JP2011148940A - Biaxially oriented film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a biaxially oriented film excellent in heat resistance and electric insulation. <P>SOLUTION: The biaxially oriented film uses a thermoplastic polyether ketone resin as a main component and has a glass transition temperature (Tg) of 145 to <180°C, wherein a resin component having a glass transition temperature (Tg) of ≥180°C is contained in an amount of 5-48 mass%. A breakdown voltage of the biaxially oriented film at 23°C (BDV23) is ≥350 kV/mm. A ratio between a breakdown voltage of the biaxially oriented film at 140°C (BDV140) and the breakdown voltage at 23°C, BDV140/BDV23 is ≥0.7. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a biaxially stretched film.

  In recent years, electronic devices have been downsized, and electronic components such as capacitors have been downsized accordingly. On the other hand, due to an increase in power to be handled, heat generation of the electronic device itself is increased, and there are advances in hybrid vehicles, electric vehicles, and the like, and electronic components that can be used in a high temperature environment are demanded. Therefore, a film used for a capacitor is required to have high heat resistance as well as electrical insulation.

  As an electrically insulating film, particularly an electrically insulating film used as an insulator of a capacitor, a film made of polyethylene, polypropylene, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or the like is well known. In recent years, for the purpose of increasing the heat resistance of capacitors, studies using other resins and studies for modifying these resins have been conducted. For example, in Patent Documents 1 and 2, the use of a thermoplastic polyetherketone film having excellent heat resistance for electrical insulation applications such as a capacitor has been studied.

  However, although the thermoplastic polyether ketone film is excellent in heat resistance, it has a disadvantage that it is slightly inferior in electrical insulation as compared with polypropylene and the like. Polypropylene or the like has insufficient heat resistance.

JP 57-137116 A JP-A 61-37419 JP-A-1-205511

  An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a biaxially stretched film excellent in heat resistance and electrical insulation. In particular, it is to provide a biaxially stretched film having excellent dielectric breakdown voltage characteristics even in a high temperature environment.

  As a result of diligent investigations to solve the above problems, the present inventors have formulated a specific resin component in a biaxially stretched film using a thermoplastic polyetherketone resin as a main component. The inventors have found that a biaxially stretched film excellent in insulating properties can be obtained, and have reached the present invention.

That is, the present invention comprises (1) a thermoplastic polyetherketone resin (A) as a main component, 5 to 48% by mass of a resin component (B) having a glass transition temperature (Tg) of 180 ° C. or higher, and a glass transition temperature. It is a biaxially stretched film whose (Tg) is 145 degreeC or more and less than 180 degreeC.

The biaxially stretched film of the present invention is
(2) The dielectric breakdown voltage (BDV23) at 23 ° C. is 350 kV / mm or more,
(3) The ratio of the breakdown voltage (BDV140) at 140 ° C. to the breakdown voltage at 23 ° C. (BDV140 / BDV23) is 0.7 or more,
(4) The resin component (B) is a polyimide resin,
(5) In each of the longitudinal direction and the transverse direction, the breaking strength at 23 ° C. (breaking strength 23) is 200 MPa or more, and the ratio between the breaking strength at 140 ° C. (breaking strength 140) and the breaking strength at 23 ° C. (breaking strength 140 / breaking strength 23) is 0.7 or more,
(6) The absolute value of the heat shrinkage rate in the longitudinal direction and the transverse direction after heat treatment at a temperature of 150 ° C. for 30 minutes is 1.0% or less,
Among them, a more excellent biaxially stretched film can be obtained by including at least one of the embodiments.

The present invention also provides
(7) Used for electrical insulation,
(8) Used for condensers,
Includes embodiments.

  ADVANTAGE OF THE INVENTION According to this invention, the biaxially stretched film excellent in heat resistance and electrical insulation can be provided. In particular, a biaxially stretched film having excellent dielectric breakdown voltage characteristics under a high temperature environment can be provided. The biaxially stretched film of the present invention having such characteristics can be suitably used for electrical insulation used in a high temperature environment, especially for mobiles, especially for automobiles such as hybrid cars and electric cars. It can be suitably used for a capacitor, and its industrial value is extremely high.

The present invention will be described in detail below.
[Biaxially stretched film]
The biaxially stretched film of the present invention comprises a thermoplastic polyether ketone resin as a main component. Here, “main” means that 52% by mass or more, preferably 65% by mass or more, and more preferably 75% by mass or more based on the biaxially stretched film is thermoplastic polyetherketone resin.

または

を単独で、あるいは該単位と他の構成単位からなるポリマーである。かかる他の構成単位としては、例えば

等が挙げられる。上記構成単位において、Ａは直接結合、酸素、−ＣＯ−、−ＳＯ_２−または二価の低級脂肪族炭化水素基であり、Ｑ及びＱ’は同一であっても相違してもよく、−ＣＯ−または−ＳＯ_２−であり、ｎは０または１である。これらポリマーは、特公昭６０−３２６４２号公報、特公昭６１−１０４８６号公報、特開昭５７−１３７１１６号公報等に記載されている。 <Thermoplastic polyether ketone resin (A)>
The thermoplastic polyetherketone resin (A) in the present invention is a structural unit.

Or

Is a polymer composed of the unit alone and other structural units. Examples of such other structural units include:

Etc. In the above structural unit, A is a direct bond, oxygen, —CO—, —SO ₂ — or a divalent lower aliphatic hydrocarbon group, and Q and Q ′ may be the same or different, CO— or —SO ₂ —, and n is 0 or 1. These polymers are described in JP-B-60-32642, JP-B-61-1486, JP-A-57-137116, and the like.

As the thermoplastic polyetherketone resin (A) in the present invention, an embodiment containing the above formula [Chemical Formula 2] is preferable, and the content thereof is preferably 60, based on the mass of the thermoplastic polyetherketone resin (A). More than 66% by mass, more preferably 66% by mass or more, more preferably 75% by mass or more, and particularly preferably 80% by mass or more. By adopting such an embodiment, the electrical insulation is improved while maintaining the heat resistance. The effect can be enhanced, and the dielectric breakdown voltage characteristics in a high temperature environment can be further improved.
As described above, the thermoplastic polyetherketone resin is known per se and can be produced by a method known per se.

Further, the thermoplastic polyetherketone resin in the present invention has an apparent melt viscosity of 500 to 10,000 poise, more preferably 1000 to 5000 poise at a temperature of 380 ° C. and an apparent shear rate of 1000 sec ⁻¹ . It is preferable because of excellent film forming properties.

<Resin component (B)>
The biaxially stretched film of this invention contains the resin component (B) whose glass transition temperature (Tg) is 180 degreeC or more. When Tg of the resin component (B) is in the above numerical range, heat resistance and electrical insulation are excellent. Moreover, the dielectric breakdown voltage in a high temperature environment can be increased. When Tg is less than 180 ° C., the electric insulation tends to be lowered. From such a viewpoint, the Tg of the resin component (B) is preferably 190 ° C. or higher, more preferably 200 ° C. or higher, and further preferably 210 ° C. or higher. If the Tg of the resin component (B) is too high, the difference from the Tg of the thermoplastic polyetherketone resin (A) tends to be too large, and the compatibility and kneadability at the time of melting tend to deteriorate. is there. From such a viewpoint, the Tg of the resin component (B) is preferably 300 ° C. or less, more preferably 260 ° C. or less, and further preferably 230 ° C. or less. From the viewpoint of compatibility and kneadability, the resin component (B) is preferably non-crystalline.

  Examples of the resin constituting the resin component (B) include polyarylate resins, polyimide resins, polyether sulfone resins, and polysulfone resins. Among them, more excellent heat resistance, electrical insulation, phase From the viewpoint of obtaining solubility and kneadability, a polyimide resin is preferable.

  The polyimide resin in the present invention is a melt-formable polymer containing a cyclic imide group, and is not particularly limited as long as it can meet the purpose of the present invention, but is aliphatic, alicyclic or aromatic. Polyetherimides containing ether units and cyclic imide groups as repeating units are preferred. For example, polyether imides described in U.S. Pat. Nos. 4,141,927, 2,262,678, 2,606,912, 2,606,914, 2,596,565, 2,596,656, and 2,598,478 are disclosed. No. 2598536, Japanese Patent No. 2599171, Japanese Patent Laid-Open No. 9-48852, Japanese Patent No. 2565556, Japanese Patent No. 2564636, Japanese Patent No. 2564537, Japanese Patent No. 2563548, Japanese Patent No. 2563547, Japanese Patent No. 2558341, Japanese Patent No. 2558341 Examples include polymers described in Japanese Patent Nos. 2558339 and 28345580.

  Moreover, structural units other than cyclic imide and ether units, for example, aromatic, aliphatic, alicyclic ester units, oxycarbonyl units and the like may be contained in the main chain of polyimide.

  Specific examples of the polyetherimide that can be preferably used in the present invention include polymers represented by the following general formula.

（ただし、上記式中、Ｒ_１は、６〜３０個の炭素原子を有する２価の芳香族または脂肪族残基であり、Ｒ_２は、６〜３０個の炭素原子を有する２価の芳香族残基、２〜２０個の炭素原子を有するアルキレン基、２〜２０個の炭素原子を有するシクロアルキレン基、及び２〜８個の炭素原子を有するアルキレン基で連鎖停止されたポリジオルガノシロキサン基からなる群より選択された２価の有機基である。）

(Wherein R ₁ is a divalent aromatic or aliphatic residue having 6 to 30 carbon atoms, and R ₂ is a divalent aromatic having 6 to 30 carbon atoms. Group residues, alkylene groups having 2 to 20 carbon atoms, cycloalkylene groups having 2 to 20 carbon atoms, and polydiorganosiloxane groups chain-terminated with alkylene groups having 2 to 8 carbon atoms A divalent organic group selected from the group consisting of:

As said R < ₁ >, R < ₂ >, the aromatic residue shown by the following formula group can be mentioned, for example.

  In the present invention, the glass transition temperature (Tg) is preferably 300 ° C. or lower, more preferably 260 ° C. or lower, from the viewpoints of compatibility / kneading properties with the thermoplastic polyether ketone resin (A), cost, and melt moldability. More preferably, a polyetherimide at 230 ° C. or lower is preferable, and 2,2-bis [4- (2,3-dicarboxyphenoxy) phenyl] propane dianhydride and m-phenylene having a structural unit represented by the following formula Most preferred are condensates with diamine or p-phenylenediamine, and copolymers and modified products thereof. This polyetherimide is manufactured by GE Plastics, for example, and can be exemplified by what is known under the trade name of ““ Ultem ”1000, 5000, and 6000 series”.

または

Or

  Content of the resin component (B) in the biaxially stretched film of this invention is 5-48 mass% on the basis of the mass of a biaxially stretched film. When the content is in the above numerical range, the heat resistance and electrical insulation are excellent, and the dielectric breakdown voltage in a high temperature environment can be increased. When the content is too small, heat resistance and electrical insulation tend to be lowered. From such a viewpoint, the content of the resin component (B) is preferably 8% by mass or more, and more preferably 14% by mass or more. Moreover, when there is too much content, it will become easy to fracture | rupture at the time of film forming, and it exists in the tendency for film forming property (stretchability) to worsen. From such a viewpoint, the content of the resin component (B) is preferably less than 35% by mass, and more preferably 25% by mass or less.

<Inert particles>
In order to improve the handleability of the film, the biaxially stretched film of the present invention preferably contains inert particles as long as the effects of the invention are not impaired. In order for the film to contain an inert particle, for example, it is preferable that the thermoplastic polyether ketone resin contains the inert particle in advance. In addition, a known method such as addition of inert particles in the step of melt-extruding the thermoplastic polyetherketone resin can be employed.

  Examples of the inert particles include inorganic particles containing elements of Periodic Tables IIA, IIB, IVA, and IVB (for example, kaolin, alumina, titanium oxide, calcium carbonate, silicon dioxide (silica), etc.). And organic particles made of a polymer having high heat resistance such as a crosslinked silicone resin, a crosslinked polystyrene resin, and a crosslinked acrylic resin. Among these, inorganic particles are preferable for reasons such as high heat resistance, and silica particles are particularly preferable.

  The average particle size of the inert particles is preferably 0.01 μm or more and 3 μm or less, more preferably 0.05 μm or more and 2 μm or less, and particularly preferably 0.1 μm or more and 1 μm or less. The content is preferably 0.01% by mass or more and 3.0% by mass or less, more preferably 0.03% by mass or more and 2.0% by mass or less, and particularly preferably 0.00% by mass or less, based on the mass of the biaxially stretched film. It is 05 mass% or more and 1.0 mass% or less. By adopting the above average particle size and content, the handling properties can be improved more efficiently, and the mechanical properties of the biaxially stretched film (breaking strength, breaking elongation, Young's modulus, etc.) And electrical characteristics (such as dielectric breakdown voltage) are not reduced excessively.

  The inert particles in the present invention preferably have a spherical shape, and when the ratio of the major axis to the minor axis (major axis / minor axis) of the inert particles is defined as the particle size ratio, the particle size ratio Is preferably 1.20 or less, more preferably 1.10 or less, particularly preferably 1.05 or less, and the handling property can be further improved.

<Other additives>
The thermoplastic polyether ketone resin in the present invention may be blended with a resin such as polyarylene polyether, polysulfone, polyarylate, polyester, polycarbonate, etc. for the purpose of improving fluidity, etc., and stabilizers and antioxidants. In addition, an additive such as an ultraviolet absorber may be contained.

[Method for producing biaxially stretched film]
The biaxially stretched film of the present invention may be referred to as a machine axis direction (hereinafter sometimes referred to as a longitudinal direction or MD) and a direction perpendicular to the machine axis direction (hereinafter referred to as a transverse direction or TD). ), The mechanical properties (breaking strength, breaking elongation, Young's modulus, etc.) are improved by biaxial stretching, and for electrical insulation, especially for capacitors. High heat resistance and electrical insulation for electrical insulation can be exhibited, and a high dielectric breakdown voltage can be exhibited in a high temperature environment. Such biaxial stretching may be either simultaneous biaxial stretching or sequential biaxial stretching. However, sequential biaxial stretching is preferable from the viewpoint of making thickness unevenness better, and the order of stretching is longitudinal stretching first. Then, it is preferable to carry out the transverse stretching to improve the thickness unevenness and from the viewpoint of productivity.

Hereinafter, the manufacturing method of the biaxially stretched film of this invention is demonstrated.
<Extrusion process>
The pellets of thermoplastic polyetherketone resin are put into an extruder, melted by heating at a temperature of (Tm + 20) ° C. or more and (Tm + 90) ° C. or less, extruded into a sheet, and then cooled and solidified by contacting with a cooling roll. An unstretched film is obtained. Here, Tm represents the melting point (unit: ° C.) of the mixed resin of the thermoplastic polyetherketone resin (A) and the resin component (B) obtained by a differential scanning calorimeter (DSC).

<Extension process>
Subsequently, the obtained unstretched film is stretched biaxially in the machine direction and the transverse direction.
Stretching in the longitudinal direction (hereinafter sometimes referred to as longitudinal stretching) is performed at a temperature (Tg−10) ° C. to (Tg + 45) ° C. and a magnification of 1.5 to 5.0 times. The stretching temperature is preferably (Tg) ° C. or more and (Tg + 30) ° C. or less, and the stretching ratio is preferably 2.0 times or more and 4.0 times or less, more preferably 2.4 times or more and 3.5 times or less. is there.

  Stretching in the transverse direction (hereinafter sometimes referred to as transverse stretching) is performed at a temperature (Tg + 10) ° C. to (Tg + 40) ° C. and a magnification of 2.5 to 5.0 times. The stretching temperature is preferably (Tg + 15) ° C. or more and (Tg + 30) ° C. or less, and the stretching ratio is preferably 2.5 times or more and 3.5 times or less. Here, Tg represents the glass transition temperature (unit: ° C.) of the mixed resin of the thermoplastic polyetherketone resin (A) and the resin component (B) obtained by DSC.

  By making the stretching conditions (stretching temperature and stretching ratio) in the longitudinal direction and the transverse direction as described above, the effect of improving heat resistance and electrical insulation can be enhanced. Moreover, the dielectric breakdown voltage in a high temperature environment can be further increased. Moreover, a thickness spot can be made into a more favorable range. Increasing the draw ratio tends to increase heat resistance and electrical insulation. Further, the thickness unevenness tends to be improved. Also, the Young's modulus and breaking strength in the same direction tend to increase. If the stretching temperature is too low, film breakage tends to occur, and thickness unevenness tends to be worsened.On the other hand, if the stretching temperature is too high, so-called flow stretching tends to occur, and thickness unevenness tends to be worsened. There is a tendency to be inferior in electrical insulation.

  Here, in the present invention, in order to make the electrical insulation better, it is preferable to carry out transverse stretching by dividing it into a plurality of temperature regions, with the temperature of the first region and the temperature of the final region, It is preferable to set a temperature difference of 3 ° C. or more and 60 ° C. or less. If the temperature difference is too large or too small, the effect of improving electrical insulation tends to be low. If the temperature difference is too small, for example, when the transverse stretching temperature is medium, the stretching stress tends to be low at the stretching start portion and the stretching stress tends to be high at the stretching end portion (final region). It is likely that the thickness becomes large and variation tends to occur, or the thickness unevenness of the film tends to deteriorate, and the effect of improving electrical insulation tends to decrease. On the other hand, if the temperature difference is too large, it is likely that local temperature fluctuations and temperature variations are likely to occur because the temperature changes greatly in the adjacent area, and the thickness unevenness tends to deteriorate. And the effect of improving the electrical insulation tends to be low. From such a viewpoint, the lower limit of the temperature difference is more preferably 5 ° C. or more, more preferably 10 ° C. or more, particularly preferably 17 ° C. or more, and the upper limit of the temperature difference is more preferably 50 ° C. or less, and 40 ° C. or less. More preferably, 30 ° C. or less is particularly preferable, and more preferable electrical insulation can be obtained.

  In the transverse stretching step, in order to create a temperature difference between the first region and the final region, a temperature difference may be provided between the zone entrance (first region) and the outlet (final region) in one stretching zone. Alternatively, two or more continuous stretching zones having different temperatures may be provided, and a temperature difference may be provided between the first stretching zone (first region) and the last stretching zone (final region). Here, the zone indicates one area divided by a shutter or the like in a tenter or the like. In any case, it is preferable to further divide between the first region and the final region and increase the temperature from the first region toward the final region, and it is particularly preferable to increase the gradient so as to be linear. For example, in the case of two or more continuous stretching zones having different temperatures, it is preferable to further provide one or more stretching zones between the first stretching zone and the last stretching zone, and one or more stretching zones are provided. More preferably. Setting the total number of stretching zones to 13 or more is disadvantageous in terms of equipment costs.

  The draw ratio should be such that the value obtained by dividing the film width immediately after leaving the final area by the film width immediately before entering the first area is the target draw ratio, and the film width is increased step by step. It is preferable to increase the gradient so that the gradient is linear. In the case where the machine direction and the transverse direction are drawn simultaneously, the drawing temperature is similarly divided into a plurality of stages, and a temperature difference is provided between the first stage temperature and the final stage temperature.

  Furthermore, in the present invention, in the above stretching conditions, the area stretching ratio (longitudinal stretching ratio × lateral stretching ratio) is preferably 5 times or more, more preferably 6 times or more, and 7 times or more. It is more preferable to make the thickness unevenness better. If the area stretch ratio is too high, the film tends to break, and the upper limit is preferably 25 times or less, more preferably 20 times or less, and particularly preferably 15 times or less.

<Heat setting process>
Next, the film biaxially stretched as described above is heat-treated and heat-set. The heat setting is performed at a temperature of (Tg + 27) ° C. or more and (Tm) ° C. or less, preferably (Tg + 60) ° C. or more and (Tm−20) ° C. or less, more preferably (Tg + 90) ° C. or more and (Tm−30) ° C. or less. The time is 1 second to 10 minutes, preferably 2 seconds to 5 minutes, preferably 3 to 120 seconds, more preferably 5 to 60 seconds. Heat setting is divided into two or more steps, such as a heat treatment that is continuously performed after the stretching process when forming a biaxially stretched film and a heat treatment that is performed separately after the formation of a biaxially stretched film. May be.

  By setting the heat setting conditions (heat setting temperature and heat setting time) as described above, the effect of improving heat resistance and electrical insulation can be enhanced. Moreover, a thickness spot can be made into a more favorable range. Further, the thermal shrinkage rate can be set in a numerical range preferably defined by the present invention. If the heat setting temperature is too high, the effect of improving heat resistance and electrical insulation tends to be low, and thickness unevenness tends to be poor. On the other hand, if it is too low, the heat shrinkage rate tends to be high.

<Thermal relaxation treatment>
Next, the film heat-fixed as described above is preferably subjected to heat relaxation treatment in the width direction in order to adjust the heat shrinkage rate. Specifically, the temperature is 180 ° C. or more and 320 ° C. or less, and the relaxation rate is 1% or more. It is preferable to perform a heat relaxation treatment of 7% or less. When the relaxation rate is too high, the thermal shrinkage rate tends to be low, but the flatness of the film tends to be inferior. On the other hand, if it is too low, the thermal shrinkage tends to increase. From such a viewpoint, the relaxation rate is more preferably 2% or more and 6% or less.
Thus, the biaxially stretched film of the present invention can be obtained.

[Characteristics of biaxially stretched film]
<Film thickness>
The thickness of the biaxially stretched film of the present invention is preferably 0.3 μm or more and 250 μm or less. When the film thickness is too thin, the film tends to break during film formation, and the production efficiency tends to deteriorate. On the other hand, when the film thickness is too thick, the stretching stress tends to increase, and it tends to be difficult to increase the stretching ratio, and as a result, the thickness unevenness tends to deteriorate. Further, the effect of improving heat resistance and electrical insulation tends to be reduced. From such a viewpoint, the lower limit of the film thickness is more preferably 0.5 μm or more, further preferably 0.8 μm or more, and particularly preferably 1.2 μm or more. On the other hand, the upper limit of the film thickness is more preferably 128 μm or less, further preferably 50 μm or less, and particularly preferably 13 μm or less.

<Thick spots>
The biaxially stretched film of the present invention preferably has a thickness unevenness of 9% or less. When thickness unevenness deteriorates, in-plane variation in electrical insulation tends to increase, and as a result, the effect of improving electrical insulation and dielectric breakdown voltage characteristics tends to decrease. From such a viewpoint, the thickness unevenness is preferably 6% or less, more preferably 3% or less. The lower limit of the thickness unevenness is preferably as small as possible. Ideally, the thickness unevenness is 0%, but actually it is about 0.1% or more.
In order to make the thickness unevenness within the above numerical range, the stretching condition may be the above-described embodiment. In particular, it is important that the transverse stretching conditions are divided into the above-described embodiments, that is, divided into a plurality of temperature regions.

<Glass transition temperature (Tg)>
The biaxially stretched film of the present invention has a glass transition temperature (Tg) of 145 ° C. or higher and lower than 180 ° C. When Tg is in the above numerical range, it is easy to maintain the rigidity of the film even in a high temperature environment, and it can be more suitably used for an automobile capacitor. Further, the effect of improving the heat resistance is increased, and as a result, the dielectric breakdown voltage in a high temperature environment can be increased. From such a viewpoint, Tg is preferably 150 ° C. or higher and 175 ° C. or lower.

<Dielectric breakdown voltage>
The biaxially stretched film of the present invention preferably has a breakdown voltage (BDV23) at 23 ° C. of 350 kV / mm or more. When BDV23 is in the above numerical range, it can be suitably used for a condenser of a hybrid vehicle. When the BDV 23 is low, when used for a capacitor of a hybrid vehicle, a short circuit occurs in the capacitor due to a large current, and problems such as destruction of the capacitor are likely to occur. From such a viewpoint, BDV23 is more preferably 360 kV / mm or more, further preferably 380 kV / mm or more, and particularly preferably 410 kV / mm or more.

  In addition, the biaxially stretched film of the present invention preferably has a high dielectric breakdown voltage under a high temperature environment, and the ratio of the dielectric breakdown voltage (BDV140) at 140 ° C. to BDV23 (BDV140 / BDV23) is 0.7 or more. It is preferable. When this ratio is in the above numerical range, it means that it exhibits electrical insulation equivalent to room temperature even in a high temperature environment, and can be suitably used for a capacitor of a hybrid vehicle. If the ratio is too small, it means that the electrical insulation is lowered in a high temperature environment, and it is difficult to apply to a use used in a high temperature environment such as a capacitor for a hybrid vehicle. From such a viewpoint, the ratio is more preferably 0.8 or more, and further preferably 0.9 or more. BDV140 is preferably 245 kV / nn or more, more preferably 350 kV / mm or more, and further preferably 400 kV / mm or more.

  BDV23 and BDV140 as described above can be achieved by adding the resin component (B) in an amount specified by the present invention to the thermoplastic polyetherketone resin (A) and stretching under specific conditions.

<Break strength>
The biaxially stretched film of the present invention preferably has a breaking strength at 23 ° C. (breaking strength 23) of 200 MPa or more in each of the longitudinal direction and the transverse direction. When the breaking strength 23 is in the above numerical range, the film becomes stiff and the flexibility is improved, and it can be more suitably used for electrical insulation such as for capacitors. From such a viewpoint, the breaking strength 23 is more preferably 220 MPa or more, further preferably 250 MPa or more, and particularly preferably 270 MPa or more.

  The biaxially stretched film of the present invention has a ratio of breaking strength (breaking strength 140) to breaking strength 23 at 140 ° C. (breaking strength 140 / breaking strength 23) of 0.7 in each of the longitudinal direction and the transverse direction. The above is preferable. When the ratio is 0.7 or more, it means that mechanical characteristics equivalent to normal temperature are expressed even in a high temperature environment, and more particularly for electrical insulation such as a capacitor used in a high temperature environment. It can be used suitably. When the ratio is less than 0.7, that is, when the breaking strength is greatly reduced when a high temperature environment is used, when used in applications exposed at high temperatures, such as for a hybrid vehicle capacitor, Destruction tends to occur easily in a high temperature environment. From such a viewpoint, the ratio of breaking strength 140 / breaking strength 23 ° C. in each of the longitudinal direction and the transverse direction is preferably 0.8 or more, more preferably 0.85 or more, and More preferably, it is 90 or more, and particularly preferably 0.93 or more. The breaking strength 140 is preferably 140 MPa or more, more preferably 250 MPa or more, and further preferably 300 MPa.

  In order to make the said ratio into the said numerical range, it can achieve by adjusting extending | stretching conditions (a draw ratio, extending | stretching temperature, etc.). In order to increase the breaking strength at 140 ° C., the thermoplastic polyether ketone resin (A) is used with the resin component (B) in the amount specified in the present invention, and the above-mentioned stretching conditions, heat setting conditions, etc. Can be achieved by adjusting according to the resin composition.

<Heat shrinkage>
In the biaxially stretched film of the present invention, it is preferable that the absolute values of the heat shrinkage in the machine direction and the transverse direction after heat treatment at a temperature of 150 ° C. for 30 minutes are both 1.0% or less. The absolute value of the heat shrinkage rate is more preferably 0.7% or less, and particularly preferably 0.5% or less. In other words, the heat shrinkage rate is preferably closer to 0. When the thermal contraction rate is in the above numerical range, the thermal dimensional stability is excellent, and the workability is excellent, such as warpage and curling are difficult to occur during processing.

  In order to make the heat shrinkage ratio as described above, the thermoplastic polyetherketone resin (A) may be used as the main component constituting the biaxially stretched film, and the film may be produced under the production conditions described above. In particular, increasing the draw ratio tends to increase the heat shrinkage rate, increasing the heat setting temperature tends to decrease the heat shrinkage rate, and increasing the relaxation rate tends to decrease the heat shrinkage rate. It is important to adjust.

[Usage]
The biaxially stretched film of the present invention is excellent in heat resistance and electrical insulation, and can be suitably used for electrical insulation that requires excellent dielectric breakdown voltage characteristics even in a high temperature environment. In particular, it can be suitably used for applications that require higher heat resistance and electrical insulation characteristics (dielectric breakdown voltage), such as those for capacitors such as those for moving bodies, particularly for hybrid vehicles, electric vehicles, and fuel vehicles. .

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited only to these Examples. Each characteristic value was measured by the following method. Moreover, unless otherwise indicated, the part and% in an Example mean a mass part and mass%, respectively.

(1) Breaking strength Using a test piece obtained by cutting a film into a length of 150 mm × 10 mm width, using a Tensilon UCT-100 type manufactured by Orientec Co., Ltd., in a room adjusted to a temperature of 23 ° C. and a humidity of 60% RH A tensile test was performed at 100 mm, a tensile speed of 10 mm / min, and a chart speed of 50 mm / min, and the breaking strength at 23 ° C. (breaking strength 23) was determined from the stress at break. In addition, the longitudinal direction breaking strength (MD) is defined as the measurement direction, and the transverse direction breaking strength is defined as the lateral direction (TD) of the film as the measurement direction. Each breaking strength was measured 10 times, and the average value was used.
In addition, the breaking strength (breaking strength 140) in a 140 ° C. temperature atmosphere is set in the chamber set in the 140 ° C. temperature atmosphere, the test piece and the tensilon chuck portion are set, and left for 2 minutes, and then the tensile strength described above. It was determined by conducting a test.

(2) Glass transition temperature (Tg) and melting point (Tm)
About 10 mg of a sample for a resin sample and about 20 mg of a sample for a film sample are sealed in an aluminum pan for measurement and attached to a differential calorimeter (TA Instruments, trade name: DSC2920 Modulated), and 25 ° C. to 20 ° C. The temperature was raised to 370 ° C. at a rate of / min, held at 370 ° C. for 3 minutes, then taken out, immediately transferred onto ice and rapidly cooled. The pan was again attached to the differential calorimeter, and the glass transition temperature (unit: ° C) and melting point (unit: ° C) were measured by increasing the temperature from 25 ° C to 20 ° C / min.

(3) Heat shrinkage rate In a oven set at a temperature of 150 ° C., the film was marked in the longitudinal and transverse directions, and a 30 cm long film whose exact length was measured in advance was placed under no load for 30 minutes. Take out after holding treatment, return to room temperature, and then read the change in dimensions. From the length (L ₀ ) before the heat treatment and the dimensional change (ΔL) due to the heat treatment, the thermal shrinkage rates in the vertical direction and the horizontal direction were obtained from the following formula (1).
Thermal contraction rate (%) = (ΔL / L ₀ ) × 100 (1)

(4) Dielectric breakdown voltage (BDV)
It was measured according to the method shown in JIS C 2151. Using a DC withstand voltage tester in an atmosphere of 23 ° C. and 50% relative humidity, the upper electrode is a brass cylinder with a diameter of 25 mm, the lower electrode is an aluminum cylinder with a diameter of 75 mm, and the pressure is increased at a pressure increase rate of 100 V / second. The voltage when the film was broken and short-circuited was read. The obtained voltage was divided by the film thickness to obtain a dielectric breakdown voltage (BDV23, unit: kV / mm) at 23 ° C.
The measurement was carried out 41 times, and the median value of the 21 points was taken as the measured value of the dielectric breakdown voltage except for the larger value of 10 points and the smaller value of 10 points.
Measurement of dielectric breakdown voltage (BDV140) at 140 ° C. is performed by setting an electrode and a sample in a hot air oven, connecting to a power source with a heat-resistant cord, and starting the pressure increase in 1 minute after putting the sample into the 140 ° C. oven. Measured in the same manner as above.

(5) Stretchability Judgment was made as follows according to the number of breaks that occurred while a biaxially stretched film was formed into 1 million meters.
Stretchability ◎: Less than 1 break per 100,000 m film formation Stretchability ○: 1 to less than 100,000 breakage per 100,000 m stretchability △: 2 breaks per 100,000 m film formation ~ Less than 4 times Stretchability x: Breakage per 100,000 m film formation 4 times to less than 8 times Stretchability XX: Breakage more than 8 times per 100,000 m film formation

(6) Film thickness and thickness unevenness The thickness of the film is measured in the vertical and horizontal directions using an electronic micrometer to measure a length of 0.5 m, and the maximum thickness (unit: μm) and the minimum of the measured lengths. The ratio (percentage) of the difference from the thickness (unit: μm) to the average thickness (unit: μm) was determined and determined as thickness spots (unit:%). The thickness variation in the vertical direction and the horizontal direction was taken as a measurement value.

[Examples 1, 2, and 3]
Polyetheretherketone resin as a thermoplastic polyetherketone resin (A) (manufactured by Victrex: polyetheretherketone 381G, Tg: 142 ° C., Tm: 343 ° C.) and polyetherimide as a resin component (B) Spherical particles having an average particle size of 0.7 μm and a particle size ratio of 1.05 as inert particles in a mixed composition (mixing ratio shown in Table 1) with a resin (manufactured by General Electric: Ultem 1010, Tg: 217 ° C.) Silica particles were added so as to be 0.1% by mass with respect to the mass of the obtained biaxially stretched film, dried at 160 ° C. for 4 hours, melt-extruded at 380 ° C. by an extruder, and maintained at 80 ° C. An unstretched film was prepared by casting on a casting drum. Next, biaxially stretched sequentially in the machine direction and then in the transverse direction under the conditions shown in Table 1, and further heat-set and heat-relaxed under the conditions shown in Table 1 to obtain a biaxially stretched film having a thickness of 3 μm. . The characteristics of the obtained biaxially stretched film are shown in Table 1.

[Comparative Example 1]
An unstretched film was prepared in the same manner as in Example 1 except that the polyetherimide resin as the resin component (B) was not used. Next, biaxially stretched sequentially in the machine direction and then in the transverse direction under the conditions shown in Table 1, and further heat-set and heat-relaxed under the conditions shown in Table 1 to obtain a biaxially stretched film having a thickness of 3 μm. . The characteristics of the obtained biaxially stretched film are shown in Table 1.

[Comparative Example 2]
An unstretched film having a film thickness of 12 μm was obtained in the same manner as in Example 2 except that biaxial stretching was not performed. The film thickness was adjusted by the discharge amount during melt extrusion and the rotation speed of the cooling roll. In addition, heat fixation and heat relaxation treatment were performed. The properties of the obtained unstretched film are shown in Table 1.

[Comparative Example 3]
Example 3 except that the mixing ratio of the polyether ether ketone resin as the thermoplastic polyether ketone resin (A) and the polyetherimide resin as the resin component (B) is 40:60 (mass%) A sample was obtained in the same manner, but there were many breaks during film formation, and the sample was not obtained.

  The biaxially stretched film of the present invention is excellent in electrical insulation and heat resistance, and thus exhibits a high dielectric breakdown voltage in a high temperature atmosphere, and is suitable for electrical insulation of moving bodies, particularly as a capacitor film for hybrid vehicles. Can be used.

Claims (8)

  The main component is a thermoplastic polyetherketone resin (A), the resin component (B) having a glass transition temperature (Tg) of 180 ° C. or higher is contained in an amount of 5 to 48% by mass, and the glass transition temperature (Tg) is 145 ° C. or higher. Biaxially stretched film that is less than 180 ° C.   The biaxially stretched film according to claim 1, wherein a dielectric breakdown voltage (BDV23) at 23 ° C is 350 kV / mm or more.   The biaxially stretched film according to claim 1 or 2, wherein a ratio of a breakdown voltage (BDV140) at 140 ° C to a breakdown voltage at 23 ° C (BDV140 / BDV23) is 0.7 or more.   The biaxially stretched film according to any one of claims 1 to 3, wherein the resin component (B) is a polyimide resin.   In each of the longitudinal direction and the transverse direction, the breaking strength at 23 ° C. (breaking strength 23) is 200 MPa or more, and the ratio between the breaking strength at 140 ° C. (breaking strength 140) and the breaking strength at 23 ° C. (breaking strength 140 / breaking strength) The biaxially stretched film according to any one of claims 1 to 4, wherein the strength 23) is 0.7 or more.   The biaxially stretched film according to any one of claims 1 to 5, wherein absolute values of heat shrinkage in the machine direction and transverse direction after heat treatment at a temperature of 150 ° C for 30 minutes are each 1.0% or less.   The biaxially stretched film according to any one of claims 1 to 6, which is used for electrical insulation.   The biaxially stretched film according to claim 7, which is used for a capacitor.