JP2009005323A - Imaging apparatus and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus which is small-sized and capable of correcting a camera shake with high performance without interference with surrounding components, and an electronic device including the same. <P>SOLUTION: The imaging apparatus includes a lens barrel unit 1 having a photographic lens, an image pickup device 2 movable within a case of a main body, a movable unit 5 configured to move the image pickup device 2, an arithmetic processing device 4 configured to process signals from the image pickup device 2, a flexible board 3 configured to connect the image pickup device 2 and the arithmetic processing device 4 thereto, a plurality of surfaces 6-9 formed between two preceding and following folded portions among a plurality of folded portions on the flexible board 3, and reinforcing plates 10-12 as a member that is mounted near the center of at least one or more of the plurality of surfaces 6-9 to restrict deformation such as slack of the surfaces. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an image pickup apparatus that picks up a subject image by forming a subject optical image on an image pickup element that generates image data based on the optical image, and in particular, causes the image pickup element to follow movement of the subject optical image due to camera shake or the like. The present invention relates to an imaging apparatus suitable for a camera having a camera shake correction function for capturing a subject image in which camera shake or the like is corrected, and an electronic apparatus including the imaging apparatus.

  2. Description of the Related Art Conventionally, an imaging apparatus such as a digital camera is known that includes a so-called camera shake correction mechanism. In this type of imaging apparatus, for example, as shown in Patent Document 1 (Japanese Patent Application Laid-Open No. 2004-274242), one end of a fixed cylinder that is integrally attached to a case of the main body and accommodates a lens barrel on a photographing optical axis. The mounting stage is provided with a CCD (Charge Coupled Device) solid-state imaging device as an imaging device. The mounting stage is held by a guide stage, and this guide stage has the photographing optical axis as the Z-axis direction and can move the mounting stage along an XY plane perpendicular to the Z-axis. The guide stage is fixed with respect to the photographing optical axis in the case of the main body, and the mounting stage is driven by a magnetic force formed by a permanent magnet and a coil arranged to face the guide stage on the guide stage. It is said that.

  In such a conventional imaging apparatus, a processing circuit including an arithmetic processing unit provided in the case of the main body detects the inclination in the X direction and the Y direction generated in the main body, and drives based on the detection output The CCD solid-state imaging device is controlled to move following the movement of the subject optical image due to camera shake by changing the energization current to the coil. At this time, the connection between the CCD solid-state imaging device and the processing circuit for controlling the CCD solid-state imaging device and processing the output signal from the CCD solid-state imaging device may be a flexible printed wiring board (hereinafter referred to as a flexible printed wiring board). The “flexible printed wiring board” is also simply referred to as “flexible board”) so that the movement control performance of the CCD solid-state imaging device is not deteriorated. That is, when the CCD solid-state imaging device moves, the reaction force generated based on the processing circuit on the fixed side is absorbed by utilizing the flexibility of the flexible substrate, so that the operation of the CCD solid-state imaging device is fixed. To prevent the control from being disturbed.

JP 2004-274242 A

  However, the flexible substrate connecting the image pickup element such as a CCD solid-state image pickup element that is movably controlled in the conventional image pickup apparatus and the processing circuit has a long overall length in order to absorb the reaction force. Therefore, there has been a problem that the reaction force cannot be effectively absorbed by interference with surrounding components due to the slack of the flexible substrate itself. In particular, since there is little space around the CCD solid-state imaging device, there is a problem that a flexible substrate must be surely arranged at the design position.

  In addition, a flexible substrate that connects an imaging device such as a CCD solid-state imaging device that is movably controlled in a conventional imaging device and a processing circuit is provided with a plurality of bent portions in order to absorb reaction force. In addition, it is necessary to accurately fold these plural bent portions and store them in a predetermined position. In particular, since there is little space around the CCD solid-state imaging device, there is a problem that a flexible substrate must be surely arranged at the design position to prevent interference with surrounding components.

  Accordingly, the present invention has been made in view of the above-described circumstances, and by attaching a member that restrains deformation to the surface of the flexible substrate and adding a function of positioning the surface, it can interfere with surrounding components. In addition, an object of the present invention is to provide a small imaging device capable of correcting camera shake with high performance and an electronic apparatus including the imaging device. In addition, a bending part positioning member is provided in the area that becomes the bending part of the flexible substrate, and the flexible substrate can be accurately formed without using a jig or the like by folding along the bending positioning member. It is an object of the present invention to provide an imaging apparatus capable of correcting camera shake with high performance without interfering with the above components and an electronic apparatus including the imaging apparatus.

  In order to solve the above-described problems, an imaging apparatus according to claim 1 is configured so that a lens barrel including a photographic lens, an imaging element that can move within a main body case, and the imaging element can be moved. A movable part provided; an arithmetic processing device that processes a signal from the imaging device; a flexible substrate to which the imaging device and the arithmetic processing device are connected; and a plurality of bent portions on the flexible substrate. A plurality of surfaces formed between two adjacent bent portions, and a member that is attached near the center of at least one of the plurality of surfaces and restrains the slack deformation of the surfaces. It is characterized by having.

  An imaging device according to a second aspect is the imaging device according to the first aspect, wherein one of the plurality of surfaces is formed in parallel to the imaging device, and is formed on a light receiving surface of the imaging device. It can be deformed in the direction of the vertical optical axis.

  The imaging device according to a third aspect is the imaging device according to the first or second aspect, wherein the plurality of surfaces are connected to the first surface extending in a direction parallel to the imaging element and the first surface. A second surface extending in a direction perpendicular to the first surface, a third surface connected to the second surface and perpendicular to the second surface and the imaging element, and the third surface. It consists of a 4th surface connected and connected with the said arithmetic processing unit.

  An imaging device according to a fourth aspect is the imaging device according to the third aspect, wherein the first surface is deformable in the optical axis direction.

  The imaging apparatus according to claim 5 is the imaging apparatus according to any one of claims 1 to 4, wherein a positioning reference portion for positioning the surface is provided on at least one of the plurality of surfaces. It is characterized by being.

  The imaging device according to a sixth aspect is the imaging device according to the fifth aspect, wherein the positioning reference portion is configured by at least one hole.

  According to a seventh aspect of the present invention, in the imaging apparatus according to the fifth aspect, the positioning reference portion includes at least one notch portion.

  An imaging apparatus according to an eighth aspect is the imaging apparatus according to any one of the fifth to seventh aspects, wherein the positioning reference portion is provided on the first surface and the third surface. To do.

  The image pickup apparatus according to claim 9 is a lens barrel including a photographic lens, an image pickup device capable of moving within a main body case, a movable portion provided to allow the image pickup device to move, An arithmetic processing unit that processes a signal from the image sensor, and a flexible substrate that includes at least three surfaces whose deformation directions are different by a plurality of bent portions, and to which the image sensor and the arithmetic processing unit are connected The bending portion is formed by bending the flexible substrate by a bending portion positioning member provided in advance on the flexible substrate.

  An imaging device according to a tenth aspect is the imaging device according to the ninth aspect, wherein a portion where the bending portion positioning member is provided is higher in rigidity than the flexible substrate around the portion.

  The imaging device according to claim 11 is the imaging device according to claim 9, wherein the bending portion positioning member is a member in which the flexible substrate is laminated or a member in which the flexible substrate is thickened. To do.

  The imaging device according to a twelfth aspect is the imaging device according to the ninth aspect, wherein the bending portion positioning member is integrally formed with the flexible substrate.

  The imaging device according to a thirteenth aspect is the imaging device according to the ninth aspect, wherein the bending portion positioning member is a reinforcing plate attached to the flexible substrate.

  The imaging device according to a fourteenth aspect is the imaging device according to the ninth aspect, wherein the bending portion positioning member is formed along a bending line on a flexible substrate to be the bending portion.

  The imaging device according to a fifteenth aspect is the imaging device according to the fourteenth aspect, wherein the bending portion positioning member is formed on one side or both sides of the bending line.

  The imaging device according to a sixteenth aspect is the imaging device according to the fourteenth aspect, wherein the bending portion positioning member is formed along the entire length or a part of the folding line.

  The image pickup apparatus according to claim 17 is the image pickup apparatus according to claim 14, wherein the bending portion positioning member is formed along each of two positions of both end portions of the bend line.

  The imaging device according to claim 18 is the imaging device according to any one of claims 1 to 17, wherein the imaging device detects the camera shake that has occurred in the main body case, thereby moving the subject image due to the camera shake. It has a camera shake correction mechanism that moves and follows the element.

  The imaging device according to claim 19 is the imaging device according to any one of claims 1 to 18, wherein the flexible substrate is provided with a bypass of a signal line that is shorter than a signal line passing through the flexible substrate. The signal line is a signal line for transmitting an image signal between the image sensor and the arithmetic processing unit.

  An electronic apparatus according to a twentieth aspect includes the imaging device according to any one of the first to nineteenth aspects.

As described above, the present invention has the following effects.
(1) An imaging apparatus according to the present invention includes a lens barrel including a photographic lens, an imaging element that can move within a main body case, and a movable part that is configured to allow the imaging element to move. , An arithmetic processing unit that processes a signal from the image sensor, a flexible substrate to which the image sensor and the arithmetic processing unit are connected, and two bent portions that are adjacent to each other among a plurality of bent portions on the flexible substrate. A plurality of surfaces formed between the portions, and a member that is attached near the central portion of at least one of the plurality of surfaces and restrains slack deformation of the surfaces. To do. According to said structure, it becomes possible by the member which restrains a deformation | transformation of a surface to eliminate slack of flexible board itself, and to prevent interference with surrounding components.

(2) In the imaging apparatus, one of the plurality of surfaces is formed in parallel to the imaging element and can be deformed in an optical axis direction perpendicular to a light receiving surface of the imaging element. It is characterized by that.
According to said structure, one surface is formed in parallel with respect to the said image pick-up element among these surfaces, and it can deform | transform in the optical axis direction perpendicular | vertical to the light-receiving surface of the said image pick-up element. Therefore, it is possible to cancel the influence of variations in the position of the image sensor in the Z direction and position the image sensor effectively.

(3) In the imaging apparatus, the plurality of surfaces include a first surface that extends in a direction parallel to the imaging element, and a first surface that is connected to the first surface and extends in a direction perpendicular to the first surface. A second surface connected to the second surface, the second surface and a third surface perpendicular to the imaging device, and a fourth surface connected to the third surface and connected to the arithmetic processing unit. It is characterized by comprising. According to the above configuration, the plurality of surfaces include a first surface that extends in a direction parallel to the imaging element, and a second surface that is connected to the first surface and extends in a direction perpendicular to the first surface. A third surface connected to the second surface and perpendicular to the second surface and the imaging device, and a fourth surface connected to the third surface and connected to the arithmetic processing unit. Thus, a structure is achieved in which the reaction force generated when the CCD solid-state imaging device moves is suppressed by deformation of the second surface and the third surface.

(4) In the imaging apparatus, the first surface may be deformable in the optical axis direction. According to the above configuration, by allowing the first surface in the optical axis direction, the influence of the positional deviation or adjustment deviation of the image sensor in the Z direction can be applied to the second and third surfaces. It can be dispensed with.

(5) In the imaging apparatus, a positioning reference portion for positioning the surface is provided on at least one of the plurality of surfaces. According to said structure, it becomes possible to position a flexible substrate more correctly by providing the positioning reference | standard part for performing positioning.

(6) In the imaging apparatus, the positioning reference portion includes at least one hole. According to said structure, the positioning reference | standard part is comprised with a hole, and the other party which positions can be sufficient with simple mechanisms, such as a pin.

(7) In the imaging apparatus, the positioning reference portion includes at least one cutout portion. According to said structure, the positioning reference | standard part is comprised by a notch, and the other party who positions can be a simple mechanism with a convex shape.

(8) In the imaging apparatus, the positioning reference portion is provided on the first surface and the third surface. According to said structure, the said positioning reference | standard part is provided on the said 1st surface and a 3rd surface, The 2nd which exists between the 1st surface, the 3rd surface, and these 2 surfaces The surface can also be accurately positioned.

(9) An imaging apparatus according to the present invention includes a lens barrel including a photographic lens, an imaging element that can move within a main body case, and a movable part that is provided so that the imaging element can be moved. And an arithmetic processing unit that processes a signal from the image sensor and at least three surfaces whose deformation directions are different by a plurality of bent portions, and the image sensor and the arithmetic processing unit are connected to each other. A flexible substrate, wherein the bent portion is formed by bending the flexible substrate with a bending portion positioning member provided in advance on the flexible substrate. According to the above configuration, the flexible substrate can be formed into a predetermined shape by the bending portion positioning member, and interference with surrounding components can be prevented.

(10) In the imaging apparatus, a portion where the bending portion positioning member is provided has higher rigidity than the flexible substrate in the vicinity thereof. According to said structure, a flexible substrate can be bend | folded along the part which made rigidity high, and it becomes a flexible substrate formed accurately.

(11) In the imaging apparatus, the bending portion positioning member is a member in which the flexible substrate is laminated or a member in which the flexible substrate is thickened. According to the above configuration, the flexible printed circuit board can be formed with high accuracy without using another member or the like by using the end of the multilayered flexible board or the end of the partially thickened flexible board. It becomes.

(12) In the imaging apparatus, the bending portion positioning member is integrally formed with the flexible substrate. According to said structure, since a bending part positioning member is integrally molded with a flexible substrate previously, it is not necessary to attach a bending part positioning member to the flexible substrate after shaping | molding, and the precision of the fixing position of a bending part positioning member improves. . Furthermore, there is no need to determine the fixing position using a jig when bending, and the flexible substrate is bent in a short time.

(13) In the imaging apparatus, the bending portion positioning member is a reinforcing plate attached to the flexible substrate. According to said structure, it becomes a bending part positioning member formed in the required place, without being influenced by the structure of an electric circuit.

(14) In the imaging apparatus, the bending portion positioning member is formed along a bending line on a flexible substrate serving as the bending portion. According to said structure, it becomes a bending part folded accurately by forming along a bending line.

(15) In the imaging apparatus, the bending portion positioning member is formed on one side or both sides of the bending line. According to said structure, if a bending part positioning member is formed in one place in front of a bending line or the back | inner side, it will become a bending part bent accurately along this. Moreover, if a bending part positioning member is formed in two places of the both sides of a bending line, it will become a bending part bent much more accurately by bending between them.

(16) In the imaging apparatus, the bending portion positioning member is formed along the entire length or a part of the bending line. According to said structure, if it forms along the full length of a fold line, it will become the bending part by which the full length of the fold line was folded accurately. Moreover, if it is formed along a part of the fold line, it becomes possible to fold only a part of the fold line that requires accuracy, and the remaining range is a side effect of the positioning member. It is possible to prevent a decrease in property. Furthermore, in the remaining range, it is possible to fold the folded surface of the folded portion so as to match 180 degrees, and the folded portion can be more reliably formed.

(17) In the imaging apparatus, the bending portion positioning member is formed along each of two locations of both end portions of the bending line. According to said structure, it becomes possible to form reliably two places of the edge part which needs a precision, and it becomes possible to suppress the side effect of a positioning member in other places.

(18) In the imaging apparatus, the imaging apparatus includes a camera shake correction mechanism that moves the imaging device to follow movement of a subject image due to camera shake by detecting camera shake occurring in the main body case. And According to the above configuration, the image pickup apparatus has a camera shake correction mechanism that moves the image pickup device to follow the movement of the subject image due to the camera shake by detecting the camera shake generated in the main body case. When the image pickup device is moved in order to compensate for shooting due to camera shake of the image pickup apparatus, it is possible to effectively absorb reaction force generated between the image pickup device and the processing circuit and to realize appropriate camera shake correction.

(19) In the imaging apparatus, the flexible board is provided with a bypass of a signal line that is shorter than a signal line passing through the flexible board, and the bypass signal line is provided between the imaging element and the arithmetic processing unit. A signal line for transmitting an image signal is used. According to the above configuration, it is possible to prevent deterioration in image quality by shortening important signal lines that affect image quality.

(20) Further, an electronic apparatus according to the present invention includes the imaging device. Accordingly, by including the imaging device, it is possible to effectively control the driving of the imaging element, particularly in an electronic device including the imaging device.

As described above, according to the imaging apparatus of the present invention, it is possible to eliminate the slack of the flexible substrate itself and prevent interference with surrounding components, and to reduce the size of the apparatus. Further, according to the imaging apparatus of the present invention, the flexible substrate can be accurately formed into a predetermined shape, and interference with surrounding parts can be prevented and the apparatus can be miniaturized.
Furthermore, according to the imaging apparatus of the present invention, in particular, in order to compensate for shooting due to camera shake of the imaging apparatus, when the imaging device is moved, the reaction force generated between the processing circuit side is effectively absorbed and appropriate. It is possible to realize an image pickup apparatus that can correct camera shake with little deterioration in image quality.
According to the electronic apparatus of the present invention, effective drive control of the image sensor can be performed in the electronic apparatus including the imaging device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an embodiment of an imaging apparatus of the present invention. FIG. 1 shows a state in which a lens barrel 1 constituting the imaging apparatus is viewed from the back, and a movable image sensor 2 is also viewed from the back. Reference numeral 3 denotes a flexible substrate, which is connected to the elongation calculation processing device 4 from the image sensor 2.

  FIG. 2 is an enlarged perspective view of the vicinity of the image sensor 2 of FIG. 1 as viewed from the light receiving surface side. The image sensor 2 can be moved in a direction parallel to the surface of the image sensor 2 by the movable portion 5. The flexible substrate 3 has a first surface 6 extending in a direction parallel to the imaging element 2, a second surface 7 connected to the first surface 6 and extending in a direction perpendicular to the first surface 6, and a second surface 7. The third surface 8 is connected to the second surface 7 and extends in a direction perpendicular to the second surface 7, and the fourth surface 9 is connected to the arithmetic processing unit 4. Reinforcing plates 10 to 12 for restraining slack deformation of the surfaces 6 to 8 are attached near the center of the first, second, and third surfaces 6 to 8. Since these reinforcing plates 10 to 12 are attached to the central portion where the sag deformation is most likely to occur on each of the surfaces 6 to 8, it is possible to effectively suppress the sag deformation. On the other hand, since the vicinity of the bent portions at both ends of the surface, which is an important part for absorbing the reaction force generated by the movement of the image sensor 2, can be freely deformed, the reaction force can be effectively absorbed.

  FIG. 3 is a top view of the flexible substrate 3 of FIG. A positioning main reference hole 13 and a positioning sub reference hole 14 are formed in the first surface 6. The holes of the positioning main reference hole 13 and the positioning sub-reference hole 14 are positioned with respect to the image sensor 1 with a jig or the like, and a part of the flexible substrate 3 is bonded to a part of the movable part 5 that is bonded and fixed to the image sensor 2. By fixing with the double-sided tape 15, the first surface 6 can be accurately positioned with respect to the image sensor 2.

  FIG. 4 is a top view of the flexible substrate 3 as viewed from the third surface 8 side. A positioning main reference hole 16 and a positioning sub-reference hole 17 are formed in the third surface 8. The third surface 8 can be accurately positioned with respect to the lens barrel 1 by being fitted to a boss formed on the lens barrel 1. Thus, by positioning the first surface 6 and the third surface 8 accurately, the position of the second surface 7 located between the two surfaces is also determined. Therefore, it is possible to accurately position all of the first surface 6, the second surface 7, and the third surface 8 within a limited range.

  FIG. 5 is an enlarged perspective view of a portion of the lens barrel 1 of the imaging device 2. When the image sensor 2 moves in the X direction, the third surface 8 is mainly deformed, and when the image sensor 2 moves in the Y direction, the second surface 7 is mainly deformed. Furthermore, the first surface 6 is deformed so as not to affect the second surface 7 and the third surface 8 with respect to variations in the position of the image sensor 2 in the Z direction. Note that the positioning main reference hole 13 and the positioning sub-reference hole 14 in FIG. 3 and the positioning main reference hole 16 and the positioning sub-reference hole 17 in FIG. 4 are formed on the flexible substrate 3 side and engaged with the boss. It is also possible to change the cutout to a possible shape.

  Here, the flexible substrate 3 used in the present invention has at least three planes (planes) 6 by bending a flat flexible substrate that has been punched into a predetermined shape at at least two predetermined locations (folding lines). 7 and 8. For example, in FIG. 2, the portion connecting the first surface 6 and the second surface 7 is the bent portion (folded portion). As described above, the three surfaces (planes) 6, 7, and 8 are deformed in different orthogonal directions (X, Y, and Z directions), and the position variation of the image pickup device 2 in the X, Y, and Z directions is varied. Since the influence can be canceled and positioning can be performed effectively, it is necessary to be accurately folded at the predetermined position (folding line) and stored in a predetermined position.

  As a result of intensive studies, the present inventors have found a method for forming a flexible substrate into a predetermined shape easily and accurately, whereby the desired flexible substrate 3 can be obtained. Hereinafter, the processing method of the flexible substrate 3 used for the imaging device 2 according to the present invention will be described.

  That is, in the present invention, a bending portion positioning member is provided in advance along a portion (bending line) where the flat flexible substrate is to be bent, and then the flexible substrate is bent along the end portion of the bending portion positioning member. To form. At this time, it arrange | positions so that the location (bending line) of a bending plan and the edge part of a bending part positioning member may correspond. Accordingly, when the flexible substrate is bent along the end portion of the bending portion positioning member, the flexible substrate is formed into a predetermined shape, and the bent portion can be formed with high accuracy.

  Here, the bending portion positioning member is a member in which a flexible substrate is laminated (configuration A) or a member in which the flexible substrate is thick (configuration B). By using the end of the multilayered flexible substrate or the end of the partially thickened flexible substrate, the forming process can be performed with high accuracy without the need for attaching another member. Further, it is preferable to integrally form such a bending portion positioning member with the flexible substrate, because it is not necessary to attach the bending portion positioning member to the molded flexible substrate, and the accuracy of the fixing position of the bending portion positioning member is improved (Configuration C). ). Furthermore, since it is not necessary to determine the fixing position using a jig when bending, the bending can be performed in a short time.

  Moreover, you may make it affix a reinforcement board to a flexible substrate as a bending part positioning member (configuration D). Thereby, it becomes possible to form in the place required for a process, without being influenced by the structure of the electric circuit of a flexible substrate.

  In any of the above bending portion positioning members, the portion where the bending portion positioning member is provided has higher rigidity than the flexible substrate in the vicinity thereof (Configuration E). As a result, the flexible substrate can be bent along the portion with increased rigidity, and forming can be performed with high accuracy.

  Further, the arrangement of the bending portion positioning members will be described in detail. The bending portion positioning members may be provided on one side or both sides of the bending line. If a bending portion positioning member is formed on one side of the fold line (one position on the front side or the back side), a bent portion is accurately bent along this (Configuration F). Further, if the bending portion positioning members are formed at two positions on both sides of the bending line, the bent portion is bent more accurately by bending the portion between them (Configuration G).

  Further, the bending portion positioning member is provided along the entire length or a part of the bending line. If the bending portion positioning member is formed along the entire length of the bend line, the bent portion is formed by bending the entire length of the bend line with high accuracy (Configuration H). In addition, if the bending portion positioning member is formed along a part of the bending line, only a part of the bending line that requires accuracy can be folded accurately, and the remaining range is a side effect of the positioning member. Thus, it becomes possible to prevent the flexibility of the flexible substrate from being lowered (Configuration I). Furthermore, in the remaining range, it is possible to fold the folded surface of the folded portion so as to match 180 degrees, and the folded portion can be more reliably formed.

  In addition, as an example which provides a bending part positioning member along a part of said bending line, the example which provides a bending part positioning member along each of two places of the both ends of the said bending line is mentioned (structure J). Thereby, it is possible to reliably form the two places at the end where accuracy is required, and to suppress the side effects of the positioning member at other places.

  6 and 7 show the configuration of the flexible substrate 3 manufactured by the processing method described above. Here, the vicinity of the image pickup device 2 is enlarged and shown as a perspective view seen from the light receiving surface side, and the same components as those shown in FIG. The reinforcing plates 10 to 12, the positioning main reference hole 13, the positioning sub reference hole 14, and the double-sided tape 15 are omitted.

  FIG. 6 shows an example in which the configurations D, E, G, and H are combined. That is, the flexible substrate 3 in FIG. 6 is a member (bending portion positioning member) in which a flexible substrate is laminated on both sides of a folding line (bending line) of the flat flexible substrate along the entire length of the bending line. 18 is affixed to a flat flexible substrate as a reinforcing plate, and then the flexible substrate is bent along the opposing ends of the two bending portion positioning members 18 to form the bent portion 3b.

  FIG. 7 shows an example in which the configurations B, C, E, F, I, and J are combined. That is, the flexible substrate 3 in FIG. 7 is a member (bending) in which the flexible substrate is thickened on one side of the folding line along each of the two ends of the flat flexible substrate (folding line). Part positioning member) 19 is integrally formed on a flat flexible substrate, and then the flexible substrate is bent along the straight ends of the two bending part positioning members 19 to form a bent portion 3b. is there.

  6 and 7, the bending portion positioning member can form the flexible substrate into a predetermined shape with high accuracy and simplicity, and can prevent interference with surrounding components.

By the way, the flexible substrate connecting between the image pickup device and the processing circuit needs to have a long overall length and a plurality of bent portions in order to absorb the reaction force returned from the processing circuit. The signal line of the flexible substrate connected from 2 to the arithmetic processing unit 4 also becomes long, and there is a problem that the image quality is deteriorated.
Therefore, the inventors have intensively studied to solve the problem, shortening only the lines affecting the image quality, and lengthening the other lines, sufficiently absorbing the reaction force returned from the processing circuit, The inventors have invented an image pickup apparatus that can perform high-performance camera shake correction and has little deterioration in image quality. That is, in the imaging apparatus according to the present invention, in the imaging apparatus described above, the flexible substrate is provided with a bypass of a signal line that is shorter than a signal line passing through the flexible substrate, and the bypass signal line is connected to the imaging element. And a signal line for transmitting an image signal between the processing unit and the arithmetic processing unit. The specific contents will be described below.

  FIG. 8 shows a configuration example in which a bypass is provided in the flexible substrate in the imaging apparatus according to the present invention. FIG. 8 shows a state in which the lens barrel 1 constituting the imaging apparatus is viewed from the back, and the image sensor 2 that can be moved is also in the state viewed from the back. Reference numeral 3 denotes a flexible substrate, which is connected to the elongation calculation processing device 4 from the image sensor 2. This is the same as the flexible substrate 3 shown in FIGS. Here, in addition to this, a bypass 20 is provided on the flexible substrate 3 to shortcut a part of the signal line. That is, a part of the signal line on the flexible substrate 3 is a bypass 20 that branches from the middle of the flexible substrate 3, passes through a shortcut, and returns to the flexible substrate 3 again.

  FIG. 9 is an enlarged view of the flexible substrate 3. As described above, the flexible substrate 3 is connected to the first surface 6 extending in a parallel direction with respect to the image pickup device 2 and is perpendicular to the first surface 6 by the three bent portions 3b. A second surface 7 extending in a certain direction, a third surface 8 connected to the second surface 7 and extending in a direction perpendicular to the second surface 7, and a fourth surface 9 connected to the arithmetic processing unit 4. Has been. The surfaces 6 to 8 can absorb reaction force generated in the flexible substrate 3 by being deformed in conjunction with the movement of the movable portion 5. In addition, the flexible substrate 3 has a signal line bypass 20 that extends from the first surface 6 to the fourth surface 9.

  In FIG. 10, the enlarged view of the bypass 20 of the flexible substrate 3 is shown. The bypass 20 is formed by bending the same flexible substrate as the surfaces 6 to 9. Specifically, a strip-shaped flexible substrate is bent at four locations in the longitudinal direction of the strip, and the three surfaces 20a formed by the bent portions 20b form a U-shaped structure. This U-shaped structural portion is twisted when the surfaces 6 to 8 are deformed in conjunction with the movement of the movable portion 5, thereby causing a reaction force exerted on the flexible substrate 3 from the arithmetic processing unit 4 during camera shake correction. Can be absorbed.

Further, at both ends of the bypass 20, there are mating solder portions 21a and 21b connected to signal lines (two signal lines in the figure) in the bypass 20, and the signal line electrical connection portions provided on the surface 6 respectively. 22a and the signal line electrical connection portion 22b provided on the surface 9 are connected by soldering together. Thereby, it is possible to provide a signal line that passes through the surface 6 -bypass 20 -the surface 9, and to shorten the length of the signal line that passes through the surfaces 6 to 9 of the flexible substrate 3. Moreover, since the bypass 20 is configured separately from the surfaces 6 to 9 of the flexible substrate, the shape of the bypass 20 can be freely determined within a range that does not impair the functions described above. Furthermore, since the bypass 20 can be connected by arranging an electrical connection portion at an arbitrary position on the surfaces 6 to 9 in conformity with the shape of the bypass 20, the degree of freedom in designing the flexible substrate 3 is increased.
Alternatively, the flexible substrate 3 in which the surfaces 6 to 9 and the bypass 20 are integrated can be used. In this case, the assemblability of the flexible substrate 3 can be improved.

FIG. 11 is a block diagram illustrating a configuration of signal lines of the flexible substrate 3 provided with the bypass 20. Here, the difference between the lengths of the lines connecting the blocks means the difference in the relative lengths of the signal lines, and the signal line a is shorter than the signal line b.
In the present invention, the signal line passing through the plane 6 -bypass 20 -plane 9 is changed from the pin (CCD output, horizontal transfer clock) that has an influence on the image quality of the CCD that is the image pickup device 2 to the signal processing operation of the arithmetic processing unit 4. A signal line a (image signal signal line for transmitting an image signal between the image pickup device 2 and the arithmetic processing unit 4) that connects to the CPU that is a unit, and a signal line that passes through the surfaces 6 to 9 of the flexible substrate 3 , A signal line b connecting from the camera shake correction mechanism related pin (the driving coil and position detection sensor provided in the movable unit 5) and the pin which does not affect the image quality of the CCD to the CPU which is the signal processing arithmetic unit of the arithmetic processing unit 4 (Mainly, a driving signal line for transmitting a signal between the camera shake correction mechanism driving system and the arithmetic processing unit 4). By disposing an important line that affects the image quality on the signal line a that is shorter than the signal line b, it is possible to suppress degradation of the image quality. Further, since the bypass 20 is also made of a flexible substrate, it is possible to more effectively absorb the reaction force generated from the arithmetic processing unit 4 on the flexible substrate 3.

  FIG. 12 shows another configuration example in which a bypass is provided in the flexible substrate in the imaging apparatus according to the present invention. Here, instead of the flexible substrate, a bypass 20L composed of two lead wires is used, and the lead wires are used as signal wires, and the signal wire electrical connection portions 22a and 9 are provided on the surface 6 at both ends. It is connected to the electrical connection portion 22b of the provided signal line by matching solder. Thereby, it is possible to provide a signal line that passes through the surface 6 -bypass 20 </ b> L-surface 9, and it is possible to reduce the length of the signal line that passes through the surfaces 6 to 9 of the flexible substrate 3. A signal line passing through the bypass 20L-plane 9 is a signal line for transmitting an image signal between the image sensor 2 and the arithmetic processing unit 4. In addition, the shape of the lead wire of the bypass 20L can be freely configured. In this case as well, the lead wires are deformed independently one by one, so that the surfaces 6 to 8 are interlocked with the movement of the movable portion 5. It is possible to absorb the reaction force from the arithmetic processing device 4 when the deformation is increased and absorb it more effectively.

Next, an electronic apparatus according to the present invention configured to incorporate the above-described imaging device will be described.
13 to 15 show the configuration of a digital camera having a camera shake correction function as an example of the electronic apparatus according to the invention. 13 is a front view of the digital camera, FIG. 14 is a rear view of the digital camera of FIG. 13, and FIG. 15 is a plan view of the digital camera of FIG.

13 to 15, a release switch (so-called shutter button) SW1, a mode dial SW2, and a sub LCD (liquid crystal display) 101 are arranged on the upper surface portion of the camera body.
Further, a strobe light emitting unit 103, a distance measuring unit 105, and a remote control (remote controller) light receiving unit 106 are provided on the front portion of the camera body. The optical viewfinder 104 has an objective surface located at the front portion of the camera body, and the lens barrel unit 107 is also provided with the objective surface facing the front side. The lens barrel unit 107 includes a lens barrel 1 that houses a photographing lens. Further, inside the camera body, as shown in FIG. 1, the imaging element 2 on the back side of the lens barrel 1 is connected to the arithmetic processing unit 4 via the flexible substrate 3.

  On the back of the camera body are a power switch SW13, LCD monitor 110, AF (auto focus) -LED (light emitting diode) 108, strobe LED 109, wide-angle zoom switch SW3, telephoto zoom switch SW4, self-timer switch SW5, menu switch SW6. , An up / strobe switch SW7, a right switch SW8, a display switch SW9, a down / macro switch SW10, a left / image confirmation switch SW11, an OK switch SW12 and a camera shake correction switch SW14. The main part of the optical viewfinder 104 is accommodated in the camera body, but its eyepiece surface is arranged on the back surface part. A cover 102 of a memory card / battery loading unit is provided on a side surface portion of the camera body.

When photographing with this digital camera, the image pickup apparatus of the present invention detects camera shake occurring in the camera body (main body case), and camera shake correction that causes the image sensor 2 to follow the movement of the subject image due to the camera shake. Is to do. Then, a subject image is formed on the image sensor 2 by each lens system of the lens barrel unit 107, and the image sensor 2 photoelectrically converts the subject image and outputs an RGB analog signal to the arithmetic processing unit 4. Then, predetermined signal processing is performed and converted into YUV data, and then a captured image is displayed based on the YUV signal.
As described above, by including the imaging device of the present invention, it is possible to effectively control the drive of the imaging device, particularly in an electronic apparatus including the imaging device.

  Although the present invention has been described with the embodiments shown in the drawings, the present invention is not limited to the embodiments shown in the drawings, and other embodiments, additions, modifications, deletions, etc. Can be changed within the range that can be conceived, and any embodiment is included in the scope of the present invention as long as the effects and advantages of the present invention are exhibited.

It is a perspective view showing an embodiment of an imaging device of the present invention. It is the perspective view which expanded the vicinity of the image pick-up element of FIG. 1, and was seen from the light-receiving surface side. It is the top view which looked at the flexible substrate of Drawing 1 from the back of an image sensor. It is the top view seen from the 3rd surface side of the flexible substrate of FIG. It is the perspective view which expanded the part of the lens barrel of the imaging device of FIG. It is the perspective view (2) which expanded the vicinity of the image pick-up element of FIG. 1, and was seen from the light-receiving surface side. It is the perspective view (3) which expanded the vicinity of the image pick-up element of FIG. 1, and was seen from the light-receiving surface side. It is a figure which shows the structural example which provided the bypass in the flexible substrate in the imaging device which concerns on this invention. It is an enlarged view of the flexible substrate of FIG. It is an enlarged view of the bypass in the flexible substrate of FIG. It is the block diagram which showed the structure of the signal wire | line of the flexible substrate of FIG. It is a figure which shows another structural example which provided the bypass in the flexible substrate in the imaging device which concerns on this invention. It is a front view of the digital camera which is an electronic device concerning the present invention. It is a rear view of the digital camera of FIG. It is a top view of the digital camera of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lens barrel 2 Image pick-up element 3 Flexible board 3b, 20b Bending part 4 Arithmetic processor 5 Movable part 6 1st surface 7 2nd surface 8 3rd surface 9 4th surface 10-12 Reinforcing plate 13 Positioning main Reference hole 14 Positioning sub reference hole 15 Double-sided tape 16 Positioning main reference hole 17 Positioning sub reference hole 18, 19 Bending part positioning member 20, 20L Bypass 20a Surface 21a, 21b Matching solder part 22a, 22b Electrical connection part 101 Sub LCD ( LCD)
DESCRIPTION OF SYMBOLS 102 Memory card / battery loading part cover 103 Strobe light emission part 104 Optical finder 105 Distance measuring unit 106 Remote control (remote controller) light-receiving part 107 Lens barrel unit 108 AF (autofocus) -LED (light emitting diode)
109 Strobe LED
110 LCD (liquid crystal display) monitor SW1 Release switch SW2 Mode dial SW3 Wide-angle zoom switch SW4 Telephoto zoom switch SW5 Self-timer switch SW6 Menu switch SW7 Up / Strobe switch SW8 Right switch SW9 Display switch SW10 Down / Macro switch SW11 Left / Image confirmation switch SW12 OK switch SW13 Power switch SW14 Camera shake correction switch

Claims (20)

  A lens barrel having a photographic lens, an image sensor that can move within the main body case, a movable part that is provided so that the image sensor can be moved, and a signal from the image sensor A plurality of surfaces formed between an arithmetic processing device, a flexible substrate to which the imaging element and the arithmetic processing device are connected, and two bent portions that are adjacent to each other among a plurality of bent portions on the flexible substrate. And an imaging device comprising: a member that is attached in the vicinity of a central portion of at least one of the plurality of surfaces and that restrains slack deformation of the surface. The imaging device according to claim 1,
One of the plurality of surfaces is formed in parallel with the image sensor, and is deformable in an optical axis direction perpendicular to a light receiving surface of the image sensor. The imaging device according to claim 1 or 2,
The plurality of surfaces include a first surface extending in a direction parallel to the imaging element, a second surface connected to the first surface and extending in a direction perpendicular to the first surface, and the second surface An imaging device comprising: a third surface that is connected to the second surface and perpendicular to the imaging device; and a fourth surface that is connected to the third surface and connected to the arithmetic processing unit. apparatus. The imaging device according to claim 3.
The imaging apparatus, wherein the first surface is deformable in the optical axis direction. In the imaging device in any one of Claims 1 thru | or 4,
An image pickup apparatus, wherein a positioning reference portion for positioning the surface is provided on at least one of the plurality of surfaces. The imaging apparatus according to claim 5,
The imaging reference device is characterized in that the positioning reference portion is composed of at least one hole. The imaging apparatus according to claim 5,
2. The imaging apparatus according to claim 1, wherein the positioning reference portion includes at least one cutout portion.   The imaging apparatus according to claim 5, wherein the positioning reference unit is provided on the first surface and the third surface. A lens barrel having a photographic lens, an image sensor that can move within the main body case, a movable part that is provided so that the image sensor can be moved, and a signal from the image sensor Comprising: an arithmetic processing unit, and a flexible substrate composed of at least three surfaces whose deformation directions are made different by a plurality of bent portions, to which the image sensor and the arithmetic processing unit are connected,
The imaging apparatus according to claim 1, wherein the bent portion is formed by bending the flexible substrate by a bending portion positioning member provided in advance on the flexible substrate. The imaging device according to claim 9,
The imaging apparatus according to claim 1, wherein the portion provided with the bending portion positioning member has higher rigidity than the flexible substrate around the portion. The imaging device according to claim 9,
The imaging apparatus according to claim 1, wherein the bending portion positioning member is a member in which the flexible substrate is laminated or a member in which the flexible substrate is thickened. The imaging device according to claim 9,
The imaging apparatus, wherein the bending portion positioning member is formed integrally with the flexible substrate. The imaging device according to claim 9,
The imaging apparatus according to claim 1, wherein the bending portion positioning member is a reinforcing plate attached to the flexible substrate. The imaging device according to claim 9,
The imaging apparatus according to claim 1, wherein the bending portion positioning member is formed along a bending line on a flexible substrate serving as the bending portion. The imaging device according to claim 14, wherein
The imaging apparatus according to claim 1, wherein the bending portion positioning member is formed on one side or both sides of the bending line. The imaging device according to claim 14, wherein
The imaging apparatus, wherein the bending portion positioning member is formed along the entire length or a part of the bending line. The imaging device according to claim 14, wherein
2. The imaging apparatus according to claim 1, wherein the bending portion positioning member is formed along each of two locations at both ends of the bending line. In the imaging device in any one of Claims 1 thru | or 17,
The image pickup apparatus includes a camera shake correction mechanism that moves the image pickup element to follow movement of a subject image due to camera shake by detecting camera shake generated in the main body case. The imaging device according to any one of claims 1 to 18,
The flexible board is provided with a signal line bypass that is shorter than a signal line that passes through the flexible board, and the bypass signal line is a signal line that transmits an image signal between the imaging device and the arithmetic processing unit; An imaging apparatus characterized by:   An electronic apparatus comprising the imaging device according to claim 1.

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