JP2008041973A - Low-profile inductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make an inductor smaller in profile, as compared with an inductor having a structure with a wire material sandwiched by two plate-shaped core members. <P>SOLUTION: A low-profile inductor 1A comprises a plate-shaped core member 10 made by forming a magnetic material into a plate shape, conductors 11, 12 disposed on at least one surface in a pair of plate surfaces of the plate-shaped core member 10, and a magnetic resin layer 13 formed on the surface of the plate-shaped core member 10, on which the conductors 11, 12 are placed and yielded by curing magnetic powder containing resin 16. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a low-profile inductor.

  Patent Document 1 discloses a thin inductor in which a wire is sandwiched between a pair of cores.

Japanese Patent Laid-Open No. 2002-43139 (abstract, claims, detailed description of the invention, FIG. 1, FIG. 4, FIG. 10, etc.)

  The thin inductor disclosed in Patent Document 1 forms a closed magnetic circuit by overlapping a pair of cores formed in a plate shape. The core formed in a plate shape needs to have a thickness in order to ensure the strength of the single core, for example. The thickness of the thin inductor disclosed in Patent Document 1 is equal to or more than two cores formed in a plate shape. Further, the thin inductor disclosed in Patent Document 1 cannot be formed to have a thickness equal to or less than two cores.

  An object of the present invention is to obtain a low-profile inductor that can achieve a lower profile than an inductor having a structure in which a wire is sandwiched between two plate-shaped core members.

  A low profile inductor according to the present invention includes a plate-shaped core member formed by forming a magnetic material into a plate shape, and a conductor placed on at least one surface of a pair of plate surfaces of the plate-shaped core member, And a magnetic resin layer formed on the surface of the plate-like core member on which the conductor is placed and formed by curing a resin containing magnetic powder.

  If this configuration is adopted, the conductor is sandwiched between the magnetic resin layer obtained by curing the resin containing the magnetic powder and the plate-like core member. The magnetic resin layer and the plate-like core member form a closed magnetic structure around the conductor. Moreover, only one plate-like core member is used to form this closed magnetic structure. Therefore, for example, the height of the inductor can be reduced as compared with a case where a closed magnetic structure is formed by sandwiching a conductor between two plate-like core members. Compared to other inductors having the same number of conductor layers, the height is reduced.

  In addition, if this configuration is adopted, the characteristic value such as the inductance value of the low-profile inductor includes the amount of resin containing magnetic powder, the formation range of the resin containing magnetic powder relative to the plate-shaped core member, and the magnetic powder containing It varies depending on the concentration (amount) of the magnetic powder in the resin. Therefore, by adjusting the resin containing the magnetic powder, it is possible to easily change or easily adjust the characteristic value such as the inductance value. In order to change the characteristic value such as inductance value, for example, the arrangement of the conductor and the number of turns are changed, the jig for that purpose is renewed, the mold for forming the conductor by pressing is remade, the plate core There is no need to change the member. A low-profile inductor can be supplied flexibly and with a short delivery time in accordance with a design change or special order without any effort or cost.

  The low-profile inductor according to the present invention is such that the conductor has a single-layer structure in addition to the configuration of the invention described above.

  By adopting this configuration, the conductor has a single-layer structure, making the most of the low profile effect of using a resin containing magnetic powder. Obtainable. This is a low-profile inductor with a lower profile than an inductor having a structure in which a wire is sandwiched between two plate-shaped core members.

  The low-profile inductor according to the present invention is one in which the magnetic powder in the resin containing magnetic powder has a concentration in the range of 20 weight percent or more to 85 weight percent or less in addition to the above-described components of the invention. It is.

  By adopting this configuration, a closed magnetic structure can be formed around the conductor by the magnetic resin layer obtained by curing the resin containing the magnetic powder and the plate-like core member.

  In the present invention, the height can be further reduced as compared with an inductor having a structure in which a wire is sandwiched between two plate-like core members.

  Hereinafter, a low-profile inductor according to an embodiment of the present invention will be described with reference to the drawings.

Embodiment 1 FIG.
FIG. 1 is a configuration diagram of a low-profile inductor 1A according to Embodiment 1 of the present invention. 1A is a plan view of the low-profile inductor 1A, FIG. 1B is a side view of the low-profile inductor 1A of FIG. 1A, and FIG. It is a sectional side view which shows the state cut | disconnected along the AA line of 1 A low profile type inductor 1A.

  The low profile inductor 1 </ b> A includes a plate-shaped core member 10, a pair of terminal members 11 as a part of a conductor, a round wire 12 as a part of a conductor, and a magnetic resin layer 13.

  The plate-shaped core member 10 is formed of, for example, a Ni-Zn (nickel-zinc) -based ferrite or a Mn-Zn (manganese-zinc) -based ferrite in a plate shape having a square shape or a rectangular shape, for example. The plate-shaped core member 10 of FIG. 1 is formed to have a flat surface and a thickness of about 0.25 millimeters.

  As shown in the cross-sectional view of FIG. 1C, the terminal member 11 is formed, for example, by bending a rectangular metal plate into a two-step staircase shape by pressing. The terminal member 11 is disposed on two opposite sides of the plate-like core member 10. One step portion formed on the terminal member 11 by the two-step staircase shape is sandwiched between the plate-like core member 10 and the magnetic resin layer 13. The other step portion not sandwiched between the plate-shaped core member 10 and the magnetic resin layer 13 is soldered to a printed circuit board (not shown).

  The round wire 12 is sandwiched between the plate-like core member 10 and the magnetic resin layer 13 as shown in the cross-sectional view of FIG. The round wire 12 has a circular cross section with a thickness of about 0.1 millimeter. Instead of the round wire 12, a rectangular wire having a quadrangular cross section may be used.

  The round wire 12 is arranged in a meander shape (zigzag shape) between the plate-like core member 10 and the magnetic resin layer 13. By making the round wire 12 into a meander shape, the inductance value can be increased as compared with, for example, a case where the round wire 12 has a single linear shape.

  Both ends of the round wire 12 are connected to a pair of terminal members 11 disposed on two opposing sides of the plate-like core member 10. Thereby, the round wire 12 is connected to a printed board (not shown) via the pair of terminal members 11. Therefore, the low profile inductor 1A functions as an inductance element.

  The magnetic resin layer 13 is disposed on one surface of the plate-like core member 10 so that the round wire 12 and the pair of terminal members 11 are sandwiched between the plate-like core member 10. In FIG. 1, the magnetic resin layer 13 is disposed on the upper surface of the plate-like core member 10. The magnetic resin layer 13 is formed by curing a resin 16 containing magnetic powder.

  The magnetic powder in the resin 16 containing magnetic powder is, for example, Ni-Zn ferrite or Mn-Zn ferrite powdered. The magnetic powder may be magnetized metal powder. The magnetic powder only needs to be formed to have a size of about 0.1 to 100 micrometers, for example, and preferably 0.5 micrometers or more and 60 micrometers or less. If the size of the magnetic powder is smaller than 0.5 micrometers or larger than 60 micrometers, it becomes difficult to mix (knead) the magnetic powder into the liquid resin. That is, in this case, it is difficult to disperse the magnetic powder substantially uniformly in the resin. The magnetic powder may be formed in an anisotropic powder shape close to a spherical shape, or may be formed in an isotropic powder shape close to a thin plate shape.

  The resin in the resin 16 containing magnetic powder may be, for example, an epoxy resin, a silicon resin, or an acrylic resin. However, acrylic resins that are cured by irradiation with ultraviolet rays are generally used. However, when magnetic powder is mixed in the resin, the ultraviolet rays are blocked by the magnetic powder. Therefore, it is difficult to cure the entire acrylic resin. In addition, acrylic resins are difficult to handle compared to epoxy resins and silicon resins. Therefore, as the resin mixed with the magnetic powder, an epoxy resin and a silicon resin are preferable. In the description of the magnetic powder described above, it is described that the magnetic powder is mixed into a liquid resin, but this is not intended to limit the resin to a liquid at room temperature. For example, the resin may be liquefied when the magnetic powder is mixed or applied. For example, the resin may be liquefied by being slightly heated in these steps.

  FIG. 2 is an explanatory diagram of an example of a manufacturing process of the low-profile inductor 1A of FIG. The low profile inductor 1A of FIG. 1 can be manufactured by executing the steps from FIGS. 2A to 2D in alphabetical order.

  FIG. 2A shows a terminal positioning process. In this step, the pair of terminal members 11 are positioned and arranged with respect to the plate-like core member 10. The pair of terminal members 11 are disposed along two opposing sides of the plate-like core member 10. One step of the terminal member 11 is placed on the upper surface of the plate-like core member 10.

  FIG. 2B is a connection process of the round wire 12. In this step, the round wire 12 provided in a meander shape (desired shape) in advance using a jig or a machine tool is placed on the upper surface of the plate-like core member 10. Both ends of the round wire 12 are connected to the pair of terminal members 11 by soldering or welding.

  FIG. 2C shows a coating (coating) step of the resin 16 containing magnetic powder. In this step, a resin 16 containing magnetic powder is applied to the upper surface of the plate-like core member 10 on which the round wire 12 and the pair of terminal members 11 are positioned. In FIG. 2C, the resin 16 containing magnetic powder is applied to the entire upper surface of the plate-like core member 10. For example, the resin 16 containing magnetic powder has a thickness of a cured magnetic resin layer 13 to be described later (finished thickness from the surface in contact with the plate-like core member 10 to the upper surface of the resin 16 containing magnetic powder) is 0. Apply to 2 millimeters. The resin 16 containing magnetic powder may be applied to a part of the upper surface of the plate-like core member 10.

  The concentration of the magnetic powder in the resin 16 containing magnetic powder may be, for example, from 20 weight percent to 85 weight percent. By setting the concentration of the magnetic powder to 20 weight percent or more, the magnetic resin layer 13 formed by curing the resin 16 containing the magnetic powder on the plate-like core member 10 can be formed. A practical closed magnetic path can be formed by the plate-like core member 10 and the magnetic resin layer 13. When the magnetic powder is mixed with the liquid epoxy resin or silicon resin, the amount of the magnetic powder is limited to 80 to 85 weight percent.

  The characteristic values of the low-profile inductor 1A in FIG. 1 are as follows: the amount of the resin 16 containing magnetic powder, the formation range of the resin 16 containing magnetic powder relative to the plate-like core member 10, and the resin 16 containing magnetic powder. It varies depending on the concentration (amount) of magnetic powder. These amounts and ranges may be selected and determined according to the DC current superposition characteristics and DC resistance value of the low profile inductor 1A.

  FIG. 2D is a step of curing the resin 16 containing magnetic powder. When using a resin that is cured by heating or UV (ultraviolet) irradiation as the resin 16 containing the magnetic powder, the curing process is performed in this step. In addition, when using what is melted by heating as the resin 16 containing the magnetic powder, in this step, the resin 16 containing the magnetic powder may be heated and then cooled. Thereby, the magnetic resin layer 13 made of the resin 16 containing the hardened magnetic powder is formed.

  The plate core member 10 is made of ferrite. On the surface of the plate-shaped core member 10, many invisible fine irregularities and holes are formed. A part of the liquid resin or the resin liquefied by heating enters into the irregularities or holes on the surface of the plate-like core member 10. The liquefied resin is cured and integrated by subsequent cooling. Therefore, the cured resin adheres to and adheres to the surface of the plate-like core member 10. When the resin is cured, the round wire 12 and the pair of terminal members 11 are fixed in a state of being sandwiched between the cured resin 16 containing magnetic powder and the plate-like core member 10. The round wire 12 and the pair of terminal members 11 are positioned and fixed with high accuracy simply by curing the resin 16 containing magnetic powder.

  The low-profile inductor 1A shown in FIG. 1 is formed by sequentially executing the steps shown in FIGS. 2A to 2D. The low-profile inductor 1A shown in FIG. 1 can be generated by the above simplified operation. Productivity of the low-profile inductor 1A of FIG. 1 can be increased.

  In addition, when using an anisotropic powder-shaped magnetic powder, the magnetic powder containing magnetic powder is applied between the coating step in FIG. 2C and the resin curing step in FIG. A magnetic field may be applied to the resin 16. Thereby, the orientation of the magnetic powder can be aligned, and the degree of orientation of the magnetic powder can be increased.

  As described above, according to the first embodiment, the round wire 12 and the pair of terminal members 11 (a part thereof) are sandwiched between the magnetic resin layer 13 and the plate-like core member 10. A closed magnetic path is formed around the round wire 12 by the magnetic powder in the magnetic resin layer 13 and the plate-like core member 10. Moreover, in order to form this closed magnetic path, only one plate-like core member 10 is used. Therefore, for example, the height of the inductor can be reduced as compared with the case where the closed magnetic circuit is formed by sandwiching the round wire 12 between the two plate-like core members 10.

  Moreover, the round wire 12 of this Embodiment 1 is arrange | positioned at meander shape (zigzag shape), and is a 1 layer structure. By doing in this way, the thickness of the round wire 12 is made into the minimum necessary thickness of 0.1 millimeters while increasing the inductance value. In this case, the thickness of the magnetic resin layer 13 formed by curing the resin 16 containing magnetic powder can be reduced to about 0.2 mm. Further, the thickness of the plate-like core member 10 is limited to about 0.25 mm. Therefore, the thickness of the low profile inductor 1A of the first embodiment is 0.45 to 0.5 millimeter. Taking advantage of the low profile due to the use of the resin 16 containing magnetic powder, it is possible to obtain an unprecedented thin low profile inductor 1A. Note that an inductor using two plate-like core members 10 requires an adhesive or the like for bonding them, so that the thickness of 0.7 to 0.8 mm is actually the limit.

  Further, the characteristic value such as the inductance value, direct current superimposition characteristic, direct current resistance, and magnetic permeability of the low profile inductor 1A depends on the amount of the resin 16 containing magnetic powder and the plate-like core member 10 of the resin 16 containing magnetic powder. Depending on the formation range, the concentration (amount) of the magnetic powder in the resin 16 containing the magnetic powder, and the like.

  Therefore, by adjusting the amount, range, concentration, etc. of the resin 16 containing the magnetic powder without changing the shape and arrangement of the round wire 12, characteristics such as inductance value, DC current superimposition characteristics, DC resistance, permeability, etc. The value can be easily changed or easily adjusted. In order to change the characteristic value such as the inductance value, for example, the number of turns of the conductor is changed, the jigs and machine tools for that purpose are renewed, the mold for forming the conductor by pressing is remade, There is no need to change the core member 10.

  As a result, the low-profile inductor 1A of the first embodiment adjusts its characteristic value in the same manner as an inductor that winds a winding around a coil bobbin, etc., even though it does not have a member that winds the winding such as a coil bobbin. It will be easy. The low-profile inductor 1A having suitable characteristics can be supplied flexibly and with a short delivery time in accordance with a design change or a special order without taking time and cost. Further, a plurality of types of low-profile inductors 1A having different characteristics can be formed using a common plate-like core member 10, a common round wire 12, and a common basic structure. For this reason, it is possible to shorten the period from when an ordered inductor is ordered to when it is delivered, and it is possible to improve cost performance through a lineup with a common basic structure.

  In addition, the low-profile inductor 1A according to the first embodiment can be formed by applying (coating) a resin 16 containing magnetic powder to the plate-like core member 10 on which the round wire 12 is placed and curing it. it can. On the other hand, in an inductor formed by overlapping two plate-shaped core members 10, when the two plate-shaped core members 10 are overlapped, there is a possibility that positional deviation occurs in the round wire 12 sandwiched therebetween. is there. If the round wire 12 is misaligned, the characteristics of the inductor are changed and the characteristics are likely to vary.

  In the first embodiment, a closed magnetic path is formed by the plate-like core member 10 and the magnetic resin layer 13 obtained by curing the resin 16 containing magnetic powder. Here, the magnetic permeability of the plate-shaped core member 10 and the magnetic resin layer 13 differs depending on the material. Therefore, a pseudo magnetic gap is formed between the plate-like core member 10 and the magnetic resin layer 13. A pseudo magnetic gap is also formed in the magnetic resin layer 13. When the magnetic gap is formed, the closed magnetic circuit becomes difficult to be saturated, and the direct current superimposition characteristics are improved. By forming these magnetic gaps, the low-profile inductor 1A of the first embodiment can be suitably used as a power inductor that allows a large current to flow. As a power inductor, an unprecedented low power inductor can be obtained.

  In the first embodiment, the pair of terminal members 11 is fixed by curing the resin 16 containing magnetic powder. The pair of terminal members 11 need not be fixed to the plate-like core member 10 with an adhesive or the like.

  In the low profile inductor 1A of the first embodiment, the round wire 12 is formed in a meander shape as shown in FIG. In addition, for example, the round wire 12 may be formed in a linear shape as shown in FIG.

  In the low profile inductor 1A of the first embodiment, as shown in FIG. 2B, the meander-shaped round wire 12 is sandwiched entirely between the plate-shaped core member 10 and the magnetic resin layer 13. ing. In addition to this, for example, in the low-profile inductor 1A, as shown in FIG. 4, a part of the meander-shaped round wire 12 is exposed without being sandwiched between the plate-like core member 10 and the magnetic resin layer 13. It may be a structure. Further, the pair of terminal members 11 may be disposed at the corners of the plate-like core member 10.

  As shown in FIG. 1C, the plate-like core member 10 of the first embodiment has a flat surface on which the round wire 12 is placed. In addition to this, for example, as shown in FIG. 5, the plate-like core member 10 may have a groove portion 17 in a portion where the round wire 12 is placed. Thereby, the round wire 12 is accommodated in the groove portion 17, and the round wire 12 is difficult to move when the resin 16 containing magnetic powder is applied to the plate-like core member 10. Further, by inserting the round wire 12 into the groove portion 17, it is possible to reduce the thickness of the magnetic resin layer 13 and to further reduce the height of the low-profile inductor 1A. Moreover, although this groove part 17 may be a thing with a cross-sectional substantially square shape, as shown in FIG. 5, it is good to set it as the cross-sectional substantially inverted trapezoid shape where the slope of the both sides of the round wire 12 becomes diagonal. This makes it easier for the resin 16 containing magnetic powder to wrap around the gap between the groove 17 and the round wire 12.

  The magnetic resin layer 13 of the first embodiment is formed in a single layer structure as shown in FIG. In addition to this, for example, the magnetic resin layer may be formed in a two-layer structure including an inner layer 18 and an outer layer 19 as shown in FIG. 6, or may be formed in a structure of three or more layers. . Thus, by making the magnetic resin layer into a structure of two or more layers, for example, the concentration (amount) of the magnetic powder of the inner layer 18 is 85% or more, or the inner layer 18 is made of a magnetic powder only layer. It becomes possible to do. Even if the inner layer 18 is formed of a resin having a magnetic powder concentration (amount) of 85% or more, or formed only from the magnetic powder, the inner layer 18 is molded by the outer layer 19 and is formed on the plate-like core member 10. A magnetic resin layer can be formed.

Embodiment 2. FIG.
FIG. 7 is a configuration diagram of a low-profile inductor 1B according to the second embodiment of the present invention. 7A is a plan view of the low-profile inductor 1B, FIG. 7B is a side view of the low-profile inductor 1B of FIG. 7A, and FIG. It is a sectional side view which shows the state cut | disconnected along the AA line of the low profile type inductor 1B of 7 (A).

  The low-profile inductor 1B includes a plate-shaped core member 10, a metal plate member 21 as a conductor, and a magnetic resin layer 13 formed by curing a resin 16 containing magnetic powder.

  As shown in FIGS. 7A and 7C, the metal plate member 21 has a rectangular shape formed longer in the longitudinal direction than the plate-like core member 10, and has a thickness of about 0.1 mm. The metal plate is punched into a predetermined shape shown in FIG. 7A by pressing or the like, and is composed of a pair of terminal portions 22 and a wire portion 23 therebetween. As shown in FIG. 7A, the wire portion 23 has a meander shape (zigzag shape) similar to the arrangement shape of the round wire 12 of the first embodiment.

  The constituent elements of the low-profile inductor 1B other than those described above are formed of the same material as the constituent elements having the same names in the first embodiment, and are denoted by the same reference numerals as those in the first embodiment. The description is omitted.

  FIG. 8 is an explanatory diagram of an example of a manufacturing process of the low-profile inductor 1B of FIG. The low-profile inductor 1B of FIG. 7 can be manufactured by executing the steps from FIGS. 8A to 8D in alphabetical order.

  FIG. 8A shows a positioning process of the metal plate member. In this step, a metal plate member 21 that has been punched in advance is positioned and disposed on the plate-like core member 10. The metal plate member 21 is positioned so that a pair of terminal portions 22 protrude from both sides of the plate-like core member 10.

  FIG. 8B shows a coating (coating) process of the resin 16 containing magnetic powder. The resin 16 containing the magnetic powder has, for example, a finished thickness of the magnetic resin layer 13 after curing (finished thickness from the surface in contact with the plate-like core member 10 to the upper surface of the resin 16 containing the magnetic powder) is 0. Apply to a thickness of 2 millimeters.

  FIG. 8C is a step of curing the resin 16 containing magnetic powder. The resin is cured by heating or irradiating the resin 16 containing magnetic powder with UV (ultraviolet rays). Thereby, the magnetic resin layer 13 made of the resin 16 containing the hardened magnetic powder is formed.

  FIG. 8D shows a process for forming the terminal portion 22. In this step, the pair of terminal portions 22 of the plate-like core member 10 protruding left and right in FIG. 8 are bent. Thereby, as shown in FIG. 7C, a pair of terminal portions 22 bent along two opposing sides of the plate-like core member 10 are formed.

  The low-profile inductor 1B shown in FIG. 7 is formed by sequentially executing the steps shown in FIGS. 8A to 8D. The low-profile inductor 1B shown in FIG. 7 can be generated with a small number of work steps, and the productivity of the low-profile inductor 1B shown in FIG. 7 can be increased. 7 has the same effect as the low-profile inductor 1B of the first embodiment. Note that the step in FIG. 8D may be performed between the step in FIG. 8A and the step in FIG.

  In particular, the conductor sandwiched between the plate-shaped core member 10 and the magnetic resin layer 13 is formed by the metal plate member 21. The metal plate member 21 is obtained by integrating the round wire 12 of the first embodiment and a pair of terminal members 22. Therefore, the step of connecting the round wire 12 and the pair of terminal members 22 in Embodiment 1 is not necessary.

  In addition, the wire part 23 of the metal plate member 21 of the said Embodiment 2 is formed in the 1 layer structure of a meander shape, as shown in FIG. In addition to this, for example, the wire portion 23 of the metal plate member 21 may be formed in a two-layer winding structure as shown in FIG. 9, or may be formed in a three-layer or more winding structure. .

Embodiment 3 FIG.
FIG. 10 is a configuration diagram of the low profile choke coil 2 according to the third embodiment of the present invention. The choke coil is used to remove common mode noise (in-phase high-frequency noise) from a pair of signal lines. In the low profile choke coil 2, a plurality of low profile inductors are formed in a structure having a common core. FIG. 10A is a plan view of the low profile choke coil 2, and FIG. 10B is a side view of the low profile choke coil 2 of FIG.

  The low profile choke coil 2 includes a plate-shaped core member 10, a first metal plate member 31 as a conductor, and a second metal plate member 32 as another conductor not connected to the first metal plate member 31. And a magnetic resin layer 13 obtained by curing the resin 16 containing magnetic powder.

  As shown in FIG. 10, the first metal plate member 31 and the second metal plate member 32 have a long, flat plate shape with a thickness of about 0.1 millimeters that is formed in a horizontally longer shape than the plate-like core member 10. Have. The first metal plate member 31 and the second metal plate member 32 are arranged with a certain distance from each other and are sandwiched between the plate-like core member 10 and the magnetic resin layer 13. Further, both end portions of the first metal plate member 31 and both end portions of the second metal plate member 32 are bent into a substantially U-shaped cross section to form terminal portions.

  The components of the low-profile choke coil 2 other than those described above are similarly formed of the same material as the component of the same name in the first embodiment, and are denoted by the same reference numerals as those in the first embodiment. Description is omitted. 10 can be formed by a process similar to the manufacturing process of the low-profile inductor 1B of the second embodiment shown in FIG. 8, for example.

  The low profile choke coil 2 can remove common mode noise while exhibiting the same effects as the low profile inductor 1A of the first embodiment. For example, a low profile choke coil 2 that is unprecedented can be obtained.

  In addition, the 1st metal plate member 31 and the 2nd metal plate member 32 of the said Embodiment 3 are formed in the linear 1 layer structure, as shown in FIG. In addition to this, for example, the first metal plate member 31 and the second metal plate member 32 are formed in a two-layer winding structure as shown in FIG. May be.

  The magnetic resin layer 13 of the third embodiment is formed as one common resin layer at a portion covering the first metal plate member 31 and a portion covering the second metal plate member 32. In addition to this, for example, as shown by a one-dot chain line in FIGS. 10 and 11, a portion of the magnetic resin layer 13 covering the first metal plate member 31 and a second metal plate member 32 of the magnetic resin layer 13 are covered. The site | part which performs may be isolate | separated. In the case of this modification, compared to the case where these parts are common, the magnetic lines of force by the first metal plate member 31 are less likely to wrap around the part covering the second metal plate member 32 of the magnetic resin layer 13, and The lines of magnetic force due to the second metal plate member 32 are less likely to wrap around the portion of the magnetic resin layer 13 that covers the first metal plate member 31. For this reason, the characteristic that a plurality of separate inductors are integrated becomes apparent.

  Each of the above embodiments is an example of a preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications and changes can be made without departing from the scope of the invention. It is.

  For example, in each of the embodiments described above, the resin 16 containing magnetic powder is directly applied to the plate-like core member 10. In addition to this, for example, the resin 16 containing magnetic powder includes a binder for arranging the magnetic resin layer 13 on the plate-like core member 10, a pair of terminal members 11, a round wire 12, a metal plate member 21, and the like. It may be formed on the plate-shaped core member 10 with an adhesive (resin) or the like for fixing to the plate-shaped core member 10 interposed.

  The present invention can be suitably used to reduce the height of an inductor.

FIG. 1 is a configuration diagram of a low-profile inductor according to Embodiment 1 of the present invention. FIG. 2 is an explanatory diagram of an example of a manufacturing process of the low-profile inductor of FIG. FIG. 3 is a diagram showing a first modification of the low profile inductor of FIG. FIG. 4 is a diagram showing a second modification of the low profile inductor of FIG. FIG. 5 is a diagram showing a third modification of the low profile inductor of FIG. FIG. 6 is a diagram showing a fourth modification of the low profile inductor of FIG. FIG. 7 is a configuration diagram of a low profile inductor according to the second embodiment of the present invention. FIG. 8 is an explanatory diagram of an example of a manufacturing process of the low-profile inductor of FIG. FIG. 9 is a diagram showing a modification of the low profile inductor of FIG. FIG. 10 is a configuration diagram of a low profile choke coil according to Embodiment 3 of the present invention. FIG. 10 is a diagram showing a modification of the low profile inductor of FIG.

Explanation of symbols

1A, 1B Low profile inductor 2 Low profile choke coil (a type of low profile inductor)
10 Plate-shaped core member 11 Terminal member (part of conductor)
12 Round wire (part of conductor)
13 Magnetic resin layer 16 Resin 17 containing magnetic powder Groove 18 Inner layer (part of magnetic resin layer)
19 Outer layer (part of magnetic resin layer)
21 Metal plate member (conductor)
31 First metal plate member (conductor)
32 Second metal plate member (another conductor)

Claims (3)

A plate-like core member formed by forming a magnetic material into a plate shape;
A conductor placed on at least one of the pair of plate surfaces of the plate-shaped core member;
A magnetic resin layer formed on the surface of the plate-like core member on which the conductor is placed, and a resin containing magnetic powder is cured;
A low-profile inductor comprising:   2. The low profile inductor according to claim 1, wherein the conductor has a single layer structure.   3. The low-profile inductor according to claim 1, wherein the magnetic powder in the resin containing the magnetic powder has a concentration in a range from 20 weight percent to 85 weight percent.

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