JP2010248403A - Polyamide resin composition and molding - Google Patents
Polyamide resin composition and molding Download PDFInfo
- Publication number
- JP2010248403A JP2010248403A JP2009100680A JP2009100680A JP2010248403A JP 2010248403 A JP2010248403 A JP 2010248403A JP 2009100680 A JP2009100680 A JP 2009100680A JP 2009100680 A JP2009100680 A JP 2009100680A JP 2010248403 A JP2010248403 A JP 2010248403A
- Authority
- JP
- Japan
- Prior art keywords
- component
- mass
- polyamide
- polyamide resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 64
- 239000011342 resin composition Substances 0.000 title claims abstract description 35
- 238000000465 moulding Methods 0.000 title abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 21
- 239000003365 glass fiber Substances 0.000 claims abstract description 17
- 239000004953 Aliphatic polyamide Substances 0.000 claims abstract description 14
- 229920003231 aliphatic polyamide Polymers 0.000 claims abstract description 14
- ALBYIUDWACNRRB-UHFFFAOYSA-N hexanamide Chemical group CCCCCC(N)=O ALBYIUDWACNRRB-UHFFFAOYSA-N 0.000 claims abstract description 7
- FQLAJSQGBDYBAL-UHFFFAOYSA-N 3-(azepane-1-carbonyl)benzamide Chemical group NC(=O)C1=CC=CC(C(=O)N2CCCCCC2)=C1 FQLAJSQGBDYBAL-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 6
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims abstract description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000004985 diamines Chemical class 0.000 claims abstract description 5
- DJZKNOVUNYPPEE-UHFFFAOYSA-N tetradecane-1,4,11,14-tetracarboxamide Chemical group NC(=O)CCCC(C(N)=O)CCCCCCC(C(N)=O)CCCC(N)=O DJZKNOVUNYPPEE-UHFFFAOYSA-N 0.000 claims abstract description 5
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 34
- 229920001577 copolymer Polymers 0.000 claims description 25
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 20
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 20
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 17
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000001361 adipic acid Substances 0.000 claims description 9
- 235000011037 adipic acid Nutrition 0.000 claims description 9
- 239000005083 Zinc sulfide Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 8
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 31
- 238000013329 compounding Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 description 29
- 239000004952 Polyamide Substances 0.000 description 27
- 229920000642 polymer Polymers 0.000 description 25
- 238000010521 absorption reaction Methods 0.000 description 23
- 239000007864 aqueous solution Substances 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 19
- 239000000203 mixture Substances 0.000 description 18
- 229920002302 Nylon 6,6 Polymers 0.000 description 17
- -1 hexamethylene isophthalic acid Chemical compound 0.000 description 17
- 238000004898 kneading Methods 0.000 description 14
- 238000006116 polymerization reaction Methods 0.000 description 14
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 7
- 239000000194 fatty acid Substances 0.000 description 7
- 229930195729 fatty acid Natural products 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 229920000305 Nylon 6,10 Polymers 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920002292 Nylon 6 Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000003484 crystal nucleating agent Substances 0.000 description 2
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920006132 styrene block copolymer Polymers 0.000 description 2
- 229920006027 ternary co-polymer Polymers 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- ZUHMEUFBTDOKPX-UHFFFAOYSA-N 6-[2-(4,6-diamino-1,3,5-triazin-2-yl)ethyl]-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(CCC=2N=C(N)N=C(N)N=2)=N1 ZUHMEUFBTDOKPX-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VLPUSWKKMASBGV-UHFFFAOYSA-N C(C)(C)(C)C1=CC=C(C(=C1)C(C)(C)C)[Na] Chemical compound C(C)(C)(C)C1=CC=C(C(=C1)C(C)(C)C)[Na] VLPUSWKKMASBGV-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 229910052586 apatite Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- TUTWLYPCGCUWQI-UHFFFAOYSA-N decanamide Chemical group CCCCCCCCCC(N)=O TUTWLYPCGCUWQI-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical group NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- OBNAOHSAPQWLGU-UHFFFAOYSA-N phthalic acid;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OC(=O)C1=CC=CC=C1C(O)=O OBNAOHSAPQWLGU-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- LTURHSAEWJPFAA-UHFFFAOYSA-N sulfuric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OS(O)(=O)=O.NC1=NC(N)=NC(N)=N1 LTURHSAEWJPFAA-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- BHTBHKFULNTCHQ-UHFFFAOYSA-H zinc;tin(4+);hexahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Zn+2].[Sn+4] BHTBHKFULNTCHQ-UHFFFAOYSA-H 0.000 description 1
Images
Landscapes
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明はポリアミド樹脂組成物及びそれからなる成型体に関する。 The present invention relates to a polyamide resin composition and a molded body comprising the same.
携帯電話、デジタルカメラなどに代表される携帯電子機器は、持ち運びされるために落下することが多く、特にハウジング等の外装部品や内部の補強体には充分な強度を有していることが求められる。この様な部品に以前より用いられてきた材料はマグネシウム合金やアルミダイキャスト等であったが、機器の軽量化要求や部材の絶縁性要求、更に難加工性でもあるため、樹脂材料に置き換わってきている。 Portable electronic devices typified by mobile phones and digital cameras often drop because they are carried around, and in particular, exterior parts such as housings and internal reinforcements are required to have sufficient strength. It is done. The materials that have been used for these parts have been magnesium alloys and aluminum die casts, but they have been replaced by resin materials because they are required to reduce the weight of equipment, have insulation properties for parts, and are difficult to process. ing.
中でも、近年の携帯電子機器の小型化に伴い薄肉化した部品には、高濃度に無機充填材を配合したポリアミド樹脂組成物が考案され用いられている。例えば、特許文献1には、3元共重合ポリアミド樹脂と無機充填材からなるポリアミド樹脂組成物が開示されている。
特許文献2には、3元共重合ポリアミド樹脂と、ポリアミド6またはポリアミド610と、無機充填材からなるポリアミド樹脂組成物が開示されている。
特許文献3には、特定の半芳香族ポリアミド樹脂と、繊維状フィラーと板状フィラーからなるポリアミド樹脂組成物が開示されている。
Among them, a polyamide resin composition in which an inorganic filler is blended at a high concentration has been devised and used for parts that have become thinner with the recent miniaturization of portable electronic devices. For example, Patent Document 1 discloses a polyamide resin composition composed of a terpolymer polyamide resin and an inorganic filler.
Patent Document 2 discloses a polyamide resin composition comprising a terpolymer polyamide resin, polyamide 6 or polyamide 610, and an inorganic filler.
Patent Document 3 discloses a polyamide resin composition comprising a specific semi-aromatic polyamide resin, a fibrous filler and a plate-like filler.
しかしながら、特許文献1及び2に記載された技術は、薄肉成型品の成型時にバリが発生しやすいという問題がある。特許文献3に記載された技術は、成型時のバリの発生は抑えられるものの、耐衝撃性に劣り十分な強度を得ることができないという問題がある。 However, the techniques described in Patent Documents 1 and 2 have a problem that burrs are likely to occur when molding a thin molded product. The technique described in Patent Document 3 has a problem that it is inferior in impact resistance and cannot obtain sufficient strength, although the generation of burrs during molding can be suppressed.
また、ポリアミド樹脂は、成型体とした際に、吸水時の剛性や寸法安定性が低下するという問題がある。これについても解決しうる技術の開発が望まれている。 Moreover, when a polyamide resin is formed into a molded body, there is a problem that rigidity and dimensional stability at the time of water absorption are lowered. Development of a technology that can solve this problem is also desired.
本発明は、上記事情に鑑みてなされたものであり、耐衝撃性に優れるとともに、吸水時の剛性と寸法安定性に優れ、かつ成型性に優れたポリアミド樹脂組成物及びその成型体を提供することを目的とする。 The present invention has been made in view of the above circumstances, and provides a polyamide resin composition having excellent impact resistance, excellent rigidity and dimensional stability at the time of water absorption, and excellent moldability, and a molded body thereof. For the purpose.
本発明者は、上記課題を解決すべく鋭意検討を重ねた結果、特定の組成比を有するポリアミド樹脂と、特定の長鎖ポリアミド樹脂と、高濃度の繊維長無機充填材と、を含むことによって、耐衝撃性に優れるとともに、吸水時の剛性と寸法安定性に優れ、かつ成型性に優れたポリアミド樹脂組成物とできることを見出し、本発明を完成させるに至った。 As a result of intensive studies to solve the above problems, the present inventor includes a polyamide resin having a specific composition ratio, a specific long-chain polyamide resin, and a high-concentration fiber length inorganic filler. The present inventors have found that a polyamide resin composition having excellent impact resistance, excellent rigidity and dimensional stability during water absorption, and excellent moldability can be obtained, and the present invention has been completed.
すなわち、本発明は、
(1)(A)ヘキサメチレンジアミンとアジピン酸から得られるヘキサメチレンアジパミド単位(N66)70〜85質量%と、ヘキサメチレンジアミンとイソフタル酸から得られるヘキサメチレンイソフタルアミド単位(N6I)及びカプロアミド単位(N6)の繰返し構造単位15〜30質量%と、からなる3元共重合体であり、前記ヘキサメチレンイソフタルアミド単位と前記カプロアミド単位との配合質量比(N61/N6)が1.0以上である、共重合ポリアミド樹脂と、
(B)含有する窒素原子数に対する炭素原子数の比(C/N)が7以上12以下であり、アミノカルボン酸及び/又はジアミンとジカルボン酸の組み合わせから得られ、かつ、JIS K 6810に準じた98%硫酸中濃度1%、25℃で測定された相対粘度(ηr)が2.0〜2.5である、脂肪族ポリアミド樹脂と、
(C)ガラス繊維と、を含み、
前記(A)成分と前記(B)成分の質量比(A/B)が40/60〜60/40であり、
前記(A)成分と前記(B)成分との合計100質量部に対して、前記(C)成分20〜250質量部を含む、ポリアミド樹脂組成物、
(2)前記(B)成分が、ポリアミド612である、(1)のポリアミド樹脂組成物、
(3)(D)前記(A)成分の構造単位と、前記(B)成分の構造単位と、からなる4元共重合体を、更に含む、(1)又は(2)のポリアミド樹脂組成物、
(4)前記(B)成分が、ポリアミド612であり、前記(D)成分が、N66、N6I、N6及びポリアミド612単位からなる4元共重合体である、(3)のポリアミド樹脂組成物、
(5)硫化亜鉛を、更に含む、(1)〜(4)のいずれかのポリアミド樹脂組成物、
(6)(1)〜(5)のいずれかのポリアミド樹脂組成物からなる成型体、
である。
That is, the present invention
(1) (A) 70 to 85% by mass of hexamethylene adipamide units (N66) obtained from hexamethylenediamine and adipic acid, hexamethyleneisophthalamide units (N6I) and caproamide obtained from hexamethylenediamine and isophthalic acid A ternary copolymer comprising 15 to 30% by mass of repeating structural units of the unit (N6), and a blending mass ratio (N61 / N6) of the hexamethylene isophthalamide unit to the caproamide unit is 1.0 or more. A copolymerized polyamide resin,
(B) The ratio (C / N) of the number of carbon atoms to the number of nitrogen atoms contained is 7 or more and 12 or less, obtained from a combination of aminocarboxylic acid and / or diamine and dicarboxylic acid, and according to JIS K 6810 An aliphatic polyamide resin having a relative viscosity (ηr) measured at 25 ° C. of 2.0 to 2.5, and a 98% sulfuric acid concentration of 1%,
(C) glass fiber,
The mass ratio (A / B) of the component (A) and the component (B) is 40/60 to 60/40,
A polyamide resin composition comprising 20 to 250 parts by mass of the component (C) with respect to a total of 100 parts by mass of the component (A) and the component (B),
(2) The polyamide resin composition of (1), wherein the component (B) is polyamide 612,
(3) (D) The polyamide resin composition according to (1) or (2), further comprising a quaternary copolymer comprising the structural unit of component (A) and the structural unit of component (B). ,
(4) The polyamide resin composition of (3), wherein the component (B) is polyamide 612, and the component (D) is a quaternary copolymer composed of N66, N61, N6 and polyamide 612 units.
(5) The polyamide resin composition according to any one of (1) to (4), further comprising zinc sulfide,
(6) A molded body comprising the polyamide resin composition according to any one of (1) to (5),
It is.
本発明のポリアミド樹脂組成物は、成型体とした際に、優れた耐衝撃性を有するとともに、成型性と、吸水時の剛性と寸法安定性のバランスに優れるという効果を有する。 The polyamide resin composition of the present invention has excellent impact resistance when formed into a molded body, and has an effect of excellent balance between moldability, rigidity at the time of water absorption and dimensional stability.
以下、本発明を実施するための形態(以下、単に「本実施形態」という。)について詳細に説明する。以下の本実施形態は、本発明を説明するための例示であり、本発明を以下の内容に限定する趣旨ではない。本発明は、その要旨の範囲内で適宜に変形して実施できる。 Hereinafter, a mode for carrying out the present invention (hereinafter simply referred to as “the present embodiment”) will be described in detail. The following embodiments are examples for explaining the present invention, and are not intended to limit the present invention to the following contents. The present invention can be implemented with appropriate modifications within the scope of the gist thereof.
本実施形態のポリアミド樹脂組成物は、(A)ヘキサメチレンジアミンとアジピン酸から得られるヘキサメチレンアジパミド単位(N66)70〜85質量%と、ヘキサメチレンジアミンとイソフタル酸から得られるヘキサメチレンイソフタルアミド単位(N6I)及びカプロアミド単位(N6)の繰返し構造単位15〜30質量%からなる3元共重合体であり、前記ヘキサメチレンイソフタルアミド単位と前記カプロアミド単位との配合質量比(N61/N6)が1.0以上である、共重合ポリアミド樹脂と、(B)含有する窒素原子数に対する炭素原子数の比(C/N)が7以上12以下であり、アミノカルボン酸及び/又はジアミンとジカルボン酸の組み合わせから得られ、かつ、JIS K 6810に準じた98%硫酸中濃度1%、25℃で測定された相対粘度(ηr)が2.0〜2.5である、脂肪族ポリアミド樹脂と、(C)ガラス繊維と、を含み、前記(A)成分と前記(B)成分の質量比(A/B)が40/60〜60/40であり、前記(A)成分と前記(B)成分との合計100質量部に対して、前記(C)成分20〜250質量部を含むものである。(A)成分、(B)成分及び(C)成分を上記割合で含有することで、耐衝撃性に優れ、かつ成型性と、吸水時の剛性と寸法安定性のバランスに優れる成型体を得ることができる。 The polyamide resin composition of this embodiment comprises (A) 70 to 85% by mass of hexamethylene adipamide units (N66) obtained from hexamethylene diamine and adipic acid, and hexamethylene isophthalic acid obtained from hexamethylene diamine and isophthalic acid. It is a ternary copolymer composed of 15 to 30% by mass of repeating structural units of an amide unit (N6I) and a caproamide unit (N6), and a blending mass ratio of the hexamethyleneisophthalamide unit and the caproamide unit (N61 / N6) Is a copolymerized polyamide resin having a ratio of 1.0 or more and (B) the ratio of the number of carbon atoms to the number of nitrogen atoms (C / N) is 7 or more and 12 or less, and an aminocarboxylic acid and / or diamine and dicarboxylic acid Obtained from a combination of acids and 98% sulfuric acid concentration 1% according to JIS K 6810, An aliphatic polyamide resin having a relative viscosity (ηr) measured at 5 ° C. of 2.0 to 2.5, and (C) a glass fiber, the component (A) and the component (B) The mass ratio (A / B) is 40/60 to 60/40, and 20 to 250 parts by mass of the component (C) are added to 100 parts by mass of the total of the component (A) and the component (B). Is included. By containing the component (A), the component (B), and the component (C) in the above proportions, a molded body having excellent impact resistance and excellent balance between moldability, rigidity at the time of water absorption and dimensional stability is obtained. be able to.
本実施形態の(A)共重合ポリアミド樹脂は、アジピン酸及びヘキサメチレンジアミンから得られるヘキサメチレンアジパミド単位(以下「N66」と称す。)と、イソフタル酸及びヘキサメチレンジアミンから得られるヘキサメチレンイソフタルアミド単位(以下、「N6I」と称す。)と、カプロラクタムからなるカプラミド単位(以下、「「N6」と称す)からなる。各成分の構成比は、N66が70〜85質量%、N6IとN6の合計が15〜30質量%である。N6I単位とN6単位の配合割合(N6I/N6)は、1以上である。共重合ポリアミド樹脂の結晶性と吸水時の剛性の観点から、好ましい構成比はN66が72〜83質量%、N6IとN6の合計が17〜28質量%であり、N6IとN6の配合割合は3以上である The (A) copolymerized polyamide resin of this embodiment is a hexamethylene adipamide unit (hereinafter referred to as “N66”) obtained from adipic acid and hexamethylenediamine, and hexamethylene obtained from isophthalic acid and hexamethylenediamine. It consists of an isophthalamide unit (hereinafter referred to as “N6I”) and a capramide unit composed of caprolactam (hereinafter referred to as “N6”). As for the composition ratio of each component, N66 is 70 to 85 mass%, and the total of N6I and N6 is 15 to 30 mass%. The blending ratio of N6I units to N6 units (N6I / N6) is 1 or more. From the viewpoint of the crystallinity of the copolymerized polyamide resin and the rigidity at the time of water absorption, N66 is preferably 72 to 83 mass%, the total of N6I and N6 is 17 to 28 mass%, and the blending ratio of N6I and N6 is 3 That's it
(A)共重合ポリアミド樹脂の重合度は、JIS K 6810に準じた98%硫酸中濃度1%、25℃で測定された相対粘度ηrで、好ましくは1.5〜2.8、より好ましくは1.6〜2.7、更に好ましくは、1.7〜2.6である。このような範囲の共重合ポリアミドを用いることにより樹脂成型品の表面の光沢性を一層向上させることができる。 (A) The degree of polymerization of the copolymerized polyamide resin is a relative viscosity ηr measured at a concentration of 1% in 98% sulfuric acid according to JIS K 6810 at 25 ° C., preferably 1.5 to 2.8, more preferably It is 1.6 to 2.7, more preferably 1.7 to 2.6. By using a copolymerized polyamide in such a range, the gloss of the surface of the resin molded product can be further improved.
本実施形態の(B)脂肪族ポリアミド樹脂は、含有する窒素原子数に対する炭素原子数の比(C/N)が7以上12以下であり、アミノカルボン酸及び/又はジアミンとジカルボン酸の組み合わせから得られ、かつ、JIS K 6810に準じた98%硫酸中濃度1%、25℃で測定された相対粘度(ηr)が2.0〜2.5である、脂肪族ポリアミド樹脂である。 In the (B) aliphatic polyamide resin of the present embodiment, the ratio of carbon atoms to the number of nitrogen atoms contained (C / N) is 7 or more and 12 or less, and a combination of aminocarboxylic acid and / or diamine and dicarboxylic acid. It is an aliphatic polyamide resin obtained and having a relative viscosity (ηr) of 2.0 to 2.5 measured at 25 ° C. with a concentration of 1% in 98% sulfuric acid according to JIS K 6810.
(B)成分は、主鎖中にアミド結合(−NHCO−)を有する重合体のうち、窒素原子数に対する炭素原子数の比(C/N)7以上12以下である。また、脂肪族モノマーから構成されるものであり、例えば、ポリヘキサメチレンセバカミド(ポリアミド610)、ポリヘキサメチレンドデカミド(ポリアミド612)、ポリウンデカラクタム(ポリアミド11)、ポリドデカラクタム(ポリアミド12)及びこれらのうち少なくとも2種類の異なったポリアミド形成成分を含むポリアミド共重合体、及びこれらの混合物などが挙げられる。中でも好ましい(B)脂肪族ポリアミド樹脂は、吸水時の剛性の観点から、ポリアミド612、ポリアミド12が挙げられる。更に好ましくは、ポリアミド612である。 Component (B) is a polymer having an amide bond (—NHCO—) in the main chain, the ratio of the number of carbon atoms to the number of nitrogen atoms (C / N) of 7 or more and 12 or less. Further, it is composed of an aliphatic monomer. For example, polyhexamethylene sebacamide (polyamide 610), polyhexamethylene dodecamide (polyamide 612), polyundecalactam (polyamide 11), polydodecalactam (polyamide). 12) and polyamide copolymers containing at least two different polyamide-forming components among them, and mixtures thereof. Among these, preferred (B) aliphatic polyamide resins include polyamide 612 and polyamide 12 from the viewpoint of rigidity during water absorption. More preferred is polyamide 612.
本実施形態の(B)成分である脂肪族ポリアミドの重合度は、JIS K 6810に準じた98%硫酸中濃度1%、25℃で測定された相対粘度ηrで、2.0〜2.5であり、好ましくは2.1〜2.4である。このような範囲の脂肪族ポリアミドを用いることで樹脂成型品表面の光沢性を向上させることができる。 The degree of polymerization of the aliphatic polyamide as the component (B) in this embodiment is 2.0 to 2.5 in terms of a relative viscosity ηr measured at 25 ° C. in a 98% sulfuric acid concentration of 1% according to JIS K6810. Preferably, it is 2.1-2.4. By using an aliphatic polyamide in such a range, the gloss of the surface of the resin molded product can be improved.
本実施形態の(C)ガラス繊維は、通常熱可塑性樹脂に使用されているものを使うことができ、繊維径や長さは特に制限はなく、例えば、平均繊維径が5〜30μmのチョップドストランド、ロービング、ミルドファイバーのいずれでも良い。チョップドストランドを用いる場合には、その長さが0.1から6mmの範囲で適宜選択すればよい。 (C) The glass fiber of this embodiment can use what is normally used for a thermoplastic resin, There is no restriction | limiting in particular in a fiber diameter and length, For example, an average fiber diameter is 5-30 micrometers chopped strand. , Roving or milled fiber. When using chopped strands, the length may be appropriately selected within the range of 0.1 to 6 mm.
これらのガラス繊維は、またその表面に通常公知の集束剤やシラン系カップリング剤を付着させたものを用いることも好ましく利用できる。例えば、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリメトキシシラン、ビニルトリエトキシシラン、γ−グリシドキシプロピルトリメトキシシランなどを利用できる。 For these glass fibers, it is also possible to preferably use a glass fiber with a generally known sizing agent or silane coupling agent attached to its surface. For example, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, vinyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, etc. Available.
本実施形態において、(D)成分として、(A)成分の構成単位と(B)成分の構成単位と、からなる4元共重合体成分を更に含むことが好ましい。(D)成分の4元共重合体成分は、(A)成分として用いられている成分と同じ成分を有し、かつ(B)成分として用いられている成分と同じ成分を有するものである。例えば、(A)成分としてN66とN6とN6Iからなるポリアミド樹脂、(B)成分としてポリアミド612を使用した場合、N66、N6、N6Iに加え、ポリアミド612単位を含む4元共重合体を(D)成分として有する。この(D)成分を加えることにより、(A)成分と(B)成分の混合状態を一層高めることが可能となり、衝撃強度や流動性の向上などに寄与することが可能となる。特に、(D)成分の4元共重合体に用いられる脂肪族ポリアミドを(B)成分と同一にすることで、(A)成分と(B)成分の混合状態を一層高めることが可能であると考えられる(ただし、作用はこれに限定されない。)。本実施形態において、特に、(B)成分がポリアミド612であり、(D)成分がN66単位、N6I単位、N6I及びポリアミド612単位からなる4元共重合体であることが好ましい。このようなポリアミド樹脂組成物とすることにより、(A)成分と(B)成分の混合状態を一層高めることができる。 In this embodiment, it is preferable that the component (D) further includes a quaternary copolymer component composed of the structural unit of the component (A) and the structural unit of the component (B). The (D) component quaternary copolymer component has the same component as the component used as the component (A) and the same component as the component used as the component (B). For example, when a polyamide resin composed of N66, N6, and N6I is used as the component (A) and a polyamide 612 is used as the component (B), a quaternary copolymer containing polyamide 612 units in addition to N66, N6, and N6I (D ) As a component. By adding the component (D), it is possible to further increase the mixed state of the component (A) and the component (B), thereby contributing to improvement in impact strength and fluidity. In particular, by making the aliphatic polyamide used in the quaternary copolymer of the component (D) the same as the component (B), it is possible to further increase the mixed state of the component (A) and the component (B). (However, the action is not limited to this.) In this embodiment, it is particularly preferable that the component (B) is polyamide 612 and the component (D) is a quaternary copolymer composed of N66 units, N6I units, N6I and polyamide 612 units. By setting it as such a polyamide resin composition, the mixed state of (A) component and (B) component can be improved further.
(D)成分中の(A)成分と(B)成分との4元共重合体成分の含有量は特に限定されないが、吸水時の剛性と結晶性の観点から、質量比(A/B)は30/70〜70/30であることが好ましい。 The content of the quaternary copolymer component of the component (A) and the component (B) in the component (D) is not particularly limited, but from the viewpoint of rigidity and crystallinity during water absorption, the mass ratio (A / B) Is preferably 30/70 to 70/30.
本実施形態のポリアミド樹脂組成物を得る場合、(A)共重合ポリアミド樹脂と(B)脂肪族ポリアミド樹脂の質量比(A/B)は、40/60〜60/40であり、吸水時の剛性の観点から、質量比(A/B)は45/55〜60/40であることが好ましい。 When obtaining the polyamide resin composition of this embodiment, the mass ratio (A / B) of (A) copolymer polyamide resin and (B) aliphatic polyamide resin is 40 / 60-60 / 40, From the viewpoint of rigidity, the mass ratio (A / B) is preferably 45/55 to 60/40.
本実施形態のポリアミド樹脂組成物における(C)ガラス繊維の配合量は、(A)共重合ポリアミド樹脂と(B)脂肪族ポリアミド樹脂の合計100質量部に対して、(C)ガラス繊維20〜250質量部であり、剛性と流動性のバランスの観点から好ましくは(A)成分と(B)成分の合計100質量部に対して(C)成分60〜180質量部、より好ましくは(C)80〜150質量部である。 The blending amount of the (C) glass fiber in the polyamide resin composition of the present embodiment is (C) a glass fiber 20 to a total of 100 parts by mass of the (A) copolymer polyamide resin and the (B) aliphatic polyamide resin. From the viewpoint of the balance between rigidity and fluidity, it is preferably 250 parts by mass, and preferably 60 to 180 parts by mass of (C) component, more preferably (C) with respect to 100 parts by mass of component (A) and component (B). It is 80-150 mass parts.
本実施形態のポリアミド樹脂組成物における(D)4元共重合体の配合量は、耐熱性と剛性の観点から、(A)共重合ポリアミド樹脂と(B)脂肪族ポリアミド樹脂の合計100質量部に対して、(D)4元共重合体2〜20質量部であることが好ましく、より好ましくは3〜10質量部である。 The blending amount of the (D) quaternary copolymer in the polyamide resin composition of the present embodiment is 100 parts by mass in total of (A) the copolymerized polyamide resin and (B) the aliphatic polyamide resin from the viewpoint of heat resistance and rigidity. The (D) quaternary copolymer is preferably 2 to 20 parts by mass, more preferably 3 to 10 parts by mass.
本実施形態のポリアミド樹脂組成物には、必要に応じて本実施形態の目的を損なわない範囲で他のポリアミド樹脂や他のポリマー類、充填材、結晶核剤、熱安定剤や紫外線吸収剤などの安定剤、難燃剤、帯電防止剤、可塑剤、滑剤、着色剤、カップリング剤など等を添加することができる。 The polyamide resin composition of the present embodiment includes other polyamide resins and other polymers, fillers, crystal nucleating agents, heat stabilizers, ultraviolet absorbers and the like as long as the purpose of the present embodiment is not impaired as necessary. Stabilizers, flame retardants, antistatic agents, plasticizers, lubricants, colorants, coupling agents and the like can be added.
他のポリアミド樹脂としては、ポリアミド6、ポリアミド46、ポリアミド66、ポリアミド6T、ポリアミド9T、ポリアミド12T、ポリアミドMXD6及びこれらのうち少なくとも2種類の異なったポリアミド形成成分を含むポリアミド共重合体等が挙げられる。 Examples of other polyamide resins include polyamide 6, polyamide 46, polyamide 66, polyamide 6T, polyamide 9T, polyamide 12T, polyamide MXD6, and polyamide copolymers containing at least two different polyamide-forming components. .
他のポリマー類としては、ポリエチレン、ポリプロピレン、エチレン−プロピレン共重合体、エチレン−オクテン共重合体、スチレン−エチレン共重合体、スチレン−イソプレン共重合体、スチレン−エチレンブチレン−スチレン系ブロック共重合体、スチレン−エチレンプロピレン−スチレン系ブロック共重合体、液晶樹脂、不飽和脂肪族カルボン酸無水物変性ポリフェニレンエーテル系樹脂やポリフェニレンサルファイド等が挙げられる。 Other polymers include polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-octene copolymer, styrene-ethylene copolymer, styrene-isoprene copolymer, styrene-ethylenebutylene-styrene block copolymer. Styrene-ethylenepropylene-styrene block copolymer, liquid crystal resin, unsaturated aliphatic carboxylic acid anhydride-modified polyphenylene ether resin, polyphenylene sulfide and the like.
充填材としては、ガラス繊維や炭素繊維などの無機繊維、マイカ、タルク、粘土鉱物、アルミナ、シリカ、アパタイト、水酸化アルミニウム、水酸化マグネシウム、ホウ酸亜鉛、すず酸亜鉛、ヒドロキシすず酸亜鉛、セルロース等が挙げられる。 As fillers, inorganic fibers such as glass fiber and carbon fiber, mica, talc, clay mineral, alumina, silica, apatite, aluminum hydroxide, magnesium hydroxide, zinc borate, zinc stannate, zinc hydroxystannate, cellulose Etc.
結晶核剤としては、カオリンや窒化ホウ素、リン酸−2,2’−メチレンビス(4,6−ジ−t−ブチルフェニル)ナトリウム等が挙げられる。 Examples of the crystal nucleating agent include kaolin, boron nitride, and phosphoric acid-2,2'-methylenebis (4,6-di-t-butylphenyl) sodium.
安定剤としては、次亜リン酸ソーダ等の亜リン酸金属塩、ヒンダードフェノール、有機リン系化合物やヒンダードアミン等が挙げられる。 Examples of the stabilizer include metal phosphites such as sodium hypophosphite, hindered phenols, organic phosphorus compounds and hindered amines.
帯電防止剤としては、ソルビタン脂肪酸エステル、グリセリン脂肪酸エステル、ポリグリセリン脂肪酸エステルや高級アルコール脂肪酸エステル等が挙げられる。 Examples of the antistatic agent include sorbitan fatty acid ester, glycerin fatty acid ester, polyglycerin fatty acid ester and higher alcohol fatty acid ester.
難燃剤としては、ポリリン酸アンモニウム、シアヌル酸メラミン、サクシノグアナミン、ポリリン酸メラミン、硫酸メラミン、フタル酸メラミン、リン酸アルミニウム等が挙げられる。 Examples of the flame retardant include ammonium polyphosphate, melamine cyanurate, succinoguanamine, melamine polyphosphate, melamine sulfate, melamine phthalate, and aluminum phosphate.
滑剤や可塑剤としては、高級脂肪酸金属塩、高級脂肪酸アミド、高級脂肪酸エステル等が挙げられる。 Examples of lubricants and plasticizers include higher fatty acid metal salts, higher fatty acid amides, and higher fatty acid esters.
着色剤としては、硫化亜鉛、チタンホワイト、カーボンブラック、アジン系染料、フタロシアニン誘導体等が挙げられる。それらの中でも、剛性と耐衝撃性の観点から、硫化亜鉛が好ましい。本実施形態のポリアミド樹脂組成物における硫化亜鉛の配合量は、耐熱性と剛性の観点から、本実施形態のポリアミド樹脂組成物100質量部において、0.1〜5質量部であることが好ましく、より好ましくは0.5〜3質量部である。 Examples of the colorant include zinc sulfide, titanium white, carbon black, azine dyes, and phthalocyanine derivatives. Among these, zinc sulfide is preferable from the viewpoint of rigidity and impact resistance. The blending amount of zinc sulfide in the polyamide resin composition of the present embodiment is preferably 0.1 to 5 parts by mass in 100 parts by mass of the polyamide resin composition of the present embodiment from the viewpoint of heat resistance and rigidity. More preferably, it is 0.5-3 mass parts.
本実施形態のポリアミド樹脂組成物を得る方法としては、溶融混練により製造することができる。溶融混練を行う装置としては、一般に実用されている混練機が適用できる。例えば、一軸又は多軸混練押出機、バンバリーミキサー、ロール等を用いればよい。溶融混練の順序にも特に制限は無く、全成分を同時に混練する方法、又は任意の2成分をあらかじめ混錬し、得られたものと残りの1成分を混錬する方法、更に押出し機の途中から逐次各成分をフィードし混練する方法などを用いてもよい。混練の温度は、共重合ポリアミド樹脂、脂肪族ポリアミド樹脂のうちで最も高い融点あるいは軟化点より1〜100度高い温度が好ましく、10〜60℃がより好ましく、20〜50℃がより一層好ましい。すなわち、本実施形態において原料として用いる樹脂は、該製法時にすべて溶融し混合することが好ましい。融点又は軟化点はJIS K 7121に準じた示差走査熱量(DSC)測定で求めることができる。該温度範囲を外れた場合には、本実施形態の効果が発現されにくくなる傾向にあると同時に生産性が低くなりやすい。 As a method for obtaining the polyamide resin composition of the present embodiment, it can be produced by melt kneading. As a device for performing melt kneading, a kneading machine generally used can be applied. For example, a single-screw or multi-screw kneading extruder, a Banbury mixer, a roll, or the like may be used. There is no particular restriction on the order of melt-kneading, and a method of kneading all the components simultaneously, or a method of kneading any two components in advance and kneading the obtained one with the remaining one component, further in the middle of the extruder Alternatively, a method may be used in which each component is sequentially fed and kneaded. The kneading temperature is preferably 1 to 100 degrees higher than the highest melting point or softening point of the copolymerized polyamide resin and aliphatic polyamide resin, more preferably 10 to 60 ° C, and still more preferably 20 to 50 ° C. That is, it is preferable that the resin used as a raw material in the present embodiment is melted and mixed during the production method. The melting point or softening point can be determined by differential scanning calorimetry (DSC) measurement according to JIS K7121. When the temperature is out of the temperature range, the effects of the present embodiment tend to be hardly exhibited, and at the same time, the productivity tends to be lowered.
本実施形態のポリアミド樹脂組成物から得られる成型体は、耐衝撃性に優れるとともに、吸水時の剛性と寸法安定性、成型性のバランスに優れているため、様々な携帯電子機器、電気電子部品として好適に使用できる。 The molded body obtained from the polyamide resin composition of the present embodiment is excellent in impact resistance, and has excellent balance of rigidity and dimensional stability upon water absorption and moldability. Can be suitably used.
以下、本実施形態を実施例により更に詳細に説明するが、本実施形態はその要旨を越えない限り、以下の実施例に制限されるものではない。なお、以下の実施例、比較例において記載した物性評価は、以下のように行った。 Hereinafter, the present embodiment will be described in more detail with reference to examples. However, the present embodiment is not limited to the following examples unless it exceeds the gist. In addition, the physical property evaluation described in the following examples and comparative examples was performed as follows.
(1)曲げ弾性率(ドライ状態)
射出成型機(日精樹脂(株)製PS−40E)を用いて、シリンダー温度280℃、金型温度100℃に設定し、4mm厚みの評価用試験片を得た後、ISO 178に準じて曲げ弾性率の測定を行った。
(1) Flexural modulus (dry state)
Using an injection molding machine (PS-40E manufactured by Nissei Resin Co., Ltd.), the cylinder temperature was set to 280 ° C. and the mold temperature was set to 100 ° C. After obtaining a test piece for evaluation with a thickness of 4 mm, bending according to ISO 178 The elastic modulus was measured.
(2)曲げ弾性率(ウェット状態)
(1)と同様に射出成型して得られた試験片を、23℃×相対湿度50%の環境に放置し、質量が一定となるまで放置し吸水処理を行った。吸水処理後の試験片を(1)と同様に曲げ試験を行った。
(2) Flexural modulus (wet condition)
The test piece obtained by injection molding in the same manner as in (1) was left in an environment of 23 ° C. × 50% relative humidity, and left to stand until the mass became constant, and a water absorption treatment was performed. The test piece after the water absorption treatment was subjected to a bending test in the same manner as (1).
(3)吸水寸法変化、吸水率
射出成型機(日精樹脂(株)製FN3000)を用いて、シリンダー温度280℃、金型温度100℃に設定し、厚み3mm×幅60mm×長さ90mmの平板を得たのち、
長さ方向の寸法(L1)を測定した。このときの測定位置を幅の中心と端の中央部とした。この試験片を用いて23℃×相対湿度50%の環境に放置し、質量が一定となるまで放置し吸水処理を行った後、同様に寸法(L2)を測定した。吸水寸法変化(ΔL)は、以下で算出した。
ΔL=(L2−L1)/L1×100
同じ平板試験片の成型直後の試験片重量(W1)と吸水処理後の試験片重量(W2)を測定することで吸水率(W3)を以下で算出した。
W3=(W2−W1)/W1×100
(3) Change in water absorption dimension, water absorption rate Using an injection molding machine (FN3000 manufactured by Nissei Resin Co., Ltd.), a cylinder temperature of 280 ° C. and a mold temperature of 100 ° C. are set, and a flat plate of thickness 3 mm × width 60 mm × length 90 mm After getting
The length dimension (L1) was measured. The measurement position at this time was the center of the width and the center of the end. Using this test piece, it was left in an environment of 23 ° C. × 50% relative humidity, left to stand until the mass became constant, and subjected to water absorption treatment, and then the dimension (L2) was measured in the same manner. The water absorption dimensional change (ΔL) was calculated as follows.
ΔL = (L2−L1) / L1 × 100
The water absorption (W3) was calculated as follows by measuring the test piece weight (W1) immediately after molding of the same flat plate test piece and the test piece weight (W2) after water absorption treatment.
W3 = (W2-W1) / W1 × 100
(4)耐衝撃性
(1)で得られた試験片を切削し、ノッチを入れた試験片でISO 179に準拠した方法で、シャルピー衝撃試験を実施し、耐衝撃性を求めた。
(4) Impact resistance The test piece obtained in (1) was cut, and a Charpy impact test was carried out by a method based on ISO 179 with a notched test piece to determine the impact resistance.
(5)流動性(バリ)
射出成型機(日精樹脂(株)製FE120)を用いて、シリンダー温度280℃、金型温度100℃に設定し、図1に示す成型品を射出成型した。射出成型品が充填する圧力で成型した際、バリ評価の為に設けられたガスベント部(厚さ100μm)に出るバリの長さを測定した。
次に本実施形態の実施例で用いた原材料について説明する。(A)成分であるポリアミド共重合体、(B)成分であるポリアミド重合体と(D)成分である43元共重合体は、以下に記載の製造例に基づいて準備した。また、製造例に使用した原材料、(C)成分と(E)その他の原材料は市販のものを使用した。
(5) Fluidity (Burr)
Using an injection molding machine (FE120 manufactured by Nissei Resin Co., Ltd.), the cylinder temperature was set to 280 ° C. and the mold temperature was set to 100 ° C., and the molded product shown in FIG. 1 was injection molded. When molding was performed at a pressure filled with the injection molded product, the length of the burr that appeared at the gas vent portion (thickness: 100 μm) provided for burr evaluation was measured.
Next, the raw materials used in the examples of this embodiment will be described. The polyamide copolymer as component (A), the polyamide polymer as component (B), and the 43-component copolymer as component (D) were prepared based on the production examples described below. Moreover, the raw material used for the manufacture example, (C) component, and (E) other raw materials used the commercially available thing.
[原材料]
ヘキサメチレンジアミン(和光純薬工業製、商品名:ヘキサメチレンジアミン)
アジピン酸(和光純薬工業製、商品名:アジピン酸)
イソフタル酸(和光純薬工業製、商品名:イソフタル酸)
ドデカン二酸(和光純薬工業製、商品名:ドデカン二酸)
カプロラクタム(和光純薬工業製、商品名:カプロラクタム)
(C)ガラス繊維
日本電気硝子(株)製、商品名 ECS03T−275/H
(E)その他の原材料
硫化亜鉛:Sachtleben Chemie GmbH製、商品名:SachtolithHD
[raw materials]
Hexamethylenediamine (made by Wako Pure Chemical Industries, trade name: hexamethylenediamine)
Adipic acid (made by Wako Pure Chemical Industries, trade name: adipic acid)
Isophthalic acid (made by Wako Pure Chemical Industries, trade name: isophthalic acid)
Dodecanedioic acid (made by Wako Pure Chemical Industries, trade name: dodecanedioic acid)
Caprolactam (made by Wako Pure Chemical Industries, trade name: Caprolactam)
(C) Glass fiber manufactured by Nippon Electric Glass Co., Ltd., trade name ECS03T-275 / H
(E) Other raw materials Zinc sulfide: manufactured by Sachtleben Chemie GmbH, trade name: SachtolithHD
(製造例1)
重合成分としてヘキサメチレンジアミンとアジピン酸との等モル塩をポリアミド樹脂として50質量%相当含有する水溶液12kgとヘキサメチレンジアミンとイソフタル酸との等モル塩をポリアミド樹脂として50質量%相当含有する水溶液2.25kgとε−カプロラクタムをポリアミド樹脂として50質量%相当含有する水溶液0.75kgを調製した。次いで、撹拌装置を有し、かつ下部に抜出しノズルを有する40リットルのオートクレーブ中に上記水溶液を仕込み、50℃の温度下で十分に水溶液を攪拌した。次に、オートクレーブ内を十分に窒素で置換した後、水溶液を撹拌しながらオートクレーブ内の温度を50℃から約270℃まで昇温した。この際、オートクレーブ内の圧力は、ゲージ圧にして約1.8MPaであったが、この圧力が1.8MPa以上にならないよう水を随時系外に排出した。また、重合時間は、ポリアミド樹脂の相対粘度が目的の相対粘度になるように調整した。オートクレーブ内での重合終了後、下部ノズルからストランド状にポリアミド樹脂を送出し、水冷・カッティングを経て、ペレット状のポリヘキサメチレンアジパミド、ポリヘキサメチレンイソフタルアミドとポリカプラミドの共重合体(ポリアミド66/6I/6)を得た。このポリアミド共重合体を80℃、24時間の条件で真空乾燥した。ポリアミド共重合体の相対粘度(ηr)を上述のようにして測定したところ、2.10であった。
(Production Example 1)
An aqueous solution 2 containing 12 kg of an equimolar salt of hexamethylenediamine and adipic acid as a polymerization component in an amount equivalent to 50% by mass as a polyamide resin and an aqueous solution 2 containing 50% by mass in an equimolar salt of hexamethylenediamine and isophthalic acid as a polyamide resin. 0.75 kg of an aqueous solution containing .25 kg and ε-caprolactam corresponding to 50% by mass as a polyamide resin was prepared. Next, the aqueous solution was charged into a 40 liter autoclave having a stirring device and having a discharge nozzle at the bottom, and the aqueous solution was sufficiently stirred at a temperature of 50 ° C. Next, after the inside of the autoclave was sufficiently substituted with nitrogen, the temperature inside the autoclave was increased from 50 ° C. to about 270 ° C. while stirring the aqueous solution. At this time, the pressure in the autoclave was about 1.8 MPa in terms of gauge pressure, but water was discharged from the system as needed so that the pressure did not exceed 1.8 MPa. Further, the polymerization time was adjusted so that the relative viscosity of the polyamide resin became the target relative viscosity. After the polymerization in the autoclave is completed, the polyamide resin is sent out in a strand form from the lower nozzle, and after water cooling and cutting, a pellet-like polyhexamethylene adipamide, polyhexamethylene isophthalamide copolymer and polycoupleramide (polyamide 66). / 6I / 6). This polyamide copolymer was vacuum dried at 80 ° C. for 24 hours. When the relative viscosity (ηr) of the polyamide copolymer was measured as described above, it was 2.10.
(製造例2)
重合成分としてヘキサメチレンジアミンとドデカン二酸との等モル塩をポリアミド樹脂として50質量%相当含有する水溶液を15kg調製した。次いで、撹拌装置を有し、かつ下部に抜出しノズルを有する40リットルのオートクレーブ中に上記水溶液を仕込み、50℃の温度下で十分に水溶液を攪拌した。次に、オートクレーブ内を十分に窒素で置換した後、水溶液を撹拌しながらオートクレーブ内の温度を50℃から約270℃まで昇温した。この際、オートクレーブ内の圧力は、ゲージ圧にして約1.8MPaであったが、この圧力が1.8MPa以上にならないよう水を随時系外に排出した。また、重合時間は、ポリアミド重合体の相対粘度が目的の相対粘度になるように調整した。オートクレーブ内での重合終了後、下部ノズルからストランド状にポリアミド重合体を送出し、水冷・カッティングを経て、ペレット状のポリヘキサメチレンドデカミド(ポリアミド612)を得た。このポリアミド612を80℃、24時間の条件で真空乾燥した。ポリアミド612の相対粘度(ηr)を上述のようにして測定したところ、2.10であった。
(Production Example 2)
15 kg of an aqueous solution containing an equimolar salt of hexamethylenediamine and dodecanedioic acid as a polymerization component in an amount corresponding to 50% by mass as a polyamide resin was prepared. Next, the aqueous solution was charged into a 40 liter autoclave having a stirring device and having a discharge nozzle at the bottom, and the aqueous solution was sufficiently stirred at a temperature of 50 ° C. Next, after the inside of the autoclave was sufficiently substituted with nitrogen, the temperature inside the autoclave was increased from 50 ° C. to about 270 ° C. while stirring the aqueous solution. At this time, the pressure in the autoclave was about 1.8 MPa in terms of gauge pressure, but water was discharged from the system as needed so that the pressure did not exceed 1.8 MPa. The polymerization time was adjusted so that the relative viscosity of the polyamide polymer was the target relative viscosity. After the polymerization in the autoclave was completed, the polyamide polymer was sent out in a strand form from the lower nozzle, and after water cooling and cutting, pelletized polyhexamethylene dodecamide (polyamide 612) was obtained. This polyamide 612 was vacuum dried at 80 ° C. for 24 hours. It was 2.10 when the relative viscosity ((eta) r) of the polyamide 612 was measured as mentioned above.
(製造例3)
重合成分としてヘキサメチレンジアミンとアジピン酸との等モル塩をポリアミド樹脂として50質量%相当含有する水溶液を15kg調製した。次いで、撹拌装置を有し、かつ下部に抜出しノズルを有する40リットルのオートクレーブ中に上記水溶液を仕込み、50℃の温度下で十分に水溶液を攪拌した。次に、オートクレーブ内を十分に窒素で置換した後、水溶液を撹拌しながらオートクレーブ内の温度を50℃から約270℃まで昇温した。この際、オートクレーブ内の圧力は、ゲージ圧にして約1.8MPaであったが、この圧力が1.8MPa以上にならないよう水を随時系外に排出した。また、重合時間は、ポリアミド重合体の相対粘度が目的の相対粘度になるように調整した。オートクレーブ内での重合終了後、下部ノズルからストランド状にポリアミド重合体を送出し、水冷・カッティングを経て、ペレット状のポリヘキサメチレンアジパミド(ポリアミド66)を得た。このポリアミド66を80℃、24時間の条件で真空乾燥した。ポリアミド66の相対粘度(ηr)を上述のようにして測定したところ、2.60であった。
(Production Example 3)
15 kg of an aqueous solution containing an equimolar salt of hexamethylenediamine and adipic acid as a polymerization component in an amount corresponding to 50% by mass as a polyamide resin was prepared. Next, the aqueous solution was charged into a 40 liter autoclave having a stirring device and having a discharge nozzle at the bottom, and the aqueous solution was sufficiently stirred at a temperature of 50 ° C. Next, after the inside of the autoclave was sufficiently substituted with nitrogen, the temperature inside the autoclave was increased from 50 ° C. to about 270 ° C. while stirring the aqueous solution. At this time, the pressure in the autoclave was about 1.8 MPa in terms of gauge pressure, but water was discharged from the system as needed so that the pressure did not exceed 1.8 MPa. The polymerization time was adjusted so that the relative viscosity of the polyamide polymer was the target relative viscosity. After the polymerization in the autoclave was completed, the polyamide polymer was sent out in a strand form from the lower nozzle, and water-cooling and cutting were performed to obtain pellet-shaped polyhexamethylene adipamide (polyamide 66). This polyamide 66 was vacuum dried at 80 ° C. for 24 hours. When the relative viscosity (ηr) of the polyamide 66 was measured as described above, it was 2.60.
(製造例4)
重合成分としてヘキサメチレンジアミンとアジピン酸との等モル塩をポリアミド樹脂として50質量%相当含有する水溶液を6kgとヘキサメチレンジアミンとイソフタル酸との等モル塩をポリアミド樹脂として50質量%相当含有する水溶液1.12kgとε−カプロラクタムをポリアミド樹脂として50質量%相当含有する水溶液0.38kgとヘキサメチレンジアミンとドデカン二酸との等モル塩をポリアミド樹脂として50質量%相当含有する水溶液7.5kgを調製した。次いで、撹拌装置を有し、かつ下部に抜出しノズルを有する40リットルのオートクレーブ中に上記水溶液を仕込み、50℃の温度下で十分に水溶液を攪拌した。次に、オートクレーブ内を十分に窒素で置換した後、水溶液を撹拌しながらオートクレーブ内の温度を50℃から約270℃まで昇温した。この際、オートクレーブ内の圧力は、ゲージ圧にして約1.8MPaであったが、この圧力が1.8MPa以上にならないよう水を随時系外に排出した。また、重合時間は、ポリアミド樹脂の相対粘度が目的の相対粘度になるように調整した。オートクレーブ内での重合終了後、下部ノズルからストランド状にポリアミド樹脂を送出し、水冷・カッティングを経て、ペレット状のポリヘキサメチレンアジパミド、ポリヘキサメチレンイソフタルアミド、ポリカプラミドとポリヘキサメチレンセバカミドの共重合体(ポリアミド66/6I/6/612)を得た。このポリアミド共重合体を80℃、24時間の条件で真空乾燥した。ポリアミド共重合体の相対粘度(ηr)を上述のようにして測定したところ、2.05であった。
(Production Example 4)
An aqueous solution containing 6 kg of an equimolar salt of hexamethylenediamine and adipic acid as a polymerization component in an amount equivalent to 50% by mass as a polyamide resin and an aqueous solution containing 50% by mass in an equimolar salt of hexamethylenediamine and isophthalic acid as a polyamide resin. 1.12 kg and 0.38 kg of an aqueous solution containing 50% by mass of ε-caprolactam as a polyamide resin, and 7.5 kg of an aqueous solution containing 50% by mass of an equimolar salt of hexamethylenediamine and dodecanedioic acid as a polyamide resin were prepared. did. Next, the aqueous solution was charged into a 40 liter autoclave having a stirring device and having a discharge nozzle at the bottom, and the aqueous solution was sufficiently stirred at a temperature of 50 ° C. Next, after the inside of the autoclave was sufficiently substituted with nitrogen, the temperature inside the autoclave was increased from 50 ° C. to about 270 ° C. while stirring the aqueous solution. At this time, the pressure in the autoclave was about 1.8 MPa in terms of gauge pressure, but water was discharged from the system as needed so that the pressure did not exceed 1.8 MPa. Further, the polymerization time was adjusted so that the relative viscosity of the polyamide resin became the target relative viscosity. After the polymerization in the autoclave is completed, the polyamide resin is sent in a strand form from the lower nozzle, and after water cooling and cutting, pelletized polyhexamethylene adipamide, polyhexamethylene isophthalamide, polycoupleramide and polyhexamethylene sebacamide The copolymer (polyamide 66 / 6I / 6/612) was obtained. This polyamide copolymer was vacuum dried at 80 ° C. for 24 hours. The relative viscosity (ηr) of the polyamide copolymer was measured as described above and found to be 2.05.
[実施例1]
製造例1のポリアミド66/6I/6共重合体50質量部と、製造例2のポリアミド612重合体50質量部からなる混合物を、2軸押出機(東芝機械(株)製TEM35、2軸同方向スクリュー回転型、L/D=47.6(D=37mmφ))を用いて、ポリアミド混合物が十分溶融したところよりポリアミド混合物100質量部に対してガラス繊維100質量部となるようにサイドフィードし、溶融混錬を行った。スクリュー回転数300rpm、シリンダー温度280℃(先端ノズル付近のポリマー温度は、290℃であった。)、レート50kg/hrで、減圧しながら押出しを行った。先端ノズルからストランド状にポリマーを排出し、水冷、カッティングを行い、ペレットとした。表1に得られた成型体の評価結果を示す。
[Example 1]
A mixture of 50 parts by mass of polyamide 66 / 6I / 6 copolymer of Production Example 1 and 50 parts by mass of polyamide 612 polymer of Production Example 2 was mixed with a twin screw extruder (TEM 35 manufactured by Toshiba Machine Co., Ltd. Using a directional screw rotation type, L / D = 47.6 (D = 37 mmφ), when the polyamide mixture is sufficiently melted, side feed is performed so that the glass fiber becomes 100 parts by mass with respect to 100 parts by mass of the polyamide mixture. Melting and kneading were performed. Extrusion was performed while reducing the pressure at a screw speed of 300 rpm, a cylinder temperature of 280 ° C. (the polymer temperature in the vicinity of the tip nozzle was 290 ° C.), and a rate of 50 kg / hr. The polymer was discharged in a strand form from the tip nozzle, water-cooled and cut to form pellets. Table 1 shows the evaluation results of the moldings obtained.
[実施例2]
製造例1のポリアミド66/6I/6共重合体50質量部と、製造例2のポリアミド612重合体50質量部からなる混合物を、2軸押出機(東芝機械(株)製TEM35、2軸同方向スクリュー回転型、L/D=47.6(D=37mmφ))を用いて、ポリアミド混合物が十分溶融したところよりポリアミド混合物100質量部に対してガラス繊維150質量部となるようにサイドフィードし、溶融混錬を行った。スクリュー回転数300rpm、シリンダー温度280℃(先端ノズル付近のポリマー温度は、290℃であった。)、レート50kg/hrで、減圧しながら押出しを行った。先端ノズルからストランド状にポリマーを排出し、水冷、カッティングを行い、ペレットとした。表1に得られた成型体の評価結果を示す。
[Example 2]
A mixture of 50 parts by mass of polyamide 66 / 6I / 6 copolymer of Production Example 1 and 50 parts by mass of polyamide 612 polymer of Production Example 2 was mixed with a twin screw extruder (TEM 35 manufactured by Toshiba Machine Co., Ltd. Using a directional screw rotation type, L / D = 47.6 (D = 37 mmφ), when the polyamide mixture is sufficiently melted, side feed is performed so that the glass fiber becomes 150 parts by mass with respect to 100 parts by mass of the polyamide mixture. Melting and kneading were performed. Extrusion was performed while reducing the pressure at a screw speed of 300 rpm, a cylinder temperature of 280 ° C. (the polymer temperature in the vicinity of the tip nozzle was 290 ° C.), and a rate of 50 kg / hr. The polymer was discharged in a strand form from the tip nozzle, water-cooled and cut to form pellets. Table 1 shows the evaluation results of the moldings obtained.
[比較例1]
製造例1のポリアミド66/6I/6共重合体100質量部を2軸押出機(東芝機械(株)製TEM35、2軸同方向スクリュー回転型、L/D=47.6(D=37mmφ))を用いて、ポリアミド混合物が十分溶融したところよりポリアミド共重合体100質量部に対してガラス繊維150質量部となるようにサイドフィードし、溶融混錬を行った。スクリュー回転数300rpm、シリンダー温度280℃(先端ノズル付近のポリマー温度は、290℃であった。)、レート50kg/hrで、減圧しながら押出しを行った。先端ノズルからストランド状にポリマーを排出し、水冷、カッティングを行い、ペレットとした。表1に得られた成型体の評価結果を示す。
[Comparative Example 1]
100 parts by mass of polyamide 66 / 6I / 6 copolymer of Production Example 1 was added to a twin-screw extruder (TEM35, manufactured by Toshiba Machine Co., Ltd., twin-screw rotation type, L / D = 47.6 (D = 37 mmφ)) ) Was used to carry out melt-kneading by side-feeding from a place where the polyamide mixture was sufficiently melted to 100 parts by mass of the polyamide copolymer to 150 parts by mass of glass fibers. Extrusion was performed while reducing the pressure at a screw speed of 300 rpm, a cylinder temperature of 280 ° C. (the polymer temperature in the vicinity of the tip nozzle was 290 ° C.), and a rate of 50 kg / hr. The polymer was discharged in a strand form from the tip nozzle, water-cooled and cut to form pellets. Table 1 shows the evaluation results of the moldings obtained.
[比較例2]
製造例1のポリアミド66/6I/6共重合体50質量部と、製造例3のポリアミド66重合体50質量部からなる混合物を2軸押出機(東芝機械(株)製TEM35、2軸同方向スクリュー回転型、L/D=47.6(D=37mmφ))を用いて、ポリアミド混合物が十分溶融したところよりポリアミド混合物100質量部に対してガラス繊維150質量部となるようにサイドフィードし、溶融混錬を行った。スクリュー回転数300rpm、シリンダー温度280℃(先端ノズル付近のポリマー温度は、290℃であった。)、レート50kg/hrで、減圧しながら押出しを行った。先端ノズルからストランド状にポリマーを排出し、水冷、カッティングを行い、ペレットとした。表1に得られた成型体の評価結果を示す。
[Comparative Example 2]
A mixture of 50 parts by mass of polyamide 66 / 6I / 6 copolymer of Production Example 1 and 50 parts by mass of polyamide 66 polymer of Production Example 3 was mixed with a twin-screw extruder (TEM35, manufactured by Toshiba Machine Co., Ltd., biaxially in the same direction). Using a screw rotation type, L / D = 47.6 (D = 37 mmφ)), when the polyamide mixture is sufficiently melted, side feed is performed so that the glass fiber becomes 150 parts by mass with respect to 100 parts by mass of the polyamide mixture. Melt kneading was performed. Extrusion was performed while reducing the pressure at a screw speed of 300 rpm, a cylinder temperature of 280 ° C. (the polymer temperature in the vicinity of the tip nozzle was 290 ° C.), and a rate of 50 kg / hr. The polymer was discharged in a strand form from the tip nozzle, water-cooled and cut to form pellets. Table 1 shows the evaluation results of the moldings obtained.
[実施例3]
製造例1のポリアミド66/6I/6共重合体45質量部と、製造例2のポリアミド612重合体45質量部と、製造例4のポリアミド66/6I/6/612共重合体10質量部からなる混合物を、2軸押出機(東芝機械(株)製TEM35、2軸同方向スクリュー回転型、L/D=47.6(D=37mmφ))を用いて、ポリアミド混合物が十分溶融したところよりポリアミド混合物100質量部に対してガラス繊維150質量部となるようにサイドフィードし、溶融混錬を行った。スクリュー回転数300rpm、シリンダー温度280℃(先端ノズル付近のポリマー温度は、290℃であった。)、レート50kg/hrで、減圧しながら押出しを行った。先端ノズルからストランド状にポリマーを排出し、水冷、カッティングを行い、ペレットとした。表1に得られた成型体の評価結果を示す。
[Example 3]
From 45 parts by mass of polyamide 66 / 6I / 6 copolymer of Production Example 1, 45 parts by mass of polyamide 612 polymer of Production Example 2, and 10 parts by mass of polyamide 66 / 6I / 6/612 copolymer of Production Example 4 From the place where the polyamide mixture was sufficiently melted using a twin screw extruder (TEM35 manufactured by Toshiba Machine Co., Ltd., twin screw co-rotating screw type, L / D = 47.6 (D = 37 mmφ)) It melt-kneaded by carrying out the side feed so that it might become 150 mass parts of glass fibers with respect to 100 mass parts of polyamide mixtures. Extrusion was performed while reducing the pressure at a screw speed of 300 rpm, a cylinder temperature of 280 ° C. (the polymer temperature in the vicinity of the tip nozzle was 290 ° C.), and a rate of 50 kg / hr. The polymer was discharged in a strand form from the tip nozzle, water-cooled and cut to form pellets. Table 1 shows the evaluation results of the moldings obtained.
[実施例4]
製造例1のポリアミド66/6I/6共重合体48.8質量部と、製造例2のポリアミド612重合体48.8質量部と、硫化亜鉛2.4質量部からなる混合物を、2軸押出機(東芝機械(株)製TEM35、2軸同方向スクリュー回転型、L/D=47.6(D=37mmφ))を用いて、ポリアミド混合物が十分溶融したところよりポリアミドと硫化亜鉛の混合物100質量部に対してガラス繊維150質量部となるようにサイドフィードし、溶融混錬を行った。スクリュー回転数300rpm、シリンダー温度280℃(先端ノズル付近のポリマー温度は、290℃であった。)、レート50kg/hrで、減圧しながら押出しを行った。先端ノズルからストランド状にポリマーを排出し、水冷、カッティングを行い、ペレットとした。表1に得られた成型体の評価結果を示す。
[Example 4]
A mixture comprising 48.8 parts by mass of polyamide 66 / 6I / 6 copolymer of Production Example 1, 48.8 parts by mass of polyamide 612 polymer of Production Example 2, and 2.4 parts by mass of zinc sulfide was biaxially extruded. When the polyamide mixture is sufficiently melted using a machine (TEM35, manufactured by Toshiba Machine Co., Ltd., TEM35, 2-axis concentric screw rotation type, L / D = 47.6 (D = 37 mmφ)), a mixture of polyamide and zinc sulfide 100 is obtained. Side feed was performed so that the glass fiber was 150 parts by mass with respect to the mass part, and melt kneading was performed. Extrusion was performed while reducing the pressure at a screw speed of 300 rpm, a cylinder temperature of 280 ° C. (the polymer temperature in the vicinity of the tip nozzle was 290 ° C.), and a rate of 50 kg / hr. The polymer was discharged in a strand form from the tip nozzle, water-cooled and cut to form pellets. Table 1 shows the evaluation results of the moldings obtained.
実施例1〜4の成型体は、ドライ状態とウエット状態における曲げ弾性率の変化が少なく、吸水による寸法変化率が小さく、吸水率が小さく、耐衝撃性に優れていた。さらに、成型体のバリが短かった。即ち、実施例1〜4の成型体は、吸水時の剛性と寸法安定性、耐衝撃性、成型性のいずれについても優れていた。一方、比較例1、2の成型体は、吸水時の剛性と寸法安定性、耐衝撃性、成型性のいずれかについて劣っていた。
以上より、本実施形態のポリアミド樹脂組成物は、成型体とした際に耐衝撃性に優れるとともに、吸水時の剛性と寸法安定性に優れ、かつ成型性にも優れていることが示された。
The molded bodies of Examples 1 to 4 had a small change in flexural modulus in the dry state and the wet state, a small dimensional change rate due to water absorption, a small water absorption rate, and excellent impact resistance. Furthermore, the burr of the molded product was short. That is, the molded bodies of Examples 1 to 4 were excellent in all of rigidity and dimensional stability at the time of water absorption, impact resistance, and moldability. On the other hand, the molded bodies of Comparative Examples 1 and 2 were inferior in any of rigidity and dimensional stability at the time of water absorption, impact resistance, and moldability.
From the above, it was shown that the polyamide resin composition of the present embodiment is excellent in impact resistance when formed into a molded body, is excellent in rigidity and dimensional stability at the time of water absorption, and is excellent in moldability. .
本発明のポリアミド樹脂組成物及び成型体は、耐衝撃性に優れるとともに、吸水時の剛性と寸法安定性に優れ、かつ成型性にも優れている為、様々な携帯電子機器、電気電子部品などの産業用材料として有用である。 The polyamide resin composition and molded body of the present invention are excellent in impact resistance, excellent in rigidity and dimensional stability at the time of water absorption, and excellent in moldability, so that various portable electronic devices, electrical and electronic parts, etc. It is useful as an industrial material.
Claims (6)
(B)含有する窒素原子数に対する炭素原子数の比(C/N)が7以上12以下であり、アミノカルボン酸及び/又はジアミンとジカルボン酸の組み合わせから得られ、かつ、JIS K 6810に準じた98%硫酸中濃度1%、25℃で測定された相対粘度(ηr)が2.0〜2.5である、脂肪族ポリアミド樹脂と、
(C)ガラス繊維と、を含み、
前記(A)成分と前記(B)成分の質量比(A/B)が40/60〜60/40であり、
前記(A)成分と前記(B)成分との合計100質量部に対して、前記(C)成分20〜250質量部を含む、ポリアミド樹脂組成物。 (A) Hexamethylene adipamide unit (N66) obtained from hexamethylenediamine and adipic acid (N66) 70 to 85% by mass, hexamethyleneisophthalamide unit (N6I) and caproamide unit (N6) obtained from hexamethylenediamine and isophthalic acid ) And 15-30% by mass of repeating structural units, and the blending mass ratio (N61 / N6) of the hexamethyleneisophthalamide units and the caproamide units is 1.0 or more. A copolymerized polyamide resin;
(B) The ratio (C / N) of the number of carbon atoms to the number of nitrogen atoms contained is 7 or more and 12 or less, obtained from a combination of aminocarboxylic acid and / or diamine and dicarboxylic acid, and according to JIS K 6810 An aliphatic polyamide resin having a relative viscosity (ηr) measured at 25 ° C. of 2.0 to 2.5, and a 98% sulfuric acid concentration of 1%,
(C) glass fiber,
The mass ratio (A / B) of the component (A) and the component (B) is 40/60 to 60/40,
A polyamide resin composition comprising 20 to 250 parts by mass of the component (C) with respect to 100 parts by mass in total of the component (A) and the component (B).
前記(D)成分が、N66、N6I、N6及びポリアミド612単位からなる4元共重合体である、請求項3に記載のポリアミド樹脂組成物。 The component (B) is polyamide 612,
The polyamide resin composition according to claim 3, wherein the component (D) is a quaternary copolymer composed of N66, N61, N6, and polyamide 612 units.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009100680A JP5400457B2 (en) | 2009-04-17 | 2009-04-17 | Polyamide resin composition and molded body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009100680A JP5400457B2 (en) | 2009-04-17 | 2009-04-17 | Polyamide resin composition and molded body |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010248403A true JP2010248403A (en) | 2010-11-04 |
JP2010248403A5 JP2010248403A5 (en) | 2012-02-09 |
JP5400457B2 JP5400457B2 (en) | 2014-01-29 |
Family
ID=43311099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009100680A Expired - Fee Related JP5400457B2 (en) | 2009-04-17 | 2009-04-17 | Polyamide resin composition and molded body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5400457B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011155596A1 (en) * | 2010-06-11 | 2011-12-15 | 旭化成ケミカルズ株式会社 | Polyamide and polyamide composition |
JP2013151665A (en) * | 2011-12-28 | 2013-08-08 | Toray Ind Inc | Moldded article having weld part |
JP2014019791A (en) * | 2012-07-18 | 2014-02-03 | Asahi Kasei Chemicals Corp | Plastic hook compact comprising polyamide resin composition |
JP2015013984A (en) * | 2013-06-05 | 2015-01-22 | 旭化成ケミカルズ株式会社 | Polyamide resin composition and molded body |
WO2016098403A1 (en) * | 2014-12-19 | 2016-06-23 | オリンパス株式会社 | Mirror frame, lens barrel, and optical device |
JP2018188533A (en) * | 2017-05-01 | 2018-11-29 | 旭化成株式会社 | Polyamide composition and molded article |
JP2019183039A (en) * | 2018-04-13 | 2019-10-24 | ユニチカ株式会社 | Manufacturing method of copolymerization semi-aromatic polyamide |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004346240A (en) * | 2003-05-23 | 2004-12-09 | Mitsubishi Engineering Plastics Corp | Thermoplastic polyamide resin composition |
JP2006193727A (en) * | 2004-12-13 | 2006-07-27 | Toray Ind Inc | Polyamide resin composition, molded product, and casing |
JP2008512525A (en) * | 2004-09-13 | 2008-04-24 | ランクセス・ドイチュランド・ゲーエムベーハー | Halogen-free flame retardant thermoplastic molding composition based on polyamide with improved glow wire resistance |
JP2008106265A (en) * | 2006-09-29 | 2008-05-08 | Toray Ind Inc | Polyamide resin composition and molded article comprising the same |
JP2008111064A (en) * | 2006-10-31 | 2008-05-15 | Toray Ind Inc | Polyamide resin composition and molded product |
JP2008291248A (en) * | 2007-04-24 | 2008-12-04 | Toray Ind Inc | Resin composition and molded article comprising the same |
JP2010037372A (en) * | 2008-08-01 | 2010-02-18 | Toray Ind Inc | Polyamide resin composition and molded article comprising the same |
JP2010248402A (en) * | 2009-04-17 | 2010-11-04 | Asahi Kasei Chemicals Corp | Polyamide resin composition and molding formed of the same |
-
2009
- 2009-04-17 JP JP2009100680A patent/JP5400457B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004346240A (en) * | 2003-05-23 | 2004-12-09 | Mitsubishi Engineering Plastics Corp | Thermoplastic polyamide resin composition |
JP2008512525A (en) * | 2004-09-13 | 2008-04-24 | ランクセス・ドイチュランド・ゲーエムベーハー | Halogen-free flame retardant thermoplastic molding composition based on polyamide with improved glow wire resistance |
JP2006193727A (en) * | 2004-12-13 | 2006-07-27 | Toray Ind Inc | Polyamide resin composition, molded product, and casing |
JP2008106265A (en) * | 2006-09-29 | 2008-05-08 | Toray Ind Inc | Polyamide resin composition and molded article comprising the same |
JP2008111064A (en) * | 2006-10-31 | 2008-05-15 | Toray Ind Inc | Polyamide resin composition and molded product |
JP2008291248A (en) * | 2007-04-24 | 2008-12-04 | Toray Ind Inc | Resin composition and molded article comprising the same |
JP2010037372A (en) * | 2008-08-01 | 2010-02-18 | Toray Ind Inc | Polyamide resin composition and molded article comprising the same |
JP2010248402A (en) * | 2009-04-17 | 2010-11-04 | Asahi Kasei Chemicals Corp | Polyamide resin composition and molding formed of the same |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011155596A1 (en) * | 2010-06-11 | 2011-12-15 | 旭化成ケミカルズ株式会社 | Polyamide and polyamide composition |
JP5451880B2 (en) * | 2010-06-11 | 2014-03-26 | 旭化成ケミカルズ株式会社 | Polyamide and polyamide composition |
US8933167B2 (en) | 2010-06-11 | 2015-01-13 | Asahi Kasei Chemicals Corporation | Polyamide and polyamide composition |
JP2013151665A (en) * | 2011-12-28 | 2013-08-08 | Toray Ind Inc | Moldded article having weld part |
JP2014019791A (en) * | 2012-07-18 | 2014-02-03 | Asahi Kasei Chemicals Corp | Plastic hook compact comprising polyamide resin composition |
JP2015013984A (en) * | 2013-06-05 | 2015-01-22 | 旭化成ケミカルズ株式会社 | Polyamide resin composition and molded body |
WO2016098403A1 (en) * | 2014-12-19 | 2016-06-23 | オリンパス株式会社 | Mirror frame, lens barrel, and optical device |
JP2018188533A (en) * | 2017-05-01 | 2018-11-29 | 旭化成株式会社 | Polyamide composition and molded article |
JP2019183039A (en) * | 2018-04-13 | 2019-10-24 | ユニチカ株式会社 | Manufacturing method of copolymerization semi-aromatic polyamide |
JP7037816B2 (en) | 2018-04-13 | 2022-03-17 | ユニチカ株式会社 | Method for Producing Copolymerized Semi-Aromatic Polyamide |
Also Published As
Publication number | Publication date |
---|---|
JP5400457B2 (en) | 2014-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5400457B2 (en) | Polyamide resin composition and molded body | |
JP5400456B2 (en) | Polyamide resin composition and molded body comprising the same | |
JP5964964B2 (en) | Polyamide, polyamide composition and molded article | |
JP5853021B2 (en) | Reinforced polyamide resin pellets | |
JP2008088377A (en) | Polyamide resin composition for breaker box body and breaker box body | |
KR20090127905A (en) | Glass fiber reinforced polyamide resin composition | |
JP5625668B2 (en) | Polyamide resin composition and molding method thereof | |
JP5371683B2 (en) | Manufacturing method of polyamide resin composition pellets | |
WO2012161064A1 (en) | Polyamide resin composition for optical components | |
JP2009269952A (en) | Polyamide resin composition for screw member | |
JP5516265B2 (en) | Molding method of polyamide resin composition | |
US4866115A (en) | Solid mixture of nucleated and nonnucleated polyamides | |
JP5570703B2 (en) | Long glass fiber reinforced polyamide resin composition, resin pellets, and molded articles thereof | |
JP5854564B2 (en) | Polyamide resin composition and molded product | |
JP6447041B2 (en) | Manufacturing method of polyamide resin molded product | |
JP5736710B2 (en) | Polyamide resin composition | |
JP2015124260A (en) | High melting point polyamide resin composition excellent in oscillation and hot rigidity during water absorption | |
JP6195766B2 (en) | Polyamide resin composition and molded product | |
JP5818184B2 (en) | High melting point polyamide resin composition with excellent vibration and appearance at the time of water absorption | |
JP2008007614A (en) | Flame-retardant polyamide resin composition and process for producing the same | |
JP2021080344A (en) | Polyamide resin composition | |
JP5669623B2 (en) | Polyamide resin composition and molded product | |
JP4633532B2 (en) | Airtight switch parts | |
CN106554616A (en) | Amilan polyamide resin composition and its molded body | |
CN112592582B (en) | Polyamide resin composition, molded article comprising same, and in-vehicle camera component |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111214 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111214 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130313 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130725 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130920 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131022 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131025 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5400457 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |