JP2008140835A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability of connections among coils, in an electronic component having vias. <P>SOLUTION: The electronic component has an element assembly 14; coils 18, 20, 22, 24, 26 and 28 formed in the element assembly 14 and the vias 17, 21 and 25 formed in the element assembly 14, while one ends are connected on the outer peripheral sections of the coils 18, 20, 22, 24, 26 and 28; and the electronic component, further, has vias 19, 23 and 27 formed in the element assembly 14, while one ends are connected on the inner peripheral sections of the coils 18, 20, 22, 24, 26 and 28 and terminals 15 and 16 electrically connected to the coils 18, 20, 22, 24, 26 and 28. The diameters of the vias 17, 21 and 25 are constituted to be larger than those of the vias 19, 23 and 27. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component such as a coil component used in various electronic devices.

  Conventionally, as shown in FIG. 2, this type of electronic component is formed in a sheet-like element body 1 with spiral coils 2, 3, 4, 5, 6, and 7 having substantially the same shape. Vias 8, 9, 10, 11, 12, and 13 were alternately stacked.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 9-270355

  In such a conventional electronic component, there is a problem that the connection reliability between the coils 3 and 4 and between the coils 5 and 6 is low.

  That is, in the above-described conventional configuration, the diameters of the vias 8, 9, 10, 11, 12, and 13 are formed as small as possible in response to a request for improving the L value of the electronic component. In such a configuration, the vias 9, 11, 13 are connected to the inner periphery of the coils 2, 3, 4, 5, 6, 7. By being protected by 2, 3, 4, 5, 6, 7, the possibility of causing disconnection or the like is low. However, with respect to the vias 8, 10, 12 connected to the outer peripheral portions of the coils 2, 3, 4, 5, 6, 7, the coils 2, 3, 4, Since it is not protected by 5, 6, and 7, there is a possibility that the vias 8, 10, and 12 may be disconnected. As a result, the connection reliability between the coils 3 and 4 and between the coils 5 and 6 is improved. Was a problem.

  Accordingly, an object of the present invention is to improve connection reliability between coils in an electronic component having a via.

  In order to achieve this object, in the present invention, the diameter of the first via having one end connected to the outer peripheral portion of the first coil is formed, and the one end is formed on the inner peripheral portion of the first coil. The diameter is larger than the diameter of the second via.

  With this configuration, it is possible to reduce the possibility of disconnection of the first via that is not protected by the coil from mechanical shock applied to the element body from the outside, so that the connection reliability between the coils is improved. Can be made.

(Embodiment 1)
Hereinafter, the electronic component according to Embodiment 1 of the present invention will be described with reference to the drawings.

  In FIG. 1, a sheet-like element body 14 made of a resin has a laminated structure of element element layers 14A, 14B, 14C, 14D, 14E, 14F, 14G, 14H, 14I, 14J, 14K, 14L, 14M, and 14N. The terminals 15 and 16 are formed on the side surfaces of the element body 14 facing each other.

  An extraction electrode 15A electrically connected to the terminal 15 is formed in the element layer 14B, and a via (first via) electrically connected to the extraction electrode 15A is formed on the upper layer of the element layer 14B. ) 17 is laminated.

  Over the element layer 14C, an element layer 14D having a spiral coil 18 electrically connected to the outer periphery of the via 17 is formed. In the element layer 14D, An element layer 14 </ b> E having a via 19 electrically connected to the inner peripheral portion of the coil 18 is laminated.

  An element layer 14F having a spiral coil 20 whose inner periphery is electrically connected to a via (second via) 19 is formed above the element layer 14E. On the upper layer of the layer 14F, an element layer 14G having a via (first via) 21 electrically connected to the outer peripheral portion of the coil 20 is laminated.

  An element layer 14H having a spiral coil 22 whose outer peripheral portion is electrically connected to the via 21 is formed on the upper layer of the element layer 14G. An element body layer 14 </ b> I having a via (second via) 23 electrically connected to the inner peripheral portion of the coil 22 is laminated.

  An element layer 14J having a spiral coil 24 whose inner periphery is electrically connected to the via 23 is formed on the element layer 14I. The element layer 14 </ b> K having vias (first vias) 25 electrically connected to the outer periphery of the coil 24 is laminated.

  An element layer 14L having a spiral coil 26 whose outer periphery is electrically connected to the via 25 is formed above the element layer 14K. An element layer 14M having a via 27 electrically connected to the inner periphery of the coil 26 is laminated.

  An element layer 14N having a spiral coil 28 whose inner periphery is electrically connected to a via (second via) 27 is formed above the element layer 14M. The outer peripheral portion of the coil 28 is electrically connected to the terminal 16 to constitute an inductance component.

  Here, the via 17 electrically connected to the outer peripheral side of the coil 18, the via 21 electrically connected to the outer peripheral side of the coils 20 and 22, and the outer peripheral side of the coils 24 and 26 are electrically connected. The diameter of the via 25 is electrically connected to the inner peripheral side of the coils 18, 20, the via 19 is electrically connected to the inner peripheral side of the coils 22, 24, and the coils 26, 28. The diameter is larger than the diameter of the via 27 electrically connected to the inner peripheral side.

  With this configuration, it is possible to improve connection reliability between the coils 20 and 22 and between the coils 24 and 26 while securing a high L value. The reason will be described below.

  First, the L value is proportional to the magnetic flux passing through the inner circumference of the coils 18, 20, 22, 24, 26, 28. Therefore, the via 19 that is electrically connected to the inner peripheral side of the coils 18 and 20, the via 23 that is electrically connected to the inner peripheral side of the coils 22 and 24, and the electric power to the inner peripheral side of the coils 26 and 28. If the diameter of the vias 27 connected to each other is increased, the flow of magnetic flux passing through the inner circumference of the coils 18, 20, 22, 24, 26, 28 may be obstructed, and as a result, the L value is lowered. There is a possibility that. However, the via 17 electrically connected to the outer peripheral side of the coil 18, the via 21 electrically connected to the outer peripheral side of the coils 20 and 22, and the outer peripheral side of the coils 24 and 26 are electrically connected. It is considered that the diameter of the via 25 does not greatly affect the amount of magnetic flux passing through the inner periphery of the coils 18, 20, 22, 24, 26, and 28. Therefore, even if the diameters of the vias 17, 21, 25 are made larger than the diameters of the vias 19, 23, 27, a high L value can be secured.

  When a mechanical impact is applied to the element body 14 from the outside, the impact is transmitted to each via 17, 19, 21, 23, 25, 27 via the element body 14, Via 19 electrically connected to the inner peripheral side of the coils 18, 20, Via 23 electrically connected to the inner peripheral side of the coils 22, 24, and electrically to the inner peripheral side of the coils 26, 28 Since the connected via 27 is protected from this impact by the coils 18, 20, 24, 26, there is no major problem even if the via diameter is made thin in consideration of the L value. A via 17 electrically connected to the outer peripheral side of 18, a via 21 electrically connected to the outer peripheral side of the coils 20 and 22, and a via 25 electrically connected to the outer peripheral side of the coils 24 and 26. For coils 18, 20, 24 Although 26 protection is not due, by configuring thicker the diameter, it is possible to reduce the possibility of breakage.

  In addition, the via 19 electrically connected to the inner peripheral side of the coils 18 and 20, the via 23 electrically connected to the inner peripheral side of the coils 22 and 24, and the electric power to the inner peripheral side of the coils 26 and 28. It is desirable that the diameter of the via 27 connected in general is equal to or smaller than the line width of the coils 18, 20, 22, 24, 26, and 28. The reason will be described below.

  In the manufacturing process, there are always manufacturing variations. Therefore, between the coil 18 and the via 19, between the coil 20 and the via 19, between the coil 22 and the via 23, between the coil 24 and the via 23, between the coil 26 and the via 27, and between the coil 28 and the via 27, Deviation may occur. Then, there is a possibility that via 19, via 23, and via 27 are arranged and connected to the inner peripheral side of coils 18, 20, 22, 24, 26, and 28 rather than assumed. If it does so, it will result in reducing L value for the above-mentioned reason, but the inner periphery side of via | veer 19, coil 22 and 24 electrically connected to the inner periphery side of coils 18 and 20 The diameter of the vias 23 electrically connected to the inner peripheral side of the vias 23 and the coils 26 and 28 is equal to or smaller than the line width of the coils 18, 20, 22, 24, 26 and 28. As a result, the difference between the line width of the coils 18, 20, 22, 24, 26, and 28 and the diameter of the vias 19, 23, and 27 can be set as an allowable range for the displacement of the connection position. That is, the decrease can be suppressed.

  Although the present embodiment has been described using an inductance component, it is also useful for other electronic components such as an LC composite component in which a capacitor or the like is provided in the element body 14.

  The electronic component according to the present invention has a feature that the connection reliability between coils can be improved, and is useful in various electric devices such as a mobile phone.

1 is an exploded perspective view of an electronic component according to Embodiment 1 of the present invention. An exploded perspective view of a conventional electronic component

Explanation of symbols

14 Element 15, 16 Terminal 17, 21, 25 Via (first via)
18, 20, 22, 24, 26, 28 Coil 19, 23, 27 Via (second via)

Claims (2)

With the body,
A first coil formed in the element;
A first via formed in the element body and having one end connected to the outer periphery of the first coil;
A second via formed in the element body and having one end connected to the inner periphery of the first coil;
A terminal electrically connected to the first coil;
An electronic component in which the diameter of the first via is larger than the diameter of the second via. The diameter of the second via is
The electronic component according to claim 1, wherein the electronic component is equal to or smaller than a line width of the coil.

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