JP2007220593A - 有機el表示装置 - Google Patents
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- 238000007789 sealing Methods 0.000 claims abstract description 36
- 230000002093 peripheral effect Effects 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 149
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 239000011575 calcium Substances 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 239000005001 laminate film Substances 0.000 claims description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical group [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910021536 Zeolite Inorganic materials 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical group O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 3
- 239000010457 zeolite Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 101100091498 Arabidopsis thaliana ROS1 gene Proteins 0.000 abstract description 10
- 101150064551 DML1 gene Proteins 0.000 abstract description 10
- 101100331657 Arabidopsis thaliana DML2 gene Proteins 0.000 abstract description 9
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- 239000007789 gas Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 4
- 101100191136 Arabidopsis thaliana PCMP-A2 gene Proteins 0.000 description 3
- 101100048260 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) UBX2 gene Proteins 0.000 description 3
- 101100489584 Solanum lycopersicum TFT1 gene Proteins 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 101100422768 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SUL2 gene Proteins 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PIYVNGWKHNMMAU-UHFFFAOYSA-N [O].O Chemical compound [O].O PIYVNGWKHNMMAU-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】絶縁基板SUBの主面に形成された第1の電極と多層構造の有機EL層と第2の電極とからなる有機発光層OLEを覆って周縁端部が絶縁基板SUBの周縁部に封着された有機フィルムの封止膜CEFを有する。有機発光層OLEの上面および側面を覆って、第1防湿層DML1と吸湿層DSCおよび第2防湿層DML2をこの順で積層された耐湿構造体を備える。有機発光層OLEの側面における第1防湿層DML1と吸湿層DSCおよび第2防湿層DML2は、有機発光層OLEの上面から側面に屈曲し、さらに側面から絶縁基板SUBの主面と平行に屈曲して、それぞれの屈曲した端部の下面が基板SUBの主面に密着して封止されている。
【選択図】図3
Description
前記有機EL層の側面における前記第1防湿層と吸湿層および第2防湿層は、前記有機EL層の上面から前記側面に屈曲し、さらに前記側面から前記絶縁基板の主面と平行に屈曲して、それぞれの屈曲した端部の下面が前記基板の主面に密着していることを特徴とする。
前記第2防湿層と共に、前記第1防湿層と吸湿層が前記接着層により前記基板の主面に固着されていることを特徴とする。
前記第1防湿層が前記第1の接着層で前記基板の主面に固着されていると共に、前記吸湿層と前記第2防湿層が前記第2の接着層により前記基板の主面に固着されていることを特徴とする。
Claims (8)
- 絶縁基板の主面に形成された第1の電極と、該第1の電極の上に形成された多層構造の有機EL層と、該有機EL層の上層に成膜された第2の電極と、該第2の電極を覆って周縁端部が前記絶縁基板の周縁部に封着された封止部材を有し、
前記有機EL層の上面および側面を覆って、第1防湿層と吸湿層および第2防湿層をこの順で積層された耐湿構造体を備え、
前記有機EL層の側面における前記第1防湿層と吸湿層および第2防湿層は、前記有機EL層の上面から前記側面に屈曲し、さらに前記側面から前記絶縁基板の主面と平行に屈曲して、それぞれの屈曲した端部の下面が前記基板の主面に密着していることを特徴とする有機EL表示装置。 - 請求項1に記載の有機EL表示装置において、
前記吸湿層と前記第2防湿層の間に接着層を有し、
前記第2防湿層と共に、前記第1防湿層と吸湿層が前記接着層により前記基板の主面に固着されていることを特徴とする有機EL表示装置。 - 請求項2に記載の表示装置において、
前記第1防湿層が窒化シリコン、前記吸湿層がカルシウム、前記第2防湿層がアルミニウム箔であることを特徴とする有機EL表示装置。 - 請求項1に記載の有機EL表示装置において、
前記有機EL層と前記第1防湿層の間に第1の接着層を有し、前記第1の防湿層と前記吸湿層の間に第2の接着層を有し、
前記第1防湿層が前記第1の接着層で前記基板の主面に固着されていると共に、前記吸湿層と前記第2防湿層が前記第2の接着層により前記基板の主面に固着されていることを特徴とする有機EL表示装置。 - 請求項4に記載の表示装置において、
前記第1防湿層がアルミニウム箔、前記吸湿層がゼオライト(商品名)、前記第2防湿層がアルミニウム箔であることを特徴とする有機EL表示装置。 - 請求項2乃至5の何れかに記載の表示装置において、
前記封止部材がポリエチレンテレフタレートのラミネートフィルムであることを特徴とする有機EL表示装置。 - 請求項2乃至6の何れかに記載の有機EL表示装置において、
前記封止部材の周縁と前記絶縁基板の封着領域にコーキング剤が塗布されていることを特徴とする有機EL表示装置。 - 請求項7に記載の有機EL表示装置において、
コーキング剤がシリコン系防水コーキング剤であることを特徴とする有機EL表示装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006042275A JP4776393B2 (ja) | 2006-02-20 | 2006-02-20 | 有機el表示装置 |
TW096105328A TWI363576B (en) | 2006-02-20 | 2007-02-13 | Organic electroluminescent display deive |
US11/676,615 US7898174B2 (en) | 2006-02-20 | 2007-02-20 | Organic electroluminescent display device with moisture resistant structural body including adhesive layer |
KR1020070017112A KR100883484B1 (ko) | 2006-02-20 | 2007-02-20 | 유기 el 표시 장치 |
CN2007100858489A CN101026228B (zh) | 2006-02-20 | 2007-02-25 | 有机el显示装置 |
Applications Claiming Priority (1)
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JP2006042275A JP4776393B2 (ja) | 2006-02-20 | 2006-02-20 | 有機el表示装置 |
Publications (2)
Publication Number | Publication Date |
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JP2007220593A true JP2007220593A (ja) | 2007-08-30 |
JP4776393B2 JP4776393B2 (ja) | 2011-09-21 |
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JP2006042275A Active JP4776393B2 (ja) | 2006-02-20 | 2006-02-20 | 有機el表示装置 |
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US (1) | US7898174B2 (ja) |
JP (1) | JP4776393B2 (ja) |
KR (1) | KR100883484B1 (ja) |
CN (1) | CN101026228B (ja) |
TW (1) | TWI363576B (ja) |
Cited By (12)
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JP2008181832A (ja) * | 2007-01-26 | 2008-08-07 | Matsushita Electric Works Ltd | 有機エレクトロルミネッセンス発光装置及び有機エレクトロルミネッセンス照明装置 |
JP2011020335A (ja) * | 2009-07-15 | 2011-02-03 | Dainippon Printing Co Ltd | ガスバリア性シート、ガスバリア性シートの製造方法、封止体、及び装置 |
JP2011175239A (ja) * | 2010-02-23 | 2011-09-08 | Anica Corp | フレキシブル表示装置 |
KR101086880B1 (ko) | 2009-05-28 | 2011-11-24 | 네오뷰코오롱 주식회사 | 게터층을 갖는 유기전계발광표시장치 제조방법 |
US8283856B2 (en) | 2007-09-27 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, lighting device, light-emitting device, and electronic device |
US8530060B2 (en) | 2008-05-16 | 2013-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element including first layer, second layer, third layer and fourth layer |
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WO2017043057A1 (ja) * | 2015-09-08 | 2017-03-16 | シャープ株式会社 | 有機el表示装置 |
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JP2019046800A (ja) * | 2017-08-31 | 2019-03-22 | エルジー ディスプレイ カンパニー リミテッド | 封止層を含む有機発光表示装置 |
US11335880B2 (en) | 2017-12-07 | 2022-05-17 | Sony Group Corporation | Flexible display with protector along side surface |
Also Published As
Publication number | Publication date |
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US20070194711A1 (en) | 2007-08-23 |
TWI363576B (en) | 2012-05-01 |
US7898174B2 (en) | 2011-03-01 |
CN101026228B (zh) | 2011-04-06 |
TW200746884A (en) | 2007-12-16 |
KR100883484B1 (ko) | 2009-02-16 |
CN101026228A (zh) | 2007-08-29 |
KR20070083213A (ko) | 2007-08-23 |
JP4776393B2 (ja) | 2011-09-21 |
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