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JP2006197440A - Antenna circuit conductor and non-contact ic tag - Google Patents

Antenna circuit conductor and non-contact ic tag Download PDF

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Publication number
JP2006197440A
JP2006197440A JP2005008715A JP2005008715A JP2006197440A JP 2006197440 A JP2006197440 A JP 2006197440A JP 2005008715 A JP2005008715 A JP 2005008715A JP 2005008715 A JP2005008715 A JP 2005008715A JP 2006197440 A JP2006197440 A JP 2006197440A
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antenna circuit
circuit conductor
antenna
base material
substrate
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Toshihiko Tokuda
俊彦 徳田
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Toppan Inc
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Toppan Printing Co Ltd
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Priority to JP2005008715A priority Critical patent/JP2006197440A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag reducing the loss of an antenna circuit conductor and having the antenna circuit conductor. <P>SOLUTION: The antenna circuit conductor 2, in which a recessed section 31 is formed previously at a place, where the edge section 21 of the antenna circuit conductor 2 on the surface of a base material is formed, the recessed section 31 is filled with a conductive member by a printing method and the side face of the edge section 21 is made approximately perpendicular to the surface of the base material, is formed. Accordingly, the sectional area of the edge section 21 of the antenna circuit conductor 2, through which a high-frequency current flows, can be expanded, the loss of antenna characteristics is reduced and a thinning and a low manufacturing cost can be realized. The non-contact IC tag improving antenna characteristics can be provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、アンテナ回路導体、及び非接触ICタグに関する。   The present invention relates to an antenna circuit conductor and a contactless IC tag.

非接触ICタグは、ICチップと無線波を送受信するためのアンテナ回路導体で構成される。
アンテナ回路導体の製造方法としては3種類の方法があり、1つは、絶縁基板(ガラスエポキシ、ポリエステルフィルム等のフレキシブルシート)上に銅またはアルミ箔を貼り付け、エッチングして形成する方法、2つ目は、断面が円形または長方形の導線等を渦巻き状に巻いた巻き線方法、3つ目はポリエステルフィルム等のフレキシブルシート上に、導体ペーストを印刷により形成する方法である。
The non-contact IC tag is composed of an antenna circuit conductor for transmitting and receiving radio waves to and from the IC chip.
There are three types of methods for manufacturing the antenna circuit conductor. One is a method in which copper or aluminum foil is pasted on an insulating substrate (flexible sheet such as glass epoxy or polyester film) and etched, The first is a winding method in which a conductor having a circular or rectangular cross section is wound in a spiral shape, and the third is a method in which a conductive paste is formed on a flexible sheet such as a polyester film by printing.

前者2つ(エッチング、巻き線)の方法は比較的低抵抗(比抵抗数μΩ・cm)の材料が選択できるため、アンテナ回路導体に要求される低抵抗、高インダクタンスの特性を得ることが可能である。
しかし、エッチングによる方法は、アンテナ回路導体を薄く形成することができ、物性的に優れるものの、製造工程が長く複雑なものであるため、製造におけるコストが高くなってしまうという問題を有する。
巻き線による方法は物性的にも優れ、比較的に安価に製造できる長所を有するが、薄型化には限界があり、さらには巻き線と電子部品回路を接続する作業が複雑であり、自動化が困難であるという問題を有する。
これらの2つの方法に対し、印刷による方法は、安価に製造ができる上、厚みも薄くでき、大量消費の非接触ICタグには最適という長所を有する。
The former two methods (etching and winding) can select a material with a relatively low resistance (specific resistance of several μΩ · cm), so the characteristics of low resistance and high inductance required for antenna circuit conductors can be obtained. It is.
However, the etching method can form the antenna circuit conductor thinly and is excellent in physical properties, but has a problem that the manufacturing process is expensive because the manufacturing process is long and complicated.
The winding method is superior in physical properties and has the advantage that it can be manufactured at a relatively low cost. However, there is a limit to reducing the thickness, and the work of connecting the winding and the electronic component circuit is complicated, and automation is difficult. It has the problem of being difficult.
In contrast to these two methods, the printing method is advantageous in that it can be manufactured at low cost and can be made thin, and is optimal for a non-contact IC tag with a large amount of consumption.

ここで、アンテナ回路導体の高周波特性で無視できないものとして、表皮効果がある。一般的に回路導体に流れる信号の周波数が高くなってくると信号は回路導体の表面に集まってくる。これは回路導体の中心部では磁束との鎖交が多く、中心部に近づくに従って逆起電力が大きくなり、電流が流れにくくなる。その結果、回路導体に流れる信号の周波数が高くなる程電流は導体の表面に集まってくる。アンテナ回路導体の抵抗がゼロでない場合、単位長当たりの抵抗は断面積に依存するので、全断面積に対する電流の流れている部分の面積が小さい程抵抗が高くなる。つまり流れる信号の周波数が高くなる程、回路導体の抵抗値が上がる。   Here, there is a skin effect that cannot be ignored in the high frequency characteristics of the antenna circuit conductor. In general, when the frequency of a signal flowing through a circuit conductor increases, the signal collects on the surface of the circuit conductor. This is because there are many linkages with the magnetic flux at the center of the circuit conductor, and the counter electromotive force increases as the distance from the center increases, making it difficult for current to flow. As a result, the higher the frequency of the signal flowing through the circuit conductor, the more current is collected on the surface of the conductor. When the resistance of the antenna circuit conductor is not zero, the resistance per unit length depends on the cross-sectional area, so that the resistance increases as the area of the current flowing portion with respect to the total cross-sectional area decreases. That is, the higher the frequency of the flowing signal, the higher the resistance value of the circuit conductor.

印刷方法でアンテナ回路導体を形成した場合、導電性ペーストが凝固する前にペーストが基材に沿ってダレが生じるため(図2(a)(b))、アンテナ回路導体のエッジ部の断面は鋭角形状になってしまう。このようなアンテナ回路導体において、特に2.45GHz等の高い周波数を扱う場合、エッジ部の先端の断面積が非常に小さい部分に電流が集中して、表皮効果によりその損失が大きくなるという問題がある。   When the antenna circuit conductor is formed by the printing method, since the paste sags along the substrate before the conductive paste solidifies (FIGS. 2A and 2B), the cross section of the edge portion of the antenna circuit conductor is It becomes an acute angle shape. In such an antenna circuit conductor, particularly when a high frequency such as 2.45 GHz is handled, there is a problem that current concentrates on a portion where the cross-sectional area of the tip of the edge portion is very small and the loss increases due to the skin effect. is there.

以下に公知文献を示す。
特開平9−1970号公報
The known literature is shown below.
JP-A-9-1970

本発明は上記問題を鑑みてなされたもので、端部形状を改善することで損失を低減したアンテナ回路導体を形成し、それを有する非接触ICタグを提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a non-contact IC tag having an antenna circuit conductor having a reduced loss by improving the end shape.

本発明は上記の課題を解決するために、請求項1の発明は、 基材表面に導電性部材により形成されるアンテナ回路導体であって、エッジ部の側面が前記基材表面に対し略垂直となることを特徴とするアンテナ回路導体である。   In order to solve the above problems, the present invention provides an antenna circuit conductor formed of a conductive member on a substrate surface, wherein the side surface of the edge portion is substantially perpendicular to the substrate surface. It is an antenna circuit conductor characterized by the following.

請求項2の発明は、上記のアンテナ回路導体において、前記基材表面の前記アンテナ回路導体のエッジ部が設置される位置に、予め凹部を形成し、前記導電性部材が前記凹部に充填され、前記エッジ部の側面が前記基材表面に対し略垂直となることを特徴とするアンテナ回路導体である。   Invention of Claim 2 WHEREIN: In said antenna circuit conductor, a recessed part is previously formed in the position where the edge part of the said antenna circuit conductor of the said base-material surface is installed, The said electroconductive member is filled in the said recessed part, The antenna circuit conductor is characterized in that a side surface of the edge portion is substantially perpendicular to a surface of the substrate.

請求項3の発明は、上記のアンテナ回路導体において、前記導電性部材は導電ペーストであり、印刷法により塗布することで、フィルム状の基材表面上に形成することを特徴とするアンテナ回路導体である。   According to a third aspect of the present invention, in the antenna circuit conductor described above, the conductive member is a conductive paste, and is formed on a film-like substrate surface by coating by a printing method. It is.

請求項4の発明は、ICチップと、基材と、この基材表面に形成された請求項1から3のいずれかに記載のアンテナ回路導体とを有することを特徴とする非接触ICタグである。   The invention of claim 4 is a non-contact IC tag comprising an IC chip, a base material, and the antenna circuit conductor according to any one of claims 1 to 3 formed on the surface of the base material. is there.

本発明によれば、アンテナ回路導体端部の断面が鋭角形状になることを抑制でき、これにより高周波電流が流れる断面積を拡大することで抵抗が低減されることとなり、アンテナ特性の損失も低減される。これにより、印刷方法でアンテナ回路導体を形成する際の課題を解決することができ、薄型化、安価な製造コストを得ることができる。さらに、このようなアンテナ特性を高めた非接触ICタグの提供をすることができる。   According to the present invention, it is possible to suppress the cross section of the antenna circuit conductor end portion from becoming an acute angle, thereby reducing the resistance by enlarging the cross-sectional area through which the high-frequency current flows, and reducing the loss of antenna characteristics. Is done. Thereby, the subject at the time of forming an antenna circuit conductor with a printing method can be solved, and thickness reduction and cheap manufacturing cost can be obtained. Furthermore, a non-contact IC tag with improved antenna characteristics can be provided.

以下に、本発明の実施の形態を詳細に説明する。
図1には、本実施形態のアンテナ基板4を示す。
このアンテナ基板4は、基材3と、この基材3上に設置されたICチップ1と、一対のアンテナ回路導体2とを備える。
基材3は、平面略矩形形状であり、例えば、ポリエチレンテレフタレート、ポリカーボネート、ポリイミド等の樹脂材料や紙を用いることができる。なお、基材3の材質はこれらに特に限定されるものではない。
Hereinafter, embodiments of the present invention will be described in detail.
FIG. 1 shows an antenna substrate 4 of the present embodiment.
The antenna substrate 4 includes a base material 3, an IC chip 1 installed on the base material 3, and a pair of antenna circuit conductors 2.
The base material 3 has a substantially rectangular shape in plan, and for example, a resin material such as polyethylene terephthalate, polycarbonate, polyimide, or paper can be used. In addition, the material of the base material 3 is not specifically limited to these.

この基材3の表面の略中央にICチップ1が設置されている。
また、基材3の表面には、基材3の長手方向に沿って、断面略矩形状の凹部31が形成されている。この凹部31は、必要に応じ種々の表面処理、例えばエンボス加工、プラズマや紫外線による酸化エッチング処理などにより形成することが可能である。
The IC chip 1 is installed at the approximate center of the surface of the substrate 3.
A concave portion 31 having a substantially rectangular cross section is formed on the surface of the base material 3 along the longitudinal direction of the base material 3. The concave portion 31 can be formed by various surface treatments as necessary, for example, embossing, oxidation etching treatment by plasma or ultraviolet rays, and the like.

アンテナ回路導体2は、シルクスクリーン印刷法により、導電性ペーストを基材3上に塗布することで形成される。前記導電性ペーストは、導電性を示すための金属粒子の他に、基材との密着性を保つためにフェノール系、エポキシ系、ポリエステル系、ウレタン系等の各種樹脂と希釈溶剤が配合されているものを使用することができる。
このアンテナ回路導体2は、平面略矩形形状であり、基材3の表面にICチップ1を挟むようにして配置される。このアンテナ回路導体2の長手方向の端部は、前記ICチップ1に接続されている。
The antenna circuit conductor 2 is formed by applying a conductive paste on the substrate 3 by silk screen printing. In addition to the metal particles for showing conductivity, the conductive paste is blended with various resins such as phenol, epoxy, polyester and urethane and a diluent solvent in order to maintain adhesion with the substrate. You can use what you have.
The antenna circuit conductor 2 has a substantially rectangular shape on a plane, and is arranged so that the IC chip 1 is sandwiched between the surfaces of the base material 3. The end of the antenna circuit conductor 2 in the longitudinal direction is connected to the IC chip 1.

アンテナ回路導体2のエッジ部21(アンテナ回路導体2の短辺方向の端部)を構成する導電性ペーストは、前述した基材3の凹部31に充填されており、エッジ部21の側面は、基材3の表面に対し、略垂直となっている。
前記略垂直とは基材3の表面に対して70度から120度の角度であることが好ましい。
The conductive paste constituting the edge portion 21 of the antenna circuit conductor 2 (the end portion in the short side direction of the antenna circuit conductor 2) is filled in the concave portion 31 of the base material 3, and the side surface of the edge portion 21 is It is substantially perpendicular to the surface of the substrate 3.
The substantially perpendicular is preferably an angle of 70 degrees to 120 degrees with respect to the surface of the substrate 3.

このようなアンテナ基板4は、次のようにして成形される。
図3(a)に示すように、導電性ペーストを基材3上に印刷する。なお、導電性ペーストとの密着性向上のために該基材に予めコロナ放電処理、プラズマ処理、サンドブラスト処理及びプライマー処理等の活性化処理を行っておくことが好ましい。
印刷直後の導電性ペーストは端部が略垂直に立った形状を示すが、所定の粘度を有しているため時間の経過とともにダレが生じる。しかし、図3(b)に示すようにダレが生じた導電性ペーストは基材3に形成された凹部31に充填されることで塗れ広がりをせき止め、アンテナ回路導体2の端部断面が鋭角になるのが抑制される。
Such an antenna substrate 4 is formed as follows.
As shown in FIG. 3A, the conductive paste is printed on the substrate 3. In order to improve the adhesion to the conductive paste, it is preferable that the substrate is previously subjected to activation treatment such as corona discharge treatment, plasma treatment, sandblast treatment, and primer treatment.
The conductive paste immediately after printing shows a shape in which the end portion stands substantially vertically, but since it has a predetermined viscosity, sagging occurs over time. However, as shown in FIG. 3 (b), the sagging conductive paste is filled in the recess 31 formed in the base material 3 to prevent spreading and the end cross section of the antenna circuit conductor 2 has an acute angle. It is suppressed.

導電性ペーストが乾燥した後、ICチップ1を導電性接着剤または異方導電性接着フィルム等を介して基材3上に搭載接続する。以上により、アンテナ基板4を得ることができる。   After the conductive paste is dried, the IC chip 1 is mounted and connected on the substrate 3 via a conductive adhesive or an anisotropic conductive adhesive film. Thus, the antenna substrate 4 can be obtained.

(実施例1)
図4(a)は本発明に用いるアンテナ回路導体の一実施例における断面図と抵抗値のシミュレーション結果を示したものである。アンテナ回路導体厚は20μm、基材に幅20μm、深さ5μmの矩形状の凹部を有するアンテナ回路を形成し、導電性ペーストの導電率を3mS/m、基材材質としてポリエチレンテレフタレートを想定した誘電率を3.2に設定し、周波数2.45GHzにおいて長さ1mの導体に1Aの電流を流したときの抵抗値を計測した。
計測した結果、抵抗値は136.48Ω/mであった。
Example 1
FIG. 4A shows a cross-sectional view and a resistance value simulation result in an embodiment of the antenna circuit conductor used in the present invention. An antenna circuit conductor thickness is 20 μm, an antenna circuit having a rectangular recess having a width of 20 μm and a depth of 5 μm is formed on a base material. The resistance was measured when a current of 1 A was passed through a 1 m long conductor at a frequency of 2.45 GHz at a rate of 3.2.
As a result of measurement, the resistance value was 136.48 Ω / m.

(実施例2)
図4(b)は本発明に用いるアンテナ回路導体の一実施例における断面図と抵抗値のシミュレーション結果を示したものである。アンテナ回路導体厚は20μm、基材に深さ5μmの楔型凹部を有するアンテナ回路を形成し、導電性ペーストの導電率を3mS/m、基材材質としてポリエチレンテレフタレートを想定した誘電率を3.2に設定し、周波数2.45GHzにおいて長さ1mの導体に1Aの電流を流したときの抵抗値を計測した。
計測した結果、抵抗値は136.79Ω/mであった。
(Example 2)
FIG. 4B shows a cross-sectional view and a resistance value simulation result in an embodiment of the antenna circuit conductor used in the present invention. An antenna circuit conductor thickness is 20 μm, an antenna circuit having a wedge-shaped recess having a depth of 5 μm is formed on a substrate, the conductivity of the conductive paste is 3 mS / m, and the dielectric constant assuming polyethylene terephthalate as the substrate material is 3. The resistance value was measured when a current of 1 A was passed through a 1 m long conductor at a frequency of 2.45 GHz.
As a result of measurement, the resistance value was 136.79 Ω / m.

(比較例)
図4(c)は従来のアンテナ回路導体における断面図と抵抗値のシミュレーション結果を上記実施例1,2に対する比較例として示したものである。アンテナ回路導体厚は20μm、基材に幅20μm、深さ5μmの矩形状の凹部を有するアンテナ回路を形成し、導電性ペーストの導電率を3mS/m、基材材質としてポリエチレンテレフタレートを想定した誘電率を3.2に設定し、周波数2.45GHzにおいて長さ1mの導体に1Aの電流を流したときの抵抗値を計測した。
計測の結果、抵抗値は183.84Ω/mであった。
(Comparative example)
FIG. 4C shows a cross-sectional view and a resistance value simulation result of a conventional antenna circuit conductor as a comparative example for the first and second embodiments. An antenna circuit conductor thickness is 20 μm, an antenna circuit having a rectangular recess having a width of 20 μm and a depth of 5 μm is formed on a base material, the conductivity of the conductive paste is 3 mS / m, and the dielectric material assuming polyethylene terephthalate as the base material The resistance was measured when a current of 1 A was passed through a 1 m long conductor at a frequency of 2.45 GHz at a rate of 3.2.
As a result of measurement, the resistance value was 183.84 Ω / m.

前記実施例1、2いずれにおいても従来のアンテナ回路導体の結果と比較して約25%の損失が低減された。   In each of Examples 1 and 2, the loss was reduced by about 25% compared to the result of the conventional antenna circuit conductor.

なお、本発明では専ら、直線上に配置されたアンテナ回路導体を使用した例についてのみ説明したが、これに限らず、ループ形状等、アンテナ機能を有する如何なる形状の類似のアンテナに関しても本発明を応用することは可能である。
また、本発明では専ら2.45GHzの周波数を使用した例についてのみ説明したが、これに限らず、他の周波数領域においても本発明を応用することは可能である。
In the present invention, only an example using antenna circuit conductors arranged on a straight line has been described. However, the present invention is not limited to this, and the present invention is also applied to a similar antenna having an antenna function such as a loop shape. It is possible to apply.
In the present invention, only an example using a frequency of 2.45 GHz has been described. However, the present invention is not limited to this, and the present invention can be applied to other frequency regions.

さらには、本発明では基材3の凹部31により塗布された導電性ペーストのエッジ部21を基材3の表面に対して略垂直としたが、従来の印刷法で形成されたアンテナ回路導体を物理的に切断する方法によりエッジ部を基材表面に対して略垂直としてもよい。   Furthermore, in this invention, although the edge part 21 of the electrically conductive paste apply | coated by the recessed part 31 of the base material 3 was made substantially perpendicular with respect to the surface of the base material 3, the antenna circuit conductor formed by the conventional printing method was used. The edge portion may be substantially perpendicular to the substrate surface by a method of physically cutting.

また、本発明では機材表面にシルクスクリーン印刷法により導電性ペーストを塗布することでアンテナ回路導体を形成する例についてのみ説明したが、これに限らず、他の方法により形成されたアンテナ回路導体のエッジ形状について本発明を応用することは可能である。   Further, in the present invention, only an example in which the antenna circuit conductor is formed by applying a conductive paste to the surface of the equipment by a silk screen printing method has been described. The present invention can be applied to edge shapes.

(a)は本発明によるアンテナ回路導体を有するアンテナ基板の概略図、(b)はアンテナ基板の断面図(A) is a schematic view of an antenna substrate having an antenna circuit conductor according to the present invention, and (b) is a cross-sectional view of the antenna substrate. (a)従来の印刷法による印刷直後のアンテナ回路導体の断面図、(b)従来の印刷法による導電性ペーストがダレた状態のアンテナ回路導体の断面図(A) Cross-sectional view of antenna circuit conductor immediately after printing by conventional printing method, (b) Cross-sectional view of antenna circuit conductor in a state where conductive paste is sag by conventional printing method (a)は本発明による印刷直後のアンテナ回路導体の断面図、(b)本発明による導電性ペーストがダレた状態のアンテナ回路導体の断面図(A) is a cross-sectional view of an antenna circuit conductor immediately after printing according to the present invention, (b) a cross-sectional view of the antenna circuit conductor in a state in which the conductive paste according to the present invention is sagging. (a)は本発明の実施例1による抵抗値のシミュレーション図、(b)は本発明の実施例2による抵抗値のシミュレーション図、(c)従来の印刷法による抵抗値のシミュレーション図(A) is a simulation diagram of resistance value according to the first embodiment of the present invention, (b) is a simulation diagram of resistance value according to the second embodiment of the present invention, and (c) is a simulation diagram of resistance value according to the conventional printing method.

符号の説明Explanation of symbols

1・・・ICチップ
2・・・アンテナ回路導体
21・・エッジ部
3・・・基材
31・・凹部
4・・・アンテナ回路基板
DESCRIPTION OF SYMBOLS 1 ... IC chip 2 ... Antenna circuit conductor 21 ... Edge part 3 ... Base material 31 ... Concave part 4 ... Antenna circuit board

Claims (4)

基材表面に導電性部材により形成されるアンテナ回路導体であって、
エッジ部の側面が前記基材表面に対し略垂直となることを特徴とするアンテナ回路導体。
An antenna circuit conductor formed of a conductive member on a substrate surface,
An antenna circuit conductor, wherein a side surface of an edge portion is substantially perpendicular to the surface of the substrate.
請求項1に記載のアンテナ回路導体において、
前記基材表面の前記アンテナ回路導体のエッジ部が設置される位置に、予め凹部を形成し、前記導電性部材が前記凹部に充填され、前記エッジ部の側面が前記基材表面に対し略垂直となることを特徴とするアンテナ回路導体。
The antenna circuit conductor according to claim 1,
A concave portion is formed in advance at a position where the edge portion of the antenna circuit conductor on the surface of the base material is installed, the conductive member is filled in the concave portion, and a side surface of the edge portion is substantially perpendicular to the base material surface. An antenna circuit conductor characterized by:
請求項1又は2に記載のアンテナ回路導体において、
前記導電性部材は、導電性ペーストであり、印刷法により塗布することで、フィルム状の基材表面上に形成することを特徴とするアンテナ回路導体。
The antenna circuit conductor according to claim 1 or 2,
The antenna circuit conductor according to claim 1, wherein the conductive member is a conductive paste, and is formed on a surface of a film-like base material by application by a printing method.
ICチップと、基材と、
この基材表面に形成された請求項1から3のいずれかに記載のアンテナ回路導体とを有することを特徴とする非接触ICタグ。
An IC chip, a substrate,
A non-contact IC tag comprising the antenna circuit conductor according to claim 1 formed on the surface of the substrate.
JP2005008715A 2005-01-17 2005-01-17 Antenna circuit conductor and non-contact ic tag Pending JP2006197440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005008715A JP2006197440A (en) 2005-01-17 2005-01-17 Antenna circuit conductor and non-contact ic tag

Publications (1)

Publication Number Publication Date
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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245101A (en) * 2007-03-28 2008-10-09 Brother Ind Ltd Pattern antenna, tag antenna, and pattern transmission line
JP2011244109A (en) * 2010-05-14 2011-12-01 Murata Mfg Co Ltd Wireless ic device
WO2019135381A1 (en) * 2018-01-05 2019-07-11 ニッタ株式会社 Ic tag

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245101A (en) * 2007-03-28 2008-10-09 Brother Ind Ltd Pattern antenna, tag antenna, and pattern transmission line
US7782259B2 (en) 2007-03-28 2010-08-24 Brother Kogyo Kabushiki Kaisha Pattern antenna, tag antenna and pattern transmission path
JP4561765B2 (en) * 2007-03-28 2010-10-13 ブラザー工業株式会社 Pattern antenna and tag antenna
JP2011244109A (en) * 2010-05-14 2011-12-01 Murata Mfg Co Ltd Wireless ic device
WO2019135381A1 (en) * 2018-01-05 2019-07-11 ニッタ株式会社 Ic tag
JP2019121933A (en) * 2018-01-05 2019-07-22 ニッタ株式会社 IC tag
CN111566670A (en) * 2018-01-05 2020-08-21 霓达株式会社 IC tag
CN111566670B (en) * 2018-01-05 2023-07-14 霓达株式会社 IC tag

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