JP2002057092A - Water-cooled noncontact cold plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cold plate for cooling a part uniformly. SOLUTION: The water-cooled noncontact cold plate is arranged to cool a part uniformly by employing a non-planar heat receiving face in a cold plate facing the part being cooled, making a cut for guiding a guide pin in the cold plate and providing protrusions on the heat receiving face 3 of the cold plate in the vicinity of the cut thereby bringing the heat receiving face 3 close to the part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water-cooled non-contact cold plate for cooling various substrates to be heat-treated, such as a semiconductor wafer, a substrate for a liquid crystal display, and a substrate for a plasma display panel. .

[0002]

2. Description of the Related Art Among the various substrates to be heat-treated, for example, a substrate for a liquid crystal display device has various thin films repeatedly formed on the surface of the substrate by photolithography. In the photolithography technique, a predetermined resist film is formed on a substrate by applying a resist film on the surface of a substrate, exposing the resist film with an exposure device, and developing the resist film. In order to increase the exposure accuracy in such photolithography technology, it is necessary to strictly control the substrate temperature before the exposure processing, and to minimize the deviation of the exposure position and the exposure focus due to thermal expansion and contraction of the substrate. Therefore, when carrying the substrate into the exposure apparatus, it is necessary to uniformly cool the entire surface of the substrate to a predetermined temperature by using a cold plate.

On the other hand, in a photolithography technique for manufacturing a semiconductor device, a metal thin film is formed on a substrate by sputtering, and a photoresist is applied thereon and prebaked.
After the pattern is drawn by the electron beam drawing apparatus, it is completed through various steps such as resist development processing, post-baking, selective etching of the metal thin film, and resist peeling. In the photolithography technology for manufacturing the semiconductor device, cooling of the substrate after baking greatly affects the quality of the semiconductor. Particularly in recent years, the size of the substrate has increased, and heat tends to be trapped in the central portion of the substrate, and the substrate may be warped.

For this reason, various cold plates for uniformly cooling a substrate have been proposed. As one example, JP-A-11-329926 discloses a cold plate 22 as shown in FIG. That is, the cold plate 22 has a horizontal substrate cooling surface (heat receiving surface) 23, and a plurality of spherical proximity balls 24 (gap members) are protrudingly provided on the substrate cooling surface 23. It is stored in the room 21. Inside the cold plate 22, two cooling water paths, a first cooling pipe 32 and a second cooling pipe 33, are formed at substantially the same depth from the substrate cooling surface 23 (in FIG. It is shown differently.) Temperature-controlled cooling water (cooling fluid) from the temperature-regulated water supply device 31 is supplied to the cooling pipes 32 and 33, respectively.
The cooling water that has exited from 2 and 33 is returned to the temperature control water supply device 31 again so that the temperature is adjusted.

[0005] A plurality of lift pins 25 are disposed so as to penetrate the cold plate 22 in the vertical direction. The lift pins 25 and a lifting drive mechanism 26 including an air cylinder for raising and lowering the lift pins 25 are provided. , The proximity of the substrate (component to be cooled) A to / from the substrate cooling surface (heat receiving surface) 23 of the cold plate.
A separation mechanism is configured. The lift pins 25 can support the substrate A at the upper end thereof, and lift the substrate A by a lifting drive mechanism 26 to transfer the substrate A to a substrate transfer robot (not shown). In addition to supporting the substrate A on the proximity ball 24 of the substrate cooling surface 23 by burying the upper end thereof below the substrate cooling surface 23 of the cold plate 22 (in addition to the position of the chain line). Solid line position).

[0006] A substrate passage opening 27 is formed at a position corresponding to the substrate transfer height on a front partition wall 34 of the processing chamber 21 to which the substrate transfer robot can face, and for opening and closing the substrate passage opening 27. A shutter mechanism 28 is provided to move the shutter plate 29 between a closed position in which the substrate passage opening 27 is closed and an open position in which the substrate passage opening 27 is opened. In a state where the shutter plate 29 is opened and the substrate passage opening 27 is opened, the substrate holding hand of the substrate transfer robot can enter the processing chamber 21 and exchange the substrate A with the lift pins 25.

However, in the cold plate 22 having such a configuration, since the substrate cooling surface 23 is substantially horizontal, the heat of the substrate A is cooled faster as the periphery is exposed to the outside air, and the heat in the central portion where the heat is trapped is reduced. Since the cooling rate is slow, the substrate A cannot be cooled to a predetermined temperature at a uniform speed, which causes the substrate A to be warped or distorted.
Further, the attachment and detachment of the substrate A to and from the cold plate 22
Is moved by robot.
The substrate A baked at a high temperature by a baking device (not shown) arranged at a position different from the cold plate or various materials mounted on the substrate come into contact with the outside air at a high temperature, and the substrate or the substrate There is a problem that various materials (components to be cooled) mounted on the device are oxidized, which may cause deterioration of quality. An object of the present invention is to provide a water-cooled non-contact type cold plate which can solve the above-mentioned problems and can uniformly cool the entire surface of a component to be cooled.

[0008]

That is, the present invention relates to a water-cooled non-contact cold plate for cooling a component to be cooled in a non-contact manner, wherein a heat receiving surface of the cold plate facing the component to be cooled has a non-planar shape. And a water-cooled non-contact cold plate characterized by uniformly cooling non-cooled parts.

The present invention also provides a water-cooled non-contact cold plate for cooling a component to be cooled in a non-contact manner, wherein the cold plate facing the component to be cooled has a non-planar heat receiving surface, and the cold plate has a non-planar shape. The notch is provided with a guide pin guide notch, and a projection is provided on the cold plate heat receiving surface near the notch so as to be close to the heat radiation surface of the component to be cooled, so that the non-cooled component is uniformly cooled. This is a water-cooled non-contact cold plate.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a water-cooled non-contact type cold plate according to the present invention. FIG. 1 shows an embodiment of the present invention. FIG. 1 shows a state before the cold plate 1 is inserted into the baking apparatus 11, FIG. 2 shows a state where the cold plate 1 is inserted into the baking apparatus 11, and FIG. Shows a state in which the cold plate 1 is taken out of the baking apparatus 11, and FIG. 4 shows an exploded view of components constituting the cold plate 1.

The cold plate 1 is composed of a plate body 2 and a cooling pipe 7 incorporated in the plate body 2. The plate body 2 is made of aluminum, copper, or the like having good thermal conductivity, and the heat receiving surface 3, which is the upper surface, has a non-planar shape whose height increases toward the center (see FIG. 4B). Reference numeral 6 denotes a gap pin (proximity ball, needle-like projection) for supporting a cooled component (for example, a substrate) A. In the illustrated embodiment, six points are provided on the upper surface of the cold plate, and the cooled component A receives heat from the plate body 2. The surface 3 is configured not to directly touch, that is, to support the surface 3 in a non-contact state. Reference numeral 7 denotes a cooling pipe incorporated in the lower surface of the cold plate body 2, and the cooling pipe 7 is a cooling fluid supply device 8.
To supply cooling water or a liquid whose temperature has been adjusted (hereinafter referred to as a cooling fluid). In the illustrated embodiment, a single cooling pipe 7 is shown.
May be divided into a plurality of systems.

In FIG. 1, reference numeral 4 denotes a guide pin guide notch provided in the cold plate body 2, and the guide notch 4 is provided so as to straddle a lift pin 12 provided in a baking device 11 described later. Numeral 5 denotes a protrusion provided so that the heat receiving surface 3 near the guide notch 4 is close to the heat radiating surface of the component A to be cooled, and a reduction in the cooling area of the plate body 2 due to the provision of the guide notch 4 is illustrated. 4 (b) and FIG. 4 (c)
As shown in the enlarged view of FIG. Reference numeral 11 denotes a baking device, which is provided with a lift pin 12 on which the component to be cooled A is placed so as to be able to move up and down.
3 to move up and down.

According to the cold plate 1 of the present invention,
In order to cool a component A to be cooled after being subjected to various heat treatments, such as a semiconductor wafer, a substrate for a liquid crystal display device, and a substrate for a plasma display panel, the component to be cooled baked by the baking device 11 as shown in FIG. Insert the cold plate 1 into the lower surface of A. Since the cold plate 1 is provided with the guide notch 4, the cold plate 1 can be inserted below the fired component A without the lift pins 12 of the baking device 11 becoming an obstacle (FIG. 2).

When the cold plate 1 is inserted below the component A to be cooled, the lift pin 12 is driven to lower the lift pins 12 so that the component A to be cooled is transferred to the cold plate body 2 as shown in FIG. It descends on the provided gap pin 6, and cooling is started by the cold plate 1. Regarding the conduction of the cooling fluid, it is determined whether the cold plate 1 is passed before the cold plate 1 is inserted into the baking device 11 or the cold plate 1 is introduced with the component A to be cooled out of the baking device 11. Select by. When the cooled component A or the like does not like the oxidizing atmosphere, it is preferable to cool the component A in the baking apparatus 11 and take out the cooled component A as shown in FIG.

Next, in the case where the temperature of the component A to be cooled is uniformly maintained at a predetermined temperature and the photoresist processing is performed, the component A to be cooled is set on the gap pins 6 of the cold plate 1 of the present invention and cooled. By flowing a cooling fluid at a predetermined temperature through the pipe 7 and adjusting the temperature for a predetermined time, the entire component to be cooled can be maintained at a uniform temperature, and excellent photoresist processing can be performed.

Since the heat receiving surface 3 of the cold plate 1 of the present invention is made non-planar and normal to the part to be cooled A closer to the center, the heat dissipated by the part to be cooled A is more easily absorbed at the center. Since the outer peripheral side of the cooled component A has a large contact area with the outside air, the cooling effect by the outside air is accelerated. Therefore, the cooled part A is cooled by the heat absorbing effect of the central part of the cooled part A where the heat is concentrated due to the approach of the heat receiving surface 3 of the cold plate body 2 and the outer part is cooled by the heat absorbing effect of the outside air and the cold plate. Therefore, it is cooled uniformly as a whole. Further, according to the present invention, a guide notch 4 is provided in the cold plate main body 2 so that the cold plate 1 can be easily taken in and out of the baking device 11, and the vicinity of the guide notch 4 is formed as a protruding portion 5 near the component A to be cooled. Since the reduction in the cooling area of the plate body 2 due to the provision of the guide notch 4 is covered, the unevenness of the cooling of the component A to be cooled can be eliminated, and the component A to be cooled can be more uniformly cooled.

[0017]

As described above, according to the present invention, the heat receiving surface 3 of the plate main body 2 of the cold plate 1 is made non-planar, and the more the heat concentrated portion of the component A to be cooled, the more the heat receiving portion 3 and the plate heat receiving surface 3 By making the distances closer, the component to be cooled A can be uniformly cooled. Further, the guide notch 4 is provided on the plate body 2 and the protrusion 5 is provided near the guide notch 4.
Is provided to make the distance to the cooled component A closer, thereby enhancing the uniform cooling effect of the cooled component A. Accordingly, even if the cooled part A is cooled after firing, the warped part A is not warped and the distortion can be minimized.
A cold plate suitable for manufacturing a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display panel, and the like can be provided, and the industrial effect thereof is excellent.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing one embodiment of the present invention, showing a state before a cold plate is inserted into a baking apparatus.

FIG. 2 is an explanatory view showing one embodiment of the present invention, and shows a state where a cold plate is inserted into a baking apparatus.

FIG. 3 is an explanatory view showing one embodiment of the present invention, showing a state where a cold plate is taken out of a baking apparatus.

FIG. 4 is an explanatory view showing one embodiment of the present invention, and is a component configuration diagram of a cold plate.

FIG. 5 is an explanatory view showing an example of a conventional cold plate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cold plate 2 Plate main body 3 Heat receiving surface 4 Guide pin guide notch 5 Projection 6 Gap pin 7 Cooling pipe 11 Baking device 12 Guide pin

Continued on the front page F term (reference) 3L044 AA04 BA05 CA14 DB01 EA04 KA04 5F031 CA02 CA05 HA06 HA08 HA33 HA38 MA30 PA11 5F046 KA04 KA10

Claims (2)

[Claims] In a water-cooled non-contact cold plate for cooling a component to be cooled in a non-contact manner, a heat receiving surface of the cold plate facing the component to be cooled has a non-planar shape so that the non-cooled component is uniformly cooled. A water-cooled non-contact cold plate, characterized in that: 2. A water-cooled non-contact cold plate for cooling a component to be cooled in a non-contact manner, wherein a heat receiving surface of the cold plate facing the component to be cooled has a non-planar shape and guides a guide pin to the cold plate. A notch is provided, and a projection is provided on the cold plate heat receiving surface near the notch so as to be close to the heat radiating surface of the component to be cooled, so that the non-cooling component is uniformly cooled. Contact cold plate.