JP2007128952A - Coil body of three-dimensional structure and method of manufacturing same, magnetic sensor and method of manufacturing same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make manufacturing easy, to achieve miniaturization, to reduce manufacturing cost, and to improve product precision. <P>SOLUTION: A coil body 3 in a three-dimensional structure is constituted in such a way that conductors 11 and 18 of insulating layer 7 and 13 can be coupled by repeating a step of forming the insulating layers 7 and 13 on a substrate 2, forming notches 9, 15 and 16 in the insulating layers 7 and 13 at once, and filling the notches 9, 15 and 16 with the conductors 11 and 18 for a plurality of layers. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a coil body having a three-dimensional structure provided so as to surround a core of a magnetic sensor or the like, a manufacturing method thereof, a magnetic sensor, and a manufacturing method thereof.

  Generally, in a magnetic sensor, an antenna, and the like, a coil is provided around a core made of an element that can cause a large Barkhausen jump phenomenon, a superconducting element, or the like. As this type of conventional coil, a coil formed on a substrate in a planar shape and used as a pickup coil is known (for example, see Patent Documents 1, 2, and 3).

  However, such a flat type coil can be effectively used only for a part of the coil, which is uneconomical and difficult to miniaturize, has low sensitivity, and is affected by noise. There was a problem that it was easy. Furthermore, in the conventional method for manufacturing this type of coil by general etching, there is a limit in increasing the thickness of the conductor portion, and there is a problem that it is difficult to reduce impedance.

Therefore, in recent years, in order to solve these problems, a three-dimensional coil body formed in a three-dimensional shape so as to wind a core and a manufacturing method thereof have been proposed (for example, see Patent Document 4).
JP 2001-194181 A JP 2004-325344 A WO2005 / 019776 JP 2005-184099 A

  However, in the conventional coil body having the three-dimensional structure and the manufacturing method thereof, it is necessary to form the groove and the through-hole separately on the substrate in order to form the three-dimensional coil. There was a problem that it took time and it was difficult to reduce the manufacturing cost.

  In addition, since the number of manufacturing steps is large and the manufacturing work is complicated, it is difficult to improve the product accuracy, and there is a limit to downsizing the product.

  The present invention has been made to solve the above-described problems, and is a coil body having a three-dimensional structure that is easy to manufacture, can be reduced in size, can reduce manufacturing costs, and can improve product accuracy. It is an object of the present invention to provide a magnetic sensor and a manufacturing method thereof.

  In order to solve the above-described object, a coil body having a three-dimensional structure according to the present invention is formed by forming an insulating layer on a substrate, forming a notch in the insulating layer at once, and then filling the notch with a conductor. By repeating the step of performing over a plurality of layers, the conductors of the respective insulating layers can be connected to each other.

  The insulating layer may be a heat-soluble resist, and the notch may be formed by pressing a heated mold onto the insulating layer.

  The insulating layer may be a positive resist, and the notch may be formed by irradiating the insulating layer with light through a mask.

  Further, the insulating layer may be a photopolymerization reactive fluid resist, and the cutout portion may be formed by pressing a room temperature mold onto the insulating layer.

  The method for manufacturing a coil body having a three-dimensional structure according to the present invention includes a step of forming an insulating layer on a substrate, forming a notch in the insulating layer at once, and then filling the notch with a conductor. By repeating the process over a plurality of layers, the conductors of the respective insulating layers are connected to each other.

  And the said notch may be formed in the said insulating layer by pressing the type | mold heated with respect to the insulating layer which consists of a heat-soluble resist.

  Further, the notch may be formed in the insulating layer by irradiating light through a mask to the insulating layer made of a positive resist.

  Furthermore, the notch portion may be formed in the insulating layer by pressing a mold at room temperature against the insulating layer made of a photopolymerizable reactive resist.

  Furthermore, in the magnetic sensor according to the present invention, an insulating layer is formed on a substrate, a notch is formed in the insulating layer at a time, and a step of filling the notch with a conductor is repeated over a plurality of layers. In the meantime, by performing the step of arranging the core on another insulating layer, the core can be arranged inside the coil body having a three-dimensional structure.

  Furthermore, in the method for manufacturing a magnetic sensor according to the present invention, the step of forming an insulating layer on a substrate, forming a notch in the insulating layer at once, and then filling the notch with a conductor is made into a plurality of layers. While repeatedly performing the process, a step of arranging the core on another insulating layer is performed, and the core is arranged inside the coil body having a three-dimensional structure.

  According to the present invention, since a notch can be formed at a time for each insulating layer, the manufacturing work of the coil body and magnetic sensor having a three-dimensional structure is simplified, and the manufacturing cost can be reduced. Further, as the man-hours are reduced, the product accuracy can be increased, integration can be achieved, and mass production of the product can be achieved.

  Furthermore, since the entire coil body can be used effectively, the product can be downsized, noise can be reduced, and sensitivity can be increased. Furthermore, since the cross-sectional area of the coil body can be widened by adopting a three-dimensional structure, it is possible to reduce the impedance and increase the degree of freedom in designing the magnetic sensor. Effects can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, a three-dimensional coil body and a magnetic sensor according to an embodiment of the present invention will be described with reference to FIG. Here, FIG. 1 is a perspective view showing a coil body having a three-dimensional structure and a magnetic sensor according to an embodiment of the present invention.

  The magnetic sensor 1 includes a flat substrate 2, a coil body 3 having a three-dimensional structure vertically formed on the substrate 2, and a thin plate core formed inside the coil body 3. 4.

  The substrate 2 is made of, for example, silicon or glass, and the coil body 3 having a three-dimensional structure is made of, for example, copper. The first connection terminal portion 5 and the second connection terminal portion 6 are provided at both ends of the coil body 3. Each is formed. In addition to the magnetic material, the core 4 may be an element that can cause a large Barkhausen jump phenomenon, a superconducting element, a magnetoresistive element, a Hall element, or the like.

  Next, a method for manufacturing a three-dimensional coil body and a magnetic sensor according to the first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 2 to FIG. 18 are perspective views showing respective steps of the manufacturing method of the coil body having a three-dimensional structure and the magnetic sensor according to the first embodiment of the present invention.

  First, a heat-soluble resist is applied as an insulating layer on the substrate 2 of FIG. 2 to form a lower layer 7 as shown in FIG. 3, and the lower layer 7 is heated to the lower layer of FIG. 4 from above. The mold 8 is pressed as shown in FIG. In this state, after the lower layer mold 8 and the lower layer 7 are cooled, as shown in FIG. 6, the lower layer mold 8 is removed from the lower layer 7 and a groove 9 is formed in the lower layer 7 as a notch at a time.

  Then, as shown in FIG. 7, after copper plating on the lower layer 7 and filling the groove 9 with a copper material, as shown in FIG. 8 and FIG. 11 is formed. As shown in FIG. 10, a resist is applied as an insulating layer on the lower layer 7 on which the lower-layer-side conductor 11 is formed in this way, an intermediate layer 12 is formed, and the core 4 is formed on the intermediate layer 12 ( FIG. 11).

  Next, on the intermediate layer 12 on which the core 4 is formed, a resist is applied as an insulating layer as shown in FIG. 12 to form an upper layer 13, and the upper layer 13 is heated from above by the heating shown in FIG. The formed upper layer mold 14 is pressed as shown in FIG. In this state, after cooling the upper layer mold 14 and the upper layer 13, as shown in FIG. 15, the upper layer mold 14 is removed from the upper layer 13, and the grooves 15 and the through holes 16 are formed in the upper layer 13 as notches at a time. Form.

  Then, as shown in FIG. 16, after copper plating on the upper layer 13 and filling the groove 15 and the through hole 16 with a copper material, as shown in FIGS. 17 and 18, the unnecessary portion 17 of the plating portion is removed, The upper layer side conductor 18 having the first and second connection terminal portions 5 and 6 is formed.

  As a result, the connecting portion 19 is formed by the copper material filled in the through-hole 16, and the upper layer side conductor 18 and the lower layer side conductor 11 are connected by the connecting portion 19, and the coil body having the three-dimensional structure shown in FIG. 3 and the magnetic sensor 1 are formed.

  Next, a method for manufacturing a coil body having a three-dimensional structure and a magnetic sensor according to the second embodiment of the present invention will be described mainly with reference to FIGS. 19 to 24, 25, and 26. Here, FIG. 19 to FIG. 24 are perspective views showing respective steps of the manufacturing method of the coil body and magnetic sensor having a three-dimensional structure according to the second embodiment of the present invention, and FIG. 25 is the present embodiment. FIG. 26 is a plan view showing a first upper layer mask used in the method for manufacturing a three-dimensional structure coil body and magnetic sensor according to FIG. 26, and FIG. 26 is used in the method for manufacturing a three-dimensional structure coil body and magnetic sensor according to the present embodiment. It is a top view which shows a 2nd upper layer mask. In the following description, for simplification of description, the same manufacturing process as in the case of the above-described first embodiment is the same as the drawing used in the description of the above-described first embodiment. Drawings and FIGS. 2, 3, 7 to 12, and 16 to 18 are used, and detailed explanations of these steps are omitted.

First, as shown in FIG. 3, a positive resist of a type in which the notch depth can be controlled by changing the light irradiation time is applied as an insulating layer on the substrate 2 of FIG. As shown in FIG. 19, a lower layer mask 21 is set above the lower layer 7, and X-rays are irradiated from above the lower layer mask 21 toward the lower layer 7. Since the hole 23 is formed in the lower layer mask 21 corresponding to the coil pattern of the lower layer side conductor 22, the X-ray irradiates the lower layer 7 through the hole 23, and the lower layer 7 is notched into the lower layer 7 by one irradiation. A groove 24 is formed as a portion.

  And like the case of the above-mentioned 1st Embodiment, as shown in FIGS. 7-12, while forming the lower layer side conductor 11 in the lower layer 7, and forming the core 4 in the intermediate layer 12, An upper layer 13 is further formed on the intermediate layer 12.

  Next, as shown in FIG. 21, the first upper layer mask 25 and the second upper layer mask 26 are superposed and set above the upper layer 13 so that the second upper layer mask 26 is positioned above the first upper layer mask 25. To do.

  In this case, as shown in FIG. 25, a plurality of (17 in FIG. 25) slit holes 27 are opened in the first upper layer mask 25 in an obliquely parallel manner corresponding to the coil pattern. A rectangular hole 28a is opened at the end of the slit hole 27 on one side (left side in FIG. 25) corresponding to the first connection terminal portion 5, and the slit hole 27 on the other side (right side in FIG. 25) A rectangular hole 28 b corresponding to the second connection terminal portion 6 is opened at the end of the straight hole 29 extending from the end toward one end so as to cross the outside of each slit hole 27. Yes.

  On the other hand, in the second upper layer mask 26, as shown in FIG. 26, slit holes 30 are opened at positions corresponding to the slit holes 27 of the first upper layer mask 25, respectively. The opening widths of both end portions 30a and 30b of each slit hole 30 are wider than the opening width of the slit hole 27 of the first upper layer mask 25, and the opening width of the hole 30c between the both end portions is the first upper layer mask. It is narrower than the opening width of the 25 slit holes 27 and is set to 1/3 the width of the slit hole 27. In addition, small holes 31a, 31b, and 32 are discontinuously opened at predetermined intervals in the second upper layer mask 26 at positions corresponding to the rectangular holes 28a, 28b and the straight holes 29 of the first upper layer mask 25, respectively. The opening width of each small hole 31a, 31b and 32 is the same as the opening width of the hole 30c between both ends of the slit hole 30 and is ½ of the width between each small hole 31a, 31b and 32. Is set to

  Then, X-rays are irradiated from above the first and second upper layer masks 25 and 26 set by polymerization in this manner toward the upper layer 13 as shown in FIG. Thereafter, as shown in FIGS. 23 and 24, the second upper layer mask 26 is placed on the first upper layer mask 25 by the opening width of the holes 30 c between both ends of the slit holes 30 of the second upper layer mask 26. The direction is shifted (in the direction of the arrow in the figure), and X-rays are irradiated for a predetermined time in each state. As a result, the X-ray irradiation time for the upper layer 13 is such that the portion 33 corresponding to both end portions 30a and 30b of the slit hole 30 of the second upper layer mask 26 corresponds to the other holes 30c and small holes 31a, 31b and 32. Therefore, the through holes and the grooves having different depths are formed in the portions 33 corresponding to both end portions 30a and 30b, the holes 30c, and the portions 34 corresponding to the small holes 31 and 32 at a time. The

  Then, as in the case of the first embodiment described above, as shown in FIGS. 16 to 18, the upper layer side conductor 18 is formed, and the upper layer side conductor 18 and the lower layer side conductor 11 are formed by the connecting portion 19. Are connected to form the three-dimensional coil body 3 and the magnetic sensor 1 shown in FIG.

  Note that the shapes and numbers of the lower layer mask 21, the first upper layer mask 25, and the second upper layer mask 26 used in the above-described second embodiment are merely examples, and depending on the coil pattern formed in the insulating layer. Various changes are possible.

  Next, a manufacturing method of a coil body having a three-dimensional structure and a magnetic sensor according to a third embodiment of the present invention will be described with reference to FIGS. In the following description, the same drawings as those used in the description of the first embodiment described above will be used and will be described with reference to FIGS. 2 to 18, and the same as in the case of the first embodiment described above. Detailed description of the manufacturing process is omitted for the sake of simplicity.

  First, as shown in FIG. 3, a photopolymerization reactive fluid resist is applied as an insulating layer on the substrate 2 of FIG. 2 to form a lower layer 7, and the light of FIG. 4 is applied to the lower layer 7. A transmissive room temperature lower layer mold 8 is set as shown in FIG. 5, and light is irradiated from above. As a result, the lower layer 7 is cured, and then, as shown in FIG. 6, the lower layer mold 8 is removed from the lower layer 7, and a groove 9 is formed in the lower layer 7 as a notch at a time.

  Thereafter, as in the case of the first embodiment described above, as shown in FIGS. 7 to 12, the lower layer side conductor 11 is formed on the lower layer 7, and the core 4 is formed on the intermediate layer 12. An upper layer 13 is further formed on the intermediate layer 12.

  Next, as shown in FIG. 13, a normal temperature upper layer mold 14 capable of transmitting the light of FIG. 13 is set on the upper layer 13 as shown in FIG. 14, and light is irradiated from above. As a result, the upper layer 13 is cured, and then, as shown in FIG. 15, the upper layer mold 14 is removed from the upper layer 13, and the grooves 15 and the through holes 16 are formed in the upper layer 13 as notches at a time.

  Then, as in the case of the first embodiment described above, as shown in FIGS. 16 to 18, the upper layer side conductor 18 is formed, and the upper layer side conductor 18 and the lower layer side conductor 11 are formed by the connecting portion 19. Are connected to form the three-dimensional coil body 3 and the magnetic sensor 1 shown in FIG.

  Thus, according to each of the above-described embodiments, notches such as grooves and through-holes having different depths can be formed at a time for each insulating layer, so that the coil body and the magnetic sensor of the three-dimensional structure can be formed. The manufacturing operation is simplified, and the manufacturing cost can be reduced. Further, along with the reduction in the number of manufacturing steps, the product accuracy can be increased and the integration can be performed, so that the mass production of the product can be easily performed. Furthermore, since the entire coil body can be used effectively, the product can be reduced in size, noise can be reduced, and sensitivity can be increased. Furthermore, since the cross-sectional area of the coil body can be increased by using a three-dimensional structure, the impedance can be reduced and the degree of freedom in designing the magnetic sensor can be increased.

  In each of the above-described embodiments, the core 4 and the intermediate layer 12 are provided. However, this is merely an example, and the present invention is applied to the coil body 3 without the core 4 and the intermediate layer 12. Is also possible.

It is a perspective view which shows the coil body and magnetic sensor of a three-dimensional structure which concern on embodiment of this invention. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body and magnetic sensor of the three-dimensional structure which concern on 1st Embodiment of this invention. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 1st Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 2nd Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 2nd Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 2nd Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 2nd Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 2nd Embodiment of this invention, and a magnetic sensor. It is a perspective view which shows the manufacturing method of the coil body of a three-dimensional structure which concerns on the 2nd Embodiment of this invention, and a magnetic sensor. It is a top view which shows the 1st upper layer mask used in the manufacturing method of the coil body and magnetic sensor of the three-dimensional structure which concern on the 2nd Embodiment of this invention. It is a top view which shows the 2nd upper layer mask used in the manufacturing method of the coil body of the three-dimensional structure which concerns on the 2nd Embodiment of this invention, and a magnetic sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Magnetic sensor 2 Board | substrate 3 Coil body of three-dimensional structure 4 Core 7 Lower layer 8 Upper layer type 9 Groove 11 Lower layer side conductor 13 Upper layer 14 Upper layer type 15 Groove 16 Through-hole 18 Upper layer side conductor 21 Lower layer mask 25 First upper layer Mask 26 Second upper layer mask

Claims (10)

After forming an insulating layer on the substrate and forming a notch in the insulating layer at once, the step of filling the notch with a conductor is repeated over a plurality of layers, whereby the conductor of each insulating layer A coil body having a three-dimensional structure, characterized in that the coils can be connected to each other. The coil body having a three-dimensional structure according to claim 1, wherein the insulating layer is a heat-soluble resist, and the notch can be formed by pressing a heated mold onto the insulating layer. 2. The coil body having a three-dimensional structure according to claim 1, wherein the insulating layer is a positive resist, and the notch can be formed by irradiating the insulating layer with light through a mask. The insulating layer is a photopolymerization-reactive fluidized resist, and the cutout portion can be formed by irradiating light in a state where a light transmissive mold is set on the insulating layer. A coil body having a three-dimensional structure according to 1. After forming an insulating layer on the substrate and forming a notch in the insulating layer at once, the step of filling the notch with a conductor is repeated over a plurality of layers, whereby the conductor of each insulating layer A manufacturing method of a coil body having a three-dimensional structure, characterized in that they are connected to each other. The coil body having a three-dimensional structure according to claim 6, wherein the notch is formed in the insulating layer by pressing a heated die against the insulating layer made of a heat-soluble resist. The coil body having a three-dimensional structure according to claim 6, wherein the notched portion is formed in the insulating layer by irradiating light to the insulating layer made of a positive resist through a mask. The three-dimensional structure according to claim 6, wherein the notched portion is formed in the insulating layer by irradiating light with a mold capable of transmitting light set on the insulating layer made of a photopolymerizable fluid resist. Coil body. An insulating layer is formed on a substrate, a notch is formed in the insulating layer at a time, and a process of filling the notch with a conductor is repeated over a plurality of layers, and then a core is formed on another insulating layer. A magnetic sensor characterized in that a core can be arranged inside a coil body having a three-dimensional structure by performing a step of arranging a coil. An insulating layer is formed on a substrate, a notch is formed in the insulating layer at a time, and a process of filling the notch with a conductor is repeated over a plurality of layers, while a core is formed on another insulating layer. A method for manufacturing a magnetic sensor, comprising: arranging a core inside a coil body having a three-dimensional structure.

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