JP2008103615A - 電子部品搭載多層配線基板及びその製造方法 - Google Patents
電子部品搭載多層配線基板及びその製造方法 Download PDFInfo
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- JP2008103615A JP2008103615A JP2006286300A JP2006286300A JP2008103615A JP 2008103615 A JP2008103615 A JP 2008103615A JP 2006286300 A JP2006286300 A JP 2006286300A JP 2006286300 A JP2006286300 A JP 2006286300A JP 2008103615 A JP2008103615 A JP 2008103615A
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- electronic component
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- wiring board
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- multilayer wiring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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Abstract
【解決手段】電子部品(34)と、電子部品を収容する第1の開口部(16、26)を有するコア材層(10)と、該コア材層の一方の面に積層され且つ前記第1の開口部より大きい第2の開口部(20)を有する樹脂層(18)と、前記コア材層の他方の面に積層され且つ前記電子部品を支持する支持層(30)と、前記第1の開口部の周囲で且つ第2の開口部の内側の前記コア材層の前記一方の面上に配置された複数の接続用導体部(14b)と、前記電子部品と該接続用導体部との間を電気的に接続するボンディングワイヤ(38)と、前記電子部品及び前記ボンディングワイヤを封止するべく前記第1及び第2の開口部内に充填された封止樹脂(40)と、により構成されることを特徴とする。
【選択図】図7
Description
また、本発明によると、電子部品と、該電子部品を収容する第1の開口部を有するコア材層と、該コア材層の一方の面に積層され且つ前記第1の開口部より大きい第2の開口部を有する樹脂層と、前記コア材層の他方の面に積層され且つ前記電子部品を支持する支持層と、前記第1の開口部の周囲で且つ第2の開口部の内側の前記コア材層の前記一方の面上に配置された複数の接続用導体部と、前記電子部品と該接続用導体部との間を電気的に接続するボンディングワイヤと、前記電子部品及び前記ボンディングワイヤを封止するべく前記第1及び第2の開口部内に充填された封止樹脂と、により構成される電子部品搭載多層配線基板が提供される。
12 スルーホール
14、14a 配線パターン(接続用導体部)
16、20、24 開口部
18、22 絶縁樹脂層
26 ニッケル・金めっき
30 銅箔(支持層)
34 電子部品
36 ダイアタッチフィルム
38 ボンディングワイヤ
40 封止樹脂
42、44 絶縁樹脂層
46、48 レジスト
50、60、62 表面実装部品
Claims (17)
- 電子部品と、該電子部品が収容された第1の開口部を有するコア材層と、該コア材層の一方の面に積層され且つ前記第1の開口部より大きい第2の開口部を有する樹脂層と、前記第1の開口部の周囲で且つ第2の開口部の内側の前記コア材層の前記一方の面上に配置された複数の接続用導体部と、前記電子部品と該接続用導体部との間を電気的に接続するボンディングワイヤと、前記電子部品及び前記ボンディングワイヤを封止するべく前記第1及び第2の開口部内に充填された封止樹脂と、該封止樹脂上に形成された配線パターンと、により構成される電子部品搭載多層配線基板。
- 前記コア材層の他方の面に、前記第1の開口部と同じ大きさで且つ該第1の開口部と整合する第3の開口部を有する第2の樹脂層が積層配置され、前記電子部品は、第1及び第3の開口部にて形成される開口部内に収容されていることを特徴とする請求項1に記載の電子部品搭載多層配線基板。
- 前記ボンディングワイヤは前記電子部品と該接続用導体部との間でループ状に形成され、該ループの最上端は、前記第2の開口部に内部に位置することを特徴とする請求項1又は2に記載の電子部品搭載多層配線基板。
- 前記電子部品は、積み重ねられた2つの半導体チップからなり、上側の半導体チップはその上面に形成された電極端子と前記接続用導体部との間がボンディングワイヤにより電気的に接続され、下側の半導体チップはその下側に形成された接続端子により、前記封止樹脂層に形成された接続用パッドとの間で接続されることを特徴とする請求項1〜3のいずれか1項に記載の電子部品搭載多層配線基板。
- 電子部品と、該電子部品を収容する第1の開口部を有するコア材層と、該コア材層の一方の面に積層され且つ前記第1の開口部より大きい第2の開口部を有する樹脂層と、前記コア材層の他方の面に積層され且つ前記電子部品を支持する支持層と、前記第1の開口部の周囲で且つ第2の開口部の内側の前記コア材層の前記一方の面上に配置された複数の接続用導体部と、前記電子部品と該接続用導体部との間を電気的に接続するボンディングワイヤと、前記電子部品及び前記ボンディングワイヤを封止するべく前記第1及び第2の開口部内に充填された封止樹脂と、により構成される電子部品搭載多層配線基板。
- 前記コア材層と前記支持層との間には、前記第1の開口部と同じ大きさで且つ該第1の開口部と整合する第3の開口部を有する第2の樹脂層が積層配置され、前記電子部品は、第1及び第3の開口部にて形成される開口部内に収容されていることを特徴とする請求項5に記載の電子部品搭載多層配線基板。
- 前記ボンディングワイヤは前記電子部品と該接続用導体部との間でループ状に形成され、該ループの最上端は、前記第2の開口部に内部に位置することを特徴とする請求項5又は6に記載の電子部品搭載多層配線基板。
- 前記電子部品は接着フィルムを介して前記支持層に接合されていることを特徴とする請求項5〜7のいずれか1項に記載の電子部品搭載多層配線基板。
- 前記電子部品を支持する支持層は銅箔からなることを特徴とする請求項5〜8のいずれか1項に記載の電子部品搭載多層配線基板。
- 配線を形成すると共に第1の開口部を形成した板状のコア材を準備する工程と、
該コア材の一方の面に前記第1の開口部より大きい第2の開口部を有する樹脂層を積層し、前記第1の開口部の周囲で且つ該第2の開口部の内側の前記コア材の前記一方の面上に、前記配線の一部として形成された複数の接続用導体部を露出させる工程と、
前記コア材の他方の面に支持層を接着する工程と、
前記第1の開口部の内部で該支持層の面上に電子部品を搭載する工程と、
該電子部品と前記複数の接続用導体部との間をボンディングワイヤにより電気的に接続する工程と、
前記電子部品及び前記ボンディングワイヤを封止するべく前記第1及び第2の開口部の内部に樹脂を充填する工程と、を含む電子部品搭載多層配線基板の製造方法。 - 該コア材の一方の面に前記樹脂層を積層する際、該コア材の他方の面に、前記第1の開口部と同じ大きさの第3の開口部を有する第2の樹脂層を、該第3の開口部が前記第1の開口部と整合するように積層し、前記電子部品を前記支持層上に搭載する際、前記第1及び第3の開口部にて形成される開口部内に収容することを特徴とする請求項10に記載の電子部品搭載多層配線基板の製造方法。
- 該電子部品と前記複数の接続用導体部との間をボンディングワイヤにより電気的に接続する工程において、該ボンディングワイヤのループの最上端が前記第2の開口部の上面より下方に位置するように、接続することを特徴とする請求項11記載の電子部品搭載多層配線基板の製造方法。
- 前記第1の開口部の内部で該支持層の面上に電子部品を搭載する工程において、前記電子部品を接着フィルムを介して前記支持層に接合することを特徴とする請求項10〜12のいずれか1項に記載の電子部品搭載多層配線基板の製造方法。
- 前記電子部品を支持する支持層として銅箔を用いることを特徴とする請求項10〜13のいずれか1項に記載の電子部品搭載多層配線基板の製造方法。
- 前記電子部品を銅箔からなる支持層上に搭載し、前記第1及び第2の開口部の内部に樹脂を充填した後、該銅箔を除去し、該銅箔を除去した後、両面に絶縁樹脂層を形成することを特徴とする請求項14に記載の電子部品搭載多層配線基板の製造方法。
- 前記銅箔を除去するにあたって、電子部品を搭載した該銅箔の部分のみ該銅箔を残し、且つ両面に絶縁樹脂層を形成するにあたって、残された前記銅箔が部分的に露出されて放熱部を形成するように、前記絶縁樹脂層に開口部を形成することを特徴とする請求項15に記載の電子部品搭載多層配線基板の製造方法。
- 前記電子部品として、積み重ねられた2つの半導体チップを用い、上側の半導体チップはその上面に形成された電極端子と前記接続用導体部との間をボンディングワイヤにより電気的に接続し、下側の半導体チップはその下面に形成された接続端子を前記銅箔に接合し、その後、該銅箔をパターニングすることにより前記下側の半導体チップの接続端子に接続される配線パターンを形成することを特徴とする請求項14に記載の電子部品搭載多層配線基板の製造方法。
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US11/907,889 US7923367B2 (en) | 2006-10-20 | 2007-10-18 | Multilayer wiring substrate mounted with electronic component and method for manufacturing the same |
KR1020070105020A KR20080035974A (ko) | 2006-10-20 | 2007-10-18 | 전자 부품이 탑재된 다층 배선 기판 및 그 제조 방법 |
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JP2012209590A (ja) * | 2012-07-17 | 2012-10-25 | Shinko Electric Ind Co Ltd | 電子部品搭載多層配線基板及びその製造方法 |
JP2013021370A (ja) * | 2012-10-29 | 2013-01-31 | Dainippon Printing Co Ltd | 部品内蔵配線板 |
KR20170112409A (ko) * | 2016-03-31 | 2017-10-12 | 삼성전기주식회사 | 인쇄회로기판 및 이를 구비한 카메라 모듈 |
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JP2019178054A (ja) * | 2018-03-30 | 2019-10-17 | Tdk株式会社 | コア材及び放熱基板 |
JP2023025665A (ja) * | 2021-08-10 | 2023-02-22 | 珠海越亜半導体股▲分▼有限公司 | 混合型埋め込みパッケージ構造及びその作製方法 |
JP7324905B2 (ja) | 2021-08-10 | 2023-08-10 | 珠海越亜半導体股▲分▼有限公司 | 混合型埋め込みパッケージ構造及びその作製方法 |
Also Published As
Publication number | Publication date |
---|---|
US8222747B2 (en) | 2012-07-17 |
CN101166394A (zh) | 2008-04-23 |
US7923367B2 (en) | 2011-04-12 |
JP5100081B2 (ja) | 2012-12-19 |
TW200822833A (en) | 2008-05-16 |
KR20080035974A (ko) | 2008-04-24 |
EP1915038A1 (en) | 2008-04-23 |
US20110140286A1 (en) | 2011-06-16 |
US20080099911A1 (en) | 2008-05-01 |
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