JP2007193275A - 液晶表示装置及びその製造方法 - Google Patents
液晶表示装置及びその製造方法 Download PDFInfo
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- JP2007193275A JP2007193275A JP2006013822A JP2006013822A JP2007193275A JP 2007193275 A JP2007193275 A JP 2007193275A JP 2006013822 A JP2006013822 A JP 2006013822A JP 2006013822 A JP2006013822 A JP 2006013822A JP 2007193275 A JP2007193275 A JP 2007193275A
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 184
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 230000001681 protective effect Effects 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 abstract description 27
- 239000010408 film Substances 0.000 description 63
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
【解決手段】異方性導電膜5を、液晶パネル3の外側にはみ出しパターン保護膜4aに重なるように配設し、また、フレキシブル基板4の端部よりも表示部側にはみ出すように配設して、配線パターンの全てを異方性導電膜5で覆う。また、接合に際して、液晶パネル3の端子部と液晶パネル3の外側の双方を加熱加圧ツール8で加熱加圧する方法を用いる。これにより、配線パターンに導電性の異物が付着したり配線パターンが液晶パネル3の端部に接触することがなく、短絡や断線を確実に防止することができ、液晶パネル3とフレキシブル基板4との接触面積を大きくして接着強度を向上させることができる。
【選択図】図3
Description
2a 第1の基板
2b 第2の基板
3 液晶パネル
4 フレキシブル基板
4a パターン保護膜
5 異方性導電膜
6 面取り部
7 緩衝材
8 加熱加圧ツール
9 押さえ込みツール
Claims (7)
- 対向する一対の基板間に液晶が挟持された液晶パネルと、前記液晶パネルと回路基板とを接続するためのフレキシブル基板とを少なくとも備え、前記液晶パネルの表示部の周囲に設けられた端子部と前記フレキシブル基板に形成された配線パターンとが異方性導電膜によって接続される液晶表示装置において、
前記異方性導電膜は、前記フレキシブル基板に沿って、前記液晶パネルの外側にはみ出すように配設されていることを特徴とする液晶表示装置。 - 前記フレキシブル基板には、前記液晶パネルに接続される側の端部から所定の間隔をあけて前記配線パターンを覆う保護膜が形成されており、
前記異方性導電膜は、前記液晶パネルの外側、かつ、前記保護膜に重なる領域まで延在していることを特徴とする請求項1記載の液晶表示装置。 - 前記異方性導電膜は、前記フレキシブル基板の前記端部から前記液晶パネルの前記表示部側にはみ出すように配設されていることを特徴とする請求項2記載の液晶表示装置。
- 前記液晶パネルは、その周縁部が面取りされて面取り部が形成されており、
前記フレキシブル基板は、前記面取り部に沿って屈曲し、かつ、前記異方性導電膜によって前記面取り部に接着、固定されていることを特徴とする請求項1乃至3のいずれか一に記載の液晶表示装置。 - 対向する一対の基板間に液晶が挟持された液晶パネルと、前記液晶パネルと回路基板とを接続するためのフレキシブル基板とを少なくとも備える液晶表示装置における前記液晶パネルと前記フレキシブル基板との接続方法であって、
前記液晶パネルの表示部の周囲に設けられた端子部上に、前記液晶パネルの外側にはみ出すように異方性導電膜を配設する第1の工程と、
前記フレキシブル基板を位置合わせして前記異方性導電膜上に載置する第2の工程と、
前記フレキシブル基板上に緩衝材を載置する第3の工程と、
前記液晶パネルの前記端子部及び前記外側の領域にツールを載置して前記異方性導電膜を加熱及び加圧する第4の工程と、を少なくとも有することを特徴とする液晶表示装置の製造方法。 - 対向する一対の基板間に液晶が挟持された液晶パネルと、前記液晶パネルと回路基板とを接続するためのフレキシブル基板とを少なくとも備える液晶表示装置における前記液晶パネルと前記フレキシブル基板との接続方法であって、
前記液晶パネルの表示部の周囲に設けられた端子部上に、前記液晶パネルの外側にはみ出すように異方性導電膜を配設する第1の工程と、
前記フレキシブル基板を位置合わせして前記異方性導電膜上に載置する第2の工程と、
前記フレキシブル基板上に緩衝材を載置する第3の工程と、
前記液晶パネルの前記端子部に第1のツールを載置し、前記液晶パネルの前記外側の領域に第2のツールを載置し、前記第2のツールで前記フレキシブル基板を押し下げながら前記第1のツールで前記異方性導電膜を加熱及び加圧する第4の工程と、を少なくとも有することを特徴とする液晶表示装置の製造方法。 - 前記液晶パネルは、その周縁部が面取りされて面取り部が形成されており、
前記第4の工程では、前記ツール又は前記第2のツールと前記緩衝材とを用いて前記フレキシブル基板を前記面取り部に沿って屈曲させ、前記異方性導電膜によって前記フレキシブル基板を前記面取り部に接着、固定することを特徴とする請求項5又は6に記載の液晶表示装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006013822A JP5128773B2 (ja) | 2006-01-23 | 2006-01-23 | 液晶表示装置の製造方法 |
US11/655,979 US7714973B2 (en) | 2006-01-23 | 2007-01-22 | Liquid crystal display device and manufacturing method thereof |
CN2007100040920A CN101008751B (zh) | 2006-01-23 | 2007-01-23 | 液晶显示装置及其制造方法 |
Applications Claiming Priority (1)
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JP2006013822A JP5128773B2 (ja) | 2006-01-23 | 2006-01-23 | 液晶表示装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
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JP2007193275A true JP2007193275A (ja) | 2007-08-02 |
JP2007193275A5 JP2007193275A5 (ja) | 2009-02-12 |
JP5128773B2 JP5128773B2 (ja) | 2013-01-23 |
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JP2006013822A Active JP5128773B2 (ja) | 2006-01-23 | 2006-01-23 | 液晶表示装置の製造方法 |
Country Status (3)
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US (1) | US7714973B2 (ja) |
JP (1) | JP5128773B2 (ja) |
CN (1) | CN101008751B (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010070779A1 (ja) * | 2008-12-19 | 2010-06-24 | パナソニック株式会社 | 異方性導電樹脂、基板接続構造及び電子機器 |
JP2010199527A (ja) * | 2009-03-31 | 2010-09-09 | Sony Chemical & Information Device Corp | 接合体及びその製造方法 |
KR20130022067A (ko) * | 2011-08-24 | 2013-03-06 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이장치 |
JP2015060977A (ja) * | 2013-09-19 | 2015-03-30 | 三菱電機株式会社 | 表示装置 |
JP2016221703A (ja) * | 2015-05-27 | 2016-12-28 | ブラザー工業株式会社 | 液体吐出装置、液体吐出装置の製造方法、配線部材、及び、配線部材の製造方法 |
WO2019234888A1 (ja) * | 2018-06-07 | 2019-12-12 | 堺ディスプレイプロダクト株式会社 | 表示パネルの製造方法および表示パネル |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
CN101236313B (zh) * | 2008-02-28 | 2010-08-11 | 友达光电股份有限公司 | 显示器及其制造方法 |
JP2011059149A (ja) * | 2009-09-07 | 2011-03-24 | Hitachi Displays Ltd | 電子機器 |
CN103513448A (zh) * | 2012-06-25 | 2014-01-15 | 苏州工业园区赫光科技有限公司 | 一种液晶显示模组温度保护装置 |
CN103513452A (zh) * | 2012-06-29 | 2014-01-15 | 北京京东方光电科技有限公司 | 显示装置的组装方法 |
KR102067148B1 (ko) * | 2013-09-30 | 2020-01-17 | 삼성디스플레이 주식회사 | 표시 장치 |
GB2525605B (en) * | 2014-04-28 | 2018-10-24 | Flexenable Ltd | Method of bonding flexible printed circuits |
KR102323242B1 (ko) * | 2015-03-10 | 2021-11-08 | 삼성디스플레이 주식회사 | 가요성 표시 장치 |
US9978674B2 (en) | 2016-04-05 | 2018-05-22 | Samsung Electronics Co., Ltd. | Chip-on-film semiconductor packages and display apparatus including the same |
CN111512707B (zh) * | 2017-12-22 | 2022-04-05 | 华为技术有限公司 | 板上柔性电路各向异性导电胶互连 |
KR20200135586A (ko) * | 2019-05-22 | 2020-12-03 | 삼성디스플레이 주식회사 | 연성 회로 필름 본딩 장치 및 이를 이용한 연성 회로 필름 부착 방법 |
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2006
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- 2007-01-23 CN CN2007100040920A patent/CN101008751B/zh active Active
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WO2010070779A1 (ja) * | 2008-12-19 | 2010-06-24 | パナソニック株式会社 | 異方性導電樹脂、基板接続構造及び電子機器 |
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WO2010113367A1 (ja) * | 2009-03-31 | 2010-10-07 | ソニーケミカル&インフォメーションデバイス株式会社 | 接合体及びその製造方法 |
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KR20130022067A (ko) * | 2011-08-24 | 2013-03-06 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이장치 |
KR101697972B1 (ko) * | 2011-08-24 | 2017-01-20 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이장치 |
JP2015060977A (ja) * | 2013-09-19 | 2015-03-30 | 三菱電機株式会社 | 表示装置 |
JP2016221703A (ja) * | 2015-05-27 | 2016-12-28 | ブラザー工業株式会社 | 液体吐出装置、液体吐出装置の製造方法、配線部材、及び、配線部材の製造方法 |
WO2019234888A1 (ja) * | 2018-06-07 | 2019-12-12 | 堺ディスプレイプロダクト株式会社 | 表示パネルの製造方法および表示パネル |
Also Published As
Publication number | Publication date |
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CN101008751A (zh) | 2007-08-01 |
JP5128773B2 (ja) | 2013-01-23 |
CN101008751B (zh) | 2011-12-07 |
US20070171347A1 (en) | 2007-07-26 |
US7714973B2 (en) | 2010-05-11 |
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