JP2007091302A - Device and method for binding paper sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for binding a paper sheet for reducing insufficient binding by mutually pressing by a pressing member the adhering face of a binding band, heating by a heater to be adhered and then by cooling the same by a cooling member. <P>SOLUTION: This binding device presses the superimposing part P of a big band 1 without shifting the part with a flapper 3 in putting the band 1 around a binding bundle S. Next, the neighborhood of the superimposed part P of the band 1 pressed without being shifted is heated and compression bonded by a heater 4 which descends in the direction of the illustrated arrow A1. As a result, the paste applied to the band 1 becomes sticky and the superimposed part of the band 1 is adhered. Then the heater 4 heated the band 1 goes up and a cooling metal 5 moves for cooling the heated area. By cooling this way, the fixation of the paste in a sticky condition is progressed for binding. The metal 5 is cooled by contacting a heat sink 8 while it is moved to and waits at a home position. The bundle bound with the band 1 is discharged underneath. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a binding device of a paper sheet processing apparatus for discriminating and sorting paper sheets such as banknotes, and in particular, when laminating bundles of sealed paper sheets and thermally bonding them in a binding band, The present invention relates to a paper sheet bundling apparatus and a paper sheet bundling method that are cooled in order to accelerate the fixation of heated glue.

  The paper sheet processing apparatus discriminates and accumulates the paper sheets to be conveyed, seals them with a paper band (hereinafter referred to as a small band) every 100 sheets, and discharges the bundle. The bundling device stacks 10 of the released bundles (hereinafter, 10 bundles of bundles are referred to as a bundle) and winds the bundles around a cross with a binding band (hereinafter referred to as a large band) to bind them. . As a method of binding, a large band is wound around the bundle, a heater is pressed against the overlapped portion of the wound large band, and the glue applied to the large band melts by heat and penetrates into the other large band and is cooled. There is known a method in which an adhesive force is generated.

In addition, with regard to this cooling method, after pressing the heater against the large band, the heater is moved backward to allow time to cool naturally, or the cooling band is directly applied to the joining surface to cool the band and bond it. (For example, refer to Patent Document 1).
JP 2002-193209 A (first page, FIG. 15)

  However, in the paper sheet bundling device described in Patent Document 1, when the heater is retracted after the heater is pressed, there is no force to press the large bands, so that sufficient adhesion is achieved even if the large bands are cooled in this state. There was a problem that it was not done. Furthermore, the cooling of the large band by the cooling air has a problem that the cooling effect is not sufficient because uniform cooling cannot be performed in a short time.

  The present invention was made in order to solve the above-mentioned problem, by pressing so as not to shift the overlapping portion of the large band, by heating and pressure-bonding the pressed vicinity with a heater, and then cooling with a cooling member, An object of the present invention is to provide a paper sheet bundling method and a paper sheet bundling apparatus capable of stably bundling a bundle.

  In order to achieve the above object, the paper sheet bundling device according to claim 1 of the present invention is a method of winding paper sheets with a bundling band, and heating and pressing the overlapping portion of the bundling band with a heater. A paper sheet bundling device for bundling paper sheets, a pressing means for pressing so as not to shift an overlapping portion of the binding band, and a heater for heating and pressure-bonding the vicinity of a portion pressed by the pressing means, And after the heating / crimping by the heater, provided with a heat absorbing means for making surface contact with the heating / crimping part and absorbing the heat of the heating part, and a heat radiating means for radiating the heat absorbed by the heat absorbing means. It is characterized by.

  Further, in the method for binding paper sheets according to claim 4 of the present invention, the paper sheets are wound by winding the paper sheets with a binding band, and the overlapping portion of the binding bands is heated and pressed with a heater to bind the paper sheets. A binding device for paper sheets, a pressing means for pressing so as not to shift the overlapping portion of the binding band, a heater for heating and pressure-bonding the vicinity of the portion pressed by the pressing means, and heating / After the pressure bonding, the heat and pressure bonded portion is brought into surface contact with the heat absorbing means for absorbing the heat of the heated portion, and the heat radiating means for radiating the heat of the heat absorbing member.

  According to the present invention, the bundle can be stably bound by pressing the portion where the binding bands are bonded to each other with the pressing member, and cooling with the cooling member after being heated with the heater.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic view of a binding device according to an embodiment of the present invention. Since the paper sheet processing apparatus and the bundling apparatus are described in Patent Document 1, detailed description will be omitted, and main features according to the present invention will be described. The overlapping portion P of the large band 1 is bonded to the large band 1 by heating and press-bonding the overlapping portion with the heater 4 so that the bundle S can be bound. In this figure, a gap is provided between the large band 1 and the bundle S for easy understanding.

  The bundling device of the present embodiment includes a feeder portion 2, a flapper 3, a heater 4, a cooling metal (heat absorbing means) 5, a catcher portion 6, and a heat sink (heat radiating means) described later, and the supplied obi 1 The bundle S is bundled by

  The feeder unit 2 sends the large band (tie band) 1 to the catcher unit 6. The catcher unit 6 catches the large band 1 sent from the feeder unit 2 and binds the periphery of the bundle of ten bundles while making one rotation along the illustrated track 7.

  FIG. 2 is an enlarged view for explaining the overlapping portion P of the large band 1. In this embodiment, when the large band 1 is wound around the bundle S, the winding start and winding end overlap with each other with the overlapped portion P shown in the figure.

FIG. 3 is a detailed view showing the positional relationship among the pressing means, the heater 4, the heat absorbing means, and the large band 1. FIG. 3A is a side view, and FIG. 3B is a plan view.
The pressing means includes a flapper (pressing member) 3 that has a pressing surface that presses in contact with a substantially central portion of the overlapped portion P of the wound obi 1 and a moving means (illustrated) that moves the flapper 3. Not). Further, the flapper 3 is moved from the home position (initial position) to a predetermined position by the moving means, and presses the overlapping portion P of the large band 1 so as not to shift.

  The heater 4 heats and presses the overlapping portion P of the large belt 1. The heater 4 makes surface contact with both ends of the large belt from the vicinity of the pressing position pressed by the flapper 3, and uniformly heats and presses the surface contact portion. It consists of two heating parts 4A and 4B. The heating sections 4A and 4B are configured to be able to overheat from both ends of the large band 1 to the outside as shown in the figure because the large band 1 may be shifted in a direction orthogonal to the conveying direction during binding. The heater 4 is moved from a home position (initial position) to a predetermined position indicated by an arrow A1 by a moving means (not shown). That is, the heater 4 is lowered in the direction of the arrow A1 to heat and press the large band 1, the glue applied to the large band 1 is brought into a sticky state, and the upper and lower large bands 1 are bonded.

  The heat absorbing means cools the overlapping portion P (adhesion surface) of the large band 1 heated by the heater 4 and is made of a material such as a metal having good heat conductivity, and faces the portion where the heater 4 is overheated and pressed. The cooling metal 5 has an endothermic contact portion 5A that comes into contact, and moving means (not shown) that moves the cooling metal 5 from a home position (initial position) to a predetermined position. Adhesion of the bonding surface is promoted by absorbing the heat of the portion where the chiller configured as described above is heated and pressed by the heater.

FIG. 4 is a detailed view of the cooling metal 5 and the heat sink 8.
The heat sink 8 contacts the cooling metal 5 to cool the cooling metal 5 when the cooling metal 5 is at the home position, and has a heat radiation contact portion 8A that makes surface contact with the heat absorbing contact portion 5A. In addition, the heat dissipation contact portion 8A has a heat dissipation portion 8B that dissipates the accumulated heat, and the heat dissipation portion 8B is indirectly heated by the heater 4 by cooling, for example, by blowing air. The adhesive surface can be cooled. Naturally, the cooling effect is increased by increasing the area of the heat radiating portion 8B.

  FIG. 5 is a diagram for explaining the operation of the bundling device of the present embodiment.

  FIG. 5A shows a state in which the large band 1 is wound around the bundle S, the overlap portion P of the large band 1 is pressed by the flapper 3, and the large band is cut by a cutter (not shown). Next, since the overlapping portion P of the large band 1 is fixed by the flapper 3, the heater 4 is lowered in the direction of the arrow A1 and pressed while heating the overlapping portion P. As a result, the glue applied to the obi 1 becomes sticky, and the heated portions of the upper and lower obi 1 adhere.

  FIG. 5 (2) shows a state in which the heater 4 that has heated the large belt 1 rises in the direction of the arrow A2 and then the cooling metal 5 moves in the direction of the arrow A3 to cool the heated portion. is there. This cooling promotes adhesion of the adhesive paste.

  FIG. 5 (3) illustrates a state in which a bundle bound by a large band moves in the direction of the arrow A4 and is released.

  FIG. 5 (4) shows a state in which the cooling metal 5 and the flapper 3 move in the direction of the illustrated arrow A5, which is the home position, and stand by for the large band binding process of the next bundle. The chiller 5 is cooled by contacting the heat sink 8 while waiting at the home position.

  As described above, according to the present invention, it is possible to promote adhesion of the adhesive surface by heating with a heater and then cooling with a cooling metal. can get. As a result, it is possible to reduce binding defects when the heater is raised.

  In addition, since the adhesive surface of the large band is pressed by the flapper and heated and bonded by the heater in a state where it does not move, even if the adhesive surface is not pressed by the heater when the heater is raised, the binding failure due to the displacement of the large band Can be prevented.

  The above method can obtain the effect of preventing a binding defect even if either a flapper or a chiller is used in a conventional heating / bonding method using a heater. As described in the present embodiment, it goes without saying that a greater binding failure prevention effect can be obtained by using both.

1 is a schematic view of a binding device according to an embodiment of the present invention. The enlarged view for demonstrating the adhesion part of a large belt. Detailed view of flapper, heater, and chiller. Detailed view of chiller and heat sink. The figure explaining operation | movement of a binding apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Large belt 2 Feeder part 3 Flapper 4 Heater 5 Cooling metal 8 Heat sink H Bunch S Bundle

Claims (5)

A paper sheet bundling device that binds the paper sheets by winding the paper sheets with a bundling band and heating and pressing the overlapping portion of the bundling band with a heater,
A pressing means for pressing so as not to shift the overlapping portion of the binding band;
A heater for heating and pressure-bonding the vicinity of the portion pressed by the pressing means;
After the heating and pressure bonding by the heater, a heat absorbing means that makes surface contact with the heating and pressure bonding portion and absorbs heat of the heating portion;
A heat radiating means for radiating heat absorbed by the heat absorbing means;
A paper sheet bundling device characterized by comprising: The pressing means is
A pressing member that presses the overlapping portion of the binding band;
Moving means for moving the pressing member from the initial position;
Have
The heater is
A heating section that uniformly heats and presses the vicinity of the pressing member pressed;
Moving means for moving the heating unit from the initial position;
The paper sheet bundling device according to claim 1, comprising: The endothermic means is
An endothermic contact portion that is made of a material having good thermal conductivity and that makes surface contact with the portion heated and pressed by the heater;
Moving means for moving the endothermic contact portion from the initial position;
Have
The heat dissipation means is
A heat dissipating contact portion in surface contact with the endothermic contact portion of the heat absorbing means;
A heat dissipating part for dissipating the heat accumulated in the heat dissipating contact part;
The paper sheet bundling device according to claim 1, comprising: The moving means is
4. The paper sheet binding device according to claim 2, wherein the pressing member and the endothermic contact portion are simultaneously moved to the initial position. A bundling method of a bundling device for bundling paper sheets by bundling them with a bundling band and bundling the paper sheets by heating and pressing the overlapping part of the bundling band with a heater,
A first step of binding the paper sheets with a binding band;
After this first step, the second step of pressing so that the overlapping part of the binding band does not shift,
After this second step, a third step of heating and pressure-bonding the overlapping portion of the binding band,
After this third step, the fourth step to absorb the heat of the heated and pressure-bonded part,
After this fourth step, a fifth step of radiating the absorbed heat,
A method for binding paper sheets, comprising:

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