JP2005244146A - Electronic-component housing package, electronic device, and mounting structure of electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable electronic-component housing package in which mechanical damage such as a crack or the like in its insulating base member does not occur and its connecting pads can be surely connected electrically to electrode pads or the like of an outer electric circuit board for a long period of time, and to provide an electronic device using the same. <P>SOLUTION: The electronic-component housing package is provided with the insulating base member 1 having mounting portions 4 for an electronic component 6 on the upper surface of the base member, wiring conductors 3 that leads from the mounting portions 4 to the lower surface of the insulating base member 1, connecting pads 5 formed on the lower surface of the insulating base member 1 and electrically connected to the respective wiring connectors 3, and metal plates 10 that are attached on the surfaces of the connecting pads 5 in such a way that the total peripheral portions of the connecting pads 5 are exposed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component storage package for storing electronic components such as a semiconductor element and a piezoelectric vibrator, an electronic device, and an electronic device mounting structure.

  Conventionally, ceramics made of aluminum oxide sintered bodies, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, etc., are used as electronic component storage packages for storing electronic components such as semiconductor elements and piezoelectric vibrators. The package made from is used. As shown in FIGS. 6 (a), 6 (b), and 6 (c), the conventional package has a rectangular parallelepiped recess 23 for accommodating the electronic component 24 at the center of the upper surface. The insulating base 21 is provided with a mounting portion 27 to which the end of the electronic component 24 is attached at the corner of the bottom surface of the recess 23. A wiring conductor 25 made of a metallized conductor or the like is led out from the upper surface of the mounting portion 27 to the lower surface of the insulating base 21. A connection pad 25 a is formed on the lower surface of the insulating base 21 so as to be connected to the lead-out portion of the wiring conductor 25. 6A is a plan view showing an example of a conventional electronic component storage package, and FIG. 6B is a cross-sectional view taken along the line BB ′ of the electronic component storage package of FIG. 6A. FIG. 6C is a bottom view of the electronic component storage package of FIG.

  The electronic component 24 is accommodated in the recess 23 of the insulating base 21 so that the main surface thereof faces the bottom surface of the recess 23, and the electrode formed at the end of the electronic component 24 is placed in the recess 23. The wiring conductor 25 exposed on the mounting portion 27 is electrically connected via an electrical connection means 28 such as a conductive adhesive, and then the lid 22 is joined around the recess 23 on the upper surface of the insulating base 21. By doing so, it is possible to configure an electronic device in which the electronic component 24 is hermetically sealed inside the container composed of the recess 23 of the insulating base 21 and the lid 22. The recess 23 is hermetically sealed by joining the lid 22 to a metallized layer 26 formed at a portion surrounding the recess 23 on the upper surface of the insulating base 21 via a brazing material such as glass or solder.

  In the electronic device thus formed, the wiring conductor 25 led to the outer surface (lower surface in FIG. 6) of the insulating base 21 and the electrode pad (not shown) of the external electric circuit board are connected to a brazing material such as solder. By connecting via the (conductive bonding material), it is mounted on the external electric circuit board in the form of so-called surface mounting, and the electronic component 24 and the external electric circuit are electrically connected via the wiring conductor 25 and the connection pad 25a. Connected.

In the case of this mounting structure, a solder material such as solder is generally joined by forming a fillet so as to gradually spread outward from the upper end of the side surface of the connection pad 25a to the upper surface of the electrode pad of the external electric circuit board.
JP-A-1994-338750

  In recent years, in such a surface-mount type electronic component storage package and an electronic device using the same, an increase in heat generation and thermal stress associated with higher functionality and higher integration of the electronic components 24 to be stored, Due to the reduction in the connection area of the connection pad 25a due to the miniaturization, the external electrical circuit board is thermally expanded or contracted due to temperature changes, and the electronic component storage package is cracked, or the electronic device and the external electrical circuit board are joined. Since there is a tendency for problems such as poor connection occurring in solder materials such as solder to occur frequently, there is an increasing demand for high reliability of connection to an external electric circuit board.

  However, in the conventional surface mount type electronic component storage package and electronic device, the connection pad 25a and the electrode pad of the external electric circuit board are directly connected via a brazing material such as solder. It is greatly affected by the thermal expansion and contraction of the external electric circuit board due to the change. In particular, an electronic device having a large outer dimension of the electronic component storage package is further affected by this effect, such as occurrence of cracks in the electronic component storage package, solder that joins the electronic device and the external electric circuit board, etc. There has been a problem that defects such as poor connection due to the brazing material are likely to occur.

  Further, in the conventional electronic device mounting structure, a fillet is formed so as to gradually spread outward from the upper end of the side surface of the connection pad 25a (on the insulating base 21 side) to the upper surface of the electrode pad of the external electric circuit board, and solder etc. Since the materials are joined and the above-described thermal stress tends to concentrate on the outer end portion of the fillet, particularly in the outer end portion of the connection pad 25a, the crack of the electronic component storage package, the electronic device and the external electric circuit board Problems such as poor connection of brazing materials such as solder are likely to occur.

  The shape of the soldering material such as solder that connects the connection pad 25a and the electrode pad of the external electric circuit board may make the electronic device more susceptible to thermal expansion and contraction of the external electric circuit board due to temperature changes. there were. For example, when the connection pads 25a formed on the lower surface of the insulating base 21 are formed so as to be greatly separated at both ends on the long side of the rectangular insulating base 21, the electrode pads of the external electric circuit board have a large bonding area. In order to achieve this, the outer periphery of the insulating base 21 needs to be formed so as to protrude largely. However, since the fillet of the brazing material expands from the connection pad 25a to the outside, the area of the mounting region increases. Therefore, the dimensional change of the external electric circuit board in the mounting region becomes very large due to the thermal expansion and contraction of the external electric circuit board due to the temperature change, and the stress due to the large dimensional change causes the stress between the connection pads 25a at both ends of the insulating base 21. In other words, the electronic component storage package is cracked and a connection failure between the electronic device and the external electric circuit board occurs.

  The present invention has been devised in view of such problems, and its purpose is to prevent mechanical damage such as cracks from occurring on the insulating substrate, and to connect the connection pads to electrode pads or the like of an external electric circuit board. An object of the present invention is to provide a highly reliable electronic component storage package, an electronic device, and an electronic device mounting structure that can be reliably electrically connected over a long period of time.

  An electronic component storage package according to the present invention is formed on an insulating base having an electronic component mounting portion on an upper surface, a wiring conductor led out from the mounting portion to a lower surface of the insulating base, and a lower surface of the insulating base. A connection pad electrically connected to the wiring conductor; and a metal plate attached to a surface of the connection pad so that an outer peripheral portion of the connection pad is exposed over the entire periphery. And

  In the electronic component storage package of the present invention, it is preferable that the metal plate has a thickness of 0.1 mm to 0.5 mm.

  In the electronic component storage package according to the present invention, preferably, the metal plate has an upper surface area of 30% to 70% of the area of the connection pad.

  In the electronic component storage package according to the present invention, preferably, at least a pair of the metal plate and the connection pad are arranged to face each other, and are opposite to the side surfaces of the metal plate facing each other. The side surface is a curved surface convex outward in plan view.

  In the electronic component storage package according to the present invention, preferably, at least a pair of the metal plate and the connection pad are arranged to face each other, and the metal plate is disposed on the surface of the connection pad. It is attached so as to be biased to the connection pad side.

  In the electronic component storage package according to the present invention, preferably, the metal plate has a recess formed in a central portion of a lower surface thereof.

  An electronic device according to the present invention includes an electronic component storage package having the above configuration, an electronic component mounted on the mounting portion and electrically connected to the wiring conductor, and the periphery of the mounting portion on the upper surface of the insulating base. And a lid attached to cover the mounting portion.

  The electronic device mounting structure of the present invention is an electronic device mounting structure in which the connection pad of the electronic device described above is mounted on an electrode pad of an external electric circuit board through a conductive bonding material. The electrode pad is larger than the metal plate in plan view, and the conductive bonding material is attached so as to cover the entire side surface of the metal plate from the electrode pad to the connection pad, and the conductive The center portion in the vertical direction of the adhesive bonding material is recessed over the entire circumference.

  In the electronic device mounting structure of the present invention, it is preferable that the conductive bonding material has a width of a bonding portion with the electrode pad that is greater than that of the metal plate than the center side of the insulating base. It is characterized by being smaller on the outer peripheral side of the substrate.

  An electronic component storage package according to the present invention includes an insulating base having a mounting portion for an electronic component on an upper surface, a wiring conductor led out from the mounting portion to the lower surface of the insulating base, and formed on the lower surface of the insulating base and connected to the wiring conductor. Since the connection pad electrically connected and the metal plate attached so that the outer peripheral portion of the connection pad is exposed over the entire circumference on the surface of the connection pad, the connection pad and the external electric circuit are provided. The electrode pads on the board are connected directly with a metal plate sandwiched between them, and after connecting via a brazing material such as solder, the metal plate causes the external electric circuit board to be generated due to temperature changes. It becomes possible to reduce the influence of stress due to thermal expansion and contraction, and the influence of stress can be minimized.

  In addition, since a pool of brazing material can be well formed around the metal plate, the bonding strength between the metal plate and the connection pad can be increased, and stress due to thermal expansion and contraction with the external electric circuit board can be increased. It can be absorbed more effectively by the pool.

  As a result, it is possible to reliably connect the connection pads to the electrode pads of the external electric circuit board for a long period of time, and to stably operate the electronic parts stored in the electronic component storage package for a long period of time. It is possible to provide an electronic component storage package that can be used.

  In the electronic component storage package of the present invention, it is preferable that the metal plate has a thickness of 0.1 mm to 0.5 mm. It can be securely and firmly attached to the connection pad, and the connection reliability of the electronic component storage package to the external electric circuit board can be further improved.

  At the same time, since an interval of at least 0.1 mm to 0.5 mm is formed in the center of the insulating base and connected via a brazing material such as solder, even if the external electric circuit board is bent, Since the metal plate can absorb the mechanical stress that is caused to act on the insulating base due to the deflection, there is an effect of preventing cracks generated in the insulating base.

  The electronic component storage package of the present invention is preferably formed such that the area of the upper surface of the metal plate is 30% to 70% of the area of the connection pad, so that the bonding area between the connection pad and the metal plate is increased. As a result, it is possible to secure the bonding strength more effectively, further relax the stress, and improve the bonding stability and bonding strength with the external electric circuit board.

  In the electronic component storage package of the present invention, it is preferable that at least a pair of the metal plate and the connection pad are arranged so as to face each other, and the side surface opposite to the side surface facing the metal plate. Since the curved surface is convex outward in plan view, the stress acting from the outer peripheral side to the central side of the insulating base due to the contraction of the external electric circuit board is distributed and relaxed with a pair of metal plates in a balanced manner. In addition, the stress can be dispersed and alleviated by making the side surface of the metal plate a curved surface with respect to the outside where the stress is easily applied. For this reason, it is possible to more effectively prevent stress from concentrating on either side of the pair of metal plates and causing mechanical breakdown such as cracks in the insulating base and connection parts, and stable connection of external connections. And the bonding strength can be further improved.

  In the electronic component storage package of the present invention, it is preferable that at least a pair of the metal plate and the connection pad are arranged so as to face each other, and the metal plate is connected to the mating connection pad side on the connection pad surface. Therefore, it is possible to form a larger pool of brazing material on the outside of the connection pad where the stress acts more greatly. And the bonding strength can be further improved.

  In the electronic component storage package according to the present invention, preferably, the metal plate has a recess formed in the central portion of the lower surface thereof, so that the insulating base and the external electric circuit board are connected by the depth of the recess. The bonding area with the pad can be increased. Therefore, it is possible to alleviate the effect of stress due to thermal expansion and contraction of the external electric circuit board that occurs due to temperature changes at the concave portion of this metal plate, and the joint stability and joint strength of the external connection are further improved. It can be.

  An electronic device according to the present invention includes an electronic component storage package configured as described above, an electronic component mounted on the mounting portion and electrically connected to the wiring conductor, and a mounting portion around the mounting portion on the upper surface of the insulating base. Since the cover is attached so as to cover, the heat of the external electric circuit board generated by the temperature change by the metal plate attached between the insulating base and the electrode pad of the external electric circuit board It is possible to mitigate the effects of stress due to expansion and contraction, minimize the effects of stress, and make it highly reliable so that electronic components housed inside can be operated stably. Can do.

  The electronic device mounting structure of the present invention is an electronic device mounting structure in which the connection pad of the electronic device described above is mounted on an electrode pad of an external electric circuit via a conductive bonding material. Is larger than the metal plate in plan view, and the conductive bonding material is applied so as to cover the entire side surface of the metal plate from the electrode pad to the connection pad, and the central portion of the conductive bonding material in the vertical direction. Therefore, the thermal stress acting on the conductive bonding material made of the brazing material can be dispersed in different directions at the upper and lower sides with this recess as a boundary. It is possible to effectively prevent stress such as thermal stress from concentrating on the end portion. As a result, problems such as cracks in the electronic component storage package and poor connection of the conductive bonding material that joins the electronic device and the external electric circuit board occur at the outer end portion of the connection pad. Therefore, a mounting structure with excellent connection reliability can be provided.

  In the electronic device mounting structure of the present invention, it is preferable that the conductive bonding material has a width of the bonding portion with the electrode pad smaller on the outer peripheral side of the insulating base of the metal plate than on the center side of the insulating base of the metal plate. As a result, the area of the insulating substrate to which the electronic components are connected via the conductive bonding material is not greatly expanded to the outer peripheral side, and the area of the mounting area is reduced and the influence due to the dimensional change of the external electric circuit board In addition, the connection area between the conductive bonding material and the electrode pad can be secured sufficiently with a wide bonding portion on the center side of the insulating substrate. Therefore, it is possible to more effectively prevent stresses such as thermal stress that increase toward the outer peripheral side of the insulating base from acting on the conductive bonding material and the like more effectively, and for a long period of time, the electrode pad and the connection pad via the conductive bonding material Thus, it is possible to provide a mounting structure with excellent long-term reliability.

  Further, the area of the mounting area of the electronic device can be kept small, and a mounting structure that is more effective for miniaturization can be obtained.

  Next, an electronic component storage package and an electronic device according to the present invention will be described with reference to the accompanying drawings. FIG. 1A is a plan view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is an AA ′ view of the electronic component storage package of FIG. FIG. 1C is a bottom view of the electronic component storage package of FIG. 2, 3 and 4 are examples of other embodiments. FIG. 5 is an enlarged cross-sectional view of a main part showing an example of an embodiment of an electronic device mounting structure using the electronic component storage package of the present invention. 2 to 5 will be described in detail later.

  1A to 1C, 1 is an insulating base, 9 is a lid, 6 is an electronic component, 3 is a wiring conductor, and 5 is a connection pad. The insulating substrate 1, the wiring conductor 3, and the connection pads 5 constitute the piezoelectric vibrator housing package of the present invention. The electronic device of the present invention is configured by storing the electronic component 6 in this electronic component storage package and sealing with the lid body 9.

  The insulating substrate 1 is made of a ceramic or a resin such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic, and has a side length of about 2 to 20 mm. It has a rectangular parallelepiped shape with a thickness of about 0.5 to 3 mm.

  In addition, a concave portion 2 having, for example, a rectangular parallelepiped shape for housing the electronic component 6 is formed on the upper surface of the insulating base 1. Such an insulating substrate 1 is manufactured as follows. First, in the case of an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a mud. This is formed into a sheet shape by a conventionally known doctor blade method, calendar roll method, or the like to obtain a plurality of ceramic green sheets. Thereafter, the ceramic green sheet is appropriately punched to form a square shape and a frame shape, and the frame shape is positioned in the upper layer so that the square shape is positioned in the lower layer. Thus, a laminated body having a concave portion 2 formed on the upper surface is formed by stacking up and down, and the laminated body is baked at a high temperature (about 1600 ° C.) to form the insulating substrate 1.

  At the corners of the recesses 2 of the insulating base 1, there are formed mounting parts 4 on which the end portions on which the electrodes of the electronic components 6 are formed are mounted and electrically and mechanically connected.

  A part of the wiring conductor 3 is exposed on the upper surface of the mounting portion 4, and the exposed portion of the wiring conductor 3 functions as a pad for electrically connecting the electrodes of the electronic component 6 housed in the recess 2. To do.

  The electronic component 6 is, for example, a surface acoustic wave element such as a semiconductor element or quartz crystal, and generally has an outer shape of a rectangular flat plate, and an electrode is formed at an end thereof.

  The end portion on which the electrode of the electronic component 6 is formed is positioned and placed on the mounting portion 4, and the electrode is electrically connected to the wiring conductor 3 through an electrical connection means 7 such as a conductive adhesive or solder. By connecting and mechanically connecting the electronic component 6 onto the mounting portion 4, the electronic component 6 is accommodated, and the electrode of the electronic component 6 is led out to the lower surface side of the insulating base 1 through the wiring conductor 3.

  A connection pad 5 is formed on the lower surface of the insulating base 1 so as to be connected to the lead-out portion of the wiring conductor 3.

  Then, the electrode of the electronic component 6 connected to the mounting portion 4 is led to the lower surface of the insulating base 1 through the wiring conductor 3 and is electrically connected to the connection pad 5. By connecting the connection pad 5 to an electrode pad of an external electric circuit board via a brazing material such as solder, the electrode of the electronic component 6 is electrically connected to the external electric circuit.

  The connection pad 5 and the wiring conductor 3 are made of a metal material such as tungsten, molybdenum, copper, or silver. For example, when made of tungsten, an organic solvent, a binder, etc. are added to the tungsten powder and kneaded. The conductive paste is formed by printing a predetermined pattern on the surface of a green sheet to be the insulating substrate 1.

  Note that the exposed surfaces of the connection pad 5 and the wiring conductor 3 prevent oxidation corrosion of the connection pad 5 and the wiring conductor 3, connect the connection pad 5 to each electrode of the electronic component 6, In order to strengthen the connection with the external electric circuit board, for example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are preferably sequentially deposited. .

  Moreover, in the electronic component storage package of the present invention, as shown in FIGS. 1B and 1C, the outer peripheral portion of the connection pad 5 is exposed on the entire surface of the connection pad 5. A metal plate 10 is attached.

  In the electronic component storage package of the present invention, the metal plate 10 is attached to the surface of the connection pad 5 so that the outer periphery of the connection pad 5 is exposed over the entire periphery. The electrode pads of the circuit board are not directly connected but are connected with the metal plate 10 interposed therebetween, and after being connected via a brazing material such as solder, the metal plate 10 causes an external electric power generated by a temperature change. It is possible to reduce the influence of stress due to thermal expansion and contraction of the circuit board, and the influence of stress can be minimized.

  Further, since a pool of brazing material can be satisfactorily formed around the metal plate 10, the bonding strength between the metal plate 10 and the connection pad 5 can be increased, and stress due to thermal expansion and contraction with the external electric circuit board can be increased. It can be absorbed more effectively by the accumulation of brazing material.

  As a result, it is possible to reliably connect the connection pads 5 to the electrode pads of the external electric circuit board for a long period of time, and the electronic components 6 housed in the electronic component storage package operate stably for a long period of time. It is possible to provide a package for storing electronic components that can be made to operate.

  The metal plate 10 is preferably made of a material having a relatively small coefficient of thermal expansion, such as an iron-nickel alloy or an iron-nickel-cobalt alloy. As a result, the difference in thermal expansion coefficient from the insulating substrate 1 is reduced, and it is difficult for large thermal stresses to occur between the insulating substrate 1 and the substrate.

  As a method for attaching the metal plate 10 to the connection pad 5, for example, an iron-nickel alloy or iron having a relatively small coefficient of thermal expansion is applied to a nickel plating layer previously formed on the surface of the connection pad 5 of the insulating substrate 1. -It can carry out by positioning the metal plate 10 which consists of metals, such as a nickel- cobalt alloy, via the preform of brazing materials, such as a silver solder. In addition, after joining the metal plate 10 to the connection pad 5, you may make it prevent oxidation corrosion by depositing nickel, gold | metal | money, etc. so that these may be covered integrally.

  In the electronic component storage package of the present invention, the metal plate 10 preferably has a thickness of 0.1 mm to 0.5 mm. When the thickness of the metal plate 10 is 0.1 mm to 0.5 mm, the stress can be relaxed more reliably, and the metal plate 10 can be more securely and firmly attached to the connection pad 5. In addition, the reliability of the connection of the electronic component storage package to the external electric circuit board can be further improved.

  At the same time, since an interval of at least 0.1 mm to 0.5 mm is formed in the center of the insulating base 1 and connected via a brazing material such as solder, even if the deflection of the external electric circuit board occurs. Since the mechanical stress intended to act on the insulating substrate 1 due to the deflection can be absorbed by the metal plate 10, there is an effect of preventing cracks generated in the insulating substrate 1.

  If the thickness of the metal plate 10 is less than 0.1 mm, the amount of deformation of the metal plate 10 is small, so that the effect of relaxing the stress tends to be insufficient. If the thickness exceeds 0.5 mm, a large stress is applied to the metal plate 10. May concentrate and the metal plate 10 may be easily detached from the connection pad 5.

  The electronic component storage package of the present invention is preferably formed so that the area of the upper surface of the metal plate 10 is 30% to 70% of the area of the connection pad 5. By setting the area of the upper surface of the metal plate 10 to 30% to 70% of the area of the connection pad 5, the bonding area between the connection pad 5 and the metal plate 10 is ensured to ensure the bonding strength more effectively and the stress. It is possible to make the relaxation more reliable and to improve the bonding stability and bonding strength with the external electric circuit board.

  Further, as shown in FIGS. 2A to 2C, in the electronic component storage package of the present invention, preferably, at least a pair of the metal plate 10 and the connection pad 5 are arranged to face each other. It is preferable that the opposite side surface of the metal plate 10 is a curved surface convex outward in plan view. Accordingly, the stress acting from the outer peripheral side to the center side of the insulating base 1 due to the contraction of the external electric circuit board can be dispersed and relaxed in a balanced manner by the pair of metal plates 10, and the stress is easily applied to the outside. On the other hand, the stress can be dispersed and relaxed by making the side surface of the metal plate 10 a curved surface. Therefore, it can prevent more effectively that stress concentrates on either one side surface of a pair of metal plates 10, and mechanical destruction, such as a crack, arises in the insulating base 1 or a connection part. Bonding stability and bonding strength can also be improved.

  In addition, as shown in FIGS. 3A to 3C, in the electronic component storage package of the present invention, preferably, at least a pair of the metal plate 10 and the connection pad 5 are arranged to face each other. The metal plate 10 is preferably attached so as to be biased to the connection pad 5 side on the mating side on the surface of the connection pad 5. As a result, a larger pool of brazing material can be formed on the outer side of the connection pad 5 where the stress acts more greatly, so that the bonding stability and bonding strength of the external connection are further improved. can do.

  Also, as shown in FIGS. 4A to 4C, the electronic component storage package of the present invention is preferably configured such that the metal plate 10 has a recess 11 at the center of the lower surface thereof. Good. As a result, the bonding area between the insulating base 1 and the electrode pad of the external electric circuit board can be increased by the depth of the recess 11. Therefore, it becomes possible to alleviate the influence of the stress due to the thermal expansion and contraction of the external electric circuit board generated by the temperature change by the concave portion 11 of the metal plate 10, and the joint stability and joint strength of the external connection are further improved. Can be.

  Further, around the recess 2 on the upper surface of the insulating base 1, for example, if the lid 9 is made of metal, tungsten or molybdenum is provided so as to surround the recess 2 in order to facilitate the joining with the lid 9. A square frame-shaped metallization layer 12 made of metal powder metallization such as copper, silver or the like is formed. The metallized layer 12 has a thickness of about 10 to 30 μm and a width of each side of about 0.2 to 0.5 mm, and functions as a base metal for joining the lid body 9.

  The metallized layer 12 may be brazed with a metal frame for sealing via a brazing material such as silver brazing. When a metal frame is brazed to the surface of the metallized layer 12, for example, a nickel plating layer having a thickness of about 0.5 to 5 μm is previously formed on the surface of the metallized layer 12 in order to improve the wettability with the brazing material. It should be attached.

  Then, the electronic component 6 is accommodated in the recess 2 of the insulating base 1, and an electrode (not shown) formed at the end of the electronic component 6 is attached to the mounting portion 4 formed on the inner surface of the recess 2. The electronic component 6 is insulated by joining the lid body 9 to the upper surface of the metallized layer 12 by a welding method such as a seam welding method or an electron beam method or a brazing method. It is hermetically sealed inside a container composed of the base 1 and the lid 9, and the electronic device of the present invention is completed.

  The electronic device of the present invention includes the electronic component storage package having a configuration excellent in connection reliability to the external electric circuit board, and the electronic component mounted on the mounting portion 4 and electrically connected to the wiring conductor 3. 6 and a lid 9 attached so as to cover the mounting portion 4 around the mounting portion 4 on the upper surface of the insulating base 1, and is attached to the connection pad 5. With the metal plate 10 between the electrode pads of the external electric circuit board, it becomes possible to mitigate the influence of the stress due to the thermal expansion and contraction of the external electric circuit board caused by the temperature change, and minimize the influence of the stress. In addition, the electronic component 6 housed inside can be made highly reliable and can be stably operated.

  In this electronic device, as shown in FIG. 5, the connection pad 5 is connected to the electrode pad 14 of the external electric circuit board 13 through a conductive bonding material 15 made of a brazing material such as solder. It is a mounting structure of the device. FIG. 5 is an enlarged cross-sectional view of the main part of the mounting structure when the electronic device shown in FIGS. 1 to 4 is mounted on the external electric circuit board 13. In FIG. 5, the same parts as those in FIG. Is attached.

  In the mounting structure of the electronic device according to the present invention, the electrode pad 14 is larger than the metal plate 10 in a plan view, and the conductive bonding material 15 covers the entire side surface of the metal plate 10 from the electrode pad 14 to the connection pad 5. Since the central portion in the vertical direction of the conductive bonding material 15 is depressed over the entire circumference, the conductive bonding material 15 acts on the conductive bonding material 15 on the upper side and the lower side with the hollow portion as a boundary. The thermal stress can be dispersed in different directions, and the concentration of stress such as thermal stress on the outer end portion of the connection pad 5 can be effectively prevented. As a result, defects such as cracks in the electronic component storage package and poor connection of the conductive bonding material 15 bonding the electronic device and the external electric circuit board 13 occur at the outer end portion of the connection pad 5 and the like. Can be effectively prevented, and a mounting structure with excellent connection reliability can be provided.

  In the mounting structure of the electronic device according to the present invention, preferably, the conductive bonding material 15 has an insulating base of the metal plate 10 whose width of the joint with the electrode pad 14 is larger than the center side of the insulating base 1 of the metal plate 10. 1 is small on the outer peripheral side of the insulating base 1, so that the area of the mounting region is reduced without greatly expanding the region where the electronic component 6 is connected to the outer peripheral side of the insulating substrate 1 through the conductive bonding material 15. The influence due to the dimensional change of the external electric circuit board 13 can be reduced, and the connection area between the conductive bonding material 15 and the electrode pad 14 is ensured sufficiently large at the wide bonding portion on the center side of the insulating substrate 1. be able to. Therefore, it is possible to more effectively prevent a stress such as a thermal stress that increases toward the outer peripheral side of the insulating substrate 1 from acting on the conductive bonding material 15 and the like more effectively, and the electrode pad 14 via the conductive bonding material 15 over a long period of time. The mounting structure can maintain a connection with the connection pad 5 and has excellent long-term reliability.

  In addition, the area of the mounting area of the electronic device (planar area required for mounting) can be kept small, and the mounting structure can be more effective for downsizing.

  As a result, the electronic component 6 housed in the electronic component housing package can be stably operated over a long period of time.

  When the lid 9 is made of ceramics or resin, in order to allow the lid 9 to be joined to the metallized layer 12 by a brazing method or a welding method, the joint surface of the lid 9 is metalized, plated, or the like. It is preferable to form a metal layer.

  The shape of the lid 9 is suitable for hermetically sealing the recess 2 by joining the outer periphery of the lower surface thereof to the periphery of the recess 2 on the upper surface of the insulating base 1. It has a quadrangular shape having a recess 2 in the surface. When the lid 9 is bonded around the upper surface of the insulating substrate 1, the electronic component 6 is hermetically sealed using glass or resin directly on the surface of the insulating substrate 1 without forming the metallized layer 12. Also good.

  Note that the recess 2 does not need to be a completely rectangular parallelepiped, and the inner corner of the recess 2 is formed into an arc shape to effectively prevent mechanical breakdown such as cracks in the insulating substrate 1 at the corner. You may make it do.

  In addition, this invention is not limited to the example of the above-mentioned embodiment, A various deformation | transformation is possible. For example, the insulating substrate 1 may be formed by laminating three or more ceramic layers.

(A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the AA 'line of the electronic component storage package of (a), (c) is It is a bottom view of the electronic component storage package of (a). (A) is a top view which shows the other example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the AA 'line of the electronic component storage package of (a), (c) ) Is a plan view of the lower surface of the electronic component storage package of FIG. (A) is a top view which shows the other example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the AA 'line of the electronic component storage package of (a), (c) ) Is a plan view of the lower surface of the electronic component storage package of FIG. (A) is a top view which shows the other example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the AA 'line of the electronic component storage package of (a), (c) ) Is a plan view of the lower surface of the electronic component storage package of FIG. (A) is an expanded sectional view of the principal part which shows an example of embodiment of the mounting structure of the electronic device of this invention. (A) is a plan view of a conventional electronic component storage package, (b) is a cross-sectional view of the electronic component storage package of (a) taken along line BB ′, and (c) is for storing the electronic component of (a). It is a bottom view of a package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 3 ... Wiring conductor 4 ... Mounting part 5 ... Connection pad 6 ... Electronic component 9 ... Lid 10 ... Metal plate 11 ... Recess 13 ... External electric circuit board 14 ... Electrode pad 15 ... Conductive bonding material

Claims (9)

An insulating base having an electronic component mounting portion on the top surface, a wiring conductor led out from the mounting portion to the bottom surface of the insulating base, and formed on the bottom surface of the insulating base and electrically connected to the wiring conductor An electronic component storage package comprising: a connection pad; and a metal plate attached to a surface of the connection pad so that an outer peripheral portion of the connection pad is exposed over the entire periphery. 2. The electronic component storage package according to claim 1, wherein the metal plate has a thickness of 0.1 mm to 0.5 mm. 3. The electronic component storage package according to claim 1, wherein an area of the upper surface of the metal plate is 30% to 70% of an area of the connection pad. 4. At least a pair of the metal plate and the connection pad are arranged so as to face each other, and a side surface on the opposite side to the mutually facing side surface of the metal plate is a curved surface protruding outward in plan view. The electronic component storage package according to claim 1, wherein the electronic component storage package is provided. At least a pair of the metal plate and the connection pad are arranged to face each other, and the metal plate is attached so as to be biased to the connection pad side on the mating side on the surface of the connection pad. The electronic component storage package according to any one of claims 1 to 4, wherein the electronic component storage package is provided. 6. The electronic component storage package according to claim 1, wherein a concave portion is formed in a central portion of the lower surface of the metal plate. The electronic component storage package according to any one of claims 1 to 6, an electronic component mounted on the mounting portion and electrically connected to the wiring conductor, and the mounting on the upper surface of the insulating base An electronic device comprising: a cover attached around the portion so as to cover the mounting portion. 8. A mounting structure of an electronic device, wherein the connection pad of the electronic device according to claim 7 is mounted on an electrode pad of an external electric circuit board via a conductive bonding material, and the electrode pad is the metal plate in a plan view. The conductive bonding material is attached so as to cover the entire side surface of the metal plate from the electrode pad to the connection pad, and the central portion in the vertical direction of the conductive bonding material is A mounting structure of an electronic device characterized by being recessed over the entire circumference. The conductive bonding material is characterized in that a width of a bonding portion with the electrode pad is smaller on an outer peripheral side of the insulating base of the metal plate than on a center side of the insulating base of the metal plate. Item 9. A mounting structure of an electronic device according to Item 8.

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