JP2012119353A - Substrate transfer device and coating applicator using the same - Google Patents
Substrate transfer device and coating applicator using the same Download PDFInfo
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Abstract
Description
本発明は、平板状の基板を処理工程の中で移送する基板移送装置とそれを用いた塗布装置に関する。 The present invention relates to a substrate transfer device for transferring a flat substrate in a processing step and a coating apparatus using the same.
近年、液晶表示装置等のフラットパネルディスプレイに用いるTFT等の駆動基板やカラーフィルタ(以下CFと略称)等の平板状の基板の製造プロセスにおいて、フォトリソグラフィー法による工程を実施する場合に、処理基板の大型化と大型基板に対する効率的な均一塗布に適したスピンレス塗布方式を用いることが多くなっている。 In recent years, in the process of manufacturing a flat substrate such as a driving substrate such as a TFT or a color filter (hereinafter abbreviated as CF) used for a flat panel display such as a liquid crystal display device, a processing substrate is used when performing a process by a photolithography method. In many cases, a spinless coating method suitable for efficient uniform coating on large substrates and large substrates is used.
スピンレス塗布方式は、基板に対してレジスト液を長尺のスリット状のノズルから均一に連続して吐出させながら、ノズルの長尺方向と略垂直な方向に基板またはノズルを移動させることにより、基板上の所定の領域に均一な厚さのレジスト塗布層を形成することができる塗布法である。上記の移動させる対象として、基板とノズルのいずれも可能であるが、基板がガラス等の平板状の場合には、基板を平面ステージ上に載置し、ノズルをステージ上方で平行移動させることが主であった。しかし、基板の大型化に伴って、長尺状のノズルの寸法や重量が増すため、そのような重厚長大のレジストノズルをステージ上方で高さ位置を一定に保ったまま一定の速度で安定に基板表面に平行移動させることが難しくなってきている。 In the spinless coating method, the substrate or nozzle is moved in a direction substantially perpendicular to the longitudinal direction of the nozzle while the resist solution is uniformly and continuously discharged from the long slit-like nozzle to the substrate, thereby causing the substrate to move. In this coating method, a resist coating layer having a uniform thickness can be formed in a predetermined region above. As the object to be moved, either a substrate or a nozzle can be used, but when the substrate is a flat plate such as glass, the substrate can be placed on a flat stage and the nozzle can be moved in parallel above the stage. It was the Lord. However, as the size of the substrate increases, the size and weight of the long nozzle increase, so that such a heavy and long resist nozzle can be stably maintained at a constant speed while maintaining the height position above the stage. It has become difficult to translate the substrate surface.
前述のように大型のノズルの平行移動が困難となる一方、大型基板を載置した大型ステージ全体を移動する場合の機構上の困難も大きいため、特許文献1に示すように、平板状の基板をステージ上面に多数設けた噴出口から噴出させた気流により浮上させるとともに、基板の移動方向に沿う周縁部を吸着パッドにより把持して水平方向の駆動ユニットにより移送する方式が提案されている。 As described above, the parallel movement of the large nozzle is difficult, but the mechanical difficulty in moving the entire large stage on which the large substrate is placed is also large. Therefore, as shown in Patent Document 1, a flat substrate is used. Has been proposed which floats by an air stream ejected from a number of jets provided on the upper surface of the stage, and grips the peripheral edge along the moving direction of the substrate with a suction pad and transports it by a horizontal drive unit.
図2は、上述のような従来の基板浮上方式の基板移送装置およびそれを用いた塗布装置の例を説明するための模式図であって、(a)は平面図、(b)は、(a)のA−A’線に沿った断面図である。
ステージ1上面に多数設けた噴出口2から噴出させた噴出エアー21((b)のブロック矢印で表示)により基板3を一定の高さに浮上させることができる。浮上した基板3は、ステージ1との摩擦力が作用しないため、水平方向に僅かな力を加えれば容易に動かせる状態となっている。ステージ1の基板進行方向と平行な辺の少なくとも片側近傍には、ステージ1に沿って移動可能な駆動ユニット4を設け、駆動ユニット4の上方に接続した吸着パッド5が基板3の下面の基板周縁部を吸着することにより、駆動ユニット4を動かせば、基板を把持して太い実線矢印で示す方向に移送することができる。一定速度で移送する基板が前記スリット状のノズルからなる塗布ユニット9の直下を通過する際に、ノズルから均一に連続して吐出するレジスト液を基板上に塗布することができるので、上述の基板移送装置を用いて塗布装置が構成される。
FIG. 2 is a schematic view for explaining an example of the conventional substrate floating-type substrate transfer apparatus and the coating apparatus using the same as described above, where (a) is a plan view and (b) is ( It is sectional drawing along the AA 'line of a).
Substrate 3 can be floated to a certain height by jetting air 21 (indicated by block arrows in (b)) jetted from jetting ports 2 provided in large numbers on the upper surface of stage 1. The floating substrate 3 is in a state where it can be easily moved if a slight force is applied in the horizontal direction because the frictional force with the stage 1 does not act. A drive unit 4 movable along the stage 1 is provided in the vicinity of at least one side of the side parallel to the substrate traveling direction of the stage 1, and the suction pad 5 connected to the upper side of the drive unit 4 is the substrate periphery on the lower surface of the substrate 3. If the drive unit 4 is moved by adsorbing the portion, the substrate can be gripped and transferred in the direction indicated by the thick solid arrow. When the substrate transported at a constant speed passes directly below the coating unit 9 composed of the slit-shaped nozzle, a resist solution that is uniformly and continuously discharged from the nozzle can be coated on the substrate. A coating device is configured using the transfer device.
上述の基板移送装置およびそれを用いた塗布装置において、ステージ1の表面から均一の高さに基板3を保って移送することにより、ノズルの吐出部と基板表面との距離が幅方向全体にわたって一定であることは、均一な塗布性能を保証するために重要である。然るに、浮上の高さによっては、基板を移送するために吸着パッド5が基板下面の周縁部を吸着する際に、吸着部分の基板が変形することがある。この影響により、基板の表面の高さは、周縁部に近い部分で均一な高さから外れることになり、塗布装置における塗布ムラの原因となる。 In the above-described substrate transfer device and a coating apparatus using the same, the distance between the nozzle discharge portion and the substrate surface is constant over the entire width direction by transferring the substrate 3 while keeping the substrate 3 at a uniform height from the surface of the stage 1. It is important to ensure uniform application performance. However, depending on the flying height, the suction pad 5 may be deformed when the suction pad 5 sucks the peripheral edge of the lower surface of the substrate in order to transfer the substrate. Due to this influence, the height of the surface of the substrate deviates from the uniform height at a portion close to the peripheral edge, causing uneven coating in the coating apparatus.
本発明は、前記の問題点に鑑みて提案するものであり、本発明が解決しようとする課題は、平板状の基板をステージ上面から浮かせ、基板下面の一部を吸着パッドにより把持して所定の方向に移送する基板移送装置において、吸着パッドによる基板の変形を防ぎ、基板表面の歪みを軽減する基板移送装置を提供し、それによって、処理工程の中で基板移送を伴うスピンレス方式の塗布を均一に行う装置を提供することである。 The present invention is proposed in view of the above problems, and the problem to be solved by the present invention is that a flat substrate is lifted from the upper surface of the stage, and a part of the lower surface of the substrate is held by a suction pad. In the substrate transfer device, the substrate transfer device that prevents the deformation of the substrate by the suction pad and reduces the distortion of the substrate surface is provided, thereby enabling spinless coating with substrate transfer in the processing step. It is to provide a uniform device.
上記の課題を解決するための手段として、請求項1に記載の発明は、平板状の基板をステージ上面から浮かせ、基板下面の一部を吸着パッドにより把持して所定の方向に移送する基板移送装置において、ステージ上と吸着パッド上とを含む基板上の異なる点の高さを測定できる測定器を有しており、高さの測定結果に基いて、吸着パッドの高さを調整することにより、基板表面の歪みを軽減することを特徴とする基板移送装置である。 As a means for solving the above-mentioned problem, the invention according to claim 1 is a substrate transfer method in which a flat substrate is lifted from the upper surface of the stage, and a part of the lower surface of the substrate is held by a suction pad and transferred in a predetermined direction. The device has a measuring device that can measure the height of different points on the substrate including on the stage and on the suction pad, and by adjusting the height of the suction pad based on the height measurement result A substrate transfer apparatus that reduces distortion of the substrate surface.
また、請求項2に記載の発明は、前記高さの測定結果を基板移送方向の位置に対応する変動データとして捉えて解析するデータ解析ユニットと、データ解析結果に基いて吸着パッドの高さを自動制御するリニアスライドユニットとを設けたことを特徴とする請求項1に記載の基板移送装置である。 According to a second aspect of the present invention, there is provided a data analysis unit for analyzing the height measurement result as fluctuation data corresponding to the position in the substrate transfer direction, and the height of the suction pad based on the data analysis result. The substrate transfer apparatus according to claim 1, further comprising a linear slide unit for automatic control.
また、請求項3に記載の発明は、基板移送に同期して作動するスピンレス方式の塗布ユニットを請求項1または2に記載の基板移送装置に合体したことを特徴とする塗布装置である。 According to a third aspect of the present invention, there is provided a coating apparatus in which a spinless type coating unit that operates in synchronization with the substrate transfer is combined with the substrate transfer apparatus according to the first or second aspect.
平板状の基板をステージ上面から浮かせ、基板下面の一部を吸着パッドにより把持して所定の方向に移送する基板移送装置において、ステージ上と吸着パッド上とを含む基板上の異なる点の高さを測定できる測定器を有しており、高さの測定結果に基いて、吸着パッドの高さを調整することにより、吸着パッドによる基板の変形を防ぎ、基板表面の歪みを軽減する基板移送装置を提供し、それによって、処理工程の中で基板移送を伴うスピンレス方式の塗布を均一に行う装置を提供することができる。 In a substrate transfer device that floats a flat substrate from the upper surface of the stage and grips a part of the lower surface of the substrate with a suction pad and transfers it in a predetermined direction, the height of different points on the substrate, including on the stage and on the suction pad A substrate transfer device that has a measuring device that can measure the surface of the substrate and prevents the deformation of the substrate by the suction pad and reduces the distortion of the substrate surface by adjusting the height of the suction pad based on the height measurement result Accordingly, an apparatus for uniformly applying spinless coating with substrate transfer in a processing step can be provided.
以下、図面に従って本発明を実施するための形態について説明する。
図1は、本発明の一例を説明するために、図2(a)のA−A’線に沿った断面図(b)と同様の向きに、本発明の一例の基板移送装置を見た場合の模式断面図である。
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1 shows an example of the substrate transfer apparatus of the present invention in the same direction as the cross-sectional view (b) taken along the line AA ′ of FIG. 2A in order to explain an example of the present invention. It is a schematic cross section in the case.
ステージ1上面から噴出させた噴出エアー21(ブロック矢印で表示)により基板3を一定の高さに浮上させることができる。浮上した基板3は、水平方向に僅かな力を加えれば容易に動かせる状態となっている。ステージ1の少なくとも片側には、ステージ1に沿って紙面と垂直な方向に移動可能な駆動ユニット4を設け、駆動ユニット4の上方に高さ調整機構50を介して接続した吸着パッド5が基板3の下面の基板周縁部を吸着することにより、駆動ユニット4を動かせば、基板を把持して紙面と垂直な方向に基板移送することができる。 The substrate 3 can be lifted to a certain height by the blown air 21 (indicated by a block arrow) blown from the upper surface of the stage 1. The floated substrate 3 can be easily moved by applying a slight force in the horizontal direction. At least one side of the stage 1 is provided with a drive unit 4 that can move in a direction perpendicular to the paper surface along the stage 1, and a suction pad 5 connected above the drive unit 4 via a height adjusting mechanism 50 is provided on the substrate 3. If the drive unit 4 is moved by adsorbing the peripheral edge of the substrate on the lower surface, the substrate can be gripped and transferred in a direction perpendicular to the paper surface.
上記噴出エアー21として乾燥空気または乾燥窒素を使用することができる。基板上への微細パターン形成を目的としたフォトリソグラフィー法による処理に用いる場合は、特に、異物微粒子を除去したクリーンで温度制御された気流を使うことが好ましい。 Dry air or dry nitrogen can be used as the jet air 21. When used for processing by a photolithography method for the purpose of forming a fine pattern on a substrate, it is particularly preferable to use a clean and temperature-controlled air stream from which foreign particles are removed.
駆動ユニット4の駆動方式は、例えばサーボモータなどの外部から位置情報を取得できる方式を用いる。また、駆動ユニット4の上方に設ける吸着パッド5は、駆動ユニット4上に一列に複数個並べてそれぞれのパッドの位置を明確にしておく。吸着パッド5の材質は可撓性の良好なシリコーンゴム等が使用できるが、吸着解除後の吸着面の跡を残さないことが必要であり、使用条件により、パッド表面への被膜形成処理等を適宜行う。 As a drive system of the drive unit 4, a system capable of acquiring position information from the outside such as a servo motor is used. Further, a plurality of suction pads 5 provided above the drive unit 4 are arranged in a line on the drive unit 4 so that the positions of the pads are clarified. The material of the suction pad 5 can be a flexible silicone rubber or the like, but it is necessary not to leave a mark on the suction surface after the suction is released. Do as appropriate.
本発明においては、駆動ユニット上への吸着パッドの接続に高さ調整機構を介しているため、吸着パッド5の高さを自在に調整することができる。高さ調整機構50は高さ方向の調整が可能な機構であれば限定されないが、例えば、リニアサーボモータとリニアスケールを有するリニアガイドからなるリニアスライドユニットを用いれば、30〜50μm程度の高さ調整を数μmの精度で行うことが可能である。 In the present invention, since the suction pad is connected to the drive unit via the height adjusting mechanism, the height of the suction pad 5 can be freely adjusted. The height adjustment mechanism 50 is not limited as long as it can be adjusted in the height direction. For example, if a linear slide unit including a linear servo motor and a linear guide having a linear scale is used, the height adjustment mechanism 50 has a height of about 30 to 50 μm. Adjustment can be performed with an accuracy of several μm.
上記の高さ調整機構50を用いるための前提として、高さ位置の正確な測定値が必要である。本発明では、ステージ上と吸着パッド上とを含む基板上の異なる点の高さを測定できる測定器を有しており、高さの測定結果に基いて、吸着パッドの高さを調整することにより、基板表面の歪みを軽減することができる。図1に示す例では、ステージ1上の基板上方に設置したレーザ変位計6による点線方向の基板表面との間の距離と、ステージから外れた近傍の吸着パッド5上の基板上方に設置したレーザ変位計7による点線方向の基板表面との間の距離とをそれぞれ測定し、後述のように各測定値の測定結果に基いて、吸着パッドの高さを調整することができる。 As a premise for using the height adjusting mechanism 50, an accurate measurement value of the height position is necessary. The present invention has a measuring device that can measure the height of different points on the substrate including the stage and the suction pad, and adjusts the height of the suction pad based on the measurement result of the height. Thus, distortion of the substrate surface can be reduced. In the example shown in FIG. 1, the distance between the substrate surface in the dotted line direction by the laser displacement meter 6 installed above the substrate on the stage 1 and the laser installed above the substrate on the suction pad 5 near the stage. The distance between the substrate surface in the dotted line direction by the displacement meter 7 is measured, and the height of the suction pad can be adjusted based on the measurement result of each measured value as described later.
上記の説明では、2つのレーザ変位計6、7を用いたが、この構成に限定されない。即ち、1つのレーザ変位計を図の左右方向に平行移動させて複数点での測定値を計測することも可能であり、また、多数のレーザ変位計を紙面に垂直な基板移送方向に沿って配置して高速のデータ処理を行うことも可能である。とは言え、平行な複数の走行軸に沿ってそれぞれ1つのレーザ変位計を対応させる図1の構成が通常は妥当である。 In the above description, the two laser displacement meters 6 and 7 are used, but the present invention is not limited to this configuration. In other words, it is possible to measure the measured values at a plurality of points by moving one laser displacement meter in the horizontal direction in the figure, and it is also possible to move many laser displacement meters along the substrate transfer direction perpendicular to the paper surface. It is also possible to arrange and perform high-speed data processing. However, the configuration of FIG. 1 in which one laser displacement meter is associated along each of a plurality of parallel traveling axes is usually appropriate.
次に、上記の構成からなる本発明の基板移送装置を用いて具体的に吸着パッドの高さを調整する方法について説明する。
図3は、本発明において、複数の測定データの変動を比較することにより吸着パッド上の基板高さに生じる異常歪みを検知し、補正する例を示すための説明図であって、(a)は、図2(a)のB−B’線に沿った測定位置に相当する測定座標xと変位計から基板表面までの距離の測定値yとの関係を示す模式断面図、(b)は、異常歪みを検知した測定データ例を模式的に示すグラフ、(c)は、吸着パッドの高さを補正した後の複数の測定データ例を模式的に示すグラフである。
Next, a method for specifically adjusting the height of the suction pad using the substrate transfer apparatus of the present invention having the above-described configuration will be described.
FIG. 3 is an explanatory diagram for showing an example of detecting and correcting an abnormal distortion occurring in the substrate height on the suction pad by comparing fluctuations of a plurality of measurement data in the present invention. Fig. 2A is a schematic cross-sectional view showing a relationship between a measurement coordinate x corresponding to a measurement position along the line BB 'in Fig. 2A and a measured value y of a distance from the displacement meter to the substrate surface; The graph which shows typically the example of measurement data which detected abnormal distortion, (c) is a graph which shows typically the example of several measurement data after correcting the height of a suction pad.
3つの吸着パッド5で周縁部が吸着された基板3は、図3(a)の左右方向に移動し、静止するレーザ変位計7の直下を通過する基板の駆動方向位置xにおける、変位計7から基板表面までの距離の測定値yを連続的に得ることができる。この結果を(b)のグラフで表示すると、レーザ変位計7による測定データ71が破線で示すように、例えば3つのコブを有する形に表される。また、同グラフに併記した実線で示す測定データ61は、吸着パッド上の走行軸と平行なステージ上の走行軸に沿った静止するレーザ変位計6の直下を通過する基板の駆動方向位置xにおける、変位計6から基板表面までの距離の測定値yを連続的に得たものである。 The substrate 3 having its peripheral portion adsorbed by the three suction pads 5 moves in the left-right direction in FIG. 3A, and moves at a position x in the driving direction x of the substrate passing immediately below the stationary laser displacement meter 7. The measurement value y of the distance from the substrate surface to the substrate surface can be obtained continuously. When this result is displayed in the graph of (b), the measurement data 71 by the laser displacement meter 7 is represented, for example, in a form having three bumps as indicated by a broken line. In addition, measurement data 61 indicated by a solid line also shown in the graph is a position in the driving direction position x of the substrate passing directly under the stationary laser displacement meter 6 along the traveling axis on the stage parallel to the traveling axis on the suction pad. The measurement value y of the distance from the displacement meter 6 to the substrate surface is obtained continuously.
上記2つの測定データ61、71は、レーザ変位計7による測定データ71の3つのコブを除いては、殆ど一致する。この場合の3つのコブは、図3(a)に示す3つの吸着パッド5が変位計7の直下を通過する際のレーザ変位計からの測定距離10が局部的に大きくなることを示しており、吸着パッド5が基板3に吸着した駆動方向位置xにおいて基板表面が他の駆動方向位置xにおけるよりも低い位置にあることを表している。 The two measurement data 61 and 71 are almost identical except for the three bumps of the measurement data 71 by the laser displacement meter 7. The three bumps in this case indicate that the measurement distance 10 from the laser displacement meter when the three suction pads 5 shown in FIG. 3A pass directly under the displacement meter 7 is locally increased. In the driving direction position x where the suction pad 5 is attracted to the substrate 3, the substrate surface is in a lower position than in the other driving direction positions x.
次に、高さの測定結果に基いて、吸着パッドの高さを前記高さ調整機構50により調整する。上記の例の場合には、吸着パッド5を高くする方向に補正を行う。パッド高さ補正後の測定データ例を模式的に示すグラフ(c)によれば、最適な補正を行うことによって、レーザ変位計7による測定データ71の3つのコブが消える。吸着パッド5が変位計7の直下を通過する際のレーザ変位計からの測定距離11を含む測定データ71が、吸着パッド上の走行軸と平行なステージ上の走行軸に沿った静止するレーザ変位計6による測定データ61に略沿ったグラフとなり、基板表面の高さからみた基板3の異常歪みが消失したことが分かる。 Next, the height of the suction pad is adjusted by the height adjusting mechanism 50 based on the measurement result of the height. In the case of the above example, correction is performed in the direction of raising the suction pad 5. According to the graph (c) schematically showing the measurement data example after the pad height correction, the three bumps of the measurement data 71 by the laser displacement meter 7 disappear by performing the optimal correction. The measurement data 71 including the measurement distance 11 from the laser displacement meter when the suction pad 5 passes directly under the displacement meter 7 is a stationary laser displacement along the traveling axis on the stage parallel to the traveling axis on the suction pad. It becomes a graph substantially along the measurement data 61 by the total 6, and it can be seen that the abnormal distortion of the substrate 3 as seen from the height of the substrate surface disappeared.
上記のような吸着パッドの高さ調整は、レーザ変位計7による測定データ71のみをパッド高さ補正前後で較べることによっても、一般的に妥当性を確認することができるが、上記の例のように、吸着パッドの高さの影響が比較的小さいと考えられるステージ上の走行軸に沿った静止するレーザ変位計6による測定データ61と比較することによって、吸着パッドの高さ以外による要因を打ち消して評価できるので、好ましい。 The adjustment of the height of the suction pad as described above can generally be confirmed by comparing only the measurement data 71 measured by the laser displacement meter 7 before and after the pad height correction. Thus, by comparing with the measurement data 61 of the stationary laser displacement meter 6 along the traveling axis on the stage where the influence of the suction pad height is considered to be relatively small, factors other than the suction pad height can be obtained. This is preferable because it can be evaluated by canceling.
なお、吸着パッドが変位計直下を通過する際の測定距離10のような局部的異常は、上例のコブに限らず、凹みの場合もあり、その場合は、吸着パッド5の設定高さが高過ぎてレーザ変位計7と基板表面との距離が他の場所よりも短縮したと解釈できるので、吸着パッド5を低くする方向に補正を行う。 The local abnormality such as the measurement distance 10 when the suction pad passes directly under the displacement meter is not limited to the bump in the above example, and may be a dent. In this case, the set height of the suction pad 5 is Since it can be interpreted that the distance between the laser displacement meter 7 and the substrate surface is shorter than other places because it is too high, correction is performed in the direction of lowering the suction pad 5.
また、本発明の基板移送装置において、基板表面の高さの測定結果を自動的にフィードバックして、吸着パッドの高さ調整を自動的に行う装置とすれば、使用方法がより容易に短時間でできるようになるとともに確実な補正を期待できる。図4は、上記の自動化を考慮した本発明の他の一例を説明するための模式断面図である。レーザ変位計6、7からの測定結果yは、データ解析ユニット8に測定点の駆動方向位置xとともに入力される。上述の高さ調整方法の説明に相当する一定の規則を上記データ解析ユニット8に予め設定しておけば、高さの測定結果を基板移送方向の位置に対応する変動データとして捉えて解析することができ、各吸着パッドの高さ補正の方向と妥当な値を決める。その結果をリニアスライドユニット51に出力して、リニアスライドユニットを作動させ、吸着パッドの高さ調整を完了する。 Further, in the substrate transfer apparatus of the present invention, if the apparatus automatically adjusts the height of the suction pad by automatically feeding back the measurement result of the height of the substrate surface, the usage method can be made easier and in a shorter time. As a result, it is possible to expect reliable correction. FIG. 4 is a schematic cross-sectional view for explaining another example of the present invention considering the above automation. The measurement result y from the laser displacement meters 6 and 7 is input to the data analysis unit 8 together with the driving direction position x of the measurement point. If a certain rule corresponding to the above description of the height adjustment method is set in the data analysis unit 8 in advance, the height measurement result is analyzed as fluctuation data corresponding to the position in the substrate transfer direction. Determine the direction and reasonable values for the height correction of each suction pad. The result is output to the linear slide unit 51, the linear slide unit is operated, and the suction pad height adjustment is completed.
さらに、本発明の基板移送装置の基板表面の歪みを軽減する基板移送機能を利用して、基板移送に同期して作動するスピンレス方式の塗布ユニットを前記基板移送装置に合体す
ることにより、スピンレス方式の塗布を均一に行う塗布装置を提供することができる。
Further, by utilizing the substrate transfer function for reducing the distortion of the substrate surface of the substrate transfer device of the present invention, a spinless method is combined with the substrate transfer device, and the spinless method is combined with the substrate transfer device. It is possible to provide a coating apparatus that uniformly coats.
1・・・ステージ
2・・・噴出口
3・・・基板
4・・・駆動ユニット
5・・・吸着パッド
6・・・レーザ変位計(ステージ上)
7・・・レーザ変位計(吸着パッド上)
8・・・データ解析ユニット
9・・・塗布ユニット
10・・・吸着パッドが変位計直下を通過する際の測定距離(パッド高さ補正前)
11・・・吸着パッドが変位計直下を通過する際の測定距離(パッド高さ補正後)
21・・・噴出エアー
50・・・高さ調整機構
51・・・リニアスライドユニット
61・・・レーザ変位計6による測定データ
71・・・レーザ変位計7による測定データ
DESCRIPTION OF SYMBOLS 1 ... Stage 2 ... Spout 3 ... Substrate 4 ... Drive unit 5 ... Suction pad 6 ... Laser displacement meter (on stage)
7 ... Laser displacement meter (on suction pad)
8 ... Data analysis unit 9 ... Coating unit 10 ... Measurement distance when the suction pad passes directly under the displacement meter (before pad height correction)
11 ... Measurement distance when the suction pad passes directly under the displacement meter (after pad height correction)
21 ... Blowing air 50 ... Height adjustment mechanism 51 ... Linear slide unit 61 ... Measurement data 71 with laser displacement meter 6 ... Measurement data with laser displacement meter 7
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JP2001038538A (en) * | 1999-08-04 | 2001-02-13 | Otis Elevator Co | Centering device for sheave |
JP2005228881A (en) * | 2004-02-12 | 2005-08-25 | Tokyo Electron Ltd | Levitation substrate transfer processing method and its apparatus |
JP2008080346A (en) * | 2006-09-26 | 2008-04-10 | Sony Corp | Laser beam machining device and laser beam machining method |
JP2009022822A (en) * | 2007-07-17 | 2009-02-05 | Tokyo Ohka Kogyo Co Ltd | Coating apparatus and coating method |
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JP2001038538A (en) * | 1999-08-04 | 2001-02-13 | Otis Elevator Co | Centering device for sheave |
JP2005228881A (en) * | 2004-02-12 | 2005-08-25 | Tokyo Electron Ltd | Levitation substrate transfer processing method and its apparatus |
JP2008080346A (en) * | 2006-09-26 | 2008-04-10 | Sony Corp | Laser beam machining device and laser beam machining method |
JP2009022822A (en) * | 2007-07-17 | 2009-02-05 | Tokyo Ohka Kogyo Co Ltd | Coating apparatus and coating method |
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