JP2003298385A - At cut crystal resonator and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an AT cut crystal resonator whose drive characteristics are stable. <P>SOLUTION: Cut off parts 4 of a resonator piece 1 of an AT cut crystal resonator processed by photolitho-etching, are arranged at 2 points of the mounting electrodes 13 side, and occurrence of crack fragments from the cut off parts 4 is prevented by covering the parts with conductive adhesive, so that sticking of the crystal crack fragments does not occur. A deterioration in drive characteristic is prevented by eliminating the sticking of the crack fragments to the electrodes. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal unit used in portable information equipment, and more particularly to an AT-cut crystal unit manufactured by photolithography etching.

[0002]

2. Description of the Related Art FIG. 3 is a plan view showing a conventional crystal oscillator. The crystal unit 10 was provided with a single cut-off portion 4 from the crystal wafer at the center of the support portion of the resonator element 1. The support portion is fixed to the case 2 by the conductive adhesive 3,
It is electrically connected to the excitation electrode.

[0003]

However, such a conventional method has the following problems. In the case where the conventional separating portion 4 has only one place, cracks may occur in the separating portion 4 when the vibrating piece 1 is separated from the crystal wafer. Then, the minute crystal piece of the separating portion 4 adheres to the electrode surface of the vibrating piece 1 supported by the case 2 to cause deterioration of drive characteristics.

[0004]

According to the present invention, there is provided a pair of extraction electrodes on one side of a vibrating piece, and a pair of separating portions extending from the extracting electrodes in the outer peripheral direction of the vibrating piece. The AT-cut piezoelectric vibrator was fixed to the case with a conductive adhesive. Here, when the width of the side having the extraction electrode of the piezoelectric vibrating piece is W, the distance between the separated portions is 0.5 W
To 0.9W is recommended. Here, if the separation portion is widened to fill the width of the resonator element, a large crack is generated on the side surface of the resonator element during separation. Further, if the distance between the cut-off portions is narrowed, an electrical short circuit may occur when the conductive adhesive is applied.

According to the present invention, the vibrating piece is easily separated by forming the notch notch at two places where the vibrating piece is separated from the crystal wafer, and when supporting the vibrating piece on the case, crystal crack pieces are generated on the surface of the supporting portion. It is possible to electrically and mechanically connect the case and the vibrator by applying by coating so as to cover with a conductive adhesive so that there is no, and by preventing the occurrence of crack pieces and scattering by the adhesive, It is possible to manufacture a vibrator with stable drive characteristics, and solve the above problems.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for explaining a vibrating piece separating shape of the present invention. Size of ceramic package is 3.2 × 2.5
The length (L) of the resonator element 1 mounted on the case 2 of 2 mm is 2.
The size is about 0 mm and the width (W) is about 1.0 to 1.3 mm. The excitation electrode 12 and the excitation electrode 12 are provided on the surface of the vibrating piece 1.
There is a pair of mounting electrodes 13 connected to one on one piece. The shape of the separation part 4 has a pitch (p) of 0.8m at two locations.
The notch notch size (a) is about 0.1 mm. After separating such a vibrating piece from the crystal wafer, it is supported by the case 2 as shown in FIG. 2, and the conductive adhesive 3 is applied to the surface of the separating part 4 to remove the crystal crack piece and to the electrode surface. It is possible to manufacture a vibrator with stable drive characteristics by eliminating the adhesion of.

[0007]

As described above, according to the present invention, it is possible to improve the drive characteristics of the crystal unit without causing the small piece of crystal to adhere to the surface of the vibrating piece.

[Brief description of drawings]

FIG. 1 is a diagram illustrating the shape of a resonator element according to the present invention.

FIG. 2 is a diagram illustrating a supporting form of the present invention.

FIG. 3 is a diagram for explaining a conventional vibrator support mode.

[Explanation of symbols]

1 vibrating piece 2 cases 3 Conductive adhesive 4 Separation section 12 Excitation electrode 13 Mounting electrode

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H03H 9/02 H01L 41/18 101A 9/10 41/22 Z

Claims (6)

[Claims] 1. A pair of extraction electrodes is provided on one side of a vibrating piece, and a pair of disconnecting portions is provided extending from the pair of extracting electrodes in the outer peripheral direction of the vibrating piece. AT cut piezoelectric vibrator fixed to the case with. 2. When the width of the side of the piezoelectric vibrating reed having the lead-out electrode is W, the distance between the cut-off portions is 0.
The AT-cut piezoelectric vibrator according to claim 1, which is 5 W to 0.9 W. 3. An AT-cut crystal unit manufactured by photolithographic etching, wherein the crystal unit has two cut-off portions. 4. An AT-cut quartz crystal resonator having a notch in the cut-off portion so that the resonator element can be easily cut off. 5. An AT-cut crystal unit, wherein a conductive adhesive is applied to the surfaces of the two cut-off portions of the crystal piece. 6. A vibrating piece is formed on a piezoelectric vibrator wafer via a pair of separating parts, and an exciting electrode and an extraction electrode connected to the exciting electrode and in contact with the separating part are formed on the vibrating piece. A method of manufacturing an AT-cut crystal oscillator, wherein the oscillator is disposed in the case, and the case and the vibrating piece are electrically and mechanically connected to the extraction electrode and the separation portion by a conductive adhesive.