JP2007114342A - Substrate for electronic device, method for manufacturing substrate for electronic device, liquid crystal panel, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for an electronic device, equipped with an inorganic alignment layer which is excellent in durability (light resistance) and excellent, for example, in a function to control an alignment state of liquid crystal molecules, a method for manufacturing the substrate for the electronic device, a highly reliable liquid crystal panel and a highly reliable electronic apparatus. <P>SOLUTION: The liquid crystal panel 1 has: a TFT substrate 17; an inorganic alignment layer 3 bonded to an inside surface of the TFT substrate 17; a counter substrate 12 for the liquid crystal panel; an inorganic alignment layer 4 bonded to an inside surface of the counter substrate 12 for the liquid crystal panel; a liquid crystal layer 2 containing the liquid crystal molecules which are sealed in a gap between the inorganic alignment layers 3 and 4; a polarizing film 7 bonded to an outside surface of the TFT substrate 17; and a polarizing film 8 bonded to an outside surface of the counter substrate 12 for the liquid crystal panel. The inorganic alignment layers 3 and 4 are respectively constituted with a plurality of prismatic inorganic particles which are disposed nearly in parallel to the inside surface of the TFT substrate 17 or that of the counter substrate 12 for the liquid crystal panel and further in such a way that their long axes are oriented to a nearly fixed direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic device substrate, a method for manufacturing an electronic device substrate, a liquid crystal panel, and an electronic apparatus.

In recent years, various liquid crystal display elements (liquid crystal panels) have been put into practical use in liquid crystal televisions (direct-view display devices), liquid crystal projectors (projection display devices), and the like.
As a vertical alignment film used in these liquid crystal display elements, for example, an organic alignment film such as polyimide is used in a liquid crystal television. In addition, oblique deposition films (inorganic alignment films) such as SiO ₂ are frequently used in liquid crystal projectors.

Among these, the polyimide organic alignment film can be obtained by rubbing the surface after forming the polyimide film. However, there is a problem that the alignment process by the rubbing process tends to be relatively non-uniform.
Further, since the obliquely deposited film has a large number of pores, there is a problem that moisture or the like enters the liquid crystal layer through the pores, and the liquid crystal layer is easily deteriorated or deteriorated. Further, when the substrate is increased in size, there is a problem that it is difficult to form a uniform and homogeneous oblique vapor deposition film in each part.

In addition, it has been proposed to use a stretched polymer film as the other alignment film (see, for example, Patent Document 1).
This alignment film is obtained by stretching a polymer ferroelectric liquid crystal formed into a film to align its molecular chain in one direction.
However, since the alignment film is made of an organic material, there is a problem that the light resistance is low and the function of regulating the alignment state of the liquid crystal molecules deteriorates with time.

Japanese Patent Laid-Open No. 7-84263

  An object of the present invention is excellent in durability (light resistance) and, for example, for an electronic device substrate provided with an inorganic alignment film having an excellent function of regulating the alignment state of liquid crystal molecules, and for an electronic device for producing such an electronic device substrate It is an object to provide a substrate manufacturing method, a highly reliable liquid crystal panel, and an electronic device.

Such an object is achieved by the present invention described below.
The electronic device substrate of the present invention is an electronic device substrate having a substrate and an inorganic alignment film provided on one surface side of the substrate,
The inorganic alignment film is characterized by being composed of a plurality of prismatic inorganic particles arranged so as to be substantially parallel to one surface of the substrate and to have a major axis in a substantially constant direction.
Thereby, while being excellent in durability (light resistance), the board | substrate for electronic devices provided with the inorganic alignment film which is excellent in the function which regulates the orientation (vertical orientation or horizontal orientation) state of a liquid crystal molecule, for example is obtained.

In the electronic device substrate of the present invention, the aspect ratio of the inorganic particles is preferably 0.03 to 0.5.
By using the inorganic particles having such dimensions, the molecular anisotropy caused by the corners of the inorganic particles can be increased. For example, the regulation (control) of the alignment state of the liquid crystal molecules is ensured. An inorganic alignment film that can be obtained is obtained.

In the electronic device substrate of the present invention, the number of the inorganic particles disposed on one surface side of the substrate is preferably 2 × 10 ⁹ to 2 × 10 ¹³ particles / cm ² .
A sufficient number of corners of the inorganic particles appear on the surface of the inorganic alignment film opposite to the substrate. For this reason, for example, liquid crystal molecules are more reliably aligned (vertical alignment) in such an inorganic alignment film.
In the electronic device substrate of the present invention, it is preferable that the inorganic particles are composed mainly of SiO ₂ or Al ₂ O ₃ .
SiO ₂ and Al ₂ O ₃ are preferable because they have a particularly low dielectric constant and high durability (light stability).

The electronic device substrate manufacturing method of the present invention is a method of manufacturing the electronic device substrate,
A first step of preparing a sheet containing the resin material and the inorganic particles;
A second step of stretching the sheet and orienting the inorganic particles in the stretching direction;
A third step of attaching the sheet to one surface side of the substrate;
And a fourth step of obtaining the inorganic alignment film by removing the resin material, transferring the inorganic particles to the substrate side, and fixing the inorganic particles to the substrate side. To do.
Thereby, while being excellent in durability (light resistance), the board | substrate for electronic devices provided with the inorganic alignment film which is excellent in the function which controls the orientation (especially vertical alignment) state of a liquid crystal molecule, for example can be manufactured.

In the method for manufacturing an electronic device substrate of the present invention, the inorganic particles are preferably obtained by pulverizing an inorganic film formed by oblique deposition.
According to such a method, inorganic particles can be produced easily, reliably and with a good yield.
In the method for manufacturing an electronic device substrate of the present invention, in the fourth step, it is preferable to perform a fixing process in which the inorganic particles are fixed to the substrate side with a fixing agent.
As a result, the inorganic particles can be securely fixed to the substrate and the inorganic alignment film can be prevented from being peeled off from the substrate.

In the method for manufacturing an electronic device substrate of the present invention, it is preferable that the fixing agent has a function of connecting the inorganic particles.
Thereby, inorganic particles can be connected reliably and the mechanical strength of an inorganic alignment film can be improved.
In the method for manufacturing an electronic device substrate according to the present invention, it is preferable that the fixing agent contains a coupling agent as a main component.
The coupling agent is preferable because the same molecule can perform both functions of fixing the inorganic particles on the substrate and connecting the inorganic particles.

In the electronic device substrate manufacturing method of the present invention, in the fourth step, the fixing process is preferably performed by heating.
Thereby, for example, the fixing process and the removal of the resin material can be performed collectively.
In the method for manufacturing an electronic device substrate of the present invention, the sheet contains the fixing agent,
In the fourth step, it is preferable that the fixing process and the removal of the resin material are collectively performed by heating.
As a result, the number of steps for forming the inorganic alignment film can be reduced.
In the method for manufacturing an electronic device substrate of the present invention, in the fourth step, the resin material is preferably removed by decomposition, dissolution, or peeling.
According to these methods, the resin material can be removed easily and reliably.

The liquid crystal panel of the present invention includes an electronic device substrate of the present invention,
And a liquid crystal layer provided on the opposite side of the inorganic alignment film from the substrate.
Thereby, a highly reliable liquid crystal panel is obtained.
An electronic apparatus according to the present invention includes the liquid crystal panel according to the present invention.
Thereby, a highly reliable electronic device can be obtained.

Hereinafter, the substrate for electronic devices, the method for manufacturing the substrate for electronic devices, the liquid crystal panel, and the electronic apparatus of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a longitudinal sectional view schematically showing an embodiment of the liquid crystal panel of the present invention, and FIG. 2 is a perspective view schematically showing an enlarged inorganic alignment film provided in the liquid crystal panel shown in FIG. In FIG. 1, the description of the sealing material, the wiring, etc. is omitted. In the following description, the upper side in FIGS. 1 and 2 is referred to as “upper” and the lower side is referred to as “lower”.

  A liquid crystal panel (TFT liquid crystal panel) 1 shown in FIG. 1 includes a TFT substrate (liquid crystal driving substrate) 17, an inorganic alignment film 3 bonded to the inner surface (lower surface) of the TFT substrate 17, a liquid crystal panel counter substrate 12, , An inorganic alignment film 4 bonded to the inner surface (upper surface) of the counter substrate 12 for liquid crystal panel, a liquid crystal layer 2 containing liquid crystal molecules sealed in a gap between the inorganic alignment film 3 and the inorganic alignment film 4, and a TFT The polarizing film 7 is bonded to the outer surface (upper surface) side of the substrate (liquid crystal driving substrate) 17 and the polarizing film 8 is bonded to the outer surface (lower surface) side of the counter substrate 12 for liquid crystal panel.

The counter substrate 12 for the liquid crystal panel is provided on the microlens substrate 11, the surface layer 114 of the microlens substrate 11, the black matrix 13 in which the opening 131 is formed, and the black matrix 13 on the surface layer 114 so as to cover the black matrix 13. A transparent conductive film (common electrode) 14.
The microlens substrate 11 includes a substrate 111 with a microlens recess provided with a plurality of (many) recesses (microlens recesses) 112 having a concave curved surface, and a recess 112 of the substrate 111 with a microlens recess. And a surface layer 114 bonded to the other surface via a resin layer (adhesive layer) 115.

In the resin layer 115, the microlens 113 is formed of a resin filled in the recess 112.
The substrate with concave portions for microlenses 111 is manufactured from a flat base material (transparent substrate), and a plurality of (many) concave portions 112 are formed on the surface thereof.
The recess 112 can be formed by, for example, a dry etching method, a wet etching method, or the like using a mask.

The substrate with concave portions 111 for microlenses is made of glass, for example.
The thermal expansion coefficient of the base material is preferably approximately the same as the thermal expansion coefficient of the glass substrate 171 (for example, the ratio of the thermal expansion coefficients of the two is about 1/10 to 10). As a result, in the liquid crystal panel 1 obtained, warpage, deflection, peeling, and the like caused by the difference in thermal expansion coefficient between the two when the temperature changes are prevented.

From this point of view, it is preferable that the substrate 111 with concave portions for microlenses and the glass substrate 171 are made of the same type of material. This effectively prevents warpage, deflection, peeling, and the like due to differences in the thermal expansion coefficient when the temperature changes.
In particular, for the TFT substrate 17 to be described later, quartz glass whose characteristics are not easily changed by the environment during manufacture is preferably used. For this reason, it is preferable that the substrate 111 with concave portions for microlenses is made of quartz glass correspondingly. As a result, it is possible to obtain the liquid crystal panel 1 that is less likely to be warped or bent and has excellent stability.

A resin layer (adhesive layer) 115 that covers the recess 112 is provided on the upper surface of the substrate with recesses 111 for microlenses.
The concave portion 112 is filled with the constituent material of the resin layer 115 to form the microlens 113.
The resin layer 115 can be made of, for example, a resin (adhesive) having a refractive index higher than the refractive index of the constituent material of the substrate 111 with concave portions for microlenses. For example, acrylic resin, epoxy resin, acrylic epoxy It can be suitably configured with an ultraviolet curable resin or the like.

A flat surface layer 114 is provided on the upper surface of the resin layer 115.
The surface layer (glass layer) 114 can be made of glass, for example. In this case, it is preferable that the thermal expansion coefficient of the surface layer 114 is substantially equal to the thermal expansion coefficient of the substrate 111 with concave portions for microlenses (for example, the ratio of the thermal expansion coefficients of the two is about 1/10 to 10). As a result, warpage, deflection, peeling, and the like caused by the difference in thermal expansion coefficient between the substrate 111 with concave portions for microlenses and the surface layer 114 are prevented. Such an effect can be more effectively obtained when the substrate with concave portions for microlenses 111 and the surface layer 114 are made of the same material.

The average thickness of the surface layer 114 is generally about 5 to 1000 μm, more preferably about 10 to 150 μm, from the viewpoint of obtaining necessary optical characteristics.
In addition, the surface layer (barrier layer) 114 can also be comprised, for example with ceramics. Examples of ceramics include nitride ceramics such as AlN, SiN, TiN, and BN, oxide ceramics such as Al ₂ O ₃ and TiO ₂ , and carbide ceramics such as WC, TiC, ZrC, and TaC. Can be mentioned.

When the surface layer 114 is made of ceramics, the average thickness of the surface layer 114 is not particularly limited, but is preferably about 20 nm to 20 μm, and more preferably about 40 nm to 1 μm.
Such a surface layer 114 can be omitted if necessary.
The black matrix 13 has a light blocking function and is made of, for example, a metal such as Cr, Al, Al alloy, Ni, Zn, Ti, or a resin in which carbon, titanium, or the like is dispersed.

The transparent conductive film 14 has conductivity and is made of, for example, indium tin oxide (ITO), indium oxide (IO), tin oxide (SnO ₂ ), or the like.
The TFT substrate 17 is a substrate that drives (alignment control) the liquid crystal molecules contained in the liquid crystal layer 2. The TFT substrate 17 is provided on the glass substrate 171 and the glass substrate 171, and is arranged in a matrix (matrix). It has (many) pixel electrodes 172 and a plurality (many) thin film transistors (TFTs) 173 corresponding to the pixel electrodes 172.

The glass substrate 171 is preferably made of quartz glass for the reasons described above.
The pixel electrode 172 drives the liquid crystal molecules of the liquid crystal layer 2 by charging and discharging with the transparent conductive film (common electrode) 14. The pixel electrode 172 is made of, for example, the same material as that of the transparent conductive film 14 described above.

The thin film transistor 173 is connected to the corresponding pixel electrode 172 in the vicinity. The thin film transistor 173 is connected to a control circuit (not shown) and controls a current supplied to the pixel electrode 172. Thereby, charging / discharging of the pixel electrode 172 is controlled.
A polarizing film (polarizing plate, polarizing film) 7 is disposed on the outer surface (upper surface in FIG. 1) side of the TFT substrate 17. Similarly, a polarizing film (polarizing plate, polarizing film) 8 is disposed on the outer surface (lower surface in FIG. 1) side of the counter substrate 12 for liquid crystal panel.

Examples of the constituent material of the polarizing films 7 and 8 include polyvinyl alcohol (PVA). Moreover, as a polarizing film, you may use what doped the said material with iodine.
As a polarizing film, what extended | stretched the film comprised with the said material to the uniaxial direction can be used, for example.
By disposing the polarizing films 7 and 8 as described above, it is possible to more reliably control the light transmittance by adjusting the energization amount.

The direction of the polarization axis of the polarizing films 7 and 8 is usually determined according to the alignment direction of the inorganic alignment films 3 and 4 (in the present embodiment, when a voltage is applied).
Further, the TFT substrate 17 is provided with the inorganic alignment film 3 bonded to the inner surface of the pixel electrode 172, and the liquid crystal panel counter substrate 12 is bonded to the inner surface of the transparent conductive film 14 to be bonded to the inorganic alignment film 4. Is provided.

In the present embodiment, the TFT substrate 17 and the inorganic alignment film 3, and the liquid crystal panel counter substrate 12 and the inorganic alignment film 4 constitute the electronic device substrate of the present invention.
The liquid crystal layer 2 is interposed (provided) between the inorganic alignment film 3 and the inorganic alignment film 4. The liquid crystal layer 2 contains liquid crystal molecules (liquid crystal material), and the alignment of the liquid crystal molecules changes in accordance with charge / discharge of the pixel electrode 172.

Examples of liquid crystal molecules include phenylcyclohexane derivatives, biphenyl derivatives, biphenylcyclohexane derivatives, terphenyl derivatives, phenyl ether derivatives, phenyl ester derivatives, bicyclohexane derivatives, azomethine derivatives, azoxy derivatives, pyrimidine derivatives, dioxane derivatives, cubane derivatives, These derivatives include those obtained by introducing a fluorine-based substituent such as a fluoro group, a trifluoromethyl group, a trifluoromethoxy group, and a difluoromethoxy group.
In addition, as a liquid crystal molecule suitable for vertical alignment, the compound etc. which are represented by following Chemical formula 1-Chemical formula 3 etc. are mentioned, for example.

［式中、環Ａ〜Ｉは、それぞれ独立して、シクロヘキサン環またはベンゼン環を示し、Ｒ^１〜Ｒ^６は、それぞれ独立して、アルキル基、アルコキシ基またはフッ素原子のいずれかを示し、Ｘ^１〜Ｘ^１８は、それぞれ独立して、水素原子またはフッ素原子を示す。］

[Wherein, Rings A to I each independently represent a cyclohexane ring or a benzene ring, R ^{1 to} R ⁶ each independently represent an alkyl group, an alkoxy group or a fluorine atom, and X ^{1 to} X ¹⁸ each independently represent a hydrogen atom or a fluorine atom. ]

The inorganic alignment films (vertical alignment films or horizontal alignment films) 3 and 4 have a function of regulating the alignment state (when no voltage is applied) of the liquid crystal molecules contained in the liquid crystal layer 2.
The configuration of the inorganic alignment films 3 and 4 will be described in detail later.
In such a liquid crystal panel 1, normally, one microlens 113, one opening 131 of the black matrix 13 corresponding to the optical axis Q of the microlens 113, one pixel electrode 172, and such a pixel One thin film transistor 173 connected to the electrode 172 corresponds to one pixel.

Incident light L incident from the liquid crystal panel counter substrate 12 side passes through the microlens concave substrate 111 and is condensed when passing through the microlens 113, while opening the resin layer 115, the surface layer 114, and the black matrix 13. 131, the transparent conductive film 14, the liquid crystal layer 2, the pixel electrode 172, and the glass substrate 171 are transmitted.
At this time, since the polarizing film 8 is provided on the incident side of the microlens substrate 11, the incident light L is linearly polarized when the incident light L passes through the liquid crystal layer 2.

At this time, the polarization direction of the incident light L is controlled in accordance with the alignment state of the liquid crystal molecules in the liquid crystal layer 2. Therefore, by transmitting the incident light L transmitted through the liquid crystal panel 1 to the polarizing film 7, the luminance of the emitted light can be controlled.
As described above, the liquid crystal panel 1 includes the microlens 113, and the incident light L that has passed through the microlens 113 is collected and passes through the openings 131 of the black matrix 13.

On the other hand, the incident light L is shielded in a portion where the opening 131 of the black matrix 13 is not formed. Therefore, in the liquid crystal panel 1, unnecessary light is prevented from leaking from portions other than the pixels, and attenuation of the incident light L at the pixel portions is suppressed. For this reason, the liquid crystal panel 1 has a high light transmittance in the pixel portion.
Now, as shown in FIG. 2, the inorganic alignment films 3 and 4 are substantially parallel to the inner surface (surface on which the inorganic alignment films 3 and 4 are provided) of the TFT substrate 17 or the liquid crystal panel counter substrate 12, respectively. It is composed of a plurality of prismatic inorganic particles 5 arranged (uniaxially oriented) so that the major axis is oriented in a substantially constant direction.

Since the inorganic alignment films 3 and 4 are the same, the inorganic alignment film 3 will be described as a representative.
Here, the inorganic particles 5 are uniaxially oriented, as shown in FIG. 2, that the major axes of the majority of the inorganic particles 5 are oriented in substantially the same direction (the average of the major axes of the inorganic particles 5). The plurality of inorganic particles 5 may include inorganic particles 5 whose major axis direction is different from the majority of the particles.

Thus, the inorganic alignment film 3 has a high structural regularity because the inorganic particles 5 are regularly arranged.
With such a configuration, the liquid crystal molecules contained in the liquid crystal layer 2 are easily aligned vertically or horizontally depending on the type. Therefore, the inorganic alignment film 3 having such a configuration is useful for construction of a VA (Vertical Alignment) type or IPS (In Plane Switching) type liquid crystal panel.

In addition, since the inorganic alignment film 3 has high structural regularity, the alignment direction of the liquid crystal molecules is more accurately aligned in a certain direction (vertical direction or horizontal direction). As a result, the performance (characteristics) of the liquid crystal panel 1 can be improved.
In particular, when a sharp portion (corner portion) exists in the liquid crystal molecule, the liquid crystal molecules are easily aligned at the portion. However, in the present invention, the corner portion of the inorganic particles 5 appears on the upper surface side of the inorganic alignment film 3, so The molecular orientation is further improved.

The inorganic particles 5 are preferably composed of an inorganic oxide as a main material. In general, inorganic materials have superior chemical stability (light stability) compared to organic materials. For this reason, the inorganic alignment film 3 composed of an aggregate of inorganic particles 5 has particularly excellent light resistance as compared with the alignment film composed of an organic material.
In addition, the inorganic oxide constituting the inorganic particles 5 preferably has a relatively low dielectric constant. Thereby, image sticking etc. in liquid crystal panel 1 can be prevented more effectively.

Examples of such an inorganic oxide include silicon oxide such as SiO ₂ and SiO, Al ₂ O ₃ , MgO, ZnO _, TiO ₂ , TiO ₂ , In ₂ O ₃ , Sb ₂ O ₃ , and Ta ₂ O _5. , Y ₂ O ₃ , CeO ₂ , WO ₃ , CrO ₃ , GaO ₃ , HfO ₂ , Ti ₃ O ₅ , NiO, ZnO, Nb ₂ O ₅ , ZrO ₂ , Ta ₂ O _{5 and the} like. Of these, one or a combination of two or more can be used, and those containing SiO ₂ or Al ₂ O ₃ as the main component are particularly preferred. SiO ₂ and Al ₂ O ₃ have a particularly low dielectric constant and high light stability.

In addition to the inorganic oxide, the inorganic particles 5 include, for example, an inorganic nitride such as SiN, an inorganic fluoride such as MgF ₂ , etc. as a main material, and an inorganic oxide, inorganic nitride, and inorganic fluoride. The material which combined arbitrary 2 or more types of these can be comprised as a main material.
The aspect ratio of the inorganic particles 5 is not particularly limited, but is preferably about 0.03 to 0.5, and more preferably about 0.05 to 0.4. By using the inorganic particles 5 having such dimensions, the molecular anisotropy generated by the corners of the inorganic particles can be increased, so that the alignment state of the liquid crystal molecules is reliably controlled (controlled). The resulting inorganic alignment film 3 is obtained.

Here, the aspect ratio of the inorganic particles 5 is the maximum length in the cross section of the inorganic particles 5 (in the case of a rectangular shape as illustrated, the length of the diagonal line: S in FIG. 2). It means the value divided by the length in the direction (L in FIG. 2).
The specific value of the average length Lm (average value of L) in the major axis direction of the inorganic particles 5 is preferably about 80 to 300 nm, and more preferably about 100 to 200 nm.

The number of inorganic particles 5 disposed on the upper surface of the TFT substrate 17, that is, the number of inorganic particles 5 present per unit area of the upper surface of the TFT substrate 17 is 2 × 10 ⁹ to 2 × 10 ¹³ particles / cm. ^It is preferably about ² , and more preferably about 5 × 10 ⁹ to 1 × 10 ¹³ pieces / cm ² . Thereby, a sufficient number of corner portions of the inorganic particles 5 appear on the upper surface side of the inorganic alignment film 3. Therefore, liquid crystal molecules are more reliably aligned (vertical alignment or horizontal alignment) in such an inorganic alignment film 3. In addition, even if the number of the inorganic particles 5 to be disposed is increased beyond the upper limit, no further increase in the effect of regulating the alignment state of the liquid crystal molecules is observed.

  The average thickness of the inorganic alignment film 3 is not particularly limited, but is preferably about 15 to 150 nm, and more preferably about 20 to 50 nm. If the thickness of the inorganic alignment film 3 is too thin, the liquid crystal molecules can be prevented from coming into direct contact with the pixel electrode 172 and short-circuiting depending on the number of inorganic particles 5 disposed on the upper surface of the TFT substrate 17. On the other hand, if the thickness of the inorganic alignment film 3 is too thick, the driving voltage of the liquid crystal panel 1 becomes high and the power consumption tends to increase.

  In addition, when the inorganic alignment film 3 (inorganic particles 5) is composed of an inorganic oxide as a main material, the inorganic alignment film 3 may be subjected to a hydroxyl group reduction treatment for reducing active hydroxyl groups present on the surface. Good. As a result, it is possible to prevent various impurities from adhering to the inorganic alignment film 3 and reacting with liquid crystal molecules over time, thereby reducing the anchoring force and easily causing an alignment abnormality.

Examples of the impurities include impurities and unreacted components in the sealing material that seals the liquid crystal layer 2, impurities and moisture in the liquid crystal layer, and dirt adhered in the manufacturing process.
Examples of the hydroxyl group reducing process include a process of chemically bonding an alcohol or a coupling agent to the inorganic alignment film 3.
Such a liquid crystal panel (liquid crystal cell) 1 can be manufactured as follows, for example.

[1] First, a TFT substrate 17 manufactured by a known method and a counter substrate 12 for a liquid crystal panel are prepared.
[2] Next, the inorganic alignment film 3 is formed on the TFT substrate 17 so as to cover the pixel electrode 172 and the TFT 173, while the inorganic alignment film 4 is formed on the transparent conductive film 14 of the counter substrate 12 for liquid crystal panel.
Since the formation method (formation process) of the inorganic alignment films 3 and 4 is the same, the case where the inorganic alignment film 3 is formed will be described below as a representative.

<First forming method>
First, the 1st formation method of an inorganic alignment film is demonstrated.
3 and 4 are diagrams (schematic diagrams) for explaining a first method for forming an inorganic alignment film. In the following description, the upper side in FIGS. 3 and 4 is referred to as “upper” and the lower side is referred to as “lower”.
The first forming method of the inorganic alignment film includes: [2A-1] sheet preparation step, [2A-2] sheet stretching step, [2A-3] sheet sticking step, and [2A-4] resin material. And a removal step. Hereinafter, each of these steps will be described sequentially.

[2A-1] Sheet manufacturing process (first process)
A sheet 191 containing a resin material, inorganic particles 5 and a fixing agent is prepared.
First, a liquid in which a resin material, inorganic particles 5 and a fixing agent are dispersed and dissolved in a solvent is prepared.
As the resin material, those that can obtain high orientation when the sheet 191 is stretched in the next step [2A-2] are preferably used. Examples of such resin materials include aromatic polymers such as polyester, polycarbonate, polyarylate, polyetherketone, polysulfone, and polyethersulfone, polyolefin polymers such as polyethylene and polypropylene, vinylidene chloride, polyvinyl alcohol, Examples thereof include vinyl polymers such as polystyrene and acrylic resins, cellulose or derivatives thereof (for example, regenerated cellulose (cellophane), diacetyl cellulose, triacetyl cellulose, etc.), and one or more of these are combined. Can be used.

  Although content of the resin material in the said liquid is not specifically limited, It is preferable that it is about 0.01-50 wt%, and it is more preferable that it is about 0.01-20 wt%. If the content of the resin material is too small, depending on the type and the like, the formed thin film 190 is too thin, and in the stretching process in the next step [2A-2], depending on the magnitude of the pulling force, etc., the sheet 191 may be damaged. On the other hand, if the content of the resin material is too large, the viscosity of the liquid becomes higher than necessary, and it becomes difficult to supply the liquid onto the sheet preparation substrate 18. The thickness of the thin film 190 (sheet 191) is likely to be non-uniform.

The inorganic particles 5 are particles having a prismatic shape. Such particles may be produced by any method, but can be suitably obtained by pulverizing an inorganic film formed by oblique deposition. According to such a method, the inorganic particles 5 can be produced easily, reliably and with good yield. Moreover, it is easy to obtain the inorganic particles 5 having the aspect ratio as described above.
When the inorganic particles 5 are produced by forming the inorganic film by the oblique vapor deposition method, specifically, the following is performed.

In the oblique vapor deposition method, as shown in FIG. 5, a vapor deposition source 810 containing an inorganic material (raw material) 800 and an inorganic particle production substrate 170 are installed in a chamber (not shown). A slit plate 820 in which a slit 821 is formed is disposed.
The inorganic particle production substrate 170 is fixed to the driving device 830 and can be translated in a state in which a vapor deposition angle (an angle θ _{2 in} FIG. 5) described later is maintained. The inorganic particle production substrate 170 can be heated by a heating means (not shown).

In this state, the inorganic material 800 is heated and evaporated (vaporized) by a heating means (not shown) provided in the vapor deposition source 810. Then, the evaporated particles of the inorganic material 800 are allowed to reach the upper surface (the surface on which the inorganic film is formed) of the inorganic particle production substrate 170 through the slits 821 of the slit plate 820.
At this time, the inorganic particle production substrate 170 is heated to a predetermined temperature by the heating means described above, and is translated by the driving device 830 at a predetermined speed.

As a result, an inorganic film having a structure in which a large number of prismatic particles (column structure) grown in an oblique direction are gathered on the inorganic particle production substrate 170 is obtained.
Here, by appropriately setting the vapor deposition angle (angle θ _{2 in} FIG. 5) at which the inorganic material (evaporated particles) 800 evaporated from the evaporation source reaches the upper surface of the inorganic particle production substrate 170, the prismatic particles The angle with respect to the upper surface of the TFT substrate 17 can be adjusted.

The degree of vacuum in the chamber (evaporation apparatus) is preferably about 1 × 10 ⁻⁵ to 1 × 10 ⁻² Pa, and more preferably about 5 × 10 ^{−5 to} 5 × 10 ⁻³ Pa.
Moreover, it is preferable that the substrate temperature at the time of vapor deposition is about 20-150 degreeC, and it is more preferable that it is about 50-120 degreeC.
The deposition rate is preferably about 2.5 to 25 liters / second, more preferably about 4 to 20 liters / second.

In addition, the vapor deposition angle θ ₂ is preferably about 45 to 85 °, and more preferably about 50 to 75 °.
Further, the azimuth angle between the vapor deposition source 810 and the inorganic particle production substrate 170 (angle θ _{1 in} FIG. 5), the separation distance between the inorganic particle production substrate 170 and the vapor deposition source 810 (L in FIG. 5), a slit plate By appropriately setting the thickness of 820 (T in FIG. 5), the width of the slit 821 (W in FIG. 5), and the like, the size of the obtained inorganic particles 5 can be adjusted.

The inorganic particles 5 are obtained by peeling off and crushing the inorganic film thus obtained from the substrate.
As the peeling / pulverizing method, for example, first, mechanically peeling with a sharp blade, or agglomerated solid of inorganic particles peeled off by ultrasonic vibration is added to a grinding medium such as a ball mill, attritor, sand mill, or bead mill. And wet pulverization method.

Further, the amount of the inorganic particles 5 to be mixed with the liquid varies depending on the kind of the resin material and is not particularly limited. Specifically, the amount of the inorganic particles 5 to be mixed with the liquid is appropriately set so that the number of the inorganic particles 5 present per unit area on the upper surface of the TFT substrate 17 falls within the above-described range. You can do it.
The fixing agent has a function of fixing the inorganic particles 5 to the TFT substrate 17 in the post-process [2A-4]. The fixing agent preferably has a function of connecting (crosslinking) the inorganic particles 5 to each other. Thereby, the mechanical strength of the inorganic alignment film 3 can be improved, and peeling from the TFT substrate 12 can be reliably prevented.

Further, as this fixing agent, a material that is not removed or is not easily removed when the resin material to be removed in the subsequent step [2A-4] is removed is suitably selected.
Examples of such a fixing agent include Ti, Li, Si, Na, K, Mg, Ca, St, Ba, Al, In, Ge, Bi, Fe, Cu, Y, Zr, and Ta as metal elements. What has a coupling agent which has as a main component is preferable, and especially what has a silane type and titanate type coupling agent as a main component is used suitably. The coupling agent is preferable because the same molecule can perform both functions of fixing the inorganic particles 5 on the TFT substrate 6 and connecting the inorganic particles 5 to each other.

  Among these, silane coupling agents include those having a vinyl group such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycol. Those having an epoxy group such as sidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, Those having a methacryloxy group such as 3-methacryloxypropylmethyldiethoxysilane and 3-methacryloxypropyltriethoxysilane, those having an acryloxy group such as 3-acryloxypropyltrimethoxysilane, N-2 (amino Ethyl) 3-aminopropylmethyldimethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Of triethoxysilyl-N- (1,3-dimethylbutylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane Those having an amino group such as hydrochloride, special aminosilane, those having a ureido group such as 3-ureidopropyltriethoxysilane, those having a chloropropyl group such as 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxy Silane, 3-mercaptopro Those having a mercapto group such as Le trimethoxysilane, those having a sulfide group such as bis (triethoxysilylpropyl) tetrasulfide, such as those having an isocyanate group such as 3-isocyanate propyl triethoxysilane and the like.

In addition, polyhydric alcohols such as polyethylene glycol and polypropylene glycol can also be used as the fixing agent.
The content of the fixing agent in the liquid is not particularly limited, but is preferably about 0.001 to 0.2 g, more preferably about 0.01 to 0.1 g, with respect to 1 g of the inorganic particles. preferable. By setting the content of the fixing agent in the above range, the inorganic particles 5 can be fixed to the TFT substrate 17 and the inorganic particles 5 can be fixed while preventing the inorganic particles 5 from being connected to each other in the process of manufacturing the sheet 191. Connection between each other can be performed reliably.

Examples of the solvent or dispersion medium used for preparing the liquid include alcohols such as isopropyl alcohol, ethyl alcohol, and methyl alcohol, dimethylformamide, hexane, tetrahydrofuran, toluene, pyridine, triethylamine, water, and acetone.
Next, the liquid is supplied onto the sheet manufacturing substrate 18 and then dried to form a thin film 190 as shown in FIG.

Examples of liquid supply include spin coating, casting, micro gravure coating, gravure coating, bar coating, roll coating, wire bar coating, dip coating, spray coating, screen printing, flexographic printing. Various coating methods such as a printing method, an offset printing method, and an ink jet printing method can be used.
The average thickness of the sheet 191 to be formed (the thin film 190 after drying) is preferably about 1 to 1000 μm, and more preferably about 1 to 500 μm. If the thickness of the sheet 191 is too thin, the sheet 191 may be damaged in the stretching process in the next step [2A-2] depending on the type and content of the resin material, the strength of the pulling force, and the like. On the other hand, if the sheet 191 is too thick, it may take a long time to obtain the stretched sheet 192 having the desired thickness.
And this thin film 190 is peeled from the board | substrate 18 for sheet preparation. Thereby, the sheet | seat 191 containing the resin material as shown in FIG.3 (b), the inorganic particle 5, and a fixing agent is obtained.

[2A-2] Sheet stretching step (second step)
Next, the stretched sheet 192 as shown in FIG. 3C is obtained by stretching the sheet 191 in the uniaxial direction.
When the sheet 191 is stretched, the molecular chains of the resin material contained in the sheet 191 are oriented in the stretching direction, and the inorganic particles 5 are aligned along this. That is, the inorganic particles 5 are oriented in the stretching direction of the sheet 191.
Examples of the stretching method include a tensile stretching method, a roll rolling method, a solid phase extrusion method, a gel rolling method, and a zone rolling method.

[2A-3] Sheet sticking step (third step)
Next, as illustrated in FIG. 4D, the stretched sheet 192 is fixed to the upper surface of the TFT substrate 17.
This can be performed by placing the stretched sheet 192 on the TFT substrate 17 so as to cover the pixel electrode 172 and the TFT 173 and then pressing the stretched sheet 192 toward the TFT substrate 17 as necessary. .

[2A-4] Resin material removal step (fourth step)
Next, the resin material is removed from the stretched sheet 192 to transfer the inorganic particles 5 onto the TFT substrate 17 and fix the inorganic particles 5 onto the TFT substrate 17. Thereby, the inorganic alignment film 3 is obtained.
First, in this embodiment, a fixing process for fixing the inorganic particles 5 on the TFT substrate 17 is performed. This fixing process is suitably performed by heating.

For example, when a silane coupling agent is used as the fixing agent, the reactive group of the silane coupling agent reacts with the functional group on the surface of the TFT substrate 17 and the functional group on the surface of the inorganic particles 5 by heating. Thus, a siloxane bond is formed. As a result, at least a part of the inorganic particles 5 is bonded onto the TFT substrate 17.
The temperature of this heat treatment is preferably about 90 to 200 ° C, more preferably about 110 to 180 ° C.

In addition to the heating, the fixing treatment can be performed by, for example, photocuring or exposure of the silane coupling agent to water vapor.
Next, by removing the resin material contained in the stretched sheet 192, the inorganic particles 5 are transferred onto the TFT substrate 17 as shown in FIG. Thereby, on the TFT substrate 17, an inorganic alignment film made up of a plurality of inorganic particles 5 which is substantially parallel to the upper surface of the TFT substrate 17 and whose major axis is arranged in a substantially constant direction. 3 is obtained.

Examples of the method for removing the resin material include (1) thermal decomposition, (2) photolysis, (3) dissolution, and (4) peeling. According to these methods, the resin material can be removed easily and reliably.
Among these, in (1) thermal decomposition, the TFT substrate 17 to which the stretched sheet 192 is fixed is heated at a temperature equal to or higher than the thermal decomposition temperature of the resin material. Thereby, the resin material contained in the stretched sheet 192 is thermally decomposed and removed. As a result, the inorganic particles 5 remain on the TFT substrate 17 and the inorganic alignment film 3 is obtained.

At this time, more inorganic particles 5 are fixed on the TFT substrate 17 by the action of the fixing agent, and the inorganic particles 5 are also connected to each other. The mechanical strength of the alignment film 3 is improved.
The lower limit of the heat treatment temperature is set to be equal to or higher than the thermal decomposition temperature of the resin material, while the upper limit is a range that does not adversely affect the TFT 173 and the pixel electrode 172 formed on the TFT substrate 17 (for example, 250 ° C. or less) It is preferable to do this.
In the case of using thermal decomposition (heating) in this step [2A-4], the removal of the resin material and the fixing treatment can be performed together, and the number of steps for forming the inorganic alignment film 3 can be increased. Reduction is possible.

(2) In the photolysis, the stretched sheet 192 is irradiated with light. Thereby, the resin material contained in the stretched sheet 192 is decomposed. And the removal process which removes a decomposition product is performed as needed. As a result, the inorganic particles 5 remain on the TFT substrate 17 and the inorganic alignment film 3 is obtained.
Here, the wavelength of the light to be irradiated is preferably about 150 to 350 nm, and more preferably about 150 to 300 nm.
The intensity of the irradiated light is preferably in the range of about 0.01~10mW / cm ^2, more preferably about 0.1 to 10 MW / cm ^2.
Examples of the decomposition product removal treatment include ozone irradiation, plasma treatment, UV treatment, and heat treatment.

(3) In dissolution, a solvent is brought into contact with the stretched sheet 192. Thereby, the resin material contained in the stretched sheet 192 is dissolved and removed. As a result, the inorganic particles 5 remain on the TFT substrate 17 and the inorganic alignment film 3 is obtained.
As the solvent, those capable of dissolving the resin material and not affecting the inorganic particles 5 are selected, and are not particularly limited. For example, xylene, styrene, toluene, 1,1,1-trichloromethane , Normal hexane, N, N-dimethylformamide, trichloroethylene, tetrachloroethylene chlorobenzene, o-dichlorobenzene, chloroform, carbon tetrachloride, 1,4-dioxane, 1,2-dichloroethane, 1,2-dichloroethylene, 1,1,2 , 2-tetrachloroethane, cresol, methyl isobutyl ketone, isopropyl alcohol, ethyl acetate, mineral spirit, heavy aromatic, cyclohexane, n-heptane, labazole, ligroin, dichloromethane, 1,2-dichlorobenzene, methanol, modified Tyl alcohol, n-propyl alcohol, isobutyl alcohol, n-butyl alcohol, modified methyl acetate, isobutyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, ethyl-3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl -3-methoxybutyl acetate, acetone, methyl ethyl ketone, cyclohexanone, 4-hydroxyn-4-methyl-2-pentanone, 3,5,5-trimethyl-2-cyclohexen-1-one, 2,6-dimethyl-4- Hebutanone, 4-methylaminolactam, N, N-dimethylformamide, vinylbenzene, diethylene glycol monobutyl ether, 3-methyl-3-methoxybutanol, ethylene glycol monobutyl ether, t-butyl celloso Bed, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, tetramethylene oxide, may be mixed tetrahydrofuran, or benzene, either alone or in any combination.
As a method of bringing the solvent into contact with the stretched sheet 192, for example, a method of immersing the TFT substrate 17 on which the stretched sheet 192 is fixed (immersion method) in a solvent, a method of applying a solvent to the stretched sheet 192 (application) Method), a method of supplying a solvent to the stretched sheet 192 in a shower (spray method), and the like.

(4) In the peeling, the sheet material of the resin material (the base portion of the sheet 191 made of the resin material) is peeled off from the TFT substrate 17 and removed. Thereby, the resin material contained in the stretched sheet 192 is removed as a lump. As a result, the inorganic particles 5 remain on the TFT substrate 17 and the inorganic alignment film 3 is obtained.
According to the above method, the inorganic alignment film 3 is removed by stretching the sheet 191 containing the resin material, the inorganic particles 5 and the fixing agent, fixing the stretched sheet 192 to the TFT substrate 17, and then removing the resin material. Therefore, the uniform and homogeneous inorganic alignment film 3 can be efficiently formed.

In particular, according to this method, even when the TFT substrate 17 is enlarged, the uniform and homogeneous inorganic alignment film 3 can be reliably formed in the same manner. That is, the method for manufacturing an electronic device substrate of the present invention is suitable for application to the case where an inorganic alignment film is formed on a large substrate.
Further, since the formed inorganic alignment film 3 is composed of the inorganic particles 5, it is possible to obtain excellent light resistance and maintain the function of regulating (controlling) the alignment state of the liquid crystal molecules for a long period of time. it can.
In the present embodiment, the case where a fixing agent is included in the sheet 191 has been described. However, the sheet 191 may not include a fixing agent. In this case, after the inorganic particles 5 are transferred onto the TFT substrate 17, the inorganic particles 5 are fixed onto the TFT substrate 17 by supplying a fixing agent onto the TFT substrate 17 and performing a fixing process, whereby the inorganic alignment film 3. Can be obtained.

<Second forming method>
Next, the second forming method of the inorganic alignment film will be described. The description will focus on differences from the first forming method, and the description of the same matters will be omitted.
FIG. 6 is a diagram (schematic diagram) for explaining a second method for forming an inorganic alignment film. In the following description, the upper side in FIG. 6 is referred to as “upper” and the lower side is referred to as “lower”.
The second forming method is the same as the first forming method except for the sheet manufacturing process.

[2B-1] Sheet production step A sheet 191 containing a resin material, inorganic particles 5 and a fixing agent is produced.
First, a liquid in which a resin material is dispersed and dissolved in a solvent is prepared, supplied onto the sheet manufacturing substrate 18, and dried to form a thin film 193 as shown in FIG.
As the resin material and the solvent, the same materials as those mentioned in the first forming method can be used.

The content of the resin material in the liquid, the liquid supply method, the drying temperature, and the like can be the same as those in the first forming method.
Next, as shown in FIG. 6B, after the inorganic particles 5 are spread almost uniformly on the thin film 193, a fixing agent or a solution thereof (diluted solution) is supplied onto the thin film 193 and dried.
As the inorganic particles 5 and the fixing agent, the same ones as those mentioned in the first forming method can be used, respectively, and the amount used can be the same as in the first forming method.
Next, the thin film 193 supplied with the inorganic particles 5 and the fixing agent is peeled from the substrate 18 for sheet preparation. Thereby, the sheet | seat 191 containing the resin material as shown in FIG.6 (c), the inorganic particle 5, and a fixing agent is obtained.

[2B-2] Sheet stretching step (second step)
In this step, the same step as the above step [2A-2] is performed.
[2B-3] Sheet sticking step (third step)
In this step, the same step as the above step [2A-3] is performed.
[2B-4] Resin material removing step (fourth step)
In this step, the same step as the above step [2A-4] is performed.

[3] Next, the inorganic alignment films 3 and 4 are opposed to each other, and the TFT substrate 17 and the liquid crystal panel counter substrate 12 are bonded to each other via a sealing material (not shown), and the void formed thereby is sealed. After injecting liquid crystal (liquid crystal composition) into the gap from a hole (not shown), the sealing hole is closed.
[4] Next, polarizing films 7 and 8 are bonded to the outer surfaces of the TFT substrate 17 and the counter substrate 12 for liquid crystal panel, respectively.

Through the above steps, the liquid crystal panel 1 shown in FIG. 1 is obtained.
In the liquid crystal panel 1, a TFT substrate is used as the liquid crystal drive substrate. However, a liquid crystal drive substrate other than the TFT substrate, such as a TFD substrate or an STN substrate, may be used as the liquid crystal drive substrate.
Next, an electronic apparatus (liquid crystal projector) using the liquid crystal panel 1 will be described as an example of the electronic apparatus of the present invention.

FIG. 7 is a diagram schematically showing an optical system of the electronic apparatus (projection display device) of the present invention.
As shown in the figure, the projection display apparatus 300 includes a light source 301, an illumination optical system including a plurality of integrator lenses, a color separation optical system (light guide optical system) including a plurality of dichroic mirrors, and the like. A liquid crystal light valve (liquid crystal optical shutter array) 24 corresponding to red (liquid crystal optical shutter array) 24 corresponding to red, a liquid crystal light valve (liquid crystal optical shutter array) 25 corresponding to green (liquid crystal optical shutter array) 25, and a liquid crystal light valve corresponding to blue (for blue) ) A liquid crystal light valve (liquid crystal light shutter array) 26, a dichroic prism (color combining optical system) 21 formed with a dichroic mirror surface 211 reflecting only red light and a dichroic mirror surface 212 reflecting only blue light, and projection And a lens (projection optical system) 22.

  The illumination optical system includes integrator lenses 302 and 303. The color separation optical system includes mirrors 304, 306, and 309, a dichroic mirror 305 that reflects blue light and green light (transmits only red light), a dichroic mirror 307 that reflects only green light, and a dichroic that reflects only blue light. A mirror (or a mirror that reflects blue light) 308 and condenser lenses 310, 311, 312, 313, and 314 are included.

The liquid crystal light valve 25 includes the liquid crystal panel 1 described above. The liquid crystal light valves 24 and 26 have the same configuration as the liquid crystal light valve 25. The liquid crystal panels 1 included in these liquid crystal light valves 24, 25 and 26 are connected to driving circuits (not shown).
In the projection display device 300, the dichroic prism 21 and the projection lens 22 constitute the optical block 20. The optical block 20 and liquid crystal light valves 24, 25 and 26 fixedly installed on the dichroic prism 21 constitute a display unit 23.

Hereinafter, the operation of the projection display apparatus 300 will be described.
White light (white light beam) emitted from the light source 301 passes through the integrator lenses 302 and 303. The light intensity (luminance distribution) of the white light is made uniform by the integrator lenses 302 and 303. The white light emitted from the light source 301 preferably has a relatively high light intensity. Thereby, the image formed on the screen 320 can be made clearer. In addition, since the projection display device 300 uses the liquid crystal panel 1 having excellent light resistance, excellent long-term stability can be obtained even when the intensity of light emitted from the light source 301 is large.

The white light transmitted through the integrator lenses 302 and 303 is reflected to the left side in FIG. 7 by the mirror 304, and blue light (B) and green light (G) of the reflected light are respectively reflected by the dichroic mirror 305 in FIG. The red light (R) is reflected downward and passes through the dichroic mirror 305.
The red light transmitted through the dichroic mirror 305 is reflected downward in FIG. 7 by the mirror 306, and the reflected light is shaped by the condenser lens 310 and enters the liquid crystal light valve 24 for red.

Green light out of blue light and green light reflected by the dichroic mirror 305 is reflected to the left side in FIG. 7 by the dichroic mirror 307, and the blue light passes through the dichroic mirror 307.
The green light reflected by the dichroic mirror 307 is shaped by the condenser lens 311 and enters the green liquid crystal light valve 25.

Further, the blue light transmitted through the dichroic mirror 307 is reflected on the left side in FIG. 7 by the dichroic mirror (or mirror) 308, and the reflected light is reflected on the upper side in FIG. 7 by the mirror 309. The blue light is shaped by the condenser lenses 312, 313, and 314, and enters the liquid crystal light valve 26 for blue.
As described above, the white light emitted from the light source 301 is separated into the three primary colors of red, green, and blue by the color separation optical system, and is guided to the corresponding liquid crystal light valve and enters.

At this time, each pixel (the thin film transistor 173 and the pixel electrode 172 connected thereto) of the liquid crystal panel 1 included in the liquid crystal light valve 24 is subjected to switching control by a driving circuit (driving means) that operates based on a red image signal. (On / off), ie modulated.
Similarly, green light and blue light enter the liquid crystal light valves 25 and 26, respectively, and are modulated by the respective liquid crystal panels 1, thereby forming a green image and a blue image. At this time, each pixel of the liquid crystal panel 1 included in the liquid crystal light valve 25 is switching-controlled by a drive circuit that operates based on a green image signal, and each pixel of the liquid crystal panel 1 included in the liquid crystal light valve 26 is used for blue color. Switching control is performed by a drive circuit that operates based on the image signal.

As a result, red light, green light, and blue light are modulated by the liquid crystal light valves 24, 25, and 26, respectively, and a red image, a green image, and a blue image are formed, respectively.
The red image formed by the liquid crystal light valve 24, that is, the red light from the liquid crystal light valve 24, enters the dichroic prism 21 from the surface 213, is reflected by the dichroic mirror surface 211 to the left in FIG. The light passes through the surface 212 and exits from the exit surface 216.

Further, the green image formed by the liquid crystal light valve 25, that is, the green light from the liquid crystal light valve 25, enters the dichroic prism 21 from the surface 214, passes through the dichroic mirror surfaces 211 and 212, and exits. The light exits from the surface 216.
Further, the blue image formed by the liquid crystal light valve 26, that is, the blue light from the liquid crystal light valve 26 is incident on the dichroic prism 21 from the surface 215, and is reflected to the left side in FIG. 7 by the dichroic mirror surface 212. The light passes through the dichroic mirror surface 211 and exits from the exit surface 216.

  Thus, the light of each color from the liquid crystal light valves 24, 25 and 26, that is, the images formed by the liquid crystal light valves 24, 25 and 26 are synthesized by the dichroic prism 21, thereby forming a color image. Is done. This image is projected (enlarged projection) on the screen 320 installed at a predetermined position by the projection lens 22.

The projection display device 300 of the present embodiment has three liquid crystal panels, and the liquid crystal panel 1 is applied to all of them, but at least one of them is the liquid crystal panel 1. I just need it. In this case, it is preferable to apply the liquid crystal panel 1 to at least a liquid crystal light valve for blue.
In addition to the projection display device of FIG. 7, the electronic apparatus of the present invention includes, for example, a personal computer (mobile personal computer), a mobile phone (including PHS), a digital still camera, a television, a video camera, a view Finder type, monitor direct-view type video tape recorder, car navigation system, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, video phone, TV monitor for crime prevention, electronic Devices equipped with binoculars, POS terminals, touch panels (for example, cash dispensers of financial institutions, automatic ticket vending machines), medical devices (for example, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiographs, ultrasonic diagnostic devices, endoscopes) Display device), fish finder, various measuring instruments, instruments (eg, vehicle) Aircraft, gauges of a ship), such as flight simulators, and the like. Needless to say, the present invention can be applied to a liquid crystal panel included in the display unit and the monitor unit of these various electronic devices.

As mentioned above, although the board | substrate for electronic devices of this invention, the manufacturing method of the board | substrate for electronic devices, a liquid crystal panel, and an electronic device were demonstrated based on embodiment of illustration, this invention is not limited to this.
For example, in the method for manufacturing an electronic device substrate of the present invention, one or more arbitrary steps can be added.

In addition, in the electronic device substrate, the liquid crystal panel, and the electronic apparatus according to the present invention, the configuration of each part can be replaced with any configuration that exhibits the same function, and any configuration can be added. it can.
The electronic device substrate of the present invention is not limited to application to the liquid crystal panel having the configuration described in the above embodiment. For example, a configuration in which a pair of electrodes for applying a voltage to the liquid crystal layer is provided on the same substrate. It can be applied to LCD panels.
Furthermore, the electronic device substrate of the present invention is not limited to application to a liquid crystal panel, and may be applied to, for example, an organic transistor. In this case, by using such an electronic device substrate, the orientation direction of the organic semiconductor layer can be regulated to improve carrier mobility.

Next, specific examples of the present invention will be described.
1. Preparation of inorganic particles First, set to prepare a silicon substrate having a diameter of 8 inches (substrate for producing inorganic particles), the substrate surface in a chamber of a vacuum deposition apparatus with respect to the deposition source, the angle theta ₁ is 50 ° did. Also, the thickness of the slit plate is 1.5 cm, the width of the slit is 2.0 cm, the deposition angle θ ₂ is 60 °, the deposition distance is 1.5 m, and the operating speed (moving speed) of the silicon substrate is 2.5 cm / Minutes.

Next, the inside of the chamber was depressurized (1 × 10 ⁻⁴ Pa), and SiO ₂ was obliquely vapor-deposited at a silicon substrate temperature of 110 ° C. and a vapor deposition rate of 10 Å / second to form a SiO ₂ oblique vapor-deposited film.
In addition, the obtained SiO ₂ oblique deposition film had an angle of about 70 ° with respect to the upper surface of the silicon substrate and an average thickness of 40 nm.
Then, the SiO ₂ oblique deposition film was peeled off from the silicon substrate and pulverized to obtain prismatic (rectangular) SiO ₂ particles.
The size of the prismatic SiO ₂ particles was 110 nm long × 20 nm long × 15 nm wide, and the aspect ratio was about 0.23.

2. Production of liquid crystal panel (Example 1)
<1> First, 0.05 g of a silane coupling agent (“KBM3060” manufactured by Shin-Etsu Chemical Co., Ltd.) represented by CH ₃ (CH ₂ ) ₅ Si (OCH ₃ ) ₃ and 1 g of polyethylene are mixed with isopropyl alcohol. Dissolved in 200 g, 1 g of SiO ₂ particles was mixed with this solution to prepare a liquid.

Next, this liquid was applied onto a sheet-forming substrate by a casting method, and dried at 150 ° C. for 2 hours to form a thin film. And the sheet | seat was obtained by peeling this thin film from the board | substrate for sheet | seat preparation. In addition, the average thickness of the obtained sheet | seat was 200 micrometers.
Next, this sheet was mounted on a uniaxial stretching apparatus and stretched. Thereby, a stretched sheet having an average thickness of 0.5 μm was obtained.

<2> Next, a TFT substrate and a counter substrate for a liquid crystal panel shown in FIG. 1 were prepared, and stretched sheets were attached to the respective substrates.
<3> Next, each substrate to which each stretched sheet was attached was heated at 200 ° C. for 3 hours. Thereby, polyethylene was thermally decomposed and removed, and the SiO ₂ particles were connected to each other, and the SiO ₂ particles were fixed to the substrate to obtain an inorganic alignment film.
In addition, the average thickness of the obtained inorganic alignment film was 30 nm. The number of inorganic particles on the substrate was 5 × 10 ⁹ particles / cm ² .

  <4> Next, the substrate on which each inorganic alignment film is formed is placed on the bottom of a Teflon container ("Teflon" is a registered trademark) with the inorganic alignment film facing upward, Water was injected until the inorganic alignment film was immersed. And this container was carried in in the vacuum chamber, and the inside of the vacuum chamber was pressure-reduced (1 Torr), and the gas of the clearance gap between inorganic particles was substituted with the ultrapure water. Thereafter, in this state, ultrasonic cleaning was performed for 10 minutes. Subsequently, the inside of the vacuum chamber was returned to atmospheric pressure, and ultrapure water was discharged from the drain. Again, the inside of the vacuum chamber was heated at 200 ° C. for 90 minutes while reducing the pressure, and then allowed to cool. Thereby, the substrate with an inorganic alignment film was washed.

  <5> Next, a thermosetting adhesive (“ML3804P” manufactured by Nippon Kayaku Co., Ltd.) is formed along the outer peripheral portion of the inorganic alignment film of the substrate with one inorganic alignment film, except for a portion corresponding to the liquid crystal injection port. ) Was printed. This thermosetting adhesive is mainly composed of an epoxy resin mixed with silica spheres having a diameter of about 3 μm. And the solvent in a thermosetting adhesive was removed by heating the board | substrate with an inorganic alignment film at 80 degreeC for 10 minute (s).

<6> Next, the substrate with an inorganic alignment film on which the thermosetting adhesive is printed and the substrate with the other inorganic alignment film are set to the inner side of the inorganic alignment film, and the alignment direction of the inorganic alignment film is It arrange | positioned so that it might become 180 degrees. Then, the two substrates were bonded together by heating at 140 ° C. for 1 hour while being pressure-bonded with a clip.
<7> Next, fluorine-based negative dielectric anisotropic liquid crystal (MLC, “MLC-6610”) was injected into the space between the inorganic alignment films from the liquid crystal injection port by a vacuum injection method. Thereafter, an acrylic UV adhesive (“LPD-204” manufactured by Henkel Japan Co., Ltd.) is supplied to the liquid crystal injection port, and the liquid crystal injection port is sealed by irradiating with a wavelength of 365 nm at 3000 mJ / cm ^2. did.

<8> Polyvinyl alcohol films (polarizing films) stretched in a uniaxial direction were bonded to the outer surfaces of the two substrates, respectively.
Through the above steps, a vertical alignment type liquid crystal panel was manufactured.

(Example 2)
A liquid crystal panel was produced in the same manner as in Example 1 except that in the step <1>, a sheet was produced as follows.
First, 1 g of polyethylene was dissolved in 200 g of isopropyl alcohol to prepare a liquid.

Next, this liquid was applied onto a sheet-forming substrate by a casting method, and dried at 150 ° C. for 2 hours to form a thin film.
Next, 1 g of SiO ₂ particles was uniformly distributed on this thin film, and then a silane coupling agent represented by CH ₃ (CH ₂ ) ₅ Si (OCH ₃ ) ₃ (manufactured by Shin-Etsu Chemical Co., Ltd., “KBM3063”). “) A solution of 0.05 g in 200 g of isopropyl alcohol was uniformly applied.
And the sheet | seat was obtained by peeling this thin film from the board | substrate for sheet | seat preparation. In addition, the average thickness of the obtained sheet | seat was 200 micrometers.
Moreover, the average thickness of the obtained inorganic alignment film was 30 nm. The number of inorganic particles on the substrate was 1 × 10 ¹⁰ particles / cm ² .

(Example 3)
A liquid crystal panel was produced in the same manner as in Example 2 except that in step <3>, heating was performed at 150 ° C. for 2 hours, and then the polyethylene was removed by peeling.
Moreover, the average thickness of the obtained inorganic alignment film was 30 nm. The number of inorganic particles on the substrate was 5 × 10 ⁹ particles / cm ² .

Example 4
In the step <3>, after heating at 150 ° C. for 2 hours and then removing polyethylene by washing for 1 hour with a UV / O ₃ cleaning device (trade name UV-1 manufactured by Samco) A liquid crystal panel was produced in the same manner as in Example 1.
Moreover, the average thickness of the obtained inorganic alignment film was 30 nm. The number of inorganic particles on the substrate was 5 × 10 ⁹ particles / cm ² .

(Example 5)
A liquid crystal panel was produced in the same manner as in Example 1 except that in step <3>, the polyethylene was removed by dissolving in xylene after heating at 150 ° C. for 2 hours.
Moreover, the average thickness of the obtained inorganic alignment film was 30 nm. The number of inorganic particles on the substrate was 5 × 10 ⁹ particles / cm ² .

(Comparative Example 1)
Instead of the steps <1> to <3>, a liquid crystal is formed in the same manner as in Example 1 except that SiO ₂ is deposited on each of the two substrates by oblique deposition to form an inorganic alignment film. Panels were manufactured.
Note that the average thickness of the SiO ₂ oblique deposition film was 30 nm.

(Comparative Example 2)
Instead of the above steps <1> to <3>, a liquid crystal was prepared in the same manner as in Example 1 except that an organic alignment film was formed by fixing stretched sheets obtained by stretching polyimide resin sheets to two substrates. Panels were manufactured.
The average thickness of the organic alignment film was 30 nm.

3. Evaluation 3-1. Measurement of Pretilt Angle The pretilt angle was measured for each of the liquid crystal panels produced in each Example and each Comparative Example.
The pretilt angle was measured by a crystal rotation method in which light was incident on each liquid crystal panel while changing the incident angle, and the angle change of the reflected light was observed.
As a result, the liquid crystal panels manufactured in each example had a pretilt angle of about 3 °. On the other hand, the pretilt angle of the liquid crystal panel manufactured in each comparative example was about 1 °.

3-2. Light Resistance Test A light resistance test was performed on each of the liquid crystal panels manufactured in each Example and each Comparative Example.
In this light resistance test, each liquid crystal panel was set as a blue liquid crystal light valve of the projection display device shown in FIG. 7, and the light source was continuously lit while maintaining the surface temperature of the liquid crystal cell at 55 ° C. The time until display abnormality occurred was measured.

A 130 WUHP lamp (manufactured by Philips) was used as the light source.
The results are shown in Table 1 below.
Table 1 shows that the time until a display abnormality occurs in the liquid crystal panel manufactured in Comparative Example 2 is “1”, and the display abnormality occurs in the liquid crystal panels manufactured in Examples 1 to 5 and Comparative Example 1. The time until the occurrence was shown as a relative value.

As shown in Table 1, it is clear that the liquid crystal panel manufactured in each example has a longer time until display abnormality occurs than the liquid crystal panel manufactured in Comparative Example 2. It was.
Further, a liquid crystal panel was produced in the same manner as described above except that an inorganic alignment film was formed of Al ₂ O ₃ instead of SiO ₂ , and evaluation was performed in the same manner as above. Obtained.

It is a longitudinal cross-sectional view which shows typically embodiment of the liquid crystal panel of this invention. It is a perspective view which expands and shows typically the inorganic alignment film with which the liquid crystal panel shown in FIG. 1 is provided. It is a figure (schematic diagram) for demonstrating the 1st formation method of an inorganic alignment film. It is a figure (schematic diagram) for demonstrating the 1st formation method of an inorganic alignment film. It is a schematic diagram which shows the structure of the vacuum evaporation system used for preparation of an inorganic particle. It is a figure (schematic diagram) for demonstrating the 2nd formation method of an inorganic alignment film. It is a figure which shows typically the optical system of the projection type display apparatus to which the electronic device of this invention is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal panel 2 ... Liquid crystal layer 3, 4 ... Inorganic alignment film 5 ... Inorganic particle 7, 8 ... Polarizing film 11 ... Microlens substrate 111 ... Substrate with a concave part for microlenses 112 ... Concave part 113 …… Microlens 114 …… Surface layer 115 …… Resin layer 12 …… Counter substrate for liquid crystal panel 13 …… Black matrix 131 …… Opening 14 …… Transparent conductive film 17 …… TFT substrate 171 …… Glass substrate 172 …… Pixels Electrode 173 ... Thin film transistor 170 ... Substrate for inorganic particle preparation 18 ... Substrate for sheet preparation 190 ... Thin film 191 ... Sheet 192 ... Oriented thin film sheet 193 ... Thin film 800 ... Inorganic material (raw material) 810 ... Deposition Source 820 ... Slit plate 821 ... Slit 830 ... Drive device 300 ... Projection type display device 3 DESCRIPTION OF SYMBOLS 1 ... Light source 302, 303 ...... Integrator lens 304,306,309 ... Mirror 305,307,308 ... Dichroic mirror 310-314 ... Condensing lens 320 ... Screen 20 ... Optical block 21 ... Dichroic prism 211, 212 ... Dichroic mirror surface 213-215 ... Surface 216 ... Output surface 22 ... Projection lens 23 ... Display unit 24-26 ... Liquid crystal light valve

Claims (14)

A substrate for an electronic device having a substrate and an inorganic alignment film provided on one surface side of the substrate,
The inorganic alignment film is composed of a plurality of prismatic inorganic particles arranged so as to be substantially parallel to one surface of the substrate and having a major axis oriented in a substantially constant direction. Device substrate.   The electronic device substrate according to claim 1, wherein an aspect ratio of the inorganic particles is 0.03 to 0.5. The electronic device substrate according to claim 1, wherein the number of the inorganic particles disposed on one surface side of the substrate is 2 × 10 ⁹ to 2 × 10 ¹³ particles / cm ² . 4. The electronic device substrate according to claim 1, wherein the inorganic particles are composed mainly of SiO ₂ or Al ₂ O _{3. 5} . A method for producing an electronic device substrate according to any one of claims 1 to 4,
A first step of preparing a sheet containing the resin material and the inorganic particles;
A second step of stretching the sheet and orienting the inorganic particles in the stretching direction;
A third step of attaching the sheet to one surface side of the substrate;
And a fourth step of obtaining the inorganic alignment film by removing the resin material, transferring the inorganic particles to the substrate side, and fixing the inorganic particles to the substrate side. A method of manufacturing an electronic device substrate.   The method for manufacturing a substrate for an electronic device according to claim 5, wherein the inorganic particles are obtained by pulverizing an inorganic film formed by oblique deposition.   The manufacturing method of the board | substrate for electronic devices of Claim 5 or 6 which performs the fixing process which fixes the said inorganic particle to the said board | substrate side with a fixing agent in the said 4th process.   The method of manufacturing a substrate for an electronic device according to claim 7, wherein the fixing agent has a function of connecting the inorganic particles.   The method for manufacturing a substrate for an electronic device according to claim 8, wherein the fixing agent contains a coupling agent as a main component.   The method for manufacturing an electronic device substrate according to claim 7, wherein in the fourth step, the fixing process is performed by heating. The sheet includes the fixing agent,
The method for manufacturing an electronic device substrate according to claim 10, wherein, in the fourth step, the fixing process and the removal of the resin material are collectively performed by heating.   The method for manufacturing a substrate for an electronic device according to any one of claims 1 to 11, wherein in the fourth step, the resin material is removed by decomposition, dissolution, or peeling. An electronic device substrate according to any one of claims 1 to 4,
A liquid crystal panel comprising: a liquid crystal layer provided on a side opposite to the substrate of the inorganic alignment film. An electronic apparatus comprising the liquid crystal panel according to claim 13.

Images