JP2007329282A - Multilayer circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a multilayer circuit board capable of sufficiently reducing unnecessary radiant noises. <P>SOLUTION: In the multilayer circuit board, a laminate is configured by superposing a first signal electrode layer 40, a ground electrode layer 30, a power-supply electrode layer 20, and a second signal electrode layer 10 in the order. An IC 60 is mounted on the top face of the multilayer circuit board, and a three-terminal capacitor 46 is mounted on a rear. A land 42 for mounting the input side and an input-side power supply pattern 41 connected to the land 42 for mounting the input side are fitted to the first signal electrode layer 40. The land 43 for mounting the output side, an output-side power supply pattern 44 connected to the land 43 for mounting the output side, and the land 45 for mounting the ground-side, are further fitted to the first signal electrode layer 40. A power-supply electrode 21 is installed to the power-supply electrode layer 20, and the land 11 for mounting the IC is installed to the second signal electrode layer 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multilayer wiring board, and more particularly to a multilayer wiring board for mounting a digital IC having a BAG (Ball Grid Array) type terminal arrangement.

  With the downsizing and higher functionality of electronic devices, the data processing speed of multilayer wiring boards has been increased. Along with this, unnecessary radiation noise becomes a problem, and the design of a digital circuit on a multilayer wiring board requires a design for noise countermeasures.

  A noise countermeasure component, for example, a bypass capacitor used for noise countermeasure, plays a role of returning a high-frequency current generated at a power supply terminal to the ground by the operation of the IC in a multilayer wiring board on which the IC is mounted. As a result, unnecessary radiation noise caused by high-frequency current propagating throughout the multilayer wiring board is reduced. However, in order to exert the noise countermeasure effect by these noise countermeasure components, it is necessary to pay attention to the mounting structure, and depending on the mounting structure, sufficient noise countermeasures may not be obtained.

  It is known to use a plurality of two-terminal capacitors connected in parallel as a countermeasure against noise in an IC power supply system in digital equipment. As a multilayer wiring board, it is also known to spatially separate a wiring on which noise is superimposed and another wiring and connect them via a three-terminal type noise countermeasure component.

  For example, as a countermeasure against noise in a conventional IC power supply system, a multilayer wiring board mounting structure as shown in Patent Document 1 is known. As shown in FIGS. 10 and 11, the multilayer wiring substrate 100 is roughly formed by stacking a first signal electrode layer 140, a power electrode layer 120, a ground electrode layer 130, and a second signal electrode layer 110 in this order. It constitutes the body. An IC 160 is mounted on the top surface of the multilayer wiring board 100, and a three-terminal capacitor 146 is mounted on the back surface.

  The first signal electrode layer 140 has an input side mounting land 142 connected to the input terminal 146a of the three-terminal capacitor 146 on the back surface of the insulating sheet, and an input side power supply connected to the input side mounting land 142. The pattern 141, the output side mounting land 143 to which the output terminal 146b of the three terminal capacitor 146 is connected, the output side power supply pattern 144 connected to the output side mounting land 143, and the ground terminal 146c of the three terminal capacitor are connected. The ground side mounting land 145 is provided.

  The power electrode layer 120 is obtained by providing a power electrode 121 on the surface of an insulating sheet. The ground electrode layer 130 is obtained by providing the ground electrode G on the entire surface of the insulating sheet. The second signal electrode layer 110 is obtained by providing an IC mounting land 111 on the surface of an insulating sheet.

  Further, a plurality of first power supply conductors (via hole conductors) 152 for connecting the power supply electrodes 121 and the output-side power supply pattern 144, the power supply electrodes 121, and the IC power supply terminals are mounted inside the multilayer wiring board 100. A plurality of second power supply conductors (via hole conductors) 151 for connecting the lands 111a and a plurality of ground connection conductors (via hole conductors) 153 for connecting the ground electrodes G and the ground side mounting lands 145 are provided. It has been.

  According to the multilayer wiring board 100, the power supply wiring (second power supply conductor 151, first power supply conductor 152, power supply electrode 121, output side power supply pattern connected to the power supply terminal of the IC 160 that is a noise source. 144) and a power supply wiring (input-side mounting land 142, input-side power supply pattern 141) connected to an external power supply are spatially separated, and these wirings are connected via a three-terminal capacitor 146. .

However, the multilayer wiring board 100 can return the high-frequency current flowing through the power supply wiring to the ground. However, when the power supply wiring and the power supply wiring are close to each other, they are electromagnetically coupled to generate a high-frequency current. It propagates to the whole 100. For this reason, there was a problem that unnecessary radiation noise could not be reduced sufficiently. FIG. 12 shows the measurement result of the radiation noise of the multilayer wiring board 100.
JP 2003-297963 A

  Therefore, an object of the present invention is to provide a multilayer wiring board that can sufficiently reduce unnecessary radiation noise.

In order to achieve the above object, a multilayer wiring board according to a first invention is
(A) Input-side mounting land to which the input terminal of the three-terminal electronic component is connected, input-side power supply pattern connected to the input-side mounting land, and output side to which the output terminal of the three-terminal electronic component is connected A mounting land, an output-side power supply pattern connected to the output-side mounting land, and a ground-side mounting land to which a ground terminal of a three-terminal electronic component is connected are provided on the back surface, and the three-terminal electronic component is mounted on the back surface. A first signal electrode layer mounted on
A ground electrode layer having a ground electrode on its surface;
A power electrode layer provided with a power electrode on the surface;
The second signal electrode layer on which the IC is mounted on the surface is stacked in the order of the first signal electrode layer, the ground electrode layer, the power supply electrode layer, and the second signal electrode layer to form a laminate,
(B) a plurality of first power supply conductors for connecting the power electrode and the output-side power supply pattern;
A plurality of second power supply conductors for connecting the power electrode and the IC;
A plurality of ground connection conductors for electrically connecting the ground electrode and the ground side mounting land are provided in the laminate,
(C) The power supply electrode is connected to the output-side mounting land with a plurality of first power supply conductors and the current paths substantially bundled together as viewed from the power supply electrode by the output-side power supply pattern. Electrically connected,
(D) The three-terminal electronic component is disposed so as to overlap with the IC in a plan perspective state,
(E) a ground electrode, a ground connection conductor, and a ground side mounting land are a first power supply conductor, a second power supply conductor, a power electrode, an output side power supply pattern, an output side mounting land, and an input side power source The supply pattern and the input side mounting land are arranged so as not to face each other,
It is characterized by.

The multilayer wiring board according to the second invention is
(A) Input side mounting land to which the input terminal of the three-terminal type electronic component is connected, output side mounting land to which the output terminal of the three-terminal type electronic component is connected, and output side connected to the output side mounting land A ground side mounting land to which a power supply pattern and a ground terminal of a three-terminal electronic component are connected is provided on the back surface, and a first signal electrode layer for mounting the three-terminal electronic component on the back surface;
A ground electrode layer having a ground electrode on its surface;
A power electrode layer provided with a power electrode on the surface;
The second signal electrode layer on which the IC is mounted on the surface is stacked in the order of the first signal electrode layer, the ground electrode layer, the power supply electrode layer, and the second signal electrode layer to form a laminate,
(B) a plurality of first power supply conductors for connecting the power electrode and the output-side power supply pattern;
A plurality of second power supply conductors for connecting the power electrode and the IC;
A plurality of ground connection conductors for electrically connecting the ground electrode and the ground side mounting land;
Input side power supply pattern connected to the input side mounting land,
A plurality of third power supply conductors for electrically connecting the input-side power supply pattern and the input-side mounting land are provided in the laminate,
(C) The power supply electrode is connected to the output-side mounting land with a plurality of first power supply conductors and the current paths substantially bundled together as viewed from the power supply electrode by the output-side power supply pattern. Electrically connected,
(D) The ground electrode, the ground connection conductor, and the ground side mounting land are the first power supply conductor, the second power supply conductor, the power electrode, the output side power supply pattern, the output side mounting land, and the input side power source. The supply pattern, the input side mounting land and the third power supply conductor are arranged so as not to face each other,
It is characterized by.

A multilayer wiring board according to a third invention is
(A) Input-side mounting land to which the input terminal of the three-terminal electronic component is connected, input-side power supply pattern connected to the input-side mounting land, and output side to which the output terminal of the three-terminal electronic component is connected A mounting land, an output-side power supply pattern connected to the output-side mounting land, and a ground-side mounting land to which a ground terminal of a three-terminal electronic component is connected are provided on the back surface, and the three-terminal electronic component is mounted on the back surface. A first signal electrode layer mounted on
A power electrode layer provided with a power electrode on the surface;
A ground electrode layer having a ground electrode on its surface;
The second signal electrode layer on which the IC is mounted on the surface is stacked in the order of the first signal electrode layer, the power electrode layer, the ground electrode layer, and the second signal electrode layer to form a laminate,
(B) a plurality of first power supply conductors for connecting the power electrode and the output-side power supply pattern;
A plurality of second power supply conductors for connecting the power electrode and the IC;
A plurality of ground connection conductors for electrically connecting the ground electrode and the ground side mounting land are provided in the laminate,
(C) The power supply electrode is connected to the output-side mounting land with a plurality of first power supply conductors and the current paths substantially bundled together as viewed from the power supply electrode by the output-side power supply pattern. Electrically connected,
(D) The first power supply conductor, the second power supply conductor, the power electrode, the output side power supply pattern, and the output side mounting land are not opposed to the input side power supply pattern and the input side mounting land. Being placed,
It is characterized by.

  In the multilayer wiring board according to the present invention, the first power supply conductor, the second power supply conductor, the power electrode, the output side power supply pattern and the output side mounting land, the input side power supply pattern and the input side mounting The land is electromagnetically separated, and both are connected via a three-terminal electronic component.

  According to the present invention, the high-frequency current flowing through the power supply wiring can be fed back to the ground, and the power supply wiring and the power supply wiring can be electromagnetically separated, so that the high-frequency current can be prevented from propagating throughout the multilayer wiring board. . As a result, a multilayer wiring board capable of sufficiently reducing unnecessary radiation noise can be obtained.

  Embodiments of a multilayer wiring board according to the present invention will be described below with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the same member and part in each Example, and the overlapping description is abbreviate | omitted.

(Refer 1st Example and FIGS. 1-3)
As shown in FIGS. 1 and 2, the multilayer wiring board 3A according to the first embodiment roughly includes a first signal electrode layer 40, a ground electrode layer 30, a power electrode layer 20, and a second signal electrode layer 10. The laminate is constructed by stacking in this order. An IC 60 is mounted on the top surface of the multilayer wiring board 3A, and a three-terminal capacitor 46 is mounted on the back surface.

  The first signal electrode layer 40 has an input side mounting land 42, an input side power supply pattern 41 connected to the input side mounting land 42, an output side mounting land 43, and the output on the back surface of the insulating sheet. An output side power supply pattern 44 and a ground side mounting land 45 connected to the side mounting land 43 are provided.

  The input terminal 46a of the three-terminal capacitor 46 is soldered to the input-side mounting land 42, the output terminal 46b of the three-terminal capacitor 46 is soldered to the output-side mounting land 43, and the ground terminal 46c of the three-terminal capacitor 46 is grounded. It is soldered to the side mounting land 45.

  The ground electrode layer 30 is obtained by providing the ground electrode G on the entire surface of the insulating sheet. The power electrode layer 20 is provided with a power electrode 21 on the surface of an insulating sheet. The second signal electrode layer 10 is obtained by providing an IC mounting land 11 on the surface of an insulating sheet. Of the IC mounting lands 11, the power terminal mounting lands 12 are for connection to the power terminals 61 of the IC 60.

  Further, in the multilayer wiring board 3A, a plurality of first power supply conductors (via hole conductors) 52 for connecting the power supply electrodes 21 and the output-side power supply pattern 44, and the power supply electrodes 21 and IC power supply terminal mounting. A plurality of second power supply conductors (via hole conductors) 51 for connecting the lands 12 and a plurality of ground connection conductors (via hole conductors) 53 for connecting the ground electrode G and the ground side mounting land 45 are provided. It has been.

  According to this multilayer wiring board 3A, the power supply electrode 21 is bundled substantially in one current path as viewed from the power supply electrode 21 by the output-side power supply pattern 44 via the plurality of first power supply conductors 52. In this state, it is electrically connected to the output side mounting land 43.

  Furthermore, the power supply wiring (second power supply conductor 51, power supply electrode 21, first power supply conductor 52, output power supply pattern 44) connected to the power supply terminal 61 of the IC 60, which is a noise source, and an external power supply are connected. The power supply wirings to be connected (the input-side mounting land 42 and the input-side power supply pattern 41) are spatially separated, and these wirings are connected via a three-terminal capacitor 46.

  Therefore, the noise generated at the power terminal 61 of the IC 60 is the power terminal 61 of the IC 60, the power terminal mounting land 12, the second power supply conductor 51, the power electrode 21, the first power supply conductor 52, and the output side power supply. The pattern 44, the output-side mounting land 43, the three-terminal capacitor 46, the input-side mounting land 42, and the input-side power supply pattern 41 are propagated in this order. That is, the propagation path of the high frequency current is substantially one, and the high frequency current always passes through the three-terminal capacitor 46. Thereby, the noise removal effect of the three-terminal capacitor 46 can be exhibited.

  The ground electrode G, the ground connection conductor 53, and the ground side mounting land 45 include the first power supply conductor 52, the second power supply conductor 51, the power electrode 21, the output side power supply pattern 44, and the output side mounting land. The land 43, the input-side power supply pattern 41, and the input-side mounting land 42 are disposed between the power supply electrode 21 and the input-side power supply pattern 41 so as not to directly face each other.

  Thereby, the electromagnetic coupling between the power supply electrode 21 and the input-side power supply pattern 41 is cut off, and it is possible to prevent the high-frequency current from propagating to the input-side power supply pattern 41 without passing through the three-terminal capacitor 46.

  Although the ground electrode G is formed on the entire surface of the ground electrode layer 30, in order to obtain the effect of this mounting structure, the first power supply conductor 52, the second power supply conductor 51, the power electrode 21, and the output The side power supply pattern 44 and the output side mounting land 43 may not be directly opposed to the input side power supply pattern 41 and the input side mounting land 42. Accordingly, the ground electrode G faces the input-side power supply pattern 41 and the input-side mounting land 42, and its size is at least as large as the combined size of the input-side power supply pattern 41 and the input-side mounting land 42. That's fine.

  Further, the three-terminal capacitor 46 is disposed so as to overlap the IC 60 when the multilayer wiring board 3A is seen through in plan. As a result, the wiring distance from the power supply terminal 61 of the IC 60 to the output-side mounting land 43 is shortened, and the deterioration of the electrical characteristics of the three-terminal capacitor 46 due to the inductance and electrical resistance caused by the power supply wiring can be reduced.

  According to the first embodiment, the high-frequency current flowing through the power supply wiring can be fed back to the ground, and the power supply wiring and the power supply wiring can be electromagnetically separated, so that the high-frequency current propagates throughout the multilayer wiring board. There is no fear of it. As a result, unnecessary radiation noise propagating through the power supply wiring to the IC 60 can be sufficiently reduced. FIG. 3 is a graph showing measurement results of radiation noise of the multilayer wiring board 3A.

(Refer 2nd Example and FIGS. 4-6)
Next, a multilayer wiring board 3B according to a second embodiment will be described with reference to FIGS. The multilayer wiring board 3B has basically the same configuration as the multilayer wiring board 3A, except that the input-side power supply pattern 41 is disposed inside the laminate, and is seen through in plan view. In this case, the three-terminal capacitor 46 is arranged relatively far from the IC 60 so as to be half overlapped. A plurality of third power supply conductors (via hole conductors) 54 for connecting the input-side mounting lands 42 and the input-side power supply pattern 41 are provided inside the multilayer wiring board 3B.

  According to this multilayer wiring board 3B, the power supply electrode 21 is bundled substantially in one current path as viewed from the power supply electrode 21 by the output-side power supply pattern 44 via the plurality of first power supply conductors 52. In this state, it is electrically connected to the output side mounting land 43.

  Further, the power supply wiring (second power supply conductor 51, first power supply conductor 52, power supply electrode 21, output side power supply pattern 44) connected to the power supply terminal 61 of the IC 60, which is a noise source, and an external power supply are connected. The connected power supply wiring (input side mounting land 42, third power supply conductor 54, input side power supply pattern 41) is spatially separated, and these wirings are connected via a three-terminal capacitor 46. ing.

  The ground electrode G, the ground connection conductor 53, and the ground side mounting land 45 include the first power supply conductor 52, the second power supply conductor 51, the power electrode 21, the output side power supply pattern 44, and the output side mounting land. The land 43 is arranged between the power supply electrode 21 and the input-side power supply pattern 41 so that the input-side power supply pattern 41, the third power supply conductor 54, and the input-side mounting land 42 do not directly face each other. Has been.

  Thereby, the electromagnetic coupling between the power supply electrode 21 and the input-side power supply pattern 41 is cut off, and it is possible to prevent the high-frequency current from propagating to the input-side power supply pattern 41 without passing through the three-terminal capacitor 46.

  FIG. 6 is a graph showing a measurement result of radiation noise of the multilayer wiring board 3B. The multilayer wiring board 3B is slightly inferior in reducing unnecessary radiation noise to a slight degree than the multilayer wiring board 3A, but sufficiently achieves noise reduction.

(Refer to the third embodiment, FIGS. 7 to 9)
Next, a multilayer wiring board 3C according to a third embodiment will be described with reference to FIGS. The multilayer wiring board 3C has basically the same configuration as the multilayer wiring board 3A, except that the first signal electrode layer 40, the power electrode layer 20, the ground electrode layer 30, and the second signal electrode are different. That is, the layers 10 are stacked in this order to form a laminate.

  The first power supply conductor 52, the second power supply conductor 51, the power electrode 21, the output-side power supply pattern 44 and the output-side mounting land 43, the input-side power supply pattern 41 and the input-side mounting land 42. And are arranged so as not to face each other. That is, when the multilayer wiring board 3C is seen through the plane, the input-side power supply pattern 41 and the input-side mounting land 43 include the first power supply conductor 52, the second power supply conductor 51, the power electrode 21, and the output side power supply. The supply pattern 44 and the output side mounting land 43 are arranged so as not to overlap even part.

  Thus, even in the case of a multilayer wiring board in which the ground electrode G for electromagnetic coupling interruption cannot be disposed between the power supply electrode 21 and the input-side power supply pattern 41 due to the structure, the first power supply conductor 52, the electromagnetic coupling among the second power supply conductor 51, the power electrode 21, the output side power supply pattern 44 and the output side mounting land 43, and the input side power supply pattern 41 and the input side mounting land 42 is reduced. Therefore, it is possible to prevent the high-frequency current from propagating to the input-side power supply pattern 41 without passing through the three-terminal capacitor 46. FIG. 9 is a graph showing measurement results of radiation noise of the multilayer wiring board 3C.

(Other examples)
The multilayer wiring board according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof.

1 is a schematic exploded perspective view showing a first embodiment of a multilayer wiring board according to the present invention. FIG. 2 is a schematic cross-sectional view of the multilayer wiring board shown in FIG. The graph which shows the measurement result of the radiation noise of the multilayer wiring board shown in FIG. The schematic exploded perspective view which shows 2nd Example of the multilayer wiring board based on this invention. FIG. 5 is a schematic cross-sectional view of the multilayer wiring board shown in FIG. 4. The graph which shows the measurement result of the radiation noise of the multilayer wiring board shown in FIG. The schematic exploded perspective view which shows 3rd Example of the multilayer wiring board based on this invention. FIG. 8 is a schematic cross-sectional view of the multilayer wiring board shown in FIG. 7. The graph which shows the measurement result of the radiation noise of the multilayer wiring board shown in FIG. The model exploded perspective view which shows the conventional multilayer wiring board. FIG. 11 is a schematic cross-sectional view of the multilayer wiring board shown in FIG. 10. The graph which shows the measurement result of the radiation noise of the multilayer wiring board shown in FIG.

Explanation of symbols

3A, 3B, 3C ... multilayer wiring board 10 ... second signal electrode layer 20 ... power electrode layer 21 ... power electrode 30 ... ground electrode layer 40 ... first signal electrode layer 41 ... input side power supply pattern 42 ... input side Mounting land 43 ... Output side mounting land 44 ... Output side power supply pattern 45 ... Ground side mounting land 46 ... 3-terminal capacitor 51 ... Second power supply conductor 52 ... First power supply conductor 53 ... Ground connection conductor 60 ... IC
G ... Ground electrode

Claims (3)

(A) Input-side mounting land to which the input terminal of the three-terminal electronic component is connected, input-side power supply pattern connected to the input-side mounting land, and output side to which the output terminal of the three-terminal electronic component is connected A mounting land, an output-side power supply pattern connected to the output-side mounting land, and a ground-side mounting land to which a ground terminal of a three-terminal electronic component is connected are provided on the back surface, and the three-terminal electronic component is mounted on the back surface. A first signal electrode layer mounted on
A ground electrode layer having a ground electrode on its surface;
A power electrode layer provided with a power electrode on the surface;
The second signal electrode layer on which the IC is mounted on the surface is stacked in the order of the first signal electrode layer, the ground electrode layer, the power supply electrode layer, and the second signal electrode layer to form a laminate,
(B) a plurality of first power supply conductors for connecting the power electrode and the output-side power supply pattern;
A plurality of second power supply conductors for connecting the power electrode and the IC;
A plurality of ground connection conductors for electrically connecting the ground electrode and the ground side mounting land are provided in the laminate,
(C) The power supply electrode is connected to the output-side mounting land with a plurality of first power supply conductors and the current paths substantially bundled together as viewed from the power supply electrode by the output-side power supply pattern. Electrically connected,
(D) The three-terminal electronic component is disposed so as to overlap with the IC in a plan perspective state,
(E) a ground electrode, a ground connection conductor, and a ground-side mounting land include a first power supply conductor, a second power supply conductor, a power electrode, an output-side power supply pattern, an output-side mounting land, and an input-side power supply The supply pattern and the input side mounting land are arranged so as not to face each other,
A multilayer wiring board characterized by (A) Input side mounting land to which the input terminal of the three-terminal type electronic component is connected, output side mounting land to which the output terminal of the three-terminal type electronic component is connected, and output side connected to the output side mounting land A ground side mounting land to which a power supply pattern and a ground terminal of a three-terminal electronic component are connected is provided on the back surface, and a first signal electrode layer for mounting the three-terminal electronic component on the back surface;
A ground electrode layer having a ground electrode on its surface;
A power electrode layer provided with a power electrode on the surface;
The second signal electrode layer on which the IC is mounted on the surface is stacked in the order of the first signal electrode layer, the ground electrode layer, the power supply electrode layer, and the second signal electrode layer to form a laminate,
(B) a plurality of first power supply conductors for connecting the power electrode and the output-side power supply pattern;
A plurality of second power supply conductors for connecting the power electrode and the IC;
A plurality of ground connection conductors for electrically connecting the ground electrode and the ground side mounting land;
Input side power supply pattern connected to the input side mounting land,
A plurality of third power supply conductors for electrically connecting the input-side power supply pattern and the input-side mounting land are provided in the laminate,
(C) The power supply electrode is connected to the output-side mounting land with a plurality of first power supply conductors and the current paths substantially bundled together as viewed from the power supply electrode by the output-side power supply pattern. Electrically connected,
(D) The ground electrode, the ground connection conductor, and the ground side mounting land are the first power supply conductor, the second power supply conductor, the power electrode, the output side power supply pattern, the output side mounting land, and the input side power source. The supply pattern, the input side mounting land and the third power supply conductor are arranged so as not to face each other,
A multilayer wiring board characterized by (A) Input-side mounting land to which the input terminal of the three-terminal electronic component is connected, input-side power supply pattern connected to the input-side mounting land, and output side to which the output terminal of the three-terminal electronic component is connected A mounting land, an output-side power supply pattern connected to the output-side mounting land, and a ground-side mounting land to which a ground terminal of a three-terminal electronic component is connected are provided on the back surface, and the three-terminal electronic component is mounted on the back surface. A first signal electrode layer mounted on
A power electrode layer provided with a power electrode on the surface;
A ground electrode layer having a ground electrode on its surface;
The second signal electrode layer on which the IC is mounted on the surface is stacked in the order of the first signal electrode layer, the power electrode layer, the ground electrode layer, and the second signal electrode layer to form a laminate,
(B) a plurality of first power supply conductors for connecting the power electrode and the output-side power supply pattern;
A plurality of second power supply conductors for connecting the power electrode and the IC;
A plurality of ground connection conductors for electrically connecting the ground electrode and the ground side mounting land are provided in the laminate,
(C) The power supply electrode is connected to the output-side mounting land with a plurality of first power supply conductors and the current paths substantially bundled together as viewed from the power supply electrode by the output-side power supply pattern. Electrically connected,
(D) The first power supply conductor, the second power supply conductor, the power electrode, the output side power supply pattern, and the output side mounting land are not opposed to the input side power supply pattern and the input side mounting land. Being placed,
A multilayer wiring board characterized by

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