JP2006176764A - Adhesive composition for electronic equipment, adhesive sheet for electronic equipment, and electronic part and electronic equipment using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive composition for electronic equipment, having excellent adhesive force, excellent reflow resistance and quick curability, to provide an adhesive sheet for electronic equipment, and to provide an electronic part and electronic equipment each using the same. <P>SOLUTION: This adhesive composition for the electronic equipment comprises a thermoplastic resin, an epoxy resin, an inorganic filler, and an imidazole compound represented by the general formula (I). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an adhesive composition for electronic equipment, and more particularly, a tape automation used when mounting a semiconductor integrated circuit for a reinforcing plate (stiffener), a heat sink (heat spreader), a semiconductor element or a wiring board (interposer). Ted bonding (TAB) pattern processing tape, ball grid array (BGA) package interposer and other semiconductor connection substrates, flexible printed circuit board (FPC) coverlays, copper-clad laminates and their reinforcing plates, multilayer substrates Interlayer adhesives, and substrate parts, lead frame fixing tapes, LOC fixing tapes, and adhesives between electronic components such as semiconductor elements and supporting members such as lead frames and insulating support substrates, that is, die bonding materials and shielding materials, using them Adhesives for electronic devices that are preferably used Composition, an electronic component and an electronic apparatus using the adhesive sheet and it electronics.

  In recent years, in a semiconductor integrated circuit (IC) package, a BGA method, an LGA method, a PGA method, etc. have been put into practical use as means for increasing the number of pins and reducing the size. Among them, the BGA method has been attracting attention because of the possibility of cost reduction, weight reduction and thinning by using plastic materials.

  FIG. 1 shows an example of the BGA method. Insulator layer 3 and conductor pattern 5 for connecting IC 1, wiring board layer composed of adhesive layer 4, reinforcing plate (stiffener), heat radiating plate (heat spreader), layer where conductor pattern is not formed 7 and an adhesive layer 6 for laminating them, each having at least one or more layers, and further having gold bumps 2 and solder resists 8, and an external connection portion of a semiconductor integrated circuit connection substrate to which IC 1 is connected As described above, solder balls 9 substantially corresponding to the number of pins of the IC are provided in a grid pattern (grid array).

  On the other hand, the BGA method has the following problems. (A) Keeping the flatness of the solder ball surface, (b) Improving heat dissipation, (c) Reducing the thermal stress applied to the solder ball during temperature cycling and reflow, (d) Because the number of reflows is large High reflow resistance is required. As a method for improving these, a method of laminating a material such as a metal plate for the purpose of reinforcement, heat dissipation, and electromagnetic shielding on a semiconductor integrated circuit connection substrate is generally used. This method is particularly important when a TAB tape or a flexible printed circuit board is used for a wiring board layer composed of an insulator layer and a conductor pattern for connecting an IC.

  The adhesive layer 4 finally remains inside the package. The characteristics required for the adhesive layer 4 are generated between different materials such as (a) easy processability, (b) reflow resistance, and (c) temperature cycle or reflow, such as a wiring board layer and a reinforcing plate. Stress absorption (low stress), (d) insulation properties when laminated on the wiring, and the like.

  Among them, an important characteristic is reflow resistance. The reflow resistance is a characteristic required in a mounting method in which the entire package is heated to a high temperature such as immersion in a solder bath, heating with a saturated vapor of an inert gas (paper phase method), or infrared reflow. In recent years, taking into consideration environmental burdens, efforts have been made to eliminate lead from solder used for connecting external terminals. Since these various lead-free solders have higher melting points than current lead-based solders, the reflow resistance required for adhesives has increased. The occurrence of problems in the reflow process is that the moisture absorbed by the member between the curing of the adhesive layer and the mounting process explosively vaporizes and expands when heated, thereby softening at a high temperature. This leads to a decrease in reliability in that air bubbles are generated, the tape substrate interface swells, and the solder terminals are short-circuited. Therefore, the adhesive is required to be hard, have low hygroscopicity, and have high adhesive strength in order to prevent intrusion of water vapor generated in the reflow process.

  Moreover, in an actual manufacturing process, a method using an adhesive sheet having a protective film layer is more common than an adhesive alone. First, the protective film layer on one side is removed from an adhesive sheet that is appropriately molded by punching or the like, and then bonded to a semiconductor connection substrate by laminating or pressing. Next, the remaining protective film layer is removed, and the reinforcing plate, the heat radiating plate, and the adherend of another circuit board are again bonded by lamination or pressing. The adhesive is cured by heating and pressing as necessary. In general, thermosetting adhesives require several hours for the curing process, which is one of the causes of reduced productivity. For this reason, a fast-curing thermosetting adhesive is desired to shorten the processing process. More preferably, the adherend is pressure-bonded to both sides of the adhesive sheet and curing is completed at the same time.

  As an example of a conventional thermosetting adhesive, an adhesive sheet as described in Patent Document 1 is used, but if the time for pressure bonding to a component for an electronic device is in units of several minutes, a curing reaction occurs. Since it is insufficient, various characteristics such as reflow resistance cannot be satisfied. In some cases, problems such as foaming may occur in the adhesive sheet due to a rapid pressure and high temperature load caused by pressure bonding. Although a fast curing property can be provided by using a general curing accelerator, a sufficient adhesive force and heat resistance (reflow resistance) cannot be obtained.

  Further, as described in Patent Document 2, a prepreg in which an imidazole silane is added as a coupling agent to an epoxy resin / phenol novolac resin / elastomer composition has been proposed. When this is used in the technical field of the present invention, the adhesion with the base material is improved by imidazole silane, but in an environment where it is repeatedly exposed to high temperatures such as a reflow process, it is bonded due to insufficient heat resistance. There is a problem that foaming and cracking occur in the agent layer.

Patent Document 3 proposes a composition of epoxy resin / carboxyl group-containing nitrile rubber / curing agent / imidazole compound / silane coupling agent / inorganic powder as a bonding sheet. However, in this case as well, the curing rate can be adjusted by the imidazole compound, but the adhesive strength with the substrate was insufficient.
JP 2001-049221 A (8th to 17th paragraphs) JP 2003-318499 A (9th to 14th paragraphs) JP-A-06-322324 (3rd to 4th paragraphs)

  When a conventional thermosetting adhesive composition is cured in a short time (units of several minutes), properties such as adhesive strength and reflow resistance cannot be obtained in a well-balanced manner. The present invention solves this problem and has an adhesive composition for electronic equipment, an adhesive composition for electronic equipment, and an electronic component and electronic equipment using the same, which has excellent adhesive strength and reflow resistance and has fast curing properties. The purpose is to provide.

  In order to solve the above problems, the present invention mainly has the following configuration. That is, it is an adhesive composition for electronic equipment containing a thermoplastic resin, an epoxy resin, an inorganic filler, and an imidazole compound represented by the general formula (I).

(However, R ¹ represents hydrogen or a saturated hydrocarbon group having 1 to 20 carbon atoms, R ² represents hydrogen, a vinyl group, or an alkyl group having 1 to 5 carbon atoms. R ³ , R ⁴ , R ⁵ and R ⁶ may be the same or different and each represents an alkyl group having 1 to 10 carbon atoms, and X ¹ and X ² may be the same or different from each other, and are hydrogen, amino group, carboxyl group, epoxy group, hydroxyl group, methylol. A group, an isocyanate group, a vinyl group, a silanol group or an alkyl group having 1 to 3 carbon atoms, p and q are integers of 1 to 10, l is an integer of 1 to 3, and r is an integer of 1 to 5. .)

  ADVANTAGE OF THE INVENTION According to this invention, the adhesive composition for electronic devices which can be hardened | cured in a short time, is excellent in adhesive force and reflow resistance, and the balance of workability and reliability can be obtained.

  The adhesive composition for electronic devices of the present invention (hereinafter referred to as an adhesive composition) is a tape automated bonding used when mounting a semiconductor integrated circuit for a stiffener, a heat spreader, a semiconductor element or a wiring board (interposer). (TAB) pattern processing tapes, semiconductor connection substrates such as ball grid array (BGA) package interposers, flexible printed circuit boards (FPCs) and their reinforcing plates, coverlays, copper-clad laminates, and multilayer substrates Adhesives and adhesives between substrate parts, lead frame fixing tapes, LOC fixing tapes, semiconductor elements, and other electronic components and supporting members such as lead frames and insulating support substrates, that is, die bonding materials, shielding materials, etc. The shape and material of these adherends are particularly limited It is not.

  Hereinafter, the configuration of the present invention will be described in detail. The adhesive composition of the present invention contains a thermoplastic resin, an epoxy resin, an inorganic filler, and an imidazole compound represented by the general formula (I).

The adhesive composition of the present invention preferably has an adhesive strength after curing of 5 Ncm ⁻¹ or more, more preferably 10 Ncm ⁻¹ or more, since reflow resistance is improved.

  By including a thermoplastic resin, the adhesive composition of the present invention can impart toughness, and effects such as improved adhesion, improved flexibility, and reduced thermal stress can be obtained. Thermoplastic resins include acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene rubber-styrene resin (ABS), polybutadiene, styrene-butadiene-ethylene resin (SEBS), acrylic resin, polyvinyl butyral, polyamide, polyester, polyimide , Known examples such as polyamideimide and polyurethane. Further, these thermoplastic resins preferably have a functional group capable of reacting with an epoxy resin described later. Specific examples include amino groups, carboxyl groups, epoxy groups, hydroxyl groups, methylol groups, and isocyanate groups. These functional groups are preferable because the bond with the epoxy resin becomes strong and the heat resistance is improved.

  Among these, copolymers containing butadiene as a copolymer component such as acrylonitrile-butadiene copolymer (NBR), styrene-butadiene-ethylene resin (SEBS), and styrene-butadiene resin (SBS) are adhesive to metal. It is preferably used from the viewpoint of chemical resistance and the like. Furthermore, copolymers having butadiene as a copolymer component and having a carboxyl group are more preferably used. For example, carboxylated NBR (NBR-C), carboxylated SEBS (SEBS-C), and carboxylated SBS (SBS-C). ) And the like. Examples of NBR-C include those obtained by carboxylating terminal groups of a copolymer rubber obtained by copolymerizing acrylonitrile and butadiene at a molar ratio of about 10/90 to 50/50, or acrylonitrile, butadiene and acrylic acid, maleic acid, etc. And terpolymer rubbers of carboxyl group-containing polymerizable monomers. Specifically, PNR-1H (manufactured by JSR Corporation), “Nipol” 1072J, “Nipol” DN612, “Nipol” DN631 (manufactured by Nippon Zeon Co., Ltd.), “Hiker” CTBN (manufactured by BF Goodrich) ) Etc. Moreover, MX-073 (made by Asahi Kasei Co., Ltd.) can be illustrated as SEBS-C, and D1300X (made by Shell Japan Co., Ltd.) can be exemplified as SBS-C.

  As the acrylic resin, a copolymer having acrylic acid and / or methacrylic acid ester having a side chain having 1 to 8 carbon atoms as a copolymerization component can be preferably used. These copolymers may also have a functional group capable of reacting with an epoxy resin described later. Specific examples include an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a methylol group, an isocyanate group, a vinyl group, and a silanol group. In this case, it is more preferable to use a copolymer having a carboxyl group and / or a hydroxyl group as a functional group in combination with another copolymer having the above-described functional group. About other functional group content, 0.07-0.7 eq / kg is preferable, More preferably, it is 0.07-0.45 eq / kg, More preferably, it is 0.07-0.14 eq / kg.

  The polyamide is not particularly limited as long as it exhibits plasticity in a temperature range of 80 ° C. to 200 ° C., and known polyamides can be used. In particular, an adhesive layer having flexibility and containing a dicarboxylic acid having a low water absorption of 36 (so-called dimer acid) is preferable. Polyamide resin containing dimer acid can be obtained by polycondensation of dimer acid and bifunctional or higher amine by a conventional method. At this time, dicarboxylic acid other than dimer acid such as adipic acid, azelaic acid, and sebacic acid is copolymerized. It may be contained as a component. As the diamine, known ones such as ethylenediamine, hexamethylenediamine, piperazine, diethylenetriamine and the like can be used, and two or more kinds may be mixed from the viewpoint of hygroscopicity and solubility.

  As an example, it is effective to use at least one combination of a low-viscosity polyamide resin having a melt viscosity at 200 ° C. of 15 Pa · s or less and a high-viscosity polyamide resin having a viscosity of 50 Pa · s or more. By combining these, the fluidity of the adhesive can be changed in the step of bonding to the organic insulating film after forming the adhesive layer on the protective film layer, so the adhesive composition to the organic insulating film can be changed. The adhesive strength between the adhesive layer and the organic insulating film can be easily controlled using the embedding property.

  The blending ratio of the high-viscosity polyamide resin and the low-viscosity polyamide resin is such that the high-viscosity polyamide resin is preferably 20 to 80% by weight, and preferably 30 to 70% by weight, based on the total polyamide resin. Is more preferable. If the high-viscosity polyamide resin is 20% by weight or more, the fluidity of the adhesive can be reduced, so that the adhesive oozes out in the process of laminating the adhesive on the organic insulating film and is blocked during winding. Etc. can be suppressed. Moreover, if high viscosity polyamide resin is 80 weight% or less, the adhesive force of an organic insulating film and an adhesive bond layer will improve.

  By including an epoxy resin, the adhesive composition of the present invention can achieve a balance of physical properties such as heat resistance, insulation at high temperatures, chemical resistance, and strength when formed into an adhesive layer. The epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule. For example, cresol novolac type epoxy resin, phenol novolac type epoxy resin, the following formulas (II), (III), (IV) Examples thereof include an epoxy resin represented by (V), a linear aliphatic epoxy resin, an alicyclic epoxy resin, a heterocyclic epoxy resin, a spiro ring-containing epoxy resin, and a halogenated epoxy resin.

(However, R ^{7 to} R ¹⁴ may be the same or different and each represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogen atom.)

(However, two or more of R ^{15 to} R ²² are 2,3-epoxypropoxy groups, and the rest may be the same or different, and each represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogen atom. Show.)

(However, R ^{23 to} R ²⁶ may be the same or different and each represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogen atom.)

(However, R ^{27 to} R ³⁶ may be the same or different and each represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogen atom.)
Among these epoxy resins, those preferably used in the present invention are excellent in adhesion, chemical resistance and insulation, and are represented by the above formula (II), (III), (IV) or (V). It is an epoxy resin represented.

In the above formula (II), preferred specific examples of R ^{7 to} R ¹⁴ include a hydrogen atom, a methyl group, an ethyl group, a sec-butyl group, a t-butyl group, a chlorine atom, and a bromine atom. Preferable specific examples of the epoxy resin represented by the above formula (II) include 4,4′-bis (2,3-epoxypropoxy) biphenyl and 4,4′-bis (2,3-epoxypropoxy) -3. , 3 ′, 5,5′-tetramethylbiphenyl, 4,4-bis (2,3-epoxypropoxy) -3,3 ′, 5,5′-tetramethyl-2-chlorobiphenyl, 4,4′- Bis (2,3-epoxypropoxy) -3,3 ′, 5,5′-tetramethyl-2-bromobiphenyl, 4,4′-bis2,3-epoxypropoxy) -3,3 ′, 5,5 Examples include '-tetraethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetrabutylbiphenyl, and the like.

  Preferred specific examples of the epoxy resin represented by the above formula (III) include 1,5-bis (2,3-epoxypropoxy) naphthalene and 1,5-bis (2,3-epoxypropoxy) -7-methyl. Naphthalene, 1,6-bis (2,3-epoxypropoxy) naphthalene, 1,6-bis (2,3-epoxypropoxy) -2-methylnaphthalene, 1,6-bis (2,3-epoxypropoxy)- 8-methylnaphthalene, 1,6-bis (2,3-epoxypropoxy) -4,8-dimethylnaphthalene, 1,6-bis (2,3-epoxypropoxy) -2-bromonaphthalene, 1,6-bis (2,3-epoxypropoxy) -8-bromonaphthalene and the like.

  Preferable specific examples of the epoxy resin represented by the above formula (IV) include HP-7200 (manufactured by Dainippon Ink & Chemicals, Inc.).

In the above formula (V), preferred specific examples of R ^{27 to} R ³⁶ include a hydrogen atom, a methyl group, an ethyl group, a chlorine atom, and a bromine atom. Preferable specific examples of the epoxy resin represented by the formula (V) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, brominated bisphenol A type epoxy resin, brominated bisphenol F type epoxy resin and the like.

  As for the quantity of the epoxy resin contained in the adhesive composition of this invention, 5-400 weight part is preferable with respect to 100 weight part of thermoplastic resins, More preferably, it is 20-200 weight part. By setting the content of the epoxy resin to 5 parts by weight or more, the elastic modulus at high temperature can be improved, and by setting it to 400 parts by weight or less, the thermal expansion can be reduced by increasing the linear expansion coefficient. At the same time, it is possible to suppress the occurrence of cracks occurring at the adhesion interface with the adherend in the reflow process.

  In the adhesive composition of the present invention, by adding an inorganic filler, the adhesive film strength is increased and the stress dispersibility is improved, so that excellent reflow resistance is obtained. In addition, workability such as punchability, thermal conductivity, and flame retardancy can be further improved. The inorganic filler is not particularly limited as long as it does not impair the properties of the adhesive, and silica, aluminum oxide, aluminum hydroxide, silicon nitride, and silicon carbide may be used alone or in combination of two or more. Of these, silica is particularly preferable because it has a thermal decomposition temperature greatly exceeding 300 ° C., which is advantageous for the reflow resistance of the adhesive, the fluidity of the adhesive sheet can be easily adjusted, and the particle size stability. The particle shape and crystallinity are not particularly limited, and a crushing system, a spherical shape, a scale shape, and the like are used. From the viewpoint of dispersibility in the paint, a spherical shape is preferably used. Furthermore, the particle size of the inorganic filler is not particularly limited, but those having an average particle size of 3 μm or less and a maximum particle size of 10 μm or less are used in terms of reliability such as dispersibility and coating properties, reflow resistance, and heat cycle properties. Preferably, the average particle size is 1 μm or less, the maximum particle size is 6 μm or less, more preferably the average particle size is 0.7 μm or less, and the maximum particle size is 2 μm or less. The average particle size and the maximum particle size here are those measured with a Horiba LA500 laser diffraction particle size distribution meter. The purity of the particles is more than 99%, preferably more than 99.8%, more preferably more than 99.9%. In particular, it is preferable that Na ions of impurity ions are 0.1 ppm or less and Cl ions are 0.2 ppm or less. The addition amount of the inorganic filler is suitably 2 to 50% by weight in the adhesive composition. By making the addition amount of the inorganic filler 2% by weight or more, an effect of improving the reflow heat resistance is obtained, and by making it 50% by weight or less, the adhesive force can be improved.

The adhesive composition of this invention contains the imidazole compound represented with general formula (I) called imidazole silane. In imidazole silane, the imidazole group has a curing accelerating action on the epoxy resin, and also has a high adsorption ability by forming a complex with copper and a copper alloy. Further, since the alkoxysilyl group strongly adsorbs to a substrate made of a metal or an inorganic material, the adhesion with the substrate is improved. Furthermore, since R ⁶ is a functional group that reacts with an epoxy group, the crosslink density is further increased, and the adhesive strength and reflow heat resistance are improved. Examples of the functional group that reacts with the epoxy group include an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a methylol group, an isocyanate group, a vinyl group, and a silanol group. Further, imidazole silane tends to lower the elastic modulus of the cured adhesive due to the length of the alkoxysilyl group, and the imidazole compound used in the present invention is R ^{3 to} R ⁶ in the general formula (1). Is in the range of 1 to 10 carbon atoms.

  The content of the imidazole compound represented by the general formula (I) is suitably 0.1 to 2.0 mol% with respect to the epoxy group contained in the adhesive composition. Here, the epoxy group contained in the adhesive composition refers to the total amount of epoxy groups contained in the thermoplastic resin and the epoxy resin when the thermoplastic resin contains an epoxy group. By setting it to 0.1 mol% or more, a curing accelerating action is obtained and the adhesive force is improved. On the other hand, by setting it as 2.0 mol% or less, the elasticity modulus can be kept high and the strength and heat resistance of the adhesive film can be improved.

  Moreover, a well-known imidazole compound can be contained for adjustment of a cure rate etc. with imidazole silane. Examples include imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole. The content of these known imidazole compounds is suitably 20 to 100 parts by weight with respect to 100 parts by weight of the imidazole compound represented by the general formula (I).

However, in the above formula, a saturated hydrocarbon group for R ¹ is hydrogen or a carbon number 1 to 20, R ² is hydrogen, a vinyl group or a carbon number represents 1 to 5 alkyl groups. R ³ , R ⁴ , R ⁵ and R ⁶ may be the same or different and each represents an alkyl group having 1 to 10 carbon atoms. X ¹ and X ² may be the same or different and each represents hydrogen, an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a methylol group, an isocyanate group, a vinyl group, a silanol group, or an alkyl group having 1 to 3 carbon atoms. . More preferably, they are hydrogen, a carboxyl group, a hydroxyl group, and a methylol group. p and q are integers of 1 to 10, l is an integer of 1 to 3, and r is an integer of 1 to 5.

  It does not restrict | limit at all to contain a hardening | curing agent in the adhesive composition of this invention. For example, 3,3 ′, 5,5′-tetramethyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5,5′-tetraethyl-4,4′-diaminodiphenylmethane, 3,3′-dimethyl- 5,5′-diethyl-4,4′-diaminodiphenylmethane, 3,3′-dichloro-4,4′-diaminodiphenylmethane, 2,2 ′, 3,3′-tetrachloro-4,4′-diaminodiphenylmethane 4,4'-diaminodiphenylsulfide, 3,3'-diaminobenzophenone, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone, 4,4'- Aromatic polyamines such as diaminobenzophenone, 3,4,4'-triaminodiphenylsulfone, boron trifluoride triethylamine Amine complexes of boron trifluoride complexes such as, dicyandiamide, phenolic resins, and the like. You may use these individually or in mixture of 2 or more types. The content is preferably 0.1 to 60% by weight in the adhesive composition.

  It is also effective to contain a thermosetting resin other than an epoxy resin in the adhesive composition of the present invention. Specific examples thereof include phenol resins, melamine resins, xylene resins, furan resins, cyanate ester resins, and the like. Phenol resins are particularly preferred because of their good reactivity with epoxy resins and excellent insulation.

  As the phenol resin, any known phenol resin such as novolac type phenol resin and resol type phenol resin can be used. For example, alkyl-substituted phenols such as phenol, cresol, pt-butylphenol, nonylphenol, p-phenylphenol, cyclic alkyl-modified phenols such as terpene and dicyclopentadiene, hetero groups such as nitro groups, halogen groups, cyano groups, and amino groups Examples thereof include those having functional groups containing atoms, those having a skeleton such as naphthalene and anthracene, and resins composed of polyfunctional phenols such as bisphenol F, bisphenol A, bisphenol S, resorcinol, and pyrogallol. Although content of a phenol resin is not specifically limited, Preferably it is 10 to 80 weight% in an adhesive composition, More preferably, it is the range of 20 to 60 weight%. By making content of a phenol resin into this range, adhesive force and heat resistance can be made compatible. In particular, the adhesive preferably contains a resol type phenol resin in the range of 20 to 60% by weight.

  The adhesive sheet for electronic equipment of the present invention (hereinafter referred to as an adhesive sheet) is a composition having an adhesive layer made of the adhesive composition of the present invention and one or more peelable protective film layers. Say. For example, a two-layer configuration of protective film layer / adhesive layer or a three-layer configuration of protective film layer 11 / adhesive layer 12 / protective film layer 11 shown in FIG. The adhesive layer includes a composite structure in which an insulating film such as polyimide is laminated in addition to a single film of the adhesive composition. Also, one or both sides of the adhesive layer may be roughened in order to reduce the adhesiveness of the adhesive itself and to prevent the entrapment of bubbles when adhering to an adherend such as a copper foil or a reinforcing plate. . Even if the adhesive layer itself has high adhesiveness, the adhesiveness is reduced by dispersing the contacts to the object to be bonded by roughening the surface. Although it does not specifically limit as a method of roughening an adhesive agent, The following example is given. The coating solution obtained by dissolving the adhesive composition in a solvent is applied onto a film having irregularities on the surface by embossing or sand matting, etc., and dried to produce a semi-cured adhesive sheet. Is transferred to the surface of the adhesive sheet. Moreover, if it laminates using a film with an unevenness | corrugation as a protective film of an adhesive sheet, an unevenness | corrugation will be similarly transferred to the adhesive sheet surface. However, since the adhesive is embedded in the unevenness of the film surface, it may be difficult to peel off the film during actual use. Therefore, what is particularly preferably used in the present invention as a film to be used is excellent in controlling releasability. , A film which has been subjected to mold release treatment of silicone or a fluorine-containing compound. In addition, the surface of the adhesive sheet can be roughened with an uneven rubber roll or the like. Moreover, it is also possible to obtain a lower adhesive sheet by combining a method of reducing the adhesiveness by thinly laminating a low adhesive layer on a normal adhesive layer and surface roughening. Specific examples of the low-adhesive adhesive layer include an adhesive having a composition in which the amount of inorganic particles is increased, or an adhesive whose thickness is controlled by heat aging a thin adhesive sheet.

  Although the thickness of an adhesive bond layer can be suitably selected by the relationship with an elasticity modulus and a linear expansion coefficient, 2-500 micrometers is preferable, More preferably, it is 20-200 micrometers.

  The protective film layer as used herein refers to an adhesive before bonding an adhesive layer to a wiring board layer (TAB tape or the like) composed of an insulator layer and a conductor pattern or a layer (stiffener or the like) where no conductor pattern is formed. If it can peel without impairing the form and function of a layer, it will not specifically limit. For example, plastic films such as polyester, polyolefin, polyphenylene sulfide, polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, polyvinyl butyral, polyvinyl acetate, polyvinyl alcohol, polycarbonate, polyamide, polyimide, polymethyl methacrylate, etc. Examples thereof include films coated with a release agent such as silicone or fluorine compound, paper laminated with these films, and paper impregnated or coated with a releasable resin. The protective film layer may be colored with a pigment so as to have good visibility during processing. Thereby, since the protective film of the side which peels previously can be recognized easily, misuse can be avoided.

When the protective film layers are provided on both surfaces of the adhesive layer, when the peeling force of each protective film layer to the adhesive layer is F ₁ and F ₂ (F ₁ > F ₂ ), F ₁ -F ₂ is preferably It is 5 Nm ⁻¹ or more, more preferably 15 Nm ⁻¹ or more. By setting F ₁ -F ₂ to 5 Nm ⁻¹ or more, the target protective film layer can be stably peeled off, so that workability is good. Further, the peeling forces F ₁ and F ₂ are preferably ¹ to 200 Nm ⁻¹ , more preferably 3 to 100 Nm ⁻¹ . If it is this range, troubles, such as omission of a protective film layer and damage to an adhesive bond layer, can be prevented.

  Next, the example of the manufacturing method of the adhesive sheet using the adhesive composition of this invention is demonstrated.

  (A) A paint obtained by dissolving the adhesive composition of the present invention in a solvent is applied on a polyester film having releasability and dried. It is preferable to apply so that the thickness of the adhesive layer is 10 to 100 μm. The drying conditions are preferably 100 to 200 ° C. and 1 to 5 minutes. Solvents are not particularly limited, but aromatic solvents such as toluene, xylene and chlorobenzene, ketones such as methyl ethyl ketone and methyl isobutyl ketone, aprotic polar solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone, or a mixture thereof. Is preferred.

  (B) The film of (a) is laminated with a polyester or polyolefin-based protective film layer having a releasability with a lower peel strength than the above to obtain the adhesive sheet for a semiconductor device of the present invention. When the adhesive thickness is further increased, the adhesive layer may be laminated a plurality of times. After lamination, for example, the degree of curing may be adjusted by heat treatment at 40 to 70 ° C. for about 20 to 200 hours.

  The electronic component in the present invention refers to an electronic component manufactured using the adhesive sheet of the present invention, and examples thereof include a semiconductor integrated circuit connection substrate.

  The substrate for connecting a semiconductor integrated circuit is for connecting an isolated semiconductor integrated circuit (bare chip) after an element is formed on a semiconductor substrate such as silicon. (A) A wiring composed of an insulator layer and a conductor pattern The shape, material, and manufacturing method are not particularly limited as long as each of the substrate layer, (B) the layer on which the conductor pattern is not formed, and (C) one or more adhesive layers. Therefore, the most basic one is an A / C / B configuration, but a multilayer structure such as A / C / B / C / B is also included.

  (A) A wiring board layer composed of an insulator layer and a conductor pattern is a layer having a conductor pattern for connecting an electrode pad of a semiconductor element and the outside of a package (printed board, etc.), and one or both sides of the insulator layer A conductor pattern is formed on the substrate.

  The insulator layer here is made of a composite material such as polyimide, polyester, polyphenylene sulfide, polyethersulfone, polyetheretherketone, aramid, polycarbonate, polyarylate, or a plastic or epoxy resin-impregnated glass cloth. A ceramic substrate such as an insulating film having a flexibility of 125 μm, alumina, zirconia, soda glass, and quartz glass is suitable, and a plurality of layers selected from these may be laminated and used. If necessary, the insulator layer can be subjected to surface treatment such as hydrolysis, corona discharge, low temperature plasma, physical roughening, and easy adhesion coating treatment.

  The formation of the conductor pattern is generally performed by either the subtractive method or the additive method, but any of them may be used in the present invention.

  In the subtractive method, a metal plate such as copper foil is bonded to the insulator layer with an insulating adhesive, or a precursor of the insulator layer is laminated on the metal plate, and the insulator layer is formed by heat treatment or the like. A pattern is formed by etching the material produced in (1) by chemical treatment. Specific examples of the material include a rigid or a copper paste material for a flexible printed board, a TAB tape, and the like. Among them, a copper paste material for a flexible printed circuit board or a TAB tape, in which at least one polyimide film is an insulator layer and a copper foil is a conductor pattern, is preferably used.

  In the additive method, a conductor pattern is directly formed on the insulator layer by electroless plating, electrolytic plating, sputtering, or the like. In either case, the formed conductor may be plated with a metal having high corrosion resistance to prevent corrosion. Further, via holes may be formed in the wiring board layer as necessary, and conductor patterns formed on both surfaces may be connected by plating.

  (B) The layer in which the conductor pattern is not formed is a uniform layer substantially independent of (A) the wiring substrate layer or (C) the adhesive layer composed of the insulator layer and the conductor pattern, and is connected to the semiconductor integrated circuit. Substrate reinforcement and dimensional stabilization (referred to as a reinforcing plate or stiffener), external and IC electromagnetic shielding, IC heat dissipation (referred to as a heat spreader, heat sink), difficulty in connecting a semiconductor integrated circuit connection substrate It carries functions such as imparting flammability and imparting distinctiveness according to the shape of the substrate for connecting a semiconductor integrated circuit. Therefore, the shape is not limited to the layer shape, and may have a fin structure for heat dissipation, for example. Any material may be used as long as it has the above functions, and the material is not particularly limited. Metals include copper, iron, aluminum, gold, silver, nickel, titanium, and stainless steel, inorganic materials include alumina, zirconia, soda glass, quartz glass, and carbon, and organic materials include polyimide, polyamide, and polyester , Vinyl-based, phenol-based, and epoxy-based polymer materials. Moreover, the composite material by these combination can also be used. Examples thereof include a thin metal plated shape on a polyimide film, a polymer kneaded with carbon to give conductivity, and a metal plate coated with an organic insulating polymer. In addition, various surface treatments are not limited as in the case of the insulator layer included in the (A) wiring board layer.

  Generally, it is further protected with a coverlay film from above a metal plate such as a patterned copper foil. The adhesive composition of the present invention can also be used for this coverlay film. Furthermore, the adhesive composition of the present invention can also be used as an adhesive layer when a reinforcing plate such as a metal plate or an organic insulating film is attached to the flexible wiring board.

  As a main structure of the coverlay film of the present invention, an organic insulating film (12.5 to 125 μm) such as a polyimide film or an aramid film / adhesive layer (5 to 50 μm) / peelable protective film (12.5) ˜125 μm) and the like.

  As a main structure of the copper-clad polyimide film in which the organic insulating film and the copper foil are bonded through the adhesive layer of the present invention, for example, single-sided product: copper foil (9 to 35 μm) / adhesive layer (5 to 20 μm) ) / Polyimide film (12.5 to 125 μm), double-sided product: copper foil (9 to 35 μm) / adhesive layer (5 to 20 μm) / polyimide film (12.5 to 125 μm) / adhesive layer (5 to 20 μm) / Copper foil (9-35 μm) and the like. In general, rolled copper foil, electrolytic copper foil, and the like can be used as the copper foil, but rolled copper foil is suitable for further stabilizing the bending characteristics of the copper-clad polyimide film, flexible printed wiring board, and FPC. It is.

  Moreover, as a tape with an adhesive for tape automated bonding (TAB), a peelable polyester protective film (12.5 to 150 μm) / an adhesive layer (5 to 200 μm) / a peelable polyester protective film (12.5) ~ 150 μm) or the like, slit an adhesive sheet to a predetermined standard width (29.7 to 60.6 mm) at a central part of an insulating film having a standard width of 35 to 70 mm at 100 to 160 ° C., 10 N / cm, Examples thereof include those prepared by hot roll lamination under conditions of 5 m / min.

  The semiconductor integrated circuit connecting substrate and IC can be connected by any of TAB gang bonding and single point bonding, wire bonding used for lead frames, resin sealing in flip chip mounting, anisotropic conductive film connection, etc. Good. A package called CSP is also included in the electronic component of the present invention.

  EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. First, an evaluation method performed in each example will be described.

  (1) Reaction rate: determined by DSC (Differential Scanning Calorimetry). The reaction rate was obtained by multiplying the value obtained by dividing the heat of reaction after curing by the heat of reaction before curing of the adhesive with 100. The curing conditions of the adhesive are 180 ° C. and 1 minute under 0.5 MPa pressure. Moreover, the apparatus used DSC6200 by Seiko Instruments Inc., and measured it with the temperature increase rate of 10 degree-C / min.

  (2) Adhesive strength: An adhesive sheet having a film thickness of 50 μm was laminated on SUS304 having a thickness of 0.35 mm under conditions of 130 ° C. and 1 MPa. Thereafter, a polyimide film (75 μm: “UPILEX 75S” manufactured by Ube Industries, Ltd.) was further laminated on the other surface of the adhesive sheet laminated on the previous SUS under the conditions of 130 ° C. and 1 MPa, and then added with 0.5 MPa. Under pressure, heat treatment was performed at 180 ° C. for 1 minute to prepare a sample for evaluation. After slitting the polyimide film to a width of 5 mm, the polyimide film having a width of 5 mm was peeled at a rate of 50 mm / min in the 90 ° direction, and the adhesive force at that time was measured. Here, the adhesive force is preferably 5 N / cm or more from the viewpoint of processability, handling properties, and reliability of the semiconductor device.

  (3) Reflow resistance: One protective film of a 50 μm-thick adhesive sheet punched into 30 mm squares is peeled off and placed on a 30 mm square 0.25 mm thick SUS304. If the sheets are attached to each other, remove the part that is attached by hand. After roll laminating under conditions of 60 ° C., 1 MPa, 1 m / min, a 30 mm square semiconductor connection substrate in which a simulated pattern with a conductor width of 100 μm and a distance between conductors of 100 μm is formed on an adhesive sheet is 150 ° C., 5 MPa, Roll lamination was performed under conditions of 1 m / min. Then, it hardened | cured on the conditions of 180 degreeC and 1 minute under 0.5 Mpa pressurization, and produced the sample for reflow-proof evaluation. An ultrasonic flaw detector was used to determine whether or not swell occurred after 20 samples of 30 mm square were absorbed by moisture for 168 hours under conditions of 30 ° C / 70% RH and then immediately passed through an infrared reflow oven whose temperature was set. Observed. The maximum temperature of the infrared reflow furnace is 245 ° C. and 260 ° C., and the holding time is 10 seconds each. The number of samples in which swelling occurred in 20 evaluation samples was counted.

  (4) PCT (Pressure Cooker Test) after reflow: The sample for evaluation produced by the evaluation of adhesive strength was subjected to the conditions of the reflow resistance test and then left in a 0.2 MPa, 121 ° C., 100% RH atmosphere. It was taken out every fixed period (10 hours elapsed), the adhesive strength was evaluated, and the time when it became 5 N / cm or less was terminated.

  Next, a method for producing an adhesive composition and an adhesive sheet will be described. The following thermoplastic resins, epoxy resins, inorganic fillers, imidazole compounds, and other additives are blended so as to have the composition ratios shown in Tables 1 to 3, respectively, and DMF / monochlorobenzene / The mixture was stirred and dissolved in MIBK mixed solvent at 40 ° C. to prepare an adhesive solution. This adhesive solution was applied with a bar coater to a 38 μm thick polyethylene terephthalate film with a silicone release agent (“Film Vina” GT manufactured by Fujimori Kogyo Co., Ltd.) to a dry thickness of about 50 μm, and at 120 ° C. It dried for 5 minutes and bonded the protective film, and produced the adhesive sheet of this invention. The raw materials used in the examples are as follows.

Thermoplastic resin A: NBR-C (PNR-1H, manufactured by JSR Corporation)
B: SEBS-C (MX-073, manufactured by Asahi Kasei Corporation)
C: Acrylic resin (SG-280DR, Teikoku Chemical Industry Co., Ltd .: carboxyl group-containing acrylic rubber mainly composed of butyl acrylate)
D: Acrylic resin (SGP-3, manufactured by Teikoku Chemical Industry Co., Ltd .: epoxy group-containing acrylic rubber mainly composed of butyl acrylate)
E: Acrylic resin (XF-1834, manufactured by Toupe Corporation: hydroxyl group-containing acrylic rubber mainly composed of ethyl acrylate)
F: Polyamide resin synthesized by the following method Dimer acid PRIPOL 1009 (manufactured by Unikema) and adipic acid as acid, hexamethylenediamine as diamine, acid / amine reactant, antifoaming agent and phosphoric acid catalyst of 1% or less In addition, a reactant was prepared. The reactant was stirred and heated at 140 ° C. for 1 hour, and then heated to 205 ° C. and stirred. The temperature was lowered under a vacuum of about 2 kPa for 0.5 hours. Finally, an antioxidant was added, and a polyamide resin F having a melt viscosity of 80 Pa · s and an acid value of 0.2 at 200 ° C. was taken out.
G: Polyamide resin synthesized by the following method.

  A dimer acid PRIPOL 1009 (manufactured by Unikema) and adipic acid were used as the acid, hexamethylenediamine was used as the diamine, an acid / amine reactant, an antifoaming agent, and 1% or less phosphoric acid catalyst were added to prepare a reactant. The reactant was stirred and heated at 140 ° C. for 1 hour, and then heated to 205 ° C. and stirred. The temperature was lowered under a vacuum of about 2 kPa for 0.5 hours. Finally, an antioxidant was added, and a polyamide resin G having a melt viscosity of 10 Pa · s and an acid value of 20 at 200 ° C. was taken out.

Epoxy resin A: bisphenol A type (“Epicoat” 828, epoxy equivalent: 186, manufactured by Japan Epoxy Resins Co., Ltd.)
B: Biphenyl type (YX4000, epoxy equivalent: 185, manufactured by Japan Epoxy Resins Co., Ltd.)
C: Phenol novolac type (“Epicoat” 152, epoxy equivalent: 175, manufactured by Japan Epoxy Resins Co., Ltd.)
D: Orthocresol novolak type ("Epicoat" 180S65, epoxy equivalent: 210, manufactured by Japan Epoxy Resins Co., Ltd.)
E: Dicyclopentadiene type (HP-7200, epoxy equivalent: 260, manufactured by Dainippon Ink & Chemicals, Inc.)
F: Trishydroxyphenylmethane type (“Epicoat” 1032, epoxy equivalent: 169, manufactured by Japan Epoxy Resins Co., Ltd.)
G: Naphthalene skeleton epoxy (HP4032H, epoxy equivalent 250, manufactured by Dainippon Ink & Chemicals, Inc.)
Inorganic filler A: spherical silica (SO-E1, average particle size 2 μm, manufactured by Admatechs Co., Ltd.)
B: Spherical silica (“Excelica”, average particle size 2 μm, manufactured by Tokuyama Corporation)
C: Aluminum hydroxide (“H-42”, manufactured by Showa Denko KK)
Imidazole Compound A: Imidazolesilane (IS-1000, manufactured by Nikko Materials Co., Ltd.)
B: 2-ethyl-4-methylimidazole Curing agent A: 4,4′-diaminodiphenyl sulfone (“SUMICURE S”, manufactured by Sumitomo Chemical Co., Ltd.)
Phenol resin A: Phenol resole resin (PL2312, manufactured by Gunei Chemical Industry Co., Ltd.).

Example 1
The thermoplastic resin A is 30.0% by weight, the epoxy resin A is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 0.2% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 8% by weight. The characteristic values are shown in Table 1.

Example 2
The thermoplastic resin A is 30.0% by weight, the epoxy resin B is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 0.2% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 8% by weight. The characteristic values are shown in Table 1.

Example 3
The thermoplastic resin A is 30.0% by weight, the epoxy resin B is 40.0% by weight, the inorganic filler B is 25.0% by weight, the imidazole compound A is 0.2% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 8% by weight. The characteristic values are shown in Table 1.

Example 4
The thermoplastic resin A is 30.0% by weight, the epoxy resin B is 40.0% by weight, the inorganic filler C is 25.0% by weight, the imidazole compound A is 0.2% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 8% by weight. The characteristic values are shown in Table 1.

Example 5
The thermoplastic resin A is 30.0% by weight, the epoxy resin C is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 0.2% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 8% by weight. The characteristic values are shown in Table 1.

Example 6
The thermoplastic resin A is 30.0% by weight, the epoxy resin D is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 0.2% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 8% by weight. The characteristic values are shown in Table 1.

Example 7
The thermoplastic resin A is 30.0% by weight, the epoxy resin D is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 0.2% by weight, and the imidazole compound B is 0.2% by weight. An adhesive sheet was prepared using 1% by weight and 4.7% by weight of curing agent A. The characteristic values are shown in Table 1.

Example 8
The thermoplastic resin A is 30.0% by weight, the epoxy resin F is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 0.1% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 9% by weight. The characteristic values are shown in Table 1.

Example 9
The thermoplastic resin B is 30.0% by weight, the epoxy resin A is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 1.0% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 0% by weight. The characteristic values are shown in Table 2.

Example 10
The thermoplastic resin C is 46.0% by weight, the epoxy resin A is 15.0% by weight, the epoxy resin E is 15.0% by weight, the inorganic filler A is 20.0% by weight, and the imidazole compound A is 0.2% by weight. An adhesive sheet was prepared using 2% by weight and 3.8% by weight of curing agent A. The characteristic values are shown in Table 2.

Example 11
The thermoplastic resin D is 46.0% by weight, the epoxy resin A is 15.0% by weight, the epoxy resin E is 15.0% by weight, the inorganic filler A is 20.0% by weight, and the imidazole compound A is 0.2% by weight. An adhesive sheet was prepared using 2% by weight and 3.8% by weight of curing agent A. The characteristic values are shown in Table 2.

Example 12
The thermoplastic resin E is 46.0% by weight, the epoxy resin A is 15.0% by weight, the epoxy resin E is 15.0% by weight, the inorganic filler A is 20.0% by weight, and the imidazole compound A is 0.2% by weight. An adhesive sheet was prepared using 2% by weight and 3.8% by weight of curing agent A. The characteristic values are shown in Table 2.

Example 13
20.0 wt% of the thermoplastic resin F, 20.0 wt% of the thermoplastic resin G, 5.0 wt% of the epoxy resin A, 15.0 wt% of the epoxy resin G, 19 of the inorganic filler A An adhesive sheet was prepared using 0.8 wt%, imidazole compound A 0.2 wt%, and phenol resin A 20.0 wt%. The characteristic values are shown in Table 2.

Example 14
The thermoplastic resin A is 47.0% by weight, the epoxy resin A is 12.0% by weight, the inorganic filler A is 37.0% by weight, the imidazole compound A is 0.1% by weight, and the curing agent A is 3. An adhesive sheet was prepared using 9% by weight. The characteristic values are shown in Table 2.

Example 15
The thermoplastic resin A is 15.0% by weight, the epoxy resin A is 47.0% by weight, the inorganic filler A is 33.0% by weight, the imidazole compound A is 0.3% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 7% by weight. The characteristic values are shown in Table 2.

Example 16
The thermoplastic resin A is 30.0% by weight, the epoxy resin A is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound A is 0.03% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 97% by weight. The characteristic values are shown in Table 2.

Example 17
The thermoplastic resin A is 30.0% by weight, the epoxy resin A is 40.0% by weight, the inorganic filler A is 23.0% by weight, the imidazole compound A is 2.0% by weight, and the curing agent A is 5. An adhesive sheet was prepared using 0% by weight. The characteristic values are shown in Table 2.

Comparative Example 1
Using the above thermoplastic resin A 30.0% by weight, epoxy resin A 40.0% by weight, inorganic filler A 25.0% by weight, and curing agent A 5.0% by weight Produced. The characteristic values are shown in Table 3.

Comparative Example 2
The thermoplastic resin A is 30.0% by weight, the epoxy resin A is 40.0% by weight, the inorganic filler A is 25.0% by weight, the imidazole compound B is 0.2% by weight, and the curing agent A is 4. An adhesive sheet was prepared using 8% by weight. The characteristic values are shown in Table 3.

Comparative Example 3
An adhesive sheet is prepared using 40.0% by weight of the above thermoplastic resin A, 53.0% by weight of epoxy resin A, 0.3% by weight of imidazole compound A, and 6.7% by weight of curing agent A. did. The characteristic values are shown in Table 3.

Comparative Example 4
28.0 wt% of the epoxy resin A, 28.0 wt% of the epoxy resin E, 36.0 wt% of the inorganic filler A, 0.4 wt% of the imidazole compound A, and 7.6 of the curing agent A An adhesive sheet was prepared using% by weight. The characteristic values are shown in Table 3.

  As is apparent from Tables 1 to 3, the adhesive sheet obtained according to the present invention was excellent in adhesive strength, reflow heat resistance, and adhesive strength after PCT. On the other hand, in Comparative Examples 1 to 4, swelling occurred during reflow, and in Comparative Examples 1 and 4, the adhesive strength was less than 5 N / cm.

A sectional view of one mode of a BGA type semiconductor device (BOC). Sectional drawing of the one aspect | mode of the adhesive agent sheet for electronic devices of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor integrated circuit 2 Gold bump 3 Insulator layer which has flexibility 4 Adhesive layer which comprises wiring board layer 5 Conductor pattern for semiconductor integrated circuit connection 6 Adhesive layer 7 Layer in which conductor pattern is not formed 8 Solder Resist 9 Solder ball 10 Sealing resin 11 Protective film layer 12 Adhesive layer

Claims (5)

An adhesive composition for electronic equipment, comprising a thermoplastic resin, an epoxy resin, an inorganic filler, and an imidazole compound represented by formula (I).

(However, R ¹ represents hydrogen or a saturated hydrocarbon group having 1 to 20 carbon atoms, R ² represents hydrogen, a vinyl group, or an alkyl group having 1 to 5 carbon atoms. R ³ , R ⁴ , R ⁵ and R ⁶ may be the same or different and each represents an alkyl group having 1 to 10 carbon atoms, and X ¹ and X ² may be the same or different from each other, and are hydrogen, amino group, carboxyl group, epoxy group, hydroxyl group, methylol. A group, an isocyanate group, a vinyl group, a silanol group or an alkyl group having 1 to 3 carbon atoms, p and q are integers of 1 to 10, l is an integer of 1 to 3, and r is an integer of 1 to 5. .) 2. The electron according to claim 1, wherein the content of the imidazole compound represented by the general formula (I) is 0.1 to 2.0 mol% with respect to the epoxy group contained in the adhesive composition. Equipment adhesive composition. The adhesive sheet for electronic devices which has the adhesive bond layer which consists of an adhesive composition for electronic devices of Claim 1 or 2, and one or more peelable protective film layers. The electronic component using the adhesive sheet for electronic devices of Claim 3. The electronic device using the adhesive agent sheet for electronic devices of Claim 3.

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