JP2009116487A - Card manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a card manufacturing method with which costs can be reduced without complicated additional processes. <P>SOLUTION: The card manufacturing method includes accommodation of an IC module 11 so that its surface may have a slope to the main part surface. An upper side core sheet 15 contacting the IC module 11 from the upper side includes a region Rt1 where a first end 11a of the IC module 11 to be lifted to the upper side is located. An upper side opening 15a is provided to a region excepting a region Rt2 contacting a second end 11b of the IC module 11 to be lowered to the bottom side. A bottom side core sheet 16 contacting the IC module 11 from the bottom side includes a region Rb2 where the second end 11b is located. A bottom side opening 16a is provided to a region excepting a region Rb1 contacting the first end 11a. At least an upper side surface sheet 17, the upper side core sheet 15, the IC module 11, the bottom side core sheet 16, and a bottom side surface sheet 18 are laminated in this order and are heated and pressurized. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a card manufacturing method using a laminate method, and more particularly, to a card manufacturing method in which an IC module is mounted inside a main body.

  In recent years, for example, non-contact IC cards that do not have contact terminals used for commuter pass tickets and tickets, and non-contact IC inlays used for electronic passports have come to be widely used. .

  As an example of a card manufacturing method for manufacturing a non-contact type IC inlay or a non-contact type IC card, for example, a laminating method in which an IC module accommodated in a main body and a plurality of laminate sheets are superposed and heated and pressed. There is.

  Hereinafter, a card manufacturing method for manufacturing a non-contact IC inlay by a conventional laminating method will be described with reference to FIGS. Here, FIG. 6 schematically shows a part of a manufacturing process of a conventional non-contact type IC inlay, and FIG. 7 schematically shows a schematic sectional configuration of the conventional non-contact type IC inlay. .

  As shown in FIG. 6, the non-contact type IC inlay 100 according to the conventional laminating system includes an IC inlet 10 that is a core part of the non-contact type IC inlay 100, and an upper surface that is a laminate sheet for absorbing the thickness of the IC inlet 10. The side core sheet 22 and the bottom surface side core sheet 23, the top surface side surface sheet 17 that is a laminate sheet in contact with the top surface side core sheet 22 from the top surface side, and the bottom surface side surface layer that is a laminate sheet in contact with the bottom surface side core sheet 23 from the bottom surface side Manufactured using the sheet 18.

  More specifically, the IC inlet 10 includes an IC module 11 that realizes various functions of the non-contact IC inlay 100, an antenna 14 for performing wireless data communication with an external reader, and the IC module 11 and the antenna 14. An antenna sheet 13 for electrical connection is provided, and the IC module 11 and the antenna sheet 13 are connected via a connection portion 12 made of a conductive material such as solder. Although not shown, the IC module 11 is configured by sealing one or more IC chips with resin.

  The upper surface side core sheet 22 is a laminate sheet that comes into contact with the IC module 11 from the upper surface side in order to absorb the thickness of the IC inlet 10, and the upper surface side opening 22a is formed in the entire region where the upper surface of the IC module 11 is located in the accommodated state. Is provided.

  The bottom-side core sheet 23 is a laminate sheet that comes into contact with the IC module 11 from the bottom side in order to absorb the thickness of the IC inlet 10. The bottom-side opening 23 a is formed in the entire region where the bottom surface of the IC module 11 is located in the accommodated state. Is provided.

  Then, the upper surface layer sheet 17, the upper surface core sheet 22, the IC inlet 10, the bottom surface core sheet 23, and the bottom surface sheet 18 are stacked in this order, and sandwiched between the upper surface thermal plate 19a and the bottom surface thermal plate 19b and heated. Pressurize. Thereby, the non-contact type IC inlay 100 is manufactured. Although not shown, a non-contact IC card is manufactured by laminating a plastic sheet or the like on the top and bottom surfaces of the non-contact IC inlay 100.

  By the way, as shown in FIG. 7, the non-contact IC inlay 100 or the non-contact IC card manufactured by the conventional card manufacturing method shown in FIG. By providing the upper surface side opening 22a in the entire region where the upper surface is located, and the bottom surface side opening 23b in the entire region where the bottom surface of the IC module 11 in the accommodated state is disposed in the bottom surface side core sheet 23, the IC module 11 The surface is disposed so as to be substantially parallel to the surface of the card body.

  However, the conventional non-contact IC inlay 100 or non-contact IC card shown in FIG. 7 is arranged such that the surface of the IC module 11 is substantially parallel to the surface of the card body, Since the contact IC inlay 100 is very thin, there is a problem that durability against a load applied in the vertical direction of the main body, particularly a point impact force, is low. Specifically, for example, when a load such as dropping or warping occurs, the IC module 11 may be damaged, the antenna sheet 13 may be damaged, or the IC module 11 and the antenna 14 may be disconnected. Further, there is a problem that chip cracking may occur depending on the use mode. As described above, in recent years, the non-contact type IC inlay 100 and the non-contact type IC card have come to be widely used in a wide range of applications, and the durability, in particular, the pressure resistance and the impact resistance are improved. It has been demanded.

  As a technique for improving the durability of the non-contact type IC inlay and the non-contact type IC card, for example, the non-contact type IC card is configured such that the surface of the IC module in the accommodated state is inclined with respect to the surface of the non-contact type IC card. There is a contact type IC card (see, for example, Patent Document 1).

  Further, in Patent Document 1, as a method of manufacturing the non-contact type IC card or the non-contact type IC inlay, a bottom side core sheet that is in contact with the IC module from the bottom side is formed so that the bottom portion is inclined with respect to the sheet surface. Forming a housing part for embedding the IC module, filling the surrounding with an encapsulant in a state in which the IC module is housed in the housing part, and superposing the upper core sheet on the upper surface of the IC module, and heating and pressing A card manufacturing method for processing is disclosed.

  The non-contact type IC inlay and non-contact type IC card described in Patent Document 1 are configured such that the surface of the IC module has an inclination with respect to the surface of the main body, so that the load applied in the vertical direction of the main body is diverted. (Sliding) can be expected to alleviate, and durability can be improved.

JP 11-328354 A

  However, in the case of the card manufacturing method for manufacturing the non-contact type IC card and the non-contact type IC inlay described in Patent Document 1, the bottom portion of the accommodating portion provided in the bottom core sheet is inclined with respect to the sheet surface. Therefore, a complicated additional process such as counterbored hole processing for forming the housing portion and an inclined arrangement of the IC module is required, which may increase the manufacturing cost.

  As another technique for improving the durability of the non-contact IC inlay and the non-contact IC card, for example, there is a method of incorporating a reinforcing structure for reinforcing the IC module. However, there is a problem that additional steps and costs such as a material for forming the reinforcing structure and processing of the material are required.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to reduce the cost of the IC module in the accommodated state without requiring a complicated additional process. The object is to provide a non-contact IC inlay configured to have an inclination with respect to the surface of the contact IC inlay or the non-contact IC card, and a card manufacturing method for the non-contact IC card.

  In order to achieve the above object, the card manufacturing method according to the present invention is such that an IC module accommodated in a main body and a plurality of laminate sheets are superposed and heated and pressurized, and the surface of the IC module is in the accommodated state. A card manufacturing method configured to have an inclination with respect to a surface of a main body, wherein the upper surface side core sheet, which is the laminate sheet in contact with the IC module from the upper surface side, is pushed up to the upper surface side in the accommodated state. An upper surface side opening is provided in a region including a region where the first end portion of the IC module is located and excluding a push-down region which is in contact with the second end portion of the IC module which is pushed down to the bottom surface side, and contacts the IC module from the bottom surface side. The bottom side core sheet, which is the laminate sheet, includes a region where the second end is located, and is in contact with the first end. The upper surface side sheet, the upper surface core sheet, the IC module, and the lower surface core are at least the laminate sheet that is in contact with the upper surface core sheet from the upper surface side. A first feature is that a sheet and a bottom surface layer sheet, which is the laminate sheet in contact with the bottom surface core sheet from the bottom surface side, are laminated in this order and subjected to heat and pressure treatment.

  The card manufacturing method according to the present invention having the above characteristics is characterized in that the IC module includes a protrusion on the bottom surface side of the first end.

  In order to achieve the above object, the card manufacturing method according to the present invention is such that an IC module accommodated in a main body and a plurality of laminate sheets are superposed and heated and pressurized, and the surface of the IC module is in the accommodated state. A card manufacturing method configured to have an inclination with respect to a surface of a main body portion, wherein the first end portion is placed on the bottom surface side of the first end portion of the IC module pushed up to the upper surface side in the accommodated state. Protruding portions are provided to push up to the side, and at least the first end of the IC module pushed up to the upper surface side in the accommodated state is positioned on the upper core sheet that is the laminate sheet that contacts the IC module from the upper surface side. An opening is provided in the area, and the bottom core sheet, which is the laminate sheet, is in contact with the IC module from the bottom surface side. The bottom side core sheet, which is the laminate sheet that comes into contact with the IC module from the bottom side, includes a region where the second end of the IC module that is pushed down to the bottom side in the accommodated state is located, and a push-up region that contacts the first end A bottom surface side opening is provided in a region excluding, and at least a top surface layer sheet that is the laminate sheet in contact with the top surface core sheet from the top surface side, the top surface core sheet, the IC module, the bottom surface core sheet, A third feature is that a bottom surface layer sheet, which is the laminate sheet in contact with the bottom surface core sheet from the bottom surface side, is laminated in this order and subjected to heat and pressure treatment.

  According to the card manufacturing method of the first and second features, the upper core sheet includes a region where the first end pushed up to the upper face side is positioned in the accommodated state, and is pushed down to the bottom face side. An upper surface side opening is provided in a region excluding a region in contact with the bottom surface, and a bottom surface side opening is provided in a region excluding the region in contact with the first end portion, including a region where the second end portion is located in the bottom surface side core sheet. Since it is configured, only by changing the position and range of the upper surface side opening of the upper surface side core sheet and the bottom surface side opening of the bottom surface side core sheet, without being particularly conscious when placing the IC module in the housing portion, The posture of the IC module in the accommodated state can be inclined with respect to the main body surface.

  That is, according to the card manufacturing method of the first and second features, the setting of the conventional upper surface side opening formation process of the upper surface side core sheet and the lower surface side opening formation process of the bottom surface side core sheet is changed. Therefore, since it is possible to incline the attitude of the IC module in the accommodated state with respect to the surface of the main body, it is not necessary to form the bottom of the core sheet on the bottom side in an inclined shape, and complicated processing such as counterbored hole processing is required. It is possible to reduce the cost without requiring an additional process.

  In addition, according to the card manufacturing method of the second and third features, the protrusion for pushing the first end portion upward is provided on the bottom surface side of the first end portion of the IC module. Only by changing the shape of the package, the attitude of the IC module in the accommodated state can be inclined with respect to the surface of the main body without being particularly conscious of the placement of the IC module in the accommodating part. As a result, a complicated additional process such as counterbored hole processing is not required, and the cost can be reduced.

  Further, according to the card manufacturing method of the second and third features, the first end of the IC module is formed by both the protrusion of the IC module and the push-up area in contact with the first end of the bottom core sheet. Since the push-up is performed, it is possible to more reliably give the IC module posture in the accommodated state to the surface of the main body part, and it is possible to give a larger inclination to the IC module in the accommodated state. .

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a card manufacturing method according to the present invention (hereinafter referred to as “the present invention method” where appropriate) will be described below with reference to the drawings.

<First Embodiment>
A first embodiment of the method of the present invention will be described with reference to FIGS. Here, FIG. 1 shows a partial process example of the method of the present invention, and shows a cross section at AA ′ of the non-contact type IC card 1 shown in FIG.

  In the present embodiment, the surface of the IC module 11 in the accommodated state with respect to the surface of the main body is made by a laminating method in which the IC module 11 accommodated in the main body and a plurality of laminate sheets are superposed and heated and pressed. Description will be made assuming that a non-contact IC card having an inclination is manufactured.

  As shown in FIG. 1, the non-contact type IC card of the method of the present invention includes an IC inlet 10 that is a core part of the non-contact type IC card, and a core sheet that is a laminate sheet for absorbing the thickness of the IC inlet 10. 15 and the bottom surface side core sheet 16, the top surface side surface layer sheet 17 that is a laminate sheet that contacts the top surface side core sheet 15 from the top surface side, and the bottom surface side surface layer sheet 18 that is a laminate sheet that contacts the bottom surface side core sheet 16 from the bottom surface side. Manufactured. In addition, the structure of the IC inlet 10 and the surface layer sheet (the upper surface side surface layer sheet 17 and the bottom surface side surface layer sheet 18) of the present embodiment is the same as the structure of the IC inlet 10 and the surface layer sheet in the prior art.

  In the method of the present invention of this embodiment, as shown in FIG. 1, in the forming process of the upper surface side opening 15a with respect to the upper surface side core sheet 15 in contact with the IC module 11 from the upper surface side, the IC module pushed up to the upper surface side in the accommodated state. 11 includes a region Rt1 in which the first end portion 11a is located, and an upper surface side opening 15a is provided in a region excluding the push-down region Rt2 in contact with the second end portion 11b of the IC module 11 pushed down to the bottom surface side.

  Furthermore, in the method of the present invention of this embodiment, as shown in FIG. 1, the second end portion 11 b is positioned in the step of forming the bottom surface side opening portion 16 a with respect to the bottom surface side core sheet 16 that contacts the IC module 11 from the bottom surface side. The bottom surface side opening 16a is provided in a region including the region Rb2 and excluding the push-up region Rb1 in contact with the first end portion 11a.

  More specifically, the positions and ranges of the upper surface side opening 15a and the bottom surface side opening 16a are the posture of the IC module 11 in the accommodated state, the area and thickness of the IC module 11, the thickness of the core sheets 15 and 16, and the like. Set appropriately according to. Here, FIG. 2 shows an example of the positions and ranges of the upper surface side opening 15a and the bottom surface side opening 16a in the present embodiment. More specifically, in the present embodiment, the top surface side opening 15a and the bottom surface side opening 16a are formed in a rounded rectangular hole shape having the same size as shown in FIGS. 1 and 2A. In the vertical direction to the surface of the non-contact type IC card, a part of the upper surface side opening 15a and a part of the bottom surface side opening 16a are arranged so as to overlap each other. Specifically, as shown in FIGS. 1 and 2A, the lengths of the top surface side opening 15a and the bottom surface side opening 16a in the BB ′ direction are longer than the length of the IC module 11 in the BB ′ direction. Is set to The length of the upper surface side opening 15a in the AA ′ direction is the entire area of the IC module 11 located on the left side of BB ′ in FIG. 2A and the partial area of the IC module 11 located on the right side of BB ′. It is set to the length including. The length of the bottom opening 16a in the AA ′ direction is the entire area of the IC module 11 located on the right side of BB ′ in FIG. 2A and the IC located on the left side of BB ′ in FIG. The length is set to include a partial area of the module 11.

  In the method of the present invention, the top surface side opening 15a of the top surface core sheet 15 and the bottom surface side opening 16a of the bottom surface core sheet 16 are formed by setting the position and range of the opening in the conventional opening forming process. To change. For this reason, about formation of the upper surface side opening part 15a of the upper surface side core sheet 15, and the bottom face side opening part 16a of the bottom face side core sheet 16, an additional process is not required and the increase in manufacturing cost can be prevented.

  After the step of forming the opening with respect to the core sheets 15, 16, the upper surface side surface sheet 17, the upper surface side core sheet 15, the IC module 11, the bottom surface side core sheet 16, and the bottom surface side surface layer sheet 18 are laminated in this order. It is sandwiched between the thermal plate 19a and the bottom side thermal plate 19b and is heated and pressurized. Thereby, a non-contact type IC card inlay (non-contact type IC inlay) is manufactured. In the present embodiment, a non-contact type IC card is manufactured by heat-pressing and laminating a plastic sheet or the like for improving the strength of the card on the outside of the non-contact type IC card inlay.

  Here, FIG. 3 shows a configuration and a cross-sectional structure of the non-contact type IC card 1 manufactured by the method of the present invention of the present embodiment. As shown in FIG. 3, in the non-contact type IC card 1 manufactured by the method of the present invention, the first end portion 11a is pushed up by the pushed-up region Rb1 of the bottom-side core sheet 16 during the heating and pressurizing process, and the upper surface The second end portion 11b is pushed down by the pushed-down region Rt2 of the side core sheet 15, and the surface of the IC module 11 is inclined with respect to the surface of the non-contact type IC card 1.

Second Embodiment
A second embodiment of the method of the present invention will be described with reference to FIG. In the present embodiment, a case where the setting method of the posture of the IC module 11 is different from the first embodiment will be described. Specifically, in the first embodiment, the case where the posture of the IC module 11 is set by the configuration of the opening of the core sheet has been described. However, in the present embodiment, the IC module 11 depends on the shape of the package of the IC module 11. The case of setting the posture of will be described.

  The method of the present invention of this embodiment will be described with reference to FIG. Here, FIG. 4 shows a partial process example of the method of the present invention. In addition, the method of this invention in this embodiment manufactures the non-contact-type IC card 1 in which the surface of the IC module 11 in the accommodated state is inclined with respect to the surface of the main body by the laminating method, as in the first embodiment. A description will be given assuming the case.

  As shown in FIG. 4, the non-contact type IC card 1 of the method of the present invention is manufactured using the top surface layer sheet 17, the top surface core sheet 20, the IC inlet 10, the bottom surface core sheet 21, and the bottom surface layer sheet 18. Is done. In addition, the structure of the core sheet (the upper surface side core sheet 20 and the bottom surface side core sheet 21) and the surface layer sheet (the upper surface side surface layer sheet 17 and the bottom surface side surface layer sheet 18) of this embodiment is the same as the structure of the first embodiment. is there.

  In the present embodiment, as shown in FIG. 4, in the manufacturing process of the IC module 11, the first end portion 11 a is placed on the upper surface side on the bottom surface side of the first end portion 11 a of the IC module 11 that is pushed upward in the accommodated state. Protruding part 11c for pushing up is provided.

  Here, in the present embodiment, the resin module is sealed with a transfer mold that is formed so that the protrusions 11c are formed during the resin sealing step in the manufacturing process of the IC module 11. By stopping, the protruding portion 11c is formed on the bottom surface side of the first end portion 11a of the IC module 11. In the present embodiment, it is necessary to manufacture a transfer mold mold formed so that the protrusions 11c are formed. However, no additional process occurs in the manufacturing process of the non-contact type IC card 1, and the non- An increase in cost at the time of manufacturing the contact IC card 1 can be suppressed.

  Furthermore, in this embodiment, in the formation process of the upper surface side opening 20a with respect to the upper surface side core sheet 20, the upper surface side core sheet 20 has at least the first end portion 11a of the IC module 11 pushed up to the upper surface side in the accommodated state. An opening is provided in the located region Rt1.

  Further, in the present embodiment, in the step of providing the bottom surface side opening 21a with respect to the bottom surface side core sheet 21, the second end portion 11b of the IC module 11 that is pushed down to the bottom surface side in the accommodated state is positioned in the bottom surface side core sheet 21. A bottom side opening 21a is provided in a region including the region Rb2 and excluding the push-up region Rb1 in contact with the first end portion 11a. By configuring the bottom-side core sheet 21 in this way, the first end portion 11a of the IC module 11 is pushed up by the protruding portion 11c and the pushed-up region Rb1 of the bottom-side core sheet 21 during the heat and pressure treatment. Thus, as in the first embodiment, the posture of the IC module 11 in the accommodated state can be set so that the surface of the IC module 11 is inclined with respect to the surface of the non-contact type IC card 1.

  In the present embodiment, the upper surface side opening 20a is formed so as to have the same configuration as that of the first embodiment. For this reason, the second end portion 11b of the IC module 11 is pushed down by the pushed-down region Rt2 of the upper surface side core sheet 20. In this case, the pressing effect of the second end portion 11b by the pressing region Rt2 of the upper surface side core sheet 20, the pressing effect of the first end portion 11a by the pressing region Rb1 of the bottom surface side core sheet 21, and the protrusion of the IC module 11 The effect of pushing up the first end portion 11a by the portion 11c can be expected, and the posture of the IC module 11 in the accommodated state can be more surely and more inclined.

  After the step of forming the opening with respect to the core sheets 20, 21, the upper surface layer sheet 17, the upper surface core sheet 20, the IC module 11 on which the protrusions 11 c are formed, the bottom surface core sheet 21, and the bottom surface sheet 18 are formed. The layers are sequentially laminated and sandwiched between the upper surface side thermal plate 19a and the bottom surface side thermal plate 19b and subjected to heat and pressure treatment. Thereby, the non-contact type IC card inlay is manufactured. In the present embodiment, the non-contact type IC card 1 is manufactured by heating and pressurizing a plastic sheet or the like for improving the strength of the card on the outside of the non-contact type IC card inlay.

  In the present embodiment, the case where the protrusion 11c of the IC module 11 is formed using a transfer mold die formed so that the protrusion 11c is formed is described, but the present invention is not limited to this. For example, even if the protrusion 11c is formed by dropping and curing a resin sealing material similar to the resin sealing material used in the resin sealing process of the IC module 11 on the bottom surface side of the first end portion 11a. good. In addition, for example, the protrusion 11c may be separately manufactured and configured to be attached with an adhesive. In this case, a conventional transfer mold can be used.

  Moreover, in this embodiment, as shown in FIG. 4, although the upper surface side opening part 20a of the upper surface side core sheet 20 was formed so that it might become the same structure as the said 1st Embodiment as a result, it is not restricted to this. is not. Even when the upper surface side core sheet 20 having the same configuration as that of the conventional technique shown in FIG. 6 is used, an IC is used during the heating and pressurizing process by the push-up region Rb1 in contact with the projection 11c and the first end 11a of the bottom surface side core sheet 21. The first end 11a of the module 11 can be pushed up. Thereby, the posture of the IC module 11 in the accommodated state can be set to have an inclination.

  Here, FIG. 5 shows a configuration and a cross-sectional structure of the non-contact type IC card 1 manufactured by the method of the present invention of the present embodiment. As shown in FIG. 5, the non-contact type IC card 1 manufactured by the method of the present invention has a first portion due to the protrusion 11 c of the IC module 11 and the push-up region Rb 1 of the bottom core sheet 21 during the heating and pressurizing process. The end 11 a is pushed up, and the surface of the IC module 11 is inclined with respect to the surface of the non-contact type IC card 1.

<Another embodiment>
<1> In the first and second embodiments described above, a case where the method of the present invention is applied to manufacture of the non-contact type IC card 1 in which the surface of the IC module 11 is inclined with respect to the surface of the main body in the accommodated state will be described. However, the present invention is not limited to this, and the method of the present invention can also be applied to the case of manufacturing a non-contact type IC inlay in which the surface of the IC module 11 is inclined with respect to the surface of the main body in the accommodated state.

  <2> In the first and second embodiments, the upper surface side core sheet 15 (upper surface side core sheet 20 in the second embodiment), the bottom surface side core sheet 16 (lower surface side core sheet 21 in the second embodiment), the upper surface Although the case where the four laminated sheets of the side surface sheet 17 and the bottom surface layer sheet 18 are subjected to the heat and pressure treatment has been described, the present invention is not limited to this. Further, another laminate sheet may be added and laminated together with the four laminate sheets and the IC inlet 10 to be heated and pressurized.

  <3> In the first and second embodiments, as shown in FIG. 2A, the IC module 11 is set to have an inclination with the BB 'as an inclination axis, but the present invention is not limited to this. As shown in FIGS. 2B and 2C, the direction of the inclination may be set to any other direction such as the direction of AA ′ or the direction of the CC ′. In this case, the shape, arrangement, etc. of the upper surface side opening 15a and the bottom surface side opening 16a are set according to the set direction of the tilt axis.

  <4> In the first and second embodiments, the top surface side opening 15a (the top surface side opening 20a in the second embodiment) and the bottom surface side opening 16a (the bottom surface side opening 21a in the second embodiment) are the same. Although formed in a substantially rectangular shape, the size is not limited to this. The shape of the opening may be set to a polygonal shape, a track shape, or the like, or may be set to have different shapes and areas in the upper surface side opening 15a and the bottom surface side opening 16a.

  <5> In the first and second embodiments, a part of the top surface side opening 15a (the top surface side opening 20a in the second embodiment) and the bottom surface side opening 16a (the bottom surface side opening 21a in the second embodiment). ) Is arranged so as to overlap the surface of the non-contact type IC card 1 in the vertical direction, but is not limited thereto, and may be arranged so as not to overlap in the vertical direction.

  <6> In the first and second embodiments, the top surface side opening 15a (the top surface side opening 20a in the second embodiment) and the bottom surface side opening 16a (the bottom surface side opening 21a in the second embodiment) are: Although it forms so that it may penetrate to the surface layer sheet | seats 17 and 18, it is not restricted to this, For example, the thickness of the core sheet | seats 15 and 16 (2nd embodiment core sheet | seats 20 and 21) is comparatively thick. In some cases, it may be formed in a concave shape.

The schematic block diagram which shows typically the example of a partial process in 1st Embodiment of the card manufacturing method which concerns on this invention. The top view which shows an example of the position and range of an opening part with respect to IC module in the card manufacturing method which concerns on this invention Sectional drawing which shows one structural example of the card | curd manufactured by 1st Embodiment of the card | curd manufacturing method which concerns on this invention. The schematic block diagram which shows typically the example of a partial process in 2nd Embodiment of the card manufacturing method which concerns on this invention. Sectional drawing which shows one structural example of the card | curd manufactured by 2nd Embodiment of the card | curd manufacturing method which concerns on this invention. Schematic schematic diagram showing an example of a part of the card manufacturing method according to the prior art Sectional drawing of the card manufactured by the card manufacturing method which concerns on a prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact-type IC card 10 IC inlet 11 IC module 11a 1st edge part 11b 2nd edge part 11c Projection part 12 Connection part 13 Antenna sheet 14 Antenna 15 Upper surface side core sheet 15a Upper surface side opening part 16 Bottom surface side core sheet 16a Bottom surface Side opening 17 Top side surface layer sheet 18 Bottom side surface layer sheet 19 Thermal plate 19a Top side thermal plate 19b Bottom side thermal plate 20 Top side core sheet 20a Top side opening 21 Bottom side core sheet 21a Bottom side opening 22 Top side core Sheet 22a Upper surface side opening 23 Bottom surface side core sheet 23a Bottom surface side opening Rt1 Upper surface side push-up region Rt2 Upper surface side push-down region Rb1 Bottom surface side push-up region Rb2 Bottom surface side push-down region

Claims (3)

A card formed by stacking an IC module accommodated in a main body and a plurality of laminate sheets, and applying heat and pressure treatment so that the surface of the IC module is inclined with respect to the surface of the main body in the accommodated state. A manufacturing method comprising:
The IC module that includes a region where the first end of the IC module that is pushed up to the upper surface side in the accommodated state is located in the upper core sheet that is the laminate sheet that contacts the IC module from the upper surface side, and is pushed down to the bottom surface side An upper surface side opening is provided in a region excluding the push-down region in contact with the second end of
The bottom side core sheet, which is the laminate sheet that contacts the IC module from the bottom side, includes a region where the second end is located, and a bottom side opening is provided in a region excluding the push-up region that contacts the first end. ,
At least the upper surface side sheet, which is the laminate sheet in contact with the upper surface side core sheet from the upper surface side, the upper surface side core sheet, the IC module, the bottom surface side core sheet, and the bottom surface side core sheet from the bottom surface side. The card | curd manufacturing method characterized by laminating | stacking the bottom side surface layer sheet which is the said laminate sheet in this order, and heat-pressing.   The card manufacturing method according to claim 1, wherein the IC module includes a protrusion on a bottom surface side of the first end portion. A card formed by stacking an IC module accommodated in a main body and a plurality of laminate sheets, and applying heat and pressure treatment so that the surface of the IC module is inclined with respect to the surface of the main body in the accommodated state. A manufacturing method comprising:
Provided on the bottom surface side of the first end portion of the IC module pushed up to the upper surface side in the accommodated state is a protrusion for pushing up the first end portion to the upper surface side,
In the upper surface side core sheet that is the laminate sheet that contacts the IC module from the upper surface side, an opening is provided at least in a region where the first end portion of the IC module that is pushed up to the upper surface side in the accommodated state is located,
The bottom side core sheet, which is the laminate sheet in contact with the IC module from the bottom side, includes a region where the second end of the IC module is pushed down to the bottom side in the accommodated state, and is pushed up in contact with the first end Provide a bottom side opening in the area excluding the area,
At least the top surface sheet, which is the laminate sheet that contacts the top surface core sheet from the top surface side, the top surface core sheet, the IC module, the bottom surface core sheet, and the laminate that contacts the bottom surface core sheet from the bottom surface side. A card manufacturing method comprising laminating bottom surface-side surface sheets, which are sheets, in this order and subjecting to heat and pressure treatment.

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