JP2007036107A - Method of manufacturing composite filter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a composite filter without the need of a process for removing an optical filter layer from electromagnetic wave shielding sheet, when grounding the composite filter, and enables an exposure and grounding of the electromagnetic wave shielding sheet. <P>SOLUTION: The method of manufacturing the composite filter for display includes the processes of: laminating at least a conductor layer 12 having a region for grounding in at least one portion of mesh-like region 101 and around the mesh-like region 101 in one side of a transparent substrate 11; preparing adhesive property optical filter processed into sheets, on one side of which an adhesives layer 22 is laminated, capable of exposing at least one part of the region for grounding; exposing at least one portion of the region for grounding of the electromagnetic wave shielding sheet periphery portion in such a way that an adhesives layer side of the adhesive optical filter is directed to a conductor layer side, and that the adhesive optical filter is bonded and laminated to the electromagnetic wave shielding sheet so that the adhesive optical filter may face a portion facing display in the shielding sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a composite filter having an electromagnetic wave shielding function for shielding electromagnetic waves generated from a display such as a CRT or PDP (shield) and an optical filter function, and more specifically, for grounding the composite filter. The present invention relates to a method for producing a composite filter that does not require a step of peeling and / or removing an optical filter layer from an electromagnetic wave shielding sheet.

  In recent years, with the advancement of functions and increased use of electrical and electronic equipment, electromagnetic noise interference (EMI) has increased, and electromagnetic waves are also generated in displays such as cathode ray tubes (referred to as CRT) and plasma display panels (referred to as PDP). appear. A plasma display panel is a combination of a glass having a data electrode, a fluorescent layer, and a glass having a transparent electrode, and generates a large amount of electromagnetic waves, near infrared rays, and heat when operated. Usually, a front plate including an electromagnetic wave shielding sheet is provided on the front surface of the plasma display panel in order to shield electromagnetic waves. The shielding property of electromagnetic waves generated from the front surface of the display requires a function of 30 dB or more at 30 MHz to 1 GHz. In addition, near infrared rays having a wavelength of 800 to 1,100 nm generated from the front of the display also cause other devices such as VTRs to malfunction, and need to be shielded.

  The electromagnetic wave shielding sheet used for such applications requires light transmittance as well as electromagnetic wave shielding performance. Therefore, as an electromagnetic wave shielding sheet, a transparent conductive ITO (Indium Tin Oxide) film provided on the entire surface of a transparent substrate (Patent Document 1, etc.) or a transparent substrate made of a resin film is bonded with an adhesive. A metal foil such as copper foil is etched to form a mesh (Patent Document 2 etc.).

  In addition to the electromagnetic wave shielding function, the front plate placed on the front of the display blocks unnecessary light emitted from the display (for example, light with a wavelength of about 590 nm due to neon light emission in PDP), and adjusts the hue of the image to reproduce the color. There are cases where a function to improve the performance, a function to suppress unnecessary reflection of external light, a function to suppress unnecessary infrared radiation from the display and to prevent malfunction of an infrared using device may be required. Therefore, as the actual front plate, an electromagnetic wave shielding sheet and an optical filter having other filter functions, for example, a color filter, antireflection filter, near infrared absorption filter, etc., laminated and integrated into a composite filter are used. (For example, Patent Document 3).

When laminating the optical filter layer on the metal mesh surface, the surface of the metal mesh area is flattened by filling the mesh openings with a transparent resin called a flattening resin in advance. In general, the optical filter layer or the like is laminated on the layer via an adhesive layer. This is because the metal mesh layer has a concave and concave surface, and if an optical filter layer is directly laminated with an adhesive, bubbles remain in the metal mesh opening, and the light scattering of the bubbles causes compounding. This is because the problem arises that the haze value of the filter increases.
In the composite filter as described above, the metal mesh of the electromagnetic wave shielding sheet needs to be grounded. Therefore, it is common to have a frame-like metal layer that is provided so as to surround the periphery of the metal mesh and that does not form an opening, and is grounded from this frame-shaped metal layer (patent) Reference 3).

JP-A-1-278800 JP 61-134189 A JP 2003-86991 A JP 2003-66854 A

The conventional composite filter as described above is formed by laminating an electromagnetic wave shielding sheet and an optical filter, each cut to the size of one display, over the entire surface including the grounding portion.
In addition, the grounding process as described above is inevitably performed at a stage close to the final process in which each completed composite filter and display body are combined.
For this reason, when grounding, it is necessary to first peel off the laminated optical filter layer from the frame part of the part to be grounded to expose the metal of the frame part for the composite filter once laminated in all layers. Yes.

For example, in the invention described in Patent Document 4, when the composite filter is cut into the size and shape of one display, a cut that reaches the thickness of the entire optical filter layer that is desired to be peeled off in advance separately from the cut portion is provided. A method is adopted in which the optical filter layer on the edge is peeled and removed at a position where the slit is placed at a position 10 mm away from the end.
In addition, in the optical filter layer to be laminated in advance, a cut that reaches most of the total thickness (half cut) at a location to be peeled and removed (for example, near the boundary between the frame portion of the electromagnetic wave shielding sheet and the mesh region) In addition, there is a method of laminating on a metal mesh to form a composite filter, and then cutting at the cut to peel off and remove the optical filter layer, adhesive layer, or further flattening layer immediately above the frame portion. Has been tried.
Since these operations need to be performed once for each display, mass production processing is impossible, production efficiency is poor, complicated, and skill is required for processing. The whole is wasted.
Further, since the process for planarizing the mesh region as described above requires an extra material and increases the number of processes, and when the composite filter is grounded, the number of objects to be removed and the work load increase. desired.

  The present invention has been made in consideration of the above-described problems, and does not have a step of removing another optical filter layer from the electromagnetic wave shielding sheet for grounding the composite filter, and shields the electromagnetic wave. The main object of the present invention is to provide a method for manufacturing a composite filter that allows the sheet to be exposed and grounded.

The present invention is a method for producing a composite filter for a display comprising a laminate of an electromagnetic wave shielding sheet and an optical filter,
(A) A conductor layer having a mesh-like region capable of covering all of the image display region of the display to be applied on one surface of the transparent base material, and a grounding region in at least a part of the periphery of the mesh-like region. A step of preparing an electromagnetic wave shielding sheet comprising at least laminated,
(B) An adhesive layer is laminated on one surface to cover all portions of the electromagnetic wave shielding sheet facing the image display region of the display and to expose at least a part of the grounding region. Providing a single wafer adhesive optical filter having a shape and dimensions;
(C) The adhesive layer side of the single-wafer adhesive optical filter is directed toward the conductor layer side of the electromagnetic wave shielding sheet, and the single-wafer adhesive optical filter is an image display area of a display in the electromagnetic wave shielding sheet. The sheet-adhesive adhesive optical filter is bonded and laminated to the electromagnetic wave shielding sheet in a state of being positioned so as to face directly above the part facing the electromagnetic wave, and at least a part of the grounding region of the electromagnetic wave shielding sheet is formed. Exposing, and
The above-described problems are solved by providing a method for producing a composite filter for display, characterized by comprising:

  According to the present invention, as an optical filter to be laminated on an electromagnetic wave shielding sheet, a single-wafer adhesive optical filter having the above-mentioned predetermined shape and dimensions in advance and also having an adhesive formed in a predetermined shape dimension in advance. On the electromagnetic wave shielding sheet, which is prepared for grounding the composite filter because it has a step of preparing and laminating and laminating the sheet-adhesive adhesive optical filter on the electromagnetic wave shielding sheet and exposing the edge of the electromagnetic wave shielding sheet. Even if the process for removing and removing the other optical filter layer is abolished, the electromagnetic wave shielding sheet can be exposed and grounded. In addition, there is no outflow or deviation of the adhesive layer to the grounding region, or misalignment between the optical filter and the adhesive layer, which tends to occur when the adhesive layer is applied to the mesh-like region side.

  In the method for manufacturing a composite filter for display according to the present invention, as the electromagnetic wave shielding sheet, the height of the line portion of the mesh region is 3 μm or less, the width of the opening of the mesh region is 150 μm or more, and A single-wafer adhesive optical filter that uses an electromagnetic wave shielding sheet without a flattening layer coating at the openings in the mesh region, and has a fluid adhesive layer at the time of adhesion and lamination as the single-wafer adhesive optical filter Is preferably used. In such a case, it is possible to prevent bubbles from remaining in the openings of the mesh when laminating and bonding the electromagnetic wave shielding sheet and the optical filter while omitting the flattening step on the mesh surface. Therefore, it is possible to avoid the disadvantage that the haze value of the composite filter increases, and to obtain a composite filter with high transparency with high production efficiency.

The method for producing a composite filter according to the present invention of claim 1 does not include a step of removing another optical filter layer from the electromagnetic shielding sheet, which is performed for grounding the composite filter, and the exposure of the electromagnetic shielding sheet and Enable grounding. In addition, there is an effect that there is no outflow or deviation of the adhesive layer to the grounding region, or no positional deviation between the optical filter and the adhesive layer.
The method for manufacturing a composite filter according to the present invention of claim 2 further provides an effect that a composite filter having high transparency can be obtained with high production efficiency while omitting the step of flattening the mesh surface. .

The present invention is a method for producing a composite filter for a display comprising a laminate of an electromagnetic wave shielding sheet and an optical filter,
(A) A conductor layer having a mesh-like region capable of covering all of the image display region of the display to be applied on one surface of the transparent base material, and a grounding region in at least a part of the periphery of the mesh-like region. A step of preparing an electromagnetic wave shielding sheet comprising at least laminated,
(B) An adhesive layer is laminated on one surface to cover all portions of the electromagnetic wave shielding sheet facing the image display region of the display and to expose at least a part of the grounding region. Providing a single wafer adhesive optical filter having a shape and dimensions;
(C) The adhesive layer side of the single-wafer adhesive optical filter is directed toward the conductor layer side of the electromagnetic wave shielding sheet, and the single-wafer adhesive optical filter is an image display area of a display in the electromagnetic wave shielding sheet. The sheet-adhesive adhesive optical filter is bonded and laminated to the electromagnetic wave shielding sheet in a state of being positioned so as to face directly above the part facing the electromagnetic wave, and at least a part of the grounding region of the electromagnetic wave shielding sheet is formed. Exposing, and
It is a manufacturing method of the composite filter for displays characterized by having.
Hereinafter, each process is explained in full detail.

<(A) Step of preparing an electromagnetic wave shielding sheet>
In the step (A) in the present invention, a mesh-like region capable of covering the entire image display region of the display to be applied and at least a part of the periphery of the mesh-like region are grounded on one surface of the transparent substrate. An electromagnetic wave shielding sheet in which at least a conductor layer having a use area is laminated is prepared.

  An example of the electromagnetic wave shielding sheet used in the present invention is shown in FIG. FIG. 1A is a plan view of an example of an electromagnetic wave shielding sheet used in the present invention, and FIG. 1B is a cross-sectional view of an example of an electromagnetic wave shielding sheet used in the present invention. As shown in FIG. 1A, the electromagnetic wave shielding sheet 1 of the present invention includes a mesh region 101 that can cover all image display regions of a display to be applied in the plane direction, and the mesh region. A conductor layer 12 having a grounding region 102 is formed on at least a part of the periphery of the substrate. The mesh area 101 has a size and shape that can cover the entire image display area of the applied display, and always includes a portion 30 that faces the image display area of the applied display. The outer edge portion that is an area outside the portion 30 facing the image display area of the display may include the mesh-shaped area 101 or may include only the grounding area 102. The grounding region 102 normally has the same layer configuration as the mesh region 101 but does not form an opening, and is provided to facilitate grounding when installed on a display. The grounding region 102 may have a mesh shape in which an opening is formed. The grounding region 102 is often provided in a frame shape around the four sides in a portion that does not affect image display, which is an outer edge portion that is an outer region of the portion 30 facing the image display region of a rectangular display, The form may be provided not only on the entire periphery of the mesh region 101 but on a part of the periphery, or may be provided on only three sides, two sides, or one side.

As shown in FIG. 1B, the electromagnetic wave shielding sheet 1 of the present invention is a conductor having a mesh region 101 and a grounding region 102 on one surface of a transparent substrate 11 in the thickness direction. The layer 12 is formed by stacking at least. The electromagnetic wave shielding sheet of the present invention may be formed by further laminating a non-conductive layer on the front and back surfaces of the conductor layer. Examples of the non-conductive layer include a rust preventive layer and a blackened layer that do not have conductivity. Even if it is a rust prevention layer, a blackening layer, etc., as long as it has electroconductivity, it is contained in a conductor layer in this invention. The non-conductive layer further laminated on the front and back surfaces of the conductor layer is integrated with the conductor layer to form a mesh region and a grounding region.
In addition, the electromagnetic wave shielding sheets illustrated below are all formed into single sheets, but in the present invention, the electromagnetic wave shielding sheets are prepared in the form of a continuous belt-like sheet, and will be described later in the form of a continuous belt ( C) You may use for a process.
Hereinafter, the electromagnetic wave shielding filter used in the present invention will be described in order from the transparent substrate 11.

[Transparent substrate]
The transparent substrate 11 is a layer for reinforcing a mesh layer having a low mechanical strength. Therefore, as long as it has light transmittance as well as mechanical strength, it may be selected and used depending on the application, taking into account heat resistance, insulation, etc. as appropriate. Specific examples of the transparent substrate include a resin plate, a resin sheet (or a film, the same applies hereinafter), a glass plate, and the like.

  Examples of transparent resins used as resin plates and resin sheets include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, terephthalic acid-isophthalic acid-ethylene glycol copolymer, and terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer. Polyester resins such as nylon 6, polyamide resins such as nylon 6, polyolefin resins such as polypropylene and polymethylpentene, acrylic resins such as polymethyl methacrylate, styrene resins such as polystyrene and styrene-acrylonitrile copolymer, triacetyl Examples thereof include cellulose resins such as cellulose, imide resins, and polycarbonate resins.

In addition, these resins are used as a single or a plurality of types of mixed resins (including polymer alloys) as a resin material, and as a layer, they are used as a single layer or a laminate of two or more layers. In the case of a resin sheet, a uniaxially stretched or biaxially stretched sheet is more preferable in terms of mechanical strength.
Moreover, you may add additives, such as a ultraviolet absorber, a filler, a plasticizer, an antistatic agent, in these resins suitably as needed.

  Further, as glass of the glass plate, there are quartz glass, borosilicate glass, soda lime glass, etc. More preferably, the thermal expansion coefficient is small, the dimensional stability and the workability in high-temperature heat treatment are excellent, and the alkali component in the glass Non-alkali glass that does not contain any of them can be used, and it can also be used as an electrode substrate as a front substrate of a display.

  The thickness of the transparent substrate is not particularly limited as long as it depends on the application. When the transparent substrate is made of a transparent resin, it is usually about 12 to 1000 μm, preferably 50 to 500 μm. On the other hand, when a transparent base material is a glass plate, about 1-5 mm is usually suitable. In any material, if the thickness is less than the above, the mechanical strength is insufficient, causing warping, sagging, breakage, etc. If the thickness exceeds the above, it becomes excessive performance and high cost, and thinning is difficult. .

  In addition, as a transparent base material, a sheet (or film), a plate, or the like made of these inorganic materials or organic materials can be applied, and the transparent base material is a display main body made of a front substrate, a back substrate, or the like. It may be combined with the front substrate which is one component, but in the form using an electromagnetic shielding filter as the front filter placed in front of the front substrate, the sheet is superior to the plate in terms of thinness and lightness. Also, the resin sheet is superior to the glass plate in that it does not break.

In addition, the transparent base material is preferably handled in the form of a continuous belt-like sheet at least at the initial stage of production, such as mesh layer formation, in that the electromagnetic shielding filter can be continuously produced and productivity can be improved. .
In this respect, a resin sheet is a preferable material for the transparent substrate, but among the resin sheets, in particular, polyester resin sheets such as polyethylene terephthalate and polyethylene naphthalate have transparency, heat resistance, cost, and the like. In view of this, a biaxially stretched polyethylene terephthalate sheet is more preferable. In addition, although the transparency of a transparent base material is so good that it is high, Preferably the light transmittance which becomes 80% or more by visible light transmittance | permeability is good.

  In addition, a transparent substrate such as a resin sheet is appropriately coated on the surface thereof with known easy processes such as corona discharge treatment, plasma treatment, ozone treatment, flame treatment, primer treatment, pre-heat treatment, dust removal treatment, vapor deposition treatment, and alkali treatment. An adhesion treatment may be performed.

[Conductor layer]
The conductor layer 12 is a layer having conductivity, and is a layer responsible for an electromagnetic wave shielding function. Even if the conductive layer 12 itself is opaque, the presence of an opening in a mesh shape causes an electromagnetic wave shield. It balances performance and light transmission. An example of the conductor layer 12 forming the mesh region 101 is shown in FIG. The conductor layer 12 forming the mesh region 101 has a mesh shape in which the openings 103 are densely arranged, and the mesh region is composed of the openings 103 and the line portions 104 forming a frame. .

  In the present invention, the material and forming method of the conductor layer forming the mesh region and the grounding region are not particularly limited, and various conductor layers in a conventionally known light-transmitting electromagnetic wave shielding sheet can be used. It can be adopted as appropriate. In general, the conductor layer mainly includes a metal layer, and in addition to this, includes a conductive treatment layer as will be described later, and, in some cases, a conductive blackening layer and a rust prevention layer.

  The shape of the mesh is arbitrary and not particularly limited, but the shape of the opening is typically a square. Examples of the shape of the opening include a triangle such as a regular triangle, a square such as a square, a rectangle, a rhombus, and a trapezoid, a polygon such as a hexagon, a circle, and an ellipse. The mesh has a plurality of openings having these shapes, and the openings are usually line-like line portions having a uniform width, and the openings and the openings are generally the same shape and the same size on the entire surface. As an example of a specific size, the width of the line part 104 between the openings is referred to as a line width W as shown in FIG. 2 in terms of the aperture ratio and the invisibility of the mesh, and is 25 μm or less, preferably 20 μm or less. It is preferable that However, it is preferable to secure at least 5 μm or more for the expression of the electromagnetic wave shielding effect and prevention of breakage. The opening width of the opening is represented by (line pitch P) − (line width W). In the present invention, the width is 150 μm or more, preferably 200 μm or more. It is preferable from the point that air bubbles hardly remain in the opening during lamination. However, in order to exhibit electromagnetic wave shielding properties in the MHz to GHz band, the maximum is 3000 μm or less. In the present invention, the thickness of the finally obtained mesh region, that is, the height H of the line portion 104 between the openings is preferably 3 μm or less. In such a case, even when the step of flattening the mesh surface is omitted in advance before the lamination with the optical filter, the adhesive is placed in the opening of the metal mesh when the electromagnetic wave shielding sheet and the optical filter are laminated and bonded. This is because the layer easily enters uniformly, and bubbles do not easily remain in the opening. In this case, it is possible to avoid the disadvantage that the cloudiness value (haze) of the composite filter increases due to light scattering of the bubbles, and it is possible to obtain a composite filter with high transparency with high production efficiency. In consideration of the electromagnetic wave shielding function so that the electric resistance value of the metal is not increased and the electromagnetic wave shielding effect is not easily lost, it is more preferable that the height of the line portion of the mesh region is 1 to 3 μm. . In addition, the height of the line part of a mesh-like area | region says the total thickness including all the thickness of the layer which forms the line part 104. FIG. For example, when the line part 104 is composed of only a conductor layer, the height of the line part is equal to the thickness of the conductor layer. For example, the line part has a conductor layer, a non-conductive blackening layer, and a non-conductive layer. In the case of the conductive rust preventive layer, the height of the line portion is the total thickness of the conductor layer, the nonconductive blackened layer, and the nonconductive rust preventive layer. In addition, the bias angle of the mesh region (angle formed between the mesh line portion and the outer periphery of the electromagnetic wave shielding sheet) may be appropriately set to an angle at which moire is difficult to occur in consideration of the pixel pitch of the display and the light emission characteristics. .

A method for preparing such an electromagnetic wave shielding sheet in which a conductive layer having a mesh-like region is laminated is not particularly limited, and examples thereof include the following four methods.
(1) A method in which a conductive ink is printed in a pattern on a transparent substrate, and metal plating is performed on the conductive ink layer (for example, JP 2000-13088 A).
(2) A method in which a conductive ink or a chemical plating catalyst-containing photosensitive coating solution is applied to the entire surface of a transparent substrate, and the coating layer is made into a mesh by photolithography, followed by metal plating on the mesh (for example, , Sumitomo Osaka Cement Co., Ltd. New Materials Division, New Materials Research Institute, New Materials Research Group, “Photoresolvable Chemical Plating Catalyst”, [online], date not listed, Sumitomo Osaka Cement Co., Ltd. [2003 Search on January 7], Internet <URL: http://www.socnb.com/product/hproduct/display.html>).
(3) After laminating a transparent base material and a metal foil with an adhesive, the metal foil is formed into a mesh by a photolithography method (for example, JP-A-11-145678).
(4) On one surface of the transparent substrate, a metal thin film is formed by sputtering or the like to form a conductive treatment layer, and a transparent substrate on which a metal layer is formed as a metal plating layer by electrolytic plating is prepared. The metal plating layer and the conductive treatment layer of the metal-plated transparent base material are formed into a mesh shape by a photolithography method (for example, Japanese Patent No. 3502979, Japanese Patent Application Laid-Open No. 2004-241761).

  Among them, particularly in the present invention, since the transparency and mesh accuracy are excellent, the display image can be satisfactorily viewed. Further, in the manufacturing process, there is little warpage or mixing of bubbles, and the manufacturing process can be performed at a low yield with a low yield. In view of the above, it is particularly preferable to use the method (4). Then, the method to prepare the electromagnetic wave shielding sheet which has the conductor layer which forms the mesh-shaped area | region by the method of said (4) is demonstrated in detail.

  An example of an electromagnetic wave shielding sheet formed by the method (4) above, in which a conductor layer forming a mesh-like region is laminated on one surface of a transparent substrate, is shown in FIG. 3 is a cross-sectional view taken along line AA and BB in FIG. 3A shows a cross section that crosses the opening, and the openings 103 and the lines 104 are alternately formed. FIG. 3B shows a cross section that cuts the line 104 vertically, and the line 104 made of the conductor layer 12 is formed. Are formed continuously. In FIG. 3, the conductor layer 12 includes a conductive treatment layer 13 and a metal plating layer 14 (hereinafter, both are collectively referred to as a metal layer).

(Formation of conductive treatment layer)
In the above method (4), a conductive treatment layer is formed on the transparent substrate 11 as described above prior to metal electrolytic plating described later. As a method for the conductive treatment, a thin film of a known conductive material may be formed. Examples of the conductive material include metals such as gold, silver, copper, iron, nickel, and chromium, or alloys of these metals (for example, nickel-chrome alloys). Moreover, transparent metal oxides, such as a tin oxide, ITO, and ATO, may be sufficient. The conductive treatment may be a single layer or multiple layers (for example, a laminate of a nickel-chromium alloy and a copper layer), and these materials are formed by a known vacuum deposition method, sputtering method, electroless plating method, or the like. The conductive treatment layer 13 is used. The thickness of the conductive treatment layer 13 is preferably an extremely thin layer of about 0.001 to 1 μm, as long as necessary conductivity can be obtained at the time of plating.

(Metal plating layer)
A metal plating layer 14 is formed on the surface of the conductive treatment layer 13 by electrolytic plating to form a metal-plated transparent substrate. As a material of the metal plating layer 14, for example, gold, silver, copper, iron, nickel, chromium, or the like having a conductivity that can sufficiently shield electromagnetic waves, or an alloy containing these metals can be applied. The metal plating layer 14 may not be a simple substance, but may be a multilayer, and copper or a copper alloy is preferable from the viewpoint of ease of electrolytic plating and conductivity. In the present invention, since the height of the line portion of the mesh region is preferably 1 to 3 μm as described above, the thickness of the metal plating layer 14 is preferably about 2 μm at the maximum. If the height of the line portion of the mesh region is less than this, the electric resistance value of the metal is increased and the electromagnetic wave shielding effect tends to be impaired. The level difference of the part becomes large, and bubbles tend to remain when the adhesive layer is laminated. In addition, the desired high-definition mesh shape cannot be obtained. As a result, the substantial aperture ratio is lowered, the light transmittance is lowered, the viewing angle is lowered, and the visibility of the image is lowered.

(Blackening layer)
In order to absorb external light to the electromagnetic wave shielding sheet 1 and improve the visibility of the image on the display, a blackening process is performed on the observation side of the conductor layer 12 forming the mesh-like region, and the contrast is increased. It is preferable to give a feeling. For this purpose, as shown in FIG. 4, a blackening layer 15A and / or 15B is provided on at least one surface of the metal plating layer 14 as necessary. The blackening layer is carried out by either roughening the surface of the metal plating layer 14, providing light absorption over the entire visible light spectrum (blackening), or using both in combination. Further, when a blackened layer is provided on the surface of the transparent substrate 11, the metal plated layer 14 may be provided after conducting a conductive treatment on the transparent substrate and providing the black plated layer.

  As the blackening layers 15A and 15B, formation of metal oxides and metal sulfides and various methods can be applied. In the case of iron, it is usually exposed to steam at a temperature of about 450 to 470 ° C. for 10 to 20 minutes to form an oxide film (blackened film) of about 1 to 2 μm. An oxide film (blackened film) may be used. Further, in the case of copper, cathodic electrodeposition in which the cathode particles are attached by performing cathodic electrolysis in an electrolytic solution composed of sulfuric acid, copper sulfate, cobalt sulfate, and the like is preferable. By providing the cationic particles, the surface becomes more rough, and at the same time, black is obtained. As the cationic particles, copper particles and alloy particles of copper and other metals can be used, but copper-cobalt alloy particles are preferred. The average particle diameter of the cationic particles is preferably about 0.1 to 1 μm from the viewpoint of black density.

  A preferable black density of the blackened layer is 0.6 or more. In addition, the measurement method of black density was set to the density standard ANSIT as an observation viewing angle of 10 degrees, an observation light source D50, and an illumination type using GRETAG SPM100-11 (trade name, manufactured by Kimoto Co., Ltd.) of COLOR CONTROL SYSTEM. The specimen is measured after calibration. Further, the light reflectance of the blackened layer is preferably 5% or less. The light reflectance is measured using a haze meter HM150 (trade name, manufactured by Murakami Color Co., Ltd.) in accordance with JIS-K7105. In addition, instead of measuring the reflectance, the Y value of reflection may be expressed by a color difference meter. In this case, the Y value is preferably 10 or less.

(Rust prevention layer)
Furthermore, the rust preventive layers 16A and / or 16B are provided so as to cover at least one side of the metal plating layer 14 and, when a blackened layer is provided, so as to cover at least one side of the blackened layers 15A and / or 15B. Is preferably provided.
The rust prevention layers 16A and 16B are preferably provided at least on the blackening layer in order to prevent the rust prevention function and the blackening layer from dropping or deforming. As the rust prevention layer 16B, nickel, zinc, and / or copper oxide, or a chromate treatment layer can be applied. The nickel, zinc, and / or copper oxide may be formed by a known plating method, and the thickness is about 0.001 to 1 μm, preferably 0.001 to 0.1 μm.

When the rust prevention layer 16A is provided on the blackened layer 15A surface of the transparent substrate 11, the conductive treatment is performed on the transparent substrate, and the rust prevention layer 16A is provided by the same material and method as the above 16B. Good. In this case, a black plating layer (corresponding to the blackening layer 15A), the metal plating layer 14, and, if necessary, a blackening layer 15B and a rust prevention layer 16B are sequentially provided on the surface of the rust prevention layer 16A.
The blackening layers 15A and 15B and the rust prevention layers 16A and 16B may be provided at least on the observation side, and the contrast is improved and the visibility of the image on the display is improved. Further, it may be provided on the other surface, that is, on the display surface side, and stray light generated from the display can be suppressed, so that the visibility of the image is further improved.

Next, the process of making the conductor layer on the transparent substrate provided as described above into a mesh by a photolithography method will be described.
First, a conductive layer on a transparent substrate prepared as described above, for example, a metal layer (metal plating layer) 14 on a transparent substrate is provided with a resist layer, mesh-patterned, and not covered with a resist layer. After removing a portion of the metal layer 14 by etching, a mesh-like metal layer is formed by a so-called photolithography method in which the resist layer is removed. Furthermore, existing equipment can be used, and by performing many of these manufacturing processes continuously, quality is high, production efficiency is high, yield is high, and production can be performed at low cost.

(Photolithography method)
A resist layer is provided in a mesh pattern on the conductor layer surface of the laminate, and a portion of the conductor layer that is not covered with the resist layer is removed by etching, and then the resist layer is removed by photolithography to obtain a mesh shape. To do.

(masking)
First, the surface on the conductor layer side of the laminate of the transparent base material 11 and the conductor layer 12 is made into a mesh shape by a photolithography method, and the mesh-like region 101 is formed. Also in this step, it is preferable to process a roll-shaped laminated body continuously wound in a band shape (referred to as a winding process or a roll-to-roll process). While the laminate is conveyed continuously or intermittently, masking, etching, and resist peeling are performed in a stretched state without looseness. When glass is used as the transparent substrate 11, it is processed one by one (referred to as single wafer processing or single wafer processing).

  First, in the masking, for example, a photosensitive resist is applied onto the conductor layer 12 forming the mesh-like region, and after drying, contact exposure with a predetermined pattern plate (photomask), water development, and dura Treat and bake. Note that either a negative type or a positive type of photosensitive resist can be used. When the photosensitive resist is a negative type, the mesh pattern of the pattern plate is a positive (positive image) with transparent line portions. When the photosensitive resist is positive, the mesh pattern of the pattern plate is a negative (negative image) with a transparent opening. Further, the exposure pattern is a desired pattern as an electromagnetic wave shielding sheet, and is composed of a pattern of a mesh area at a minimum. Further, as necessary, a grounding area pattern is added to the outer periphery of the mesh area as shown in FIG.

  In the winding process, the resist is applied by winding the belt-like laminated body (laminated body of the transparent base material 11 and the conductive layer 12) continuously or intermittently while forming the mesh-like region on the surface of the conductive layer 12 A resist such as casein, PVA, or gelatin is dipped (immersed), curtain coated, or poured. Moreover, a dry film resist may be used instead of application | coating, and workability | operativity can be improved. In the case of a casein resist, baking is performed at 200 to 300 ° C., but the lowest possible temperature is preferable in order to prevent warping of the laminate.

(etching)
Etching is performed after masking. As the etching solution used for the etching, a solution of ferric chloride or cupric chloride that can be easily circulated is preferable in the present invention in which etching is continuously performed. The etching is basically the same as the equipment for manufacturing a shadow mask for a color TV cathode ray tube that etches a strip-like continuous steel material, particularly a thin plate having a thickness of 20 to 80 μm. In other words, the existing manufacturing equipment for the shadow mask can be diverted, and from masking to etching can be produced consistently and continuously, which is extremely efficient. Single-wafer processing in the case of using glass as the transparent substrate 11 has also been performed for a long time. After etching, the substrate may be dried after washing with water, stripping the resist with an alkaline solution, and washing. Since the transparent base material is exposed on the surface of the mesh opening thus formed, the transparency of the mesh opening is good.

(Flattening)
In the present invention, an electromagnetic wave shielding sheet having a mesh layer thickness of 3 μm or less and a mesh opening width of 150 μm or more is used as the electromagnetic wave shielding sheet, and the sheet-fed adhesive optical filter By using a single-wafer adhesive optical filter that has a fluid adhesive layer during bonding and lamination, the display has excellent transparency without providing a flattening layer coating on the mesh opening. However, in the case where the adhesive optical filter having the specific adhesive layer is not used, the planarizing layer may be coated on the mesh region in advance.

  The flattening layer may be one having high transparency, good adhesion to the conductive layer of the mesh, and good adhesion to the adhesive in the next step. However, if there are protrusions, dents, or unevenness on the surface of the flattening layer, moire, interference unevenness, and Newton rings may occur when installed on the front surface of the display. In order to prevent such a problem, as a preferable method, after applying a liquid resin, the substrate is laminated with a substrate having excellent flatness and a peelable property, and the coated resin is cured by heating or irradiation with ultraviolet rays. The method of peeling and removing a material is mentioned. As for the surface of the planarization layer, the surface of the planar substrate is transferred to form a smooth surface. The resin used for the flattening layer is not particularly limited, and various natural or synthetic resins can be applied. From the viewpoint of durability, applicability, ease of flattening, flatness, and the like, acrylic ultraviolet curable resins are used. Is preferred.

<(B) Step of preparing a single wafer adhesive optical filter>
In the step (B) according to the present invention, an adhesive layer is laminated on one surface to cover all portions of the electromagnetic wave shielding sheet facing the image display area of the display, and at least one of the grounding areas. A single-wafer adhesive optical filter having a shape and a dimension capable of exposing a portion is prepared.

  A cross-sectional view of an example of the optical filter used in the present invention is shown in FIG. As shown in FIG. 5, the single wafer adhesive optical filter 20 used in the present invention is formed by laminating an adhesive layer 22 on one surface of an optical filter 21. The transparent base material 23 and the function expressing layer 24 are laminated. The functional expression layer is not particularly limited. For example, an optical filter functional layer such as a near-infrared absorbing layer, a neon light absorbing layer, an ultraviolet absorbing layer, an antireflection layer, or the like is essential, and a hard coat layer or an antifouling layer is also necessary. And an antiglare layer. FIG. 6 exemplifies a case where the functional expression layer 24, the transparent base material 23, and the adhesive layer 22 are composed of three layers. Each of the functional expression layer, the transparent substrate, and the adhesive layer is illustrated as follows. There may be a single layer or a multilayer, and there may be a configuration in which the function-expressing layer and the transparent substrate are laminated to each other. In addition, the function-expressing layer may function as a transparent substrate, and may be composed of a function-expressing layer and an adhesive layer. Alternatively, an adhesive layer may be provided between each function expressing layer or between the function expressing layer and the transparent substrate. The optical filter used in the present invention has an adhesive layer on at least one surface and has adhesiveness. Therefore, it is not limited to the transparent substrate side, and there may be a configuration in which an adhesive layer is provided on the function expressing layer side.

[Layer structure of optical filter]
(Transparent substrate)
As the transparent base material used for the optical filter, the same transparent equipment as described in the electromagnetic wave shielding sheet can be used.

(Functional expression layer)
Among the function expressing layers, as the near-infrared absorbing layer, a commercially available film having a near-infrared absorbing agent (for example, Toyobo Co., Ltd., trade name No. 2832) is laminated with an adhesive, or a near-infrared absorbing dye is contained in the binder. May be applied. As the near-infrared absorbing dye, when an optical filter is applied to the front surface of a plasma display panel, which is a typical application, the plasma display panel 7 generates a near-infrared region generated when light is emitted using xenon gas discharge, that is, What absorbs a wavelength range of 800 nm to 1100 nm, and the near infrared transmittance of the band is preferably 20% or less, more preferably 15% or less. At the same time, the near-infrared absorbing layer desirably has a sufficient light transmittance in the visible light region, that is, in the wavelength region of 380 nm to 780 nm. Specific examples of near-infrared absorbing dyes include polymethine compounds, cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, naphthoquinone compounds, anthraquinone compounds, dithiol compounds, imonium compounds, diimonium compounds, and aminium. Compounds, pyrylium compounds, cerium compounds, squarylium compounds, copper complexes, nickel complexes, dithiol metal complexes organic near infrared absorbing dyes, tin oxide, indium oxide, magnesium oxide, titanium oxide, chromium oxide Zirconium oxide, nickel oxide, aluminum oxide, zinc oxide, iron oxide, ammonium oxide, lead oxide, bismuth oxide, inorganic near-infrared absorbing dyes such as lanthanum oxide, etc. can be used alone or in combination of two or more. . In addition, as the binder resin, a polyester resin, a polyurethane resin, an acrylic resin, a curing type using a reaction such as epoxy, acrylate, methacrylate, or isocyanate group that is cured by heat or ultraviolet rays can be applied.

  Among the function expressing layers, the neon light absorbing layer is installed to absorb neon light emitted from the plasma display panel when the optical filter is used for a plasma display. The neon light absorption region has a wavelength of 550 to 640 nm, and is preferably designed so that the light transmittance at a wavelength of 550 nm is 50% or less. The neon light absorption layer may be formed by dispersing a dye conventionally used as a dye having an absorption maximum in a wavelength region of at least 550 to 640 nm in a binder resin as mentioned in the near infrared absorption layer. it can. Specific examples of the dye include cyanine, oxonol, methine, subphthalocyanine or porphyrin.

  Of the function expressing layers, the ultraviolet absorbing layer can be formed by, for example, dispersing an ultraviolet absorbent in a binder resin. Examples of the ultraviolet absorber include organic compounds such as benzotriazole and benzophenone, and inorganic compounds composed of particulate zinc oxide, cerium oxide, and the like. As the binder resin, resins such as those listed for the near infrared absorption layer can be used.

  Among the function-expressing layers, the antireflection layer (AR layer) generally has a multilayer structure in which, for example, a low refractive index layer and a high refractive index layer are alternately laminated. It can be formed by a method or a wet method such as coating. Note that silicon oxide, magnesium fluoride, fluorine-containing resin, or the like is used for the low refractive index layer, and titanium oxide, zinc sulfide, zirconium oxide, niobium oxide, or the like is used for the high refractive index layer.

  Moreover, as a hard coat layer (HC layer) among functional expression layers, for example, polyfunctional (meth) acrylate prepolymers such as polyester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, or Trifunctional or higher polyfunctional (meth) acrylate monomers such as trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, etc., alone or in these monomers or prepolymers It can be formed as a coating film using an ionizing radiation curable resin selected and combined in combination of two or more. Here, (meth) acrylate is a composite notation meaning acrylate or methacrylate.

  In addition, as the antiglare layer (AG layer) among the function-expressing layers, a coating film formed by adding an inorganic filler such as silica in a resin binder, or a shaping process using a shaping sheet or a shaping plate, etc. Thus, the layer surface can be formed as a layer provided with fine irregularities for irregularly reflecting external light. As the resin of the resin binder, a curable acrylic resin, an ionizing radiation curable resin, or the like is preferably used in the same manner as the hard coat layer because surface strength is desired as the surface layer.

Of the function expressing layers, the antifouling layer is generally a water-repellent or oil-repellent coat, and a siloxane-based, fluorinated alkylsilyl compound or the like can be applied. A fluorine-based or silicone-based resin used as a water-repellent paint can be preferably used. For example, when the low refractive index layer of the antireflection layer is formed of SiO ₂ , a fluorosilicate water-repellent paint is preferably used.

(Adhesive layer)
Next, the adhesive layer which is an essential layer in the optical filter used in the present invention and is laminated on one surface will be described.
The adhesive layer is not particularly limited as long as it is a layer capable of adhering the optical filter and the electromagnetic wave shielding sheet, and various natural or synthetic resins, heat or ionizing radiation. A cured resin can be applied.

  Moreover, in this invention, it is especially preferable that it is an adhesive layer which has fluidity | liquidity at the time of adhesion | attachment with the said electromagnetic wave shielding sheet, and lamination | stacking. The fluidity mentioned here refers to the property of having no or only a restoring force with respect to an external force and deforming and displacing indefinitely. For example, Newton viscosity such as water, dilatancy or thixotropic (non-Newton) viscosity, or creep deformability is comprehensively referred to. In such a case, even if the mesh surface of the electromagnetic wave shielding sheet is not flattened, the adhesive layer spreads to every corner in the mesh opening during lamination and adhesion of the electromagnetic wave shielding sheet and the optical filter. Therefore, it is possible to prevent bubbles from remaining in the opening. Accordingly, it is possible to avoid the disadvantage that the haze value of the composite filter increases due to light scattering of bubbles while omitting the step of flattening the mesh surface, and it is possible to obtain a highly transparent optical filter with high production efficiency. . Accordingly, the fluidity of the adhesive layer in the present invention is such that the adhesive layer can be deformed to replace the air in the mesh region opening and fill the opening. The fluidity of the adhesive layer in the present invention is, as a guide, when the adhesive is pressed onto the mesh surface, 50,000 cps or less, preferably about 10000 cps (measured value with a C-type rotational viscometer. It is preferable to have a viscosity of a value of 2). Even when a low-flowing adhesive having a viscosity exceeding 50000 cps is used, the residual bubbles can be eliminated by heating the adhesive layer at the time of bonding and further vacuuming from the electromagnetic wave shielding sheet side. However, after filling the mesh opening of the electromagnetic wave shielding sheet and laminating with the single-wafer adhesive optical filter, the fluidity of the pressure-sensitive adhesive may be lowered as necessary. That is, at the time of adhesion to the electromagnetic wave shielding sheet, the fluidity of the pressure-sensitive adhesive is preferably as low as possible in order to reliably fill the mesh opening. However, the flowability of the adhesive is not required after adhesion and lamination. Rather, the flowability of the adhesive is that the adhesive flows out from the lamination interface between the electromagnetic wave shielding sheet and the single-wafer adhesive optical filter, or the adhesive. This is because when a pigment (colorant) is added to the layer, the discoloration of the pigment may be promoted, which is not preferable.

  As the adhesive layer having fluidity, it is sufficient that the adhesive layer has fluidity at the time of adhesion and lamination. For example, an adhesive layer made of a resin that has been fluidized (liquefied) by dissolving or dispersing in an adhesive or solvent, Even an adhesive layer composed of a natural rubber or synthetic resin that is fluid at room temperature without being dissolved or dispersed, or a syrup-type adhesive in which the polymer is dissolved in the reaction monomer Good. Further, it may be a hot-melt adhesive layer that is melted by applying an appropriate temperature and has fluidity. Further, it may be an adhesive layer containing a polymerization reactive monomer that is liquid at room temperature, and may be an adhesive layer that is cured by light and / or heat after lamination. Among them, as a method for reducing the fluidity of the adhesive layer, for example, a cross-linking agent is added to the adhesive layer in advance and bonded to the electromagnetic wave shielding sheet. Examples of suitable methods include a polymerization method.

Among these, a pressure-sensitive adhesive is preferable as the fluid adhesive layer used in the present invention.
Here, the pressure-sensitive adhesive refers to one type of adhesive. Of the adhesives, the adhesive is bonded only by the pressure on the surface, only by pressing moderately, usually by light pressure. Say what you can. In order to develop the adhesive strength of the pressure-sensitive adhesive, usually, physical energy or action such as heating, humidification, radiation (ultraviolet ray, electron beam, etc.) irradiation is unnecessary, and chemical reaction such as polymerization reaction is also unnecessary. In addition, the pressure-sensitive adhesive can maintain the adhesive strength to the extent that it can be re-peeled after bonding. There is no restriction | limiting in particular as such an adhesive, It has moderate adhesiveness (adhesive force), transparency, and coating suitability from what is conventionally used as a well-known adhesive, and it is used in this invention. An optical filter that does not substantially change the transmission spectrum of the optical filter is appropriately selected.

  An acrylic adhesive is mentioned as an adhesive suitably used. The acrylic pressure-sensitive adhesive is a polymer containing at least a (meth) acrylic acid alkyl ester monomer. Generally, it is a copolymer of a (meth) acrylic acid alkyl ester monomer having an alkyl group having about 1 to 18 carbon atoms and a monomer having a carboxyl group. In the present invention, (meth) acrylic acid refers to acrylic acid and / or methacrylic acid.

Examples of (meth) acrylic acid alkyl ester monomers used here include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, sec-propyl (meth) acrylate, N-butyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, isoamyl (meth) acrylate, n-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, Examples thereof include n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, undecyl (meth) acrylate, and lauryl (meth) acrylate.
Moreover, the said (meth) acrylic-acid alkylester is copolymerized in the quantity of 30-99.5 weight part normally in an acrylic adhesive.

  Moreover, as a monomer which has a carboxyl group which forms an acrylic adhesive, monomers containing a carboxyl group such as (meth) acrylic acid, itaconic acid, crotonic acid, maleic acid, monobutyl maleate and β-carboxyethyl acrylate are used. Can be mentioned.

  Furthermore, in addition to the above, the acrylic pressure-sensitive adhesive used in the present invention may be copolymerized with a monomer having another functional group within a range that does not impair the characteristics of the acrylic pressure-sensitive adhesive. Examples of monomers having other functional groups include monomers containing hydroxyl groups such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and allyl alcohol; (meth) acrylamide, N-methyl Monomers containing amide groups such as (meth) acrylamide and N-ethyl (meth) acrylamide; Monomers containing amide groups and methylol groups such as N-methylol (meth) acrylamide and dimethylol (meth) acrylamide; Monomers having functional groups such as monomers containing amino groups such as (meth) acrylate, dimethylaminoethyl (meth) acrylate and vinylpyridine; epoxy group-containing monomers such as allyl glycidyl ether and (meth) acrylic acid glycidyl ether Can be mentioned. In addition to these, fluorine-substituted (meth) acrylic acid alkyl ester, (meth) acrylonitrile, and the like, vinyl group-containing aromatic compounds such as styrene and methylstyrene, vinyl acetate, and vinyl halide compounds can be used.

Furthermore, in the acrylic pressure-sensitive adhesive used in the present invention, in addition to the monomer having other functional groups as described above, another monomer having an ethylenic double bond can be used. Examples of monomers having an ethylenic double bond include diesters of α, β-unsaturated dibasic acids such as dibutyl maleate, dioctyl maleate and dibutyl fumarate; vinyl esters such as vinyl acetate and vinyl propionate. Vinyl ether; vinyl aromatic compounds such as styrene, α-methylstyrene and vinyl toluene; (meth) acrylonitrile and the like.
In addition to the monomer having an ethylenic double bond as described above, a compound having two or more ethylenic double bonds may be used in combination. Examples of such compounds include divinylbenzene, diallyl malate, diallyl phthalate, ethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, methylene bis (meth) acrylamide, and the like.

  Furthermore, in addition to the above-described monomers, monomers having an alkoxyalkyl chain can be used. Examples of alkoxyalkyl esters of (meth) acrylic acid include 2-methoxyethyl (meth) acrylate, methoxyethyl (meth) acrylate, 2-methoxypropyl (meth) acrylate, 3-methoxypropyl (meth) acrylate , 2-Methoxybutyl (meth) acrylate, 4-methoxybutyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 3-ethoxypropyl (meth) acrylate, 4-ethoxybutyl (meth) acrylate And so on.

Moreover, the homopolymer of a (meth) acrylic-acid alkylester monomer may be sufficient.
For example, (meth) acrylic acid ester homopolymers include poly (meth) acrylate methyl, poly (meth) ethyl acrylate, poly (meth) acrylate propyl, poly (meth) acrylate butyl, poly (meth) Examples include octyl acrylate.
As a copolymer containing 2 or more types of acrylate units, methyl (meth) acrylate- (meth) ethyl acrylate copolymer, (meth) methyl acrylate- (meth) butyl acrylate copolymer, ( Examples include methyl (meth) acrylate- (meth) acrylic acid 2-hydroxyethyl copolymer, methyl (meth) acrylate- (meth) acrylic acid 2-hydroxy-3-phenyloxypropyl copolymer, and the like.

As a copolymer of (meth) acrylic acid ester and other functional monomers, (meth) methyl acrylate-styrene copolymer, (meth) methyl acrylate-ethylene copolymer, (meth) acrylic An acid methyl- (meth) acrylic acid 2-hydroxyethyl-styrene copolymer may be mentioned.
For example, (meth) acrylic acid ester homopolymers include poly (meth) acrylate methyl, poly (meth) ethyl acrylate, poly (meth) acrylate propyl, poly (meth) acrylate butyl, poly (meth) Examples include octyl acrylate.

  As a copolymer containing 2 or more types of acrylate units, methyl (meth) acrylate- (meth) ethyl acrylate copolymer, (meth) methyl acrylate- (meth) butyl acrylate copolymer, ( Examples include methyl (meth) acrylate- (meth) acrylic acid 2-hydroxyethyl copolymer, methyl (meth) acrylate- (meth) acrylic acid 2-hydroxy-3-phenyloxypropyl copolymer, and the like.

As a copolymer of (meth) acrylic acid ester and other functional monomers, (meth) methyl acrylate-styrene copolymer, (meth) methyl acrylate-ethylene copolymer, (meth) acrylic An acid methyl- (meth) acrylic acid 2-hydroxyethyl-styrene copolymer may be mentioned.
Examples of commercially available acrylic pressure-sensitive adhesives include Nos. TU-41A, TD-06, and Nitto Denko's No. 591, no. 5915, no. 5919M, no. 595B, CS9621, LA-50, LA-100, HJ-9210, HJ-9150W, etc. are preferably used.

  As the rubber-based adhesive, the main component is, for example, natural rubber, polyisoprene rubber, polyisobutylene, polybutadiene rubber, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, etc. Those containing at least one selected are used.

Moreover, it is preferable to mix | blend antioxidant with an adhesive bond layer. It is possible to prevent the color change from occurring due to oxidation of the conductive layer by the acid component contained in the adhesive at the interface between the adhesive layer and the conductive layer of the obtained composite filter.
Furthermore, a crosslinking agent such as an isocyanate compound, a tackifier, a silane coupling agent, a filler, and the like can be blended in the adhesive layer as desired.

  The adhesive layer may contain one or more near infrared absorbing dyes, ultraviolet absorbers, and / or neon light absorbing dyes as described above. By doing in this way, since the function of a plurality of functional layers can be combined with one layer and integrated with the adhesive layer, the total thickness, the number of steps, and the cost as a composite filter can be reduced. This is possible and preferable. In that case, the light transmittance in the wavelength region of 800 nm to 1100 nm is 20% or less, particularly 15% or less, and the light transmittance in the wavelength region of 560 to 630 nm is preferably 30% or less, particularly preferably 25% or less. .

[Shape and dimensions of optical filter]
Next, the shape and dimensions of the optical filter will be described.
The optical filter used in the present invention first covers the entire image display area of the display to be applied in order to uniformly exert the function of the optical filter over the entire area of the image display area of the applied display. Must have a shape and dimensions that are possible. Therefore, the optical filter used for this invention has the shape and dimension which can cover all the part 30 which opposes the image display area | region of the display of the said electromagnetic wave shielding sheet first.

  Here, the image display area refers to the entire area inside the frame by the outer frame when viewed from the display side of the display, outside the area that is substantially inside the frame and displaying the image. If there is a black area that substantially does not display an image, it is outside the image display area. However, it is uncomfortable that the appearance is different from that of the image display area as long as the black area is also seen from the viewpoint of practical use. Therefore, for convenience, it is preferable to handle the black area by including it in the image display area. Further, the part of the electromagnetic shielding sheet facing the image display area of the display refers to an area of the mesh shielding area 101 of the electromagnetic shielding sheet that faces the image display area so as to cover the entire image display area of the applied display. It is a region having substantially the same shape and size as the image display region. Usually, in order to facilitate alignment with the image display area of the display, it is often slightly (a few millimeters) larger than the image display area of the display.

  The shape and dimensions of the optical filter used in the present invention are only required to be able to cover the entire portion 30 facing the image display area of the display of the electromagnetic wave shielding sheet, and have the same shape and the same as the image display area of the display. Although it may be a size, it is usually slightly smaller than the image display area of the display in order to facilitate alignment with the image display area of the display or the part of the electromagnetic shielding sheet facing the display image display area. Make it larger. Therefore, the shape of the optical filter can be, for example, a shape that is substantially similar to a portion that opposes the image display area of the applied display or the image display area of the display of the electromagnetic wave shielding sheet. In addition, the size of the optical filter can be increased by, for example, 1 mm to 20 mm, more preferably 1 mm to 10 mm, and particularly preferably 2 mm to 5 mm at each side as compared with the image display area of the display to which the optical filter is applied.

  On the other hand, in the present invention, in order to secure a grounding part on the electromagnetic wave shielding sheet at the same time as laminating the sheet-adhesive adhesive optical filter with the electromagnetic wave shielding sheet, the optical filter used in the present invention is a grounding of the electromagnetic wave shielding sheet. It has a shape and a dimension capable of exposing at least a part of the working area. This grounding region originally does not require mesh formation, but a mesh may be formed. Further, the exposed portion may include a part of a mesh-like region present at the outer edge portion of the portion facing the image display region of the display.

  In order to have a shape and size capable of exposing at least a part of the grounding region of the electromagnetic shielding sheet, the electromagnetic shielding sheet for one sheet when the electromagnetic shielding sheet is actually used as a composite filter for display The shape and dimensions of the electromagnetic wave shielding sheet cannot be exactly the same as the entire area, and the dimensions of the electromagnetic wave shielding sheet are smaller than the entire area of the electromagnetic shielding sheet. It is necessary to have. However, as long as it is possible to expose at least a part of the grounding region, as described above, the shape of the image display region or the portion similar to the image display region of the electromagnetic shielding sheet display is almost similar. For example, as shown in FIG. 6A, even if there is a line that overlaps the edge of the region of one sheet of the electromagnetic wave shielding sheet, only a part thereof becomes the exposed portion 40. Further, as shown in FIG. 6B, for example, the shape may be such that the exposed portion 40 is hollowed out while the edges of one electromagnetic wave shielding sheet overlap. Further, the dimension of the optical filter can be reduced by, for example, 1 mm to 20 mm, more preferably 1 mm to 10 mm, and particularly preferably 2 mm to 5 mm at each side as compared to the area of one electromagnetic wave shielding sheet.

  Single wafer processing may be performed by laminating a functional layer of an optical filter on a base material such as a glass base material having a predetermined size and shape in advance, but in a roll shape. It is preferable from the viewpoint of productivity efficiency to obtain the optical filter by cutting it appropriately.

<(C) Step of exposing the edge of the electromagnetic wave shielding sheet>
In the step (C) according to the present invention, the adhesive layer side of the single-wafer adhesive optical filter is directed to the conductor layer side of the electromagnetic wave shielding sheet, and the single-wafer adhesive optical filter is the electromagnetic wave. Adhering and laminating the sheet-adhesive adhesive optical filter to the electromagnetic wave shielding sheet in a state of being aligned so as to face the portion of the shielding sheet facing the image display area of the display, and the electromagnetic wave shielding sheet At least a part of the grounding area is exposed.

  A method for producing such a composite filter for display of the present invention will be specifically described with reference to the drawings. FIG. 7 is a process diagram showing an example of the process (C) of the method for producing a composite filter for display according to the present invention. FIG. 7A1 is a cross-sectional view showing a state in which the single-wafer adhesive optical filter is positioned so as to face the portion directly opposite to the image display area of the display in the electromagnetic wave shielding sheet. ) Is a plan view showing a state of the alignment. In FIG. 7, the electromagnetic wave shielding sheet is shown as a single sheet. However, the electromagnetic wave shielding sheet may be laminated with a single wafer adhesive optical filter in a continuous belt shape.

  In this step, first, as shown in FIG. 7A1, the adhesive layer 22 side of the single wafer adhesive optical filter 20 is directed toward the conductor layer side 12 of the electromagnetic wave shielding sheet 1, and 7 (A2), when the single-wafer adhesive optical filter 20 uses the electromagnetic wave shielding sheet 1 or the continuous belt-like electromagnetic wave shielding sheet, the entire area 50 for one electromagnetic wave shielding sheet is used. Positioning is performed by directly facing the portion 30 facing the image display area of the display so as to cover the entire portion 30 facing the image display area. When performing this alignment, it is preferable to increase the positional accuracy by attaching a register mark on the electromagnetic wave shielding sheet or using an optical sensor.

  In the state of alignment as described above, next, as shown in FIG. 7 (B1), the adhesive layer 22 of the single wafer adhesive optical filter 20 is adhered and laminated to the electromagnetic wave shielding sheet 1, At least a part of the grounding region of the electromagnetic wave shielding sheet 1 is exposed. The exposed portion 40 is not particularly limited as long as it is appropriately designed so as to enable grounding, but a portion that does not affect the image display around the four sides of the generally rectangular electromagnetic wave shielding sheet is often provided in a frame shape. Even if the entire periphery of the edge of the electromagnetic wave shielding sheet is not exposed, only one side may be exposed, or a part may be exposed at one or several places.

  The composite filter for display of the present invention manufactured by the manufacturing method including the steps as described above does not have a step of removing another optical filter layer from the electromagnetic wave shielding sheet for grounding the composite filter. The electromagnetic shielding sheet can be exposed and grounded. Since there is no peeling and removing step that needs to be performed once for each display, mass production can be performed collectively and production efficiency is good.

  In particular, as the electromagnetic wave shielding sheet, the line-shaped height of the mesh-like region is 3 μm or less, the opening width of the mesh opening is 150 μm or more, and the mesh opening has no flattening layer coating. When using a sheet-fed adhesive optical filter having a fluid adhesive layer at the time of adhesion and lamination as the sheet-fed adhesive optical filter, an electromagnetic shielding sheet is used. A flattening step is not required, and extra materials and steps can be reduced, and a composite filter having excellent transparency can be obtained with high production efficiency.

  The display composite filter obtained by the production method according to the present invention preferably has a high transparency, and preferably has a haze of 3 or less. Here, haze means a value measured by a method according to JIS K7105-1981.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

Hereinafter, the present invention will be specifically described with reference to examples.
<Example 1>
(1) Manufacture of electromagnetic wave shielding sheet The electromagnetic wave shielding filter 1 shown in the plan view of FIG. 1 (A) was produced as follows.
As the transparent base material 11, a continuous belt-like uncolored transparent biaxially stretched polyethylene terephthalate film having a thickness of 100 μm and a polyester resin primer layer formed on one surface was prepared.
On the primer layer of the transparent substrate, a nickel-chromium alloy layer having a thickness of 0.1 μm and a copper layer having a thickness of 0.2 μm (a part of the conductor layer) are sequentially provided by sputtering. Treatment layer 13 was obtained.
A copper metal plating layer 14 (remaining portion of the conductor layer) having a thickness of 2.0 μm is provided on the surface of the conductive treatment layer by an electrolytic plating method using a copper sulfate bath, and the conductive treatment layer 13 and the metal plating layer are provided. Both layers of 14 were formed as the conductor layer 12, and a copper-clad laminate sheet was produced in which the conductor layer was directly formed on the transparent substrate without interposing the adhesive layer therebetween.

  Next, a blackened layer 15B was formed on the conductor layer. Specifically, a nickel plate is used for the anode, and the mesh-like conductor layer is formed on a transparent base material in a blackening plating bath made of a mixed aqueous solution of a nickel ammonium sulfate aqueous solution, a zinc sulfate aqueous solution and a sodium thiocyanate aqueous solution. The laminated sheet formed above is immersed and subjected to electroplating to blacken, and a blackened layer 15B made of a nickel-zinc alloy is formed on the entire surface of the exposed conductor layer so as to be conductive. A sheet on which the body layer 12 (the conductive treatment layer 13, the metal plating layer 14, and the blackening layer 15A) was laminated was obtained.

Next, the conductive layer of the laminated sheet is etched using a photolithography method, and the mesh region 101 including the opening 103 and the line portion 104, and the outer edge that surrounds the four circumferences of the mesh region 101. A frame-shaped grounding region 102 was formed in the part.
Specifically, using a production line for a color TV shadow mask, the etching was performed consistently from masking to etching on the continuous belt-like laminated sheet. That is, after applying a photosensitive etching resist to the entire surface of the conductor layer of the laminated sheet, a desired mesh pattern is closely exposed, developed, hardened, and baked on the area corresponding to the line portion of the mesh. After processing the resist layer into a pattern in which the resist layer remains and there is no resist layer on the area corresponding to the opening, the conductor layer and the blackened layer are etched away with an aqueous ferric chloride solution. A mesh-shaped opening was formed, and then water washing, resist peeling, washing, and drying were sequentially performed.

  The mesh shape of the mesh region is such that the line width of the linear part whose opening is a square and non-opening is 10 μm, the line interval (pitch) is 300 μm, and the height of the line part is 2.3 μm. When the sheet was cut into rectangular sheets as shown in (A), the bias angle defined as the minor angle with respect to the long side of the rectangle was 49 degrees. The mesh region 101 has a portion 30 that faces the image display region of the display when the completed composite filter is mounted on the front surface of the image display device (display), and the periphery of the mesh region 101 The pattern was designed in such a manner that when the composite filter was cut into a rectangular sheet, a frame portion having a width of 15 mm with no opening was left on the outer periphery of the four sides as a grounding region 102. Thus, the electromagnetic wave shielding sheet 1 of Example 1 having no planarization layer was obtained.

(2) Manufacture of single wafer adhesive optical filter Next, the single wafer adhesive optical filter 20 to be laminated on the electromagnetic shielding sheet 1 was prepared. As the layer configuration of the optical filter, an anti-reflection layer / ultraviolet absorption layer / adhesive layer 22 (adhesive layer 22 also serves as a near infrared absorption layer and a neon light absorption layer) was prepared. “/” Indicates that the left and right layers are laminated and integrated.

As the ultraviolet absorbing layer, a Tetron film (trade name “HB type”, manufactured by Teijin Limited), which is a transparent biaxially stretched PET film having a thickness of 50 μm and kneaded with an ultraviolet absorber, was used. The ultraviolet absorbing layer is also used as a base material for coating and forming an antireflection layer.
The antireflection layer was formed by sequentially forming a high refractive index layer and a low refractive index layer on the ultraviolet absorbing layer.
Here, the high refractive index layer is a cured product having a thickness of 3 μm and a refractive index of 1.69 of a composition (trade name “KZ7973” manufactured by JSR Corporation) in which ultrafine zirconia particles are dispersed in an ultraviolet curable resin. Consists of layers.
The low refractive index resin layer is made of a cured product having a thickness of 100 nm and a refractive index of 1.41 made of a fluororesin-based ultraviolet curable resin (manufactured by JSR Corporation, trade name “TM086”).

Further, an adhesive layer 22 is formed on the side opposite to the antireflection layer of the ultraviolet absorber layer, and a near-infrared absorber and a neon light absorber are added to the adhesive layer 22 so that the adhesive layer 22 The agent layer was also used as a near infrared absorption layer and a neon light absorption layer.
A cyanine dye (trade name “TY-167” manufactured by Asahi Denka Kogyo Co., Ltd.) as a neon light absorber, and a diimonium dye (trade name “CIR1085” manufactured by Nippon Carlit Co., Ltd.), phthalocyanine as a near infrared absorber. And a phthalocyanine dye (manufactured by Nippon Shokubai Co., Ltd., trade name “IR14”) were added.

As the adhesive, a low-flowing acrylic resin-based pressure-sensitive adhesive (manufacturer: Nitto Denko Corporation, trade name: CS9621) was used.
The optical filter 20 having the above-described configuration is cut in the same shape as the portion 30 (rectangle) facing the image display area on the mesh area of the electromagnetic wave shielding sheet, and the dimensions are cut large by 4 mm in both the vertical and horizontal directions. A leaf adhesive optical filter was obtained.

(3) Manufacture of composite filter Then, the obtained electromagnetic wave shielding sheet 1 and the single-wafer adhesive optical filter 20 are formed into a mesh shape in which the adhesive layer 22 is the conductor layer 12 as shown in FIG. The sheet-adhesive adhesive optical filter covers the entire portion 30 facing the image display area of the mesh-like area 101 in the direction facing the area 101, and 2 mm on the inner peripheral side of the grounding area 102 is The sheet-adhesive adhesive optical filter was covered, and on the other hand, the outer peripheral side 13 mm of the grounding region 102 was aligned so that nothing was covered and the conductor layer was exposed, and then laminated to each other. The lamination conditions at this time are as follows: a vacuum pump is used to suck from the electromagnetic wave shielding sheet side, and the heated and pressurized state is laminated by hot air blowing at 80 ° C. from the single wafer adhesive optical filter side (so-called autoclave processing). )did.

<Example 2>
In the production of the composite filter of Example 1 (3), the composite filter was prepared in the same manner as in Example 1 except that lamination was performed at room temperature (20 ° C.) with a rubber roller at a maximum pressure of 10 kg / cm. Manufactured.

<Example 3>
In the production of the sheet-fed adhesive optical filter of Example 1 (2), an acrylic resin-based pressure-sensitive adhesive having a high fluidity as an adhesive (manufacturer; manufactured by Yodogawa Paper, trade name: “TU-41A”) A composite filter was produced in the same manner as in Example 1 except that was used.

<Example 4>
As an adhesive in the production of the sheet-fed adhesive optical filter in Example 2 (2), an acrylic resin-based pressure-sensitive adhesive (manufacturer; manufactured by Yodogawa Paper, trade name: “TU-41A”) A composite filter was produced in the same manner as in Example 2 except that it was used.

<Example 5>
(1) Production of electromagnetic wave shielding sheet The electromagnetic wave shielding filter 1 shown in FIG. 1 was produced as follows. First, as a metal foil used as the conductor layer 12, a continuous strip-shaped electrolytic copper foil having a thickness of 10 μm and having a blackened layer 15A made of copper-cobalt alloy particles formed on one surface was prepared.
In addition, a continuous strip-shaped uncolored transparent biaxially stretched polyethylene terephthalate film having a thickness of 100 μm and a polyester resin primer layer formed on one surface was prepared as the transparent substrate 11.
And after carrying out galvanization with respect to both surfaces of the said copper foil, the well-known chromate process was performed by the dipping method, and the antirust layers 16A and 16B were formed in both front and back surfaces.

  Next, the copper foil is composed of 12 parts by mass of a polyester polyurethane polyol having an average molecular weight of 30,000 and a curing agent of 1 part by mass of a xylene diisocyanate-based prepolymer on the transparent substrate primer layer on the blackened layer surface side. Continuously having a transparent adhesive layer having a thickness of 7 μm between the copper foil (antirust layer) and the transparent substrate after dry lamination with a transparent two-component curable urethane resin-based adhesive and curing at 50 ° C. for 3 days. A strip-shaped copper-clad laminate sheet was obtained.

Next, the conductive layer and the blackened layer of the copper-laminated laminated sheet are etched by using a photolithography method, and the mesh region 101 including the opening 103 and the line portion 104, and the mesh region 101 are formed. A frame-shaped grounding region 102 was formed on the outer edge surrounding the four circumferences.
The etching process is the same as in Example 1. The height of the line portion of the mesh region is 10 μm, but the shape and dimensions of the other mesh regions are the same as those in the first embodiment.
Thus, the electromagnetic wave shielding sheet 1 of Example 5 having no planarizing layer was obtained.

(Manufacture of single wafer adhesive optical filter)
In the same manner as in Example 1, a single wafer adhesive optical filter was obtained.
(Manufacture of composite filters)
Then, a single-wafer adhesive optical filter was bonded and laminated on the mesh region 101 of the obtained electromagnetic shielding sheet 1 in the same manner as in Example 1.
Thus, the composite filter of Example 5 was obtained.

<Example 6>
As in Example 5, except that lamination was performed at room temperature (20 ° C.) with a rubber roller at a maximum pressure of 10 kg / cm as a lamination condition in the production of the composite filter of Example 5 (3). Manufactured.

<Example 7>
In the production of the sheet-fed adhesive optical filter of Example 5 (A), an acrylic resin-based pressure-sensitive adhesive having high fluidity as an adhesive (manufacturer; manufactured by Yodogawa Paper, trade name: “TU-41A”) A composite filter was produced in the same manner as in Example 5 except that it was used.

<Example 8>
Acrylic resin-based pressure-sensitive adhesive having high fluidity as an adhesive in the production of the sheet-fed adhesive optical filter of Example 6 (2) (Manufacturer: Yodogawa Paper, trade name: “TU-41A”) A composite filter was produced in the same manner as in Example 6 except that was used.

<Example 9>
(1) Production of electromagnetic wave shielding sheet In the same manner as in Example 1, an electromagnetic wave shielding sheet having no flattening layer was obtained.
Next, the electromagnetic wave shielding sheet once wound on a roll was unwound to form a planarizing layer on the mesh surface.
First, a coating liquid made of a transparent ionizing radiation curable resin composition is subjected to 2 steps toward the entire inner circumference of the frame portion running on both sides in the width direction and the frame portion before and after the flow direction by intermittent coating by the intermittent die coating method. Apply to the mesh area of the electromagnetic wave shielding sheet at a dry coating amount of 25 g / m ² so that it is applied to the position where it has entered 5 mm and the outside is not applied, and completely fills the mesh opening. The coated surface was flattened.

  The coating liquid is a photopolymerization initiator [Irgacure (registered trademark) 184, manufactured by Ciba Specialty Chemicals Co., Ltd.] for a mixture of urethane acrylate oligomer and phenoxyethyl acrylate monomer in a 1: 1 mass ratio. Is 3% by weight, and this is a coating liquid comprising an ionizing radiation curable resin composition further diluted with an organic solvent (a mixed solvent of methyl ethyl ketone: toluene = 1: 1 mass ratio).

And after the said application | coating, as a shaping sheet | seat which shapes a flat surface with respect to the coating film after drying and removing a solvent, the continuous-belt-shaped commercially available biaxially-stretched polyethylene terephthalate film of 50 micrometers in thickness is the easy adhesion process. An untreated surface (surface roughness is JIS B0601 (1994 version) specified centerline average roughness is 0.01 μm) was laminated to the coating film. After this, ultraviolet rays are irradiated from the side of the shaped sheet (using a D bulb manufactured by Fusion UV Systems) to cure the coating film, and then only the shaped sheet is peeled off to form a flattened layer with a flat surface. did.
Thus, an electromagnetic shielding sheet 1 with a planarizing layer was obtained.

(2) Production of single-wafer adhesive optical filter In the same manner as in Example 1, a single-wafer adhesive optical filter was obtained.
(3) Manufacture of composite filter Then, on the flattened layer of the obtained electromagnetic shielding sheet 1, a single wafer adhesive optical filter was bonded and laminated in the same manner as in Example 1.
Thus, the composite filter of Example 9 was obtained.

<Example 10>
Example 9 (3) The composite filter was manufactured in the same manner as in Example 9 except that the lamination was performed at room temperature (20 ° C.) with a rubber roller at a maximum pressure of 10 kg / cm as the lamination condition. Manufactured.

<Example 11>
Acrylic resin-based pressure-sensitive adhesive having high fluidity as an adhesive in the production of the sheet-fed adhesive optical filter of Example 9 (2) (manufacturer: Yodogawa Paper, trade name: “TU-41A”) A composite filter was produced in the same manner as in Example 9 except that was used.

<Example 12>
As an adhesive in the production of the sheet-fed adhesive optical filter of Example 10 (2), an acrylic resin-based pressure-sensitive adhesive having a high fluidity (manufacturer; manufactured by Yodogawa Paper, trade name: “TU-41A”) The composite filter was manufactured by laminating in the same manner as in Example 10 except that.

<Example 13>
(1) Production of electromagnetic wave shielding sheet In the same manner as in Example 5, an electromagnetic wave shielding sheet without a planarizing layer was obtained.
Next, a planarizing layer was formed on the mesh surface of the electromagnetic wave shielding sheet in the same manner as in Example 9.
Thus, an electromagnetic shielding sheet 1 with a planarizing layer was obtained.

(2) Production of single-wafer adhesive optical filter In the same manner as in Example 1, a single-wafer adhesive optical filter was obtained.
(3) Manufacture of composite filter Then, on the flattened layer of the obtained electromagnetic shielding sheet 1, a single-wafer adhesive optical filter was bonded and laminated in the same manner as in Example 1.
Thus, the composite filter of Example 13 was obtained.

<Example 14>
As in Example 13, except that lamination was performed at room temperature (20 ° C.) with a rubber roller at a maximum pressure of 10 kg / cm as a lamination condition in the production of the composite filter of Example 13 (3). Manufactured.

<Example 15>
Acrylic resin-based pressure-sensitive adhesive having high fluidity as an adhesive in the production of the sheet-fed adhesive optical filter of Example 13 (manufacturer: Yodogawa Paper, trade name: “TU-41A”) A composite filter was produced in the same manner as in Example 13 except that was used.

<Example 16>
An acrylic resin-based pressure-sensitive adhesive having a high fluidity as an adhesive in the production of the sheet-fed adhesive optical filter of Example 14 (2) (manufacturer: Yodogawa Paper, trade name: “TU-41A”) A composite filter was manufactured by laminating in the same manner as in Example 14 except that was used.

<Comparative Example 1>
In the manufacture of the sheet-adhesive adhesive optical filter of Example 1 (2), when the sheet-adhesive adhesive optical filter 20 is cut into sheets, the shape and dimensions of the sheet-adhesive adhesive optical filter 20 are as follows. Same as above.
Further, when laminating the sheet-adhesive adhesive optical filter 20 with the electromagnetic wave shielding sheet 1, the outer edge portions of the both are aligned, and the sheet-adhesive adhesive optical filter 20 is arranged on the mesh area 101 of the electromagnetic wave shielding sheet 1 and Both the grounding regions 102 were covered over the entire area.
Others were processed in the same manner as in Example 1 to obtain a composite filter of Comparative Example 1.

<Comparative example 2>
As in Comparative Example 1, the single-wafer adhesive optical filter 20 has the same shape and dimensions as the single-wafer electromagnetic wave shielding sheet 1, and the single-wafer adhesive optical filter 20 is on the mesh of the electromagnetic wave shielding sheet 1. A composite filter of Comparative Example 2 was obtained by processing in the same manner as in Example 2 except that both the region 101 and the grounding region 102 were laminated so as to cover the entire region.

<Comparative Example 3>
As in Comparative Example 1, the single-wafer adhesive optical filter 20 has the same shape and dimensions as the single-wafer electromagnetic wave shielding sheet 1, and the single-wafer adhesive optical filter 20 is on the mesh of the electromagnetic wave shielding sheet 1. A composite filter of Comparative Example 3 was obtained by processing in the same manner as in Example 3 except that both the region 101 and the grounding region 102 were laminated so as to cover the entire region.

<Comparative example 4>
As in Comparative Example 1, the single-wafer adhesive optical filter 20 has the same shape and dimensions as the single-wafer electromagnetic wave shielding sheet 1, and the single-wafer adhesive optical filter 20 is on the mesh of the electromagnetic wave shielding sheet 1. A composite filter of Comparative Example 4 was obtained by processing in the same manner as in Example 4 except that both the region 101 and the grounding region 102 were laminated so as to cover the entire region.

[Performance evaluation method]
The following points were evaluated with respect to the above examples and comparative examples. The evaluation results are shown in Table 1.
(1) Workability at the time of grounding The grounding work was performed on 10 samples. We compared the necessity of exposure work in the ground contact area, the complexity of the exposure work, and the degree of occurrence of defects.
[Criteria]
No exposure work required; ○
Exposure work is required. However, it can be peeled off every time, no breakage of the conductor layer every time;
Exposure work is required. However, it cannot be peeled once or more, or there is breakage damage to the conductor layer; ×

(2) Transparency of mesh-like region The composite filters were compared through visual observation.
Cloudy (cloudy) or those that do not recognize the presence of bubbles; ○
Appearance of cloudiness or air bubbles;
Appearance of cloudiness or bubbles, especially noticeable; ×

FIG. 1A is a plan view of an example of an electromagnetic wave shielding sheet used in the present invention, and FIG. 1B is a cross-sectional view of an example of an electromagnetic wave shielding sheet used in the present invention. It is a perspective view which shows an example of the mesh-like area | region 101 of the conductor layer of this invention. It is a figure which shows an example of the electromagnetic wave shielding sheet used for this invention. It is a figure which shows another example of the electromagnetic wave shielding sheet used for this invention. It is a figure which shows an example of the optical filter used for this invention. It is a figure which shows an example of the exposed part of the electromagnetic wave shielding sheet in this invention. It is process drawing which shows an example of the (C) process of the manufacturing method of the composite filter for displays of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electromagnetic wave shielding sheet 11 Transparent base material 12 Conductor layer 13 Conductive treatment layer 14 Metal plating layer (metal layer)
DESCRIPTION OF SYMBOLS 15 Blackening layer 16 Antirust layer 20 Adhesive optical filter 21 Optical filter 22 Adhesive layer 23 Transparent base material 24 Function expression layer 101 Mesh area 102 Grounding area 103 Opening part 104 Line part

Claims (2)

A method for producing a composite filter for a display comprising a laminate of an electromagnetic wave shielding sheet and an optical filter,
(A) A conductor layer having a mesh-like region capable of covering all of the image display region of the display to be applied on one surface of the transparent base material, and a grounding region in at least a part of the periphery of the mesh-like region. A step of preparing an electromagnetic wave shielding sheet comprising at least laminated,
(B) An adhesive layer is laminated on one surface to cover all portions of the electromagnetic wave shielding sheet facing the image display region of the display and to expose at least a part of the grounding region. Providing a single wafer adhesive optical filter having a shape and dimensions;
(C) The adhesive layer side of the single-wafer adhesive optical filter is directed toward the conductor layer side of the electromagnetic wave shielding sheet, and the single-wafer adhesive optical filter is an image display area of a display in the electromagnetic wave shielding sheet. The sheet-adhesive adhesive optical filter is bonded and laminated to the electromagnetic wave shielding sheet in a state of being positioned so as to face directly above the part facing the electromagnetic wave, and at least a part of the grounding region of the electromagnetic wave shielding sheet is formed. Exposing, and
A method for producing a composite filter for display, comprising: As the electromagnetic wave shielding sheet, the height of the line portion of the mesh-like region is 3 μm or less, the opening width of the opening of the mesh-like region is 150 μm or more, and the opening of the mesh-like region is not covered with a flattening layer The single-wafer adhesive optical filter having a fluid adhesive layer at the time of adhesion and lamination is used as the single-wafer adhesive optical filter while using an electromagnetic wave shielding sheet. A method for producing a composite filter comprising a laminate of an electromagnetic wave shielding sheet and an optical filter.

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