JP2010258944A - Communication module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communication module that stably outputs a communication signal. <P>SOLUTION: A communication module includes: a module mounting member including a piezoelectric oscillator mounting pad and a first integrated circuit element mounting pad; a first integrated circuit element mounted in the first integrated circuit element mounting pad; a piezoelectric oscillator mounted on the piezoelectric oscillator mounting pad, the piezoelectric oscillator including an element mounting member, a piezoelectric vibration element mounted on one principal surface of the element mounting member, a second integrated circuit element mounted on another principal surface of the element mounting member, and a cover member for air-tightly sealing the piezoelectric vibration element; a resin layer provided to cover the piezoelectric oscillator and the first integrated circuit element; and a frequency adjustment write terminal, provided on another principal surface of the module mounting member, for adjusting an oscillation frequency of the piezoelectric oscillator. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a communication module used for an electronic device or the like.

FIG. 13 is a cross-sectional view showing a conventional communication module. As shown in FIG. 13, the conventional communication module 400 mainly includes a module mounting member 410, a piezoelectric oscillator 420, and a first integrated circuit element 430 as an example.
On one main surface of the module mounting member 410, a piezoelectric oscillator mounting pad 411 and a first integrated circuit element mounting pad 412 for mounting the piezoelectric oscillator 420 and the first integrated circuit element 430 are provided.
The module mounting member 410 has a laminated structure, and a wiring pattern (not shown) or the like is provided in the inner layer of the module mounting member 410. With this wiring pattern, the first integrated circuit element mounting pad 412 is connected to the external connection electrode terminal 414 and the piezoelectric oscillator mounting pad 411 provided on the other main surface of the module mounting member 410.
On the piezoelectric oscillator mounting pad 411 and the first integrated circuit element mounting pad 412, the piezoelectric oscillator 420 and the first integrated circuit element 430 are electrically connected through a conductive bonding material 450.
A structure in which a resin layer 440 is formed on the main surface of the module mounting member 410 so as to cover the mounted piezoelectric oscillator 420 and the first integrated circuit element 430 is known (Patent Document 1).
The piezoelectric oscillator 420 is mainly configured by an element mounting member 421, a piezoelectric vibration element 422, a lid member 423, and a second integrated circuit element 424. In the piezoelectric oscillator 420, the piezoelectric vibration element 421 is mounted in the first recessed space K1 formed in the element mounting member 421, and the second integrated circuit element 424 is mounted in the second recessed space K2. It is installed. The first recess space K1 is hermetically sealed by a lid member 423.

JP 2008-252782 A

  However, in the conventional communication module 400, the resin layer 440 is formed on the main surface of the module mounting member 410 so as to cover the piezoelectric oscillator 420, but the resin for forming the resin layer 440 is the piezoelectric oscillator 420. If the resin adheres to the circuit formation surface of the second integrated circuit element 424 and the resin contacts the circuit capacity of the second integrated circuit element 424, the capacity is loaded. It will be. Therefore, the oscillation frequency of the piezoelectric oscillator 420 changes. There has been a problem that the communication signal of the communication module 400 cannot be output due to the fluctuation of the oscillation frequency of the piezoelectric oscillator 420.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the communication module which can output a communication signal stably.

  The communication module of the present invention includes a module mounting member provided with a piezoelectric oscillator mounting pad and a first integrated circuit element mounting pad, a first integrated circuit element mounted on the first integrated circuit element mounting pad, The piezoelectric oscillator mounted on the piezoelectric oscillator mounting pad is mounted on the main surface of the element mounting member and the other main surface of the element mounting member. And a resin layer provided so as to cover the piezoelectric oscillator and the first integrated circuit element, and a lid member for hermetically sealing the integrated circuit element and the piezoelectric vibration element. The other main surface of the module mounting member is provided with a frequency adjusting write terminal for adjusting the oscillation frequency of the piezoelectric oscillator.

  Further, the main surface of the module mounting member is provided with a recess, and the piezoelectric oscillator mounting pad is provided in the recess.

  The main surface of the module mounting member is provided with a recess, the piezoelectric oscillator mounting pad is provided so as to surround the recess, and the second integrated circuit element is accommodated in the recess. It is characterized in that an oscillator is mounted.

  Even if the resin for forming the resin layer enters the second recess space of the piezoelectric oscillator and the resin adheres to the circuit formation surface of the integrated circuit element and the oscillation frequency fluctuates, the communication module of the present invention Since the frequency adjustment write terminal for adjusting the oscillation frequency of the piezoelectric oscillator is provided on the other main surface of the mounting member, the oscillation frequency of the piezoelectric oscillator can be adjusted again. Therefore, the communication module can output a stable communication signal.

  Further, the communication module of the present invention has the piezoelectric oscillator mounted on the piezoelectric oscillator mounting pad provided in the recess, so that the frame of the piezoelectric oscillator is placed in the recess provided in the main surface of the module mounting member. Since a part of the communication module can be installed, the communication module can be thinned.

  In the communication module of the present invention, the main surface of the module mounting member is provided with a recess, and the piezoelectric oscillator is mounted so that the second integrated circuit element is accommodated in the recess. The module can be thinned.

It is a perspective view which shows an example of the communication module which concerns on the 1st Embodiment of this invention. It is AA sectional drawing of FIG. It is a perspective view which shows an example in the state without the resin layer which comprises the communication module which concerns on the 1st Embodiment of this invention. (A) is the perspective view seen from one main surface which shows an example of the module mounting member which comprises the communication module which concerns on the 1st Embodiment of this invention, (b) is the 1st of this invention It is the perspective view seen from the other main surface which shows an example of the module mounting member which comprises the communication module which concerns on embodiment. It is sectional drawing which shows the piezoelectric oscillator which comprises the communication module which concerns on the 1st Embodiment of this invention. It is a perspective view which shows an example of the communication module which concerns on the 2nd Embodiment of this invention. It is BB sectional drawing of FIG. (A) is the perspective view seen from one main surface which shows an example of the module mounting member which comprises the communication module which concerns on the 2nd Embodiment of this invention, (b) is the 2nd of this invention It is the perspective view seen from the other main surface which shows an example of the module mounting member which comprises the communication module which concerns on embodiment. It is a perspective view which shows an example of the communication module which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows CC of FIG. (A) is the perspective view seen from one main surface which shows an example of the module mounting member which comprises the communication module which concerns on the 3rd Embodiment of this invention, (b) is the 3rd of this invention It is the perspective view seen from the other main surface which shows an example of the module mounting member which comprises the communication module which concerns on embodiment. It is sectional drawing which shows the piezoelectric oscillator which comprises the communication module which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the conventional communication module.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described. In addition, the illustrated dimensions are partially exaggerated.

(First embodiment)
FIG. 1 is a perspective view showing an example of a communication module according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a perspective view showing an example of a state in which there is no resin layer constituting the communication module according to the first embodiment of the present invention. FIG. 4A is a perspective view seen from one main surface showing an example of a module mounting member constituting the communication module according to the first embodiment of the present invention, and FIG. It is the perspective view seen from the other main surface which shows an example of the module mounting member which comprises the communication module which concerns on 1st Embodiment. FIG. 5 is a cross-sectional view showing the piezoelectric oscillator constituting the communication module according to the first embodiment.

As shown in FIGS. 1 to 2, the communication module 100 according to the first embodiment of the present invention is mainly composed of a module mounting member 110, a piezoelectric oscillator OS <b> 1, a first integrated circuit element 120, and a resin layer 140. ing.
In this communication module 100, the piezoelectric oscillator OS1 is mounted on the piezoelectric oscillator mounting pad 111 of the module mounting member 110 in which the piezoelectric oscillator mounting pad 111 and the first integrated circuit element mounting pad 112 are provided on one main surface. A first integrated circuit element 120 is mounted on the first integrated circuit element mounting pad 112. A resin layer 140 is provided so as to cover the piezoelectric oscillator OS1 and the first integrated circuit element 120.

The first integrated circuit element 120 shown in FIGS. 1 to 3 includes an RF portion, a baseband portion, and a rewritable storage medium such as a flash memory. The RF performance information is written, and the RF performance in the RF is adjusted based on the written registry information. In this way, the first integrated circuit element 120 outputs a communication signal when an oscillation frequency from a piezoelectric oscillator OS1 described later is input.
The first integrated circuit element 120 is mounted on the first integrated circuit element mounting pad 112 of the module mounting member 110 via a conductive bonding material such as solder.

  As shown in FIG. 5, the piezoelectric oscillator OS1 is mainly configured by an element mounting member SB, a piezoelectric vibration element XT, a lid member RD, and a second integrated circuit element SS. In the piezoelectric oscillator OS1, the piezoelectric vibration element XT is mounted in the first concave space K1 formed in the element mounting member SB, and the second integrated circuit element SS is included in the second concave space K2. It is installed. The first recess space K1 is hermetically sealed by the lid member RD.

As shown in FIG. 5, the piezoelectric vibration element XT is formed by adhering an excitation electrode D1 to a quartz base plate XS, and an alternating voltage from the outside is applied to the quartz base plate XS via the excitation electrode D1. Then, excitation is generated in a predetermined vibration mode and frequency.
The quartz base plate XS is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to external processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode D1 is formed by depositing and forming a metal in a predetermined pattern on both the front and back main surfaces of the crystal element plate XS.
Such a piezoelectric vibration element XT includes a lead electrode extending from the excitation electrode D1 attached to both main surfaces of the piezoelectric vibration element XT and a piezoelectric vibration element mounting pad, which will be described later, formed on the bottom surface in the first recess space K1. The AT is mounted in the recessed space K1 by electrically and mechanically connecting the AT with the conductive adhesive DS.

As shown in FIG. 5, the second integrated circuit element SS is provided with an oscillation circuit or the like for generating an oscillation output from the piezoelectric vibration element XT on the circuit formation surface, and an output signal generated by this oscillation circuit. Is output to the outside of the piezoelectric oscillator OS1 via the module mounting member connection terminal MST, and is used as a reference signal such as a clock signal, for example.
Further, the second integrated circuit element SS is applied with a control voltage corresponding to the ambient temperature to the variable capacitance element to compensate for fluctuations in the oscillation frequency of the oscillation circuit due to temperature changes, and a cubic function generating circuit and a memory element The temperature compensation circuit unit is provided by the unit, and a temperature sensor is connected to the cubic function generation circuit.
This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit.
The second integrated circuit element SS has a conductive bonding material (not shown) such as solder on the integrated circuit element mounting pad ST formed on the substrate part SB1 exposed in the second recessed space K2 of the element mounting member SB. It is mounted through.

As shown in FIG. 5, the element mounting member SB is mainly composed of a substrate part SB1 and frame parts SB2 and SB3.
In the element mounting member SB, a frame portion SB2 is provided on one main surface of the substrate portion SB1, and a recessed space K1 is formed. Further, the element mounting member SB is provided with a frame part SB3 on the other main surface of the substrate part SB1, and a second recessed space K2 is formed.
Two pairs of piezoelectric vibration element mounting pads AT are provided on one main surface of the substrate part SB1 exposed in the first recess space K1.
Module mounting member connection terminals MST are provided at the four corners of the other main surface of the frame portion SB3 of the element mounting member SB.
As shown in FIG. 5, a plurality of second integrated circuit element mounting pads ST and two pairs of piezoelectric vibration element measurement pads are formed on the other main surface of the substrate part SB1 exposed in the second recess space K2. (Not shown) is formed.
The substrate portion SB1 constituting the element mounting member SB is formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics. Further, the substrate part SB1 has a structure in which ceramic materials are laminated.
For example, a seal ring is used for the frame portion SB2. In this case, the frame part SB2 is made of a metal such as 42 alloy or Kovar, and has a frame shape with the center punched out.
The frame portion SB2 is connected to the sealing conductor film HM provided so as to surround the outer periphery of one main surface of the substrate portion SB1 by brazing or the like.

  The lid member RD is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), or the like. Such a lid member RD hermetically seals the recessed space K1 with nitrogen gas or vacuum. Specifically, the lid member RD is placed on the frame portion SB2 of the element mounting member SB in a nitrogen atmosphere or a vacuum atmosphere, and a metal on the surface of the frame portion SB2 and a part of the metal of the lid member RD. Is welded to the frame portion SB2 by applying a predetermined current so as to be welded.

  The conductive adhesive DS contains a conductive powder as a conductive filler in a binder such as a silicone resin. Examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten ( W), platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is used. Yes.

As shown in FIGS. 1 to 3, the electronic component element 130 is, for example, a chip component such as a capacitor, a resistor, or an inductor, a SAW filter, or the like.
The electronic component element 130 is mounted on an electronic component element mounting pad 113 of a module mounting member 110 described later.

The module mounting member 110 is formed of a ceramic material such as glass ceramics, alumina ceramics, mullite ceramics, and the like, and is formed in a flat plate shape.
As shown in FIGS. 2 and 4A, a piezoelectric oscillator mounting pad 111, a first integrated circuit element mounting pad 112, and an electronic component element mounting pad 113 are provided on one main surface of the module mounting member 110. .
As shown in FIG. 2 and FIG. 4B, an external connection electrode terminal 114 and a frequency adjustment write terminal 115 are provided on the other main surface of the module mounting member 110. In addition, a communication signal as the communication module 100 is output from one of the external connection electrode terminals 114.
A wiring pattern (not shown) or the like is provided on the inner layer of the module mounting member 110.
With this wiring pattern, the piezoelectric oscillator mounting pad 111 is provided on the first main surface of the module mounting member 110 and the other main surface of the module mounting member 110. It is connected to the frequency adjusting write terminal 115.
In addition, the first integrated circuit element mounting pad 112 is provided on one main surface of the module mounting member 110 and the other main surface of the module mounting member 110 by this wiring pattern. The external connection electrode terminal 114 is connected.

The frequency adjusting write terminal 115 is used as a terminal for adjusting the oscillation frequency of the piezoelectric oscillator OS1.
As shown in FIG. 2, the frequency adjusting terminal 115 is electrically connected to the piezoelectric oscillator mounting pad 111 via via conductors VD 1 and VD 2 and a wiring pattern M.
The piezoelectric oscillator mounting pad 111 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS1 through a conductive bonding material 160 such as solder.
Therefore, the frequency adjusting write terminal 115 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS1.

  When the module mounting member 110 is made of glass ceramics, the piezoelectric oscillator mounting pad 111 and the first oscillator are mounted on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a predetermined ceramic material powder. A conductive paste made of, for example, Ag or Cu, which becomes the integrated circuit element mounting pad 112, the external connection electrode terminal 114, the frequency adjusting write terminal 115, etc., is punched in advance in the ceramic green sheet. A conductor paste to be a via conductor is applied to the through-hole previously formed by well-known screen printing, and a plurality of these are laminated, press-molded, and then fired at a high temperature.

The resin layer 140 is formed so as to cover the entire surface of the first integrated circuit element 120, the piezoelectric oscillator OS1, and the electronic component element 130 mounted on the module mounting member 110.
The resin layer 140 is formed, for example, by vacuum printing a mixture of an epoxy resin and a curing agent.

The conductive layer 150 is made of a radio wave shielding material, and is formed by evaporating an organic solvent by performing a heat treatment after applying the radio wave shielding material to the main surface of the resin layer 140.
The conductive layer 150 can prevent electromagnetic waves from entering the circuit wiring constituting the oscillation circuit and the amplification circuit in the first integrated circuit element 120, and can stabilize the operation of the communication module 100. .
In addition, the radio wave shielding material causes a reduction reaction by, for example, throwing a metal ion solution of silver (Ag), copper (Cu), nickel (Ni), palladium (Pd) into hydrogen gas or phosphorus, After that, the reaction is promoted by heating by combustion, and a metal colloid is prepared by using a method in which the generated metal colloid is received in a liquid dispersion medium or a method in which the metal ion solution is reduced in the liquid dispersion medium. It is formed by dispersing in an epoxy together with an organic solvent.
Further, it is possible to form a shield structure suitable for the oscillation frequency band in the communication module 100 by utilizing the fact that the corresponding frequency band of the radio wave shielding material varies depending on the type of colloidal metal of the radio wave shielding material.

  According to the communication module 100 according to the first embodiment of the present invention, the resin for forming the resin layer 140 enters the second recessed space K2 of the piezoelectric oscillator OS1, and the circuit of the second integrated circuit element SS. Even if the resin adheres to the forming surface and the oscillation frequency varies, the other main surface of the module mounting member 110 is provided with the frequency adjusting write terminal 115 for adjusting the oscillation frequency of the piezoelectric oscillator OS1. The oscillation frequency of the piezoelectric oscillator OS1 can be adjusted again. Therefore, the communication module 100 can output a stable communication signal.

(Second Embodiment)
Next, a communication module according to the second embodiment of the present invention will be described.
FIG. 6 is a perspective view showing an example of a communication module according to the second embodiment of the present invention. 7 is a cross-sectional view taken along line BB in FIG. Fig.8 (a) is the perspective view seen from one main surface which shows an example of the module mounting member which comprises the communication module which concerns on the 2nd Embodiment of this invention, FIG.8 (b) is this invention. It is the perspective view seen from the other main surface which shows an example of the module mounting member which comprises the communication module which concerns on 2nd Embodiment. In addition, the illustrated dimensions are partially exaggerated.
The communication module 200 according to the second embodiment of the present invention is mounted such that a part of the frame portion SB2 of the piezoelectric oscillator OS1 enters a recess 216 provided on the main surface of the module mounting member 210. This is different from the first embodiment.

In the communication module 200, the piezoelectric oscillator OS 1 is mounted on the piezoelectric oscillator mounting pad 211 provided on the bottom surface of the recess 216 of the module mounting member 210, and the first surface provided on the main surface of the module mounting member 210. The first integrated circuit element 120 is mounted on the integrated circuit element mounting pad 212.
A resin layer 140 is provided so as to cover the piezoelectric oscillator OS1 and the first integrated circuit element 120.

The module mounting member 210 is formed of a ceramic material such as glass ceramics, alumina ceramics, mullite ceramics, and the like, and is formed in a flat plate shape.
As shown in FIG. 7 and FIG. 8A, a recess 216 is provided on one main surface of the module mounting member 210, and a piezoelectric oscillator mounting pad 211 is provided on the bottom of the recess 216. As shown in FIGS. 7 and 8A, the first integrated circuit element mounting pad 212 and the electronic component element mounting pad 213 are provided on one main surface of the module mounting member 210.
As shown in FIG. 7 and FIG. 8B, an external connection electrode terminal 214 and a frequency adjustment write terminal 215 are provided on the other main surface of the module mounting member 210. A communication signal as the communication module 200 is output from one of the external connection electrode terminals 214.
A wiring pattern (not shown) or the like is provided on the inner layer of the module mounting member 210.
Due to this wiring pattern, the piezoelectric oscillator mounting pad 211 is provided on the first main surface of the module mounting member 210 and the other main surface of the module mounting member 210. It is connected to the frequency adjusting write terminal 215.
Also, with this wiring pattern, the first integrated circuit element mounting pad 212 is provided on the piezoelectric oscillator mounting pad 211 provided on one main surface of the module mounting member 210 or the other main surface of the module mounting member 210. The external connection electrode terminal 214 is connected.

The frequency adjusting write terminal 215 is used as a terminal for adjusting the oscillation frequency of the piezoelectric oscillator OS.
As shown in FIG. 8, the frequency adjusting terminal 215 is electrically connected to the piezoelectric oscillator mounting pad 211 via the via conductor VD3 and the wiring pattern M.
The piezoelectric oscillator mounting pad 211 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS1 via a conductive bonding material 160 such as solder.
Therefore, the frequency adjusting write terminal 215 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS1.

Thus, even if it comprises the communication module 200 which concerns on the 2nd Embodiment of this invention, there exists an effect similar to 1st Embodiment.
Further, a recess 216 is provided on the main surface of the module mounting member 210, and the piezoelectric oscillator OS 1 is mounted on the piezoelectric oscillator mounting pad 211 provided in the recess 216, whereby the module mounting member 210. The communication module 200 can be thinned because the frame SB2 of the piezoelectric oscillator OS1 can be mounted so as to enter the recess 216 provided on the main surface.

(Third embodiment)
Next, a communication module according to the third embodiment of the present invention will be described.
FIG. 9 is a perspective view showing an example of a communication module according to the third embodiment of the present invention. 10 is a cross-sectional view taken along the line CC of FIG. FIG. 11A is a perspective view seen from one main surface showing an example of a module mounting member constituting a communication module according to the third embodiment of the present invention, and FIG. It is the perspective view seen from the other main surface which shows an example of the module mounting member which comprises the communication module which concerns on 3rd Embodiment. FIG. 12 is a sectional view showing a piezoelectric oscillator constituting a communication module according to the third embodiment of the present invention. In addition, the illustrated dimensions are partially exaggerated.
The communication module 300 according to the third embodiment of the present invention is not provided with the frame portion SB3 of the element mounting member SB of the piezoelectric oscillator OS2, but is connected to the module mounting member at the four corners of the other main surface of the substrate portion SB1. The terminal MST is provided, and the second integrated circuit element SS mounted on the piezoelectric oscillator OS2 is mounted so as to be accommodated in the recess 316 provided on the main surface of the module mounting member 310. Different from the first embodiment.

The communication module 300 is provided on the main surface of the module mounting member 310 so as to surround the recess 316 so that the second integrated circuit element SS is accommodated in the recess 316 of the module mounting member 310. The piezoelectric oscillator OS2 is mounted on the piezoelectric oscillator mounting pad 311. Further, the first integrated circuit element 120 is mounted on the first integrated circuit element mounting pad 312 provided on the main surface of the module mounting member 310.
A resin layer 140 is provided so as to cover the piezoelectric oscillator OS2 and the first integrated circuit element 120.

As shown in FIG. 12, the element mounting member SB of the piezoelectric oscillator OS2 is mainly composed of a substrate part SB1 and a frame part SB2.
In the element mounting member SB, a frame portion SB2 is provided on one main surface of the substrate portion SB1, and a first recess space K1 is formed.
On one main surface of the substrate part SB1 exposed in the first recess space K1, two pairs of piezoelectric vibration element mounting pads AT for mounting the piezoelectric vibration elements XT are provided.
Module mounting member connection terminals MST are provided at the four corners of the other main surface of the substrate portion SB1 of the element mounting member SB.
As shown in FIG. 12, a plurality of second integrated circuit elements for mounting a second integrated circuit element SS on the other main surface of the board portion SB1 inside the module mounting member connection terminal MST. A mounting pad ST and a pair of piezoelectric vibration element measurement pads (not shown) are formed.
The substrate portion SB1 constituting the element mounting member SB is formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics. Further, the substrate part SB1 has a structure in which ceramic materials are laminated.
For example, a seal ring is used for the frame portion SB2. In this case, the frame part SB2 is made of a metal such as 42 alloy or Kovar, and has a frame shape with the center punched out.
The frame portion SB2 is connected to the sealing conductor film HM provided so as to surround the outer periphery of one main surface of the substrate portion SB1 by brazing or the like.

The module mounting member 310 is made of a ceramic material such as glass ceramics, alumina ceramics, mullite ceramics, etc., and is formed in a flat plate shape.
As shown in FIGS. 10 and 11A, a recess 316 is provided on one main surface of the module mounting member 310, and the recess 316 accommodates the second integrated circuit element SS. . Further, as shown in FIG. 11A, a piezoelectric oscillator mounting pad 311 is provided on one main surface of the module mounting member 310 so as to surround the recess 316.
As shown in FIGS. 10 and 11A, the first integrated circuit element mounting pad 312 and the electronic component element mounting pad 313 are provided on one main surface of the module mounting member 310.
As shown in FIGS. 10 and 11B, the other main surface of the module mounting member 310 is provided with an external connection electrode terminal 314 and a frequency adjustment write terminal 315. In addition, a communication signal as the communication module 300 is output from one of the external connection electrode terminals 314.
A wiring pattern (not shown) or the like is provided on the inner layer of the module mounting member 310.
Due to this wiring pattern, the piezoelectric oscillator mounting pad 311 is provided on the first integrated circuit element mounting pad 312 provided on one main surface of the module mounting member 310 or the other main surface of the module mounting member 310. It is connected to a frequency adjusting write terminal 315.
Also, with this wiring pattern, the first integrated circuit element mounting pad 312 is provided on the piezoelectric oscillator mounting pad 311 provided on one main surface of the module mounting member 310 or the other main surface of the module mounting member 310. The external connection electrode terminal 314 is connected.

The frequency adjusting write terminal 315 is used as a terminal for adjusting the oscillation frequency of the piezoelectric oscillator OS2.
As shown in FIG. 10, the frequency adjusting terminal 315 is electrically connected to the piezoelectric oscillator mounting pad 311 via via conductors VD 1 and VD 2 and a wiring pattern M.
The piezoelectric oscillator mounting pad 311 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS2 via a conductive bonding material 160 such as solder.
Therefore, the frequency adjusting write terminal 315 is electrically connected to the module mounting member connection terminal MTS of the piezoelectric oscillator OS2.

Thus, even if it comprises the communication module 300 which concerns on the 3rd Embodiment of this invention, there exists an effect similar to 1st Embodiment.
In addition, a recess 316 is provided on the main surface of the module mounting member 310, and the piezoelectric oscillator OS2 is mounted in the recess 316 so that the second integrated circuit element SS is accommodated. The module 300 can be thinned.

In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, the case where quartz is used as the piezoelectric material constituting the piezoelectric vibration element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element may be used.

In the above-described embodiment, the case where the seal ring is used for the frame portion has been described. However, it may be formed of a ceramic material in the same manner as the substrate portion.
In this case, an annular sealing conductor pattern is formed on the entire circumference of the opening side top surface of the frame portion, and the lid member is arranged and joined on the sealing conductor pattern.
In this case, the lid member is provided with a sealing member at a location facing a sealing conductor pattern provided so as to surround the recessed space of the element mounting member.

110, 210, 310 ... module mounting member 111, 211, 311 ... piezoelectric oscillator mounting pad 112, 212, 312 ... first integrated circuit element mounting pad 113, 213, 313 ... electronic component element Mounting pads 114, 214, 314 ... External connection electrode terminals 115, 215, 315 ... Frequency adjustment write terminals 216, 316 ... Recessed portion 120 ... First integrated circuit element 130 ... -Electronic component element 140 ... Resin layer 150 ... Conductor layer 160 ... Conductive bonding material 100, 200, 300 ... Communication module OS1, OS2 ... Piezoelectric oscillator SB ... Element mounting member SB1 ... Substrate part SB2, SB3 ... Frame part K1 ... First recess space HM ... Conducting conductive film AT ... Piezoelectric vibration element mounting pad MT ... Connection terminal for module mounting member ST ... Second integrated circuit element mounting pad K2 ... Second recess space XT ... Piezoelectric vibration element XS ... Quartz element plate D1 ... For excitation Electrode RD ... Lid member SS ... Second integrated circuit element DS ... Conductive adhesive

Claims (3)

A module mounting member provided with a piezoelectric oscillator mounting pad and a first integrated circuit element mounting pad;
A first integrated circuit element mounted on the first integrated circuit element mounting pad;
A piezoelectric oscillator mounted on the piezoelectric oscillator mounting pad, mounted on an element mounting member, a piezoelectric vibration element mounted on one main surface of the element mounting member, and the other main surface of the element mounting member A piezoelectric oscillator comprising: a second integrated circuit element having a lid member for hermetically sealing the piezoelectric vibration element;
A resin layer provided to cover the piezoelectric oscillator and the first integrated circuit element;
A communication module comprising a frequency adjusting write terminal for adjusting an oscillation frequency of the piezoelectric oscillator on the other main surface of the module mounting member.   The communication module according to claim 1, wherein a recess is provided in a main surface of the module mounting member, and the piezoelectric oscillator mounting pad is provided in the recess.   The main surface of the module mounting member is provided with a recess, the piezoelectric oscillator mounting pad is provided so as to surround the recess, and the piezoelectric oscillator is accommodated in the recess. The communication module according to claim 1, wherein the communication module is mounted.

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