JP2010034144A - Electronic component manufacturing device and electronic component manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component manufacturing device that highly accurately controls the film thickness of an electrode pattern when forming the electrode pattern by applying conductive paste on a ceramic green sheet and drying the conductive paste. <P>SOLUTION: The electronic component manufacturing device 21 includes a transfer device 22 for transferring a ceramic green sheet 2 in a prescribed direction, a gravure roll 26 for printing a conductive paste 29, stored in a conductive paste storage tank 28, on one side of the ceramic green sheet 2, and a film thickness sensor 34 for measuring the film thickness of an electrode pattern, made of dried conductive paste, on the downstream side of a drying furnace 33 for drying the conductive paste. The temperature of the conductive paste 29 is adjusted by a temperature adjusting device 37 on the basis of the film thickness measured by the film thickness sensor 34, the predetermined prescribed film thickness range, and the relationship between the temperature and the viscosity of the conductive paste 29, respectively, which are calculated beforehand. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a manufacturing apparatus and a manufacturing method of an electronic component such as a multilayer ceramic capacitor, and more specifically, an electronic device including a printing apparatus for printing a conductive paste on one surface of a ceramic green sheet when forming an electrode. The present invention relates to a component manufacturing apparatus and an electronic component manufacturing method using the electronic component manufacturing apparatus.

  Conventionally, when manufacturing a ceramic electronic component such as a multilayer ceramic capacitor, an electrode pattern, which is a large number of internal electrode assemblies, is formed on a mother ceramic green sheet in order to increase productivity. Specifically, a conductive paste is printed on a long ceramic green sheet to form the electrode pattern. Next, the electrode pattern is dried and finally baked in a subsequent process, whereby an electrode is finally formed. In this case, in order to control the film thickness of the electrode with high accuracy, the film thickness after printing of the conductive paste must be controlled with high accuracy.

  Patent Document 1 below discloses an ink film thickness control apparatus for printing ink on the surface of a long sheet. The ink film thickness control apparatus described in Patent Document 1 is provided with an ink kneading roller for supplying ink so as to have a predetermined film thickness on a plate cylinder having a printing area on the surface. FIG. 8 is a perspective view schematically showing a portion where the ink kneading roller is provided.

  A plurality of ink kneading rollers 102 are in contact with the ink source roller 101. Each ink kneading roller 102 includes a heater 103. The heater 103 is heated by the power source 104. The amount of heat supplied to the ink is adjusted by adjusting the amount of current by the current regulator 105. As a result, an amount of ink corresponding to a predetermined film thickness is supplied from the ink kneading roller 102 to an ink-equipped roller (not shown) that is in pressure contact with a plate cylinder (not shown) via the ink kneading roller 102. Then, the roller with ink supplies the predetermined amount of ink to the surface of the plate cylinder. Here, the film thickness of the ink is controlled by adjusting the temperature of the ink in the ink kneading roller 102.

On the other hand, in Patent Document 2 described below, a method of detecting the stain of a printed matter in an image processing apparatus and adjusting the temperature of ink supplied to the image processing device when the stain exists, that is, when it is abnormal. Is disclosed.
JP 61-163859 A JP 11-133756 A

  In the ink film thickness control apparatus described in Patent Document 1, the relationship between the ink temperature and the ink film thickness on the plate cylinder is obtained in advance, and the ink is supplied to the ink kneading roller 102 based on the relationship. The ink temperature is adjusted.

  However, in order to apply the ink so as to obtain a desired film thickness, the viscosity of the ink must be taken into consideration. However, the viscosity of the ink varies depending on the lot of ink. Also, the ink may thicken over time. Due to these effects, it has been very difficult to keep the viscosity of the ink constant. Therefore, as described in Patent Document 1, it is difficult to print the ink so as to obtain a desired thickness only by controlling the temperature of the ink.

  Further, in Patent Document 2, the ink viscosity is adjusted by changing the temperature of the ink, thereby suppressing the stain on the printed matter. However, Patent Document 2 only shows a method for eliminating the stain, and no attention is paid to controlling the film thickness of the printed ink.

  An object of the present invention is to provide an electronic component including a process capable of controlling the thickness of a conductive paste after drying with high accuracy when the conductive paste is printed on a ceramic green sheet in view of the current state of the prior art described above. It is to provide a manufacturing apparatus and a method for manufacturing an electronic component.

  An electronic component manufacturing apparatus according to the present invention includes a conveying means for conveying a ceramic green sheet along a predetermined conveying direction, a conductive paste storage tank in which a conductive paste printed on the ceramic green sheet is stored, A printing plate on which a conductive portion is supplied and a printing unit for forming an electrode pattern on the ceramic green sheet is provided on the surface, and is disposed downstream of the printing plate in the transport direction by the transport device. The conductive paste printed on the ceramic green sheet, the film thickness measuring means for measuring the film thickness of the electrode pattern made of the conductive paste, and the conductive paste storage tank. Temperature adjustment means for adjusting the temperature of the conductive paste, and film thickness measurement obtained by the film thickness measurement means In If it is outside the predetermined thickness within a predetermined range, so that within a predetermined thickness range, and a control means for adjusting the temperature of the conductive paste by the temperature adjusting means.

  In a specific aspect of the electronic component manufacturing apparatus according to the present invention, the conductive paste reservoir is provided with a viscosity measuring unit for measuring the viscosity of the conductive paste, and the viscosity measurement value given from the viscosity measuring unit Based on the measured film thickness obtained from the film thickness measuring device, the control means adjusts the temperature of the conductive paste so that the measured film thickness falls within the predetermined film thickness range. In this case, since the film thickness of the conductive paste is controlled in consideration of not only the film thickness measurement value but also the viscosity measurement value of the conductive paste, the film thickness after drying of the conductive paste can be made even more accurate. Can be controlled.

  In another specific aspect of the electronic component manufacturing apparatus according to the present invention, the temperature adjusting means is provided with the conductive paste reservoir. In this case, a heater or cooling means can be provided in the paste storage tank with a margin.

  In still another specific aspect of the electronic component manufacturing apparatus according to the present invention, the printing plate is a gravure printing roll, and a press contact roll that is pressed against the gravure printing roll so as to sandwich the ceramic green sheet is further provided. Is provided. In this case, an electrode pattern in which the film thickness is controlled with high accuracy can be formed by the gravure printing method with high productivity.

  In still another specific aspect of the electronic component manufacturing apparatus according to the present invention, the temperature adjusting means is provided so as to adjust the temperature of the conductive paste on the gravure printing roll. In this case, since the temperature of the conductive paste in the printing region of the gravure printing roller itself is adjusted, the temperature of the conductive paste printed on the ceramic green sheet can be controlled more strictly.

  In still another specific aspect of the electronic component manufacturing apparatus according to the present invention, the temperature adjusting means is provided in the pressure contact roll. In this case, the temperature adjusting means may be provided without difficulty because the temperature adjusting means may be provided on the pressure contact roll side having a simple structure.

  An electronic component manufacturing method according to the present invention includes a step of starting conveyance of a ceramic green sheet along a predetermined conveyance direction, and printing in which a printing unit corresponding to an electrode pattern printed on the ceramic green sheet is formed. Using a plate, printing the conductive paste on one side of the ceramic green sheet, drying the ceramic green sheet printed with the conductive paste, and drying the conductive paste after drying the conductive paste The step of measuring the film thickness of the obtained electrode pattern and, based on the measurement value of the film thickness, when the film thickness measurement value is outside the predetermined film thickness range, the viscosity and temperature of the conductive paste determined in advance And adjusting the temperature of the conductive paste so that the measured film thickness falls within a predetermined film thickness range.

  In a specific aspect of the method for manufacturing an electronic component according to the present invention, the method further includes a step of measuring the viscosity of the conductive paste, wherein the measurement value of the viscosity of the conductive paste and the electrode pattern formed by drying the conductive paste The temperature of the conductive paste is adjusted based on both film thickness measurements. In this case, the film thickness after drying of the conductive paste can be controlled with higher accuracy by also using the measured viscosity value.

  In the electronic component manufacturing apparatus according to the present invention, when the conductive paste is printed on the ceramic green sheet, when the thickness of the conductive paste after drying is outside the predetermined film thickness range, Since the temperature of the conductive paste is controlled based on the relationship with the viscosity, the thickness after drying of the conductive paste can be controlled with high accuracy. In particular, even if the viscosity of the conductive paste used varies from lot to lot or increases with time, according to the present invention, the conductive paste after drying depends on the conductive paste currently used. Since the paste, that is, the electrode pattern film thickness can be controlled with high accuracy, an electrode pattern with high film thickness accuracy can be reliably formed.

  Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.

  FIGS. 1A and 1B are schematic configuration diagrams for explaining a process of forming an electrode pattern by printing a conductive paste on a mother ceramic green sheet in one embodiment of the present invention. b) is a schematic cross-sectional view showing a state in which a conductive paste is applied on a mother ceramic green sheet and dried to form an electrode before firing. FIG. 2 is a flowchart for explaining the manufacturing method of the present embodiment.

  In this embodiment, a multilayer ceramic capacitor is manufactured as an electronic component. As is well known, when manufacturing a multilayer ceramic capacitor, a plurality of ceramic green sheets 2 and 3 are sequentially stacked on a support film 1 as shown in FIG. On the ceramic green sheets 2 and 3, electrode patterns 5 and 6 are formed by applying a conductive paste and drying, as shown.

  By laminating a plurality of ceramic green sheets printed with such an electrode pattern, a mother laminate 7 is obtained as shown in FIG. After obtaining the mother laminate 7, the mother laminate 7 is pressurized in the thickness direction, and then cut in the thickness direction. Thereby, a multilayer body of individual multilayer ceramic capacitor units is obtained.

  By firing the obtained laminated body, a laminated ceramic sintered body 8 shown in FIG. 5 is obtained. In the sintered body 8, a plurality of first internal electrodes 9 and a plurality of second internal electrodes 10 are overlapped via a ceramic layer. The multilayer ceramic capacitor 13 is obtained by forming the external electrodes 11 and 12 on both end faces of the multilayer ceramic sintered body 8.

  The internal electrodes 9 and 10 are derived from the electrode patterns 5 and 6 formed on the mother ceramic green sheets 2 and 3 at the stage of the mother ceramic green sheets 2 and 3. Capacitance is taken out by the opposing portions of the first and second internal electrodes 9 and 10.

  Therefore, the electrode patterns 5 and 6 must be formed with high accuracy. That is, not only the position where the electrode patterns 5 and 6 are formed, but also the thickness must be controlled with high accuracy.

  The manufacturing method according to the present embodiment is characterized in that the electrode patterns 5 and 6 are formed on the ceramic green sheets 2 and 3. This will be described more specifically with reference to FIGS. 1 (a), 1 (b) and FIG.

  As shown in FIG. 1A, in the manufacturing apparatus 21 used in the present embodiment, the ceramic green sheet 2 is transported in the direction indicated by the arrow A by the transport apparatus 22. Since the mother ceramic green sheet 2 does not have a strength that can withstand conveyance, the ceramic green sheet 2 is actually conveyed in the direction of arrow A while being supported by the support film 23 as shown in FIG. Is done. In FIG. 1A, the support film 23 is not shown because it is complicated. However, the support film 23 is located on the upper surface side of the ceramic green sheet 2 so that the surface on which the conductive paste of the ceramic green sheet 2 is printed is the lower surface in FIG.

  As the transport device 22, an appropriate rotational drive source that rotationally drives the take-up roll 24 can be used. The ceramic green sheet 2 can be transported in the direction of arrow A by rotating the take-up roll 24. However, the conveying device 22 is not limited to a drive source that rotationally drives the take-up roll 24, and can be formed by an appropriate drive source as long as the long ceramic green sheet 2 can be moved in the direction of arrow A.

  A roll 25 is provided midway in the transport direction A, and has a gravure roll 26 and a pressure contact roll 27 in front of the roll 25 in the traveling direction. A printing device is arranged. Here, a printing region corresponding to the electrode pattern to be printed is formed on the outer surface of the gravure roll 26. The gravure roll 26 is driven to rotate counterclockwise as indicated by the arrow in the figure. On the other hand, the press contact roll 27 is rotationally driven in the clockwise direction as indicated by the arrow in the figure. Both the gravure roll 26 and the pressure contact roll 27 may be rotationally driven, only one of them may be rotationally driven, and the other may be rotatably arranged. In any case, the ceramic green sheet 2 laminated on the support film 23 passes between the gravure roll 26 and the pressure contact roll 27. In this case, the support film 23 side is in contact with the pressure contact roll 27, and one surface of the ceramic green sheet 2 is in contact with the outer surface of the gravure roll 26.

  On the other hand, the lower part of the gravure roll 26 is immersed in a conductive paste 29 stored in a conductive paste storage tank 28. Therefore, when the gravure roll 26 is rotationally driven by the illustrated arrow, the conductive paste 29 adheres to the outer surface of the gravure roll 26 and the conductive paste 29 is supplied to the printing area. In order to scrape off the excess conductive paste, the scraper 30 is disposed with a predetermined gap from the outer surface of the gravure roll 26. This predetermined gap is provided to control the thickness of the conductive paste deposited. That is, the distance between the scraper 30 and the outer surface of the gravure roll 26 is set according to the target film thickness for the amount of conductive paste applied to one side of the ceramic green sheet 2.

  On the other hand, a temperature measuring device 31 for measuring the temperature of the conductive paste 29 in the conductive paste reservoir 28 is provided. The sensor unit 31 a of the temperature measuring device 31 is immersed in the conductive paste 29. The temperature measuring device 31 detects the temperature of the conductive paste 29 by the sensor unit 31a. And the electric signal according to this temperature is output. As the sensor unit 31a, a known temperature sensitive element such as a thermocouple can be used.

  A viscosity measuring device 32 for measuring the viscosity of the conductive paste 29 is also provided. The viscosity measuring device 32 has a sensor part 32 a, and the sensor part 32 a is immersed in the conductive paste 29 in the conductive paste storage tank 28. The viscosity measuring device 32 measures the viscosity of the conductive paste 29 in the conductive paste storage tank 28 and outputs an electrical signal corresponding to the measured viscosity value. As the viscosity measuring device 32, a known viscosity sensor such as a B-type viscometer can be used.

  A drying furnace 33 is disposed downstream of the gravure roll 26 and the pressure contact roll 27. The drying furnace 33 dries the conductive paste printed on the ceramic green sheet 2 to form the electrode pattern 5. The drying furnace 33 can be formed by an appropriate heating device such as a zone-type heating furnace. In addition to the heating device, a blower device may be arranged.

  On the downstream side of the drying furnace 33, a film thickness sensor 34 as a film thickness measuring means is arranged. The film thickness sensor 34 measures the thickness of the electrode pattern 5 after drying, and outputs an electric signal corresponding to the film thickness measurement value. As the film thickness sensor 34, an optical sensor such as a laser displacement meter or an appropriate thickness sensor such as an X-ray film thickness meter can be used.

  A control device 35 is electrically connected to the temperature measuring device 31, the viscosity measuring device 32, and the film thickness sensor 34. The control device 35 is also electrically connected to the transport device 22.

  Further, a temperature adjusting device 37 is electrically connected to the control device 35. In the present embodiment, the temperature adjustment device 37 is a heating / cooling device including a heater for heating the conductive paste 29 stored in the conductive paste storage tank 28 and a cooling medium blowing device for cooling.

  The temperature adjusting device 37 heats or cools the conductive paste 29 according to a command from the control device 35. In the control device 35, the relationship between the viscosity and the temperature of the conductive paste 29 is stored in advance.

  Next, a specific method for forming the electrode pattern 5 by printing the conductive paste 29 on the ceramic green sheet 2 using the electronic component manufacturing apparatus 21 of the present embodiment will be described.

  First, as shown in FIG. 2, in step S <b> 1, the conveyance device 22 is driven by an electrical signal from the control device 35, and conveyance of the ceramic green sheet 2 is started.

  Next, in step S2, the conductive paste 29 is transferred to one side of the ceramic green sheet 2 and printed. Thereafter, the printed conductive paste is dried in the drying furnace 33 in step S3.

  Next, based on the electrical signal from the control device 35, the film thickness of the electrode pattern 5 to which the film thickness sensor 34 has been conveyed, that is, the film thickness of the conductive paste after drying is measured. The film thickness sensor 34 gives an electrical signal corresponding to the film thickness measurement value to the control device 35. In step S5, the control device 35 determines whether or not the measured film thickness is within a predetermined target film thickness range. When the measured film thickness is within the target film thickness range, the ceramic green sheet on which the electrode pattern 5 is formed is wound on the winding roll 24 in step S6.

  On the other hand, if the measured film thickness is outside the target film thickness range in step S5, the temperature and viscosity of the conductive paste 29 are measured in step S7.

  FIG. 6 is a diagram showing the relationship between the viscosity and temperature of the conductive paste 29, and the relationship between the viscosity and temperature is stored in the control device 35 in advance.

  FIG. 7 is a diagram showing the relationship between the viscosity of the conductive paste 29 and the film thickness of the conductive paste dried material after passing through the drying furnace 33, that is, the electrode pattern 5. It can be seen that in order to obtain a desired film thickness range, the viscosity of the conductive paste may be set within a predetermined viscosity range. If the viscosity of the conductive paste is high, the conductive paste remains on the outer surface of the gravure roll 26 during printing, and the transferred conductive paste tends to have a thin film thickness. Next, in step S8, temperature adjustment is performed. When the measured film thickness is larger than the target film thickness range from the relationship between the temperature and viscosity of the conductive paste measured in step S7 and the temperature and viscosity of the conductive paste 29 previously stored in the control device 35. The conductive paste 29 is cooled so as to reduce the viscosity. On the contrary, when the measured film thickness is thinner than the target film thickness range, it is necessary to increase the viscosity, and therefore the control device 35 gives an electric signal for heating the conductive paste 29 to the temperature adjusting device 37. Thereby, the temperature adjusting device 37 heats the conductive paste 29.

  In the present embodiment, the viscosity is also measured by the viscosity measuring device 32. That is, the temperature of the conductive paste 29 is adjusted so as to be within a predetermined film thickness range in consideration of the measured film thickness and the actual viscosity of the conductive paste 29 being used. In this case, when the measured film thickness is larger than the desired film thickness, it is necessary to reduce the viscosity of the conductive paste 29. However, the actual viscosity of the conductive paste 29 is measured by the viscosity measuring device 32, and the measured viscosity is measured. Based on the relationship with the viscosity temperature stored in advance, the viscosity may be lowered so as to be within a desired film thickness range. That is, the temperature adjustment device 37 may be used for heating according to the difference between the measured viscosity and the viscosity within a desired film thickness range. Conversely, when the measured film thickness is lower than the desired film thickness range, the conductive paste 29 may be cooled according to the difference between the viscosity that realizes the desired film thickness range and the measured viscosity. .

  However, in the present invention, it is not always necessary to adjust the temperature of the conductive paste in consideration of the viscosity using the viscosity measuring device 32, and the relationship between the measured film thickness and the previously determined viscosity and temperature is not necessary. Only based on this, the temperature of the conductive paste 29 may be adjusted.

  Thereafter, returning to step S2, printing, drying, and film thickness measurement are performed again, and it is determined whether or not the measured film thickness is within the target film thickness range in step S5. By repeating this process, the process proceeds to step S6 only when the measured film thickness is within the target film thickness range, and the ceramic green sheet 2 is wound up.

  Therefore, according to the manufacturing method of this embodiment, the film thickness of the electrode pattern 5 can be reliably within the target film thickness range. Therefore, it is possible to obtain the electrode pattern 5 in which the film thickness after drying is controlled with high accuracy, and thereby it is possible to obtain a multilayer capacitor with little variation in electrical characteristics. As described above, in a multilayer ceramic electronic component such as a multilayer ceramic capacitor, the electrical characteristics vary depending not only on the electrode formation position but also on the thickness of the electrode. Further, the conductive paste 29 to be used has different viscosities and properties depending on lots. Further, the conductive paste 29 may thicken during storage.

  According to the manufacturing method of the present embodiment, based on the relationship between the temperature and the viscosity of the conductive paste 29 currently used, the conductive material used is based on the thickness of the electrode pattern after being actually printed and dried. The temperature of the paste 29 is adjusted. Therefore, the electrode pattern 5 within the target film thickness range can be reliably formed on one surface of the ceramic green sheet 2 regardless of variations in the viscosity of the conductive paste 29.

  In the above embodiment, the temperature adjusting device 37 heats or cools the conductive paste 29 in the conductive paste storage tank 28, but directly heats or cools the conductive paste supplied to the outer surface of the gravure roll 26. A temperature adjusting device may be used. Or you may use the temperature adjustment apparatus 41 which heats or cools the press-contact roll 27 so that it may be connected with the broken line B to Fig.1 (a).

  In any case, as long as the temperature of the conductive paste transferred to one side of the ceramic green sheet 2 can be adjusted, the temperature adjusting device can be placed at any point in time before transferring the conductive paste 29 and in the stage before the transfer. May be arranged.

  As described above, the electrode pattern 5 whose thickness is controlled with high accuracy is formed on the ceramic green sheet 2. By repeating this process in sequence, as described above, a plurality of mother ceramic green sheets on which an electrode pattern made of a conductive paste is printed can be prepared to produce a multilayer ceramic capacitor.

  As described above, since the film thickness of the electrode pattern is controlled with high accuracy by in-line feedback control, variations in the electrode pattern 5 in the long ceramic green sheet 2 wound around the same winding roll 24 are controlled. can do. Moreover, since it is a printing method using the gravure roll 26, since it is not necessary to arrange many printing plates, manufacturing cost can be reduced.

  In addition, since the viscosity of the conductive paste varies greatly between lots, when a conventional printing apparatus is used, trial coating has to be performed many times. Therefore, the work of confirming the film thickness after trial coating and drying is very complicated. On the other hand, in this embodiment, such troublesome trial coating and film thickness confirmation work can be omitted, and productivity can be greatly increased.

  Further, in the conventional manufacturing method, when the printed shape of the conductive paste deviates from the target shape, it is necessary to temporarily stop the printing process and replace the printing plate such as a gravure roll. On the other hand, in this embodiment, since the coating thickness can be controlled in-line, the drive stop operation associated with replacement of the printing plate is not necessary. Therefore, the operating rate of the manufacturing apparatus can be greatly increased.

  In the above embodiment, the gravure printing apparatus using the gravure roll 26 is shown as the apparatus for transferring the conductive paste, that is, the conductive paste printing apparatus. However, the present invention is not limited to the gravure printing apparatus, but other printing apparatuses. It may be used. However, by using a gravure printing method using a gravure printing apparatus, an electrode pattern can be formed continuously and efficiently on one side of the long ceramic green sheet 2. Therefore, a gravure printing method using the gravure roll 26 is desirable.

  In the above embodiment, the manufacturing method and the manufacturing apparatus of the multilayer ceramic capacitor have been described. However, the present invention can generally be applied to a manufacturing method of a ceramic multilayer substrate or other ceramic electronic components. Further, the present invention can be applied not only to electrode patterns that form internal electrodes, but also to electrode patterns obtained by applying and baking a conductive paste formed on the surface of a ceramic substrate.

(A) is a schematic block diagram of the electronic component of one Embodiment of this invention, (b) is typical sectional drawing which shows the state in which the electrode pattern which consists of electrically conductive paste is formed on the ceramic green sheet. It is a flowchart for demonstrating the manufacturing process of the electronic component of one Embodiment of this invention. It is a front sectional view for explaining the process of laminating a mother ceramic green sheet in a multilayer ceramic capacitor to which an embodiment of the present invention is applied. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front sectional view showing a mother ceramic laminate obtained in a method for producing a multilayer ceramic capacitor to which an embodiment of the present invention is applied. It is a typical front sectional view of the multilayer ceramic capacitor obtained by one embodiment of the present invention. It is a figure which shows the relationship between the temperature and viscosity of an electrically conductive paste. It is a figure which shows the relationship between the viscosity of electrically conductive paste, and the film thickness after printed electrically conductive paste drying. It is a schematic perspective view for demonstrating the principal part of the conventional printing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support film 2, 3 ... Ceramic green sheet 5, 6 ... Electrode pattern 7 ... Laminated body 8 ... Ceramic sintered body 9, 10 ... Internal electrode 11, 12 ... External electrode 13 ... Multilayer ceramic capacitor 21 ... Manufacturing apparatus 22 ... Conveying device 23 ... support film 24,25 ... roll 26 ... gravure roll 27 ... pressing roll 28 ... conducting paste reservoir 29 ... conducting paste 30 ... scraper 31 ... temperature measuring device 31a ... sensor unit 32 ... viscosity measuring device 33 ... drying furnace 34 ... Film thickness sensor 35 ... Control device 37 ... Temperature adjustment device 41 ... Temperature adjustment device

Claims (9)

A conveying means for conveying the ceramic green sheet along a predetermined conveying direction;
A conductive paste storage tank storing a conductive paste printed on a ceramic green sheet;
A printing plate provided with a printing portion on the surface to which the conductive paste is supplied and to form an electrode pattern on the ceramic green sheet;
A drying means disposed on the downstream side of the printing plate in the transport direction by the transport device, and drying the conductive paste printed on the ceramic green sheet;
Film thickness measuring means for measuring the film thickness of the electrode pattern made of the conductive paste,
Temperature adjusting means for adjusting the temperature of the conductive paste stored in the conductive paste storage tank;
When the film thickness measurement value obtained by the film thickness measurement means is outside a predetermined film thickness range, the temperature adjusting means adjusts the temperature of the conductive paste so that the film thickness measurement value is within the predetermined film thickness range. An electronic component manufacturing apparatus comprising control means for adjusting.   Viscosity measurement means for measuring the viscosity of the conductive paste is provided in the conductive paste storage tank, the viscosity measurement value given from the viscosity measurement means, and the film thickness measurement value obtained from the film thickness measurement device 2. The electronic component manufacturing apparatus according to claim 1, wherein the control unit adjusts the temperature of the conductive paste so that the measured film thickness is within the predetermined film thickness range.   The electronic component manufacturing apparatus according to claim 1, wherein the temperature adjusting unit is provided in the conductive paste storage tank.   The electronic component according to any one of claims 1 to 3, wherein the printing plate is a gravure printing roll, and further includes a pressure contact roll that is pressed against the gravure printing roll so as to sandwich the ceramic green sheet. Manufacturing equipment.   The electronic component manufacturing apparatus according to claim 4, wherein the temperature adjusting unit is provided so as to adjust a temperature of the conductive paste on the gravure printing roll.   The electronic component manufacturing apparatus according to claim 4, wherein the temperature adjusting means is provided in the pressure contact roll. Starting the conveyance of the ceramic green sheet along a predetermined conveyance direction;
Using a printing plate on which a printing portion corresponding to an electrode pattern printed on the ceramic green sheet is formed, and printing a conductive paste on one surface of the ceramic green sheet;
Drying the ceramic green sheet printed with the conductive paste;
Measuring the film thickness of the electrode pattern obtained by drying the conductive paste after drying the conductive paste;
Based on the measurement value of the film thickness, when the film thickness measurement value is outside the predetermined film thickness range, the film thickness measurement value is determined to be the predetermined film thickness based on the relationship between the viscosity and the temperature of the conductive paste determined in advance. And a step of adjusting the temperature of the conductive paste so as to be within a range.   The method further comprises the step of measuring the viscosity of the conductive paste, and adjusting the temperature of the conductive paste based on both the measured viscosity value of the conductive paste and the measured film thickness of the electrode pattern formed by drying the conductive paste. The manufacturing method of the electronic component of Claim 7.   The method of manufacturing an electronic component according to claim 7 or 8, wherein a gravure printing roll is used as a printing plate when the conductive paste is printed on the ceramic green sheet by transfer.

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