JP2008186914A - Linear light source device and back light device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a linear light source device eliminating the need for a metallic wiring board, having excellent light-extracting efficiency and reliability, and allowing miniaturiation and cost reduction. <P>SOLUTION: Electrode pads for mounting LED elements and a through wiring layer are formed on a sub-mount board mounting the LED elements having different luminous wavelengths. The sub-mount board is loaded along the longitudinal direction on a long-sized metal, and the LED elements having the same wavelength can be connected in series electrically by using bonding wires via through wirings on the adjacent sub-mount board. Accordingly, a compact, inexpensive linear light source device can be produced without using the metallic wiring board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a linear light source device using a light emitting diode (hereinafter referred to as an LED) that can be used as a backlight of a liquid crystal display such as a personal computer, and a backlight device including the linear light source device.

  Thin and lightweight liquid crystal displays are rapidly spreading due to lower prices and improved image quality due to progress in manufacturing technology, and are widely used as display devices for various electronic devices.

  In general, a low-output type LED element is used as a light source of a backlight for a small liquid crystal display used in a mobile phone, a portable information terminal, or the like. On the other hand, since a light source having a high light output is required for a backlight for a medium-sized or larger liquid crystal display such as a personal computer or a television, a cold cathode tube is used.

  However, in recent years, with the practical use of high-power LED elements that can supply a large electric power of about 1 W per element, it has become possible to apply LEDs as a light source for backlights for medium-sized and larger liquid crystal displays. Development for commercialization has been activated.

  In general, backlights for medium-sized liquid crystal displays often use an edge light system in which a linear light source such as a cold cathode fluorescent lamp (fluorescent lamp) is placed opposite to the side surface of a rectangular light guide plate made of a material that transmits light. It has been. White light emitted from the cold-cathode tube is made incident from the side surface of the light guide plate, and is extracted into a planar shape while being repeatedly reflected inside the light guide plate. In addition, an LED can be used instead of a cold-cathode tube as a light source for the backlight. In this case, the color reproduction range of the liquid crystal display can be expanded and mercury-free operation can be realized. Is possible.

  In order to expand the color reproduction range by using the LED as a light source for the backlight in this way, the method of using white, which is a combination of red, green, and blue LED elements and mixing them is the most effective. .

  FIG. 1 shows a schematic diagram of a backlight using a conventional LED light source. Since the LED element is a point light source, in the edge light type backlight device using the LED light source, a linear light source in which the LED elements are arranged on a long wiring board is disposed opposite to the end face of the light guide plate 1. Yes. As such a linear light source device, for example, a linear light source device using an LED package 2 as shown in FIG. 2 is known. The LED package 2 has a structure in which an LED element is mounted on a substrate having a concave portion and is packaged with a translucent member having a lens shape and a resin (for example, see Patent Document 1). And the linear light source device is implement | achieved by mounting the LED package 2 along the longitudinal direction of a elongate wiring board. At this time, the lead frame 3 of the LED package 2 and the wiring layer 5 of the wiring substrate 4 are electrically connected by bonding using solder or the like. However, when the LED package 2 is used, a long color mixing distance is required from the light emitting surface of the LED element to the light guide plate entrance surface in order to reduce luminance unevenness and color unevenness of white light on the light guide plate entrance surface. There arises a problem that the thickness and frame of the frame become wide.

  Therefore, in order to reduce the size of the linear light source device, a linear light source device including a submount substrate 7 on which an LED element is mounted and a long translucent member 13 as shown in FIG. 3 is used. (For example, refer to Patent Document 2). In this linear light source device, red, blue, and green LED elements are mounted on a submount substrate 7, and the submount substrate 7 is connected to a wiring substrate 4 (not shown in FIG. 3). After connecting each terminal of the submount substrate 7 and the wiring substrate 4 with the bonding wire 11, a long translucent member 13 provided with a space for housing the LED element and sealing the resin is mounted on the wiring substrate 4. The LED element housing portion is resin-sealed, and a light diffusing sheet is disposed on the exit surface of the long translucent member 13. The base member 6 of the wiring board 4 is made of a metal having high thermal conductivity such as copper or aluminum in order to effectively dissipate heat generated from the LED elements. In addition, a reflector (not shown) may be formed between the submount substrates 7 in the long translucent member 13 in order to efficiently extract the light from the LED elements to the outside.

  Here, a high-power type LED element is usually a large element having a size of about 1 mm square, but when a metal is used as the base member 6 of the long wiring board, the LED generated due to a difference in linear expansion coefficient In order to relieve stress on the element, it is desirable to connect between the wiring board 4 and the LED element via a submount substrate 7. In order to reduce variation in optical characteristics of the LED elements mounted on the long wiring board, the LED elements are mounted on the submount board 7 and then mounted on the wiring board after selection by lighting inspection. desirable. Therefore, about 3 to 5 LED elements are usually mounted on one submount substrate 7.

  Edge light-type backlight for liquid crystal displays by making white light emitted from the upper surface of such a linear light source device incident from the end face of the light guide plate and diffusing the white light into a planar shape in the light guide plate It can function as a device.

JP 2006-13198 A JP 2006-269079 A

  Recently, linear light source devices using LED elements are required to be small and low in cost. Further, in order to realize a linear light source device having a wide color reproduction range as described above and a high luminance, red, blue, and green high output type LED elements are mounted on the submount substrate 7 and long. A structure mounted on a long metal wiring board is desirable.

  However, when a linear light source device is realized using a metal wiring substrate, the cost of the linear light source device increases because the wiring substrate is expensive. Therefore, when a wiring board is used, there is a problem that recent needs cannot be met.

  Therefore, in the linear light source device using the submount substrate 7 on which a plurality of LED elements having different wavelengths are mounted, the electrical connection to the LED element can be realized only by the bonding wire 11 and the wiring on the submount substrate 7. A metal wiring board can be dispensed with, and a low-cost linear light source device can be realized. In this case, it is necessary to adjust the light emission amount of each element by connecting red, blue, and green LED elements in series for each color and controlling the current respectively.

  However, when the wiring on the submount substrate 7 is directly connected by the bonding wires 11, there is a problem that the bonding wires intersect with each other and the reliability of the linear light source device is lowered.

  Further, when adopting the configuration as shown in FIG. 3, unlike the configuration using the wiring board, the bonding wire becomes an obstacle, and it becomes impossible to secure a sufficient space for forming the reflector in the translucent member. There may be a reduction in efficiency.

  Furthermore, when the configuration as shown in FIG. 3 is adopted, resin sealing for each submount substrate cannot be performed, and thus it is necessary to perform resin sealing along a plurality of submount substrates mounted in a long shape. When encapsulating the sealing resin in a long shape, there is a problem that the reliability of the linear light source device is lowered because the resin peels from the adhesive surface due to the expansion and contraction of the sealing resin in the longitudinal direction.

  The present invention has been made in view of such a situation, and provides a low-cost linear light source device that does not require a metal wiring board. In addition to this, the present invention also provides a linear light source device excellent in light extraction efficiency and reliability.

  In order to solve the above problems, in the linear light source device according to the present invention, a plurality of submount substrates on which LED elements are mounted are mounted on a long substrate, and through wiring is formed on each of the submount substrates. Yes. Here, the long shape means that the outer shape is not a square but an elongated rectangle.

  That is, the linear light source device according to the present invention includes a plurality of submount substrates each mounted with a plurality of LED elements, a long substrate for mounting the plurality of submount substrates in series, and a translucent member. Each of the submount substrates has an electrode pad for mounting the LED element and a through wiring, and the LED device mounting formed on the through wiring and another adjacent submount substrate. The electrode pads are electrically connected by bonding wires.

  LED elements having different emission wavelengths are mounted on the plurality of submount substrates, respectively. The plurality of submount substrates are mounted along the longitudinal direction on the long substrate, and the LED elements having the same emission wavelength are connected to the bonding wires and the through wiring formed on the adjacent submount substrate. And electrically connected in series. Here, the plurality of LED elements include a red LED element, a green LED element, and a blue LED element, and the ratio of the number of red LED elements, green LED elements, and blue LED elements is 1: 2: 1. Is desirable.

  In the linear light source device of the present invention, the first type submount substrate on which the red LED element and the green LED element are mounted, and the second type on which the blue LED element and the green LED element are mounted. Submount substrates are alternately mounted along the longitudinal direction on a long substrate. Each of the plurality of submount substrates has two through wirings. In the first type of submount substrate, the first through wiring is provided at the upper end portion of the submount substrate, and the second through wiring is relative to the central axis of the plurality of submount substrates mounted in the longitudinal direction of the long substrate. Is shifted downward. In the second type submount substrate, the first through wiring is provided at the lower end of the submount substrate, and the second through wiring is shifted upward with respect to the central axis of the submount substrate. Further, in the first and second types of submount substrates, a sufficient space for the LED element to be disposed is formed between the first through wiring and the second through wiring.

  Further, the long substrate includes a mounting surface of the submount substrate, and an inclined surface that is formed at a position above the mounting surface along the longitudinal direction and reflects light from the LED element.

  Further, the long substrate has a peeling preventing means for preventing the resin sealing portion from peeling due to a stress generated by a difference in expansion coefficient between the long substrate and the resin sealing portion. This peeling prevention means is a pillar formed between a plurality of mounted submount substrates.

  The long substrate is made of a metal plate, and each of the plurality of submount substrates is made of aluminum nitride or silicon.

  In the present invention, a backlight device is also provided. The backlight device is an edge light system, and includes any one of the linear light source devices described above and a rectangular light guide plate, and the light emission surface of the linear light source device faces the end surface of the light guide plate. It is characterized by being arranged.

  Further features of the present invention will become apparent from the best mode for carrying out the present invention and the accompanying drawings.

  ADVANTAGE OF THE INVENTION According to this invention, the low-cost linear light source device which does not require a metal wiring board can be provided. Moreover, according to this invention, the linear light source device excellent in light extraction efficiency and reliability can also be provided. Furthermore, according to this invention, the backlight apparatus provided with such a linear light source device can also be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be noted that the embodiments are merely examples for realizing the present invention and do not limit the present invention. In each drawing, the same reference numerals are assigned to common components.

<First Embodiment>
FIG. 4 is a diagram showing a schematic configuration of the linear light source device 100 according to the first embodiment of the present invention.
The linear light source device 100 includes an LED element 10, a submount substrate 7, a bonding wire 11, a long translucent member 17, a long metal plate (long substrate) 15, and translucency. And a sealing resin (transparent resin) 12 filled in a space formed between the member 17 and the metal plate 15. In the present embodiment, a high output type LED element 10 having a size of about 1 mm square and a 3-5 mm square submount substrate 7 on which about four LED elements 10 can be mounted on one are used. ing. In addition, after mounting the LED element 10 on the submount substrate 7, a lighting inspection is performed to suppress variation in optical characteristics of the LED elements mounted on the long metal plate 15. The submount substrate 7 is used to relieve the stress applied to the LED element 10 due to the difference in linear expansion coefficient between the metal plate 15 and the LED element 10.

  The linear light source device 100 having the above-described configuration is manufactured by the following procedure. That is, first, an LED element 10 is mounted on an electrode pad (not shown) for mounting an LED element formed on the submount substrate 7 using solder or conductive paste, and the submount substrate 7 is elongated. Along the longitudinal direction on the metal substrate 15, bonding is performed using a conductive paste (for example, silver paste) having excellent heat dissipation. In consideration of adhesiveness with the conductive paste, the conductive paste spreads in a circular shape when pressed by the submount substrate. Therefore, the submount substrate 7 preferably has a square shape. Subsequently, after the LED element 10 and each electrode terminal on the submount substrate 7 are electrically connected using the bonding wire 11, the translucent member 17 is disposed on the long metal plate 15. Then, the space between the metal plate 15 on which the LED element 10 is disposed and the translucent member 17 is sealed with the sealing resin 12. The linear light source device 100 is manufactured through the above steps.

  FIG. 5 is a plan view of the region indicated by A in FIG. FIG. 6 is a cross-sectional view taken along the line B-B ′ of FIG. 5. In the first embodiment, in order to obtain white light by mixing three colors of red, blue, and green, the ratio of the number of LED elements used is red: blue: green = 1: 1: 2. . This is the ratio with the best output balance of the three colors, but is not limited to this ratio.

  As shown in FIG. 5, a total of four LED elements, two red LED elements 18 and two green LED elements 19, are mounted on the submount substrate 7 in a grid pattern, and further, the blue LED elements 20 are A total of four LED elements including two green LED elements 19 and two green LED elements 19 are mounted on a grid on another submount substrate 7. The two types of submount substrates 7 thus formed are mounted as a unit along the long side direction on the long metal plate 15. Here, the number of LED elements mounted on one submount substrate 7 is four, but the present invention is not limited to this. In addition, when the shape of the submount substrate 7 is square as described above, the number of LED elements is preferably four.

  Here, in order to control white light obtained by mixing three colors, it is necessary to adjust the light emission amounts of the red, blue, and green LED elements by current control. Therefore, although it is necessary to electrically connect each LED element of each color in series, in the present embodiment, on the submount substrate 7 of the adjacent unit via the through wiring layer 22 on the adjacent submount substrate 7. A bonding wire 11 is used to connect the electrode pad mounted with the LED element having the same wavelength. Thereby, the LED elements of the respective colors can be connected in series. As described above, since the LED elements of the respective colors are directly connected using the through wiring 22, for example, when the green LED elements 19 are connected in series, the submount in which the green LED elements 19 are not mounted by the wire bonding 11. There is no need to straddle the substrate 7. Therefore, there is no risk that the wire bondings 11 cross each other, and the reliability of the linear light source device can be improved.

  As shown in FIG. 5, for example, two through wirings 22 are formed on each submount substrate 7. Between each through wiring 22, the space which can mount an LED element at least is provided. When the LED element, the through wiring, the LED element, and the through wiring are arranged in this order on one submount substrate 7, the adjacent submount substrate 7 includes the through wiring, the LED element, the through wiring, and the LED element. They are arranged in order. As a result, as shown in FIG. 6, there are two LED elements, through wiring, and two LED elements from the left in one row (BB ′ line) on a plurality of (four in FIG. 6) submount substrates. -Each will be arranged in the order of the through wiring. However, the position of the through wiring 22 is not limited to that shown in FIG. 5, and it is sufficient that the LED elements having the same wavelength can be connected in series. Therefore, for example, one through wiring 22 is formed only at the end portion of each submount substrate 7, and the green LED 19 is disposed substantially at the center of the submount substrate 7. In this case, the green LED elements 19 are connected in series between the submount substrates 7 without the through wires 22, and only the red LED elements 18 and the blue LED elements 20 are connected in series via the through wires 22. (See FIG. 7).

  In this embodiment, in order to effectively dissipate heat generated when the LED element 10 is driven, aluminum nitride, which is an electrically insulating material having high thermal conductivity, is used as the submount substrate 7. A wiring layer made of a metal such as copper or gold is patterned by photolithography on one surface of the submount substrate 7 using aluminum nitride by plating or vapor deposition. Here, a substrate having a high thermal conductivity such as silicon can be used as the submount substrate 7. When a conductive base material such as silicon is used, it is used as the submount substrate 7 by separately providing an insulating layer such as a thermal oxide film or a silicon nitride film between the wiring layer and the base material. .

  Thus, by using the through wiring 22 formed on the submount substrate, the LED elements 18 to 20 having different wavelengths can be electrically connected in series without the bonding wires 11 crossing each other. Therefore, the reliability of the linear light source device is improved.

  Further, it is desirable to use a metal such as copper or aluminum for the long metal plate 15 in order to effectively dissipate heat generated from the LED element 10. In the first embodiment, aluminum is used. Furthermore, the inclined surface 16 is formed in the metal plate 15 along the longitudinal direction. Thereby, the light generated from the LED element 10 can be reflected on the light emitting surface of the linear light source device 100, and the light extraction efficiency of the linear light source device 100 can be increased.

  Further, in the first embodiment, acrylic having excellent light transmittance and workability is used as the translucent member 17, and silicon resin having excellent heat resistance and chemical stability is used as the transparent resin 12.

  According to the first embodiment having the structure as described above, the linear light source device 100 that is excellent in reliability and light extraction efficiency, is small and low cost can be realized without using a metal wiring board.

  In addition, the present invention realizes a compact and low-cost backlight device that is excellent in reliability and light extraction efficiency by disposing the linear light source device 100 according to the first embodiment on the end face of the light guide plate 1. (See FIG. 1).

<Second Embodiment>
As described in the first embodiment, since the submount substrates 7 are directly connected by the bonding wires 11 in the present invention, it is necessary to seal the resin in a long shape. In this case, since the resin sealing space is also long, stress is applied in the longitudinal direction of the sealing resin 12 due to the difference in thermal expansion coefficient between the sealing resin (transparent resin) 12 and the metal plate 15. Therefore, the sealing resin 12 peels off on the bonding surface of the metal plate 15 due to the expansion and contraction of the sealing resin 12 in the longitudinal direction. In particular, the present invention requires a countermeasure against stress as compared with the conventional configuration of FIG. 3 because the sealing space is large. Therefore, in order to prevent such peeling, in the second embodiment, a support 24 for preventing peeling is formed on the long metal plate 15.

  FIG. 8 is a schematic diagram of a linear light source device 200 according to the second embodiment of the present invention. 8, the same reference numerals are used for the same components as those in FIG. As shown in FIG. 8, the linear light source device 200 according to the second embodiment includes a plurality of columns 24 between the submount substrates 7 mounted along the longitudinal direction on the long metal plate 15. Yes. The column 24 is formed by forming an insertion hole (not shown) on the metal plate 15 and inserting a cylindrical metal rod into the insertion hole. As a result, the stress generated by the difference in thermal expansion coefficient between the metal plate 15 and the sealing resin 12 is absorbed by the pillars 24 formed between the submount substrates 7. That is, the column 24 is pressed from each direction by the generated stress, but the stresses in the opposite directions are canceled out, thereby absorbing the stress. The action of the pillars 24 can prevent the sealing resin 12 from peeling from the metal plate 15 (particularly in the region where the submount substrate is mounted). Although there is a possibility that the post (pin) 24 is subjected to the stress described above and peels off at that portion, as described above, peeling in the region where the submount substrate is mounted can be avoided at least. large. In addition, since the structure and formation method of the other linear light source device 200 are the same as those in the first embodiment, description thereof is omitted.

  According to the second embodiment having the above-described structure, the linear light source device 200 having excellent reliability, small size, and low cost can be realized without using a metal wiring board.

  In addition, the present invention realizes a compact and low-cost backlight device that is excellent in reliability and light extraction efficiency by disposing the linear light source device 200 according to the second embodiment opposite to the end face of the light guide plate 1. (See FIG. 1).

<Summary>
According to the embodiment of the present invention, the through wire 22 formed on the submount substrate 7 and the electrode pad of the LED element 10 mounted on the adjacent submount substrate are electrically connected using the bonding wire 11. It becomes possible to do. As a result, since the LED elements can be electrically connected in series only with the wiring formed on the submount substrate, a small and low-cost linear light source device that does not require a wiring substrate can be realized.

  Further, since the red, blue, and green LED elements 18, 19, and 20 can be connected in series for each color, white light obtained by mixing three colors is adjusted by controlling the current value of each color. be able to. In order to efficiently adjust white light in consideration of the output balance of the three colors, the ratio of the number of red, green and blue LED elements is preferably 1: 2: 1. As a result, it is possible to realize a linear light source device for a backlight that can eliminate the need for a wiring board and can expand the color reproduction range of a liquid crystal display. In other words, when a cold cathode tube (fluorescent lamp) is used as the linear light source, light with an extra wavelength is incident on the color filter of the liquid crystal, but if an RGB LED element is used, there is no noise light. Improve (can output a color close to the actual color).

  Furthermore, since the through wirings formed on the submount substrate are alternately offset with respect to the central axis along the longitudinal direction of the submount substrate, wiring connection can be performed without crossing bonding wires. it can. Thereby, a highly reliable linear light source device can be realized.

  In addition, since the inclined surface formed along the long side direction of the long substrate functions as a reflector that reflects the emitted light from the LED element, the light extraction efficiency of the linear light source device can be improved. . As a result, a high-brightness linear light source device can be realized.

  According to the second embodiment, since the pillar is formed on the long substrate (metal plate 15), it is generated due to the difference in thermal expansion coefficient between the sealing resin 12 and the long substrate (metal plate 15). It is possible to prevent peeling at the bonding surface between the sealing resin 12 and the long substrate due to stress. Thereby, a highly reliable linear light source device can be realized.

  In each embodiment, since the long substrate is formed of a metal plate having high thermal conductivity such as copper or aluminum, heat generated from the LED element can be effectively dissipated to the outside. Thereby, when a high output type LED element is used, the linear light source device excellent in cooling performance is realizable.

  Moreover, since the submount substrate 7 is formed using aluminum nitride or silicon having high thermal conductivity, heat generated from the LED element can be effectively dissipated. Thereby, when a high output type LED element is used, the linear light source device excellent in cooling performance is realizable. Further, when such a submount substrate 7 is used, there is an advantage that an insulating layer that normally has to be provided on a long substrate (metal substrate 15) becomes unnecessary.

  Furthermore, according to each embodiment, the backlight apparatus provided with the linear light source device of the structure which mounted the LED element on the submount board | substrate is realizable. Therefore, since a metal wiring board can be dispensed with in the linear light source device, a small and low-cost edge light type backlight device can be provided.

It is a schematic block diagram of the edge light type backlight using the conventional LED. It is sectional drawing of the linear light source device using the conventional LED package. It is sectional drawing of the linear light source device using the conventional submount board | substrate. 1 is a schematic configuration diagram of a linear light source device according to a first embodiment of the present invention. It is a top view of the area | region A of FIG. 2, and is a figure which shows the mounting state of an LED element. FIG. 4 is a cross-sectional view taken along B-B ′ of FIG. 3. It is a top view of the area | region A of FIG. 2, and is a figure which shows the mounting state of the LED element different from FIG. It is a schematic block diagram of the linear light source device by the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light guide plate 2 LED package 3 LED package lead frame 4 Wiring board 5 Wiring board wiring layer 6 Wiring board base member 7 Submount board 8 LED element mounting electrode pad 9 Submount board base member 10 LED element 11 Bonding wire 12 Sealing resin 13 Translucent member 14 Light diffusion sheet 15 Metal plate 16 Inclined surface of metal plate (reflector function)
17 Translucent member 18 Red LED element 19 Green LED element 20 Blue LED element 21 LED element mounting electrode pad 22 Through wiring 23 Conductive paste 24 Column (pin)
100, 200 linear light source device

Claims (11)

A plurality of submount substrates each mounted with a plurality of LED elements, a long substrate for mounting the plurality of submount substrates in series, a translucent member, and a resin sealing portion,
Each of the submount substrates has an electrode pad for mounting an LED element and a through wiring,
A linear light source device, wherein the through wiring and an electrode pad for mounting an LED element formed on an adjacent submount substrate are electrically connected by a bonding wire. Each of the plurality of submount substrates is mounted with LED elements having different emission wavelengths,
The plurality of submount substrates are mounted along a longitudinal direction on the long substrate,
The LED elements having the same emission wavelength are electrically connected in series using the bonding wire and the through wiring formed on an adjacent submount substrate. Linear light source device. The plurality of LED elements include a red LED element, a green LED element, and a blue LED element,
The linear light source device according to claim 2, wherein a ratio of the number of the red LED elements, the green LED elements, and the blue LED elements is 1: 2: 1.   The first type submount substrate on which the red LED element and the green LED element are mounted and the second type submount substrate on which the blue LED element and the green LED element are mounted are alternately arranged. The linear light source device according to claim 3, wherein the linear light source device is mounted along a longitudinal direction on the long substrate. Each of the plurality of submount substrates has two through wires,
In the first type submount substrate, the first through wiring is provided at the upper end of the submount substrate, and the second through wiring is the center of the plurality of submount substrates mounted in the longitudinal direction of the long substrate. Shifted downward relative to the axis,
In the second type submount substrate, the first through wiring is provided at the lower end of the submount substrate, and the second through wiring is shifted upward with respect to the central axis,
In the first and second type submount substrates, a sufficient space is formed between the first through wiring and the second through wiring for the LED element to be disposed. The linear light source device according to claim 4.   The elongate substrate includes a mounting surface of the submount substrate, and an inclined surface that is formed at a position above the mounting surface along the longitudinal direction and reflects light from the LED element. The linear light source device according to claim 1, wherein:   The long substrate has peeling prevention means for preventing peeling of the resin sealing portion due to a stress caused by a difference in expansion coefficient between the long substrate and the resin sealing portion. The linear light source device according to claim 1.   The linear light source device according to claim 7, wherein the peeling prevention unit is a column formed between the plurality of mounted submount substrates.   The linear light source device according to claim 1, wherein the long substrate is made of a metal plate.   2. The linear light source device according to claim 1, wherein each of the plurality of submount substrates is made of aluminum nitride or silicon. The linear light source device according to any one of claims 1 to 10,
A rectangular light guide plate,
An edge-light type backlight device, wherein a light emission surface of the linear light source device is disposed to face an end surface of the light guide plate.

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