JP2006307344A - 電気めっき槽 - Google Patents
電気めっき槽 Download PDFInfo
- Publication number
- JP2006307344A JP2006307344A JP2006121511A JP2006121511A JP2006307344A JP 2006307344 A JP2006307344 A JP 2006307344A JP 2006121511 A JP2006121511 A JP 2006121511A JP 2006121511 A JP2006121511 A JP 2006121511A JP 2006307344 A JP2006307344 A JP 2006307344A
- Authority
- JP
- Japan
- Prior art keywords
- electroplating tank
- electroplating
- tank according
- anode
- screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 94
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 34
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 22
- 239000010936 titanium Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 15
- 239000011247 coating layer Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 13
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000002378 acidificating effect Effects 0.000 claims abstract description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 5
- 239000011733 molybdenum Substances 0.000 claims abstract description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000001450 anions Chemical class 0.000 claims abstract description 4
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 4
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920000447 polyanionic polymer Polymers 0.000 claims abstract description 4
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 4
- 239000010937 tungsten Substances 0.000 claims abstract description 4
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000003792 electrolyte Substances 0.000 claims description 14
- -1 anhydride cation Chemical class 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 239000004743 Polypropylene Substances 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 12
- 229920001155 polypropylene Polymers 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000002759 woven fabric Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 229910052741 iridium Inorganic materials 0.000 claims description 5
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 5
- 239000012811 non-conductive material Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000002557 mineral fiber Substances 0.000 claims description 3
- 239000000654 additive Substances 0.000 abstract description 11
- 230000000996 additive effect Effects 0.000 abstract description 10
- 239000000243 solution Substances 0.000 abstract description 4
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 3
- 150000001768 cations Chemical class 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000004753 textile Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 24
- 238000007747 plating Methods 0.000 description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 5
- 239000005751 Copper oxide Substances 0.000 description 5
- 229910000431 copper oxide Inorganic materials 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Abstract
【解決手段】電気めっきに使用するアノード1は、キャリヤ4とコーティング層5からなる陽極基材2、および、薄い織物6と格子または網7からなるスクリーン3等から構成される2相または3相以上とすること、また、電解液は70 mg/lを超える塩化物、及び陰イオン、酸素酸からなるポリアニオン、酸無水物の陽イオンまたはヘテロポリアニオンである、モリブデン、バナジウム、ジルコニウム、タンタル、タングステン、ハフニウムまたはチタンからなる群から選択された少なくとも一つの元素を5〜5000 mg/l、好ましくは200〜1200 mg/lの濃度で含む。
【選択図】図1
Description
特許文献7は、パルス電気めっき法に使用する銅電解液を含んだ塩化物を開示している。
100 mg/l塩化物では、平均89%の層厚偏差が得られる。
125 mg/l塩化物では、平均102%の層厚偏差が得られる。
150 mg/l塩化物では、平均125%の層厚偏差が得られる。
175 mg/l塩化物では、平均132%の層厚偏差が得られる。
250 mg/l塩化物では、平均99%の層厚偏差が得られる。
なお、上記層厚偏差の%は、予定した層厚に対する実際のめっき処理により得た層厚の割合を示したものである。
2 陽極基材
3 スクリーン
4 キャリア
5 コーティング層
6 薄い織物
7 格子または網
a 距離
b 距離
c 距離
Claims (21)
- アノード1、カソード及び電解液を含んだ酸性電気めっき槽であって、前記アノード1は2相または3相以上であり、前記電解液は70 mg/l以上の塩化物、及び陰イオン、酸素酸からなるポリアニオン、酸無水物の陽イオンまたはヘテロポリアニオンである、モリブデン、バナジウム、ジルコニウム、タンタル、タングステン、ハフニウムまたはチタンからなる群から選択された少なくとも一つの元素を5〜5000 mg/lの濃度で含むことを特徴とする、電気めっき槽。
- 前記元素の濃度が200〜1200 mg/lであることを特徴とする、請求項1に記載の電気めっき槽
- 前記電解液が90 〜5000 mg/lの塩化物を含むことを特徴とする、請求項1または2に記載の電気めっき槽。
- 前記電解液が100 〜300 mg/lの塩化物を含むことを特徴とする、請求項1または2に記載の電気めっき槽。
- 前記電解液が120 〜250 mg/lの塩化物を含むことを特徴とする、請求項1または2に記載の電気めっき槽。
- 前記アノード1が陽極基材2及びスクリーン3から構成されることを特徴とする、請求項1乃至5のいずれか1項に記載の電気めっき槽。
- 前記陽極基材2がキャリア4及びコーティング層5から構成されることを特徴とする、請求項6に記載の電気めっき槽。
- 前記キャリア4がステンレススチール製またはチタン製であることを特徴とする、請求項7に記載の電気めっき槽。
- 前記コーティング層5がイリジウム混合酸化物製または白金製であることを特徴とする、請求項7に記載の電気めっき槽。
- 前記スクリーン3がキャリア4から離れて配置されており、プラスチック製または金属製であることを特徴とする、請求項6乃至9のいずれか1項に記載の電気めっき槽。
- 前記スクリーン3が薄い織物であることを特徴とする、請求項6乃至10のいずれか1項に記載の電気めっき槽。
- 前記スクリーン3がチタン製の格子または網7であることを特徴とする、請求項11に記載の電気めっき槽。
- 前記スクリーン3が不導電性材料で作製される薄い織物6であることを特徴とする、請求項11に記載の電気めっき槽。
- 前記不導電性材料で作製される薄い織物がプラスチック、グラスファイバーまたは鉱物繊維の薄い織物であることを特徴とする、請求項13に記載の電気めっき槽。
- 前記プラスチックがポリプロピレンであることを特徴とする、請求項14に記載の電気めっき槽。
- 前記スクリーン3がチタン製の格子または網(7)及びポリプロピレン製の薄い織物6の二つの部分からなり、ポリプロピレン製の薄い織物6は陽極基材2とチタン製の格子または網7との間に設けられることを特徴とする、請求項6乃至15のいずれか1項に記載の電気めっき槽。
- 前記電解液が銅電解液であることを特徴とする、請求項1乃至16のいずれか1項に記載の電気めっき槽。
- 請求項1乃至17のいずれか1項に記載の電気めっき槽を使用することを特徴とする、電気めっきの方法。
- 直流、正パルス電流または負パルス電流を用いた電気めっきにより電解析出を行うことを特徴とする、請求項18に記載の方法。
- 請求項1乃至17のいずれか1項に記載の電気めっき槽を電気めっきのために用いる方法。
- 請求項1乃至17のいずれか1項に記載の電気めっき槽を、被めっき材を縦方向とした操作または横方向とした操作から選択された少なくとも一つの方向の操作に用いる方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05009183A EP1717351A1 (de) | 2005-04-27 | 2005-04-27 | Galvanikbad |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006307344A true JP2006307344A (ja) | 2006-11-09 |
JP4404871B2 JP4404871B2 (ja) | 2010-01-27 |
Family
ID=34935798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006121511A Active JP4404871B2 (ja) | 2005-04-27 | 2006-04-26 | 電気めっき槽 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060272951A1 (ja) |
EP (1) | EP1717351A1 (ja) |
JP (1) | JP4404871B2 (ja) |
KR (1) | KR100741198B1 (ja) |
CN (1) | CN1854352B (ja) |
TW (1) | TWI332533B (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1712660A1 (de) * | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
ES2698205T3 (es) | 2005-11-25 | 2019-02-01 | Macdermid Enthone Inc | Procedimiento y dispositivo para la purificación de soluciones de proceso |
EP1961842A1 (en) * | 2007-02-22 | 2008-08-27 | Atotech Deutschland Gmbh | Device and method for the electrolytic plating of a metal |
EP2009147A1 (en) * | 2007-06-20 | 2008-12-31 | METAKEM Gesellschaft für Schichtchemie der Metalle GmbH | Anode assembly for electroplating |
US8940158B2 (en) * | 2009-02-13 | 2015-01-27 | Chlorking, Inc. | System and method for chlorine generation and distribution |
US8221600B2 (en) | 2010-09-23 | 2012-07-17 | Sunpower Corporation | Sealed substrate carrier for electroplating |
US8221601B2 (en) | 2010-09-23 | 2012-07-17 | Sunpower Corporation | Maintainable substrate carrier for electroplating |
US8317987B2 (en) | 2010-09-23 | 2012-11-27 | Sunpower Corporation | Non-permeable substrate carrier for electroplating |
WO2012039818A1 (en) * | 2010-09-23 | 2012-03-29 | Sunpower Corporation | Maintainable substrate carrier for electroplating |
US9006147B2 (en) * | 2012-07-11 | 2015-04-14 | Faraday Technology, Inc. | Electrochemical system and method for electropolishing superconductive radio frequency cavities |
CN104073862A (zh) * | 2014-07-11 | 2014-10-01 | 张钰 | 一种用于碱性锌镍合金电镀的不溶性阳极装置 |
CN105887144B (zh) * | 2016-06-21 | 2018-09-21 | 广东光华科技股份有限公司 | 电镀铜镀液及其电镀铜工艺 |
DE102019202899B3 (de) * | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US3607706A (en) * | 1967-08-04 | 1971-09-21 | Ionics | Method of making stable laminated cation-exchange membranes |
US3832296A (en) * | 1972-08-07 | 1974-08-27 | Kennecott Copper Corp | Electrowinning cell and method with provision for electrolyte circulation |
US3857683A (en) | 1973-07-27 | 1974-12-31 | Mica Corp | Printed circuit board material incorporating binary alloys |
US4138510A (en) * | 1973-09-27 | 1979-02-06 | Firma C. Conradty | Metal anode for electrochemical processing and method of making same |
US4033837A (en) * | 1976-02-24 | 1977-07-05 | Olin Corporation | Plated metallic cathode |
JPS5626554A (en) * | 1979-08-10 | 1981-03-14 | Asahi Chem Ind Co Ltd | Improved cation exchange membrane |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
JPH01150000A (ja) * | 1987-12-07 | 1989-06-13 | Nippon Steel Corp | 電気メッキ用不溶性陽極 |
US5378347A (en) | 1993-05-19 | 1995-01-03 | Learonal, Inc. | Reducing tin sludge in acid tin plating |
DE19545231A1 (de) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
DE19653681C2 (de) * | 1996-12-13 | 2000-04-06 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens |
US5972192A (en) * | 1997-07-23 | 1999-10-26 | Advanced Micro Devices, Inc. | Pulse electroplating copper or copper alloys |
DE19834353C2 (de) * | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
KR100366631B1 (ko) * | 2000-09-27 | 2003-01-09 | 삼성전자 주식회사 | 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법 |
US6610192B1 (en) * | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
US20040060728A1 (en) | 2001-01-04 | 2004-04-01 | Philippe Steiert | Method for producing electroconductive structures |
JP2003105584A (ja) * | 2001-07-26 | 2003-04-09 | Electroplating Eng Of Japan Co | 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法 |
EP1310582A1 (en) | 2001-11-07 | 2003-05-14 | Shipley Company LLC | Process for electrolytic copper plating |
US20040217005A1 (en) * | 2002-07-24 | 2004-11-04 | Aron Rosenfeld | Method for electroplating bath chemistry control |
DE10261493A1 (de) * | 2002-12-23 | 2004-07-08 | METAKEM Gesellschaft für Schichtchemie der Metalle mbH | Anode zur Galvanisierung |
EP1712660A1 (de) * | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
-
2005
- 2005-04-27 EP EP05009183A patent/EP1717351A1/de not_active Withdrawn
- 2005-11-02 CN CN2005101201051A patent/CN1854352B/zh active Active
- 2005-12-13 KR KR1020050122525A patent/KR100741198B1/ko not_active IP Right Cessation
-
2006
- 2006-03-02 TW TW095107051A patent/TWI332533B/zh active
- 2006-04-26 JP JP2006121511A patent/JP4404871B2/ja active Active
- 2006-04-27 US US11/380,559 patent/US20060272951A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1717351A1 (de) | 2006-11-02 |
CN1854352B (zh) | 2010-09-22 |
JP4404871B2 (ja) | 2010-01-27 |
US20060272951A1 (en) | 2006-12-07 |
CN1854352A (zh) | 2006-11-01 |
KR20060113344A (ko) | 2006-11-02 |
TWI332533B (en) | 2010-11-01 |
TW200704831A (en) | 2007-02-01 |
KR100741198B1 (ko) | 2007-07-19 |
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