JP2008263360A - High-frequency substrate device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of mutual transmission lines which can suppress signal interface to a peripheral semiconductor element, wiring circuit or the like. <P>SOLUTION: A transmission line substrate for connection having a ground pattern where two slot holes electromagnetic-coupled to a triplate line are formed is connected to first and second transmission line substrates having a ground pattern where slot holes electromagnetic-coupled to the triplate line are formed, and the slot holes are opposed to each other, so that a high frequency signal can be transmitted between the first and second transmission line substrates. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a high-frequency board device for connecting transmission lines in a microwave or millimeter wave high-frequency band.

  Conventionally, an electrode having a slot pattern and a resonator pattern is formed on the top surface of a dielectric substrate, and the resonator based on the resonator pattern is disposed at the end of the dielectric substrate and at the end of the transmission line, and both are electromagnetically coupled. Thus, a transmission line connection structure for connecting slot lines is known (for example, see Patent Document 1). In this connection structure, it is not necessary to connect the conductors of two transmission lines using wires or ribbons, and the transmission lines can be connected without being affected by parasitic components due to the wires or ribbons. Further, since the resonators are arranged close to each other and strongly coupled, a low insertion loss characteristic can be obtained over a wide band.

JP 2001-308601 A (FIG. 1)

  However, in the conventional transmission line connection structure, high frequency signals are transmitted by electromagnetically coupling the resonators between different dielectric substrates. Therefore, some signal components that cannot be electromagnetically coupled by the resonance pattern at the connection part. Will be radiated into space. For this reason, there has been a problem that the radio wave of the signal component radiated to the space is coupled to a semiconductor element or a wiring circuit disposed in the vicinity of the resonator and affects its high frequency characteristics.

  The present invention has been made to solve such problems, and does not connect the conductors of two transmission lines using wires or ribbons, and does not cause signal interference to peripheral semiconductor elements or wiring circuits. An object is to obtain a connection structure between transmission lines that can be suppressed.

The high-frequency board device according to the present invention includes a triplate line, a first transmission line board having a ground pattern in which a slot hole electromagnetically coupled to the triplate line is formed, and a side ground pattern covering the side surface of the board, A triplate line, a ground pattern in which a slot hole electromagnetically coupled to the triplate line is formed, and a side ground pattern that covers a side surface of the board, the side ground pattern being a side ground pattern of the first transmission line board A second transmission line substrate disposed oppositely with a gap therebetween, a triplate line, a ground pattern having two slot holes electromagnetically coupled to both ends of the triplate line, and a side surface of the substrate. A transmission line substrate for connection having a side ground pattern for covering and connecting the first and second transmission line substrates. ,
Each slot hole of the connection transmission line is connected so as to be in contact with the slot hole of the first transmission line substrate and the slot hole of the second transmission line substrate.

A first transmission line substrate having a triplate line, a ground pattern in which slot holes are electromagnetically coupled to the triplate line, and a side ground pattern covering the side surface of the substrate; a triplate line; A second transmission line substrate connected to the first transmission line substrate having a ground pattern formed with slot holes electromagnetically coupled to both ends of the plate line and a side surface ground pattern covering the side surface of the substrate; With
The slot holes of the first and second transmission line substrates may be bonded in contact with each other, and the triplate lines of the first and second transmission line substrates may be coupled to each other through the slot holes.

  According to the present invention, the electromagnetic coupling portion connected via the slot hole has a structure surrounded by the ground pattern, so that it is possible to reduce the emission of unnecessary radio waves from the connection portion to the surrounding space.

Embodiment 1 FIG.
1 is a cross-sectional view showing a connection structure of a high-frequency substrate device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view showing the configuration of the high-frequency substrate device according to the first embodiment. FIG. 3 is a diagram showing a transmission line coupling structure in the high-frequency board device according to the first embodiment.

  In the figure, the high-frequency substrate device according to the first embodiment includes a metal carrier 1, a (first) transmission line substrate 2 and a (second) transmission line substrate 3 mounted on the metal carrier 1, and a transmission line. A connection transmission line substrate 4 mounted across the substrate 2 and the transmission line substrate 3 is provided. Further, the transmission line substrate 2 and the transmission line substrate 3 are mounted with a gap (Gap) between devices required for manufacturing between them. The connection transmission line substrate 4 is fastened together with the transmission line substrate 2 and the transmission line substrate 3 via screws 24 and fastened to the metal carrier 1. A semiconductor element 23 is mounted on the transmission line substrate 2 and the transmission line substrate 3. The semiconductor element 23 functions as an active element such as an amplifier or an attenuator, or a passive element such as a capacitor or a resistance element.

  The semiconductor element 23 is electrically connected to the transmission line substrate 2 and the transmission line substrate 3 by flip chip mounting or wire bonding. A wiring pattern 22 connected to the conductor pad 21 is formed. The metal carrier 1 is made of a conductive metal having a small difference in linear expansion coefficient with respect to the transmission line substrate 2 and the transmission line substrate 3, such as an iron nickel cobalt alloy. The transmission line substrate 2 and the transmission line substrate 3 are each composed of a dielectric multilayer ceramic substrate.

  The transmission line substrate 2 has ground patterns 16 and 14 formed on the upper and lower surfaces. The transmission line substrate 2 has a triplate line 5 made of a strip line formed on the inner layer, and the upper and lower layers thereof are electromagnetically shielded by ground patterns 16 and 14, respectively. The transmission line substrate 2 has a side surface ground pattern 11 formed on the side surface. The ground pattern 14 is in contact with the metal carrier 1 and connected to the ground. A conductor pad 19 is formed at the tip of the triplate line 5 to constitute an antenna probe. At this time, the vicinity of the conductor pad 19 at the tip of the triplate line 5 is an open end in terms of high frequency. Slot holes 8b are formed in the ground pattern 16. This slot hole 8 b constitutes a coupling slot corresponding to the frequency to be transmitted by the triplate line 5. The slot hole 8b is disposed so as to face the conductor pad 19.

  The transmission line substrate 3 has ground patterns 15 and 13 formed on the upper and lower surfaces. The transmission line substrate 3 is formed with a triplate line 6 made of a strip line on the inner layer, and the upper and lower layers thereof are electromagnetically shielded by ground patterns 15 and 13, respectively. Further, the transmission line substrate 3 has a side surface ground pattern 12 formed on the side surface. The ground pattern 13 is in contact with the metal carrier 1 and connected to the ground. A conductor pad 20 is formed at the tip of the triplate line 6 to constitute an antenna probe. At this time, the vicinity of the conductor pad 20 at the tip of the triplate line 6 is an open end in terms of high frequency. Slot holes 9b are formed in the ground pattern 15. The slot hole 9b constitutes a coupling slot corresponding to the frequency to be transmitted by the triplate line 6. The slot hole 9b is disposed to face the conductor pad 20. The transmission line substrate 3 has basically the same structure as the transmission line substrate 2.

  In the example of FIG. 1, conductor pads 21 and wiring patterns 22 are provided on the upper surface of the transmission line substrate 3. These peripheries are surrounded by the ground pattern 15 with a partially exposed dielectric surface in between, and the conductor pads 21 and the wiring pattern 22 are arranged in a non-contact manner with respect to the ground pattern 15.

  The connection transmission line substrate 4 has ground patterns 17 and 30 formed on the upper and lower surfaces. In the transmission line substrate 4 for connection, a triplate line 7 made of a strip line is formed on the inner layer, and the upper and lower layers thereof are electromagnetically shielded by ground patterns 17 and 30, respectively. The ground pattern 17 covers the entire upper surface of the connection transmission line substrate 4. Further, the connection transmission line substrate 4 has a side surface ground pattern 10 formed on the side surface. Conductor pads 18 are formed at both ends of the triplate line 7 to constitute an antenna probe. At this time, the vicinity of the conductor pads 18 at both ends of the triplate line 7 is open at high frequencies. Slot holes 8 and 9 are formed in the ground pattern 30. The slot holes 8 and 9 constitute a coupling slot corresponding to a frequency to be transmitted by the triplate line 6. The slot holes 8 and 9 are arranged so as to face the conductor pads 8 at both ends of the triplate line 6.

  The connection transmission line substrate 4 is placed on the upper surfaces of the transmission line substrate 2 and the transmission line substrate 3 so that the slot hole 8 coincides with the slot hole 8b and the slot hole 9 coincides with the slot hole 9b. Further, one conductor pad 18 in the triplate line 7 overlaps the conductor pad 19 at the position in the substrate horizontal direction, and the other conductor pad 18 overlaps the conductor pad 20 at the position in the substrate horizontal direction. With this configuration, when high-frequency signals are transmitted between the transmission line substrate 2 and the transmission line substrate 3, the slot holes 8b and 9b formed in the respective substrates correspond to the slot holes 8 and 8 in the connection transmission line substrate 4, 9, the high-frequency signals in the vertical direction are transmitted between the transmission line substrates 2 and 3 and the connection transmission line substrate 4 by electromagnetic coupling. That is, the triplate line 5 of the transmission line substrate 2 is electromagnetically coupled to the triplate line 7 of the connection transmission line substrate 4 through the slot holes 8 and 8b. Further, the triplate line 6 of the transmission line substrate 3 is electromagnetically coupled to the triplate line 7 of the connection transmission line substrate 4 through the slot holes 9 and 9b. Thus, the triplate line 5 of the transmission line substrate 2 and the triplate line 6 of the transmission line substrate 3 are connected to each other by electromagnetic coupling via the connection transmission line substrate 4.

  The transmission line substrate 2, the transmission line substrate 3, and the connection transmission line substrate 4 are formed with a ground pattern so as to cover the entire outer periphery excluding wiring patterns, electrical terminals, and semiconductor element mounting portions. As a result, the emission of unnecessary radio waves to the space around the connection portion between the substrates is reduced, and the influence on other high-frequency circuits can be suppressed.

  As described above, in this embodiment, a strip line composed of a multilayer ceramic substrate is formed on both substrates so as to straddle between two transmission line substrates composed of a multilayer ceramic substrate and having the strip line as a transmission line. A transmission line substrate for connection as a transmission line is mounted, and both substrates are connected. At this time, a high frequency signal transmitted to the inner triplate line is electromagnetically coupled through a slot hole formed in the ground pattern surface of each transmission line substrate. As a result, a high-frequency signal is transmitted between two transmission line substrates via a connection transmission line substrate, and surrounding the transmission line substrate with a ground pattern eliminates the need for space at the connection part. Radiation can be suppressed.

It is a figure which shows the connection structure of the high frequency board | substrate apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the structure of the high frequency board apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the coupling structure of the transmission line which concerns on Embodiment 1 of this invention.

Explanation of symbols

  1 metal carrier, 2 (first) transmission line substrate, 3 (second) transmission line substrate, 4 connection transmission line substrate, 5 triplate line, 6 triplate line, 7 triplate line, 8 slot hole, 9 slot hole, 10 side ground pattern, 11 side ground pattern, 12 side ground pattern, 13 ground pattern, 14 ground pattern, 15 ground pattern, 16 ground pattern, 17 ground pattern, 18 conductor pad, 19 conductor pad, 20 conductor pad , 21 Conductor pad, 22 Wiring pattern, 23 Semiconductor chip, 24 Screw, 25 Through hole, 30 Ground pattern.

Claims (2)

A first transmission line substrate having a triplate line, a ground pattern in which slot holes are electromagnetically coupled to the triplate line, and a side ground pattern covering the side surface of the substrate;
A triplate line, a ground pattern in which a slot hole electromagnetically coupled to the triplate line is formed, and a side ground pattern that covers a side surface of the board, the side ground pattern being a side ground pattern of the first transmission line board A second transmission line substrate disposed oppositely with a gap therebetween,
A first transmission line substrate having a triplate line, a ground pattern having two slot holes electromagnetically coupled to both ends of the triplate line, and a side ground pattern covering the side surface of the substrate; A transmission line substrate for connection,
With
Each slot hole of the connection transmission line is connected so as to be in contact with the slot hole of the first transmission line substrate and the slot hole of the second transmission line substrate, respectively.
A high-frequency substrate device characterized by that. A first transmission line substrate having a triplate line, a ground pattern in which slot holes are electromagnetically coupled to the triplate line, and a side ground pattern covering the side surface of the substrate;
A second plate connected to the first transmission line substrate having a triplate line, a ground pattern in which slot holes are electromagnetically coupled to both ends of the triplate line, and a side ground pattern covering the side surface of the substrate. A transmission line substrate of
With
The slot holes of the first and second transmission line substrates are bonded in contact with each other, and the triplate lines of the first and second transmission line substrates are coupled to each other through the slot holes.
A high-frequency substrate device characterized by that.

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