JP2009004688A - Heat dissipation structure of heat generation source on plane - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of a heat generation source on a plane which can efficiently dissipate heat from a plate surface, in which a heating element is mounted or the heat from the heating element is absorbed, in a mounting board of LED used for lighting and the like and a reflecting plate which supports a backlight using LED as a light emitting source used for display and the like. <P>SOLUTION: The heat dissipation structure of the heat generation source on the plane is provided with: a cooled plate; at least one group of heat pipes which are arranged directly or through a heat transfer member in one surface of the cooled plate; and a heatsink which is installed so as to be thermally connected to a part of each heat pipe among a group of heat pipes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides a plate-like surface on which a heating element is mounted or which absorbs heat from the heating element, such as a reflection board that supports a backlight used in an LED mounting substrate or a display used in lighting or the like. The present invention relates to a heat dissipation mechanism for efficiently dissipating heat from the heat.

  Conventionally, LEDs that have been on the market do not yet have sufficient luminance corresponding to the purpose of use, and are rarely used as lighting or backlights. Even if an LED is used as an illumination or backlight, it is also related to low brightness, and because it generates less heat, heat is dissipated by natural convection directly from the plate surface without special consideration of the heat dissipation mechanism on the plate surface. Alternatively, a substrate is attached on the fin, and the heat is dissipated by natural convection.

  Similarly, in the reflector that supports the backlight used for displays, etc., it is also related to the low brightness, and since the amount of heat generation is small, the plate surface does not need to be specially considered without considering the heat dissipation mechanism. The heat was directly radiated from the surface by natural convection, or the fan wind used for heat generation countermeasures from the power supply was used to radiate heat directly from the reflector by forced convection.

  Japanese Patent Application Laid-Open No. 2003-36032 discloses a display device. The disclosed display device includes a module including a liquid crystal panel, a main chassis, and a backlight. The module is formed with a liquid crystal panel attached to the front side of the main chassis and a backlight attached to the back side.

  A circuit board is attached to the back side of the module, an air inlet for taking in air is provided at the lower part of the circuit board, and a fan is further attached to the upper side of the circuit board. The backlight is composed of a diffusion plate facing the back surface of the liquid crystal panel, a plurality of fluorescent tubes arranged in parallel, and a reflecting plate provided on the back surface of the fluorescent tube. Air flows through the space formed between the circuit board and the backlight by the fan to cool the circuit board, the reflector of the backlight, and the like. The main chassis that holds the above-described backlight is made of metal such as iron, copper, or aluminum having good thermal conductivity.

Japanese Patent Application Laid-Open No. 2003-36032 also discloses that the liquid crystal panel needs to be enlarged and the backlight size needs to be increased in order to enlarge the screen. For this reason, the number of fluorescent tubes required increases and the calorific value increases.
Japanese Patent Laid-Open No. 2003-36032

As described above, the increase in the screen size increases the number of fluorescent tubes used in the backlight, increases the amount of heat generation, increases the required brightness, increases the temperature of the backlight, and heat dissipation is important. It has become a problem.
On the other hand, in recent years, with the progress of technology, the brightness of LEDs has risen, and finally there is a possibility for illumination, but on the other hand, the amount of heat generated by LEDs has increased, so it has been recognized too much in the past. The heat dissipation problem of LEDs that has not been found has become very important. Also in displays, higher definition and larger size have progressed, and the required brightness has increased and power consumption has increased. In addition, as described above, outside air is introduced into a predetermined space by a fan, and forced air cooling is performed by passing cold air around the heat generating member. However, it is very sensitive to sound accompanying the movement of the fan. As a result, quietness has been demanded.

  Accordingly, an object of the present invention is to mount a heating element such as a reflector for supporting a backlight having an LED used as a light source as a mounting substrate of an LED used for illumination or the like, or from a heating element. An object of the present invention is to provide a heat dissipation structure for a surface heat source that can efficiently dissipate heat from a plate-like surface that absorbs heat.

  The inventor conducted extensive research to solve the conventional problems. As a result, in order to cope with an increase in the amount of heat generation and an increase in size, the length of the heat pipe excellent in soaking and heat transport is not deformed by freezing of the hydraulic fluid due to temperature change even in an inclined state. It is effective to combine heat pipes of a limited length as appropriate, and to arrange a part of each heat pipe on the back side of the heat generating source on the surface of the mounting plate material, thereby eliminating the need for a fan It was found that heat can be radiated efficiently.

The first aspect of the on-surface heat source heat dissipation structure of the present invention is a cooled plate material,
At least one heat pipe group disposed directly or via a heat transfer member on one surface of the cooled plate member;
A heat dissipation structure for an on-surface heat source including a heat sink that is thermally connected to a part of each heat pipe of the heat pipe group.

  According to a second aspect of the heat dissipation structure of the on-surface heat source of the present invention, each of the heat pipe groups is composed of two heat pipes arranged in a straight line, and the two heat pipes are A heat radiation structure for an on-surface heat source, characterized in that the heat radiation source is disposed in a state in which ends are abutted with each other at a predetermined interval.

  According to a third aspect of the on-surface heat source heat dissipation structure of the present invention, each of the heat pipe groups is composed of two heat pipes, and the two heat pipes are in the vicinity of one end of each. The heat dissipating structure of the on-surface heat source is characterized in that the side surfaces are arranged in a state of facing each other with a predetermined gap therebetween.

  According to a fourth aspect of the on-surface heat source heat dissipation structure of the present invention, each of the heat pipe groups is composed of three or more heat pipes, and the heat pipes are adjacent to each other in the vicinity of one end. A heat dissipation structure for an on-surface heat source, characterized in that the heat pipe is disposed in a state of being opposed to each other at a predetermined interval from the side surfaces of the heat pipe.

  The fifth aspect of the heat radiation structure of the on-surface heat source according to the present invention is composed of two heat pipes arranged in a straight line, and the two heat pipes are end-to-end with a predetermined interval. A plurality of heat pipe groups arranged in a state of being arranged in parallel, and the end portions that are butted together are arranged so that the heat pipe groups adjacent to each other are opposed to each other. This is a heat dissipation structure.

  According to a sixth aspect of the heat dissipating structure of the on-surface heat source of the present invention, the heat pipe group in which the two heat pipes are arranged in a state where the side surfaces face each other with a predetermined interval in the vicinity of the end portion. A heat dissipating structure of an on-surface heat source, wherein a plurality of the heat pipe groups are arranged in parallel and arranged so that the end portions adjacent to each other are opposed to each other in the adjacent heat pipe groups. .

  The seventh aspect of the heat radiation structure of the on-surface heat source of the present invention is composed of two heat pipes arranged in a straight line, and the two heat pipes are attached to each other at a predetermined interval. 1 or more each of the heat pipe groups arranged in a state where the heat pipe groups are arranged in a state where two heat pipes face each other at a predetermined interval in the vicinity of the end portions. An on-surface heat source that is arranged in parallel and arranged so that the end portions that are butted together or the end portions that are arranged opposite to each other are opposed to each other between the adjacent heat pipe groups. This is a heat dissipation structure.

  According to an eighth aspect of the on-surface heat source heat dissipation structure of the present invention, the heat sink is in the vicinity of a position where the ends of the at least two heat pipe groups are attached to each other, and / or the end. A heat dissipating structure of an on-surface heat source that is thermally connected in common to the positions where the side surfaces face each other in the vicinity.

  The ninth aspect of the heat radiation structure for the on-surface heat source of the present invention is the heat radiation structure for the on-surface heat source, wherein the length of the heat pipe to be used is 125 times or less of the outer diameter.

  A tenth aspect of the on-surface heat source heat dissipation structure according to the present invention is the on-surface heat source heat dissipation structure in which the plate to be cooled is a mounting plate material on which the heat generator is mounted on the other surface. .

  An eleventh aspect of the on-surface heat source heat dissipating structure according to the present invention is the on-surface heat source heat dissipating structure characterized in that the heat generator is a plurality of LEDs.

  A twelfth aspect of the on-surface heat source heat dissipating structure according to the present invention is an on-surface heat source heat dissipating structure in which the plate to be cooled is a reflection plate of a display having a backlight.

According to the present invention, a heating element such as a reflector for supporting a backlight having an LED as a light source is mounted or absorbs heat from the heating element. It is possible to provide a heat dissipation structure for an on-surface heat source that can efficiently dissipate heat from a plate-like surface.
Furthermore, by the heat dissipation structure of the on-surface heat source of the present invention, an LED mounting substrate using a high-luminance LED used for illumination, or a backlight reflector using an LED used for display, Heat can be effectively dissipated.

  Furthermore, the length of the heat pipe excellent in temperature uniformity and heat transport is limited to a length that does not deform due to temperature change even in an inclined state, and the heat pipes of the limited length are appropriately combined, By disposing a part on the back side of the heat generating source on the surface of the mounting plate material, it is possible to efficiently dissipate heat without using a fan in response to an increase in heat generation and an increase in size.

A heat radiation structure for an on-surface heat source according to the present invention will be described in detail with reference to the drawings.
One aspect of the heat dissipating structure of the on-surface heat source of the present invention is a cooled plate material,
At least one heat pipe group disposed directly or via a heat transfer member on one surface of the cooled plate member;
A heat dissipation structure for an on-surface heat source including a heat sink that is thermally connected to a part of each heat pipe of the heat pipe group.

  In other words, in order to cope with the increase in screen size, the brightness of the backlight is increased by using a large number of fluorescent tubes as in the past, and the increased amount of heat is applied to the backlight by applying cool air to the backlight. The heat pipe is not cooled but is combined with a heat pipe excellent in heat equalization and heat transport, effectively radiating heat while maintaining quietness.

  The heat pipe is excellent in temperature equalization and heat transport, but it can be used for a board mounted with a high-brightness LED with a large amount of heat generation, and it can fully exhibit its heat dissipation function, and it does not use a fan Verification is necessary in terms of whether a desired heat dissipation effect can be obtained while maintaining quietness.

  Therefore, before explaining the heat radiation structure of the on-surface heat source of the present invention, first, the heat radiation effect by the heat pipe of the substrate on which the LED was mounted was confirmed at the simulation level. FIG. 1 shows the model used for the simulation and its result. (1) When a plurality of LEDs are arranged in parallel in three rows on the mounting board and nothing is arranged on the back side of the surface on which the LEDs are mounted; (2) A plurality of LEDs are arranged on the mounting board. The temperature state in the case where the three heat pipes were arranged in parallel on the back side of the surface on which the LEDs were mounted corresponding to the arrangement position of the LEDs and the radiation fins were attached to both ends was examined. . As the material of the mounting substrate, aluminum, copper, a multilayer substrate such as a glass epoxy substrate with a circuit copper foil attached to the surface, or the like was used.

  In the case of (1) in which no heat pipe is arranged, the temperature varies depending on the material of the mounting board, but the tendency is almost the same, and a temperature difference appears remarkably in the periphery of the LED and other parts, and the temperature is very high. The parts are scattered. On the other hand, in the case of (2) in which three heat pipes are arranged in parallel on the back side of the surface on which the LEDs are mounted, corresponding to the arrangement position of the LEDs, the temperature is made uniform over the entire mounting board, The part of does not exist.

  Thus, it has been confirmed that by using a heat pipe, it is possible to equalize the temperature of the mounting substrate and lower the overall temperature. However, on the other hand, whether heat pipes can actually be used in this way, heat dissipation means including heat pipe combinations etc. when it is necessary to efficiently dissipate more heat with a large mounting board We reviewed and confirmed. As a result, it was confirmed that the arrangement of the heat pipe as shown in FIG. 2 and the use of the heat sink were effective.

  FIG. 2 is a diagram showing one embodiment of a heat dissipation structure of an on-surface heat source. 2A is a front view, FIG. 2B is a front view with the heat sink removed, and FIG. 2C is a side view. As shown in FIGS. 2A and 2C, a plurality of LEDs 4 are mounted on one surface of the substrate 2 (that is, the lower surface shown in the drawing), and the opposite surface of the substrate 2 (that is, the lower surface) The two heat pipes 3 are attached in a thermally connected state with their one end portions opposed to each other on the upper surface shown in the drawing. The position of the heat pipe preferably corresponds to the position of the LED so as to be close to the LED as indicated by the dotted line in FIG. Furthermore, the heat sink 1 is installed so as to be in thermal contact with a part of each of the two heat pipes. As shown in FIG.2 (c), in this aspect, the two heat pipes are arrange | positioned at predetermined intervals substantially in series.

  Here, one end of each of the two heat pipes 3 does not need to be completely in contact, and may be separated if there is a part of each of the heat pipes 3 at a position in contact with the heat sink 1. The length of the heat pipe 3 itself may be changed as appropriate depending on the amount of heat generated from the LED 4 and the place where the heat sink 1 can be installed. Further, in this embodiment, the heat sink 1 itself is in contact with the two heat pipes 3, but the heat sink 1 may be divided and a separate heat sink may be attached to each.

  By arranging in this way, even if the brightness of the LED 4 is high and the calorific value is large, the heat of the LED 4 is transferred to the mounting board such as aluminum or copper and is thermally connected to the opposite surface of the mounting board corresponding to the LED 4 The hydraulic fluid is transmitted to the hydraulic fluid stored in the container of the heat pipe and is evaporated. The evaporated working fluid moves to the end of the heat pipe connected to the heat sink, where it dissipates heat and returns to the liquid phase, and returns to the position corresponding to the LED 4 by capillary force. In this way, a large amount of heat is transferred by the gas phase liquid phase change of the working fluid.

  In the aspect shown in FIG. 2, as described above, the heat dissipation structure of the on-surface heat source includes a vertically long mounting board in which two heat pipes are arranged in series at positions corresponding to the LEDs. That is, it is possible to efficiently dissipate the heat of a plurality of LEDs that are mounted on a vertically long mounting board and have a high luminance and a large amount of heat generation.

  FIG. 3 is a diagram for explaining a heat dissipation structure of the on-surface heat source in a form in which the mounting board is enlarged in the vertical and horizontal directions. That is, an example of the arrangement of the heat pipes on one surface of the mounting board is shown, and FIG. 3A shows an example of attachment when a plurality of heat pipes arranged in series in the width direction are arranged in parallel in the same manner as in FIG. 3 (b) shows an example of attachment of the heat pipe to the mounting board in a special arrangement. In any case, it is suitable for efficiently dissipating the heat of a plurality of LEDs having a high luminance and a large calorific value mounted on a mounting board enlarged in the vertical and horizontal directions.

  (B-1) shown in FIG. 3B is an example in which a part of each of the two heat pipes is arranged in parallel and the length of the heat pipe is the same. (B-2) is an example in which a part of each of the two heat pipes is arranged in parallel and the lengths of the heat pipes are different.

  (B-3) and (B-4) shown in FIG. 3B are arranged with two heat pipes having different lengths in a state in which the end portions are attached to each other at a predetermined interval, and The case where each one edge part left | separated and the case where it contact | connected is represented. In (B-5) shown in FIG. 3B, a heat pipe group is formed by three heat pipes, and a series part similar to that shown in FIG. 2 is formed by two heat pipes. One heat pipe is arranged in parallel with the above-described series part to form a parallel part. In other words, the heat pipes are arranged in a state of facing each other with a predetermined distance from the side surfaces of the adjacent heat pipes in the vicinity of the end portion.

  As described above, regarding the arrangement of the heat pipes, as described with reference to FIGS. 2 and 3, different types of heat pipes may be combined, or only one type of heat pipe may be used. In any case, it is important that a plurality of sets of one or two heat pipes (which may be more than two) are arranged. Moreover, the pitch between each set when using a plurality of sets of heat pipes does not necessarily have to be constant, and can be set according to the amount of heat generated and the positional relationship with other components.

  As described above, as a reason for arranging a plurality of heat pipes, many of the heat pipes used for electronic devices and the like are made of copper / water using water as the working fluid, and as the mounting plate becomes larger, A longer heat pipe is required. As a result, the amount of hydraulic fluid enclosed in the heat pipe container increases. Therefore, for example, when the heat receiving plate is tilted during transportation or storage, the working fluid sealed in the container collects at one end of the container, and when the temperature there falls to 0 ° C. or less. The water that is the working fluid freezes at the end. If the water turns into ice, it causes sediment expansion, and if the ice does not break at the gas-liquid interface part, the container part of the heat pipe will swell, and if the number of high and low temperature cycles increases, the container will eventually break down A problem will occur.

  The heat dissipating structure of the surface heat generation source according to the present invention solves the above-mentioned problem of the heat pipe by arranging a plurality of heat pipes in combination, and copes with an increase in heat generation and an increase in size which are the original purposes. In addition, it was made in order to meet the demand for efficient heat dissipation without using a fan.

  As a result of various evaluations on the heat pipe so that it can cope with an increase in heat generation and an increase in size, the length of the heat pipe needs to be at most 125 times the maximum, preferably 100 times or less. It is desirable to make it.

  When the heat pipe with an outer diameter of 6 mm is tilted 10 degrees and the hydraulic fluid is installed at one end of the container and 1000 cycles of −25 ° C. + 25 ° C. heat cycles are performed, the heat pipe with a length of 600 mm is No change in the outer diameter was observed even after the test was completed, but a heat pipe with an outer diameter of 6 mm and a length of 750 mm produced a bulge of 0.3 mm, and a heat pipe with an outer diameter of 6 mm and a length of 900 mm was destroyed. It has arrived. Although the heat pipe having an outer diameter of 6 mm and a length of 750 mm swells, the function as a heat pipe was maintained.

  Similarly, in the heat pipe having an outer diameter of 8 mm, the heat pipe having a length of 1000 mm is somewhat swollen. The heat pipe having an outer diameter of 8 mm and a length of 1200 mm has been destroyed. Thus, if the length of the heat pipe is about 125 times or less of the outer diameter, the function as a heat pipe can be maintained even when there is a temperature change in an inclined state, It was confirmed that it is desired to design with about 100 times or less.

Fig. 4-6 shows an installation example of the heat sink.
FIG. 4 is a view showing one embodiment of the heat dissipating structure of the on-surface heat source of the present invention. FIG. 4A shows a side view, and FIG. 4B shows a front view. As shown in FIG. 4A, a plurality of LEDs 4 are disposed on one surface of the mounting board 2 in a thermally connected manner. As shown in FIG. 4B, a heat pipe is thermally connected to the surface on the opposite side of the mounting plate corresponding to the row of the plurality of LEDs 4. In the aspect shown in FIG. 4, a plurality of LEDs 4 are arranged in parallel to each other in five rows. Two heat pipes form a heat pipe group, and five heat pipe groups are arranged in parallel. As described above, the position of the heat pipe corresponds to the row of LEDs 4. One end of each of the two heat pipes is arranged in a row opposite to each other at a predetermined interval. A heat sink with one base plate and fins is thermally connected to one end of the heat pipe of the group of five heat pipes arranged in this way (the center in the longitudinal direction of the mounting plate member). Yes.

  Therefore, it is divided into two parts at the center in the longitudinal direction of the mounting plate material, and as described above, the heat of the LED 4 is transferred to the mounting plate material such as aluminum or copper, and on the opposite surface of the mounting plate material corresponding to the LED 4 The hydraulic fluid is transmitted to the hydraulic fluid contained in the thermally connected heat pipe container to evaporate the hydraulic fluid. The evaporated working fluid moves to the end of the heat pipe connected to the heat sink, where it dissipates heat and returns to the liquid phase, and returns to the position corresponding to the LED 4 by capillary force. In this way, a large amount of heat is transferred by the gas phase liquid phase change of the working fluid. In the embodiment shown in FIG. 4, the heat of the LED can be effectively radiated in response to the increase in size in the vertical and horizontal directions.

  FIG. 5 is a view showing another embodiment of the heat dissipating structure of the on-surface heat source of the present invention. FIG. 5A shows a side view, and FIG. 5B shows a front view. As shown in FIG. 5A, a plurality of LEDs 4 are arranged on one surface of the mounting board 2 so as to be thermally connected. As shown in FIG. 5B, a heat pipe is thermally connected to the surface on the opposite side of the mounting plate corresponding to the row of the plurality of LEDs 4. In the aspect shown in FIG. 5, a plurality of LEDs 4 are arranged in parallel to each other in five rows. Two heat pipes form a heat pipe group, and five heat pipe groups are arranged in parallel. As described above, the position of the heat pipe corresponds to the row of LEDs 4. One end of each of the two heat pipes is arranged in a row facing each other at a predetermined interval. A heat sink with one base plate and fins is thermally connected to one end of each of the heat pipes of the five heat pipe groups arranged in this way (on both ends in the longitudinal direction of the mounting plate material). ing.

  Therefore, it is divided into two parts at the center in the longitudinal direction of the mounting plate material, and the heat of the LED is dissipated by heat sinks provided at both ends of the mounting plate material. Also in the aspect shown in FIG. 5, it is possible to effectively dissipate the heat of the LED in response to the increase in size in the vertical and horizontal directions.

  FIG. 6 is a view showing another aspect of the heat radiation structure of the on-surface heat source of the present invention. 6A shows a side view, and FIG. 6B shows a front view. As shown in FIG. 6A, a plurality of LEDs 4 are arranged on one surface of the mounting plate 2 so as to be thermally connected. As shown in FIG. 6 (b), heat pipes are thermally connected to the opposite surface of the mounting plate corresponding to the plurality of LEDs 4 in a row. The arrangement method of the heat pipes is the same as that described with reference to FIG. That is, also in the aspect shown in FIG. 6, the plurality of LEDs 4 are arranged in parallel to each other in five rows.

  Two sets of heat pipes are arranged in parallel. As described above, the position of the heat pipe corresponds to the row of LEDs 4. One end of each of the two heat pipes is arranged in a row facing each other at a predetermined interval. A heat sink in which the base plate and the fin are integrated with one end of the heat pipe of the heat pipe group of the five heat pipes arranged in this way (the right side heat pipe shown in the drawing, in the center in the longitudinal direction of the mounting plate). Are arranged in a thermally connected manner, and another heat sink in which the base plate and the fin are integrated is thermally connected to the center of the other heat pipe of the five heat pipes (the heat pipe on the left side in the figure). Has been.

  Therefore, also in this aspect, the LED arranged in the left part shown in the drawing in the central part in the longitudinal direction of the mounting plate material is heated to the heat sink separately from the central part arranged by the heat pipe. Is moved to dissipate heat, and the LED disposed in the right portion shown in the figure is dissipated by heat being transferred to the heat sink disposed at the left end by the heat pipe. Also in the aspect shown in FIG. 6, it is possible to effectively dissipate the heat of the LED in response to the increase in size in the vertical and horizontal directions.

  FIG. 7 is a view showing another aspect of the heat dissipation structure of the on-surface heat source of the present invention. Fig.7 (a) shows a side view, FIG.7 (b) shows a front view. That is, FIG. 7 shows an example in which the heat pipe and the heat sink that are thermally connected to the mounting plate material are arranged so as to be symmetrical with respect to a line orthogonal to the longitudinal direction of the heat pipe. In this aspect, the mounting plate material is an example in which two plate materials are combined, but may be formed of a single plate material. In addition, the positions of the heat pipe and the heat sink can be changed asymmetrically due to restrictions on the amount of heat generated by the heat source, the heat source location, and the mounting method.

  8 and 9 are partially enlarged views showing a heat pipe mounting method. In the embodiment shown in FIG. 8, the heat pipe is mounted in the aluminum block 7 by pressure contact, and is attached to the mounting plate 2 by screws or caulking. In this aspect, the contact area between the aluminum block 7 and the heat sink 1 is increased, and the heat dissipation effect is enhanced. Further, in the embodiment shown in FIG. 9, the heat pipe 3 is mounted on the aluminum plate 5 by curling and attached to the mounting plate 2. FIG. 9B shows an enlarged curling portion. In this aspect, the weight can be further reduced.

  As described above, according to the present invention, a heating element is mounted or a heating element such as a reflector for supporting a backlight having an LED as a light source as an LED mounting board used for illumination or the like. The heat from the plate-like surface that absorbs the heat from the heat can be efficiently radiated, and furthermore, heat pipes of a limited length are combined as appropriate, and a part of each heat pipe is placed on the surface of the mounting plate material By disposing on the back side of the heat generation source, heat can be efficiently radiated without using a fan in response to an increase in heat generation and an increase in size.

FIG. 1 shows a heat pipe model of a substrate on which an LED used in the simulation is mounted and its result. FIG. 2 is a diagram showing one embodiment of a heat dissipation structure of an on-surface heat source. 2A is a front view, FIG. 2B is a front view with the heat sink removed, and FIG. 2C is a side view. FIG. 3 is a diagram for explaining a heat dissipation structure of the on-surface heat source in a form in which the mounting board is enlarged in the vertical and horizontal directions. FIG. 4 shows an installation example of the heat sink. FIG. 5 shows an installation example of the heat sink. FIG. 6 shows an installation example of the heat sink. FIG. 7 is a view showing another aspect of the heat dissipation structure of the on-surface heat source of the present invention. FIG. 8 is a partially enlarged view showing a heat pipe mounting method. FIG. 9 is a partially enlarged view showing a heat pipe mounting method.

Explanation of symbols

1 Heat Sink 2 Mounting Board 3 Heat Pipe 4 LED
5 Aluminum plate material 6 Curling part 7 Aluminum block 10 Radiation structure of heat source on surface

Claims (12)

A cooled plate material,
At least one heat pipe group disposed directly or via a heat transfer member on one surface of the cooled plate member;
A heat dissipating structure for an on-surface heat source, comprising: a heat sink thermally connected to a part of each heat pipe of the heat pipe group.   Each of the heat pipe groups is composed of two heat pipes arranged in a straight line, and the two heat pipes are arranged in a state where the end portions are abutted with each other at a predetermined interval. The heat dissipating structure for an on-surface heat source according to claim 1, wherein:   Each of the heat pipe groups is composed of two heat pipes, and the two heat pipes are arranged in a state in which the side surfaces face each other with a predetermined interval in the vicinity of one end portion of each. The heat dissipating structure for an on-surface heat source according to claim 1.   Each of the heat pipe groups is composed of three or more heat pipes, and the heat pipes are opposed to each other at a predetermined interval from the side surfaces of the adjacent heat pipes in the vicinity of one end of each. The heat dissipating structure for an on-surface heat source according to claim 1, wherein the heat dissipating structure is an on-surface heat source.   A plurality of the heat pipe groups are arranged in parallel, each of which is composed of two heat pipes arranged in a straight line and in which the two heat pipes are arranged in a state where the ends are attached to each other with a predetermined interval therebetween. The heat dissipation structure for an on-surface heat source according to claim 1, wherein the heat-sink groups adjacent to each other are arranged so that the end portions that are abutted face each other.   The two heat pipes are arranged in a state in which the side surfaces are opposed to each other with a predetermined gap in the vicinity of the end portions. The heat dissipating structure for an on-surface heat source according to claim 1, wherein the heat pipe groups adjacent to each other are arranged so as to face each other in the vicinity of the end portions.   The heat pipe group including two heat pipes arranged in a straight line, and the two heat pipes arranged in a state where the ends are attached to each other at a predetermined interval, and the two heat pipes In the vicinity of the end portion, the heat pipe groups that are arranged in a state where the side surfaces face each other with a predetermined gap are arranged in parallel, and one or more of the heat pipe groups are arranged in parallel, and the abutted end portion or the opposed state The heat dissipation structure for an on-surface heat source according to claim 1, wherein the vicinity of the arranged end portion is disposed so as to face each other between the adjacent heat pipe groups.   The heat sink is thermally connected in common in the vicinity of the position where the ends of the heat pipe group are attached to each other and / or in the vicinity of the ends where the side faces face each other. The heat dissipating structure for an on-surface heat source according to any one of claims 1 to 7.   The heat radiation structure for an on-surface heat source according to any one of claims 1 to 8, wherein the length of the heat pipe to be used is 125 times or less of the outer diameter.   The heat dissipation structure for an on-surface heat source according to any one of claims 1 to 9, wherein the cooled plate member is a mounting plate member on which a heating element is mounted on the other surface.   The heat dissipation structure for an on-surface heat source according to any one of claims 1 to 10, wherein the heating element is a plurality of LEDs.   The heat dissipation structure for an on-surface heat source according to any one of claims 1 to 11, wherein the cooled plate member is a reflection plate of a display including a backlight.

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