JP2007235289A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator outputting a predetermined frequency signal stably by controlling conduction of heat generated from an integrated circuit element to a piezoelectric oscillation element. <P>SOLUTION: A first package body where a piezoelectric oscillation element mounted in a first space section is connected electrically with an electrode terminal for connecting a second package body, and a second package body where a piezoelectric oscillation element arranged in a second space section is connected electrically with an electrode terminal for connecting a first package body, are integrated by conduction bonding the first package body connection terminal and the second package body connection terminal to produce a piezoelectric oscillator. An annular first metal layer is formed on the other major surface of the first package body, a second metal layer is formed oppositely to the first metal layer on the other major surface of the second package body, and a third space is formed by the bonding material of the first and second metal layers where the interior of the third space section is vacuum. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator that is one of electronic components mounted in an electronic device, and more particularly to a piezoelectric oscillator in which an unnecessary change in output signal frequency is small when used as an electronic component.

  Conventionally, in an electronic device such as a portable communication device, a piezoelectric oscillator is mounted as one of electronic components and used as a reference signal generation source or a timing device.

  An example of such a conventional piezoelectric oscillator is illustrated in FIGS. The first package body 90 constituting the piezoelectric oscillator 100 has a substantially flat outer shape, and a concave first space portion 92 is formed on one main surface of the insulating first base 91. In the first space 92, a piezoelectric vibration element 93 made of quartz is mounted. The piezoelectric vibration element 93 is a second package body connection electrode formed on the other main surface of the first base 91. The first space portion of the first side wall portion 91a that is electrically connected to the terminal 94 and the lid body 95 is a part of the structure portion of the first base 91 that surrounds the first space portion 92. The first space portion 92 is hermetically sealed by being arranged and fixed to the end surface on the 92 opening side so as to close the opening portion of the first space portion 92.

  Further, the second package body 80 constituting the piezoelectric oscillator 100 has a substantially flat outer shape, has a main surface size comparable to the main surface size of the first base, and has an insulating property. A concave second space portion 82 is formed on one main surface of the second base 81, and an oscillation circuit for exciting at least the piezoelectric vibration element is formed in the second space portion 82. The integrated circuit element 83 is disposed, and the integrated circuit element 83 is a second space of the second side wall portion 81a that is a part of the structural portion of the second base 81 that surrounds the second space portion 82. 52 is electrically connected to the external connection electrode terminal 84 formed at the corner of the opening side end face, and the integrated circuit element 83 is further formed in the first corner formed on the other four main corners of the second base 81. The package body connection electrode terminal 85 is also electrically connected.

  A second package body connection terminal 94 formed on the first package body 90 and a first package body connection terminal 85 formed on the second package body 80 are made of a conductive adhesive, solder, or the like. The piezoelectric oscillator 100 is formed by mechanically and electrically connecting and fixing predetermined electrode terminals with a conductive bonding material 86.

Regarding the piezoelectric oscillator as described above, the following prior art documents are disclosed.
JP 2000-244244 A JP 2001-36343 A JP 2004-129090 A

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  However, in the piezoelectric oscillator having the above-described form, when the piezoelectric oscillator is operated, heat generated from the integrated circuit element mounted in the second package body passes through the second base and the first base. Therefore, the heat is transmitted to the piezoelectric vibration element mounted in the first package body, and the heat may cause unnecessary fluctuations in the vibration frequency of the piezoelectric vibration element due to the temperature characteristics of the piezoelectric vibration element. . In particular, the influence of heat conducted from a structural portion having a short distance from the integrated circuit element is large.

  Further, as the size of the piezoelectric oscillator is further reduced, the volume of the integrated circuit element occupying the volume of the second package body is increased, and therefore, the heat generated by the integrated circuit element tends to be easily transmitted to other members constituting the piezoelectric oscillator. There is.

  The present invention has been devised in order to solve the above-mentioned problems, and its purpose is to stabilize a predetermined frequency signal by suppressing conduction of heat generated from the integrated circuit element to the piezoelectric vibration element. The object is to provide a piezoelectric oscillator for output.

In one embodiment of the piezoelectric oscillator according to the present invention, the outer shape is a substantially flat plate shape, and a concave first space is formed on one main surface of the insulating first base. A piezoelectric vibration element is mounted in the space, and this piezoelectric vibration element is electrically connected to a second package body connection electrode terminal formed on the other main surface of the first base, and the lid is The first space part opening side end surface of the first side wall part surrounding the first space part is disposed and fixed in a form of closing the first space part opening part, and the first space is provided by the lid body. A first package body hermetically sealing the part;
A concave second space portion is formed on one main surface of the insulating second base body having a substantially flat outer shape, and at least an oscillation circuit is formed in the second space portion. The integrated circuit element is electrically connected to the electrode terminal for external connection formed at the corner of the second space opening side end surface of the second side wall surrounding the second space. And the integrated circuit element further includes a second package body electrically connected to the first package body connection electrode terminals formed at the four corners of the other main surface of the second substrate.
In the piezoelectric oscillator formed integrally by mechanically and electrically connecting and fixing the first package connection terminal and the second package connection terminal,
At least one annular first metal layer is formed on the other main surface of the first package body other than the region where the second package body connection electrode terminal is formed, and The other main surface of the second package body other than the region where the first package body connection electrode terminal is formed has the same shape as the first metal layer at a position facing the first metal layer. The second metal layer is formed, and the first metal layer and the second metal layer are mechanically joined to each other by a bonding material, and the first metal layer and the second metal layer are joined together. And a third space is formed in the ring surrounded by the bonding material, and the inside of the third space is vacuum.

In another form of the piezoelectric oscillator according to the present invention, the outer shape is a substantially flat plate shape, and a concave first space is formed on one main surface of the insulating first base, A piezoelectric vibration element is mounted in the first space, and the piezoelectric vibration element is a first electrode terminal for electrical connection with the second package body formed on the other main surface of the first base. The lid is disposed and fixed in such a manner as to close the first space portion opening on the first space portion opening side end surface of the first side wall portion surrounding the first space portion. A first package body hermetically sealing the first space portion;
A concave second space portion is formed on one main surface of the insulating second base body having a substantially flat outer shape, and at least an oscillation circuit is formed in the second space portion. The integrated circuit element is electrically connected to the first package body formed at the corner of the second space portion opening side end surface of the second side wall portion surrounding the second space portion. The integrated circuit element is also electrically connected to external connection electrode terminals formed at the four corners of the other main surface of the second substrate. A second package body,
In the piezoelectric oscillator formed integrally by mechanically and electrically connecting the first electrode terminal and the second electrode terminal,
At least one annular first metal layer is formed on the other main surface of the first package body other than the region where the first electrode terminal is formed,
Between the first package body and the second package body, third electrode terminals for connecting the first package body are formed at four corners of one rectangular main surface, and the first package body is formed. A second metal layer having the same shape as that of the first metal layer is formed at a position on the main surface opposite to the metal layer, and the second package body connection is provided at the four corners of the other rectangular main surface. A fourth electrode terminal is formed, and an insulating substrate having a structure in which each third electrode terminal and the fourth electrode terminal facing each other are electrically connected is disposed.
Each opposing first electrode terminal and third electrode terminal, and each opposing second electrode terminal and fourth electrode terminal are mechanically and electrically connected and fixed by a conductive bonding material. In addition, the first metal layer and the second metal layer are mechanically bonded to each other by a bonding material, and the third metal is surrounded by the first metal layer, the second metal layer, and the bonding material. The space portion is formed, and the inside of the third space portion is a vacuum.

  According to the piezoelectric oscillator in accordance with the present invention, the first annular body is provided between the first package body and the second package body constituting the piezoelectric oscillator or between the first package body and the insulating substrate. By the metal layer, the annular second metal layer, and the bonding material, a third space part that hermetically seals the space inside the ring is formed, and the inside of the third space part is vacuum, Heat generated from the integrated circuit element mounted in the second package body is conducted to the first package body and the piezoelectric vibration element mounted in the first package body by the heat insulating action of the vacuum in the third space. As a piezoelectric oscillator, it is possible to stably output a predetermined frequency signal. In particular, since the third space portion is formed between the shortest distance between the integrated circuit element and the piezoelectric vibration element, heat conduction can be further suppressed. In addition, the formation of the third space portion having a vacuum inside can be formed regardless of the size of the piezoelectric oscillator. Therefore, even when the size of the piezoelectric oscillator is reduced, the third space in which the inside is vacuum is formed. It is possible to form the part and achieve the above-described action.

  Moreover, in one form of the piezoelectric oscillator according to the present invention, the first metal layer formed on the first package body and the second metal layer formed on the second package body are combined with the third space portion. Since bonding is performed via a bonding material to form, the bonding strength between the first package body and the second package body is significantly higher than that of the conventional piezoelectric oscillator of the same form, and the piezoelectric oscillator as a whole The rigidity can be increased.

  Therefore, according to the present invention, there is an effect that it is possible to provide a piezoelectric oscillator in which the frequency of the output signal is highly stable, can cope with downsizing, and has high rigidity as a component.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view showing an embodiment of a piezoelectric oscillator according to the present invention. FIG. 2 is a cross-sectional view of the piezoelectric oscillator shown in FIG. 1 after being assembled and cut along a virtual cutting line A1-A2 shown in FIG. FIG. 3 is a plan view showing a first package body and a second package body constituting the piezoelectric oscillator according to the present invention, and FIG. 3A shows the first package body constituting the first package body. It is the top view shown from the other main surface side of the 1st substrate, and (b) is the plane which showed the 2nd package body from the other main surface side of the 2nd substrate which constitutes the 2nd package body. FIG. FIG. 5 is a cross-sectional view showing another embodiment of the piezoelectric oscillator according to the present invention. In addition, the structural components which attached | subjected the same code | symbol in each figure have shown the same thing. In each of the drawings, a part of the structure is not shown, and some dimensions are exaggerated for clarity. In particular, the thickness dimension in each figure is exaggerated.

  That is, the piezoelectric oscillator 30 shown in FIGS. 1 to 3 generally has a form in which the first package body 10 and the second package body 20 are overlapped and joined. The first package body 10 has a substantially flat outer shape, and has a concave first shape on one main surface of the first base 11 formed of an insulating material such as glass-ceramic or alumina ceramic. The space portion 12 is formed.

  In the first space portion 12, a piezoelectric vibration element 13 using quartz as a piezoelectric material as a main structural material is mounted, and this piezoelectric vibration element 13 is formed on the other main surface of the first base 11. , And electrically connected to the second package connection electrode terminal 14 having functions such as an input terminal and an output terminal of the piezoelectric vibration element, or a ground terminal, and is made of a metal plate such as 42 alloy, Kovar, phosphor bronze or the like. The lid 15 has an opening of the first space portion 12 on an end surface on the opening side of the first space portion 12 of the first side wall portion 11a constituting a part of the first base 11 surrounding the first space portion 12. The first package body 10 is configured in such a manner that the first space portion 12 is hermetically sealed by being arranged and fixed in such a manner as to close the portion.

  Further, the other main surface of the first base body 11 constituting the first package body 10 is annularly surrounded on the main surface other than the region where the second package body connection electrode terminals 14 are formed. The first metal layer 16 in the form of a band is formed. The first metal layer 16 is formed by forming a metallized layer made of tungsten (W), molybdenum (Mo) or the like on the other main surface of the first base, and forming a nickel (Ni) layer on the metallized layer. A stacked structure is formed in which a gold (Au) layer is formed on the Ni layer.

  In addition, when the member which comprises the 1st base | substrate 11 consists of ceramic materials, such as glass-ceramics, for example on the surface etc. of the ceramic green sheet obtained by adding and mixing a suitable organic solvent etc. to ceramic material powder A conductor paste to be a wiring conductor is applied by well-known screen printing or the like, and a plurality of these are laminated, press-molded, and then fired at a high temperature.

  In the first embodiment, the piezoelectric vibration element 13 housed in the first package body 10 uses quartz as its main structural material. The piezoelectric vibration element 13 forms a rectangular flat plate-shaped crystal element plate by applying an outer shape process to a crystal piece cut out from the artificial crystal lens at a predetermined cut angle, and a pair of crystal elements on both main surfaces of the crystal element plate. An excitation electrode (not shown) is attached. When a fluctuation voltage from the outside is applied to the crystal base plate via the pair of excitation electrodes, the crystal base plate vibrates in a predetermined vibration mode and frequency. The piezoelectric vibration element 13 is electrically connected to a piezoelectric vibration element connection electrode pad formed on the inner bottom surface of the first space portion 12 through a conductive adhesive with a pair of excitation electrodes formed on both main surfaces thereof. And it is mounted by mechanically connecting and fixing.

  The second package body 20 has a substantially flat plate-like outer shape, and is recessed on one main surface of the second base 21 formed of an insulating material such as a ceramic material such as glass-ceramic or alumina ceramic. A second space 22 having a shape is formed. An integrated circuit element 23 in which at least an oscillation circuit is formed is disposed in the second space 22, and the integrated circuit element 23 constitutes a part of the second base 21 that surrounds the second space 22. The second side wall portion 21a is electrically connected to the external connection electrode terminal 24 formed at the corner of the end surface on the second space portion opening side, and the integrated circuit element 23 is connected to the other end of the second base body 21. The first package body connection electrode terminals 25 formed at the four corners of the main surface are also electrically connected.

  Further, on the other main surface of the second base 21 constituting the second package body 20, the first metal layer 16 formed on the other main surface of the first base is opposite to the first base layer 21. A second metal layer 26 having the same shape as the first metal layer 16 is formed at the position where the first metal layer 16 is formed. The second metal layer 26 is formed by forming a metallized layer made of tungsten (W), molybdenum (Mo) or the like on the other main surface of the second substrate, and forming a nickel (Ni) layer on the metallized layer. A stacked structure is formed in which a gold (Au) layer is formed on the Ni layer.

  As the integrated circuit element 23, for example, a plurality of connection pads corresponding to an integrated circuit element connection electrode pad formed on the bottom surface of the second space 22 on the mounting surface of the integrated circuit element 23 are provided. In order to compensate the temperature characteristics of the temperature sensing element (thermistor) for detecting the ambient temperature state and the piezoelectric vibration element 13 on the integrated circuit forming surface. A memory for storing the temperature compensation data, a temperature compensation circuit for correcting the vibration characteristics of the piezoelectric vibration element 13 according to the temperature change based on the temperature compensation data, and an oscillation connected to the temperature compensation circuit to generate a predetermined oscillation output An oscillation output signal generated by this oscillation circuit is output to the outside of the piezoelectric oscillator, and then, for example, a clock signal in an electronic device equipped with the piezoelectric oscillator And thus it is utilized as a reference signal.

  The first package body 10 and the second package body 20 having the above-described form are connected to the second package body connection electrode terminal 14 formed on the first package body 10 and the second package body 20. The first package body connection electrode terminal 25 thus formed is mechanically and electrically connected and fixed by the conductive bonding material 31 such as a conductive adhesive or solder, and the first package body connection electrode terminal 25 is formed on the first package body 10. The first metal layer 16 and the second metal layer 26 formed on the second package body 20 are mechanically connected and fixed by the bonding material 32 formed over the entire circumference of the metal layer, thereby the piezoelectric oscillator 30. Is configured.

  The first metal layer 16 formed on the first package body 10 and the second metal layer 26 formed on the second package body 20 are mechanically connected and fixed by the bonding material 32, whereby the first metal layer 16 is formed. Between the package body 10 and the second package body 20, a third space portion 33 which is surrounded and sealed by the first metal layer 16, the second metal layer 26 and the bonding material 32 is formed. . Further, the inside of the third space 33 is in a vacuum. As described above, as a method of evacuating the inside of the third space portion, it is possible to perform the step of connecting and fixing the first metal layer 16 and the second metal layer 26 through the bonding material 32 in a vacuum. Become.

  Another embodiment of the piezoelectric oscillator according to the present invention will be described with reference to FIG. That is, the piezoelectric oscillator 40 shown in FIG. 4 generally has a form in which the first package body 10 and the second package body 50 are overlapped and joined. The first package body 10 has a substantially flat outer shape and is recessed on one main surface of the first base 11 formed of an insulating material such as a ceramic material such as glass-ceramic or alumina ceramic. A first space 12 having a shape is formed.

  In the first space portion 12, a piezoelectric vibration element 13 using quartz as a piezoelectric material which is a main structural material is mounted, and this piezoelectric vibration element 13 is formed on the other main surface of the first base 11. It is electrically connected to the first electrode terminal 44 for electrical connection with the second package having the functions of the input terminal and the output terminal of the piezoelectric vibration element and the function of the ground terminal of the first package body. The lid 15 made of a metal plate such as 42 alloy, Kovar, phosphor bronze or the like has a first side wall portion 11a constituting a part of the first base 11 surrounding the first space portion 12. A first package body 10 having a shape in which the first space portion 12 is hermetically sealed is arranged and fixed to the end surface on the opening side of the space portion 12 so as to close the opening portion of the first space portion 12. .

  Further, the other main surface of the first base 11 constituting the first package body 10 has a band-shaped second shape in which the main surface other than the region where the first electrode terminals 44 are formed is annularly enclosed. 1 metal layer 16 is formed. The first metal layer 16 is formed by forming a metallized layer made of tungsten (W), molybdenum (Mo) or the like on the other main surface of the first base 11, and a nickel (Ni) layer on the metallized layer. And a stacked structure in which a gold (Au) layer is formed on the Ni layer.

  In addition, when the member which comprises the 1st base | substrate 11 consists of ceramic materials, such as glass-ceramics, for example on the surface etc. of the ceramic green sheet obtained by adding and mixing a suitable organic solvent etc. to ceramic material powder A conductor paste to be a wiring conductor is applied by well-known screen printing or the like, and a plurality of these are laminated, press-molded, and then fired at a high temperature.

  In the second embodiment, the piezoelectric vibration element 13 housed in the first package body 10 uses quartz as its main structural material. The piezoelectric vibration element 13 forms a rectangular flat plate-shaped crystal element plate by applying an outer shape process to a crystal piece cut out from the artificial crystal lens at a predetermined cut angle, and a pair of crystal elements on both main surfaces of the crystal element plate. An excitation electrode (not shown) is attached. When a fluctuation voltage from the outside is applied to the crystal base plate via the pair of excitation electrodes, the crystal base plate vibrates in a predetermined vibration mode and frequency. The piezoelectric vibration element 13 is configured such that a pair of excitation electrodes formed on both main surfaces thereof are electrically connected to a piezoelectric vibration element connection electrode pad formed on the inner bottom surface of the first space 12 via a conductive adhesive. It is mounted by connecting and fixing mechanically and mechanically.

  The second package body 50 has a substantially flat outer shape, and has a concave second shape on one main surface of the second base 51 formed of an insulating material such as glass-ceramic or alumina ceramic. The space portion 52 is formed. An integrated circuit element 53 in which at least an oscillation circuit is formed is disposed in the second space 52, and the integrated circuit element 53 constitutes a part of the second base 51 that surrounds the second space 52. Electrically connected to the second electrode terminal 54 for electrical connection with the first package body formed at the corner of the second space portion opening side end surface of the second side wall 51a The integrated circuit element 53 is also electrically connected to external connection electrode terminals 55 formed at the four corners of the other main surface of the second base 51.

  The integrated circuit element 53 includes, for example, a plurality of connection pads corresponding to the integrated circuit element connection electrode pads formed on the bottom surface of the second space 52 on the mounting surface of the integrated circuit element 53. In order to compensate the temperature characteristics of the temperature sensing element (thermistor) for detecting the ambient temperature state and the piezoelectric vibration element 13 on the integrated circuit forming surface. A memory for storing the temperature compensation data, a temperature compensation circuit for correcting the vibration characteristics of the piezoelectric vibration element 13 according to the temperature change based on the temperature compensation data, and an oscillation connected to the temperature compensation circuit to generate a predetermined oscillation output An oscillation output signal generated by this oscillation circuit is output to the outside of the piezoelectric oscillator, and then, for example, a clock signal in an electronic device equipped with the piezoelectric oscillator And thus it is utilized as a reference signal.

  Between the first package body 10 and the second package body 50, third electrode terminals 61 for connecting the first package body are formed at four corners of one rectangular main surface, and the above-mentioned A second metal layer 62 having the same shape as that of the first metal layer 16 is formed at a position opposite to one of the main surfaces facing the first metal layer 16, and the other rectangular main surface is formed. 4th electrode terminal 63 for the 2nd package body connection is formed in four corners of this, and external shape is a substantially flat plate shape, and resin, such as glass cloth base epoxy resin, polycarbonate, epoxy resin, polyimide resin, etc. An insulating substrate 60 formed of an insulating material such as a material or a ceramic material such as glass-ceramic or alumina ceramic is disposed. Each of the third electrode terminal 61 and the fourth electrode terminal 63 facing each other with the insulating substrate body interposed therebetween is electrically connected by a via hole or the like penetrating the insulating substrate 60 in the thickness direction. The second metal layer 62 is formed by forming a metallized layer made of tungsten (W) or molybdenum (Mo) on one main surface of the insulating substrate 60, and forming a nickel (Ni) layer on the metallized layer. A stacked structure is formed in which a gold (Au) layer is formed on the Ni layer.

  The first package body 10, the insulating substrate 60, and the second package body 50 having the above-described configuration are formed on the first electrode terminal 44 formed on the first package body 10 and the third substrate formed on the insulating substrate 60. The electrode terminal 61, the second electrode terminal 54 formed on the second package body, and the fourth electrode terminal 63 formed on the insulating substrate 60 are connected to a conductive bonding material such as a conductive adhesive or solder. 31 is mechanically and electrically connected and fixed, and the first metal layer 16 formed on the first package body 10 and the second metal layer 62 formed on the insulating substrate 60 are all around the metal layer. The piezoelectric oscillator 40 is configured by being mechanically connected and fixed by the bonding material 32 formed over the entire area.

  Also in the piezoelectric oscillator disclosed in the second embodiment, the first metal layer 16 formed on the first package body 10 and the second metal layer 62 formed on the insulating substrate 60 are mechanically bonded by the bonding material 32. Thus, the third space enclosed and sealed by the first metal layer 16, the second metal layer 62, and the bonding material 32 is provided between the first package body 10 and the insulating substrate 60. A portion 64 is formed. In addition, the inside of the third space 64 is in a vacuum. As described above, as a method of evacuating the inside of the third space portion 64, the step of connecting and fixing the first metal layer 16 and the second metal layer 62 through the bonding material 32 is performed in a vacuum. It becomes possible.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the piezoelectric oscillators disclosed in the first and second embodiments, the external shape of the third space portions 33 and 72 formed by surrounding and sealing with the first metal layer, the second metal layer, and the bonding material is substantially cross-shaped. However, the present invention does not limit the external shape of the third space portion to the present embodiment, and any other rectangular shape or circle may be used as long as the same effect as the present invention is achieved. What formed the 3rd space part which has a shape or a polygonal outer ring shape may be sufficient. Further, a plurality of the third space portions as described above may be formed between the first package body and the second package body, or between the first package body and the insulating substrate.

FIG. 1 is an exploded perspective view showing an embodiment of a piezoelectric oscillator according to the present invention. FIG. 2 is a cross-sectional view of the piezoelectric oscillator shown in FIG. 1 after being assembled and cut along a virtual cutting line A1-A2 shown in FIG. FIG. 3 is a plan view showing a first package body and a second package body constituting the piezoelectric oscillator shown in FIG. 1, and FIG. 3A shows the first package body constituting the first package body. It is the top view shown from the other main surface side of the 1st base | substrate which does, (b) showed the 2nd package body from the other main surface side of the 2nd base | substrate which comprises a 2nd package body. It is a top view. FIG. 4 is a cross-sectional view showing another embodiment of the piezoelectric oscillator according to the present invention. FIG. 5 is an exploded perspective view showing a form of a conventional piezoelectric oscillator. 6 is a cross-sectional view of the conventional piezoelectric oscillator shown in FIG. 5 after being assembled and cut along a virtual cutting line B1-B2 shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 30,40 ... Piezoelectric oscillator 10 ... 1st package body 11 ... 1st base | substrate 12 ... 1st space part 13 ... Piezoelectric vibration element 14 ... 2nd package body Connection electrode terminal 15 ... Lid 20, 50 ... Second package 21, 51 ... Second base 22, 52 ... Second space 23, 53 ... Integrated circuit Element 24, 55 ... External connection electrode terminal 25 ... First package body connection electrode terminal 16 ... First metal layer 26, 62 ... Second metal layer 31 ... Conductivity Adhesive bonding material 32 ... bonding material 33, 64 ... third space 44 ... first electrode terminal 54 ... second electrode terminal 61 ... third electrode terminal 63 ...・ Fourth electrode terminal 60: Insulating substrate

Claims (2)

A concave first space portion is formed on one main surface of the insulating first base body having a substantially flat outer shape, and a piezoelectric vibration element is mounted in the first space portion. The piezoelectric vibration element is electrically connected to a second package body connection electrode terminal formed on the other main surface of the first base, and a lid surrounds the first space portion. The first side wall portion is arranged and fixed to the first space portion opening side end face so as to close the first space portion opening, and the first space portion is hermetically sealed by the lid. 1 package body,
A concave second space portion is formed on one main surface of the insulating second base body having a substantially flat outer shape, and at least an oscillation circuit is formed in the second space portion. An integrated circuit element, and the integrated circuit element has an external connection electrode terminal formed at a corner of the second space opening side end surface of the second side wall surrounding the second space. A second package body which is electrically connected, and the integrated circuit element is also electrically connected to first package body connection electrode terminals formed at the four corners of the other main surface of the second base. And
In the piezoelectric oscillator formed integrally by mechanically and electrically connecting and fixing the first package connection electrode terminal and the second package connection electrode terminal,
At least one annular first metal layer is formed on the other main surface of the first package body other than the region where the second package body connection electrode terminal is formed, and On the other main surface of the second package body other than the region where the first package body connection electrode terminal is formed, the first metal is positioned opposite to the first metal layer. A second metal layer having the same shape as the layer is formed, and the first metal layer and the second metal layer are mechanically bonded to each other by a bonding material, and the first metal layer, A piezoelectric oscillator, wherein a third space is formed in an annulus surrounded by the second metal layer and a bonding material, and the inside of the third space is a vacuum. A concave first space portion is formed on one main surface of the insulating first base body having a substantially flat outer shape, and a piezoelectric vibration element is mounted in the first space portion. The piezoelectric vibration element is electrically connected to a first electrode terminal for electrical connection with a second package body formed on the other main surface of the first base, and the lid body is The first side wall portion surrounding the first space portion is disposed and fixed to the end surface on the first space portion opening side so as to close the first space portion opening, and the lid body fixes the first space portion. A first package body hermetically sealing the space of 1;
A concave second space portion is formed on one main surface of the insulating second base body having a substantially flat outer shape, and at least an oscillation circuit is formed in the second space portion. The integrated circuit element is arranged, and the integrated circuit element is formed at a corner of the second side wall opening side end surface of the second side wall portion surrounding the second space portion. An external connection electrode terminal formed at the four corners of the other main surface of the second base body and electrically connected to a second electrode terminal for electrical connection with the body. A second package body electrically connected to each other,
In the piezoelectric oscillator formed integrally by mechanically and electrically connecting the first electrode terminal and the second electrode terminal,
At least one annular first metal layer is formed on the other main surface of the first package body other than the region where the first electrode terminals are formed,
Between the first package body and the second package body, third electrode terminals for connecting the first package body are formed at four corners of one main surface, and the first metal layer and A second metal layer having the same shape as the first metal layer is formed at a position facing each other, and fourth electrode terminals for connecting the second package body are formed at the four corners of the other main surface. Each of the opposing third electrode terminal and the fourth electrode terminal is conductive, and an insulating substrate having a rectangular main surface is disposed,
Each of the opposing first electrode terminal and the third electrode terminal, and each of the opposing second electrode terminal and the fourth electrode terminal are mechanically and electrically connected by a conductive bonding material. The first metal layer and the second metal layer are mechanically bonded to each other by a bonding material, and the first metal layer, the second metal layer, and the bonding material A piezoelectric oscillator, wherein a third space is formed in an enclosed ring, and the inside of the third space is a vacuum.

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