JP2002185201A - Wiring board for high frequency - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board for high frequency which can make high-frequency impedance matching and can further reduce the reflection loss of high-frequency signals by eliminating mismatching at a high frequency. SOLUTION: On the upper and lower surfaces of a dielectric substrate 2, pluralities of input-output section grounding through conductors 11a are respectively provided in areas surround by circles having radii of 0.8A and drawn with centers at a through conductor 10 and rectangles having shorter sides of 3A in length, in the direction perpendicular to both coplanar lines 5 and 8 and longer sides of 4A in length in the direction parallel to the lines 5 and 8 and drawn with centers at the through conductor 10. In addition, pluralities of transmission section grounding through conductors 11b which are electrically connected to grounding conductors 4 and 7 are arranged on both sides of the line conductors 3 and 6 of the first and/or second coplanar lines 5 and/or 8 at intervals of <=1/4 wavelength of the high-frequency signals on the outside of the areas.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency wiring board provided with a high-frequency input / output section having improved electrical characteristics in a high-frequency band.

[0002]

2. Description of the Related Art Conventionally, in a high-frequency wiring board used for a high-frequency circuit board, a high-frequency semiconductor element storage package, a high-frequency semiconductor element mounting chip carrier, and the like, a high-frequency semiconductor element and the like mounted on the upper surface thereof A high-frequency transmission line for transmitting high-frequency signals is formed on the upper and lower surfaces to electrically connect the high-frequency component of the present invention and the high-frequency circuit of the external electric circuit board on which the high-frequency wiring board is mounted. As a result, a high-frequency input / output unit is formed by electrically connecting them with a through conductor. Then, the high-frequency wiring board is mounted on the external electric circuit board, and the high-frequency transmission line on the lower surface is electrically connected to the connection line conductor of the external electric circuit board, so that the high-frequency wiring board is mounted. Will be used.

As an example of applying such a conventional high-frequency wiring board to a package for mounting a high-frequency semiconductor device, there is, for example, a package described in Japanese Patent No. 2605502. The package includes a package substrate, a package side wall mounted on the package substrate, a lid for sealing a cavity formed by being surrounded by the package side wall, and a die for mounting a semiconductor integrated circuit chip provided in the cavity. An external coplanar line having a bonding area and an internal high-frequency transmission line formed of a metallized metal layer on the surface of a dielectric substrate provided in the cavity, and forming a lead terminal formed by the metallized metal layer on the bottom surface of the package substrate; And a via hole made of metal for electrically connecting the internal high-frequency transmission line and the external coplanar line,
The internal high-frequency transmission line formed in the cavity is constituted by a coplanar line, and the ground metal of each of the internal high-frequency transmission line and the external coplanar line is connected by a plurality of via holes made of metal.

According to this, since the internal high-frequency transmission line is configured as a coplanar line, the line width of the signal line can be reduced by appropriately selecting the distance between the signal line and the ground metal. The line width can be adjusted to a lower value, the loss can be reduced, and the reflection loss can be reduced.

Further, when the external coplanar line and the internal high-frequency transmission line are connected by a plurality of via holes or via holes having a coaxial structure, high-frequency mismatch is small, and
In addition, it is possible to increase the isolation.

The reason why the coplanar line is used as the high-frequency transmission line is that the pattern width of the signal line on the side (upper surface) on which the high-frequency component is mounted on the high-frequency wiring board and the external electric circuit substrate on the lower surface are used. For the purpose of compensating for the discontinuity with the pattern width of the signal line on the side (lower surface) mounted on the substrate and improving the isolation between the signal lines, it is preferable to connect the coplanar lines as compared with the microstrip line. It is because of that.

[0007]

However, in the high-frequency wiring board applied to the package described in Japanese Patent No. 2605502, the external coplanar line and the internal high-frequency transmission line are connected to a plurality of via holes (through conductors).
When connecting with, the via holes form a coaxial structure, but these via holes penetrate and connect the external ground conductor and the internal ground conductor, so when performing impedance matching, in the surface layer, Since the gap is formed between the line conductor of the external coplanar line and the ground conductor or the gap between the internal coplanar line and the ground conductor, and a coaxial structure is formed by via holes in the dielectric substrate, impedance matching is very difficult in practice.

Therefore, there is a problem that a deviation of impedance matching occurs in the dielectric substrate, a high-frequency signal transmitted at a portion connecting transmission lines having different impedances is reflected, and a reflection loss increases. .

Accordingly, the present invention has been completed in view of the above-mentioned problems of the prior art. It is an object of the present invention to make the arrangement of the ground through conductor and the like around the through conductor closer to the coaxial structure and to reduce the frequency of the high frequency signal. It is an object of the present invention to provide a high-frequency wiring board including a high-frequency input / output unit which suppresses reflection loss of a high-frequency signal as an arrangement having high transmission characteristics.

[0010]

A high frequency wiring board according to the present invention comprises a first coplanar line for transmitting a high frequency signal formed on an upper surface of a dielectric substrate formed by laminating a plurality of dielectric layers. A first coplanar line and a second coplanar line formed in parallel on the lower surface of the dielectric substrate with the ends of the line conductors facing each other;
The ends of these line conductors are electrically connected by a through conductor, and the ground conductors of the two coplanar lines are electrically connected to each other by a ground through conductor at a distance A on both sides in a direction orthogonal to the two coplanar lines from the through conductor. A high-frequency input / output unit that is connected to the upper surface and the lower surface, and a circle having a radius of 0.8 A centered on the through conductor and orthogonal to the two coplanar lines centered on the through conductor. A plurality of input / output unit ground through conductors are provided in a region surrounded by a rectangle whose short side in the direction is 3A and whose long side in both coplanar line directions is 4A.

According to the high-frequency wiring board of the present invention, with the above-described configuration, the input / output unit ground through conductor is provided closer to the periphery of the through conductor, and the through conductor is arranged closer to the coaxial structure. In addition, by setting the arrangement of the input / output unit ground through conductor with respect to the through conductor within a predetermined area, high-precision impedance matching can be performed. Therefore, it is possible to eliminate high-frequency mismatch and reduce reflection loss of high-frequency signals.

In the present invention, preferably, a plurality of electric conductors electrically connected to the ground conductor on both sides of the line conductor along the first coplanar line and / or the second coplanar line outside the region. Characterized in that the transmission portion ground through conductors are arranged at intervals of not more than ４ of the wavelength of the high frequency signal.

According to the above configuration, the ground conductor of the coplanar line is in a good ground state, and a good transmission line with small transmission loss can be formed.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a high-frequency wiring board according to the present invention will be described with reference to the drawings. 1A and 1B show an example of an embodiment of a high-frequency wiring board according to the present invention, in which FIG. 1A is a top view, FIG. 1B is a sectional view taken along line XX ′ of FIG.
(C) is a sectional view taken along line YY 'of (a), and (d) is a bottom view. Each shows the vicinity of the high frequency input / output unit.

In these figures, reference numeral 1 denotes a high-frequency wiring board. Reference numeral 2 denotes a dielectric substrate formed by laminating a plurality of dielectric layers, 3 denotes a first line conductor formed on the upper surface of the dielectric substrate 2 for transmitting a high-frequency signal, and 4 denotes a first line conductor. First line conductors are disposed on both sides, and the line conductor 3 and the ground conductor 4 constitute a first coplanar line 5. Reference numeral 6 denotes a first line conductor 3 on the lower surface of the dielectric substrate 2 so that its tip is opposed to the first line conductor 3.
The second line conductor 7 formed in parallel with the second line conductor 7 is a second ground conductor disposed on both sides of the second line conductor 6, and these line conductors 6 and the ground conductor 7 form a second coplanar line. 8 are configured.

Reference numeral 10 denotes a tip of the line conductor 3 of the first coplanar line 5 and a line conductor 6 of the second coplanar line 8.
Is a through conductor that electrically connects the tip of the wire.

Thus, the first coplanar line 5 formed on the upper surface of the dielectric substrate 2 and the second coplanar line 8 formed on the lower surface of the dielectric substrate 2 The high-frequency input / output unit of the high-frequency wiring board 1 is formed by opposing the upper and lower surfaces and electrically connecting the ends of the line conductors 3 and 6 of the coplanar lines 5 and 8 with the through conductors 10. In such a high-frequency input / output unit, the second
The line conductor 6 of the coplanar line 8 also serves as a mounting electrode for connection to an external electric circuit board.

Reference numeral 11a denotes an input / output unit ground through conductor, which electrically connects the first ground conductor 4 and the second ground conductor 7 of both coplanar lines 5, 8. Then, a circle having a radius of 0.8 A centered on the through conductor 10 and a short side in a direction orthogonal to the first and second coplanar lines 5 and 8 centered on the through conductor 10 are 3 A and the first and second
A plurality of input / output unit ground through conductors 11a are provided in a region surrounded by a rectangle having a long side in the direction of the coplanar lines 5 and 8 of 4A.
Are arranged to form a pseudo-coaxial structure centering on the through conductor 10.

In this example, the first ground conductor 4 formed on the upper surface of the dielectric substrate 2 and the second ground conductor 7 formed on the lower surface surround the ends of the respective line conductors 3 and 6. , So that a better grounding state can be obtained.

Reference numeral 12 denotes a frame joined to the upper surface of the dielectric substrate 2, and M denotes a mounting portion for electronic components such as semiconductor elements formed on the upper surface of the dielectric substrate 2. By providing the mounting portion M and the frame 12 in this manner, the high-frequency wiring board 1 can be used as an electronic component storage package for storing high-frequency electronic components.

According to such a high-frequency wiring board 1 of the present invention, as shown in an enlarged top view of a main part of the present invention in FIG. In a region surrounded by a rectangle having a radius of 0.8A and a rectangle having a short side of 3A in a direction orthogonal to both coplanar lines 5 and 8 with the through conductor 10 as a center and a long side of both coplanar lines in the direction of 4A, Plural input / output unit ground through conductors 11
By providing a, in the high frequency input / output unit,
Through conductor 10 of first and second coplanar lines 5, 8
Can have electrical characteristics as a pseudo-coaxial structure closer to a coaxial structure by the input / output unit ground through conductor 11a. As a result, high-frequency mismatch can be reduced to reduce the reflection loss, and the phase of the ground at the connection between the line conductors 3, 6 and the through conductor 10 can be made equal to eliminate the shift. Thus, it is possible to suppress the occurrence of reflection of the high-frequency signal and to suppress the reflection loss.

The distance A is specifically 0.2 to 5 m
m is less than 0.2 mm, the capacitance component of the capacitive component and the inductive component (self-induction component) due to the electromagnetic coupling between the through conductor 10 and the input / output unit ground through conductor 11a increases. Then, the matching between the capacitive component and the inductive component suitable for impedance matching tends to be impaired, and a resonance point tends to appear.
If it exceeds 5 mm, the capacitance component decreases and the induction component relatively increases, so that a resonance point tends to appear.

Here, the input / output unit ground through conductor 11a is
When the distance is outside the above range, the distance between the through conductor 10 and the input / output unit ground through conductor 11a is too large. It is difficult to obtain.

The pitch between the input / output unit ground through conductors 11a is preferably about 0.2 to 5 mm, like the distance A.

The angle between adjacent lines of the line connecting the input / output portion ground through conductor 11a and the through conductor 10 is preferably 10 to 80 °, and if the angle is less than 10 °, the through conductors 10 are too close to each other. Cracks are likely to occur in the dielectric substrate due to the method of manufacturing the dielectric substrate. If the angle exceeds 80 °, when a high-frequency signal propagates through the through conductor 10, electromagnetic waves leak from between the input / output portion through conductors 11 a, and transmission loss tends to increase.

Further, with respect to the above angle, more preferably, the extension side of the transmission direction (the first line) with respect to the input / output unit ground through conductor 11a located at the position of the distance A on both sides in the direction orthogonal to the first coplanar line 5. The angles of the input / output unit ground through conductors 11a adjacent to each other on the side extending in the transmission direction at the end of the conductor 3 (on the side extending in the transmission direction from the end of the first line conductor 3) and on the side returning in the transmission direction (10-40), respectively. ° is good.

The input / output section ground through conductor 11a on the extension side in the transmission direction is different from the input / output section ground through conductor 11a located at a distance A on both sides in the direction orthogonal to the first coplanar line 5. , A radius around the through conductor 10.
It is preferably within the range surrounded by a circle of 8A to 1.5A. By arranging in this way, it becomes more similar to a coaxial structure. Within the area less than 0.8A radius,
Of the capacitance component and the induction component (self-induction component) due to the electromagnetic coupling between the through conductor 10 and the input / output unit ground through conductor 11a,
The capacity component increases. Then, the matching between the capacitive component and the inductive component suitable for impedance matching tends to be impaired, and a resonance point tends to appear. If it exceeds 1.5 A, the capacitance component decreases and the induction component relatively increases, so that a resonance point tends to appear.

An input / output unit ground through conductor 11a located at a distance A on both sides in a direction orthogonal to the first coplanar line 5
On the other hand, it is preferable that the input / output unit ground through conductor 11a on the side returning in the transmission direction is substantially present on the arrangement line of the transmission unit ground through conductor 11b. As a result, there is obtained an effect that reflection of a high-frequency signal transmitted at a portion connecting transmission lines having different impedances is effectively suppressed, and occurrence of reflection loss can be prevented.

Further, the input / output unit ground through conductor 11a is preferably arranged substantially symmetrically with respect to the direction of the first coplanar line 5 (the direction of the first line conductor 3; the transmission direction). A coaxial structure may be formed.

Various preferred configurations as described above are described in the second section.
The same can be applied to the coplanar line 8.

In addition, outside the above-mentioned area, along the first coplanar line 5 and / or the second coplanar line 8, on both sides of the line conductors 3, 6, are electrically connected to ground conductors 4, 7. The plurality of transmission section ground through conductors 11b are arranged at intervals of not more than の of the wavelength of the high frequency signal.

When the transmission part ground through conductors 11b are provided at intervals exceeding one-fourth of the wavelength of the high-frequency signal, the leakage of the electromagnetic field of the high-frequency signal transmitted through the line conductors 3, 6 is effectively suppressed. And it becomes difficult to suppress the reflection loss of the high-frequency signal in the high-frequency input / output unit. Therefore, it is preferable that the transmission part ground through conductors 11b are arranged at intervals of not more than の of the wavelength of the high frequency signal.

The transmission part ground through conductor 11b is
It is good to arrange symmetrically with respect to the first and second coplanar line directions (directions of the first and second line conductors 3 and 6; transmission direction), and if not arranged symmetrically. In addition, there is a tendency that the leakage of the electromagnetic field of the high-frequency signal transmitted through the line conductors 3 and 6 cannot be effectively suppressed, and the reflection loss of the high-frequency signal in the high-frequency input / output unit may not be able to be suppressed.

The high-frequency wiring board 1 of the present invention is mounted on the upper surface of an external electric circuit board.
The line conductor 6 of the second coplanar line 8 is connected to the line conductor for connection of the external electric circuit board, and the ground conductor 7 is connected to the ground conductor of the external electric circuit board by a conductive connecting member such as a solder bump or a solder material. By electrically connecting by the used reflow process, the high-frequency wiring board 1 is mounted on the external electric circuit board.

Next, another example of the embodiment of the high-frequency wiring board of the present invention is shown in FIG. 2 in a view similar to FIG.
2, (a) is a top view, (b) is a cross-sectional view taken along line XX 'of (a), and (c) is a YY' line of (a).
FIG. 4D is a bottom view, and all show the vicinity of the high-frequency input / output unit. The same parts as those in FIG. 1 are denoted by the same reference numerals.

In these figures, 1 is a high-frequency wiring board, 2 is a dielectric board formed by laminating a plurality of dielectric layers, and 3 is a first line conductor formed on the upper surface of the dielectric board 2. Reference numeral 4 denotes a first ground conductor disposed on both sides of the first line conductor 3, and reference numeral 5 denotes a first coplanar line composed of the line conductor 3 and the ground conductor 4. Reference numeral 6 denotes a second line conductor formed on the lower surface of the dielectric substrate 2 in parallel with the first line conductor 3 so that the front end thereof faces the first line conductor 3, and 7 denotes a second line conductor 6. The second ground conductors 8 provided on both sides of the second conductor are a second coplanar line composed of the line conductor 6 and the ground conductor 7.

Reference numeral 9 denotes a first and a second in the dielectric substrate 2.
2 formed so as to face the coplanar lines 5 and 8 of FIG.
Reference numeral 9a denotes an inner-layer ground conductor immediately below the first coplanar line 5, and 9b denotes an inner-layer ground conductor immediately above the second coplanar line 8. Reference numeral 10 denotes a through conductor that electrically connects the tip of the first line conductor 3 and the tip of the second line conductor 6.

Reference numeral 12 denotes a frame joined to the upper surface of the dielectric substrate 2, and M denotes a mounting portion for electronic components such as semiconductor elements formed on the upper surface of the dielectric substrate 2.

Reference numeral 13a denotes a first input / output unit auxiliary ground through conductor, and 13b denotes a second input / output unit auxiliary ground through conductor. The first ground conductor 4 and the first ground conductor 4 formed on the upper surface of the dielectric substrate 2 The second ground conductor 7 formed on the lower surface is extended so as to surround the end of each of the line conductors 3 and 6, so that a better ground state can be obtained. The first input / output section auxiliary ground through conductor 13a connects the first ground conductor 4 and the inner layer ground conductor 9a, and the second input / output section auxiliary ground through conductor 13b connects the second ground conductor 7 and the inner layer conductor. It is connected to the ground conductor 9b. Also, the inner layer ground conductor 9
a and 9b are electrically connected by an intermediate ground through conductor 14.

These first input / output section auxiliary ground through conductors 1
3a, the second input / output section auxiliary ground through conductor 13b
In the extension direction of the transmission direction of each end of the line conductor 3 and the second line conductor 6, 0.2 to 5
mm, the inner-layer ground conductors 9a and 9b are electrically connected to the extended ground conductors 4 and 7, respectively.

According to such a high-frequency wiring board 1 of the present invention, the connection between the first and second coplanar lines 5, 8 in the high-frequency input / output section, as in the example of FIG.
The through conductor 10, the inner layer ground conductors 9a and 9b, the input / output section ground through conductor 11a, the intermediate section ground through conductor 14, the first input / output section auxiliary ground through conductor 13a, and the second input / output section auxiliary ground through conductor 13b. Thereby, it has electrical characteristics as a pseudo coaxial structure closer to the coaxial structure. As a result, high-frequency mismatch can be reduced to reduce the reflection loss, and the line conductors 3, 6 and the through conductor 10 can be reduced.
It is possible to equalize the phases of the grounds at the connection portion to eliminate the shift, suppress the occurrence of reflection of the high-frequency signal, and suppress the reflection loss.

By providing the first input / output section auxiliary ground through conductor 13a and the second input / output section auxiliary ground through conductor 13b at predetermined positions as described above, the line conductors 3, 6 are provided as described above. Leakage of the electromagnetic field of the high-frequency signal into the dielectric substrate 2 extending in the direction of extension of the transmission direction from the end of the high-frequency signal, and the reflection loss of the high-frequency signal at the high-frequency input / output unit can be further suppressed. it can.

Here, the positions (interval L1; FIG. 2 (b)) where the first input / output section auxiliary ground through conductor 13a and the second input / output section auxiliary ground through conductor 13b are formed are line conductors 3, 6, the distance between the through conductor 10 and the first auxiliary ground through conductor 13a is less than 0.2 mm.
In addition, the capacitance component due to the electromagnetic coupling with the second auxiliary ground through conductor 13b and the capacitance component of the inductive component (self-induction component) increase. Then, the matching between the capacitive component and the inductive component suitable for impedance matching tends to be impaired, and a resonance point tends to appear.

On the other hand, the first input / output section auxiliary ground through conductor 1
When the position (interval L1) where the 3a and the second input / output section auxiliary ground through conductor 13b are formed is located at a distance farther than 5 mm, the capacitance component decreases and the inductive component increases relatively. There is a tendency for resonance points to appear. Therefore, the positions where the first input / output unit auxiliary ground through conductor 13a and the second input / output unit auxiliary ground through conductor 13b are formed are determined by the line conductor 3 of the first coplanar line 5 and the line of the second coplanar line 8. It is preferable that the distance L1 between the conductor 6 and the penetrating conductor 10 in the extension direction of the transmission direction of each end of the conductor 6 be set to a position of 0.2 ≦ L1 ≦ 5 mm.

The length of the first input / output section auxiliary ground through conductor 13a is preferably set to 50 μm to 0.5 mm.
If it is less than 50 μm, the wiring pattern width of the high-frequency wiring board 1 tends to be narrow, and therefore, the deterioration of the signal reflection characteristics at the connection between the semiconductor chip to be mounted and the high-frequency wiring board 1 becomes large. If it exceeds 0.5 mm, the high-frequency wiring board 1
The wiring pattern width tends to be widened, which hinders the downsizing of the high-frequency wiring board 1. The length of the second input / output section auxiliary ground through conductor 13b is 50 μm to 0.1 μm.
The width is preferably 5 mm, and if it is less than 50 μm, the width of the wiring pattern of the high-frequency wiring board 1 is likely to be thin, so that the strength of the joint portion of the lead terminal is weakened or the joining of the lead terminal becomes difficult. If it exceeds 0.5 mm, the wiring pattern width of the high-frequency wiring board 1 tends to be widened, which hinders downsizing of the high-frequency wiring board 1.

When the ground conductor 4 of the first coplanar line 5 and the ground conductor 7 of the second coplanar line 8 extend so as to surround the ends of the line conductors 3 and 6, respectively, the first coplanar line 5 The ground conductors 4 and 7 are formed by adjusting the capacitance component so as to minimize the loss when transmitting signals to the second coplanar line 8 via the through conductor 10 and vice versa. At this time, it is preferable that the resistance, the inductor, and the capacitance are formed at matching positions in the entire signal line.

The high-frequency wiring board 1 of the present invention is also mounted on the upper surface of the external electric circuit board and the line conductor 6 of the second coplanar line 8 is mounted.
Is electrically connected to the connection line conductor of the external electric circuit board, and the ground conductor 7 is electrically connected to the ground conductor of the external electric circuit board by a conductive connection member such as a solder bump or a reflow process using a solder material. By
The high-frequency wiring board 1 is mounted on the external electric circuit board.

In the present invention, the high frequency band is 1 to 1
The high frequency wiring board 1 of the present invention is used in a high frequency band of about 1 to 100 GHz and a millimeter wave band, but has a relatively high frequency band of about 1 to 80 GHz. It is preferably used in a low band. This is because in a high-frequency band exceeding 80 GHz, a high-frequency signal is easily affected by an external magnetic field, resulting in an increase in noise and loss. More preferably, it is good to use at about 1 to 40 GHz.

It should be noted that the present invention is not limited to the above embodiment, and various changes and improvements can be made without departing from the scope of the present invention. For example, in the above-described embodiment, the case where one line conductor is provided as each of the first and second coplanar lines has been described. However, the case where two line conductors are provided or a plurality of three or more line conductors are provided. It may be a case of multiple ports arranged. In the above embodiment, the inner-layer ground conductors 9a and 9b are shown as having two layers, but there may be three or more layers. Further, a structure in which a connecting metal member such as a lead terminal or a ball is attached to the line conductor of the coplanar line may be adopted.

[0050]

The present invention provides a first coplanar line for transmitting a high-frequency signal formed on an upper surface of a dielectric substrate formed by laminating a plurality of dielectric layers, and a first coplanar line on a lower surface of the dielectric substrate. And the second coplanar line formed in parallel with the second coplanar line are arranged with the ends of the line conductors facing each other, and the ends of these line conductors are electrically connected to each other with through conductors. A high-frequency input / output unit formed by electrically connecting ground conductors of both coplanar lines with ground through conductors at a distance A on both sides in a direction orthogonal to both coplanar lines; On the lower surface, a radius of 0.
A plurality of input / output unit ground through conductors are surrounded by an area surrounded by a rectangle of 3A in the direction perpendicular to both coplanar lines centered on the circle of 8A and the through conductor and a long side of 4A in both coplanar line directions. The provision of the input / output unit ground through conductor is provided closer to the periphery of the through conductor, so that the through conductor has a pseudo-coaxial structure closer to the coaxial structure, and the input / output unit ground to the through conductor is provided. By setting the arrangement of the through conductors in a predetermined area, high-precision impedance matching can be performed. Therefore, it is possible to eliminate high-frequency mismatch and reduce reflection loss of high-frequency signals.

Further, the present invention preferably provides a plurality of transmission sections electrically connected to a ground conductor on both sides of the line conductor along the first coplanar line and / or the second coplanar line outside the above-mentioned region. Since the ground through conductors are arranged at intervals of one-fourth or less of the wavelength of the high-frequency signal,
The ground conductor of the coplanar line is in a good ground state, and a good transmission line with small transmission loss can be formed.

[Brief description of the drawings]

FIG. 1A is a top view showing an example of an embodiment of a high-frequency wiring board according to the present invention, and FIG.
X ′ line sectional view, (c) is a YY ′ line sectional view of (a),
(D) is a bottom view.

FIG. 2A is a top view showing another example of the embodiment of the high-frequency wiring board of the present invention, and FIG.
X ′ line sectional view, (c) is a YY ′ line sectional view of (a),
(D) is a bottom view.

FIG. 3 is an enlarged top view of a main part of FIG. 1 (a).

[Explanation of symbols]

 1: High frequency wiring board 2: Dielectric substrate 3: First line conductor 4: First ground conductor 5: First coplanar line 6: Second line conductor 7: Second ground conductor 8: Second Coplanar line 10: Through conductor 11: Ground through conductor 11a: Input / output unit ground through conductor 11b: Transmission unit ground through conductor

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H01L 23/12 E

Claims (2)

[Claims] A first substrate for transmitting a high-frequency signal formed on an upper surface of a dielectric substrate formed by laminating a plurality of dielectric layers.
A coplanar line, and the first surface on the lower surface of the dielectric substrate.
And a second coplanar line formed in parallel with the second coplanar line, with the ends of the line conductors facing each other, electrically connecting the ends of these line conductors with a through conductor, and A high-frequency input / output unit formed by electrically connecting ground conductors of the two coplanar lines with a ground through conductor at a position of a distance A on both sides in a direction orthogonal to the two coplanar lines; In the above, a circle having a radius of 0.8A centered on the through conductor and a rectangle having a short side of 3A in a direction orthogonal to the two coplanar lines and a long side of 4A in the both coplanar lines centering on the through conductor are defined. A high-frequency wiring board, wherein a plurality of input / output unit ground through conductors are provided in an enclosed area. 2. A plurality of transmission part ground penetrations electrically connected to the ground conductor on both sides of the line conductor along the first coplanar line and / or the second coplanar line outside the region. The conductor is a quarter of the wavelength of the high-frequency signal
2. The device according to claim 1, wherein the components are arranged at the following intervals.
The wiring board for high frequency described.