JP2006323297A - Heating and cooling method for manufacturing photomask, and heating and cooling system to realize method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve temperature uniformity on a mask substrate in heating and cooling in relation to a heating and cooling method for manufacturing a photomask and a heating and cooling system, in which the mask substrate is heated and cooled after predetermined treatment in the manufacture of the photomask. <P>SOLUTION: The method is constructed as follows: after a lapse of a predetermined time period since start of heating of the mask substrate with a heating unit, a periphery of the mask substrate is covered with a frame portion, and simultaneously a thermo-reflection member is positioned on the upper side of the mask substrate and baking is conducted (S5-S8); and after a lapse of a predetermined time period since start of cooling of the mask substrate, on which the frame portion etc. have been arranged and are still remaining after completion of the baking, with a cooling unit, the frame portion etc. are detached from the mask substrate, and the cooling is continued (S25-S28). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heating / cooling method and a heating / cooling system for manufacturing a photomask that are heated and cooled after a predetermined process in manufacturing a photomask.

  In recent years, photomasks used for forming semiconductor integrated circuits have been increased in density and miniaturization, and high-resolution drawing and processing are required also in the mask substrate processing step in photomask manufacturing. In photomask manufacturing, when a pattern is formed on a mask substrate by, for example, an exposure apparatus, a resist process is performed as a pretreatment, a heating (baking) process is performed after the resist is applied, and cooling is performed for the next process. High quality is constantly desired for photomasks, and temperature uniformity is desired when heating and cooling are performed as part of this.

  Conventionally, in the case of a process for patterning a photomask with a photolithography technique, a metal thin film is formed on a mask substrate, a photoresist is applied thereon and prebaked, and then a pattern is drawn by an exposure apparatus. Then, it is manufactured through resist development, post bake, selective etching of a metal thin film, resist stripping, and the like. When performing a baking process and a cooling process continuously in such a process, it is common to move the mask substrate to be processed between the processes. Such a system is disclosed, for example, in Patent Document 1 below.

JP 2004-319626 A JP 2004-303998 A

  Patent Document 1 discloses a heat treatment apparatus for reliably preventing overbaking by a hot plate and obtaining high throughput. Specifically, a post-exposure bake plate or a cool plate is provided in the heat treatment portion. And a local transfer robot is provided, and the holding plate of the local transfer robot is held in close proximity to almost the entire bottom surface of the substrate so that it can reciprocate between the post-exposure bake plate and the cool plate. When the heated substrate is received by the holding plate, the substrate is immediately cooled to some extent, and the substrate is moved to the cool plate and fitted into the recess to cool the substrate and precisely control the temperature.

  FIG. 8 is a schematic explanatory view of heating or cooling of the conventional mask substrate, and FIG. 9 is an explanatory view of the temperature state of the mask substrate by the heating processing and cooling processing of FIG. FIG. 8 (A) shows the cool plate shown in FIG. 6 of the above-mentioned Patent Document 1, but it can also be applied to a bake plate. That is, a recess 103 is formed in the plate 102 of the heat treatment apparatus 101, and a substrate (here, referred to as a mask substrate) 104 is placed in the recess 103 with a proximity gap for protecting the back surface.

  When the plate 102 is a bake plate, the substrate 104 is baked. When the plate 102 is a cool plate, the substrate 104 transported and moved from the bake plate is cooled. In this case, as shown in FIG. 8B, the temperature state of the substrate 104 is detected by, for example, the temperature detector TH1 at the center and the temperature detectors TH2 to TH5 at the four corners.

  Therefore, the temperature difference at each temperature detection point by heating and cooling the substrate 104 is shown in FIG. Here, the heating and cooling processes and the temperature detection are performed in an environment of room temperature of about 22 ° C. and humidity of about 35 percent, and the used substrate 104 is a photomask having a size of 6 inches and a thickness of about 6 mm. It is a mask substrate for.

  In FIG. 9, the alternate long and short dash line schematically shows the five temperature distributions of the temperature detectors TH1 to TH5 on the substrate 104 as one, and the maximum and minimum temperature differences of the temperature detectors TH1 to TH5 are indicated by solid lines. It is shown by. That is, when heating is started about 35 seconds after the substrate 104 is placed in the recess 103 of the bake plate, the maximum temperature difference becomes 4.65 ° C. after about 81 seconds from the heating. When it was moved into the recess 103 of the cool plate and cooling was started, the maximum temperature difference became 7.64 ° C. about 84 seconds after cooling.

  By the way, in the heating and cooling of the substrate 104, the temperature difference at each point on the substrate affects the quality in the formation of the thin film. The maximum temperature difference shown in FIG. 9 is affected by the heating / cooling method and the horizontal movement when the substrate 104 is moved from the bake plate to the cool plate, so that a change in temperature distribution at the initial stage of cooling is received. (In general, the temperature in the peripheral part is more likely to be lower than that in the central part).

  On the other hand, there is a patent publication of the above-mentioned Patent Document 2 filed by the applicant of the present application as an example in which the influence of a change in temperature distribution due to horizontal movement is reduced when the substrate 104 is moved. The method of Patent Document 2 is to arrange the heating process and the cooling process in the vertical direction so as not to horizontally move the substrate, thereby minimizing the change in temperature distribution due to the movement. Improvement in temperature uniformity is desired.

  Accordingly, the present invention has been made in view of the above problems, and provides a heating / cooling method and heating / cooling system for manufacturing a photomask for improving temperature uniformity on a mask substrate in heating / cooling, thereby improving quality and yield. The purpose is to provide.

  In order to solve the above-mentioned problem, in the invention of claim 1, a mask substrate for manufacturing a photomask is baked on a horizontal surface of a heating unit after predetermined processing, and cooled on a horizontal surface of a cooling unit after the baking. A heating / cooling method for manufacturing a photomask, the step of positioning the mask substrate on the heating unit, the step of starting baking the mask substrate at a predetermined temperature by the heating unit, and the predetermined from the start of heating And a step of positioning a frame portion covering the periphery of the mask substrate on the heating unit around the mask substrate after the time.

  According to a second aspect of the present invention, after the baking is finished, the mask substrate is held together with the frame, and the mask substrate is cooled on the mask substrate by the cooling unit. And a step of detaching the frame portion on the cooling unit from the cooling unit and continuing cooling until the end after a predetermined time from the start of cooling.

  According to a third aspect of the present invention, when the frame portion covers the periphery of the mask substrate, a heat reflecting member is positioned above the mask substrate and thermally reflected.

  The invention according to claim 4 is a heating / cooling system for manufacturing a photomask that performs baking after a predetermined process on the mask substrate and cools the mask substrate after the baking, and is horizontally movable from a standby position to a heating / cooling processing position, A heating unit that performs baking when the mask substrate to be conveyed is positioned on a horizontal plane, and a horizontal movement from a standby position to a heating / cooling processing position, and cooling when the mask substrate is positioned on a horizontal plane. And a movable holding means for holding the mask substrate in a state of covering the periphery of the mask substrate with the frame portion. It is arranged so that it can move up and down freely, and it is lowered during baking and the frame portion is positioned around the mask substrate on the heating unit. The frame unit is lifted and detached from the mask substrate on the cooling unit, and when the heating unit and the cooling unit are exchanged on the processing position, the mask substrate is held by the movable holding means. And an auxiliary unit to be raised.

  According to a fifth aspect of the present invention, the auxiliary knit includes a heat reflecting member that heat-reflects above the mask substrate when the frame portion covers the periphery of the mask substrate.

  According to the first to third aspects of the present invention, the frame substrate covers the periphery of the mask substrate after a predetermined time from the start of heating by the mask substrate heating unit, and the heat reflecting member is appropriately positioned above the mask substrate for baking. Heating and cooling by adopting a configuration in which cooling is continued by separating the frame portion from the mask substrate after a predetermined time from the start of cooling by the cooling unit of the mask substrate with the frame portion and the like being positioned after baking is completed. Temperature uniformity on the mask substrate can be improved, and as a result, quality and yield can be improved.

  According to invention of Claim 4 and 5, the said auxiliary | assistant unit is lowered | hung at the time of baking by a heating unit, the said frame part is located in the circumference | surroundings of a mask board | substrate suitably with a heat | fever reflection member, and an auxiliary | assistant unit is raised at the time of cooling by a cooling unit. The frame portion or the like is detached from the mask substrate, and when the heating unit and the cooling unit are exchanged on the processing position, the movable holding means of the auxiliary unit holds and lifts the mask substrate. As a result, the above heating / cooling method can be realized and the mask substrate to be processed is not moved horizontally when shifting from heating to cooling. It can be improved, and as a result, quality and yield can be improved.

  Hereinafter, the best embodiment of the present invention will be described with reference to the drawings. In the present embodiment, only necessary components are conceptually shown as a heating / cooling system, but since these controls and driving can be realized by a conventional method, illustration and description are omitted.

  In FIG. 1, the conceptual block diagram of the heating-cooling system which concerns on this invention is shown. FIG. 1A is a conceptual diagram of a heating / cooling system, and FIG. 1B is a conceptual configuration diagram of an auxiliary unit. In FIG. 1A, in the heating / cooling system 11, a heating / cooling processing position 13 is set on the processing table 12, and a standby position of the heating unit 14 and a standby position of the cooling unit 15 are set with respect to the processing position 13. Is done. The heating unit 14 can move horizontally with respect to the processing position 13 from the standby position, and the cooling unit 15 can move horizontally with respect to the processing position 13 from the standby position.

  The heating unit 14 has a horizontal plane on which a mask substrate for manufacturing a photomask to be heated is placed, and four lift pins (see FIG. 2) for moving the mask substrate up and down on the horizontal plane. Holes 21 are formed, and for example, four spacers 22 that secure proximity gaps when the mask substrate is placed are formed in the appropriate vicinity of each hole 21. Further, a heater that has been used in the past, for example, as shown in FIG. 3 of Japanese Patent Application Laid-Open No. 2004-303998, is disposed in the horizontal plane portion of the heating unit 14, and the lift pin and the lift pin are moved up and down inside. A driving means (not shown) is provided.

  The cooling unit 15 has a horizontal surface on which the mask substrate is placed, and four holes 23 for lift pins (see FIGS. 3 and 4) for moving the mask substrate up and down are formed on the horizontal surface. For example, four spacers 24 that secure a proximity gap when the mask substrate is placed are formed in the appropriate vicinity of the holes 23. Further, a cooling mechanism for circulating a coolant as previously described, for example, as shown in FIG. 4 of Japanese Patent Application Laid-Open No. 2004-303998 is disposed in the horizontal plane portion of the cooling unit 15, and the lift pins are disposed inside the cooling unit 15. In addition, driving means (not shown) for moving the lift pin up and down is provided.

  On the other hand, an auxiliary unit 16 is disposed above the processing position 13 so as to be movable up and down (control means and drive means are not shown). The auxiliary unit 16 includes a frame portion 32 and a reflecting plate 33 that is a heat reflecting member in a housing 31 having an open space on one side. The frame portion 32 is formed of, for example, a metal member, and covers the periphery of the mask substrate placed on the horizontal surface of the heating unit 14 or the cooling unit 15. The reflection plate 33 is formed of, for example, a metal member, and is used for heat reflection above the mask substrate when the frame portion 32 covers the periphery of the mask substrate.

  Further, mounting portions 34A and 34B are attached to, for example, opposite side surfaces of the auxiliary unit 16 outside the housing 31, and holding pins 35A to 35D as movable holding means are rotatably provided on the mounting portions 34A and 34B. . As will be described later, the holding pins 35 </ b> A to 35 </ b> D rotate to the back side of the mask substrate placed on the heating unit 14 and hold it at each point on the back side, and in this state, the auxiliary unit 16. , The periphery is covered with the frame portion 32, and the mask substrate is raised while the reflector 33 is positioned above. On the other hand, the mask substrate is particularly positioned on the lift pins of the cooling unit 15. The holding pins 35A to 35D are rotated to release the holding.

  Here, FIG. 2 shows an explanatory diagram of the heating process by the heating unit in the heating and cooling system of FIG. 1, FIG. 3 shows an explanatory diagram of the heating process from the heating process in the heating and cooling system of FIG. 1, and FIG. The explanatory view of the cooling processing by the cooling unit in the heating cooling system of Drawing 1 is shown. 2 to 4 are for explaining the operation of each component, and do not directly show the heating and cooling method according to the present invention.

  FIG. 2A shows a case where the heating unit 14 is moved horizontally to the processing position 13. When the heating unit 14 is positioned at the processing position 13, lift pins provided in the holes 21 so as to be movable up and down. As shown in FIG. 2B, a transport robot that transports a predetermined transport means (for example, holding the side surface of the mask substrate) above each lift pin 25 that has been lifted. ), The mask substrate 41 is transported and placed on each lift pin 25.

  As shown in FIG. 2C, the lift pins 25 on which the mask substrate 41 is placed are lowered so that the mask substrate 41 is lowered and formed on the horizontal plane of the heating unit 14. The proximity gap is secured by being placed on the spacer 22. Then, as shown in FIG. 2D, the mask substrate 41 placed on the spacer 22 is heated to room temperature or higher by the heater 26 as described above. The auxiliary unit 16 is lowered with respect to the mask substrate 41 placed on the spacer 22. In this case, the holding pins 35 </ b> A to 35 </ b> D provided on both side surfaces of the casing 31 are positioned on the outer side with respect to the casing 31.

  When the auxiliary unit 16 is lowered and the frame portion 32 is placed on the horizontal plane of the heating unit 14, the mask substrate 41 is covered as shown in FIG. When the heating unit 14 and the cooling unit 15 are exchanged at the processing position 13, as shown in FIG. 3B, the lift pins 25 of the heating unit 14 are raised and the synchronized auxiliary unit 16 is also raised. After the ascent, the holding pins 35A to 35D of the auxiliary unit 16 rotate inward, and when the respective lift pins 25 begin to descend, the back surface of the mask substrate 41 is placed and held at each point.

  Then, as shown in FIG. 3C, the lift pins 25 are lowered while the mask substrate 41 is held by the auxiliary unit 16 at the upper position, and the processing position 13 is shifted to the standby position shown in FIG. Next, as shown in FIG. 3D, the cooling unit 15 moves horizontally to the processing position 13, and when the cooling unit 15 is positioned at the processing position 13, the respective lift pins 27 rise (the drive means is not shown). ). When each lift pin 27 is raised, the auxiliary unit 16 is lowered.

  When the auxiliary unit 16 is lowered and the mask substrate 41 comes into contact with the lift pins 27, the holding pins 35 </ b> A to 35 </ b> D of the auxiliary unit 16 are attached to the housing 31 as shown in FIG. The mask substrate 41 is held outwardly by the holding pins 35A to 35D, and the lift pins 27 and the auxiliary unit 16 are lowered synchronously. Then, when the lift pins 27 are lowered, the mask substrate 41 is placed on each spacer 24 of the cooling unit 15, and the auxiliary unit 16 is lowered until the frame portion 32 is placed on the horizontal plane of the cooling unit 15. To do.

  As shown in FIG. 4B, when the frame portion 32 is placed on the horizontal plane of the cooling unit 15, the frame portion 32 covers the periphery of the mask substrate 41, and the reflecting plate 33 is Cooling is performed by, for example, the start of circulation of the coolant by the cooling mechanism 28 in a state of being positioned above the mask substrate 41. As shown in FIG. 4 (C), when the auxiliary unit 16 is raised and the cooling process is finished, as shown in FIG. 4 (D), when each lift pin 27 is raised and reaches a predetermined position. The mask substrate 41 is discharged by the transfer means (the transfer robot as described above), and then the respective lift pins 27 are lowered and horizontally moved to the standby position as shown in FIG.

  FIG. 5 shows a flowchart of the heating process and the cooling process in the heating / cooling system of FIG. 1, and FIG. 6 shows a flowchart regarding the movement of the heating unit and the cooling unit of FIG. 5A is a flowchart of the heating process, FIG. 5B is a flowchart of the cooling process, FIG. 6A is a flowchart regarding the movement of the heating unit, and FIG. 6B is a flowchart regarding the movement of the cooling unit. Specific processing conditions and the like will be described with reference to FIG.

  5A, first, the heating unit 14 as shown in FIG. 1A moves horizontally from the standby position to the processing position 13 (step (S1)), and when the movement is completed, the respective lift pins 25 are raised. (S2, see FIG. 2A). When each lift pin 25 is raised, the mask substrate 41 is placed on each lift pin 25 by the above-described transport means (for example, a transport robot) (see S3, FIG. 2B), and the placement is performed. When completed, the respective lift pins 25 are lowered so that the mask substrate 41 is placed on the respective spacers 22 on the horizontal plane of the heating unit 14 with a proximity gap secured (S4, FIG. 2 (C), (See (D)).

  Subsequently, the above-described heater 26 in the heating unit 14 is driven to start heating (S5). When the predetermined time t1 has elapsed from the start of heating (S6), the auxiliary unit 16 is lowered to position the reflecting plate 33 above the mask substrate 41, and the frame 32 is positioned around the mask substrate 41 to cover it. (S7, see FIG. 2D and FIG. 3A). At this time, the holding pins 35 </ b> A to 35 </ b> D of the auxiliary unit 16 are positioned outside the housing 31. In this state, baking is performed until the heating is completed (S8).

  After the baking is finished, in FIG. 6A, the lift pins 25 of the heating unit 14 are raised, and the auxiliary unit 16 is raised in synchronism with this (see S11, FIG. 3B). When each ascending is completed, the holding pins 35A to 35D of the auxiliary unit 16 are rotated to the inside of the casing 31 and the mask substrate 41 is held at each point on the back surface by the holding pins 35A to 35D. The lift pins 25 are lowered (see S12, FIGS. 3B and 3C). Then, the heating unit 14 moves to a standby position as shown in FIG. 1A (S13, see FIG. 3C).

  Subsequently, in FIG. 5B, when the heating unit 14 returns to the standby position, the cooling unit 15 is moved horizontally to the processing position 13 (S21), and when the cooling unit 15 is positioned at the processing position 13, Each lift pin 27 is raised (see S22, FIG. 3D). When each lift pin 27 is raised, the auxiliary unit 16 holding the mask substrate 41 is lowered, and when each lift pin 27 is in contact with the back surface of the mask substrate 41, each holding pin 35A to 35A of the auxiliary unit 16 is retained. 35D is rotated to the outside of the housing 31 to release the holding (S23, see FIG. 4A).

  Then, the lift pins 27 of the auxiliary unit 16 and the cooling unit 15 are lowered in synchronization, so that the mask substrate 41 is placed on the spacers 24 of the cooling unit 15 with a proximity gap secured. The frame portion 32 of the auxiliary unit 16 is placed on the horizontal plane of the cooling unit 15 (S24, see FIG. 4B).

  Subsequently, the cooling mechanism 28 in the cooling unit 15 as described above is driven (for example, the coolant is circulated), and cooling is started (S25). When a predetermined time t2 has elapsed from the start of cooling (S26), the auxiliary unit 16 is lifted to separate the reflecting plate 33 and the surrounding frame portion 32 above the mask substrate 41 from the mask substrate 41 (S27, FIG. 4C )reference). In this state, the process is continued until the cooling is completed (S28).

  After completion of the cooling process, in FIG. 6B, the lift pins 27 of the cooling unit 15 are raised to raise the mask substrate 41 after the cooling process is finished (S31). Thus, the mask substrate 41 is discharged from the cooling unit 15 (see S32, FIG. 4D). Then, each lift pin 27 is lowered, and the cooling unit 15 is horizontally moved to the standby position as shown in FIG. 1A (S33).

  FIG. 7 shows an explanatory diagram of the temperature state of the mask substrate by the heating process and the cooling process in the heating and cooling system of FIG. Here, as in FIG. 8B, temperature detection is performed by the temperature detector TH1 at the center portion and by the temperature detectors TH2 to TH5 at the peripheral four corner portions, and the room temperature is about 22.5 ° C. as a test condition. The mask substrate 41 is used in an environment with a humidity of about 35 percent and is 6 inches large and about 6 mm thick.

  In FIG. 7, the alternate long and short dash line schematically shows the five temperature distributions of the temperature detectors TH1 to TH5 of the mask substrate 41 as one, and shows the maximum and minimum temperature difference between the temperature detectors TH1 to TH5. This is indicated by a solid line. That is, heating is started about 30 seconds after the mask substrate 41 is placed on the heating unit 14 as baking in the heating unit 14 (heating temperature is about 200 ° C. on the heater surface, for example), and about 75 seconds (from the start of heating) t1) After that, when the auxiliary unit 16 is lowered to cover the periphery of the mask substrate 41 with the frame 32 and the reflecting plate 33 is positioned upward, the maximum temperature difference becomes 2.92 ° C. after about 85 seconds. .

  After completion of the heat treatment, the mask substrate 41 is raised while being held by the auxiliary unit 16, and at this time, the heating unit 14 and the cooling unit 15 are exchanged (about 50 seconds). When the cooling unit 15 moves to the processing position 13, the auxiliary unit 16 that holds the mask substrate 41 is lowered, and when the mask substrate 41 and the frame portion 32 are placed on the horizontal plane of the cooling unit 15, the coolant is circulated. The cooling started, and the maximum temperature difference became 2.91 ° C. after about 55 seconds (t2) from the start of cooling. Then, about 110 seconds after the start of cooling, the auxiliary unit 16 is raised to raise the frame portion 32 and the reflecting plate 33, and the cooling is continued to cool to near the room temperature.

  In this way, the temperature uniformity on the mask substrate 41 in heating and cooling can be improved from the past, and as a result, quality and yield can be improved. In general, a thick mask substrate is difficult to store and dissipate heat at the central portion with respect to heating and cooling, and tends to shorten the time for storing and dissipating heat as it follows the periphery. That is, from the start of heating until the mask substrate 41 is covered by the frame portion 32, the heat dissipation is promoted from the surroundings to bring the tendency of heat storage closer to the heat storage tendency of the central portion, and after the heat storage of the central portion proceeds, the frame portion 32 Since the heat radiation is regulated by covering the periphery with the above, the temperature difference between the central portion and the peripheral portion at the time of heating can be made extremely smaller than before. In this case, the reflecting plate 33 serves to improve the heating efficiency with respect to the mask substrate 41.

  On the other hand, from the start of cooling until the frame portion 32 is detached from the periphery of the mask substrate 41, heat dissipation from the periphery is restricted and the exhaust heat tendency approaches the exhaust heat tendency of the central portion. The temperature difference between the center portion and the surrounding portion can be made much smaller than before, and the exhaust heat of the central portion advances, and then the frame portion 32 is detached to promote the overall exhaust heat.

  By the way, when the heating unit 14 and the cooling unit 15 are exchanged, the heated mask substrate 41 is held by the holding pins 35A to 35D of the auxiliary unit 16, and is in a so-called heat retaining state. Since the movement direction of the mask substrate 41 is not a horizontal direction, the mask substrate 41 is not urged to dissipate heat in the peripheral portion by wind (airflow), and the occurrence of temperature non-uniformity until the transition to cooling can be minimized. It can be done.

  The heating / cooling method and heating / cooling system for manufacturing a photomask according to the present invention are suitable for a process of performing cooling after baking such as a mask blank manufacturing process and a pattern forming process in photomask manufacturing.

It is a conceptual lineblock diagram of the heating cooling system concerning the present invention. It is explanatory drawing of the heat processing by the heating unit in the heating-cooling system of FIG. It is explanatory drawing of the cooling process from the heat processing in the heating cooling system of FIG. It is explanatory drawing of the cooling process by the cooling unit in the heating-cooling system of FIG. It is a flowchart of the heat processing and cooling processing in the heating-cooling system of FIG. It is a flowchart regarding the movement of the heating unit and cooling unit of FIG. It is explanatory drawing of the temperature state of the mask substrate by the heat processing and cooling processing in the heating-cooling system of FIG. It is a schematic explanatory drawing of the heating or cooling of the conventional mask substrate. It is explanatory drawing of the temperature state of the mask board | substrate by the heat processing and cooling process of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Heating / cooling system 13 Processing position 14 Heating unit 15 Cooling unit 16 Auxiliary unit 25, 27 Lift pin 26 Heater 28 Cooling mechanism 32 Frame part 33 Reflecting plate 35 Holding pin 41 Mask substrate

Claims (5)

A photomask manufacturing heating and cooling method for performing baking on a horizontal plane of a heating unit after predetermined processing of a mask substrate for manufacturing a photomask, and performing cooling on a horizontal plane of a cooling unit after the baking,
Positioning the mask substrate on the heating unit;
Starting baking the mask substrate at a predetermined temperature by the heating unit;
A step of positioning a frame portion covering the periphery of the mask substrate on the heating unit around the mask substrate after a predetermined time from the start of heating;
A heating and cooling method for manufacturing a photomask, comprising: It is the heating-cooling method for photomask manufacture of Claim 1,
After the baking, the mask substrate is held together with the frame portion, and in this state is positioned on the cooling unit;
Starting cooling the mask substrate by the cooling unit;
A step of detaching the frame part on the cooling unit from the cooling unit after a predetermined time from the start of cooling and continuing cooling until the end;
A heating and cooling method for manufacturing a photomask, comprising:   3. The method of heating and cooling a photomask according to claim 1, wherein when the frame portion covers the periphery of the mask substrate, a heat reflecting member is positioned above the mask substrate and thermally reflected. A heating / cooling method for producing a photomask, which is characterized. A heating / cooling system for manufacturing a photomask that performs baking after a predetermined treatment of a mask substrate, and performs cooling after the baking,
A heating unit that is horizontally movable from a standby position to a heating and cooling processing position, and performs baking when the transferred mask substrate is positioned on a horizontal plane; and
A cooling unit that is horizontally movable from a standby position to a heating and cooling processing position, and that cools when the mask substrate is positioned on a horizontal plane;
A frame portion covering the periphery of the mask substrate and a movable holding means for holding the mask substrate in a state of being covered by the frame portion are provided, and can be moved up and down on the heating / cooling processing position. The frame is lowered at the time of baking to position the frame portion around the mask substrate on the heating unit, and is raised at the time of cooling to separate the frame portion from the mask substrate on the cooling unit. An auxiliary unit that holds and lifts the mask substrate with the movable holding means when the heating unit and the cooling unit are exchanged on the processing position;
A heating / cooling system for manufacturing a photomask, comprising:   5. The heating / cooling system for manufacturing a photomask according to claim 4, wherein the auxiliary unit is configured to heat-reflect the heat above the mask substrate when the frame portion covers the periphery of the mask substrate. A heating / cooling system for manufacturing a photomask, comprising:

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