JP2005353858A5 - - Google Patents

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Publication number: JP2005353858A5
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2004173317A

Other versions

JP4574240B2 (ja

JP2005353858A (ja

Filing date

2004-06-11

Publication date

2007-07-26

2004-06-11 Application filed filed Critical

2004-06-11 Priority to JP2004173317A priority Critical patent/JP4574240B2/ja

2004-06-11 Priority claimed from JP2004173317A external-priority patent/JP4574240B2/ja

2005-06-07 Priority to EP05012232A priority patent/EP1605308B1/en

2005-06-07 Priority to DE602005024340T priority patent/DE602005024340D1/de

2005-06-08 Priority to US11/149,046 priority patent/US7789647B2/en

2005-12-22 Publication of JP2005353858A publication Critical patent/JP2005353858A/ja

2007-07-26 Publication of JP2005353858A5 publication Critical patent/JP2005353858A5/ja

2010-11-04 Application granted granted Critical

2010-11-04 Publication of JP4574240B2 publication Critical patent/JP4574240B2/ja

2024-06-11 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

JP2004173317A 2004-06-11 2004-06-11 加工装置、加工方法、デバイス製造方法 Expired - Lifetime JP4574240B2 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2004173317A JP4574240B2 (ja)	2004-06-11	2004-06-11	加工装置、加工方法、デバイス製造方法
EP05012232A EP1605308B1 (en)	2004-06-11	2005-06-07	Apparatus and method for transferring a pattern
DE602005024340T DE602005024340D1 (de)	2004-06-11	2005-06-07	Vorrichtung und Verfahren zur Übertragung eines Musters
US11/149,046 US7789647B2 (en)	2004-06-11	2005-06-08	Processing apparatus and method

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2004173317A JP4574240B2 (ja)	2004-06-11	2004-06-11	加工装置、加工方法、デバイス製造方法

Publications (3)

Publication Number	Publication Date
JP2005353858A JP2005353858A (ja)	2005-12-22
JP2005353858A5 true JP2005353858A5 (ja)	2007-07-26
JP4574240B2 JP4574240B2 (ja)	2010-11-04

Family

ID=34978721

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2004173317A Expired - Lifetime JP4574240B2 (ja)	2004-06-11	2004-06-11	加工装置、加工方法、デバイス製造方法

Country Status (4)

Country	Link
US (1)	US7789647B2 (ja)
EP (1)	EP1605308B1 (ja)
JP (1)	JP4574240B2 (ja)
DE (1)	DE602005024340D1 (ja)

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JP4533358B2 (ja) *	2005-10-18	2010-09-01	キヤノン株式会社	インプリント方法、インプリント装置およびチップの製造方法
JP2007242893A (ja) *	2006-03-08	2007-09-20	Toshiba Corp	パターン転写方法およびパターン転写装置
JP4795300B2 (ja) *	2006-04-18	2011-10-19	キヤノン株式会社	位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法
KR101261606B1 (ko) *	2006-05-09	2013-05-09	삼성디스플레이 주식회사	표시판의 제조 장치 및 제조 방법
JP4854383B2 (ja) *	2006-05-15	2012-01-18	アピックヤマダ株式会社	インプリント方法およびナノ・インプリント装置
KR100774327B1 (ko) *	2006-06-07	2007-11-08	현대자동차주식회사	트랜스퍼 프레스 장치 및 그 작동방법
JP4506987B2 (ja) *	2006-07-21	2010-07-21	株式会社日立ハイテクノロジーズ	エネルギ線硬化型樹脂の転写方法、転写装置及びディスクまたは半導体デバイス
JP5007091B2 (ja) *	2006-09-21	2012-08-22	東芝機械株式会社	転写装置
TWI396617B (zh) *	2006-09-29	2013-05-21	Toray Industries	微細形狀轉印片之製法及製造裝置
JP4989234B2 (ja) *	2007-01-09	2012-08-01	東芝機械株式会社	転写装置
US8945444B2 (en)	2007-12-04	2015-02-03	Canon Nanotechnologies, Inc.	High throughput imprint based on contact line motion tracking control
JP5150309B2 (ja) *	2008-03-03	2013-02-20	東芝機械株式会社	転写装置および転写方法
JP5666082B2 (ja) *	2008-05-30	2015-02-12	東芝機械株式会社	転写装置およびプレス装置
TWI342270B (en) *	2008-07-15	2011-05-21	Univ Nat Taiwan	Specific-light-cured and pressure-differential embossing apparatus
JP5517423B2 (ja) *	2008-08-26	2014-06-11	キヤノン株式会社	インプリント装置及びインプリント方法
WO2010082686A1 (ja) *	2009-01-19	2010-07-22	新日本製鐵株式会社	真空圧空成形露光装置及び露光方法
JPWO2010089867A1 (ja) *	2009-02-05	2012-08-09	パイオニア株式会社	転写装置および転写方法
JP5379564B2 (ja) *	2009-06-01	2013-12-25	キヤノン株式会社	インプリント装置、および物品の製造方法
NL2004735A (en) *	2009-07-06	2011-01-10	Asml Netherlands Bv	Imprint lithography apparatus and method.
EP2287666B1 (de)	2009-08-22	2012-06-27	EV Group E. Thallner GmbH	Vorrichtung zum Prägen von Substraten
JP2011146447A (ja) *	2010-01-12	2011-07-28	Canon Inc	インプリント装置及び物品の製造方法
US8747092B2 (en) *	2010-01-22	2014-06-10	Nanonex Corporation	Fast nanoimprinting apparatus using deformale mold
JP5351069B2 (ja)	2010-02-08	2013-11-27	株式会社東芝	インプリント方法及びインプリント装置
JP5337114B2 (ja) *	2010-07-30	2013-11-06	株式会社東芝	パタン形成方法
WO2012016744A1 (en)	2010-08-05	2012-02-09	Asml Netherlands B.V.	Imprint lithography
JP2012182384A (ja) *	2011-03-02	2012-09-20	Toshiba Corp	テンプレート用の基板の処理装置及びテンプレート用の基板の処理方法
JP5769451B2 (ja) *	2011-03-07	2015-08-26	キヤノン株式会社	インプリント装置および物品の製造方法
JP5864929B2 (ja) *	2011-07-15	2016-02-17	キヤノン株式会社	インプリント装置および物品の製造方法
KR20130063233A (ko) *	2011-12-06	2013-06-14	삼성전자주식회사	나노 임프린트 리소그래피 장치 및 방법
US20140205702A1 (en) *	2013-01-24	2014-07-24	Kabushiki Kaisha Toshiba	Template, manufacturing method of the template, and position measuring method in the template
US20140209567A1 (en) *	2013-01-29	2014-07-31	Kabushiki Kaisha Toshiba	Template, manufacturing method of the template, and strain measuring method in the template
KR101345750B1 (ko)	2013-02-27	2013-12-27	(주)에이피앤	나노 전자소자 제조방법
WO2014145360A1 (en)	2013-03-15	2014-09-18	Nanonex Corporation	Imprint lithography system and method for manufacturing
US10108086B2 (en)	2013-03-15	2018-10-23	Nanonex Corporation	System and methods of mold/substrate separation for imprint lithography
DE102013207243B4 (de) *	2013-04-22	2019-10-02	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Vorrichtung und verfahren zur herstellung einer struktur aus aushärtbarem material durch abformung
JP6282069B2 (ja) *	2013-09-13	2018-02-21	キヤノン株式会社	インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP6674218B2 (ja) *	2014-12-09	2020-04-01	キヤノン株式会社	インプリント装置、インプリント方法及び物品の製造方法
US10747106B2 (en)	2014-12-09	2020-08-18	Canon Kabushiki Kaisha	Imprint apparatus
WO2017217931A1 (en) *	2016-06-15	2017-12-21	Semiconductor Technologies And Instruments Pte Ltd	Apparatus and method for automatically setting, calibrating and monitoring or measuring pickup head position and force during component pickup operations
JP6768409B2 (ja) *	2016-08-24	2020-10-14	キヤノン株式会社	インプリント装置、及び物品製造方法
US10991582B2 (en) *	2016-12-21	2021-04-27	Canon Kabushiki Kaisha	Template for imprint lithography including a recession, an apparatus of using the template, and a method of fabricating an article
JP7410616B2 (ja) *	2019-09-24	2024-01-10	キヤノン株式会社	平坦化装置、物品の製造方法、平坦化方法及びインプリント装置

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JPS5375868A (en) *	1976-12-17	1978-07-05	Nec Corp	Exposure device permitting observation of contact state between mask and specimen wafer
US5804017A (en) *	1995-07-27	1998-09-08	Imation Corp.	Method and apparatus for making an optical information record
US6482742B1 (en) *	2000-07-18	2002-11-19	Stephen Y. Chou	Fluid pressure imprint lithography
EP1072954A3 (en) *	1999-07-28	2002-05-22	Lucent Technologies Inc.	Lithographic process for device fabrication
US6873087B1 (en)	1999-10-29	2005-03-29	Board Of Regents, The University Of Texas System	High precision orientation alignment and gap control stages for imprint lithography processes
SE515607C2 (sv) *	1999-12-10	2001-09-10	Obducat Ab	Anordning och metod vid tillverkning av strukturer
EP2264523A3 (en) *	2000-07-16	2011-11-30	Board Of Regents, The University Of Texas System	A method of forming a pattern on a substrate in imprint lithographic processes
US6696220B2 (en) *	2000-10-12	2004-02-24	Board Of Regents, The University Of Texas System	Template for room temperature, low pressure micro-and nano-imprint lithography
US7211214B2 (en) *	2000-07-18	2007-05-01	Princeton University	Laser assisted direct imprint lithography
EP2099066B1 (en) *	2002-11-13	2012-01-04	Molecular Imprints, Inc.	Method for modulating shapes of substrates
US6871558B2 (en) *	2002-12-12	2005-03-29	Molecular Imprints, Inc.	Method for determining characteristics of substrate employing fluid geometries
TW568349U (en) *	2003-05-02	2003-12-21	Ind Tech Res Inst	Parallelism adjusting device for nano-transferring
US6805054B1 (en) *	2003-05-14	2004-10-19	Molecular Imprints, Inc.	Method, system and holder for transferring templates during imprint lithography processes
JP4455092B2 (ja) *	2004-02-20	2010-04-21	キヤノン株式会社	加工装置及び加工方法
KR100558754B1 (ko) *	2004-02-24	2006-03-10	한국기계연구원	Ｕｖ 나노임프린트 리소그래피 공정 및 이 공정을수행하는 장치
US7168939B2 (en) *	2004-02-26	2007-01-30	Hitachi Global Storage Technologies Netherlands Bv	System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
US20050270516A1 (en) *	2004-06-03	2005-12-08	Molecular Imprints, Inc.	System for magnification and distortion correction during nano-scale manufacturing

2004
- 2004-06-11 JP JP2004173317A patent/JP4574240B2/ja not_active Expired - Lifetime
2005
- 2005-06-07 DE DE602005024340T patent/DE602005024340D1/de active Active
- 2005-06-07 EP EP05012232A patent/EP1605308B1/en not_active Not-in-force
- 2005-06-08 US US11/149,046 patent/US7789647B2/en active Active

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