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JP2007142526A5 - - Google Patents

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Publication number
JP2007142526A5
JP2007142526A5 JP2005329795A JP2005329795A JP2007142526A5 JP 2007142526 A5 JP2007142526 A5 JP 2007142526A5 JP 2005329795 A JP2005329795 A JP 2005329795A JP 2005329795 A JP2005329795 A JP 2005329795A JP 2007142526 A5 JP2007142526 A5 JP 2007142526A5
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JP
Japan
Prior art keywords
piezoelectric
support portion
piezoelectric substrate
wafer
axis
Prior art date
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Application number
JP2005329795A
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Japanese (ja)
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JP2007142526A (en
JP4830069B2 (en
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Publication date
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Priority to JP2005329795A priority Critical patent/JP4830069B2/en
Priority claimed from JP2005329795A external-priority patent/JP4830069B2/en
Publication of JP2007142526A publication Critical patent/JP2007142526A/en
Publication of JP2007142526A5 publication Critical patent/JP2007142526A5/ja
Application granted granted Critical
Publication of JP4830069B2 publication Critical patent/JP4830069B2/en
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Claims (5)

圧電ウエハ本体と、
支持部により前記圧電ウエハ本体に接続される圧電基板と、を有し、
ＡＴカットされた水晶で形成された圧電ウエハであって、
前記圧電基板は、矩形であり、その長辺が前記水晶のＸ軸に沿って形成され、
前記支持部は、前記圧電基板の短辺のうちの一辺に形成され、
前記支持部の外側面は、前記Ｘ軸に沿って、前記圧電基板の前記長辺と連続して設けられ、
前記支持部の内側面には、前記水晶のＺＺ’軸に沿う第１の溝が設けられた、
ことを特徴とする圧電ウエハ。 And the pressure electrostatic wafer body,
Includes a piezoelectric substrate which is connected to the piezoelectric wafer body by supporting lifting portion,
A piezoelectric wafer formed of AT-cut quartz,
The piezoelectric substrate is rectangular, and its long side is formed along the X axis of the quartz crystal,
The support portion is formed on one side of the short sides of the piezoelectric substrate,
The outer surface of the support portion is provided continuously with the long side of the piezoelectric substrate along the X axis ,
A first groove along the ZZ ′ axis of the crystal is provided on the inner surface of the support portion.
A piezoelectric wafer characterized by that. 前記支持部の前記外側面に、前記ＺＺ’軸に沿った第２の溝を設けたことを特徴とする請求項１に記載の圧電ウエハ。 The piezoelectric wafer according to claim 1, wherein a second groove along the ZZ ′ axis is provided on the outer surface of the support portion. 前記第２の溝の長さは、前記第１の溝の長さよりも短いことを特徴とする請求項２に記載の圧電ウエハ。   The piezoelectric wafer according to claim 2, wherein a length of the second groove is shorter than a length of the first groove. 請求項１ないし３のいずれかに記載の圧電ウエハに設けられた前記圧電基板に電極パターンを設け、前記圧電基板を前記支持部から分離してなることを特徴とする圧電デバイス。 It claims 1 provided with an electrode pattern on the piezoelectric substrate provided on the piezoelectric wafer as claimed in any one of 3, a piezoelectric device, characterized by comprising separating the piezoelectric substrate from the support portion. 前記支持部から分離された前記圧電基板をパッケージに搭載したことを特徴とする請求項４に記載の圧電デバイス。 The piezoelectric device according to claim 4 , wherein the piezoelectric substrate separated from the support portion is mounted on a package.
JP2005329795A 2005-11-15 2005-11-15 Piezoelectric wafer Active JP4830069B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005329795A JP4830069B2 (en) 2005-11-15 2005-11-15 Piezoelectric wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005329795A JP4830069B2 (en) 2005-11-15 2005-11-15 Piezoelectric wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011055577A Division JP5152542B2 (en) 2011-03-14 2011-03-14 Quartz wafer manufacturing method

Publications (3)

Publication Number Publication Date
JP2007142526A JP2007142526A (en) 2007-06-07
JP2007142526A5 true JP2007142526A5 (en) 2008-10-23
JP4830069B2 JP4830069B2 (en) 2011-12-07

Family

ID=38204911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005329795A Active JP4830069B2 (en) 2005-11-15 2005-11-15 Piezoelectric wafer

Country Status (1)

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JP (1) JP4830069B2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5251082B2 (en) * 2007-11-22 2013-07-31 セイコーエプソン株式会社 Piezoelectric vibrating piece, piezoelectric device, and method of manufacturing piezoelectric vibrating piece
JP2010004484A (en) * 2008-06-23 2010-01-07 Nippon Dempa Kogyo Co Ltd Crystal oscillator, electronic component, and method of manufacturing element for crystal oscillator
JP5158706B2 (en) * 2008-06-30 2013-03-06 日本電波工業株式会社 Quartz crystal manufacturing method, crystal oscillator and electronic component
JP5251369B2 (en) * 2008-09-03 2013-07-31 セイコーエプソン株式会社 Method for manufacturing piezoelectric vibrating piece
JP4809447B2 (en) 2009-01-30 2011-11-09 日本電波工業株式会社 Manufacturing method of crystal unit
JP5402031B2 (en) * 2009-02-02 2014-01-29 セイコーエプソン株式会社 Quartz crystal vibrating piece processing method and quartz wafer
JP5302776B2 (en) * 2009-05-29 2013-10-02 京セラクリスタルデバイス株式会社 Crystal piece assembly board
JP4908614B2 (en) * 2009-06-12 2012-04-04 日本電波工業株式会社 Manufacturing method of crystal unit
JP5113870B2 (en) 2009-08-27 2013-01-09 日本電波工業株式会社 Manufacturing method of surface mount crystal unit
JP5465992B2 (en) * 2009-12-11 2014-04-09 エスアイアイ・クリスタルテクノロジー株式会社 Quartz crystal unit, electronic component, and method for manufacturing crystal unit
JP5632627B2 (en) * 2010-03-15 2014-11-26 エスアイアイ・クリスタルテクノロジー株式会社 Quartz crystal
JP5929244B2 (en) * 2012-01-31 2016-06-01 株式会社大真空 Thickness-slip vibration type crystal piece, thickness-shear vibration type crystal piece with electrode, crystal diaphragm, crystal resonator and crystal oscillator
JP5725008B2 (en) * 2012-12-27 2015-05-27 セイコーエプソン株式会社 Method for manufacturing piezoelectric vibrating piece
JP5679036B2 (en) * 2013-11-28 2015-03-04 セイコーエプソン株式会社 Piezoelectric vibrating piece, piezoelectric device, and method of manufacturing piezoelectric vibrating piece
JP5872660B2 (en) * 2014-10-09 2016-03-01 エスアイアイ・クリスタルテクノロジー株式会社 Quartz crystal
JP5949882B2 (en) * 2014-11-20 2016-07-13 セイコーエプソン株式会社 Manufacturing method of vibrating piece
JP6532223B2 (en) * 2014-12-01 2019-06-19 京セラ株式会社 Method of manufacturing intermediate product of quartz crystal vibrating element
JP5994880B2 (en) * 2015-02-13 2016-09-21 セイコーエプソン株式会社 Piezoelectric wafer
JP6678428B2 (en) * 2015-10-26 2020-04-08 エスアイアイ・クリスタルテクノロジー株式会社 Method of manufacturing piezoelectric vibrating reed, piezoelectric vibrating reed and piezoelectric vibrator
JP6645211B2 (en) * 2016-01-26 2020-02-14 株式会社大真空 Method for manufacturing crystal vibrating device
JP6206516B2 (en) * 2016-02-04 2017-10-04 セイコーエプソン株式会社 Piezoelectric wafer, method for manufacturing vibrating piece, and method for manufacturing vibrating device
JP7206924B2 (en) * 2018-03-01 2023-01-18 株式会社大真空 piezoelectric vibration device
JP7114027B2 (en) * 2019-03-29 2022-08-08 株式会社村田製作所 Manufacturing method of crystal oscillator

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588221U (en) * 1981-07-10 1983-01-19 シチズン時計株式会社 Tuning fork crystal vibrating piece
JPS58157211A (en) * 1982-03-13 1983-09-19 Kinseki Kk Manufacture of piezoelectric diaphragm
CH646032GA3 (en) * 1982-04-14 1984-11-15
JPH04294622A (en) * 1991-03-25 1992-10-19 Seiko Epson Corp Production of piezoelectric element
JPH05183374A (en) * 1992-01-07 1993-07-23 Seiko Epson Corp Piezoelectric vibrator chip, piezoelectric vibrator and production of piezoelectric vibrator
JP2002033631A (en) * 2000-07-13 2002-01-31 Nippon Dempa Kogyo Co Ltd Electrode forming method for crystal vibrator and the crystal vibrator adopting the method
JP2003298385A (en) * 2002-03-29 2003-10-17 Seiko Instruments Inc At cut crystal resonator and its manufacturing method

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