JP2007095956A - Package for housing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing electronic components that comprises an insulating frame, through which a via conductor penetrates in the thickness direction, while assuring reliability in airtight sealing with a reduced planar area. <P>SOLUTION: In a package 10 for housing electronic components, an insulating frame 2 that encloses a mounting part 1a is provided on the upper surface of an insulating substrate 1, comprising the mounting part 1a on which an electronic part 5 is mounted. An electrode pad 3 that is electrically connected to the electronic component 5 is provided inside the inner surface of the insulating frame 2. A lid 4 is fitted to the insulating frame 2 to cover the mounting part 1a. The insulating frame 2 comprises a wide part 1b, that protrudes toward the mounting part 1a over the entire length in thickness direction, and a via conductor 6 that penetrates in the thickness direction is formed at the wide part 1b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component storage package for hermetically storing electronic components such as piezoelectric vibrators and semiconductor elements.

  Conventionally, electronic parts such as piezoelectric vibrators and semiconductor elements are housed in an electronic part housing package for housing these electronic parts and are hermetically sealed with a lid to form an electronic device, such as a mobile phone or a computer. Used as a part of various electronic devices.

  What is widely used as such an electronic component storage package is a rectangular insulating substrate having an electronic component mounting portion on its upper surface, and an insulating frame provided on the upper surface of the insulating substrate so as to surround the mounting portion. It is the structure which comprised the body. The insulating substrate and the insulating frame are made of an integrally fired ceramic material or the like.

  A metallized layer is usually formed on the upper surface of the insulating frame. For example, a metal lid is joined to the metallized layer by a joining means such as a brazing method or a welding method, so that the electronic component mounted on the mounting portion is covered with the lid and hermetically sealed.

  The electronic component to be hermetically sealed is led out to the outside of the mounting portion through a wiring conductor formed so as to be led out from the mounting portion to an outer surface such as an outer surface or a lower surface. Of the wiring conductor, a portion exposed to the mounting portion functions as an electrode pad for electrically connecting the electrodes of the electronic component.

A via conductor that penetrates in the thickness direction is formed in the insulating frame. For example, the metallized layer on the upper surface of the insulating frame and the wiring conductor electrically connected to the grounding electrode of the electronic component are electrically connected via the via conductor. As a result, the grounding electrode of the electronic component is electrically connected to a metallized layer having a large area, a metal lid or the like, and the grounding of the electronic component is ensured.
JP 2004-319831 A JP 2003-218265 A

  However, since the electronic component storage package has been downsized (planar area is reduced) in response to the recent downsizing of electronic components, the width of the insulating frame has been reduced. The via conductor occupying a considerable proportion in the width direction is formed in the narrow insulating frame, so that the via conductor portion is formed of, for example, a metallized conductor (sintered metal powder) similar to the metallized layer. ), And the mechanical strength is low, there is a problem that mechanical breakdown such as cracks occurs in the insulating frame. The stress that induces cracks or the like is, for example, thermal stress caused by a difference in thermal expansion coefficient (linear expansion coefficient) between the lid and the insulating frame.

  The present invention has been devised in view of the above-described drawbacks, and an object thereof is to provide a planar area while ensuring reliability of hermetic sealing in an electronic component storage package having an insulating frame through which a via conductor penetrates in the thickness direction. It is an object of the present invention to provide an electronic component storage package that can be reduced in size.

  The electronic component storage package according to the present invention is provided with an insulating frame body surrounding and surrounding the mounting portion on the upper surface of the insulating substrate having the mounting portion on which the electronic component is mounted, and more than the inner side surface of the insulating frame body. An electronic component storage package in which an electrode pad that is electrically connected to the electronic component is provided inside, and a lid is attached to the insulating frame so as to cover the mounting portion, and the insulating frame Has a wide part protruding toward the mounting part over the entire length in the thickness direction, and a via conductor penetrating in the thickness direction is formed in the wide part.

  In the electronic component storage package of the present invention, it is preferable that the wide portion is located in a non-formed portion of the electrode pad.

  According to the electronic component storage package of the present invention, the insulating frame has a wide portion protruding toward the mounting portion over the entire length in the thickness direction, and a via conductor penetrating in the thickness direction is formed in the wide portion. Therefore, the proportion of the via conductor in the width direction of the insulating frame can be kept relatively low. For this reason, it is possible to suppress a decrease in mechanical strength of the insulating frame body even at a portion where the via conductor is formed. As a result, it is possible to effectively prevent mechanical damage such as cracks from occurring in the insulating frame, and to provide an electronic component storage package capable of reducing the planar area while ensuring the reliability of hermetic sealing. be able to.

  In the electronic component storage package of the present invention, preferably, since the wide portion is located in the non-formed portion of the electrode pad, the electrical component electrode to the electrode pad is electrically connected via a connecting material such as a bonding wire. The general connection is prevented from being hindered. Therefore, it is possible to provide an electronic component storage package that is excellent in the reliability of hermetic sealing and is small in size and easy to mount electronic components.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1A is a plan view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. . 1A and 1B, 1 is an insulating substrate having a mounting portion 1a, 2 is an insulating frame, 3 is an electrode pad, and 4 is a lid. The insulating substrate 1, the insulating frame 2, the electrode pad 3, and the lid 4 mainly constitute an electronic component storage package 10.

  The insulating substrate 1 has a square plate shape, for example, and has an electronic component mounting portion 1a at the center of the upper surface. The insulating substrate 1 is made of a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic, an aluminum nitride sintered body, a mullite sintered body, an inorganic material such as an organic resin, an organic resin, and a ceramic sintered body. It is formed of an electrically insulating material such as a composite material.

  When the insulating substrate 1 is formed in a shape having corners such as a square plate shape, each corner may be chamfered into an arc shape or a straight shape (C surface) to prevent chipping or the like.

  The mounting portion 1a has a shape suitable for efficiently mounting the electronic component 5, and has, for example, a substantially rectangular shape similar to a substantially rectangular electronic component (having a long side). In addition, the shape is not particularly similar, and for example, a rectangular shape in which the length of each side is longer than that of the electronic component may be used depending on the arrangement position of the electrode pad.

  The electronic component 5 includes a semiconductor element including an optical semiconductor element such as a light emitting element such as a CCD type or CMOS type light receiving element and a light emitting diode, a piezoelectric element such as a crystal resonator or a surface acoustic wave element, a pressure sensor element, a capacitor, a resistor Devices, inductors and the like.

  An insulating frame 2 is provided on the upper surface of the insulating substrate 1 so as to surround the mounting portion 1a. The insulating frame 2 surrounds the mounting portion 1a and functions as a side wall portion when the mounting portion 1a is hermetically sealed together with a lid 4 described later.

  The insulating frame 2 includes an aluminum oxide sintered body, a glass ceramic, an aluminum nitride sintered body, a ceramic sintered body such as a mullite sintered body, an organic resin such as an epoxy resin and a polyimide resin, and an organic resin. It is formed of an electrically insulating material such as a composite material with an inorganic material such as a ceramic sintered body.

  The insulating substrate 1 and the insulating frame 2 are integrally formed of the same material in consideration of, for example, productivity, bonding strength between the two, reliability, and the like.

  If both the insulating substrate 1 and the insulating frame 2 are made of an aluminum oxide sintered body, raw powders such as aluminum oxide, silicon oxide, and calcium oxide are formed into a sheet shape together with an appropriate organic solvent and a binder. It is produced by laminating and firing the ceramic green sheets produced in this way. In this case, the frame-shaped ceramic green sheet to be the insulating frame 2 is formed by punching the center portion by punching using a mold or the like and forming it into a frame shape.

  Note that the insulating substrate 1 and the insulating frame 2 may be formed individually and bonded via a bonding material such as a resin adhesive, a brazing material, or glass. The individual insulating substrate 1 and the insulating frame 2 can be formed by firing the ceramic green sheet separately into one that becomes the insulating substrate 1 and a frame-like one that becomes the insulating frame 2. It can also be formed by molding an organic resin such as an epoxy resin by a molding means such as injection molding or transfer molding.

  By attaching the lid 4 to the upper surface of the insulating frame 2, the electronic component 5 is hermetically sealed inside the container constituted by the mounting portion 1 a of the insulating substrate 1, the insulating frame 2, and the lid 4. As a result, an electronic device (unsigned) is formed.

  An electrode pad 3 is formed on the inner side of the inner side surface of the insulating frame 2, and an electrode of the electronic component 5 is placed on the electrode pad 3 through a conductive connecting material (not shown) such as a bonding wire or solder. Are electrically connected.

The electrode pad 3 is formed on the outer surface of the electronic device 9 (the lower surface and side surfaces of the insulating substrate 1, the insulation, for example) via wiring conductors (not shown) formed on the surface of the insulating substrate 1 and the insulating frame 2 and inside. To the side surface of the frame 2). That is, the electrode of the electronic component 5 is electrically connected to the electrode pad 3 and led out to the outer surface of the electronic device through the electrode pad 3 and the wiring conductor. The lead-out to the outer surface of the electrode pad 3 may be performed via means other than the wiring conductor (via conductor, lead terminal made of metal such as iron-nickel alloy, lead pin, etc.).

  The lid 4 has a shape and dimensions such that the outer peripheral portion of the lower surface thereof is attached to the upper surface of the insulating frame 2 and is formed of a metal material such as iron-nickel-cobalt alloy, iron-nickel alloy, or copper. Yes.

  If the lid 4 is made of, for example, an iron-nickel-cobalt alloy, the iron-nickel-cobalt alloy plate material is subjected to appropriate metal processing such as rolling, punching, etching, or the like to have a predetermined shape and size. It is produced by molding.

  The lid 4 is attached to the upper surface of the insulating frame 2, for example, a metallized layer 2a is formed on the upper surface of the insulating frame 2, and the outer peripheral portion of the lower surface of the lid 4 is made of gold-tin or the like on the metalized layer 2a This is performed by joining with a joining method such as a brazing method using a brazing material, a resistance welding method, an electron beam welding method or the like.

  The insulating frame 2 has a wide portion 2b protruding toward the mounting portion 1a over the entire length in the thickness direction, and a via conductor 6 penetrating in the thickness direction is formed in the wide portion.

  For example, the metallized layer 2a on the upper surface of the insulating frame 2 and the wiring conductor electrically connected to the grounding electrode (not shown) of the electronic component 5 through the via conductor 6 are electrically connected. Connected. Thereby, the grounding of the electronic component 5 is ensured. Moreover, it can prevent effectively that the electronic component 5 receives the noise (electromagnetic wave) from the outside. For example, when the electronic component 5 is a semiconductor element (semiconductor integrated circuit element) that handles high-frequency signals, such noise shielding has a great effect on the electronic component (in order to suppress malfunction and delay).

  Thus, since the wide portion 2b is provided and the via conductor 6 penetrating in the thickness direction is formed in the wide portion 2b, the ratio of the via conductor 6 in the width direction of the insulating frame 2 is kept relatively low. Can do. For this reason, it is possible to suppress a decrease in mechanical strength of the insulating frame 2 even in the portion where the via conductor 6 is formed.

  As a result, it is possible to effectively prevent mechanical damage such as cracks from occurring in the insulating frame 2, and to provide an electronic component storage package 10 that can reduce the planar area while ensuring the reliability of hermetic sealing. Can be provided.

  Since the via conductor 6 is formed over the entire length in the thickness direction of the insulating frame 2 so as to cover at least part of the wide portion 2b, the wide portion 2b is formed over the entire length in the thickness direction of the insulating frame 2.

  Such a wide portion 2b is formed, for example, by forming a punching pattern at the inner edge of the opening and a protruding portion (non-punched portion) inward when forming a frame-shaped ceramic green sea to be the insulating frame 2. It is formed by adjusting the pattern of the punching die as described above.

  The via conductor 6 does not necessarily have to enter the wide portion 2b in order to obtain the above-described effects such as prevention of cracks in the insulating frame, but from the front end portion of the wide portion 2b on the mounting portion 1a side. It is only necessary that the central portion of the via conductor 6 is located at a position substantially half of the line connecting the outer sides of the insulating frame 2 with straight lines. As a result, the remaining wide portion 2b on the inside and outside of the via conductor 6 and the thickness of the insulating frame 2 are substantially the same, and the mechanically weak portion is not biased.

  Note that the wide portion is approximately 30 μm to 200 μm from the reference line (the line connecting the inner periphery of the portion other than the wide portion) to the mounting portion side with respect to the width of the insulating frame 2 (10 % To 70%) is preferred.

  In addition, the wide portion 2b can be formed in various shapes such as an arc shape, an elliptical arc shape, and a quadrangular shape in plan view, but the via conductor 6 has a circular shape or an elliptical shape in plan view that is easy to form. In some cases, arc shapes and elliptic arc shapes are preferred accordingly.

  In addition, the wide portion 2 b is preferably located in a non-formed portion of the electrode pad 3.

  In this case, the electrical connection of the electrode of the electronic component to the electrode pad 3 through the connecting material such as a bonding wire is prevented from being hindered. Therefore, it is possible to provide an electronic component storage package that is excellent in the reliability of hermetic sealing and is small in size and easy to mount electronic components.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

  For example, the electrode pad 3 may be formed in the central portion of the mounting portion 1a so as not to contact the insulating frame 2.

(A) is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the X-X 'line | wire of (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Mounting part 1b ... Wide part 2 ... Insulating frame 3 ... Electrode pad 4 ... Lid 5 ... Electronic component 6 ... Via conductor 10 ... Package for storing electronic components

Claims (2)

On the upper surface of the insulating substrate having a mounting portion on which electronic components are mounted,
While providing an insulating frame surrounding the mounting portion,
An electrode pad that is electrically connected to the electronic component is provided on the inner side of the inner surface of the insulating frame,
An electronic component storage package in which a lid is attached so as to cover the mounting portion on the insulating frame,
The insulating frame is
It has a wide part protruding toward the mounting part over the entire length in the thickness direction,
A package for storing an electronic component, wherein a via conductor penetrating in the thickness direction is formed in the wide portion. 2. The electronic component storage package according to claim 1, wherein the wide portion is located in a non-formed portion of the electrode pad.

Images