JP2012253954A - Electric power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To take thermal countermeasures of a current sensor without increasing the size of an electric power conversion apparatus.SOLUTION: An electric power conversion apparatus according to this invention includes: a power semiconductor module having a power semiconductor element; a passage forming body; and a current sensor. The power semiconductor module has a metal first heat radiation base facing one surface of the power semiconductor element, a metal second heat radiation base facing the other surface of the power semiconductor element; and an alternating current terminal transmitting an alternating current. The passage forming body has a first passage disposed at a side part of the first heat radiation base and a second passage disposed so as to face the first passage through the power semiconductor module. The current sensor is disposed at a position through which the alternating current terminal penetrates, and the current sensor has a first fixing part fixed to the first heat radiation base and a second fixing part fixed to the second heat radiation base.

Description

  The present invention relates to a power conversion device, and more particularly to a power conversion device that controls a drive motor of a hybrid vehicle or an electric vehicle.

  In the case of a power converter used in a hybrid vehicle, particularly an electric vehicle, a large current of about 450 Arms may be applied between the power semiconductor element and the end of the AC bus bar that transmits the AC current. A large current flows through the AC bus bar, and the temperature rises due to Joule heat. Since the current sensor for detecting the current value of the alternating current penetrates the alternating current bus bar, there is a problem that it is exposed to a high temperature due to heat generated by the alternating current bus bar.

  A current sensor is usually composed of a core having a gap and a Hall element mounted in the gap portion of the core, and the magnetic flux generated by the current passing through the core is converged by the core, and the magnetic flux generated in the gap portion of the core is By detecting with the Hall element, it is possible to detect the amount of current flowing through the AC bus bar. Here, when the ambient temperature of the current sensor or the temperature of the current sensor itself rises due to the heat generated by the AC bus bar, the resin mounting the core melts, exceeds the allowable temperature of the Hall element, and errors due to temperature drift increase. Furthermore, since the Hall element is usually a compound semiconductor such as GaAs, there has been a problem that the Hall element does not operate because the temperature exceeds the allowable temperature of the semiconductor.

  Therefore, in Patent Document 1 (Japanese Patent Laid-Open No. 2006-81308), the current sensor is mounted in parallel with the power module on the heat sink that cools the power semiconductor module, so that the heat of the current sensor generated by the heat generated by the bus bar is transferred to the heat sink. It is disclosed that a large current is passed through the AC output by dissipating heat.

JP 2006-81308 A

  However, in the configuration of Patent Document 1, since it is necessary to increase the size of the heat sink in order to secure a space for cooling the current sensor, there is a problem that the power conversion device is increased in size.

  Another problem is that the signal terminal connected to the Hall element for measuring the magnetic flux of the core of the current sensor comes out in the same direction as the control terminal of the power semiconductor module. There is a problem that it is necessary to solder the signal terminal of the Hall element to the driver circuit board in the same process as connecting to the driver circuit board by soldering or the like. In other words, the control terminals of the power semiconductor module require two terminals for driving a normal power semiconductor element, one terminal for a current sensor of the power semiconductor element, and two terminals for detecting the temperature of the power semiconductor element. is there. Even if the temperature detection is to detect only the temperature of the power semiconductor element related to one of the upper and lower arms of the inverter circuit, at least eight are required for one phase of the upper and lower arms. For three phases, a total of 8 × 3 = 24 control terminals are required. If this is added to the three terminals for current sensors × 3 outputs = 9, the total is 33. In addition to being extremely difficult to insert a large number of signal terminals into the driver circuit board in this way, the process of soldering requires a lot of man-hours and the productivity in the inverter final assembly process also decreases. was there.

  The subject of this invention is performing the heat countermeasure of a current sensor, without enlarging a power converter device. Another object of the present invention is to not impair productivity in the assembly process of the power converter.

  In order to solve the above problems, a power conversion device according to the present invention includes a power semiconductor module having a power semiconductor element that converts a direct current into an alternating current, a flow path forming body that forms a flow path for flowing a cooling refrigerant, A power sensor that detects an alternating current, wherein the power semiconductor module includes a first metal heat dissipation base that faces one surface of the power semiconductor element, and a metal that faces the other surface of the power semiconductor element. A second heat radiating base made of metal, and an alternating current terminal that projects from the space between the first heat radiating base and the second heat radiating base and transmits the alternating current. 1 has a first flow path disposed on the side of the heat dissipation base, and a second flow path disposed to face the first flow path through the power semiconductor module, and the current sensor includes: AC terminal Is disposed at a position to be penetrated further said current sensor includes a first fixing portion for fixing to the first heat radiating base, a second fixing portion for fixing to the second heat radiating base, a. Thereby, the heat countermeasure of a current sensor can be performed, without enlarging a power converter device.

  According to the present invention, it is possible to protect the current sensor from heat while suppressing an increase in size of the power conversion device. As another effect of the present invention, productivity can be improved in the assembly process of the power converter.

1 is a system diagram showing a system of a hybrid vehicle. It is a circuit diagram which shows the structure of the electric circuit shown in FIG. 1 is an external perspective view of a power conversion device 200. FIG. It is the perspective view which decomposed | disassembled the power converter device 200. FIG. It is the figure which looked at the case 10 shown in FIG. 4 from the bottom. FIG. 6A is a perspective view of the power semiconductor module 300a of the present embodiment. FIG. 6B is a cross-sectional view of the power semiconductor module 300a according to the present embodiment cut along a cross section D and viewed from the direction E. FIG. 7 is a view showing a power semiconductor module 300a from which the screw 309 and the second sealing resin 351 are removed from the state shown in FIG. 6, FIG. 7 (a) is a perspective view, and FIG. 7 (b) is FIG. 6 (b). It is sectional drawing when it cut | disconnects in the cross section D similarly and is seen from the direction E. FIGS. 8A and 8B are views showing the power semiconductor module 300a from which the module case 304 is further removed from the state shown in FIG. 7, FIG. 8A is a perspective view, and FIG. 8B is FIGS. It is sectional drawing when it cut | disconnects by the cross section D similarly to), and it sees from the direction E. FIG. FIG. 9 is a perspective view of a power semiconductor module 300a in which the first sealing resin 348 and the wiring insulating portion 608 are further removed from the state shown in FIG. It is a figure for demonstrating the assembly process of the module primary sealing body 302. FIG. 4 is a perspective view for explaining the structure of a capacitor module 500. FIG. 12A is an external perspective view in which the power semiconductor modules 300a to 300c, the capacitor module 500, and the bus bar assembly 800 are assembled to the case 10, and FIG. 12B is an enlarged view of a portion A in FIG. FIG. FIG. 13A is a top view of the power semiconductor module 300a according to the present embodiment. FIG. 13B is a side view of the power semiconductor module 300a according to the present embodiment. FIG. 14A is a top view of a power semiconductor module 300a according to another embodiment. FIG. 14B is a side view of a power semiconductor module 300a according to another embodiment. It is a perspective view of the power converter device 200 in the state where the metal base plate 11 is separated. It is sectional drawing of the power converter device 200 seen from the arrow direction of the cross section B of FIG. It is an enlarged view of peripheral components of AC terminals 822a to 822c. It is an enlarged view of peripheral components of the DC terminal 900a on the negative electrode side and the DC terminal 900b on the positive electrode side. 1 is an exploded perspective view of a case 10 in which AC terminals 822a to 822c and DC terminals 900a and 900b are assembled, and a vehicle-side connector 193. FIG. It is a side view of case 10 seen from the side where AC terminals 822a-822c and DC terminal 900a are arranged. It is a top view of the capacitor module 500 with the resin sealing material 550 removed. FIG. 5 is a top view of the power conversion apparatus 200 from which electric components arranged above the capacitor module 500 shown in FIG. 4 are removed. It is sectional drawing seen from the arrow direction of the dashed-dotted line AA of FIG. It is sectional drawing seen from the arrow direction of the dashed-dotted line BB of FIG. 4 is a side view showing a connection state between a connector 51 and a connector 55 provided on the driver circuit board 22. FIG. FIG. 26A is a top view of a power semiconductor module 300a according to another embodiment. FIG. 26B is a side view of a power semiconductor module 300a according to another embodiment. 4 is a side view showing a connection state between a connector 51 and a driver circuit board 22. FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing a control block of a hybrid vehicle (hereinafter referred to as “HEV”). Engine EGN and motor generator MG1 generate vehicle running torque. Motor generator MG1 not only generates rotational torque but also has a function of converting mechanical energy applied from the outside to motor generator MG1 into electric power.

  The motor generator MG1 is, for example, a synchronous machine or an induction machine, and operates as a motor or a generator depending on the operation method as described above. When motor generator MG1 is mounted on an automobile, it is desirable to obtain a small and high output, and a permanent magnet type synchronous motor using a magnet such as neodymium is suitable. Further, the permanent magnet type synchronous motor generates less heat from the rotor than the induction motor, and is excellent for automobiles from this viewpoint.

  The output torque on the output side of the engine EGN is transmitted to the motor generator MG1 via the power distribution mechanism TSM, and the rotation torque from the power distribution mechanism TSM or the rotation torque generated by the motor generator MG1 is transmitted via the transmission TM and the differential gear DEF. Transmitted to the wheels. On the other hand, during regenerative braking operation, rotational torque is transmitted from the wheels to motor generator MG1, and AC power is generated based on the supplied rotational torque. The generated AC power is converted to DC power by the power conversion device 200 as described later, and the high-voltage battery 136 is charged, and the charged power is used again as travel energy.

  Next, the power conversion device 200 will be described. The inverter circuit 140 is electrically connected to the battery 136 via the direct current side connector 138, and power is exchanged between the battery 136 and the inverter circuit 140. When motor generator MG 1 is operated as a motor, inverter circuit 140 generates AC power based on DC power supplied from battery 136 via DC connector 138, and supplies to motor generator MG 1 via AC connector 188. Supply. The configuration comprising motor generator MG1 and inverter circuit 140 operates as a first motor generator unit.

  In the present embodiment, the first motor generator unit is operated as the electric unit by the electric power of the battery 136, so that the vehicle can be driven only by the power of the motor generator MG1. Further, in the present embodiment, the battery 136 can be charged by operating the first motor generator unit as a power generation unit by the power of the engine EGN or the power from the wheels to generate power.

  The power conversion device 200 includes a capacitor module 500 for smoothing the DC power supplied to the inverter circuit 140.

  The power conversion device 200 includes a communication connector 21 for receiving a command from a host control device or transmitting data representing a state to the host control device. Power conversion device 200 calculates a control amount of motor generator MG1 by control circuit 172 based on a command input from connector 21, further calculates whether to operate as a motor or a generator, and based on the calculation result. The control pulse is generated, and the control pulse is supplied to the driver circuit 174. The driver circuit 174 generates a driving pulse for controlling the inverter circuit 140 based on the supplied control pulse.

  Next, the configuration of the electric circuit of the inverter circuit 140 will be described with reference to FIG. In the following description, an insulated gate bipolar transistor is used as a semiconductor element, and hereinafter abbreviated as IGBT. The IGBT 328 and the diode 156 that operate as the upper arm, and the IGBT 330 and the diode 166 that operate as the lower arm constitute the series circuit 150 of the upper and lower arms. The inverter circuit 140 includes this series circuit 150 corresponding to the three phases of the U-phase, V-phase, and W-phase of the AC power to be output.

  In this embodiment, these three phases correspond to the three-phase windings of the armature winding of motor generator MG1. The series circuit 150 of the upper and lower arms of each of the three phases outputs an alternating current from the intermediate electrode 169 that is the middle point portion of the series circuit. This intermediate electrode 169 is connected to AC bus bars 802 and 804 described below which are AC power lines to motor generator MG1 through AC terminal 159 and AC side connector 188.

  The collector electrode 153 of the IGBT 328 of the upper arm is electrically connected to the capacitor terminal 506 on the positive electrode side of the capacitor module 500 via the positive electrode terminal 157. The emitter electrode of the IGBT 330 of the lower arm is electrically connected to the capacitor terminal 504 on the negative electrode side of the capacitor module 500 via the negative electrode terminal 158.

  As described above, the control circuit 172 receives a control command from the host control device via the connector 21, and based on this, the IGBT 328 that configures the upper arm or the lower arm of each phase series circuit 150 that constitutes the inverter circuit 140. And a control pulse that is a control signal for controlling the IGBT 330 is generated and supplied to the driver circuit 174.

  Based on the control pulse, the driver circuit 174 supplies a drive pulse for controlling the IGBT 328 and IGBT 330 constituting the upper arm or the lower arm of each phase series circuit 150 to the IGBT 328 and IGBT 330 of each phase. IGBT 328 and IGBT 330 perform conduction or cutoff operation based on the drive pulse from driver circuit 174, convert DC power supplied from battery 136 into three-phase AC power, and supply the converted power to motor generator MG1. Is done.

  The IGBT 328 includes a collector electrode 153, a signal emitter electrode 155, and a gate electrode 154. The IGBT 330 includes a collector electrode 163, a signal emitter electrode 165, and a gate electrode 164. A diode 156 is electrically connected between the collector electrode 153 and the emitter electrode 155. A diode 166 is electrically connected between the collector electrode 163 and the emitter electrode 165.

  As the switching power semiconductor element, a metal oxide semiconductor field effect transistor (hereinafter abbreviated as MOSFET) may be used. In this case, the diode 156 and the diode 166 are unnecessary. As a power semiconductor element for switching, IGBT is suitable when the DC voltage is relatively high, and MOSFET is suitable when the DC voltage is relatively low.

  The capacitor module 500 includes a capacitor terminal 506 on the positive electrode side, a capacitor terminal 504 on the negative electrode side, a power supply terminal 509 on the positive electrode side, and a power supply terminal 508 on the negative electrode side. The high-voltage DC power from the battery 136 is supplied to the positive-side power terminal 509 and the negative-side power terminal 508 via the DC-side connector 138, and the positive-side capacitor terminal 506 and the negative-side power terminal 508 of the capacitor module 500 are supplied. The voltage is supplied from the capacitor terminal 504 to the inverter circuit 140.

  On the other hand, the DC power converted from the AC power by the inverter circuit 140 is supplied to the capacitor module 500 from the positive capacitor terminal 506 and the negative capacitor terminal 504, and is connected to the positive power terminal 509 and the negative power terminal 508. Is supplied to the battery 136 via the DC connector 138 and stored in the battery 136.

  The control circuit 172 includes a microcomputer (hereinafter referred to as “microcomputer”) for calculating the switching timing of the IGBT 328 and the IGBT 330. The input information to the microcomputer includes a target torque value required for the motor generator MG1, a current value supplied from the series circuit 150 to the motor generator MG1, and a magnetic pole position of the rotor of the motor generator MG1.

  The target torque value is based on a command signal output from a host controller (not shown). The current value is detected based on a detection signal from the current sensor 180. The magnetic pole position is detected based on a detection signal output from a rotating magnetic pole sensor (not shown) such as a resolver provided in the motor generator MG1. In the present embodiment, the current sensor 180 detects a three-phase current value as an example. However, the current sensor 180 may detect a current value for two phases and obtain a current for three phases by calculation. .

  The microcomputer in the control circuit 172 calculates the d-axis and q-axis current command values of the motor generator MG1 based on the target torque value, the calculated d-axis and q-axis current command values, and the detected d The voltage command values for the d-axis and q-axis are calculated based on the difference between the current values for the axes and q-axis, and the calculated voltage command values for the d-axis and q-axis are calculated based on the detected magnetic pole position. Convert to phase, V phase, and W phase voltage command values. Then, the microcomputer generates a pulse-like modulated wave based on the comparison between the fundamental wave (sine wave) and the carrier wave (triangular wave) based on the voltage command values of the U-phase, V-phase, and W-phase, and the generated modulation The wave is output to the driver circuit 174 as a PWM (pulse width modulation) signal.

  When driving the lower arm, the driver circuit 174 outputs a drive signal obtained by amplifying the PWM signal to the gate electrode of the corresponding IGBT 330 of the lower arm. Further, when driving the upper arm, the driver circuit 174 amplifies the PWM signal after shifting the level of the reference potential of the PWM signal to the level of the reference potential of the upper arm, and uses this as a drive signal as a corresponding upper arm. Are output to the gate electrodes of the IGBTs 328 respectively.

  Further, the microcomputer in the control circuit 172 detects an abnormality (overcurrent, overvoltage, overtemperature, etc.) and protects the series circuit 150. For this reason, sensing information is input to the control circuit 172. For example, information on the current flowing through the emitter electrodes of the IGBTs 328 and IGBTs 330 is input to the corresponding drive units (ICs) from the signal emitter electrode 155 and the signal emitter electrode 165 of each arm. Thereby, each drive part (IC) detects an overcurrent, and when an overcurrent is detected, the switching operation of the corresponding IGBT 328 and IGBT 330 is stopped, and the corresponding IGBT 328 and IGBT 330 are protected from the overcurrent.

  Information on the temperature of the series circuit 150 is input to the microcomputer from a temperature sensor (not shown) provided in the series circuit 150. In addition, voltage information on the DC positive side of the series circuit 150 is input to the microcomputer. The microcomputer performs over-temperature detection and over-voltage detection based on the information, and stops switching operations of all the IGBTs 328 and IGBTs 330 when an over-temperature or over-voltage is detected.

  FIG. 3 is an external perspective view of the power conversion device 200. FIG. 4 is an exploded perspective view of the power conversion device 200 in order to help understanding in order to explain the internal configuration of the case 10 of the power conversion device 200.

  An inlet pipe 13 for flowing in the refrigerant and an outlet pipe 14 for flowing out the refrigerant are arranged on the same side surface of the case 10. The case 10 houses the flow path forming body 12 so that the refrigerant flow path 19 shown in FIG. 5 is along both sides of the case 10. An opening 400a and an opening 400b are formed along the side surface of the case 10 on the upper surface of one side of the flow path forming body 12, and the opening 400c is formed on the upper surface of the other side of the flow path forming body 12. Is formed. Openings 400a to 400c are closed by inserted power semiconductor modules 300a to 300c.

  A storage space 405 for storing the capacitor module 500 is formed between one first flow path portion 19a and the other second flow path portion 19c formed by the flow path forming body 12. Thereby, the capacitor module 500 is cooled by the refrigerant flowing in the refrigerant flow path 19. Since the capacitor module 500 is disposed so as to be surrounded by the refrigerant flow paths 19a to 19c, it can be efficiently cooled.

  Further, since the flow path is formed along the outer surface of the capacitor module 500, the arrangement of the flow path, the capacitor module 500, and the power semiconductor module 300 is neatly arranged, and the whole becomes smaller. The first flow path portion 19a and the third flow path portion 19c are arranged along the long side of the capacitor module 500, and the distance from the power semiconductor modules 300a to 300c inserted and fixed in the refrigerant flow path 19 is substantially constant. Therefore, the circuit constants of the smoothing capacitor and the power semiconductor module circuit can be easily balanced in each of the three phases, and the circuit configuration can easily reduce the spike voltage. In the present embodiment, water is most suitable as the refrigerant. However, since it can be used other than water, it will be referred to as a refrigerant hereinafter.

  As shown in FIG. 4, a bus bar assembly 800 described later is disposed above the capacitor module 500. The bus bar assembly 800 includes an AC bus bar and a holding member 803 that holds the AC bus bar.

  By forming the flow path forming body 12 and the case 10 integrally by casting an aluminum material, the refrigerant flow path 19 has an effect of increasing the mechanical strength in addition to the cooling effect. Moreover, the flow path forming body 12 and the case 10 are integrated with each other by being made by aluminum casting, so that the heat conduction of the entire power conversion device 200 is improved and the cooling efficiency is improved.

  The driver circuit board 22 is disposed above the bus bar assembly 800. A metal base plate 11 is disposed between the driver circuit board 22 and the control circuit board 20.

  The metal base plate 11 is fixed to the case 10. The metal base plate 11 functions as an electromagnetic shield for a group of circuits mounted on the driver circuit board 22 and the control circuit board 20 and also releases and cools the heat generated by the driver circuit board 22 and the control circuit board 20. have. The point that the metal base plate 11 has a high noise suppression function will be described later.

  Further, the metal base plate 11 has an effect of increasing the mechanical resonance frequency of the control circuit board 20. That is, it becomes possible to dispose screwing portions for fixing the control circuit board 20 to the metal base plate 11 at short intervals, shorten the distance between the support points when mechanical vibration occurs, and reduce the resonance frequency. Can be high. Since the resonance frequency of the control circuit board 20 can be increased with respect to the vibration frequency transmitted from the engine or the like, it is difficult to be affected by the vibration and the reliability is improved.

  The lid 8 is fixed to the metal base plate 11 to protect the control circuit board 20 from external electromagnetic noise.

  In the case 10 according to the present embodiment, the portion in which the flow path forming body 12 is housed has a substantially rectangular parallelepiped shape, but a projecting housing portion 10a is formed from one side of the case 10. A terminal 702 extended from the DCDC converter 700, a DC-side bus bar assembly 800, which will be described later, and a resistor 450 are housed in the protruding housing portion 10a. Here, the resistor 450 is a resistor element for discharging the electric charge stored in the capacitor element of the capacitor module 500. As described above, since the electric circuit components between the battery 136 and the capacitor module 500 are concentrated in the protruding housing portion 10a, it is possible to suppress complication of wiring and contribute to downsizing of the entire apparatus. .

  The lid 18 shown in FIG. 4 is a member for closing the working window 17 for connecting the terminal 702 extended from the DCDC converter 700. Note that the DCDC converter 700 forms an opening 701 for penetrating the terminal 702 on the surface facing the bottom surface of the case 10.

  In this way, the flow path forming body 12 is disposed at the bottom of the power conversion device 200, and then the work of fixing necessary components such as the capacitor module 500, the bus bar assembly 800, and the substrate can be sequentially performed from the top. This improves productivity and reliability.

  FIG. 5 is a view for explaining the case 10 and the flow path forming body 12, and is a view of the case 10 shown in FIG. 4 as viewed from below.

  A single opening 404 is formed on the lower surface of the case 10, and the opening 404 is closed by the lower cover 420. A seal member 409 is provided between the lower cover 420 and the case 10 to maintain airtightness.

  The lower cover 420 is formed with a convex portion 406 that protrudes in the direction opposite to the side on which the refrigerant flow path 19 is disposed. The convex part 406 is provided corresponding to the power semiconductor modules 300a to 300c. In addition, although the convex part 407 does not respond | correspond with a power semiconductor module, it is provided in order to adjust the cross-sectional area of the refrigerant | coolant flow path 19. FIG.

  The refrigerant flows in the direction of flow 417 indicated by the dotted line through the inlet pipe 13 and in the first flow path portion 19a formed along the longitudinal side of the case 10 in the direction of flow 418. Further, the refrigerant flows in the second flow path portion 19 b formed along the short side of the case 10 as in the flow direction 421 as in the flow direction 421. The second channel portion 19b forms a folded channel. In addition, the refrigerant flows through the third flow path portion 19 c formed along the longitudinal side of the flow path forming body 12 as in the flow direction 422. The third flow path portion 19c is provided at a position facing the first flow path portion 19a across the capacitor module 500. Further, the refrigerant flows out through the outlet pipe 14 as in the flow direction 423.

  The first flow path portion 19a, the second flow path portion 19b, and the third flow path portion 19c are all formed larger in the depth direction than in the width direction. Moreover, since the flow path forming body 12 is formed so that the opening 404 formed on the back surface of the case 10 and the openings 400a to 400c face each other, the flow path forming body 12 is configured to be easily manufactured by aluminum casting.

  A detailed configuration of the power semiconductor modules 300a to 300c used in the inverter circuit 140 will be described with reference to FIGS. The power semiconductor modules 300a to 300c have the same structure, and the structure of the power semiconductor module 300a will be described as a representative. 6 to 10, the control terminal 325U corresponds to the gate electrode terminal 154 and the signal emitter electrode 155 disclosed in FIG. 2, and the control terminal 325L corresponds to the gate electrode 164 and the emitter electrode 165 disclosed in FIG. Correspond. The DC positive terminal 315B is the same as the positive terminal 157 disclosed in FIG. 2, and the DC negative terminal 319B is the same as the negative terminal 158 disclosed in FIG. The AC terminal 320B is the same as the AC terminal 159 disclosed in FIG.

  FIG. 6A is a perspective view of the power semiconductor module 300a of the present embodiment. FIG. 6B is a cross-sectional view of the power semiconductor module 300a according to the present embodiment cut along a cross section D and viewed from the direction E.

  FIG. 7 is a diagram showing a power semiconductor module 300a in which the screw 309 and the second sealing resin 351 are removed from the state shown in FIG. FIG. 7A is a perspective view, and FIG. 7B is a cross-sectional view when viewed from the direction E cut along a cross-section D in the same manner as FIG. 6B. FIG. 7C shows a cross-sectional view before the fin 305 is pressed and the bending portion 304A is deformed.

  FIG. 8 is a diagram showing a power semiconductor module 300a in which the module case 304 is further removed from the state shown in FIG. FIG. 8A is a perspective view, and FIG. 8B is a cross-sectional view taken along the section D and viewed from the direction E similarly to FIGS. 6B and 7B.

  FIG. 9 is a perspective view of the power semiconductor module 300a in which the first sealing resin 348 and the wiring insulating portion 608 are further removed from the state shown in FIG.

  FIG. 10 is a view for explaining an assembly process of the module primary sealing body 302.

  The power semiconductor elements (IGBT 328, IGBT 330, diode 156, and diode 166) constituting the upper and lower arm series circuit 150, as shown in FIGS. 8 and 9, are formed by the conductor plate 315 or conductor plate 318, or by the conductor plate 320 or conductor plate. By 319, it is fixed by being sandwiched from both sides. The conductor plate 315 and the like are sealed with the first sealing resin 348 with the heat dissipation surface exposed, and the insulating sheet 333 is thermocompression bonded to the heat dissipation surface. As shown in FIG. 8, the first sealing resin 348 has a polyhedral shape (here, a substantially rectangular parallelepiped shape).

  The module primary sealing body 302 sealed with the first sealing resin 348 is inserted into the module case 304 and sandwiched with the insulating sheet 333, and is thermocompression bonded to the inner surface of the module case 304 that is a CAN type cooler. Is done. Here, the CAN-type cooler is a cylindrical cooler having an insertion port 306 on one surface and a bottom on the other surface. The space remaining inside the module case 304 is filled with the second sealing resin 351.

  The module case 304 is made of a member having electrical conductivity, for example, an aluminum alloy material (Al, AlSi, AlSiC, Al—C, etc.), and is integrally formed without a joint. The module case 304 has a structure in which no opening other than the insertion port 306 is provided. The insertion port 306 is surrounded by a flange 304B. Further, as shown in FIG. 6 (a), the first heat radiating surface 307A and the second heat radiating surface 307B, which are wider than the other surfaces, are arranged facing each other so as to face these heat radiating surfaces. Each power semiconductor element (IGBT 328, IGBT 330, diode 156, diode 166) is arranged. The three surfaces that connect the first heat radiation surface 307A and the second heat radiation surface 307B that face each other constitute a surface that is sealed with a narrower width than the first heat radiation surface 307A and the second heat radiation surface 307B, and the other one side surface An insertion port 306 is formed at the bottom. The shape of the module case 304 does not need to be an accurate rectangular parallelepiped, and the corner may form a curved surface as shown in FIG.

  By using the metal case having such a shape, even when the module case 304 is inserted into the refrigerant flow path 19 through which a refrigerant such as water or oil flows, a seal against the refrigerant can be secured by the flange 304B. It is possible to prevent the medium from entering the inside of the module case 304 with a simple configuration. Further, the fins 305 are uniformly formed on the first heat radiation surface 307A and the second heat radiation surface 307B facing each other. Further, a curved portion 304A having an extremely thin thickness is formed on the outer periphery of the first heat radiating surface 307A and the second heat radiating surface 307B. Since the curved portion 304A is extremely thin to such an extent that it can be easily deformed by pressurizing the fin 305, the productivity after the module primary sealing body 302 is inserted is improved.

  As described above, the gap between the conductor plate 315 and the inner wall of the module case 304 can be reduced by thermocompression bonding the conductor plate 315 and the like to the inner wall of the module case 304 via the insulating sheet 333, and the power semiconductor The generated heat of the element can be efficiently transmitted to the fin 305. Further, by providing the insulating sheet 333 with a certain degree of thickness and flexibility, the generation of thermal stress can be absorbed by the insulating sheet 333, which is favorable for use in a power conversion device for a vehicle having a large temperature change. .

  Outside the module case 304, a metallic DC positive wiring 315A and a DC negative wiring 319A for electrical connection with the capacitor module 500 are provided, and a DC positive terminal 315B (157) and a DC are connected to the tip thereof. Negative terminals 319B (158) are formed respectively. Also, a metallic AC wiring 320A for supplying AC power to motor generator MG1 or MG2 is provided, and an AC terminal 320B (159) is formed at the tip thereof. In the present embodiment, as shown in FIG. 9, the DC positive wiring 315A is connected to the conductor plate 315, the DC negative wiring 319A is connected to the conductor plate 319, and the AC wiring 320A is connected to the conductor plate 320.

  In addition to the module case 304, metal signal wirings 324U and 324L for electrical connection with the driver circuit 174 are provided, and a control terminal 325U (154, 155) and a control terminal 325L are provided at the tip thereof. (164, 165) are formed. In the present embodiment, as shown in FIG. 9, the signal wiring 324 </ b> U is connected to the IGBT 328, and the signal wiring 324 </ b> L is connected to the IGBT 328.

  FIG. 13A is a top view of the power semiconductor module 300a according to the present embodiment. FIG. 13B is a side view of the power semiconductor module 300a according to the present embodiment.

  The current sensor 180a is obtained by molding a core having a gap with a resin, and an IC having a Hall element is mounted in the gap portion of the core. The current sensor 180a protrudes from one side surface of the current sensor 180a and is fixed to the flange portion 304B. The current sensor 180a protrudes from the other side surface of the current sensor 180a and is fixed to the flange portion 304B. And a fixing part. Further, the current sensor 180a has a signal terminal 184 electrically connected to the IC in the current sensor 180a extended above the power semiconductor module 300a, and connected to the driver circuit board 22 by soldering like the control terminals 325U and 325L. Is done. The current sensor connected to the power semiconductor modules 300b and 300c has the same configuration as the current sensor 180a.

  In the case of a power conversion device for driving a motor of a hybrid vehicle or an electric vehicle, a large current of several hundred amperes is passed through the AC wiring 320A. Therefore, although it generates heat due to Joule heat, the current sensor 180a is fixed to the flange portion 304B near the cooling fin 305 with screws, so that the heat received by the current sensor 180a is the first fixing portion 181a and the second fixing portion. Since the current sensor 180a is cooled in the order of 181b, the flange portion 304B, the fin 305, and the refrigerant, the current sensor 180a can be used at a temperature lower than the allowable temperature even when a large current flows through the AC wiring 320A. Can be improved.

  In this embodiment, when the current sensor 180a is fixed to the power semiconductor module 300a with a screw, it is directly fixed. However, a method of improving the thermal conductivity using heat radiation grease or the like is also effective.

  In the present embodiment, an adhesive may be used to fix the current sensor 180a, or the current sensor 180a may be molded on the double-sided cooling power semiconductor module 300.

  Even when the module case 304 is not provided with the flange portion 304B, the first fixing portion 181a and the second fixing portion 181b of the current sensor 180a are not connected to the first heat dissipation surface 307A and the second heat dissipation surface 307B of the module case 304. The current sensor 180a can be protected from heat by being directly connected to the surface in the vertical direction, that is, the surface in the thickness direction of the module case 304.

  The DC positive wiring 315A, the DC negative wiring 319A, the AC wiring 320A, the signal wiring 324U, and the signal wiring 324L are integrally molded as the auxiliary mold body 600 in a state where they are insulated from each other by the wiring insulating portion 608 formed of a resin material. Is done. The wiring insulating portion 608 also acts as a support member for supporting each wiring, and a thermosetting resin or a thermoplastic resin having an insulating property is suitable for the resin material used therefor. As a result, it is possible to secure insulation between the DC positive electrode wiring 315A, the DC negative electrode wiring 319A, the AC wiring 320A, the signal wiring 324U, and the signal wiring 324L, thereby enabling high-density wiring.

  The auxiliary mold body 600 is fixed to the module case 304 with a screw 309 that passes through a screw hole provided in the wiring insulating portion 608 after being metal-bonded to the module primary sealing body 302 at the connection portion 370. For example, TIG welding or the like can be used for metal bonding between the module primary sealing body 302 and the auxiliary mold body 600 in the connection portion 370.

  The direct current positive electrode wiring 315A and the direct current negative electrode wiring 319A are stacked on each other in a state of facing each other with the wiring insulating portion 608 interposed therebetween, and have a shape extending substantially in parallel. With such an arrangement and shape, the current that instantaneously flows during the switching operation of the power semiconductor element flows oppositely and in the opposite direction. As a result, the magnetic fields produced by the currents cancel each other out, and this action can reduce the inductance. The AC wiring 320A and the control terminals 325U and 325L also extend in the same direction as the DC positive wiring 315A and the DC negative wiring 319A.

  The connection portion 370 where the module primary sealing body 302 and the auxiliary mold body 600 are connected by metal bonding is sealed in the module case 304 by the second sealing resin 351. Thereby, since a necessary insulation distance can be stably ensured between the connection part 370 and the module case 304, the power semiconductor module 300a can be reduced in size as compared with the case where sealing is not performed.

  As shown in FIG. 9, on the auxiliary module body 600 side of the connecting portion 370, the auxiliary module side DC positive connection terminal 315C, the auxiliary module side DC negative connection terminal 319C, the auxiliary module side AC connection terminal 320C, and the auxiliary module side signal The connection terminal 326U and the auxiliary module side signal connection terminal 326L are arranged in a line. On the other hand, on the module primary sealing body 302 side of the connection portion 370, along one surface of the first sealing resin 348 having a polyhedral shape, an element side DC positive connection terminal 315D and an element side DC negative connection terminal 319D are provided. , The element side AC connection terminal 320D, the element side signal connection terminal 327U, and the element side signal connection terminal 327L are arranged in a line. Thus, the structure in which the terminals are arranged in a line in the connection portion 370 facilitates the manufacture of the module primary sealing body 302 by transfer molding.

  Here, the positional relationship of each terminal when the part extending outward from the first sealing resin 348 of the module primary sealing body 302 is viewed as one terminal for each type will be described. In the following description, a terminal constituted by the DC positive electrode wiring 315A (including the DC positive electrode terminal 315B and the auxiliary module side DC positive electrode connection terminal 315C) and the element side DC positive electrode connection terminal 315D is referred to as a positive electrode side terminal. A terminal composed of the DC negative electrode terminal 319B (including the auxiliary module side DC negative electrode connection terminal 319C) and the element side DC negative electrode connection terminal 319D is referred to as a negative electrode side terminal, and the AC wiring 320A (AC terminal 320B and the auxiliary module side AC connection) The terminal constituted by the element side AC connection terminal 320D and the element side AC connection terminal 320D is referred to as an output terminal, and is constituted by the signal wiring 324U (including the control terminal 325U and the auxiliary module side signal connection terminal 326U) and the element side signal connection terminal 327U. Is called the upper arm signal terminal. Referred to as a line 324L (control terminal 325L and the auxiliary module-side signal connecting terminals including 326L) and the element-side signal connecting terminals 327L signal for the lower arm composed of the terminal by terminal.

  Each of the terminals protrudes from the first sealing resin 348 and the second sealing resin 351 through the connection portion 370, and each protruding portion from the first sealing resin 348 (element side DC positive electrode connection terminal 315D). , Element side DC negative electrode connection terminal 319D, element side AC connection terminal 320D, element side signal connection terminal 327U and element side signal connection terminal 327L) are one surface of the first sealing resin 348 having a polyhedral shape as described above. Are lined up in a row. Further, the positive terminal and the negative terminal protrude from the second sealing resin 351 in a stacked state and extend outside the module case 304. With such a configuration, the power semiconductor element is sealed with the first sealing resin 348 and the module primary sealing body 302 is manufactured. It is possible to prevent an excessive stress on the connecting portion and a gap in the mold from occurring. In addition, since currents in opposite directions flowing through the stacked positive electrode side terminals and negative electrode side terminals generate magnetic fluxes in directions that cancel each other, a reduction in inductance can be achieved.

  On the auxiliary module body 600 side, the auxiliary module side DC positive electrode connection terminal 315C and the auxiliary module side DC negative electrode connection terminal 319C are the DC positive electrode terminal 315B and the DC negative electrode terminal 319B opposite to the DC positive electrode wiring 315A and DC negative electrode wiring 319A. Each is formed at the tip. Further, the auxiliary module side AC connection terminal 320C is formed at the tip of the AC wiring 320A opposite to the AC terminal 320B. The auxiliary module side signal connection terminals 326U and 326L are formed at the distal ends of the signal wirings 324U and 324L on the side opposite to the control terminals 325U and 325L, respectively.

  On the other hand, on the module primary sealing body 302 side, the element side DC positive connection terminal 315D, the element side DC negative connection terminal 319D, and the element side AC connection terminal 320D are formed on the conductor plates 315, 319, and 320, respectively. The element side signal connection terminals 327U and 327L are connected to the IGBTs 328 and 330 by bonding wires 371, respectively.

  As shown in FIG. 10, the DC positive side conductor plate 315 and the AC output side conductor plate 320 and the element side signal connection terminals 327 </ b> U and 327 </ b> L are connected to a common tie bar 372 and are substantially the same. It is integrally processed so as to have a planar arrangement. To the conductor plate 315, the collector electrode of the IGBT 328 on the upper arm side and the cathode electrode of the diode 156 on the upper arm side are fixed. The conductor plate 320 is fixedly attached with a collector electrode of the IGBT 330 on the lower arm side and a cathode electrode of the diode 166 on the lower arm side. On the IGBTs 328 and 330 and the diodes 156 and 166, a conductor plate 318 and a conductor plate 319 are arranged in substantially the same plane. To the conductor plate 318, the emitter electrode of the IGBT 328 on the upper arm side and the anode electrode of the diode 156 on the upper arm side are fixed. On the conductor plate 319, an emitter electrode of the IGBT 330 on the lower arm side and an anode electrode of the diode 166 on the lower arm side are fixed. Each power semiconductor element is fixed to an element fixing portion 322 provided on each conductor plate via a metal bonding material 160. The metal bonding material 160 is, for example, a low-temperature sintered bonding material including a solder material, a silver sheet, and fine metal particles.

  Each power semiconductor element has a flat plate-like structure, and each electrode of the power semiconductor element is formed on the front and back surfaces. As shown in FIG. 10, each electrode of the power semiconductor element is sandwiched between a conductor plate 315 and a conductor plate 318, or a conductor plate 320 and a conductor plate 319. In other words, the conductor plate 315 and the conductor plate 318 are stacked so as to face each other substantially in parallel via the IGBT 328 and the diode 156. Similarly, the conductor plate 320 and the conductor plate 319 have a stacked arrangement facing each other substantially in parallel via the IGBT 330 and the diode 166. In addition, the conductor plate 320 and the conductor plate 318 are connected via an intermediate electrode 329. By this connection, the upper arm circuit and the lower arm circuit are electrically connected to form an upper and lower arm series circuit. As described above, the IGBT 328 and the diode 156 are sandwiched between the conductor plate 315 and the conductor plate 318, and the IGBT 330 and the diode 166 are sandwiched between the conductor plate 320 and the conductor plate 319, so that the conductor plate 320 and the conductor plate 318 are connected to the intermediate electrode. Connect via H.329. Thereafter, the control electrode 328A of the IGBT 328 and the element side signal connection terminal 327U are connected by the bonding wire 371, and the control electrode 330A of the IGBT 330 and the element side signal connection terminal 327L are connected by the bonding wire 371.

  FIG. 11 is a perspective view for explaining the structure of the capacitor module 500. Although not shown in FIG. 11, a plurality of film capacitors are provided inside the capacitor case 502, and the film capacitors are electrically connected to the negative electrode conductor plate and the positive electrode conductor plate. An insulating member is disposed between the negative electrode conductor plate and the positive electrode conductor plate to reduce inductance, and the negative electrode conductor plate and the positive electrode conductor plate are configured in a laminated state. That is, the negative electrode conductor plate and the positive electrode conductor plate constitute a laminated conductor plate.

  The resin sealing material 550 is filled in the capacitor case 502 in order to fix the film capacitor and the laminated conductor plate to the capacitor case 502. The negative power supply terminal 508 and the positive power supply terminal 509 are each electrically connected to the laminated conductor plate, protrude from the exposed surface of the resin sealing material 550, and bend toward the side surface of the capacitor case 502. DC power is supplied to the positive power supply terminal 509 and the negative power supply terminal 508 via the DC connector 138 as described with reference to FIG.

  The capacitor terminals 503a to 503c are electrically connected to the laminated conductor plates, respectively, and are provided corresponding to the positive terminal 157 (315B) and the negative terminal 158 (319B) of the semiconductor module 300. Capacitor terminals 503a to 503c are connected to power semiconductor modules 300a to 300c, respectively. An insulating sheet 517a is provided between the negative capacitor terminal 504a and the positive capacitor terminal 506a constituting the capacitor terminal 503a to ensure insulation. The same applies to the other capacitor terminals 503b to 503c.

  The capacitor case 502 is provided with fixing means for fixing the capacitor module 500 to the flow path forming body 12, for example, holes 520a to 520d for allowing a screw to pass therethrough.

  In addition, a protruding storage portion 502 a is formed on one side of the long side of the capacitor case 502. In the protruding housing portion 502a, electrical circuit elements that are electrically connected in series or in parallel to the film capacitor and the power supply terminals 508 and 509 are housed. In the present embodiment, a noise removing capacitor that removes noise from the battery 136 and is electrically connected to the ground is accommodated. Since this capacitor is smaller than the film capacitor, the height of the protruding housing portion 502 a is formed to be smaller than the height of the capacitor case 502. That is, a space is formed below the protruding storage portion 502a. The flow path forming body 12 shown in FIG. 3 forms a part of the refrigerant flow path 19 in this space. As a result, the noise removing capacitor can be cooled, and the increase in the pressure loss is prevented by suppressing locally increasing the cross-sectional area of the refrigerant flow path 19.

  12A is an external perspective view in which the power semiconductor modules 300a to 300c, the capacitor module 500, and the bus bar assembly 800 are assembled to the case 10. FIG. FIG.12 (b) is an enlarged view of the part A of Fig.12 (a).

  The DC positive terminal 315B (157), the DC negative terminal 319B (158), the AC terminal 321 (159), and the second sealing portion 601B extend in the longitudinal direction of the case 10 toward the lid 8 side. The area of the current path of the DC positive terminal 315B (157) and the DC negative terminal 319B (158) is much smaller than the area of the current path of the laminated conductor plate in the capacitor module 500. Therefore, when current flows from the laminated conductor plate to the DC positive terminal 315B (157) and the DC negative terminal 319B (158), the area of the current path changes greatly. That is, the current concentrates on the DC positive terminal 315B (157) and the DC negative terminal 319B (158).

  Therefore, in the present embodiment, the negative-side capacitor terminal 504a has a rising portion 540 that rises from the laminated conductor plate, and has a connection portion 542 at its tip. Further, the positive electrode side capacitor terminal 506a has a rising portion 543 that rises from the laminated conductor plate, and has a connection portion 545 at the tip thereof. A DC negative terminal 319B (158) and a DC positive terminal 315B (157) of the power semiconductor module 300a are connected between the connecting portion 542 and the connecting portion 545.

  As a result, the negative capacitor terminal 504a and the positive capacitor terminal 506a form a laminated structure through the insulating sheet until just before the connection portions 542 and 545, so that the inductance of the wiring portion of the capacitor terminal where current concentrates is reduced. Can do. Further, the tip of the DC negative terminal 319B (158) and the side of the connecting portion 542 are connected by welding, and similarly, the tip of the DC positive terminal 315B (157) and the side of the connecting portion 545 are connected by welding. . For this reason, productivity can be improved in addition to characteristic improvement by low inductance.

  The tip of AC terminal 321 (159) of power semiconductor module 300a is connected to the tip of AC bus bar 802a by welding. In a production facility for welding, making the welding machine movable in a plurality of directions with respect to an object to be welded leads to a complicated production facility, which is not preferable from the viewpoint of productivity and cost. Therefore, in the present embodiment, the welding location of the AC terminal 321 (159) and the welding location of the DC negative electrode terminal 319B (158) are arranged in a straight line along the longitudinal side of the case 10. Thereby, it is possible to perform a plurality of weldings while moving the welding machine in one direction, and productivity is improved.

  Further, as shown in FIGS. 4 and 12, the plurality of power semiconductor modules 300 a and 300 b are arranged in a straight line along the side in the longitudinal direction of the case 10. Thereby, when welding the several power semiconductor modules 300a-300b, productivity can be improved further.

  FIG. 15 is a perspective view of the power converter 200 with the metal base plate 11 separated. FIG. 16 is a cross-sectional view of the power conversion device 200 as seen from the direction of the arrow in the cross section B of FIG.

  The metal base plate 11 is disposed above the driver circuit board 22. In the present embodiment, the peripheral edge of the opening of the case 10 is closed by the metal base plate 11. The control circuit board 20 is accommodated in a space formed by the metal base plate 11 and the lid 8.

  Since the current sensor 180, the driver circuit board 22, and the control circuit board 20 are hierarchically arranged in the height direction, and the control circuit board 20 is arranged at a position farthest from the high-power power semiconductor modules 300a to 300c, switching is performed. Mixing of noise and the like can be suppressed. Furthermore, the metal base plate 11 is electrically connected to the flow path forming body 12 that is electrically connected to the ground. The metal base plate 11 reduces noise mixed from the driver circuit board 22 into the control circuit board 20.

  In FIG. 15, the driver circuit board 22 has a hole 24 penetrating the driver circuit board 22. The control terminals 325U and 325L of the power semiconductor modules 300a to 300c are inserted into the holes 24, and the control terminals 325U and 325L are joined to the wiring pattern of the driver circuit board 22 by soldering. Note that solder bonding is performed from the surface of the driver circuit board 22 opposite to the surface facing the flow path forming body 12.

  Thereby, since a signal line can be connected without using a wiring connector, productivity can be improved. In addition, the driver circuit board 22 of the present embodiment has a drive circuit (not shown) such as a driver IC chip mounted on the side facing the flow path forming body 12. Thus, the heat of solder bonding is suppressed from being transmitted to the driver IC chip or the like, and damage to the driver IC chip or the like due to solder bonding is prevented. In addition, since a high-profile component such as a transformer mounted on the driver circuit board 22 is disposed in the space between the capacitor module 500 and the driver circuit board 22, the entire power conversion device 200 can be reduced in height. Is possible.

  FIG. 17 is an enlarged view of the peripheral components of the AC terminals 822a to 822c. The AC bus bars 805a to 805c are supported by the first support member 820, and their tips are connected to the AC terminals 822a to 822c. The AC terminals 822a to 822c are cylindrical female connectors.

  The first support member 820 is fixed to the case 10 by a fixing portion 826. The first support member 820 has terminal cover portions 828a to 828c that protrude toward the outside of the case 10 and cover the tip portions of the AC terminals 822a to 822c. AC terminals 822a to 822c are connected to vehicle-side connector 193 shown in FIG. Since the connector 193 is removed when the power conversion device 200 is transported, assembled into a vehicle, tested, or replaced, there is a possibility that the AC terminal is exposed. At that time, it is necessary to prevent electric shock due to the operator touching the exposed AC terminals 822a to 822c, but by covering the tip of the AC terminals 822a to 822c with an insulator with the above configuration, the electric shock can be prevented. Can do.

  Further, the first support member 820 is that the AC side connector 188 shown in FIG. 19 has been detached from the first support member 820, that is, the AC side connector 188 and the AC terminals 822a to 822c are electrically disconnected. The connection detection circuit 830 for detecting this is held. The connection detection circuit 830 detects that it is in a connected state by fitting with a similar connection detection circuit provided on the AC connector 188 side. When the connection detection circuit 830 detects that the AC connector 188 and the AC terminals 822a to 822c are electrically disconnected, the detection information is transmitted to the control circuit board 20, and the control circuit board 20 controls to suppress or stop the driving of the power semiconductor modules 300a to 300c based on the detection information.

  Note that the connection detection circuit 830 forms a closed circuit of the control circuit board 20 and the AC terminal 822a, and the control circuit board 20 is disconnected when any part is disconnected and becomes electrically disconnected. Emits a signal to suppress or stop the driving of the power semiconductor module.

  With the above configuration, when the operator removes the vehicle-side connector 193 and the AC terminals 822a to 822c are exposed, such as during assembly of the power conversion device 200 to the vehicle, testing, or parts replacement, The operator's safety can be ensured by stopping the driving of the power conversion device 200. Further, in order to prevent the connection detection circuit 830 from accidentally dropping off due to vibration and stopping the driving of the power conversion device 200 at an unexpected timing, the connection detection circuit 830 is a first support firmly fixed to the case 10. Supported by member 820.

  Further, the first support member 820 has a protruding portion 832 that protrudes toward the outside of the case 10. The protruding portion 832 is formed so as to surround the AC terminals 822a to 822c, and is formed so that the outer edge of the protruding portion 832 fits with the inner edge of the opening 10b shown in FIG. Thereby, the position accuracy of AC terminal 822a-822c and the inner edge part of the opening part 10b can be improved. Moreover, the waterproof effect can also be improved. Further, since the contact area between the first support member 820 holding the AC terminals 822a to 822c and the case 10 can be greatly increased, the resonance frequency of the AC terminals 822a to 822c is transmitted from the engine or the like. It can be higher than the frequency. Therefore, vibration resistance around the AC terminals 822a to 822c can be improved.

  Further, the first support member 820 has a shielding portion 834 for closing the opening 10 b of the case 10. The shielding part 834 is formed so as to fill between the terminal cover parts 828 a to 828 c and the protruding part 832. When only the power conversion device 200 is transported, assembled to a vehicle, tested, or when parts are replaced, foreign matter such as screws and tools may be mixed into the case 10 from the outside. The foreign matter mixed into the case 10 may lead to a short circuit at the electrical connection location or damage to the components, leading to the destruction of the power conversion device 200. Thus, by blocking the inside and the outside of the case 10 by the shielding portion 834 as in the above configuration, it is possible to prevent foreign matters from entering from the outside.

  FIG. 18 is an enlarged view of the peripheral components of the DC terminal 900a on the negative electrode side and the DC terminal 900b on the positive electrode side.

  The DC bus bar 902a on the negative electrode side has one end connected to the power supply terminal 508 on the negative electrode side of the capacitor module 500 and one end connected to the DC terminal 900a. Similarly, one end of the DC bus bar 902b on the positive electrode side is connected to the power supply terminal 509 on the positive electrode side of the capacitor module 500, and one end is connected to the DC terminal 900b. The DC terminals 900a and 900b are cylindrical female connectors.

  The second support member 904 is fixed to the case 10 by a fixing portion 906. The second support member 904 includes terminal cover portions 908a and 908b that protrude toward the outside of the case 10 and that cover the tip portions of the DC terminals 900a and 900b. DC terminals 900a and 900b are connected to a vehicle-side connector 193 shown in FIG. Since the connector 193 is removed when the power conversion device 200 is transported, assembled to a vehicle, tested, or replaced, there is a possibility that the DC terminal is exposed. At that time, it is necessary to prevent an electric shock due to the operator touching the exposed DC terminals 900a and 900b, but the electric terminals can be prevented by covering the front ends of the DC terminals 900a and 900b with an insulator with the above-described configuration. Can do.

  Further, the second support member 904 is disconnected from the DC support 138 shown in FIG. 19 from the second support member 904, that is, the DC connector 138 and the DC terminals 900a and 900b are electrically disconnected. The connection detection circuit 910 for detecting this is held. The connection detection circuit 910 detects a connection state by fitting with a similar connection detection circuit provided on the DC connector 138 side. When the connection detection circuit 910 detects that the DC connector 138 and the DC terminals 900a and 900b are electrically disconnected, the detection information is transmitted to the control circuit board 20, and the control circuit board is transmitted. 20 controls to suppress or stop the drive of the power converter 200 based on the detection information.

  Note that the connection detection circuit 830 forms a closed circuit with the control circuit board 20, the DC terminal, and the control circuit board 20 is a power semiconductor when any part is cut and becomes electrically disconnected. Signals to suppress or stop the drive of the module.

  In the present embodiment, the connection detection circuit 830 is also provided on the AC terminals 822a to 822c side, and the control circuit board 20, the DC terminal, the AC terminal, and the closed circuit are configured, and any part is disconnected. The control circuit board 20 is configured to emit a signal for suppressing or stopping the driving of the power semiconductor module when it is electrically disconnected. As shown in FIG. 19, when the connector 193 is formed integrally with the DC side connector 138 and the AC side connector 188, only one of the connection detection circuit 830 and the connection detection circuit 910 can be provided. For example, control that suppresses or stops the driving of the power conversion device 200 can be executed.

  With the above configuration, when the operator removes the vehicle-side connector 193 and the DC terminals 900a and 900b are exposed, such as during assembly of the power conversion device 200 to the vehicle, testing, or parts replacement, The operator's safety can be ensured by stopping the driving of the power conversion device 200. In addition, in order to prevent the connection detection circuit 910 from being accidentally dropped due to vibration and stopping the driving of the power converter 200 at an unexpected timing, the connection detection circuit 910 is a second support firmly fixed to the case 10. Supported by member 904.

  Further, the second support member 904 has a protruding portion 912 that protrudes toward the outside of the case 10. The protruding portion 912 is formed so as to surround the DC terminals 900a and 900b, and is formed so that the outer edge of the protruding portion 832 fits with the inner edge of the opening 10c shown in FIG. As a result, the positional accuracy between the DC terminals 900a and 900b and the inner edge of the opening 10c can be improved. Moreover, the waterproof effect can also be improved. Furthermore, since the contact area between the second support member 904 that holds the DC terminals 900a and 900b and the case 10 can be greatly increased, the resonance frequency of the DC terminals 900a and 900b can be reduced by vibrations transmitted from the engine or the like. It can be higher than the frequency. Therefore, the vibration resistance around the DC terminals 900a and 900b can be improved.

  Further, the second support member 904 has a shielding portion 914 for closing the opening 10 c of the case 10. The shielding part 914 is formed so as to fill between the terminal cover parts 908 a and 908 b and the protruding part 912. When only the power conversion device 200 is transported, assembled to a vehicle, tested, or when parts are replaced, foreign matter such as screws and tools may be mixed into the case 10 from the outside. The foreign matter mixed into the case 10 may lead to a short circuit at the electrical connection location or damage to the components, leading to the destruction of the power conversion device 200. Thus, by blocking the inside and the outside of the case 10 by the shielding portion 914 as in the above configuration, it is possible to prevent foreign matters from entering from the outside.

  FIG. 19 is an exploded perspective view of the case 10 in which the AC terminals 822a to 822c and the DC terminals 900a and 900b are assembled, and the connector 193 on the vehicle side.

  The case 10 has a first wall 10d that protrudes from the edge of the opening 10b toward the outside of the case 10. The first wall 10d may be formed integrally with the case 10. The AC connector 188 passes through the space surrounded by the first wall 10d and is connected to AC terminals 822a to 822c supported by the first support member 820. As a result, the AC terminals 822a to 822c are covered with the first wall 10d, and the AC terminals 822a to 822c can be protected from external impact. Moreover, while the protrusion part 832 of the 1st support member 820 and the 1st wall 10d contact in a wide area, while being able to raise the positional accuracy of AC terminal 822a-822c, the resonant frequency of AC terminal 822a-822c is made. The frequency of vibration transmitted from an engine or the like can be made higher. Furthermore, since the AC side connector 188 is also configured to come into contact with the inner periphery of the first wall 10d, the position accuracy of the AC side connector 188 can be increased, and the resonance frequency of the AC wiring of the AC side connector 188 can be set to an engine or the like. The frequency of the vibration transmitted from can be made higher.

  Similarly, the case 10 includes a second wall 10e that protrudes from the edge of the opening 10c toward the outside of the case 10. The second wall 10e may be formed integrally with the case 10. The DC side connector 138 is connected to the DC terminals 900a and 900b supported by the second support member 904 through the space surrounded by the second wall 10e. Accordingly, the DC terminals 900a and 900b are covered with the second wall 10e, and the DC terminals 900a and 900b can be protected from an external impact. Further, since the protruding portion 912 of the second support member 904 and the second wall 10e are in contact with each other over a wide area, the positional accuracy of the DC terminals 900a and 900b can be increased, and the resonance frequency of the DC terminals 900a and 900b can be increased. The frequency of vibration transmitted from an engine or the like can be made higher. Further, since the DC side connector 138 is also configured to come into contact with the inner periphery of the second wall 10e, the positional accuracy of the DC side connector 138 can be increased, and the resonance frequency of the DC wiring of the DC side connector 138 can be set to an engine or the like. The frequency of the vibration transmitted from can be made higher.

  The metal plate 836 is a member for fixing the first support member 820 to the case 10 by sandwiching the first support member 820 shown in FIG. The metal plate 836 is formed to cover at least a part of the surface of the AC bus bars 822a to 822c on the side where the control circuit board 20 shown in FIG. 4 is arranged. Since the control circuit board 20 and the wiring for transmitting the control system signal are weak currents, they are easily affected by noise from the AC terminals 822a to 822c and the AC bus bars 805a to 805c. Therefore, noise can be blocked by surrounding the AC terminals 822a to 822c and the AC bus bars 805a to 805c with a metal plate 836 which is a conductive member.

  In the present embodiment, the connector 193 is configured such that the DC side connector 138 and the AC side connector 188 are integrated. Thereby, while being able to reduce a number of parts, a connection operation can be simplified and productivity improves. However, on the other hand, since the DC side connector 138 and the AC side connector 188 are attached together, the connector 193 becomes large and easily distorted, and there is a possibility that the insertion stress of the connector 193 is biased. As a result, the connector 193 and the parts of the power conversion device 200 may be damaged, or the seal member between the connector 193 and the case 10 may be biased to cause deterioration in waterproofness. Further, if the connector 193 and the power conversion device 200 are mounted on a vehicle while the insertion stress of the connector 193 is biased, the required vibration resistance performance may not be exhibited.

  Therefore, the AC terminals 822a to 822c and the DC terminals 900a and 900b of the present embodiment are arranged so that the distortion of the connector 193 in which the DC side connector 138 and the AC side connector 188 are integrally formed is reduced. Specifically, as shown in FIG. 20, the AC terminals 822a to 822c and the DC terminals 900a and 900b are arranged on one side surface of the case 10, and one side surface of the case 10 has a short side and a long side. It has a rectangular shape composed of The DC terminals 900a and 900b are arranged side by side along one side in the lateral direction of one side of the case 10, and the AC terminals 822a to 822c are arranged on one side in the longitudinal direction of one side of the case 10. Are arranged side by side.

  Thereby, a substantially T-shape or a substantially L-shape inclined by 90 degrees is formed by a line segment passing through the DC terminals 900a and 900b and a line segment passing through the AC terminals 822a and 822c. Accordingly, the connector 193 is positioned in the height direction (short side direction of one side surface of the case 10) and the width direction (longitudinal direction of one side surface of the case 10) at the same time so that the insertion stress of the connector 193 is not biased. The connector 193 can be fixed to each terminal and the case 10. Further, since the height direction and the width direction of the connector 193 are suppressed from becoming extremely long, the distortion of the connector 193 can be reduced, and the bias of the insertion stress of the connector 193 is reduced. Moreover, since the height direction or the width direction of the connector 193 is suppressed from becoming extremely long, the distance between each of the connector fixing portions 10f to 10m can be shortened. Thereby, the resonant frequency of the connector 193 and the case 10 can be made higher than the frequency of the vibration transmitted from the engine or the like, and the vibration resistance of the vehicle can be improved.

  In the present embodiment, the AC terminal 822b is arranged closer to the other side in the longitudinal direction of one side surface of the case 10 than the AC terminals 822a and 822c. In accordance with such an arrangement, the first support member 820 and the first wall 10d have an inverted triangular shape with gentle corners. Thereby, since the height direction or the width direction of the AC side connector 188 and the connector 193 is suppressed from becoming extremely long, there is an effect that the connection reliability and vibration resistance as described above are improved.

  FIG. 21 is a top view of the capacitor module 500 with the resin sealing material 550 removed.

  Capacitor case 502 houses capacitor elements 560a to 560d, a negative bus bar 548, a positive bus bar (not shown), and noise removing capacitor elements 562a to 562b.

  Capacitor elements 560a to 560d are cylindrical film capacitors, which smooth a direct current and output the smoothed direct current to power semiconductor modules 300a to 300c. Capacitor elements 560 a to 560 d are arranged so that one electrode faces the bottom surface of capacitor case 502 and the other electrode faces the opening side of capacitor case 502. Capacitor elements 560 a to 560 d are arranged side by side along the long side of capacitor case 502.

  The negative electrode side bus bar 548 is connected to the other electrodes of the capacitor elements 560a to 560d. A positive-side bus bar (not shown) is disposed between the bottom surface of the capacitor case 502 and the capacitor elements 560a to 560d, and is connected to one electrode of the capacitor elements 560a to 560d.

  The noise removing capacitor elements 562a to 562b are cylindrical film capacitors and are capacitor elements having a smaller capacitance and a smaller size than the capacitor elements 560a to 560d. One electrode of the noise removing capacitor element 562a is connected to a positive bus bar (not shown). The other electrode of the noise removing capacitor element 562a is electrically connected to the ground of the vehicle body via the metal case 10. One electrode of the noise removing capacitor element 562b is connected to the negative bus bar 548. The other electrode of the noise removing capacitor element 562b is electrically connected to the ground of the vehicle body via the metal case 10. The noise removing capacitor elements 562a to 562b are capacitor elements for removing electromagnetic noise generated by driving the motor MG1 in FIG. 2 and the like and propagating through the DC terminals 900a to 900b.

  The noise removing capacitor elements 562a to 562b are arranged in a protruding storage portion 502a protruding from one side wall of the capacitor case 502. On the other hand, the power supply terminals 508a to 508b and 509a to 509b protrude from the protruding storage portion 502a. Capacitor elements 560a to 560d are electrically connected to power supply terminals 508a to 508b and power supply terminals 509a to 509b via noise removing capacitor elements 562a and 562b.

  FIG. 22 is a top view of the power conversion device 200 from which electrical components arranged above the capacitor module 500 shown in FIG. 4 are removed. FIG. 23 is a cross-sectional view as seen from the direction of the arrow of dashed-dotted line AA in FIG.

  The power semiconductor module 300a and the power semiconductor module 300b are arranged side by side along the flow direction of the cooling refrigerant flowing through the first flow path portion 19a indicated by the dotted line, and are fixed to the flow path forming body 12. The power semiconductor module 300c is disposed on the side close to the outlet pipe, which is the third flow path portion 19c indicated by the dotted line, and is fixed to the flow path forming body 12. The power semiconductor module 300c is disposed at a position facing the power semiconductor module 300a via the capacitor module 500.

  The noise removing capacitor elements 562a to 562b shown in FIG. 21 are arranged at positions facing the power semiconductor module 300b via the capacitor module 500. As shown in FIG. 23, the noise removing capacitor elements 562a to 562b are disposed above the third flow path portion 19c and are thermally connected to the third flow path portion 19c.

  Power supply terminals 508a to 508b and 509a to 509b provided on the capacitor module 500 are connected to the DC bus bars 902a and 902b. The DC bus bars 902a and 902b are connected to the DC terminals 900a and 900b as illustrated in FIG.

  With such an arrangement relationship, the noise removing capacitor elements 562a to 562b are less likely to receive heat from the power semiconductor modules 300a to 300c, so that the electrical components in the power conversion device 200 are more integrated, and the power conversion device can be reduced in size. Can be That is, the noise removing capacitor elements 562a to 562b are thermally connected to the power semiconductor modules 300a and 300b through the capacitor module 500, the first flow path portion 19a, and the third flow path portion 19c. Furthermore, the noise removing capacitor elements 562a to 562b are thermally connected to the power semiconductor module 300c through the third flow path portion 19c. Therefore, the noise removing capacitor elements 562a to 562b can be thermally separated from two of the three power semiconductor modules 300a to 300c, and the power semiconductor module 300c located in a thermally close position also flows the refrigerant. Since the three flow path portions 19c are interposed, it is difficult for the power semiconductor modules 300a to 300c to receive heat.

  The refrigerant flowing through the refrigerant flow path 19 flows in the order of the vicinity of the power semiconductor module 300c, the lower side of the noise removing capacitor elements 562a to 562b, the vicinity of the power semiconductor module 300b, and the vicinity of the power semiconductor module 300a. Therefore, the noise removing capacitor elements 562a to 562b are cooled by the refrigerant that stores only the heat received from the power semiconductor module 300c, and thus are less susceptible to the heat from the power semiconductor modules 300a and 300b.

  Furthermore, since the noise removing capacitor element is sensitive to heat, it is necessary to prevent the influence of external heat in addition to cooling of self-heating. That is, it is necessary to prevent the influence of heat transmitted from the outside of the power converter 200 via the DC bus bars 902a and 902b. Therefore, in the present embodiment, since the third flow path portion 19c is formed immediately below the noise removing capacitor elements 562a to 562b, the noise removing capacitor elements 562a to 562b and the third flow path portion 19c are thermally intimate. Connected. Therefore, the self-heating of the noise removing capacitor elements 562a to 562b and the heat from the outside can be sufficiently transmitted to the refrigerant.

  In the present embodiment, the electric circuit component disposed in the vicinity of the third flow path portion 19c is the noise removing capacitor element, but the resistor 450 may be disposed. That is, since the electric circuit component that needs to prevent the influence of the heat transmitted from the outside of the power converter 200 via the DC bus bars 902a and 902b is disposed in the vicinity of the third flow path portion 19c, the capacitor element 560d and Any electric circuit element that is electrically connected in series or in parallel to the DC terminals 902a and 902b may be used.

  The DC bus bars 902a and 902b are formed in such a manner that their main surfaces are shifted in the vicinity of the power supply terminals 508a to 508b and 509a to 509b provided in the capacitor module 500. On the other hand, the DC bus bar 902a is formed so as to be disposed above the DC bus bar 902b, and in the vicinity of the DC terminals 900a and 900b, the main surfaces of the DC bus bars 902a and 902b are formed so as to overlap each other. Thereby, the wiring inductance of the DC bus bars 902a and 902b is reduced.

  Further, the DC terminals 900a and 900b shown in FIG. 18 are arranged at positions closer to the noise removing capacitor elements 562a and 562b than the first power semiconductor modules 300a to 300c. Thereby, the wiring distance of DC bus-bar 902a and 902b arrange | positioned in case 10 can be shortened. Therefore, electromagnetic noise radiated from the DC bus bars 902a and 902b can be reduced. In addition, electromagnetic noise transmitted through the DC bus bars 902a and 902b is removed by the noise removing capacitor elements 562a and 562b before being transmitted to the negative electrode side bus bar 548, the positive electrode side bus bar, the capacitor element 560a, and the like in the capacitor module 500. be able to.

  In addition, as shown in FIG. 21, the reflux currents 580 a to 580 c that flow when the IGBTs in the first power semiconductor modules 300 a to 300 c are switched and flow between the upper and lower arms flow to the negative bus bar 548 and the positive bus bar. In this embodiment, the wiring distance between the noise removing capacitor elements 562a and 562b and the IGBTs and diodes in the first power semiconductor modules 300a to 300c is the wiring between the noise removing capacitor elements 562a and 562b and the DC terminals 900a and 900b. It is smaller than the distance. Accordingly, it is possible to prevent the noise removing capacitor elements 562a and 562b from sufficiently performing the noise removing function due to the return currents 580a to 580c flowing through the noise removing capacitor elements 562a and 562b.

  The noise removing capacitor elements 562a and 562b may be disposed outside the capacitor case 502 and fixed to the flow path forming body 12. In the present embodiment, the capacitor elements 560a to 560d and the noise removing capacitor elements 562a and 562b are film capacitors, and members having similar thermal conductivity are used. Therefore, the capacitor elements 560a to 560d and the noise removing capacitor element 562a are used. And 562b are sealed with a resin sealing material 550 in one capacitor case 502. This suppresses an increase in the number of connection points for electrical connection of the noise removing capacitor elements 562a and 562b and facilitates temperature management in the power conversion device 200.

  The resistor 450 functions as a discharge resistor for converting the electric charge remaining in the capacitor elements 560a to 560d into thermal energy, thereby preventing an electric shock during repair work. For this reason, it is necessary that the resistor 450 is thermally insulated from other electric parts. Therefore, the resistor 450 is disposed on the side opposite to the capacitor module 500 via the third flow path portion 19c. The resistor 450 is provided with a positive terminal 451 and a negative terminal 452 on one side. The positive terminal 451 is connected to the driver circuit board 22 via a harness (not shown). On the driver circuit board 22, a switching element electrically connected in series with the resistor 450 is mounted. On the other hand, the negative terminal 452 is connected to the power terminal 509a on the negative side. The switching operation of the switching element mounted on the driver circuit board 22 is controlled by a microcomputer or the like mounted on the driver circuit board 22 or the control circuit board 20.

  Further, an opening 703 for penetrating a terminal 702 extending from the DCDC converter 700 shown in FIG. In FIG. 22, the opening 703 is closed by a cover 704. The cover 704 is used when the power conversion device 200 is not used in combination with the DCDC converter 700. When the power converter 200 and the DCDC converter 700 are used in combination as shown in FIG. 4, the cover 704 is removed. Thereby, the power converter device 200 of this embodiment is comprised so that the DCDC converter 700 can be combined or removed according to the embodiment of a vehicle.

  Further, high-frequency noise current flows through the AC bus bars 805a to 805c along with the switching operation of the IGBT in the power semiconductor module. This noise current is generated concentrically with a high-frequency magnetic field as an axis about the direction of current flow. The high frequency magnetic field is linked to the control circuit board 20 to generate noise. Therefore, in the present embodiment, the direction of formation of the DC bus bars 902a and 900b from the DC terminals 900a and 900b to the inside of the case 10 is the same as that of the AC bus bars 805a to 805c from the AC terminals 822a to 822c shown in FIG. It is formed along the forming direction. Thereby, since the direction of the current flowing through the AC bus bars 805a to 805c and the direction of the current flowing through the DC bus bars 902a and 900b are opposite to each other, the magnetic field generated by the current flowing through the AC bus bars 805a to 805c and The magnetic field generated by the flowing current cancels out in the case 10, and the magnetic field generated by the current flowing in the AC bus bars 805a to 805c and the DC bus bars 902a and 900b can be suppressed.

  24 is a cross-sectional view seen from the direction of the arrow of the alternate long and short dash line BB in FIG.

  A terminal 702 of the DCDC converter 700 passes through the opening 703 and is connected to a power supply terminal 509 b provided in the capacitor module 500. In the present embodiment, the DCDC converter 700 functions as a step-down circuit for charging a power source for driving a 12V electrical component in the vehicle. However, when an abnormality occurs in the power conversion device 200 or the like and it becomes difficult to supply power to the drive motor, power may be urgently supplied from the DCDC converter 700.

  The power supply terminals 508 a and 509 a provided on the capacitor module 500 are arranged so as to face the window 17 provided on the case 10. Thereby, the connection workability of the power supply terminals 508a and 509a is improved. Further, power supply terminals 508 b and 509 b that are connected to the DCDC converter 700 are also arranged so as to face the window 17. Thereby, the connection workability of the power supply terminals 508b and 509b is also improved.

  Another embodiment according to the present invention will be described with reference to FIGS. Configurations denoted by the same reference numerals as those in the first embodiment have similar functions. FIG. 14A is a top view of a power semiconductor module 300a according to another embodiment. FIG. 14B is a side view of a power semiconductor module 300a according to another embodiment.

  The flexible printed board 50 functions as a wiring board connected to the control terminals 325U and 325L and the signal terminal 184 of the current sensor 180a. The connector 51 is connected to the side of the flexible printed board 50 opposite to the side to which the control terminal 325U and the like are connected. Reference numeral 60 denotes an electronic component constituting the driver circuit.

  The flexible printed circuit board 50 and each signal terminal are connected by soldering, and are arranged in parallel to these wirings at positions slightly away from the DC positive electrode wiring 315A, the DC negative electrode wiring 319A, and the AC wiring 320A. ing.

  FIG. 25 is a side view showing a connection state between the connector 51 and the connector 55 provided on the driver circuit board 22.

  In the first embodiment, it is possible to take heat countermeasures for the current sensor 180a. However, when the number of signal terminals 184 of the current sensor is increased in the power semiconductor module 300a and the control terminals 325U and 325L are combined, 11 lines per phase, The number of signal terminals to be inserted into the driver circuit board is increased by 33 for three phases.

  For this reason, when the signal terminals are connected to the through holes of the driver circuit board 22, the insertability deteriorates, and it is necessary to separately prepare guide pins and the like on the driver circuit board 22 in order to solve this problem. Furthermore, there has been a problem that the time required for soldering after inserting the signal terminal into the printed circuit board is increased.

  Therefore, in the present embodiment, the control terminals 325U and 325L and the signal terminal 184 of the current sensor are configured by the flexible printed circuit board 50, and the connector 55 is used as a connection portion between the driver circuit board 22 and the double-sided cooling power semiconductor module. The connection between the 300 signal terminals and the driver circuit board 22 can be simplified, and the number of steps in the final assembly process of the inverter can be reduced.

  Here, since the wiring member used in the present embodiment is flexible and can be easily bent, it is not necessary to consider positional accuracy in connection with the driver circuit board 22, and the connection work can be facilitated. This is because it can.

  In addition, the flexible circuit board is bent from the signal terminal of the power semiconductor module 300a, and is arranged in parallel with the DC positive electrode wiring 315A, the DC negative electrode wiring 319A, and the AC wiring 320A, and the driver circuit board 22 Since it can be connected, the influence of noise generated at the main terminal can be suppressed. Furthermore, the influence of heat generated in the AC wiring 320A can be avoided as much as possible.

  In this embodiment, polyimide and copper foil are used as the wiring material of the flexible printed circuit board 50. However, a rigid type printed circuit board such as a normal glass epoxy may be used, and connection is made using a normal wiring material. May be.

  The control terminals 325U and 325L, the signal terminal 184, and the flexible printed circuit board 50 are connected by soldering, but may also be connected by a connector or the like.

  Another embodiment according to the present invention will be described with reference to FIGS. Configurations denoted by the same reference numerals as those in the first embodiment have similar functions. FIG. 26A is a top view of a power semiconductor module 300a according to another embodiment. FIG. 26B is a side view of a power semiconductor module 300a according to another embodiment. FIG. 27 is a side view showing a connection state between the connector 51 and the driver circuit board 22.

  Reference numeral 186 denotes a hall sensor IC. An IC is also incorporated in a part of the electronic component 60, and the double-sided cooling power semiconductor 300 is driven in accordance with an input signal from the control circuit board 20, and various types such as overcurrent protection, overtemperature protection, and power supply low voltage protection It has a protection function and a function of protecting the power semiconductor element.

  By extending the flexible printed circuit board 50 to the gap portion of the core of the current sensor 180a and mounting the Hall sensor IC 186 thereon, directly without using the signal terminal 182 of the current sensor used in the first and second embodiments, The signal from the current sensor 180 a can be sent to the control circuit board 20 via the connector 51.

  In Example 1, the AC wiring 320A was slightly lengthened by fixing the current sensor 180a to the flange portion 304B of the power semiconductor module 300a. As a result, the space between the flange portion 304B and the driver circuit board 22 is increased, and the dead space is widened. Therefore, all or part of the components on the driver circuit board 22 are transferred onto the flexible printed circuit board 50. Since the dead space can be effectively used and the driver circuit board 22 can be eliminated, the power converter can be downsized.

  Furthermore, since the components constituting the driver circuit are mounted on the flexible printed circuit board 50, it is only necessary to connect the connector 51 to the control circuit board 20, so that the final assembly man-hour of the inverter is greatly reduced. Cost reduction can be achieved.

  As described above, the current sensor 180a is directly fixed to the flange portion 304B or the module case 304 of the power semiconductor module 300a, and the current sensor 180a is also cooled from both directions, so that the inverter device is not enlarged and the current is not increased. It is possible to take measures against heat of the sensor.

  Further, the control terminals 325U and 325L of the power semiconductor module 300a and the signal terminals 184 of the current sensor are connected to the upper control circuit board 20, the driver circuit board 22 or the like by the flexible printed circuit board 50, thereby connecting the current sensor 180a. It is possible to prevent the complexity of the inverter assembly man-hours and the increase in man-hours caused by heat countermeasures.

  Furthermore, by mounting the electronic component 60 of the driver circuit and the Hall sensor IC 186 on the flexible printed board 50, the driver circuit board 22 can be eliminated, and the inverter device can be downsized.

8, 18 Lid 10 Case 10a Projection storage 10b, 10c, 400a to 400c, 404, 701, 703 Opening 10d First wall 10e Second wall 10f to 10m Connector fixing part 11 Metal base plate 12 Flow path forming body 13 Inlet Piping 14 Outlet piping 17 Window 19 Refrigerant flow path 19a First flow path portion 19b Second flow path portion 19c Third flow path portion 20 Control circuit boards 21, 51, 193 Connector 22 Driver circuit board 50 Flexible printed circuit board 60 Electronic component 136 Battery 138 DC side connector 140 Inverter circuit 150 Upper and lower arm series circuits 153 and 163 Collector electrode 154 Gate electrode terminal 155 Signal emitter electrode 156 and 166 Diode 157 Positive electrode terminal 158 Negative electrode terminal 159 AC terminal 160 Metal bonding material 164 Gate electrode 165 Emitter Electrode 1 9,329 intermediate electrode 172 control circuit 174 driver circuit 180a a current sensor 181a first fixing portion 181b second fixed portion 184 the signal terminal 186 Hall sensor IC
188 AC side connector 200 Power converter 302 Module primary sealing body 304 Module case 304A Curved portion 304B Flange portion 305 Fin 306 Insertion port 307A First heat radiating surface 307B Second heat radiating surface 309 Screws 315, 318, 319, 320 Conductor plate 315A DC positive wiring 315B DC positive terminal 315C Auxiliary module side DC positive connection terminal 315D Element side DC positive connection terminal 319A DC negative wiring 319B DC negative terminal 319C Auxiliary module side DC negative connection terminal 319D Element side DC negative connection terminal 320A AC wiring 320B AC terminal 320C Auxiliary module side AC connection terminal 320D Element side AC connection terminal 322 Element fixing part 324U, 324L Signal wiring 325U, 325L Control terminal 326U, 326L Auxiliary module side signal connection Terminals 327U, 327L Element side signal connection terminals 328, 330 IGBT
333 Insulating sheet 348 First sealing resin 351 Second sealing resin 370, 542 Connection portion 371 Bonding wire 372 Tie bar 406, 407 Protrusion portion 409 Seal member 417, 418, 421, 422, 423 Flow direction 420 Lower cover 450 Resistor 451 Positive side terminal 452 Negative side terminal 500 Capacitor module 502 Capacitor case 504, 506 Capacitor terminal 508a, 508b, 509a, 509b Power supply terminal 540 Rising part 548 Negative side bus bar 550 Resin sealing materials 560a to 560d Capacitor elements 562a and 562b Noise removal Capacitor elements 580a, 580b, 580c Return current 600 Auxiliary mold body 608 Wiring insulation part 700 DCDC converter 702 Terminal 704 Cover 800 Bus bar assembly

Claims (5)

A power semiconductor module having a power semiconductor element for converting a direct current into an alternating current;
A flow path forming body that forms a flow path for flowing a cooling refrigerant;
A current sensor for detecting the alternating current,
The power semiconductor module includes a metal first heat dissipation base facing one surface of the power semiconductor element, a metal second heat dissipation base facing the other surface of the power semiconductor element, and the first heat dissipation. An AC terminal that projects from the space sandwiched between the base and the second heat dissipation base and transmits the AC current;
The flow path forming body includes a first flow path disposed on a side portion of the first heat dissipation base, a second flow path disposed to face the first flow path via the power semiconductor module, Have
The current sensor is disposed at a position penetrating the AC terminal,
Furthermore, the current sensor includes a first fixing portion that is fixed to the first heat dissipation base, and a second fixing portion that is fixed to the second heat dissipation base. The power conversion device according to claim 1,
The first heat radiating base and the second heat radiating base are formed with a flange portion surrounding the AC terminal,
The power conversion device in which the first fixing portion and the second fixing portion of the current sensor are fixed to the flange portion. The power conversion device according to claim 1 or 2,
A driver circuit board on which a driver circuit for driving the power semiconductor element is mounted;
A wiring board connected to the driver circuit board,
The power semiconductor module has a control terminal connected to the power semiconductor element,
The control terminal is disposed on the side where the AC terminal protrudes in the first heat dissipation base and the second heat dissipation base,
The wiring board is a power conversion device connected to a current sensor terminal protruding from the current sensor and the control terminal. The power conversion device according to claim 3,
The power conversion device, wherein the wiring board is a flexible printed board. The power conversion device according to claim 1 or 2,
A control circuit board equipped with a control circuit for controlling the switching operation of the power semiconductor element;
A wiring board connected to the control circuit board and arranged in parallel with the protruding direction of the AC terminal;
The power semiconductor module has a control terminal connected to the power semiconductor element,
The control terminal is disposed on the side where the AC terminal protrudes in the first heat dissipation base and the second heat dissipation base,
The wiring board is connected to a current sensor terminal protruding from the current sensor and the control terminal, and is mounted with a driver circuit for driving the power semiconductor element.