JP2005333037A - Package for electronic parts, and piezo-electric oscillating device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for electronic parts and a piezo-electric oscillating device which can improve manufacture yield in hermetic seal and reliability after sealing simultaneously. <P>SOLUTION: A surface mounted crystal resonator is constituted by a ceramic package 1 having a recess in which upper section opens, a tuning fork crystal vibration plate 2 of a piezo-electric vibration plate housed in the package, and a lid 3 joined to an opening of the package. In the ceramic package, a portion 1a is formed in which a first metal film layer 11a is not formed, and the lid 3 is mounted on the first metal film layer, then the hermetic seal is performed by an electronic beam. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a package for an electronic component used in an electronic device or the like, and more particularly to a package configuration with improved hermetic sealing performance and a piezoelectric vibration device using the package.

  Examples of electronic components that require hermetic sealing include piezoelectric vibration devices such as crystal resonators, crystal filters, and crystal oscillators. Each of these products is hermetically sealed in order to form a metal thin film electrode on the surface of the crystal diaphragm and protect the metal thin film electrode from the outside air.

  Due to the demand for surface mounting of components, these piezoelectric vibration devices are increasingly being stored in a ceramic package in an airtight manner. When such a ceramic package is used, the bonding between the package body and the lid is diverse. Joining methods are being studied. Japanese Patent Application Laid-Open No. 2004-104766 has an electronic element housing portion surrounded by a bank portion, uses a rectangular package in plan view, and uses a lid (lid) to airtightly bond a metal brazing or glass material as a bonding material Is disclosed. A metal film layer (metallized layer) is provided on the top of the bank portion of the package, and concave castellations are formed at four corners in plan view.

The castellation is necessary for internal and external wiring in the package, or is necessary when the package is separated from the wafer in terms of manufacturing. That is, in the manufacture of a ceramic package, generally, it is integrally fired and formed on a wafer in which a large number of packages are formed in a matrix. After that, the necessary plating process or the like is performed and separated into individual packages, but the castellation facilitates this separation work.

By the way, the separation from the wafer into each package is subdivided along a break groove formed in advance, and a deformed portion that rises microscopically may be formed in this break groove forming portion. Or when cutting off by dicing, the cut portion may be microscopically deformed due to stress during dicing. FIG. 10 is a schematic cross-sectional view showing a cut state of the package 9, but a deformed portion may occur in the metal film layer 91 or the ceramic layer 90 in the cut portion C between the packages 9 and 9. This occurs when a paste of a metal film layer (metallized layer) is pattern printed on a green sheet of ceramic layer, and then the break grooves are formed in a matrix shape. A deformable portion that rises visually may be formed. By firing in this state, the deformed portion remains as it is. Further, even when the ceramic package is cut from the wafer by dicing or the like, the metal film layer may be plastically deformed by the stress generated during cutting to form a deformed portion. This may have an adverse effect upon subsequent hermetic sealing with the lid.

In particular, when electronic components are extremely small as in recent years, a highly accurate flatness is required for the bonding surface used for hermetic sealing. If the flatness is not sufficient, the lid partly floats under the influence of the deforming portion 91a, so that the close contact between the lid and the package is reduced microscopically. For example, bonding using an electron beam is performed. At the time of carrying out, sufficient bondability could not be obtained, resulting in poor airtightness. In such a case, in the piezoelectric vibration device, characteristics such as frequency change, and reliability as an electronic component may be lowered.
JP 2004-104766 A

  The present invention has been made in view of such a point, and an object of the present invention is to improve the manufacturing yield in hermetic sealing, and to improve the reliability after sealing, and an electronic component package that can improve reliability after sealing An object of the present invention is to provide a piezoelectric vibration device.

  In order to achieve the above object, the present invention aims at a package configuration that can eliminate the adverse effects caused by the deformation that occurs during the manufacture of a ceramic package, and can be realized by the following configuration.

  That is, as shown in claim 1, a package having a bank portion around the electronic component element housing portion and having a first metal film layer on the bank portion is joined to the first metal film layer. A package for an electronic component having a second metal film layer and a lid for hermetically sealing the package, wherein the first metal film layer formed on the bank is It is characterized by being formed inside the outer peripheral end.

  As described above, the ceramic package is generally manufactured by batch processing using a wafer, and the wafer is cut into individual packages at the final stage. In the cut portion of the metal film layer, there may be a deformed portion in which the outer peripheral end portion of the metal film layer is deformed upward, but in the present invention, without forming the metal film layer up to the end portion of the bank, It has a pull-down portion that is closer to the predetermined dimension from the end portion. In the lowering portion, the ceramic base material of the package is exposed without forming the metal film material.

  With such a configuration, a deformation portion is not created when a break groove is formed, and unnecessary stress is not directly applied to the metal film layer when separating into individual packages. A metal film layer (first metal film layer) excellent in flatness can be obtained at the upper part of the bank. Even if a lid is mounted on the entire upper surface of the ceramic package including the first metal film layer and the pull-down portion, the first metal film layer of the ceramic package can be provided by the first metal film layer that is flat and has no deformed portion. And the second metal film layer of the lid can be brought into close contact with each other, and the manufacturing yield at the time of bonding can be improved.

  By the way, the configuration in which the first metal film layer is formed inside the outer peripheral end of the bank portion, that is, the configuration having the pull-down portion is preferably provided on the entire circumference of the bank portion, but the seal path width, that is, the package and the lid In order to secure a region that contributes to the bonding, a portion may be provided. For example, a pull-down portion may be provided in the castellation forming portion and the long side portion, or in the castellation forming portion and the short side portion. In addition, pull-down portions may be provided at the corner portions of the four outer circumferences of the rectangular package, and when castellations are provided at the corner portions, pull-down portions may be provided at the castellation forming portions. Further, the castellation may be provided on the side portion of the package. In such a case, a pull-down portion may be provided in the castellation forming portion.

  The electronic component package according to claim 1, wherein the package has a rectangular shape in a plan view and has concave portions at corners and / or sides of the outer periphery. A castellation having a shape is formed, and the first metal film layer is formed on the inner side of the outer peripheral end portion of the bank portion in the bank portion where the castellation is formed. The present invention can be applied to either the case where the castellations are formed only at the corners, the case where the castellations are formed only at the sides, or the case where they are formed at both sides.

  When forming break grooves or cutting from wafer to individual package, it is verified that deformed parts are likely to occur in castellation forming parts and corners having a complicated shape in a relatively narrow area. It has become clear. This is considered to be due to stress concentration during processing such as cutting, but as shown in claim 2, the structure in which the metal film layer is formed inside the outer peripheral end of the bank portion in the castellation forming portion, That is, by adopting a structure having a pull-down portion, the flatness can be ensured without causing a deformed portion in the metal film layer. Even if a lid is mounted on the entire upper surface of the ceramic package including the first metal film layer and the pull-down portion, the first metal film layer of the ceramic package can be provided by the first metal film layer that is flat and has no deformed portion. And the second metal film layer of the lid can be brought into close contact with each other, and the manufacturing yield at the time of bonding can be improved.

  Further, the third aspect of the present invention has a configuration in which the adverse effects of the deformation of the package are eliminated by the device of the lid. That is, a package having a rectangular shape in the plan view having a bank portion around the electronic component element housing section and having a first metal film layer on the bank portion, and a second bonded to the first metal film layer. And a lid for a rectangular shape in plan view that hermetically joins the package, wherein a corner portion of the lid has a chamfered portion. .

  As described above, the deformed portion is likely to occur in a castellation forming portion or a corner portion having a complicated shape in a relatively narrow region. Accordingly, the first metal of the package has a configuration in which a chamfered portion is provided so that the corner portion of the lid does not abut at a position corresponding to the corner portion of the rectangular package in plan view or the corner portion where the castellation is formed. Since only the flat portion of the film layer is in intimate contact with the lid, hermetic sealing can be reliably performed.

  Further, according to a fourth aspect of the present invention, there is provided the electronic component package according to the first or second aspect, wherein the package is hermetically joined by a lid having a rectangular shape in plan view having a chamfered portion at a corner portion. Good. Even if an unintended deformed portion is formed at the corner portion of the package, the deformed portion can be avoided by the chamfered portion, and the bonding reliability during hermetic sealing can be improved.

  According to a fifth aspect of the present invention, the means for joining the lid and the package is specified, and in the electronic component package according to any one of the first to fourth aspects, the hermetic joint between the lid and the package is an energy beam joint or a seam joint. It is characterized by being.

  As is well known, the energy beam can be exemplified by an electron beam or a laser beam, but in recent years it has also been used for hermetic sealing of packages for electronic components. Seam joining is a kind of joining by resistance welding, and this is also often used for hermetic sealing of electronic component packages. Any of the joining means requires adhesion between the lid and the package at the time of joining. By using the electronic component package according to any one of claims 1 to 4, joining without avoiding deformation or avoiding deformation is performed. Therefore, the reliability of hermetic sealing can be improved. In particular, the bonding by the energy beam requires that the metal film layer (first metal film layer) of the package and the metal film layer (second metal film layer) of the lid are in close contact with each other at the time of beam irradiation. The package structure for electronic components functions effectively to improve the bondability.

  According to a sixth aspect of the present invention, there is provided the electronic component package according to any one of the first to fifth aspects, wherein at least a piezoelectric vibration element having an excitation electrode is accommodated in the electronic component element accommodating portion. It is a device. For example, a crystal resonator or the like is required to be stored in an inert gas or a vacuum atmosphere, and highly accurate airtightness is also required in order to stabilize its characteristics. According to the above-described configuration, it is possible to improve the manufacturability such as the manufacturing yield at the time of hermetic sealing and to improve the reliability of the subsequent hermetic sealing, thereby obtaining a piezoelectric vibration device having extremely stable characteristics. be able to.

  According to the present invention, an electronic component that can eliminate the adverse effects caused by deformation that occurs during the manufacture of a ceramic package, can improve the manufacturing yield in airtight sealing, and can improve the reliability after sealing. Package and piezoelectric vibration device can be obtained.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
A first embodiment of the present invention will be described with reference to FIGS. 1 and 2 by taking a surface-mounted crystal resonator as an example. FIG. 1 is an exploded perspective view showing this embodiment, and FIG. 2 is a plan view when FIG. 1 is assembled. The surface-mount type crystal resonator includes a ceramic package 1 having a recess with an upper opening, a tuning fork type crystal vibration plate 2 that is a piezoelectric vibration plate housed in the package, and a lid bonded to the opening of the package. It consists of three.

  The ceramic package 1 has a configuration in which a ceramic such as alumina and a conductive material are appropriately laminated, has a concave shape in cross section, and has an electronic element storage portion 10. The upper surface of the bank portion 11 around the electronic element housing portion is flat, and a circumferential first metal film layer 11a is formed on the bank portion. The upper surface of the first metal film layer 11a is also formed to be flat, and the metal film layers are configured in the order of tungsten, nickel, and gold. Tungsten is integrally formed during ceramic firing by metallization technology, and nickel and gold layers are formed by plating technology.

  Castellations C1, C2, C3, C4 extending in the vertical direction are formed at the four corners of the outer periphery of the ceramic package. The castellation has a configuration in which arc-shaped cutouts are formed in the vertical direction, and is necessary when the wafer is cut into pieces as described above.

  On the bank portion on the upper surface of the castellations C1, C2, C3, and C4, the pull-down portions 1a where the first metal film layer 11a is not formed are formed. The pull-down portion 1a is formed to include a corner portion formed by castellation, and has a configuration in which a deformed portion is difficult to be formed at the time of separation from the wafer. That is, since the metal film layer is not formed in the castellation portion, when the matrix-like break groove is formed in the wafer on which the plurality of ceramic packages are formed, the deformed portion is formed in the metal film layer near the castellation portion. Nothing will happen. Further, the stress at the time of separation from the wafer is not transmitted to the metal film layer, and it becomes difficult to form a deformed portion due to plastic deformation in the metal film layer. For this reason, since the first metal film layer as a whole does not have a portion protruding upward even when viewed microscopically, good flatness can be ensured.

  The dimension of the above-mentioned pull-down part is preferably 0.03 mm to 0.1 mm, more preferably 0.04 mm to 0.07 mm. If it is smaller than 0.03 mm, a deformation layer at the time of forming a break groove is formed on the remaining metal film layer, and the flatness of the metal film layer is likely to deteriorate. Moreover, there is a possibility that the metallized pattern is not formed due to an error during printing. On the other hand, when the pull-down dimension is 0.1 mm or more, the seal path region contributing to the hermetic sealing becomes small, and the hermetic sealing performance may be lowered. In consideration of the stacking error of the ceramic package, the size of the lowered portion of 0.04 mm to 0.07 mm is preferable. Even if the ceramic package size changes, the size of the pull-down portion can be almost applied to a package having a size for an electronic component.

  The first metal film layer 11a is externally formed on the lower surface (back surface) of the ceramic package by a via hole (not shown) formed in the ceramic package or a conductive film (not shown) formed in the castellation portion. It is electrically connected to a connection electrode (not shown) and finally connected to ground.

  Electrode pads 12 and 13 are formed on the inner bottom surface of the ceramic package 1, and these electrode pads are connected to external connection electrodes 14 and 15 (see FIG. 5) formed on the bottom surface outside the package via connecting electrodes (not shown). (Not shown) are respectively drawn out as input / output terminals.

A tuning fork type crystal diaphragm 2 which is a piezoelectric diaphragm is mounted between the electrode pads 12 and 13. As is well known, the tuning fork type quartz diaphragm 2 is composed of a pair of vibrating rods and a base for connecting these vibrating rods. Although not shown in the drawing, one electrode set is formed by commonly connecting the excitation electrodes formed on the front and back surfaces of one vibrating rod portion and both side surfaces of the other vibrating rod portion, and on both side surfaces of one vibrating rod portion, The excitation electrodes formed on the front and back surfaces of the other vibrating bar are connected in common to form the other electrode set, and the tuning fork bending vibration is excited by applying an AC voltage to each electrode set. Each of these electrode sets is drawn out to a lead electrode formed on the base, and is conductively bonded to the electrode pads 12 and 13 of the ceramic package by a conductive bonding material (not shown).

  The lid 3 for hermetically sealing the ceramic package has a flat plate configuration having a rectangular shape in plan view. The lid 3 has a configuration in which a metal brazing material is formed as a second metal film layer 32 on a core material 31 made of Kovar. More specifically, for example, a nickel layer, a kovar core material, a copper layer, and a silver brazing layer are formed from the upper surface. The silver brazing layer as the second metal film layer is joined to the first metal film layer of the ceramic package. The external view of the lid in plan view is the same as that of the ceramic package.

  The tuning fork type quartz diaphragm 2 is housed in the electronic element housing portion 10 of the ceramic package 1, and the electrode pads 12 and 13 and the extraction electrode of the tuning fork type quartz diaphragm 2 are soldered or a conductive resin adhesive (conductive filler added). Conductive bonding with a resin adhesive). Thereafter, hermetic sealing is performed in a vacuum atmosphere. In the present embodiment, the silver solder formed on the lid is melt-cured using an electron beam as a heat source, and hermetic sealing is performed. Specifically, as shown in FIGS. 2A and 2B, the lid 3 is mounted on the first metal film layer of the ceramic package, and this state is fixed by a jig (not shown). FIG. 2A is a plan view when the lid is mounted on the ceramic package, and the package configuration located below the lid 3 is indicated by a dotted line. FIG. 2B shows an electron beam irradiation region for the lid, and the configuration of the ceramic package is not shown. In a vacuum atmosphere, an electron beam is irradiated as an energy beam along the vicinity of the outer periphery of the lid. The irradiated region M is heated, and the lower silver brazing layer is melted and then cured, and the first metal film layer and the second metal film layer are joined.

  In the hermetic sealing by the electron beam, the flatness of the first metal film layer 11a formed on the bank 11 of the ceramic package and the flatness of the second metal film layer 32 formed on the lid are good. However, according to the present invention, since the flatness of both is good, a highly reliable hermetic sealing can be performed. Ensuring the flatness makes it possible to dispose the lid above the pulling-down portion of the corner of the package, and as described above, the lid and the package can have the same planar view outline. With such a configuration, the seal path region (region applied to hermetic sealing) can be expanded, and this is effective in improving the hermetic sealing performance of such energy beam sealing.

  The hermetic sealing may be performed by seam welding. In the case of seam bonding, seam bonding can be performed more efficiently by selecting a lid having a smaller size than the ceramic package plan view outline. Thus, the size of the ceramic package and the lid may be determined according to the joining method.

  The present invention is not limited to the above embodiment, and examples of the configuration of the first metal film layer formed in the ceramic package include the configurations shown in FIGS. 3, 4, and 5. FIG. 3 is a plan view of the ceramic package, and a first metal film layer 17 is formed on the upper surface of the bank portion formed on the outer periphery of the ceramic package. The first metal film layer 17 is configured such that the metal film layer is not formed at the corners newly formed by the castellation. That is, the pull-down portion 1b is formed for each new corner portion. The deformed portion mentioned as the problem of the prior art tends to appear remarkably at the corner portion. The present plan is for such a phenomenon, and by leaving the metal film layer in other portions, a bonding region can be secured, and depending on the bonding method, it may function effectively.

  FIG. 4 also shows a plan view of the ceramic package 1. A first metal film layer 18 is formed on the upper surface of the bank portion formed on the outer periphery of the ceramic package. The first metal film layer 18 is configured to have a pull-down portion 1c formed inside the outer peripheral end of the bank portion over the entire circumference. In the present embodiment, since there is a pull-down portion on the entire circumference, it is possible to eliminate the influence of the deformation portion that occurs when the ceramic package is separated from the wafer, and to ensure the flatness of the first metal film layer. Therefore, the reliability of hermetic sealing can be improved.

  The plan view of the ceramic package shown in FIG. 5 has a structure in which only a castellation portion and a long side portion have a pull-down portion. In the case of a ceramic package having a rectangular shape in plan view, it has been confirmed by a verification experiment that the deformation portion is relatively difficult to be formed on the short side. Therefore, the present example is a configuration aiming to secure a bonding region and improve the overall bonding strength by adopting a configuration in which a pull-down portion is not formed on the short side.

  A second embodiment of the present invention will be described with an exploded perspective view of FIG. 6 and a plan view of FIG. In the present embodiment, the hermetic sealing performance is improved by a device on the lid side. The surface-mount type crystal resonator includes a ceramic package 4 having a recess with an upper opening, a rectangular crystal vibration plate 5 that is a piezoelectric vibration plate housed in the package, and a lid 6 that is bonded to the opening of the package. It consists of.

  The ceramic package 4 has a configuration in which a ceramic such as alumina and a conductive material are laminated, and has a concave shape when viewed in cross section, and has an electronic element housing portion 40. The upper surface of the bank portion 41 around the electronic element housing portion is flat, and a circumferential first metal film layer 41a is formed on the entire surface of the bank portion. The upper surface of the first metal film layer 41a is also formed to be flat and has a layer structure of tungsten, nickel, and gold. Tungsten is integrally formed during ceramic firing by metallization technology, and nickel and gold layers are formed by plating technology.

  Castellations C1, C2, C3, C4 extending in the vertical direction are formed at the four corners of the outer periphery of the ceramic package. The castellation has a configuration in which arc-shaped cutouts are formed in the vertical direction, and is necessary when the wafer is cut into pieces as described above.

  The first metal film layer 41a is formed of an external connection electrode 46 (formed on the lower surface (back surface) of the ceramic package by a via hole (not shown) formed in the ceramic package or a conductive film formed in the castellation portion. (Not shown) and is finally connected to ground.

  Electrode pads 42 and 43 are formed on the inner bottom surface of the ceramic package 4, and these electrode pads are connected to external connection electrodes 44 and 45 (see FIG. 5) formed on the bottom surface outside the package via connection electrodes (not shown). (Not shown) are respectively drawn out as input / output terminals.

Between the electrode pads 42 and 43, an AT-cut crystal diaphragm 5 which is a piezoelectric diaphragm is mounted. Although not shown in the figure, the AT-cut quartz crystal diaphragm 5 has a configuration in which a pair of excitation electrodes are formed on the front and back surfaces, and an extraction electrode is drawn from the excitation electrode to the outer peripheral end. The extraction electrode is conductively bonded to the electrode pads 42 and 43 of the ceramic package by a conductive bonding material (not shown). As a result, one end of the AT-cut quartz crystal plate in the long side direction is cantilevered.

  The lid 6 for hermetically sealing the ceramic package 4 has a flat plate configuration that is rectangular in plan view. The lid 6 has a configuration in which a metal brazing material is formed as a second metal film layer 62 on a core material 61 made of Kovar. For example, the lid 6 has a multilayer configuration of a nickel layer, a Kovar core material, and a silver brazing layer. The silver brazing layer as the metal film layer is joined to the first metal film layer of the ceramic package. A chamfer 6a is formed at each of the four corners of the lid 6. In the present embodiment, the chamfered portion 6a has a concave chamfered configuration having a curvature, and the size thereof is set larger than the size of the castellation of the ceramic package, as shown in FIG. More specifically, the outer size of the lid itself is substantially the same as the plan view size of the ceramic package, but the curvature radius of the chamfered portion 6a of the lid is set larger than the curvature radius of the curvature portion of the castellation.

  The AT-cut quartz diaphragm 5 is stored in the electronic element housing part 40 of the ceramic package 4, and the electrode pads 42 and 43 and the extraction electrode of the AT-cut quartz diaphragm 5 are bonded with a conductive resin adhesive (resin bonding with a conductive filler added). Conductive bonding with the agent). Thereafter, hermetic sealing is performed in a vacuum atmosphere or an inert gas atmosphere. The hermetic sealing method may be an energy beam such as the aforementioned electron beam, or may be a joint using seam welding. Further, instead of the silver brazing formed on the lid, an atmospheric heating method in which a brazing material having a lower melting point is used and heating is performed by a heating furnace or the like may be used.

  In the present embodiment, the ceramic package has a structure in which a metal film layer is formed up to the outer peripheral end portion of the bank portion as in the conventional case. Therefore, a deformed portion may be formed on the metal film layer in the castellation forming portion at the time of separation from the wafer into the package. Even in this case, the chamfered portion 6a of the lid avoids the deformed portion. As a result, the lid is prevented from partially floating, the first metal film layer 41a formed in the ceramic package and the second metal film layer 62 formed in the lid are in close contact, and reliability in hermetic sealing is improved. improves.

  The chamfered lid may be applied to the ceramic package configuration used in the first embodiment, that is, a configuration having a pull-down portion. FIG. 8 is a plan view of the hermetically sealed electronic component package. The ceramic package 1 used here is the same as the configuration used in the first embodiment, and the upper part of the bank portion of each castellation forming portion. A pull-down portion is formed. The lid 62 has the same configuration as that used in the second embodiment, and has chamfered portions 62a at each corner. As shown in FIG. 8, the outer size of the lid is smaller than the outer shape of the metal film layer. However, in the part of the castellation part, the lid protrudes to the lowered part. Also in FIG. 8, the dotted line display part shows the component located below the lid. The lid may be the same size as the outer shape of the metal film layer.

  FIG. 9 is a plan view showing another example. 9A is a plan view of the ceramic package, FIG. 9B is a plan view of the lid, and FIG. 9C is a plan view of a state in which the ceramic package is closed with the lid. As shown in FIG. 9A, in a ceramic package 7 having a rectangular shape in plan view, castellations C1, C2, C3, and C4 are provided at four corners, and castellations C5 and C6 are provided on the long sides, respectively. The case where it is formed is shown. Among the castellations at the corners, the pull-down portions 7a are formed only for the castellations C4, and the pull-down portions 7b and 7b are also formed for the castellations C5 and C6. The pull-down portion 7a contributes to ensuring flatness and clearly indicating the directionality of the ceramic package.

As shown in FIG. 9B, the lid 8 used for hermetic sealing has a rectangular shape in plan view, and a corner portion other than the portion corresponding to the castellation C4 is formed with a straight chamfered portion 8a. In addition, the corner portion 82 is not chamfered, but is disposed corresponding to the pull-down portion 7a, and thus does not adversely affect the hermetic sealing performance. The castellations C5 and C6 are also provided with the lowered portions 7b and 7b, so that the flatness of the metal film layer can be maintained and contributes to good hermetic sealing.

  In each of the above embodiments, the chamfering of the lid may be performed on only a part. Moreover, when forming the structure which has a pull-down part in a ceramic package, you may combine with each structure shown in Embodiment, and the combination with the structure which is not limited to an Example is also possible.

  In the examples of the above embodiments, a surface mount type crystal resonator using a tuning fork type crystal diaphragm or an AT-cut crystal diaphragm is illustrated, but a crystal filter, a crystal diaphragm and other electronic elements are used. A configuration stored in a package may be used. In addition, the piezoelectric diaphragm may be made of other piezoelectric materials such as a piezoelectric ceramic diaphragm, and may be applied to other electronic component elements, and is not limited to the example of the above embodiment.

  It can be applied to mass production of electronic parts including crystal units.

The disassembled perspective view of the open state of the crystal oscillator by 1st Embodiment. The top view of the state which closed the lid by 1st Embodiment. The top view which shows other embodiment. The top view which shows other embodiment. The top view which shows other embodiment. The disassembled perspective view of the open state of the crystal oscillator according to the second embodiment. The top view of the state closed by 2nd Embodiment. The figure which shows other embodiment. The figure which shows other embodiment. A diagram for explaining a conventional example

Explanation of symbols

1, 4 Ceramic package 1a Pull-down part 11, 41 Bank part
12, 42 Electrode pad
13, 43 Electrode pad
2 Tuning fork type crystal diaphragm 3, 6 Lid 5 AT cut crystal diaphragm

Claims (6)

A package having a bank portion around the electronic component element housing section, a first metal film layer on the bank portion, and a second metal film layer bonded to the first metal film layer A lid for hermetically sealing the package, and an electronic component package comprising:
The electronic component package, wherein the first metal film layer formed on the bank portion is formed on an inner side than an outer peripheral end portion of the bank portion. The package has a rectangular shape in plan view, and has a configuration in which concave castellations are formed at corners and / or sides of the outer periphery, and the first metal film layer is formed on the bank portion of the castellation forming portion. The electronic component package according to claim 1, wherein the electronic component package is formed inside an outer peripheral end of the bank portion. A package having a rectangular shape in plan view having a bank portion around the electronic component element housing section and having a first metal film layer on the bank portion, and a second metal joined to the first metal film layer A package for an electronic component having a film layer and a lid having a rectangular shape in plan view for hermetically bonding the package;
A package for an electronic component, wherein a corner portion of the lid has a chamfered portion. 3. The electronic component package according to claim 1, wherein the package is hermetically joined by a rectangular lid having a chamfered portion at a corner portion. 5. The electronic component package according to claim 1, wherein the lid and the package are hermetically bonded by energy beam bonding or seam bonding. 6. A piezoelectric vibration device using the electronic component package according to claim 1, wherein a piezoelectric vibration element having at least an excitation electrode is housed in the electronic component element housing portion.

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