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JP2008253981A - 塗布装置及びこれを利用したコーティング液の塗布方法 - Google Patents

塗布装置及びこれを利用したコーティング液の塗布方法 Download PDF

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Publication number
JP2008253981A
JP2008253981A JP2007296963A JP2007296963A JP2008253981A JP 2008253981 A JP2008253981 A JP 2008253981A JP 2007296963 A JP2007296963 A JP 2007296963A JP 2007296963 A JP2007296963 A JP 2007296963A JP 2008253981 A JP2008253981 A JP 2008253981A
Authority
JP
Japan
Prior art keywords
coating
unit
substrate
coating liquid
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007296963A
Other languages
English (en)
Japanese (ja)
Inventor
Kwang Shin Park
光信 朴
Eui Sik In
義植 印
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of JP2008253981A publication Critical patent/JP2008253981A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2007296963A 2007-04-04 2007-11-15 塗布装置及びこれを利用したコーティング液の塗布方法 Pending JP2008253981A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070033035A KR100803147B1 (ko) 2007-04-04 2007-04-04 도포장치 및 이를 이용한 처리액의 도포 방법

Publications (1)

Publication Number Publication Date
JP2008253981A true JP2008253981A (ja) 2008-10-23

Family

ID=39343156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007296963A Pending JP2008253981A (ja) 2007-04-04 2007-11-15 塗布装置及びこれを利用したコーティング液の塗布方法

Country Status (4)

Country Link
JP (1) JP2008253981A (ko)
KR (1) KR100803147B1 (ko)
CN (1) CN101281372B (ko)
TW (1) TWI326618B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082230A (ja) * 2009-10-05 2011-04-21 Dainippon Screen Mfg Co Ltd 基板塗布装置
CN116618247A (zh) * 2023-07-24 2023-08-22 江西煜明智慧光电股份有限公司 一种led灯具加工用点胶装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101343502B1 (ko) * 2009-07-24 2013-12-19 엘지디스플레이 주식회사 코팅장비의 코터 척
KR101085395B1 (ko) 2009-08-21 2011-11-21 주식회사 케이씨텍 부상식 기판 코터 장치
KR101085396B1 (ko) 2009-08-21 2011-11-21 주식회사 케이씨텍 부상식 기판 코터 장치 및 그 코팅 방법
CN102320753A (zh) * 2011-08-09 2012-01-18 深圳市华星光电技术有限公司 玻璃基板的涂布设备及其涂布方法
CN202490741U (zh) * 2011-10-27 2012-10-17 金宝电子（中国）有限公司 涂布装置
CN105170417A (zh) * 2015-08-26 2015-12-23 京东方科技集团股份有限公司 一种涂布机及涂布方法
TWI745335B (zh) * 2016-01-22 2021-11-11 日商庄田德古透隆股份有限公司 端面塗佈裝置
CN106125178A (zh) * 2016-08-19 2016-11-16 武汉华星光电技术有限公司 彩色滤光片及其获取的涂布装置和获取方法
CN109013180A (zh) * 2018-08-17 2018-12-18 武汉华星光电技术有限公司 一种配向膜涂布方法及涂布机
CN111760749B (zh) * 2020-07-07 2022-01-04 业成科技（成都）有限公司 涂布头组件及涂布机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002140982A (ja) 2000-11-01 2002-05-17 Toray Ind Inc プラズマディスプレイ用発光基板の製造装置および製造方法
KR20040090149A (ko) * 2003-04-16 2004-10-22 엘지.필립스 엘시디 주식회사 패턴형성을 위한 비회선 방식의 포토레지스트 도포장치
JP4386430B2 (ja) * 2004-04-07 2009-12-16 東京エレクトロン株式会社 塗布膜形成装置
JP2006100722A (ja) * 2004-09-30 2006-04-13 Tokyo Electron Ltd 基板処理システム
JP3836119B2 (ja) * 2004-11-29 2006-10-18 東京応化工業株式会社 塗布装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082230A (ja) * 2009-10-05 2011-04-21 Dainippon Screen Mfg Co Ltd 基板塗布装置
CN116618247A (zh) * 2023-07-24 2023-08-22 江西煜明智慧光电股份有限公司 一种led灯具加工用点胶装置
CN116618247B (zh) * 2023-07-24 2023-09-29 江西煜明智慧光电股份有限公司 一种led灯具加工用点胶装置

Also Published As

Publication number Publication date
CN101281372A (zh) 2008-10-08
TWI326618B (en) 2010-07-01
TW200840652A (en) 2008-10-16
CN101281372B (zh) 2012-11-28
KR100803147B1 (ko) 2008-02-14

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