit 234 discharges low compressed air, and the high compressed air supply unit 235 discharges high compressed air having a pressure higher than that of the low compressed air.

  The piping 231 is provided with a low-compressed air solenoid valve 237 and a high-compressed air solenoid valve 238. The low-compressed air solenoid valve 237 and the high-compressed air solenoid valve 238 are provided to switch the pressure of the gas (air) sent to the plurality of substrate levitation holes 213.

  When low-compressed air is sent to the plurality of substrate levitation holes 213 by the low-compressed air supply unit 234, the control unit (not shown) opens the low-compressed air solenoid valve 237 and closes the high-compressed air solenoid valve 238. Take control. As a result, low-compressed air is jetted from the plurality of substrate levitation holes 213 and blown to the back surface 101 b of the substrate 101. As a result, the substrate 101 floats above the receiving table 21.

  On the other hand, when high compressed air is sent to the plurality of substrate levitation holes 213 by the high compressed air supply unit 235, the control unit (not shown) opens the high compressed air electromagnetic valve 238 and the low compressed air electromagnetic valve 237. Control to close. Thereby, highly compressed air is ejected from the plurality of substrate levitation holes 213 and blown to the back surface 101 b of the substrate 101. As a result, the substrate 101 floats above the receiving table 21. At this time, the substrate 101 floats higher than when low-compressed air is blown.

  The pipe 232 is connected to the plurality of substrate feed holes 214 using pipe joints 233, and one end communicates with the plurality of substrate feed holes 214. The other end of the pipe 232 is connected to the high compressed air supply unit 235.

The piping 232 is provided with a highly compressed air solenoid valve 239. When high compressed air is sent to the plurality of substrate feed holes 214 by the high compressed air supply unit 235, the high compressed air solenoid valve 239 is opened. Thereby, highly compressed air is ejected from the plurality of substrate feed holes 214 and blown to the back surface 101 b of the substrate 101. As a result, the highly compressed air ejected from the plurality of substrate feed holes 214 is ejected in the direction inclined in the other direction in the X direction, and assists the movement of the substrate 101 in the other direction in the X direction.
On the other hand, when high compressed air is not sent to the plurality of substrate feed holes 214, the high compressed air solenoid valve 239 is closed.

[Holding stand]
Next, the configuration of the holding table 34 in the holding unit 3 will be described with reference to FIG.
FIG. 5 is a plan view of the holding table 34.

  As shown in FIG. 5, the holding table 34 is formed in a rectangular plate shape that is long in the X direction. The upper surface 34 a of the holding table 34 is set to have an outer shape substantially equal to the upper surface 21 a of the receiving table 21. Further, the holding table 34 is cooled by a holding table cooling unit 39 (see FIG. 7) described later.

  One end of the holding base 34 in the X direction faces the receiving base 21 (see FIG. 1) of the receiving unit 2, and the other end in the X direction is an end far from the receiving unit 2. is there. Further, one end of the holding base 34 in the Y direction is an end far from the discharge unit 6, and the other end in the Y direction faces the discharge base (see FIG. 1) of the discharge unit 6. .

  A plurality of intake holes 342, a plurality of substrate floating holes 343, a plurality of first substrate feed holes 344, and a plurality of second substrate feed holes 345 are formed in the holding table 34. The plurality of intake holes 342, the plurality of substrate floating holes 343, the plurality of first substrate feeding holes 344, and the plurality of second substrate feeding holes 345 are opened on the upper surface 34 a of the holding table 34.

  The plurality of intake holes 342 are arranged in a lattice pattern on the upper surface 34a of the holding table 34, and are arranged along the X direction and the Y direction. The plurality of intake holes 342 are connected to a vacuum pump (not shown) via a pipe (not shown).

  When the vacuum pump is driven in a state where the substrate 101 is disposed above the holding table 34, the air around the plurality of suction holes 342 is sucked, and a plurality of spaces are provided between the upper surface 34 a of the holding table 34 and the back surface of the substrate 101. A vacuum zone is formed. Thereby, it is possible to prevent the substrate 101 from moving in a direction parallel to the upper surface 34 a of the holding table 34.

  The plurality of substrate levitation holes 343 are arranged so as to be distributed over the entire upper surface 34a of the holding table 34, and are arranged along the X direction and the Y direction. Each of the plurality of substrate floating holes 343 extends substantially perpendicular to the upper surface 34a of the holding table 34, and communicates with a pipe 351 (see FIG. 6) described later of the second substrate floating portion 35.

  The plurality of first substrate feed holes 344 are arranged so as to be distributed in the center in the Y direction on the upper surface 34 a of the holding table 34, and are arranged along the X direction and the Y direction. The plurality of first substrate feed holes 344 are inclined to the other side in the X direction, and communicate with a pipe 352 (see FIG. 6) described later of the second substrate floating portion 35.

  The plurality of second substrate feed holes 345 are arranged so as to be distributed in the center in the Y direction on the upper surface 34a of the holding table 34, similarly to the plurality of first substrate feed holes 344. It is lined up along the direction. The plurality of second substrate feed holes 345 each extend while inclining to the other in the Y direction, and communicate with a pipe 353 (see FIG. 6) described later of the second substrate floating portion 35. The other in the Y direction is the direction in which the substrate 101 moves from the holding table 34 to the discharge table 61 (see FIG. 1).

In addition, two locking pins 347 are provided on the upper surface 34 a of the holding table 34. The two locking pins 347 are disposed at the other end portion in the X direction of the upper surface 34a. The edges (end surfaces) of the substrate 101 (see FIG. 1) that has moved above the holding table 34 abut against the two locking pins 347.
For example, when there is one locking pin 347, there is a possibility that the substrate 101 in contact with the locking pin 347 rotates around an axis parallel to the Z direction. Therefore, it is preferable to provide two or more locking pins 347 according to this embodiment.

[Second substrate floating surface]
Next, the configuration of the second substrate floating portion 35 will be described with reference to FIG.
FIG. 6 is an explanatory view showing the second substrate floating portion 35.

  As shown in FIG. 6, the second substrate floating portion 35 causes the substrate 101 to float on the holding table 34. The second substrate floating portion 35 includes a pipe 351, a pipe 352, a pipe 353, a low compressed air supply unit 234, and a high compressed air supply unit 235.

  The pipe 351 is connected to the plurality of substrate floating holes 343 using pipe joints 233, and one end thereof communicates with the plurality of substrate floating holes 343. The other end of the pipe 351 is connected to the low compressed air supply unit 234 and the high compressed air supply unit 235.

  The low compressed air supply unit 234 and the high compressed air supply unit 235 are common to the low compressed air supply unit 234 and the high compressed air supply unit 235 of the first substrate floating portion 23. However, the low compressed air supply unit and the high compressed air supply unit according to the present invention may be separately prepared for the first substrate floating portion 23 and the second substrate floating portion 35.

  The pipe 351 is provided with a low-compressed air solenoid valve 354 and a high-compressed air solenoid valve 355. The low-compression air solenoid valve 354 and the high-compression air solenoid valve 355 are provided to switch the pressure of the gas (air) sent to the plurality of substrate levitation holes 343.

  When low-compressed air is sent to the plurality of substrate levitation holes 343 by the low-compressed air supply unit 234, the control unit (not shown) opens the low-compressed air solenoid valve 354 and closes the high-compressed air solenoid valve 355. Take control. Thereby, low-compressed air is jetted from the plurality of substrate levitation holes 343 and blown to the back surface 101 b of the substrate 101. As a result, the substrate 101 floats above the holding table 34.

  On the other hand, when high compressed air is sent to the plurality of substrate levitation holes 343 by the high compressed air supply unit 235, the high compressed air electromagnetic valve 355 is opened and the low compressed air electromagnetic valve 354 is closed. Thereby, highly compressed air is ejected from the plurality of substrate levitation holes 343 and blown to the back surface 101 b of the substrate 101. As a result, the substrate 101 floats above the holding table 34. At this time, the substrate 101 floats higher than when low-compressed air is blown.

  The pipe 352 is connected to the plurality of first substrate feed holes 344 using pipe joints 233, and one end communicates with the plurality of first substrate feed holes 344. The other end of the pipe 352 is connected to the high compressed air supply unit 235.

The pipe 352 is provided with a highly compressed air solenoid valve 356. When high compressed air is sent to the plurality of first substrate feed holes 344 by the high compressed air supply unit 235, a control unit (not shown) performs control to open the high compressed air electromagnetic valve 356. Thereby, highly compressed air is jetted from the plurality of first substrate feed holes 344 and blown to the back surface 101 b of the substrate 101. As a result, the highly compressed air ejected from the plurality of first substrate feed holes 344 assists the movement of the substrate 101 in the other direction in the X direction.
On the other hand, when high compressed air is not sent to the plurality of first substrate feed holes 344, the control unit (not shown) closes the high compressed air solenoid valve 356.

  The pipe 353 is connected to the plurality of second substrate feed holes 345 using pipe joints 233, and one end communicates with the plurality of second substrate feed holes 345. The other end of the pipe 353 is connected to the high compressed air supply unit 235.

The piping 353 is provided with a highly compressed air solenoid valve 357. When high compressed air is sent to the plurality of second substrate feed holes 345 by the high compressed air supply unit 235, a control unit (not shown) performs control to open the high compressed air electromagnetic valve 357. Thereby, highly compressed air is jetted from the plurality of second substrate feed holes 345 and blown to the back surface 101 b of the substrate 101. As a result, the highly compressed air jetted from the plurality of second substrate feed holes 345 assists the movement of the substrate 101 to the other side in the Y direction.
On the other hand, when high compressed air is not sent to the plurality of second substrate feed holes 345, the control unit performs control to close the high compressed air electromagnetic valve 357.

  An air cooling unit 358 is provided between the low compressed air solenoid valve 354 and the low compressed air supply unit 234. The air cooling unit 358 cools the low compressed air supplied from the low compressed air supply unit 234.

  An air cooling unit 359 is provided between the high compression air solenoid valves 355, 356, 357 and the high compression air supply unit 235. The air cooling unit 359 cools the high compressed air supplied from the high compressed air supply unit 235. As the air cooling units 358 and 359, for example, those using cooling water can be adopted.

  At the exposure position, the substrate 101 is warmed because light from a light source (not shown) of the exposure unit 5 is irradiated onto the substrate 101. In the exposure using the proximity method, the mask heated by light is brought close to the substrate 101 with a minute gap, so that the substrate 101 is heated by the radiant heat from the mask.

  If the pattern is formed by the exposure unit 5 (see FIG. 1) in a state where the substrate 101 is heated and thermally expanded, the pattern is distorted by shrinking the substrate 101 when the substrate 101 cools thereafter. As a result, an accurate pattern cannot be obtained, resulting in exposure failure.

  Therefore, in this embodiment, the low-compressed air supplied from the low-compressed air supply unit 234 is cooled to a predetermined temperature by the air cooling unit 358 and then sprayed onto the back surface 101b of the substrate 101. Further, the high-compressed air discharged from the high-compressed air supply unit 235 is cooled to a predetermined temperature by the air cooling unit 359 and then sprayed on the back surface 101 b of the substrate 101.

Thereby, it is possible to prevent the substrate 101 from being heated and thermally expanded. Therefore, the thermal expansion of the substrate 101 can be prevented and the exposure failure can be suppressed or prevented while the flatness of the substrate 101 is ensured by floating the substrate 101.
In the present embodiment, the air cooling units 358 and 359 are controlled (managed) so that the temperature of the substrate 101 becomes 23 ± 0.2 ° C., and pattern exposure errors due to thermal expansion of the substrate 101 are prevented.

[Holding stand cooling section]
Next, the holding table cooling unit 39 will be described with reference to FIG.
FIG. 7 is an explanatory diagram showing the holding table cooling unit 39.

  As shown in FIG. 7, the holding table cooling unit 39 includes an endless pipe 391 disposed at least partially inside the holding table 34, a liquid circulating in the pipe 391, and a heat exchanger that cools the liquid. 392. In the holding table cooling unit 39, the liquid circulating in the pipe 391 is cooled by the heat exchanger 392, so that the holding table 34 through which the pipe 391 passes is cooled. Thereby, it can suppress that the board | substrate 101 is warmed.

[Substrate moving part]
Next, the configuration of the substrate moving unit 8 will be described with reference to FIG.
FIG. 8A is a plan view showing the substrate moving unit 8 and the substrate discharging unit 9. FIG. 8B is a front view showing the substrate moving unit 8 and the substrate discharging unit 9. In FIG. 8, illustration of the pin through hole 211 and the intake hole 212 of the receiving base 21 is omitted, and illustration of the intake hole 342 of the holding base 34 is omitted.

  As shown in FIGS. 8A and 8B, the substrate moving unit 8 is disposed above the receiving table 21 in the receiving unit 2. The substrate moving unit 8 includes X-axis guide rails 81A and 81B extending in the X direction, and transport sliders 82A and 82B that are movably connected to the X-axis guide rails 81A and 81B.

  The X-axis guide rails 81A and 81B are formed in a rectangular column shape that is long in the X direction. The length of the X-axis guide rails 81A and 81B in the X direction is set longer than the length of the receiving table 21 in the X direction. One end of the X-axis guide rails 81A and 81B in the X direction is disposed above the end of the receiving table 21 opposite to the holding table 34. On the other hand, the other ends of the X-axis guide rails 81A and 81B in the X direction are positioned at least above the end on the receiving table 21 side of the holding table 34 disposed at the transfer position.

  Further, the distance from the lower surface of the X-axis guide rails 81A and 81B to the upper surface 21a of the receiving table 21 is set longer than the distance from the surface 101a of the substrate 101 that floats above the receiving table 21 to the upper surface 21a of the receiving table 21. Has been. Therefore. The substrate 101 that floats above the receiving table 21 does not interfere with the X-axis guide rails 81A and 81B.

  The transport slider 82A is movably engaged with the lower surface of the X-axis guide rail 81A, and moves in the X direction along the X-axis guide rail 81A. The transport slider 82B is movably engaged with the lower surface of the X-axis guide rail 81B, and moves in the X direction along the X-axis guide rail 81B.

  The transport sliders 82A and 82B come into contact with one of the short sides (end surfaces) of the substrate 101 that floats above the receiving table 21 (the side far from the holding table 34), along the X-axis guide rails 81A and 81B. Move in the direction. As a result, the substrate 101 moves from above the receiving table 21 to above the holding table 34 disposed at the transfer position. That is, the transport sliders 82A and 82B transport the substrate 101 from above the receiving table 21 to above the holding table 34 disposed at the transfer position.

[Substrate ejector]
Next, the configuration of the substrate discharge unit 9 will be described with reference to FIG.
The substrate discharge unit 9 is disposed above the holding table 34 in the holding unit 3 arranged at the delivery position. The substrate discharge unit 9 includes Y-axis guide rails 91A and 91B extending in the Y direction, and transport sliders 92A and 92B movably connected to the Y-axis guide rails 91A and 91B.

  The Y-axis guide rails 91A and 91B are formed in a prismatic shape that is long in the Y direction. The length of the Y-axis guide rails 91A and 91B in the Y direction is set to be longer than the length of the holding base 34 in the Y direction. One end portion in the Y direction of the Y-axis guide rails 91A and 91B is disposed above one end portion in the Y direction on the holding base 34 disposed at the transfer position. On the other hand, the other end portion in the Y direction of the Y-axis guide rails 91A and 91B is disposed above the other end portion in the Y direction (the discharge table 61 side (see FIG. 1)) of the holding table 34 disposed at the delivery position. ing.

  Further, the distance from the lower surface of the Y-axis guide rails 91A and 91B to the upper surface 34a of the holding table 34 disposed at the transfer position is from the surface 101a of the substrate 101 floating above the holding table 34 to the upper surface 34a of the holding table 34. It is set longer than the distance. Therefore. The substrate 101 floating above the holding table 34 does not interfere with the Y-axis guide rails 91A and 91B.

  The transport slider 92A is movably engaged with the lower surface of the Y-axis guide rail 91A, and moves in the Y direction along the Y-axis guide rail 91A. The transport slider 92B is movably engaged with the lower surface of the Y-axis guide rail 91B, and moves in the Y direction along the Y-axis guide rail 91B.

  The transport sliders 92A and 92B come into contact with the edge (end surface) of one long side (the side far from the discharge table 61) of the substrate 101 that floats above the holding table 34 disposed at the transfer position, and the Y-axis guide rail 91A. , 91B to move in the Y direction. Thereby, the board | substrate 101 moves to the upper direction of the discharge stand 61 (refer FIG. 1) from the upper direction of the holding stand 34 arrange | positioned in the delivery position. That is, the transport sliders 92 </ b> A and 92 </ b> B transport the substrate 101 from above the holding table 34 disposed at the delivery position to above the discharge table 61.

<Operation of the exposure apparatus according to the first embodiment>
Next, the operation of the exposure apparatus 1 will be described.
First, the supply and recovery unit 7 (see FIG. 1) transports the substrate 101 before exposure to the receiving table 21 of the receiving unit 2. At this time, the holding unit 3 is disposed at the delivery position. The holding unit 3 only needs to be disposed at the transfer position until the substrate 101 floats above the receiving table 21 in the receiving unit 2.

  The receiving unit 2 projects a plurality of push-up pins 25 (see FIG. 2) from the upper surface 21 a of the receiving table 21, and supports the back surface 101 b of the substrate 101 with the tips of the plurality of push-up pins 25. At this time, a gap of a predetermined distance is generated between the back surface 101 b of the substrate 101 and the upper surface 21 a of the receiving table 21.

  Subsequently, the receiving unit 2 ejects highly compressed air from the plurality of substrate levitation holes 213. Highly compressed air sprayed from the plurality of substrate levitation holes 213 is blown substantially perpendicularly to the back surface 101 b of the substrate 101. In addition, the receiving unit 2 sucks air around the plurality of intake holes 212 (see FIG. 3), and a plurality of vacuum areas are formed between the upper surface 21 a of the receiving table 21 and the back surface 101 b of the substrate 101.

  In this state, the substrate 101 is supported by highly compressed air ejected from the plurality of substrate levitation holes 213. Therefore, the weight of the substrate 101 is hardly added to the plurality of push-up pins 25.

  Next, the receiving unit 2 lowers the plurality of push-up pins 25 and stores the tips of the plurality of push-up pins 25 in the receiving table 21. As a result, the plurality of push-up pins 25 are separated from the back surface 101 b of the substrate 101, and the substrate 101 floats above the receiving table 21.

  At this time, since the substrate 101 is not in contact with the receiving table 21, no frictional resistance is generated between the receiving table 21 and the substrate 101. In addition, since a plurality of vacuum zones are formed between the upper surface 21 a of the receiving table 21 and the back surface of the substrate 101, the substrate 101 does not move in a direction parallel to the upper surface 21 a of the receiving table 21.

  And the distance (flying height) from the upper surface 21a of the receiving stand 21 to the back surface 101b of the board | substrate 101 is predetermined length (height), and does not interfere with the board | substrate moving part 8 (refer FIG. 8). In the present embodiment, the flying height of the substrate 101 when high-compressed air is ejected from the plurality of substrate flying holes 213 is defined as the flying height for movement.

  Next, the receiving unit 2 injects highly compressed air from the plurality of substrate feed holes 214 (see FIG. 8). Highly compressed air ejected from the plurality of substrate feed holes 214 travels in a direction inclined to the other side in the X direction.

  The holding unit 3 injects highly compressed air from the plurality of substrate floating holes 343 and the plurality of first substrate feeding holes 344. The high compressed air jetted from the plurality of substrate floating holes 343 travels substantially perpendicular to the upper surface of the holding table 34, and the high compressed air jetted from the plurality of first substrate feed holes 344 is the other in the X direction. Proceed in the direction inclined to

  Subsequently, the substrate moving unit 8 moves the transport sliders 82A and 82B from one end in the X direction of the X-axis guide rails 81A and 81B to the other end. As a result, the transport sliders 82A and 82B come into contact with the edge of one short side of the substrate 101 and move in the X direction along the X-axis guide rails 81A and 81B. As a result, the substrate 101 moves from above the receiving table 21 to above the holding table 34.

  At this time, since the highly compressed air jetted from the plurality of substrate levitation holes 343 of the holding table 34 travels substantially perpendicular to the upper surface 34 a of the holding table 34, the substrate 101 also floats above the holding table 34. The flying height of the substrate 101 is maintained.

  Further, the highly compressed air injected from the plurality of substrate feed holes 214 of the receiving table 21 proceeds in a direction inclined to the other side in the X direction. Therefore, the highly compressed air jetted from the substrate feed hole 214 assists the movement of the substrate 101 to the other side in the X direction above the receiving table 21.

  Further, the highly compressed air jetted from the plurality of first substrate feed holes 344 of the holding table 34 advances in a direction inclined to the other in the X direction. Therefore, the highly compressed air ejected from the plurality of first substrate feed holes 344 assists the movement of the substrate 101 to the other side in the X direction above the holding table 34.

  As a result, the substrate 101 can easily move from above the receiving table 21 to above the holding table 34, and the load on the transport sliders 82A and 82B can be reduced. Therefore, the mechanism for moving the transport sliders 82A and 82B can be reduced in size.

  The substrate 101 moved from above the receiving table 21 to above the holding table 34 comes into contact with the locking pin 347 of the holding table 34 and stops. When the substrate 101 is disposed above the holding table 34, the receiving unit 2 stops jetting high-compressed air from the plurality of substrate floating holes 213 and the plurality of substrate feeding holes 214. In addition, the holding unit 3 stops the injection of high-compressed air from the plurality of substrate floating holes 343 and the plurality of first substrate feeding holes 344.

  Further, air around the plurality of intake holes 342 (see FIG. 5) is sucked to form a plurality of vacuum areas between the upper surface 34 a of the holding table 34 and the back surface 101 b of the substrate 101. As a result, the substrate 101 does not move in a direction parallel to the upper surface 34 a of the holding table 34.

  The holding unit 3 injects low-compressed air from the plurality of substrate levitation holes 343. Thereby, the pressure of the gas injected from the plurality of substrate levitation holes 343 is reduced, and the levitation height of the substrate 101 is lower than the levitation height for movement. In the present embodiment, the flying height of the substrate 101 when low-compressed air is ejected from the plurality of substrate flying holes 343 is set as the exposure flying height.

  Next, the holding unit 3 moves to one side in the X direction along the X-axis guide 41 in a state where the substrate 101 is floated and held. Thereby, the holding unit 3 is disposed at the exposure position, and the surface 101 a of the substrate 101 that has floated above the holding table 34 faces the exposure unit 5. The exposure unit 5 exposes the surface of the substrate 101. As a result, a pattern is formed on the surface 101 a of the substrate 101.

  The holding unit 3 positions the substrate 101 with respect to the exposure unit 5 by driving the X stage 31, the Y stage 32, the θ stage, and the Z-tilt mechanism 38 after being arranged at the exposure position. Further, the relative positioning between the exposure unit 5 and the substrate 101 that is floated and held above the holding unit 3 may be performed by moving the exposure unit 5.

  When the exposure by the exposure unit 5 is completed, the holding unit 3 stops the low-compressed air injection from the plurality of substrate floating holes 343 and injects the high-compressed air from the plurality of substrate floating holes 343. Thereby, the pressure of the gas injected from the plurality of substrate levitation holes 343 increases, and the flying height of the substrate 101 becomes the flying height for movement.

  At this time, by stopping the operation of sucking ambient air from the plurality of intake holes 342, the substrate 101 after exposure can be quickly raised. As described above, the operation of sucking ambient air from the plurality of intake holes 342 may be started and stopped at an appropriate timing.

  Next, the holding unit 3 moves to the other side in the X direction along the X-axis guide 41 in a state where the exposed substrate 101 is floated and held. Thereby, the holding unit 3 is arranged at the delivery position.

  Subsequently, the holding unit 3 ejects highly compressed air from the plurality of second substrate feed holes 345. Highly compressed air ejected from the plurality of second substrate feed holes 345 travels in a direction inclined to the other side in the Y direction.

  Next, the substrate moving unit 8 (see FIG. 8) moves the transport sliders 92A and 92B from one end in the Y direction of the Y-axis guide rails 91A and 91B to the other end. Accordingly, the transport sliders 92A and 92B come into contact with the edge of one long side of the substrate 101 and move in the Y direction along the Y-axis guide rails 91A and 91B. As a result, the substrate 101 moves from above the holding table 34 to above the discharge table 61 in the discharge unit 6 and moves above the discharge table 61.

  At this time, the highly compressed air ejected from the plurality of second substrate feed holes 345 of the holding base 34 advances in a direction inclined to the other in the Y direction. Therefore, the highly compressed air jetted from the second substrate feed hole 345 assists the movement of the substrate 101 to the other side in the Y direction above the holding table 34.

  As a result, the substrate 101 can easily move from above the holding table 34 to above the discharge table 61, and the load on the transport sliders 92A and 92B can be reduced. Therefore, the mechanism for moving the transport sliders 92A and 92B can be reduced in size.

  Thereafter, the supply and recovery unit 7 (see FIG. 1) takes out the exposed substrate 101 from the discharge table 61 and transports it to an apparatus for performing the next process in the production line. As an apparatus that performs the next process in the production line, for example, a developing apparatus that performs a developing process on a pattern exposed on the substrate 101 can be cited.

  In the exposure apparatus 1 of the present embodiment, the transport sliders 82A and 82B of the substrate moving unit 8 come into contact with the edge (end surface) of the substrate 101 that has floated above the receiving table 21, and the substrate 101 is moved above the holding table 34. Move. Thus, the transport sliders 82A and 82B can move the substrate 101 without contacting the back surface 101b of the substrate 101. As a result, it is possible to prevent or suppress foreign matters such as dust from adhering to the back surface 101b of the substrate 101.

  Further, in the exposure apparatus 1 of the present embodiment, the transport sliders 92A and 92B of the substrate discharge unit 9 come into contact with the edge (end surface) of the substrate 101 that floats above the holding table 34, and the substrate 101 is placed on the discharge table 61. Move upward. Thus, the transport sliders 92A and 92B can move the substrate 101 without contacting the back surface 101b of the substrate 101. As a result, it is possible to prevent or suppress foreign matters such as dust from adhering to the back surface 101b of the substrate 101.

  In the exposure apparatus 1 of the present embodiment, the holding table cooling unit 39 and the air cooling units 358 and 359 are provided. Thereby, the elongation of the substrate 101 due to thermal expansion can be suppressed to be small, so that defects in the pattern formed on the substrate 101 can be reduced. In the exposure apparatus 1 of the present embodiment, since the substrate 101 is lifted and moved, the cooling of the substrate 101 by the air cooling units 358 and 359 is more effective than the cooling of the substrate 101 by the holding table cooling unit 39.

  In the exposure apparatus 1 of the present embodiment, a plurality of push-up pins 25 are provided on the receiving table 21. Accordingly, the substrate 101 supplied from the supply and recovery unit is received by the plurality of push-up pins 25, so that the substrate 101 can be held in parallel with the upper surface 21 a of the receiving table 21.

  In the exposure apparatus 1 of the present embodiment, the receiving table 21 is provided with a plurality of substrate floating holes 213 and a plurality of substrate feeding holes 214. As a result, the substrate 101 can be floated above the receiving table 21 with the compressed air jetted from the plurality of substrate floating holes 213. Further, the movement of the substrate 101 can be assisted by the compressed air that is ejected from the plurality of substrate feed holes 214 and proceeds in a direction inclined in the moving direction of the substrate 101.

Further, in the exposure apparatus 1 of the present embodiment, the substrate 101 is floated and moved from above the receiving table 21 to above the holding table 34. Therefore, it is not necessary to arrange a transfer unit for transferring the substrate 101 between the receiving table 21 and the holding table 34, and the distance that the substrate 101 moves can be shortened. As a result, the apparatus can be reduced in size.
In addition, since it is not necessary to provide a plurality of push-up pins for receiving the substrate 101 on the holding base 34, the configuration of the apparatus can be simplified, and productivity when manufacturing the apparatus can be improved.

  Moreover, in the exposure apparatus 1 of this embodiment, since a conveyance part adsorb | sucks or supports the board | substrate 101, it does not convey to the holding stand 34, Therefore The time required for adsorption | suction and support can be shortened. In addition, distortion of the substrate 101 can be prevented, and foreign matter such as dust can be prevented or suppressed from adhering to the back surface 101b of the substrate 101, thereby reducing defects due to back surface transfer. As a result, the display panel can be manufactured with a short tact time and a high yield.

<Configuration of Exposure Apparatus According to Second Embodiment>
Next, the configuration of the exposure apparatus according to the second embodiment will be described with reference to FIG.
FIG. 9 is an explanatory diagram showing an outline of the configuration of an exposure apparatus according to the second embodiment.

  An exposure apparatus 10 according to the second embodiment has a configuration similar to that of the exposure apparatus 1 (see FIG. 2) according to the first embodiment. The exposure apparatus 10 is different from the exposure apparatus 1 only in the substrate moving unit 18. Therefore, here, the substrate moving unit 18 of the exposure apparatus 10 will be described, and description common to the exposure apparatus 1 will be omitted.

  As shown in FIG. 9, the substrate moving unit 18 of the exposure apparatus 10 is arranged above the receiving unit 2 and the holding unit 3 arranged at the delivery position. The substrate moving unit 18 includes an X-axis guide rail 181 extending in the X direction and a transport slider 182 movably connected to the X-axis guide rail 181.

  The X-axis guide rail 181 is formed in a rectangular column shape that is long in the X direction. One end portion in the X direction of the X-axis guide rail 181 is opposed to a substantially central portion on the upper surface 21a of the receiving table 21, and the other end portion in the X direction is a substantially central portion on the upper surface 34a of the holding table 34 disposed at the delivery position. Facing the part.

  The transport slider 182 is movably engaged with the lower surface of the X-axis guide rail 181 and moves in the X direction along the X-axis guide rail 181. The transport slider 182 includes an engaging portion 184, a main body portion 185, a contact portion 186, and a stopper portion 187.

  The engaging portion 184 is formed in a substantially rectangular parallelepiped shape, and its upper portion is movably engaged with the lower surface of the X-axis guide rail 181. The main body 185 is formed in a substantially rectangular plate shape, and has an upper surface 185a and a lower surface 185b that are substantially orthogonal to the Z direction. An engaging portion 184 is joined to a substantially central portion of the upper surface 185a of the main body portion 185.

  The contact portion 186 is continuous with one end portion in the X direction on the lower surface 185 b of the main body portion 185. The contact portion 186 protrudes substantially perpendicularly from the lower surface 185 b of the main body portion 185, and contacts the edge (end surface) of one short side (the side far from the holding table 34) of the substrate 101 that floats above the receiving table 21. To do.

  The stopper portion 187 is continuous with the other end portion in the X direction on the lower surface 185 b of the main body portion 185. The stopper portion 187 protrudes substantially vertically from the lower surface 185 b of the main body portion 185, contacts the substrate 101 that has moved above the holding base 34, and stops the movement of the substrate 101.

  The transport slider 182 moves above the receiving table 21 until the substrate 101 floats above the receiving table 21. For example, when the transport slider 182 interferes with the substrate 101 when the supply and recovery unit 7 (see FIG. 1) transports the substrate 101 before exposure to the receiving table 21 of the receiving unit 2, the entire substrate moving unit 18 is moved. It may be retracted upward.

  The substrate 101 that has floated above the receiving table 21 is disposed between the contact portion 186 and the stopper portion 187 of the transport slider 182. Thereafter, the transport slider 182 moves in the X direction along the X-axis guide rail 181 and is disposed above the holding table 34.

  At this time, the contact portion 186 of the transport slider 182 contacts the edge (end surface) of one short side (the side far from the holding table 34) of the substrate 101 that floats above the receiving table 21. As a result, the substrate 101 moves from above the receiving table 21 to above the holding table 34 disposed at the transfer position. That is, the transport slider 182 transports the substrate 101 from above the receiving table 21 to above the holding table 34 disposed at the transfer position.

  When the transport slider 182 stops above the holding table 34, only the substrate 101 floating above the holding table 34 moves in the X direction. Then, the stopper portion 187 contacts the edge (end surface) of the other short side of the substrate 101. Thereby, the movement of the substrate 101 in the X direction is stopped, and the substrate 101 is disposed above the holding table 34. Therefore, in the exposure apparatus 10 according to the second embodiment, the two locking pins 347 of the holding table 34 can be omitted.

  In the second embodiment, the same effect as in the first embodiment described above can be obtained. Furthermore, in the second embodiment, the movement of the substrate 101 in the X direction is stopped by the stopper portion 187 of the transport slider 182. Therefore, the impact applied to the substrate 101 can be made smaller than when the substrate 101 is stopped by the two locking pins 347 according to the first embodiment.

  In the present embodiment, when the transport slider 182 moves above the holding table 34, the substrate discharge unit 9 (not shown) positioned above the holding table 34 is retracted to a position where it does not interfere with the transport slider 182. Let

[Modification]
The exposure apparatus according to the embodiment of the present invention has been described above including its effects. However, the exposure apparatus of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention described in the claims.

  For example, in the first embodiment described above, the two holding pins 347 are provided on the holding base 34. However, the locking portion provided on the holding base according to the present invention is not limited to providing the two locking pins 347, and a locking portion that comes into contact with the substrate 101 and stops the movement of the substrate 101 in the X direction is provided. It only has to be done. As a latching | locking part which concerns on this invention, you may have a contact surface orthogonal to a X direction, for example. When providing such a locking part, if one or more locking parts are provided, the substrate 101 in contact with the locking part does not rotate.

  DESCRIPTION OF SYMBOLS 1,10 ... Exposure apparatus, 2 ... Acceptance unit, 3 ... Holding unit, 4 ... Base, 5 ... Exposure unit, 6 ... Discharge unit, 7 ... Supply and collection unit, 8, 18 ... Substrate moving part, 9 ... Substrate discharge , 21 ... receiving stand, 22 ... receiving stand support part, 23 ... first substrate floating part, 25 ... push-up pin, 26 ... pin lifting part, 31 ... X stage, 32 ... Y stage, 33 ... θ stage, 34 ... Holding table, 35 ... Second substrate floating part, 36 ... Y-axis guide, 38 ... Z-tilt mechanism, 39 ... Holding table cooling unit, 41 ... X-axis guide, 61 ... Discharge table, 81A, 81B, 181 ... X-axis guide rail, 82A, 82B, 92A, 92B, 182 ... conveying slider, 91A, 91B ... Y-axis guide rail, 101 ... substrate, 184 ... engaging portion, 185 ... main body portion 186: Contact part, 187 ... Stopper part, 211 ... Pin through hole, 212, 342 ... Intake hole, 213, 343 ... Substrate floating hole, 214 ... Substrate feed hole, 231, 232, 351, 352, 353, 391 ... Piping, 233 ... Fitting, 234 ... Low compressed air supply part, 235 ... High compressed air supply part, 237,354 ... Solenoid valve for low compressed air, 238,239,355,356,357 ... Electromagnetic for high compressed air Valve, 344 ... 1st board | substrate feed hole, 345 ... 2nd board | substrate feed hole, 347 ... Locking pin, 358,359 ... Air cooling part, 392 ... Heat exchanger

Claims (8)

A cradle to which the substrate is supplied;
A first substrate floating portion for floating the substrate above the receiving table;
A holding table arranged side by side on the receiving table;
A second substrate floating portion for floating the substrate above the holding table;
A substrate moving unit that contacts the edge of the substrate and moves the substrate floating above the receiving table to above the holding table;
An exposure unit that performs exposure on a substrate disposed above the holding table;
An exposure apparatus comprising: The receiving table jets a gas in a direction inclined to a direction in which the substrate moves from the receiving table to the holding table, and a plurality of substrate levitation holes that jet gas substantially perpendicularly to the back surface of the substrate. A plurality of substrate feed holes, and
2. The exposure according to claim 1, wherein the first substrate floating portion includes a pipe communicating with the plurality of substrate floating holes and the plurality of substrate feeding holes, and a gas supply unit connected to the pipe. apparatus. The holding table is configured to eject a gas in a direction inclined in a direction in which the substrate moves from the receiving table to the holding table, and a plurality of substrate levitation holes that jet gas substantially perpendicularly to the back surface of the substrate. A plurality of substrate feed holes, and
The said 2nd board | substrate levitation | floating part has the piping connected to these several board | substrate levitation holes and these board | substrate feeding holes, and the gas supply part connected to the said piping. Exposure equipment. The exposure apparatus according to claim 3, wherein the second substrate floating portion includes a gas cooling unit that cools the gas supplied from the gas supply unit. The exposure apparatus according to claim 1, further comprising a holding table cooling unit that cools the holding table. A discharge table arranged side by side on the holding table;
A substrate discharge unit that contacts the edge of the substrate exposed by the exposure unit and moves the substrate floating above the holding table to above the discharge table;
An exposure apparatus according to claim 1. The holding table is configured to eject a gas in a direction inclined in a direction in which the substrate moves from the receiving table to the holding table, and a plurality of substrate levitation holes that jet gas substantially perpendicularly to the back surface of the substrate. A plurality of first substrate feed holes, and a plurality of second substrate feed holes for ejecting gas in a direction inclined in a direction in which the substrate moves from the holding table to the discharge table,
The second substrate floating portion includes a plurality of substrate floating holes, a plurality of first substrate feeding holes, a pipe communicating with the plurality of second substrate feeding holes, and a gas supply connected to the pipe An exposure apparatus according to claim 6. The exposure apparatus according to claim 1, further comprising a holding table moving mechanism that moves the holding table below the exposure unit.