JP2010247461A - Imprinting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imprinting method preventing the occurrence of breakage of an imprint mold and the occurrence of pattern defects due to bending of the imprint mold. <P>SOLUTION: A first supporting/cushioning layer 15 equipped with two layers of a first supporting layer 12 and a first cushioning layer 13 made of material softer than the first supporting layer is arranged between a first stage 11 with a molded body 10 placed thereon and the molded body. A second supporting/cushioning layer 25 equipped with two layers of a second supporting layer 22 and a second cushioning layer 23 made of material softer than the second supporting layer is arranged between the imprint mold 3 arranged so that an uneven pattern forming surface 4 faces to the molded body and a second stage 21 facing to the first stage via the molded body and the imprint mold. The imprint mold 3 is pressed to the molded body 10 to form a pattern corresponding to the uneven pattern of the imprint mold on the molded body. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  In the present invention, an imprint mold having a concavo-convex pattern formed on the surface is pressed against an object to be molded (for example, a resin on which a desired pattern is transferred onto a substrate), and the concavo-convex shape of the imprint mold The present invention relates to an imprint method in which a pattern is transferred to a molding object and a pattern is formed on the molding object.

  In recent years, imprint methods have been used in the formation process of fine patterns in the manufacturing process of semiconductor devices, displays, recording media, biochips, optical devices and the like.

  In this imprint method, an imprint mold on which a concavo-convex pattern corresponding to a negative / positive reversal image of a pattern to be finally transferred is pressed against a resin film or the like formed on a substrate to form a concavo-convex pattern on the imprint mold. This is a method of transferring a corresponding pattern to a molding target.

By the way, there is a thermal imprint process as one of the methods for transferring the concavo-convex pattern to the object to be molded using such an imprint method. As an apparatus used for this thermal imprint process, an imprint apparatus as shown in FIG. 18 has been proposed (see Patent Document 1).
In other words, the imprint apparatus transfers a mold pattern 62 formed on the imprint mold 61 and a transfer product 53 (including a substrate 51 and a resist film 52 disposed on the substrate 51). In order to suppress misalignment between patterns, a first buffer sheet 81 is disposed between the stationary stage 71 and the molded product 53 placed thereon, and the imprint mold 61 and the movable that holds it. A second buffer sheet 82 is disposed between the stage 72 and the stage 72.

  According to this imprint apparatus, the tensile force applied from the respective stages to the substrate and the mold is absorbed by the buffer member, so that the pattern transferred to the mold and the pattern transferred to the substrate by the thermal expansion of the stage It is said that it is possible to suppress the occurrence of minute deviations between

  However, in this imprint apparatus, when a buffer sheet that is flexible and has a large cushioning property (deformation amount) is used as the first and second buffer sheets 81 and 82, the first and second buffer sheets 81 and 82 are used during pressing. Is greatly deformed (collapsed) and extends in the plane direction, the thickness of the first and second buffer sheets 81 and 82 is increased at the peripheral edge of the imprint mold 61 and the peripheral edge of the substrate 51, or the first In addition, wrinkles may enter the second buffer sheets 81 and 82, and a load is applied to a part of the imprint mold 61, and the imprint mold 61 may be damaged.

  Further, when the arrangement of the mold patterns 62 arranged in the imprint mold 61 is not uniform, distribution (variation) occurs in the thickness of the resist film (resin) 52 in the transfer area during pressing. Then, the first and second buffer sheets 81 and 82 are deformed according to the distribution, and as a result, the imprint mold 61 may bend and a pattern defect or damage to the imprint mold 61 may occur.

  On the other hand, when a buffer sheet made of a material that is hard and has a small deformation amount is used as the first and second buffer sheets 81 and 82, non-uniformity of the first and second stages 71 and 72, dust, and the like during pressing. In other words, it is impossible to absorb the minute unevenness caused by the above, and a load is applied to a part of the imprint mold, and the imprint mold is damaged.

JP 2008-49544 A

  The present invention solves the above-mentioned problem, and a load is applied to a part of the imprint mold during pressing, preventing the imprint mold from being bent and causing pattern defects or damage to the imprint mold. An object of the present invention is to provide an imprint method that can be performed.

In order to solve the above problem, the imprint method of the present invention provides:
The imprint mold having a concavo-convex pattern formed on the surface thereof is pressed onto a molding target on which a predetermined pattern is to be formed, and the concavo-convex pattern of the imprint mold is transferred to the molding target, thereby the molding target. An imprint method for forming a pattern on a body,
A first support layer disposed on the first stage side and a first support layer disposed on the molded body side between the first stage on which the molded body is placed and the molded body; A first support / buffer layer having a two-layer structure including two layers of a first buffer layer made of a material softer than one support layer;
The imprint mold disposed so that the concavo-convex pattern forming surface faces the molding target, and the second stage facing the first stage via the molding target and the imprint mold Between the two layers, a second support layer disposed on the second stage side and a second buffer layer disposed on the imprint mold side and made of a softer material than the second support layer. A second support / buffer layer having a two-layer structure is provided;
The first and / or second stage is moved in a direction in which both approach each other, the imprint mold is pressed against the molding object, and the pattern corresponding to the uneven pattern of the imprint mold is pressed against the molding object It is characterized by forming.

In the present invention, the object to be molded is one in which a resin layer, a glass paste layer, a ceramic paste layer or the like on which a predetermined pattern is to be formed is disposed on the surface of the substrate or the surface of the carrier film. Examples thereof include those made of a single material for forming a predetermined pattern.
For example, if a photosensitive (photo-curable) material is used as a resin layer, a glass paste layer, a ceramic paste layer, etc., the photo-imprint method can be applied, and if a thermoplastic material is used, a heat imprinting method can be applied. It becomes possible to apply the printing method.

  Moreover, as the first support layer and the second support layer, it is desirable to use a resin film having a thickness of 0.01 to 2.0 mm.

  Moreover, it is desirable to use what consists of an elastomer with a thickness of 0.01-2.0 mm as said 1st buffer layer and 2nd buffer layer.

  Further, it is preferable that the first buffer layer and the second buffer layer have a thickness of 0.01 to 2.0 mm and have adhesiveness.

  In the imprint method of the present invention, the first support layer disposed on the first stage side and the molding target side are disposed between the first stage on which the molding target is placed and the molding target. The first support / buffer layer having a two-layer structure including two layers of the first buffer layer made of a softer material than the first support layer is disposed, and the concavo-convex pattern forming surface faces the molding target. A second support layer disposed on the second stage side between the imprint mold disposed as described above and the second stage facing the first stage via the workpiece and the imprint mold, In the state where the second support / buffer layer provided with two layers of the second buffer layer of the two-layer structure made of a material softer than the second support layer, which is disposed on the imprint mold side, is disposed. Press the mold against the workpiece and imprint it onto the workpiece. Since the pattern corresponding to the concave / convex pattern of the mold is formed, it becomes possible to suppress the elongation of the buffer layer by the support layer, and a load is applied to a part of the imprint mold, and the imprint mold is damaged. It becomes possible to prevent this efficiently.

  That is, when the first and second support / buffer layers have a two-layer structure of a support layer and a buffer layer, the imprint mold is pressed against the molding object, and the uneven pattern is transferred to the molding object. The elongation in the planar direction of the first and second support / buffer layers can be suppressed or prevented. As a result, it is possible to sufficiently suppress and prevent a part of the imprint mold from being subjected to a load in the imprint process, and a highly reliable imprint method that does not cause pattern defects or damage to the imprint mold. It becomes possible to provide.

  In addition, as a support layer, it is desirable to use what consists of material whose Young's modulus is 0.1 GPa or more (harder than a buffer layer), for example.

  Moreover, as a buffer layer, it is desirable to use what consists of material whose Young's modulus is less than 0.1 GPa (softer than a support layer), for example.

Moreover, the plane of the 1st and 2nd support and buffer layer at the time of pressing an imprint mold by using a resin film with a thickness of 0.01-2.0 mm as a 1st support layer and a 2nd support layer. It becomes possible to more reliably suppress and prevent the elongation in the direction, and to make the present invention more effective.
If the thicknesses of the first support layer and the second support layer are less than 0.01 mm, wrinkles easily enter the first and second support / buffer layers, and the mold may be damaged. If it exceeds 2.0 mm, the heat conduction becomes insufficient, and for example, there is a possibility of causing trouble in the case of thermal imprinting.

  Examples of the resin film that can be used in the present invention include a material having a Young's modulus of 0.1 GPa or more and a material harder than the buffer layer, such as a film made of polyethylene terephthalate, polyester, polyimide, or the like. .

Moreover, the stress applied to the imprint mold when the imprint mold is pressed can be efficiently relieved by using the first buffer layer and the second buffer layer made of an elastomer having a thickness of 0.01 to 2.0 mm. can do.
The buffer layer is a material that has a Young's modulus of less than 0.1 GPa and is softer than the support layer. For example, the buffer layer is made of an acrylic, synthetic rubber, or silicon adhesive material, or an elastomer such as silicone rubber or fluororubber. This is exemplified. If the thickness of the first buffer layer and the second buffer layer is less than 0.01 mm, sufficient buffering properties cannot be obtained, and if the thickness exceeds 2.0 mm, the amount of deformation becomes too large to cause a harmful effect. The thickness of the layer and the second buffer layer is preferably in the range of 0.01 to 2.0 mm.

Moreover, as a 1st buffer layer and a 2nd buffer layer, by using what has a thickness of 0.01-2.0 mm and has adhesiveness, a buffer layer, an imprint mold, and a to-be-molded body are bonded together. It becomes possible to handle easily and it becomes possible to improve productivity.
Examples of the buffer layer having adhesiveness include a film made of an acrylic, synthetic rubber, or silicon adhesive material.

It is a figure which shows the structure of the to-be-molded body used in enforcing the imprint method of Example 1 of this invention. It is a figure which shows the structure of the imprint mold used for implementing the imprint method of Example 1 of this invention. It is a figure which shows notionally the state which is pressing the imprint mold to the to-be-molded body of FIG. It is a figure which shows the detailed structure at the time of pressing the imprint mold to a to-be-molded body. It is a figure which shows the exposure process after the press process of FIG. 4 is complete | finished. It is a figure which shows the state which removed the imprint mold after completion | finish of the exposure process of FIG. It is a figure which shows the resin pattern obtained by removing an uncured film (residual film) by development. It is a figure which shows the structure of the to-be-molded body used in order to implement the imprint method of the other Example (Example 2) of this invention. It is a figure which shows the state which is pressing the imprint mold to the to-be-molded body of FIG. In Example 2, it is a figure which shows the exposure process to the electrically conductive paste for wiring of the 1st layer after the imprint. It is a figure which shows the state which removed the imprint mold after completion | finish of the exposure process of FIG. It is a figure which shows the wiring pattern obtained by removing an uncured film (residual film) by development. It is a figure which shows the process of forming the insulating pattern of the 2nd layer. It is a figure which shows the state which formed the through-hole for via holes in the insulating pattern of the 2nd layer. It is a figure which shows the exposure process to the uppermost (3rd layer) insulation pattern. FIG. 16 is a diagram showing a state in which dicing is performed and divided into individual chips after completion of the exposure process of FIG. 15. It is a figure which shows typically the structure of the multilayer electronic component (multilayer coil component) manufactured by the method concerning Example 1 of this invention. It is a figure which shows the structure of the apparatus used for the conventional thermal imprint process.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

(1) As shown in FIG. 1, a resin paste (photosensitive Ag paste) 2 is applied to a thickness of 10 μm on a substrate 1 by screen printing to obtain a molded body 10.
In this embodiment, a resin paste (photosensitive Ag paste) containing an acrylic photosensitive resin and Ag powder is used as the resin paste 2, but the resin paste 2 is not limited to this, and other thermoplastics may be used. It is also possible to use a resin paste or a resin having a Tg of room temperature or lower.
Specifically, for example, acrylic resins, novolak resins, photosensitive resins other than acrylic photosensitive resins, or photosensitive metal pastes containing these photosensitive resins and metal powders such as Ag are used. Is possible.
As a coating method, for example, methods such as screen printing and spin coating can be used.

(2) Then, as shown in FIG. 3, the imprint mold 3 (FIG. 2) is arranged such that the concave-convex pattern forming surface 4 faces the molding body 10 (in this embodiment, the molding body 10 is And is pressed (pressed) against the molded body 10 at a pressure of 5 MPa while being heated to 100 ° C.
As shown in FIG. 2, as the imprint mold 3, for example, a 1.5 mm thick quartz is processed by RIE, and a desired concavo-convex pattern 17 (for example, a step of 50 μm or more) including the concave portions 5a and the convex portions 5b is provided. In addition, a structure in which a light-shielding film (light-shielding film) 16 such as a Ni film is formed at the tip of the convex portion 5b was used.

At this time, specifically, as shown in FIG. 4, the first stage 11 disposed on the first stage 11 side between the first stage 11 on which the molding target 10 is placed and the molding target 10. A first support / buffer layer 15 having a two-layer structure including two layers, a support layer 12 and a first buffer layer 13 made of a material softer than the first support layer 12 and disposed on the molding target 10 side. Is disposed.
Further, as shown in FIG. 4, the imprint mold 3 in which the concave / convex pattern forming surface 4 is disposed so as to face the molding target 10, and the first stage via the molding target 10 and the imprint mold 3. 11 and the second stage 21 facing the second support layer 22 disposed on the second stage 21 side, and a material softer than the second support layer 22 disposed on the imprint mold 3 side. A second support / buffer layer 25 having a two-layer structure including two layers of the second buffer layer 23 is provided.

  In this state, the imprint mold 3 is pressed to the molding target 10. Thereby, the concavo-convex pattern 17 of the imprint mold 3 is transferred to the molding target 10.

  Although the heating temperature at the time of pressing was set to 100 ° C. as described above, it may be higher than the glass transition temperature (Tg) of the resin contained in the resin paste 2. If Tg is below room temperature, you may press at room temperature.

  The pressing pressure can form (transfer) a desired uneven pattern on the molding object (specifically, the resin paste 2 applied on the substrate 1), and the molding object (resin paste 2). It is sufficient that the resin contained in the resin is in a pressure range in which the resin is not thermally cured.

  The first and second buffer layers 13 and 23 are made of a material having a Young's modulus of less than 0.1 GPa (soft). For example, an acrylic, synthetic rubber, or silicon adhesive, or an elastomer such as silicone rubber or fluororubber is used. The thickness is desirably 0.01 mm to 2.0 mm.

  The first and second support layers 12 and 22 are made of a (hard) material having a Young's modulus of 0.1 GPa or more. For example, a film made of polyethylene terephthalate, polyester, or polyimide is used. The thickness is desirably 0.01 to 2.0 mm.

  The first support layer 12 and the first buffer layer 13 constituting the first and second support / buffer layer buffer materials 15 and 25, and the second support layer 22 and the second buffer layer 23 are in close contact with each other. Is formed.

  In the case where an adhesive is used as the first and second buffer layers 13 and 23, the first and second support layers 12 and 22 can be brought into close contact with each other by utilizing the adhesiveness of the buffer layer itself.

  Further, as the first and second support / buffer layers 15, 25, an adhesive film such as a commercially available thermal release sheet (manufactured by Nitto Denko: Riva Alpha) can be used.

(3) Then, the imprint mold 3 and the molded body 10 are cooled, and the molded body 10 (resin paste 2) is exposed and cured with an exposure amount of 500 mJ / cm ² (FIG. 5).
The exposure amount is determined by the sensitivity of the photocurable material used for the resin paste (photosensitive Ag paste) 2. It is appropriate usually ^{10mJ / cm 2 ~2000mJ / cm 2} .
The exposure step may be omitted if it is not necessary, such as when no photosensitive resin is used.
In some cases, the exposure may be performed before the above cooling is completed.

  (4) The imprint mold 3 is released from the molding target 10. As a result, as shown in FIGS. 5 and 6, the resin paste (photosensitive Ag paste) 2 is molded on the substrate 1 into a shape corresponding to the shape of the recess 5 a of the imprint mold 3 and photocured. The region (resin pattern) 2a and the uncured region (uncured film) 2b that has been thinned by being pressed by the convex portion 5b of the optical imprint mold 3 remain.

(5) Then, the uncured film (residual film) 2b (FIG. 6) is removed by wet etching (development) to obtain a resin pattern 2a (FIG. 7). Here, although a 4% triethanolamine aqueous solution is used as the developer, the developer is not limited to this.
The uncured film (residual film) 2b (FIG. 6) can be removed by dry etching in some cases.

  As described above, the support / buffer layer has a two-layer structure of a soft buffer layer and a support layer that is harder than the buffer layer, thereby preventing the buffer layer from being stretched or wrinkled. It is possible to prevent the imprint mold from being damaged due to a part of the load being applied.

  In addition, by using the support / buffer layer having the two-layer structure as described above, the pressure due to minute unevenness caused by the bite of dust is dispersed, and the occurrence of pattern defects due to the pressure distribution, the imprint mold It becomes possible to prevent damage and the like.

  Further, since the deformation of the buffer layer is suppressed by the support layer made of a hard material, the support / buffer layer as a whole can be easily handled.

  Further, when an adhesive layer is used as the buffer layer, the imprint process can be efficiently carried out by bonding the support / buffer layer and the object to be molded or the imprint mold.

  In Example 2, a case where a multilayer inductor having a coil formed therein by connecting layers of wiring (coil conductors) having a multi-layer structure formed by applying the imprint method of the present invention is manufactured. Let's take an example.

  (1) As shown in FIG. 8, a carrier film 32 is attached to the substrate 31, and a first insulating paste 33 a is applied on the carrier film 32 by printing. The insulating paste 33a is cured to form the lowermost (first) insulating layer 43a.

  As the substrate 31, a quartz substrate having a surface roughness Ra = 0.1 to 1 μm, a thickness of 3 mm, and 100 mm □ can be used.

  As the carrier film 32, a foam release sheet (manufactured by Nitto Denko: Riva Alpha) or the like can be used.

As the insulating paste 33a, for example, a photosensitive glass paste is used and cured by UV irradiation. As the exposure amount, an exposure amount at which the insulating paste is sufficiently cured is used. For example, in the case of a photosensitive glass paste using a general photosensitive acrylic resin, the received light amount is about 2000 mJ / cm ² .

(2) Furthermore, the wiring conductive paste 34 is printed on the insulating layer 43a to a thickness of 10 μm. Thereby, the to-be-molded body 40 provided with the board | substrate 31, the carrier film 32, the insulating layer 43a, and the resin paste (photosensitive Ag paste) 34 is formed.
As the conductive paste 34 for wiring, a photosensitive paste, for example, a photosensitive Ag paste is used.
As a coating method, for example, spin coating or the like can be used. In this case, the conductive paste for wiring on the outer peripheral portion is removed by, for example, dropping a rinse solution onto the outer peripheral portion of the substrate (edge rinsing).

(3) As shown in FIG. 9, the concavo-convex pattern forming surface 4 on the lower surface side of the imprint mold 3 includes a substrate 31, a carrier film 32, an insulating layer 43a, and a resin paste (photosensitive Ag paste) 34. They are superposed so as to face the molding target 40 and pressed (pressed) against the molding target 40 at a pressure of 5 MPa while being heated to 100 ° C.
In addition, as the imprint mold 3, the thing of the same structure as what was used in Example 1 was used (refer FIG. 2).

  At this time, specifically, as shown in FIG. 9, the first stage 11 disposed on the first stage side 11 is between the first stage 11 on which the molding target 40 is placed and the molding target 40. The first support / buffer layer 15 having a two-layer structure including the support layer 12 and the first buffer layer 13 made of a material softer than the first support layer 12 and disposed on the molding target 40 side. Is disposed.

  Further, as shown in FIG. 9, the imprint mold 3 is disposed so that the concave / convex pattern forming surface 4 faces the molding target 40, and the first stage via the molding target 40 and the imprint mold 3. 11 and the second stage 21 facing the second support layer 22 disposed on the second stage 21 side, and a material softer than the second support layer 22 disposed on the imprint mold 3 side. A second support / buffer layer 25 having a two-layer structure including two layers of the second buffer layer 23 is provided.

  Then, in this state, the imprint mold 3 is pressed onto the molding target 40. Thereby, the uneven | corrugated pattern 17 of the imprint mold 3 is transcribe | transferred to the to-be-molded body 40 (conductive paste 34 for wiring).

  The heating temperature should just be more than the glass transition temperature (Tg) of process material (Thermoplastic material (resin) contained in the electrically conductive paste 34 for wiring).

  Further, the pressure during pressing can form desired irregularities on the object to be molded (specifically, resin contained in the conductive paste for wiring), and the object to be molded (resin included in the conductive paste for wiring). Any pressure range that does not cause thermosetting is acceptable.

  For the first and second buffer layers 13 and 23, a material having a Young's modulus of less than 0.1 GPa (soft) is used as in the first embodiment. For example, an acrylic, synthetic rubber, or silicon adhesive, or an elastomer such as silicone rubber or fluororubber is used. The thickness is desirably 0.01 mm to 2.0 mm.

Further, the first and second support layers 12 and 22 are made of a (hard) material having a Young's modulus of 0.1 GPa or more, similar to that used in the first embodiment. For example, a film made of polyethylene terephthalate, polyester, or polyimide is used. The thickness is desirably 0.01 to 2.0 mm.
Similarly to the case of Example 1, the first support layer 12 and the first buffer layer 13 constituting the first and second support / buffer layer cushioning materials 15 and 25, the second support layer 22 and The second buffer layers 23 are formed in close contact with each other.

(4) Then, the imprint mold 3 and the molded body 40 are cooled, and the molded body 40 (photosensitive Ag paste 34) is exposed and cured with an exposure amount of 500 mJ / cm ² (FIG. 10).
The exposure amount is determined by the sensitivity of the photocurable material used for the photosensitive Ag paste 34. It is appropriate usually ^{10mJ / cm 2 ~2000mJ / cm 2} .
The exposure step may be omitted if it is not necessary, such as when no photosensitive resin is used.
In some cases, the exposure may be performed before the above cooling is completed.

  (5) The imprint mold 3 is released from the molding target 40. As a result, as shown in FIGS. 11 and 12, a region (wiring pattern) 34a formed on the substrate 31 is molded into a shape corresponding to the shape of the recess 5a (FIG. 2) of the imprint mold 3 and is photocured. The uncured region (uncured film) 34b that has been thinned by being pressed by the convex portion 5b of the imprint mold 3 remains.

(6) Then, the uncured film (residual film) 34b is removed by wet etching (development) to obtain a first-layer wiring pattern 34a (FIG. 12). Here, for example, a 4% triethanolamine aqueous solution is used as the developer.
Note that the remaining film may be removed by dry etching in some cases.

(7) Next, the wiring pattern 34a is subjected to a decompression process at 90 ° C. and 10 Pa for 60 minutes, and then heated to 200 ° C. with a hot plate.
The conditions for the decompression process are not limited to this. If the pressure is 100 Pa or less, the effect can be obtained in a shorter time.

(8) Then, as shown in FIG. 13, a second layer of insulating paste 33b is applied on the wiring pattern 34a by a screen printing method using a screen plate 38a and a squeegee 38b to a thickness of 10 μm.
Note that the method of applying the second-layer insulating paste 33b is not limited to the screen printing method, and other methods can be used.
For example, the same photosensitive glass paste as the first-layer insulating paste 33a can be used as the insulating paste 33b. It is also possible to use a different one from the first-layer insulating paste.

(9) Then, if necessary, a via hole through hole 36 is formed in the second insulating paste 33b as shown in FIG.
In the case of a photosensitive glass paste, a via hole pattern can be formed by photolithography. Examples of processing conditions include an exposure amount of 100 mJ / cm ² , development for 30 seconds (developer: 2% Na ₂ CO ₃ aqueous solution), and the like.
Simultaneously with the formation of the via hole through hole 36 or after the formation of the via hole through hole 36, the insulating paste 33b is cured to form the second insulating layer 43b.

  (10) Then, the steps (2) to (9) are repeated to form a predetermined number of wiring patterns 34a, and then the third-layer insulating paste 33c is printed on the uppermost wiring pattern 34a. The uppermost (third) insulating layer 43c is formed by UV irradiation and curing (FIG. 15).

  In FIG. 15, for the sake of convenience, the wiring pattern has a two-layer structure and the interlayer connection is shown by the via-hole conductor 37. However, the wiring pattern can have a multilayer structure of three or more layers. In the case of the multilayer inductor as in the embodiment, it usually has a multilayer structure of three or more layers.

  Also, as the insulating paste 33c for forming the uppermost insulating layer, for example, the same photosensitive glass paste as the first and second insulating pastes 33a and 33b is used. However, it is possible to use a different one from the first and second insulating pastes.

  (11) Then, the wafer is diced and divided into individual chips, the carrier film is peeled off, and the substrate is removed.

  (12) A chip element is obtained by firing individual chips 39 (FIG. 16). Then, after the chip element is barrel-polished as necessary, external electrodes are formed.

  Thereby, as schematically shown in FIG. 17, a wiring (coil conductor) 134 obtained by firing the wiring pattern (34 a (FIG. 15)) is a via-hole conductor (not shown) disposed in the insulating layer 143. Thus, the laminated coil component 100 including a pair of external electrodes 140a and 140b arranged to be electrically connected to both ends of the coil 120 is obtained. As the external electrode, for example, an external electrode having a structure in which a Ni layer is used as a lower layer and Cu plating, Sn plating, or the like is applied thereon is formed.

Also in the second embodiment, as described above, since the first and second support / buffer layers have a two-layer structure of a soft buffer layer and a support layer harder than the buffer layer, an imprint mold is used. Even when a multilayer inductor is manufactured by repeatedly performing a process of forming a wiring pattern by pressing to a photosensitive Ag paste, it is possible to suppress and prevent the elongation of the buffer layer and the generation of wrinkles in the imprint process. As a result, it is possible to efficiently prevent the imprint mold from being damaged by applying a load to a part of the imprint mold. In addition, it is possible to prevent the occurrence of pattern defects due to the damage of the imprint mold or the pressure distribution by dispersing the pressure due to minute unevenness due to the biting of dust.
In other respects, the same effects as those of the first embodiment can be obtained.

  In the first and second embodiments, the case where the multilayer inductor is manufactured has been described as an example. However, the present invention can also be applied to the case where other multilayer electronic components such as an LC filter are manufactured. is there.

  In the above-described embodiment, the case where the photosensitive Ag paste is patterned by the photoimprinting method to form the wiring pattern has been described as an example. However, the present invention is not limited to this, and the thermosetting paste film is used. It is also possible to apply to the case of patterning by thermal imprinting.

  In Example 2, the photolithography method was used to form the through hole for the via hole in the insulating layer. However, it can also be formed by the optical imprint method using the mold processed into the shape of the through hole for the via hole. It is.

  The present invention is not limited to the above embodiments in other points, and various applications and modifications can be made within the scope of the invention.

1 Substrate 2 Resin paste (photosensitive Ag paste)
2a Photocured region of photosensitive Ag paste (resin pattern)
2b Uncured region of photosensitive Ag paste 3 Imprint mold 4 Concavity and convexity pattern forming surface 10 Molded object 5a Concave portion of imprint mold 5b Convex portion of imprint mold 11 First stage 12 First support layer 13 First buffer layer 15 First support / buffer layer 16 Film (light-shielding film)
17 Concavity and convexity pattern 21 Second stage 22 Second support layer 23 Second buffer layer 25 Second support / buffer layer 31 Substrate 32 Carrier film 33a First insulating paste 33b Second insulating paste 33c Third insulating paste 34 Conductive paste for wiring (photosensitive Ag paste)
34a Photocured region (wiring pattern) of photosensitive Ag paste
34b Uncured region of photosensitive Ag paste 36 Via-hole through-hole 37 Via-hole conductor 38a Screen plate 38b Squeegee 39 Chip 40 Molded body 43a Lowermost insulating layer cured insulating paste 43b Second insulating layer 43c Uppermost layer (Third layer) insulating layer 100 laminated coil component 120 coil 134 coil conductor 143 insulating layer 140a, 140b external electrode

Claims (4)

The imprint mold having a concavo-convex pattern formed on the surface thereof is pressed onto a molding target on which a predetermined pattern is to be formed, and the concavo-convex pattern of the imprint mold is transferred to the molding target, thereby the molding target. An imprint method for forming a pattern on a body,
A first support layer disposed on the first stage side and a first support layer disposed on the molded body side between the first stage on which the molded body is placed and the molded body; A first support / buffer layer having a two-layer structure including two layers of a first buffer layer made of a material softer than one support layer;
The imprint mold disposed so that the concavo-convex pattern forming surface faces the molding target, and the second stage facing the first stage via the molding target and the imprint mold Between the two layers, a second support layer disposed on the second stage side and a second buffer layer disposed on the imprint mold side and made of a softer material than the second support layer. A second support / buffer layer having a two-layer structure is provided;
The first and / or second stage is moved in a direction in which both approach each other, the imprint mold is pressed against the molding object, and the pattern corresponding to the uneven pattern of the imprint mold is pressed against the molding object Forming an imprinting method.   The imprint method according to claim 1, wherein the first support layer and the second support layer are resin films having a thickness of 0.01 to 2.0 mm.   The imprinting method according to claim 1 or 2, wherein the first buffer layer and the second buffer layer are made of an elastomer having a thickness of 0.01 to 2.0 mm.   The imprint method according to claim 1, wherein the first buffer layer and the second buffer layer have a thickness of 0.01 to 2.0 mm and have adhesiveness.

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