CN100580528C - Liquid crystal display and its used backlight module - Google Patents

Abstract

The invention provides a liquid crystal display and a backlight module used therefor. The backlight module includes a light source module and a backplane. The light source module has at least one light emitting component. The backplane is arranged adjacent to the light source module, and the backplane is provided with at least one heat dissipation protrusion. The heat dissipation protrusion is in contact with the light source module and is arranged corresponding to the light emitting component. Wherein, a heat conduction medium is provided between the heat dissipation protrusion and the light source module to reduce the thermal resistance. Therefore, the heat generated by the light-emitting component can be conducted out through the heat dissipation module to achieve the purpose of heat dissipation.

Description

Liquid crystal display and its used backlight module

technical field

The invention relates to a backlight module. Specifically, the invention relates to a backlight module and a liquid crystal display used in conjunction with it.

Background technique

As the liquid crystal display panel (LCD) industry continues to develop towards a large-size route, the related challenges seem to be becoming more and more difficult. As far as TV-LCD for home use is concerned, its display characteristics such as brightness, contrast, display response speed, viewing angle, color range and color saturation must be better than traditional desktop displays, even better than plasma displays ( PDP) is only competitive if it is excellent. In addition, in addition to display features, price and cost are also one of the main purchasing considerations for consumers. However, in terms of large-sized LCDs, the cost of the backlight module (Backlight) accounts for a higher proportion, so how to effectively reduce costs is also a factor considered by LCD panel manufacturers.

Generally speaking, the backlight module of the liquid crystal display panel mostly uses a cold cathode fluorescent tube (CCFL; Cold Cathode Fluorescent Lamp) as the backlight source, and is mainly divided into direct-type and side-type backlight module designs. Among them, the side-type backlight module has a high light loss rate due to the light guide design, thereby limiting the brightness of the backlight. Therefore, when the size of the panel is larger, the brightness generated by the side-type backlight module will be difficult to satisfy, so the direct-type backlight module is almost replaced. However, in order to improve the brightness of the picture, the direct-type backlight module will inevitably increase the number of lamp tubes, which will increase the power consumption and cost accordingly. Others, such as increasing the length of the lamp tube, adding a diffuser film to enhance light uniformity, and possibly increasing the thickness of the panel, all increase the cost. In addition, without increasing the thickness of the panel, that is to say, in a certain space, too many and densely arranged lamp tubes will inevitably reduce the distance between the left and right of the lamp tubes, making it more difficult to dissipate heat.

In order to solve the heat dissipation problem, traditional panel manufacturers simply add additional heat dissipation modules, such as cooling devices such as heat sinks, heat pipes, or fans. However, these methods will add many components and weight to the LCD, and the cost will also be relatively increased.

Contents of the invention

The main purpose of the present invention is to provide a backlight module and a liquid crystal display used therein which can effectively reduce the thermal resistance of the heat dissipation path.

Another object of the present invention is to provide a backlight module, which has the characteristics of increasing product life and increasing luminous efficiency.

Another object of the present invention is to provide a backlight module with reinforced rib structure and a liquid crystal display used therein.

Another object of the present invention is to provide a backlight module and a liquid crystal display used in conjunction therewith, which have fewer components and are lighter in weight.

Another object of the present invention is to provide a backlight module and a liquid crystal display used in conjunction therewith, which have lower assembly costs.

Another object of the present invention is to provide a backlight module that can increase the brightness of a display and a liquid crystal display used in conjunction with it.

The backlight module of the present invention includes a light source module and a backplane. The light source module has at least one light emitting component. The backplane is arranged adjacent to the light source module, and the backplane is provided with at least one heat dissipation protrusion. The heat dissipation protrusion is in contact with the light source module and is arranged corresponding to the light emitting component.

In a preferred embodiment, a thermally conductive interface substance is further provided between the light source module and the backplane. Through the heat-conducting interface material arranged between the light source module and the metal backboard, the thermal effect of the light-emitting component can be transferred to the backplane with a better effect. In addition, the heat dissipation protrusion preferably further includes a rib protruding from the back plate. The protruding rib protrudes toward the light source module and has a top surface in contact with the light source module. The protruding ribs are preferably elongated and arranged on the back plate, and are preferably arranged parallel to an arrangement direction of the light-emitting component.

The invention further provides a liquid crystal display including a display panel, a backlight module and a backplane. The backlight module is arranged under the display panel. In a preferred embodiment, the liquid crystal display further includes a first casing and a second casing, through which the display panel and the backlight module are respectively assembled and fixed.

Description of drawings

FIG. 1 is an exploded schematic diagram of a backlight module according to an embodiment of the present invention;

2 is a diagram of a preferred embodiment of the combination of the backlight module and the backplane of the present invention;

Fig. 3 is a diagram of a preferred embodiment of the liquid crystal display of the present invention, that is, a cross-sectional view of a liquid crystal display using a direct-type backlight module;

4 is another preferred embodiment diagram of the liquid crystal display of the present invention, that is, a cross-sectional view of a liquid crystal display using a side-entry backlight module;

5 is a cross-sectional view of a backlight module using an LED backlight according to an embodiment of the present invention;

Figure 6 is a diagram of a preferred embodiment of the backboard of the present invention; and

Fig. 7 is a diagram of another preferred embodiment of the backplane of the present invention.

Among them, reference signs:

100 backlight modules

102 diffuser plate

104 prism sheet

106, 171 light guide plate

108 reflectors

110 frames

120 light source module

122 light-emitting components

150 optical components

200 backplane

210 heat dissipation protrusion

212 Thermal Interface Material (TIM)

220 convex rib

222 Top

230 bumps

300 display panel

400 LCD display

410 first housing

510 First Space

Detailed ways

The present invention utilizes the structural parts of the backlight module itself as a heat conduction component, thereby effectively dissipating liquid crystal display and its matched backlight module. In other words, through the self-cooler function of the backlight module, the surface temperature of the light-emitting component is reduced, thereby increasing the luminous efficiency and brightness of the display. In a preferred embodiment, the light-emitting components in the backlight module refer to cold cathode fluorescent tubes (CCFL). However, in other different embodiments, the light emitting component can also use external electrode fluorescent lamps (EEFL), light emitting diodes (LED), flat fluorescent lamps (FFL; Flat Fluorescent Lamp) or other light sources. Below promptly in conjunction with accompanying drawing, illustrate each specific embodiment of the present invention and steps thereof:

FIG. 1 is an exploded schematic view of a backlight module according to an embodiment of the present invention. The backlight module 100 of the present invention includes a light source module 120 , a backplane 200 , a frame 110 and an optical component 150 . The optical component 150 preferably includes a diffuser plate 102 , a prism sheet 104 , a light guide plate 106 and a reflective plate 108 . The optical component 150 is disposed on one side of the frame 110 . The light source module 120 has at least one light emitting component 122 . In the embodiment shown in FIG. 2 , a direct type backlight module 100 is preferably used. In other words, the light emitting elements 122 are preferably cold cathode fluorescent tubes (CCFL), and are evenly distributed on the light source module 120 . However, in other different embodiments, light sources such as external electrode fluorescent lamps, flat fluorescent lamps or light emitting diodes may also be used. The backplane 200 is adjacent to the light source module 120 and assembled on the other side of the frame 110 . The plurality of heat dissipation protrusions 210 of the backplane 200 are arranged corresponding to the light emitting components 122 of the light source module 120 , so that each heat dissipation protrusion 210 contacts the light source module 120 .

FIG. 2 is a schematic diagram of an embodiment of the combination of the backlight module and the backplane of the present invention. As shown in the embodiment of FIG. 2 , in the present invention, the backplane 200 having at least one heat dissipation protrusion 210 is preferably combined with the backlight module 100 to achieve the purpose of reducing thermal resistance. The material of the back plate 200 is preferably a material with high thermal conductivity, such as aluminum alloy (Al), galvanized steel sheet (SECC), aluminum-magnesium alloy (Al-Mg) or other metal materials with high thermal conductivity. In addition, a thermal interface material (TIM) with high thermal conductivity is added between the backlight module 100 and the backplane 200, such as: thermal paste, thermal pad/gap pad, thermal mica sheet, thermal bubble Cotton, thermal paste, thermal silica film, thermal tape and other media are used to increase the thermal conductivity per unit area or length and increase the efficiency of heat conduction. Furthermore, the thermal resistance of the heat dissipation path of the backlight module 100 is reduced by utilizing the material of the backplane 200 itself and the arrangement of the thermal interface material 212 medium.

FIG. 3 is a cross-sectional view of a liquid crystal display using the above-mentioned backlight module according to an embodiment of the present invention. The liquid crystal display 400 of the embodiment of the present invention further includes a display panel 300 , a first casing 410 and a backlight module 100 . The display panel 300 is disposed on the surface of the backlight module 100 for displaying images. In particular, components such as the backlight module 100 and the display panel 300 are assembled and positioned in the first casing 410 and the backplane 200 respectively. In the embodiment shown in FIG. 3 , each heat dissipation protrusion 210 of the backplane 200 preferably includes a rib 220 protruding from the backplane 200 . Each rib 220 further includes a top surface 222 mainly for contacting with the light source module 120 and for adding the thermally conductive interface substance 212 . The material of the housing of the light source module 120 is preferably a material with high thermal conductivity, please refer to the materials mentioned above. In addition, between the light source module 120 and the heat dissipation protrusion 210 , that is, between the light source module 120 and the top surface 222 of the protruding rib 220 , a thermally conductive interface material 212 is preferably disposed to increase the thermal conductivity.

In the embodiment shown in FIG. 2 , each heat dissipation protrusion 210 is preferably elongated and disposed on the back plate 200 , and is disposed parallel to an arrangement direction of the light emitting element 122 . In other words, the heat dissipation protrusions 210 are preferably arranged corresponding to the shape of the light emitting components 122 , that is, they are attached to the surface of the light source module 120 correspondingly to the number, length, width, direction and position of the light emitting components 122 . Therefore, if five strip-shaped light emitting components 122 are provided, at least five heat-dissipating protrusions 210 are also strip-shaped and at least five are provided. However, in the embodiment shown in FIG. 3 , the two heat dissipation protrusions 210 can also be integrated into one heat dissipation protrusion 210 with a larger top surface 222 area (as shown in the upper part of FIG. 3 ), or integrated into two or more heat dissipation protrusions. The heat dissipating protrusions 210 are even arranged in a manner of connecting several heat dissipating protrusions 210 and integrated into one heat dissipating protrusion 210 (as shown in the lower part of FIG. 3 ), and can be designed left and right according to requirements.

It should be noted here that the forming method of the heat dissipation protrusion 210 is preferably formed by bending or stamping. However, in other different embodiments, the heat dissipation protrusion 210 may also be formed by injection bonding or other methods. In addition, in the assembly process, before the backplane 200 is assembled with the light source module 120 , it is preferable to add the thermal interface substance 212 on the top surface 222 of the heat dissipation protrusion 210 first. However, in other different embodiments, after the backplane 200 and the light source module 120 are assembled, the thermal interface substance 212 may be applied to each top surface 222 of the heat dissipation protrusion 210 .

Therefore, when the light-emitting component 122 turns on and emits light and generates heat energy in the first space 510, it will be transferred to the light source module 120 through air convection, and the light source module 120 will directly transfer the heat energy to the backplane 200 through the easily conductive medium-thermally conductive interface material 212. Each of the heat dissipation protrusions 210. Therefore, by using each heat dissipation protrusion 210 to contact/interfere with the light source module 120 , the heat energy can be transferred out of the system more easily. In other words, using the backplane 200 with the heat dissipation protrusions 210 and the low thermal resistance material properties of the backplane 200 itself, the heat energy is conducted to the outside of the backlight module 100, and even the heat energy is conducted to the outside of the liquid crystal display 400 through air or other means. . Therefore, the temperature of the air in the first space 510 and the surface temperature of the light-emitting component 122 can be reduced, thereby increasing the lifespan of the light-emitting component 122 and even increasing the luminous efficiency.

Also as shown in FIG. 4 , it is a diagram of another preferred embodiment of the liquid crystal display of the present invention. In this embodiment, the backlight module 100 of the liquid crystal display 400 adopts a side-type backlight module, so the light-emitting component 122 is arranged on one side of the backlight module 100, and the light is guided and distributed to the backlight module 100 by a special light guide plate 171 and emitted. to the display panel 300 . In the embodiment shown in FIG. 4 , the light emitting component 122 is preferably a CCFL. However, in other different embodiments, a light source such as an external electrode fluorescent lamp or a flat fluorescent lamp may also be used; or in the embodiment shown in FIG. 5 , a light emitting diode may also be used as the light emitting component 122 .

In the embodiment shown in FIG. 4 or FIG. 5, since the light-emitting component 122 is also arranged on one side of the liquid crystal display 400, the heat dissipation protrusion 210 of the back plate 200 can preferably be set as a single rib 220 and protrude toward the light source module. 120. The area of the top surface 222 of the heat dissipation protrusion 210 is preferably greater than or equal to the cross-sectional area of the first space 510 where the light emitting component 122 is disposed. However, in other different embodiments, the top surface 222 of the heat dissipation protrusion 210 can also be designed with a smaller area. Therefore, the bent heat dissipation protrusion 210 uses the thermally conductive interface substance 212 to contact the surface of the light source module 120 with low thermal resistance. When the light-emitting component 122 is turned on to generate heat energy, the heat energy can be transferred out of the system through the light source module 120 , the heat-conducting interface material 212 , and the heat dissipation protrusion 210 . In this way, the surface temperature of the first space 510 and the light-emitting component 122 is reduced, thereby increasing the service life of the light-emitting component 122 and its display brightness.

In addition, in the embodiment shown in FIG. 6 , if the backlight module adopts a direct-type light source, and the light-emitting component adopts a strip-shaped cold-cathode fluorescent tube or other similar-shaped lamp tubes, the heat-dissipating protrusions of the back plate 200 The shape of the 210 is preferably a long strip, and is arranged parallel to the direction in which the light emitting components 122 are arranged. If the direct-type light-emitting element is arranged in a dot shape of light emitting diodes, and the heat dissipation protrusion 210 of the back plate 200 has a better shape, it is also arranged in a bump 230, please refer to FIG. 7 at the same time. The bump 230 described here is preferably circular in shape. However, in other different embodiments, the shape of the bump 230 can also be similar to a circle or other different shapes.

Finally, it should be emphasized here that the heat dissipation protrusion 210 of the present invention can protrude toward the light emitting component 122 of the light source module 120 and transfer waste heat to the light emitting component 122; The protruding portion 210 and the TIM 212, such as components such as integrated circuits (ICs) on the printed circuit board, can also achieve the effect of reducing the thermal resistance of the heat dissipation path and other gains.

The present invention has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the invention. On the contrary, modifications and equivalent arrangements included in the spirit and scope of the claims are included in the scope of the present invention.

Claims (21)

1. A backlight module, characterized in that, comprising: A light source module having at least one light emitting component; and A back plate is arranged adjacent to the light source module, the back plate is provided with at least one heat dissipation protrusion, the heat dissipation protrusion is in contact with the light source module, and is arranged corresponding to the light emitting component, and the heat dissipation protrusion is in contact with the light emitting component The shape, quantity, setting direction and setting position of the light source module are correspondingly pasted on the surface of the light source module; A heat-conducting interface substance, the heat-conducting interface substance is arranged between the heat dissipation protrusion and the light source module. 2 . The backlight module according to claim 1 , wherein the thermal interface material comprises heat dissipation tape, heat conduction sheet or heat conduction paste. 3 . 3 . The backlight module according to claim 1 , wherein the heat dissipation protrusion comprises a protruding rib protruding from the back plate, and the protruding rib protrudes toward the light source module. 4 . 4. The backlight module according to claim 3, wherein the protruding ribs are elongated and disposed on the backplane. 5. The backlight module according to claim 3, wherein the convex rib is parallel to an arrangement direction of the light-emitting component. 6. The backlight module according to claim 3, wherein the convex rib is formed by bending the back plate. 7 . The backlight module according to claim 1 , wherein the heat dissipation protrusion comprises a protruding point protruding from the back plate, and the protruding point protrudes toward the light source module. 8. The backlight module according to claim 1, wherein the heat dissipation protrusion comprises a top surface, and the top surface is in contact with the light source module. 9. The backlight module according to claim 1, wherein the backplane material comprises metal or alloy. 10. The backlight module according to claim 1, wherein the light-emitting component comprises a cold cathode fluorescent lamp, a light-emitting diode or an external electrode fluorescent lamp. 11. A liquid crystal display, characterized in that, comprising: a display panel; A backlight module is arranged under the display panel, and the backlight module includes: A light source module having at least one light emitting component; and A back plate is arranged adjacent to the light source module, the back plate is provided with at least one heat dissipation protrusion, the heat dissipation protrusion is in contact with the light source module, and is arranged corresponding to the light emitting component, and the heat dissipation protrusion is in contact with the light emitting component The shape, quantity, setting direction and setting position of the light source module are correspondingly pasted on the surface of the light source module; A heat conduction interface substance, wherein the heat conduction interface substance is arranged between the heat dissipation protrusion and the light source module. 12. The liquid crystal display according to claim 11, further comprising a first casing, the first casing and the back plate fix the display panel and the backlight module therein. 13 . The liquid crystal display according to claim 11 , wherein the thermal interface material comprises a heat dissipation tape, a heat conduction sheet or a heat conduction paste. 14 . 14. The liquid crystal display according to claim 11, wherein the heat dissipation protrusion comprises a rib protruding from the back plate, and the rib protrudes toward the light source module. 15 . The liquid crystal display according to claim 14 , wherein the protruding ribs are elongated and disposed on the back plate. 16 . 16. The liquid crystal display according to claim 14, wherein the rib is parallel to an arrangement direction of the light-emitting component. 17. The liquid crystal display according to claim 14, wherein the convex rib is formed by bending the back plate. 18 . The liquid crystal display according to claim 11 , wherein the heat dissipation protrusion comprises a protruding point protruding from the back plate, and the protruding point protrudes toward the light source module. 19. The liquid crystal display according to claim 11, wherein the heat dissipation protrusion comprises a top surface, and the top surface interferes with the light source module. 20. The liquid crystal display according to claim 11, wherein the back plate material comprises metal or alloy. 21. The liquid crystal display according to claim 11, wherein the light-emitting component comprises a cold cathode fluorescent lamp, a light-emitting diode or an external electrode fluorescent lamp.

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