JP2004349548A - Heat sink and electric controller equipped with it - Google Patents
Heat sink and electric controller equipped with it Download PDFInfo
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- JP2004349548A JP2004349548A JP2003146349A JP2003146349A JP2004349548A JP 2004349548 A JP2004349548 A JP 2004349548A JP 2003146349 A JP2003146349 A JP 2003146349A JP 2003146349 A JP2003146349 A JP 2003146349A JP 2004349548 A JP2004349548 A JP 2004349548A
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Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は、ファンを用いた冷却構造を有する電気制御装置に関するもので、例えばサーボ制御装置のような電気制御装置に関するものである。
【０００２】
【従来の技術】
半導体素子が取付けられたヒートシンクの冷却フィンに冷却風を流通させて冷却することは公知である（例えば、特許文献１参照）。
【０００３】
【特許文献１】
特開平１０−１５０２８４号公報
【０００４】
特許文献１記載の発明は、ヒートシンクを大きくすることなく半導体素子を確実に冷却するもので、半導体素子を取付けた第１のヒートシンクと、半導体素子を取付けた第２のヒートシンクと、風洞を形成する覆板と、冷却風を導く整流板とを有し、第１のヒートシンクは空間を介して第２のヒートシンクを配設され、覆板は両ヒートシンクを覆って底板との間に風洞を形成し、整流板は斜辺部を有する部材からなり第１のヒートシンクの側面と第２のヒートシンクの側面に跨がって配置され、一方端を第２のヒートシンクの側面に取付け、他方端を第１のヒートシンクの側面に取付けるようにしている。
しかしながら、半導体素子のそれぞれに別個のヒートシンクを設けているため、２個のヒートシンクの間に隙間ができ、その隙間を塞ぐための底板が別途必要となり、また、冷却ファンへ通じる風洞を形成する覆板も別途必要となり、部品点数が多くなり、取付工数も増え、コスト高となった。
【０００５】
図５は本発明の前提となった電気制御装置を示すもので、これは特許文献１記載の発明ような底板や覆板は必要としないものである。
図において、１は複数の発熱素子、２はファン、３は制御基板、４はヒートシンクである。複数の発熱素子１、ファン２および制御基板３は共通の大きなヒートシンク４の上に搭載されている。ヒートシンク４のファン２の冷却風は発熱素子１および制御基板３に吹き付けられ、これらを冷却する。
これによれば、複数の半導体素子は共通の大きなヒートシンクに搭載されているため、複数の半導体素子の間に隙間がなく、したがって底板が不要となり、また、冷却ファンへ通じる風洞を形成する覆板も不要となり、部品点数も取付工数も減り、コストダウンとなった。
しかしながら、複数の発熱素子１は周辺部品も含めて密集して配設されているため、発熱素子１への冷却風は十分にあたらず、放熱効果は十分ではなかった。
【０００６】
【発明が解決しようとする課題】
このように、上述の電気制御装置では、発熱素子が装置内部にその他部品と密集して搭載されているような場合、ヒートシンクによる放熱は、熱を拡散するだけにとどまり、装置外部への積極的な放熱は行えず、ファンを利用して放熱する場合も、発熱素子周辺が密集しているため、ファンの冷却風が十分に発熱素子に届かず、放熱効果は発熱素子に対して十分ではなく、温度上昇を効率よく抑えることは出来なかった。
また、放熱効果を上げようとすると発熱素子の間隔を大きくとる必要があり小型化できないという問題があった。
【０００７】
【課題を解決するための手段】
上記問題を解決するために、請求項１記載の発明は、発熱素子を搭載するヒートシンクにおいて、該発熱素子搭載面とその反対面とを貫通する切欠き穴を端部近傍に設け、該切欠き穴を冷却風が流れる流路としたことを特徴とする。
請求項２記載の発明は、請求項１記載のヒートシンクにおいて、前記反対面に冷却フィンを設けたことを特徴とする。
請求項３記載の電気制御装置の発明は、発熱素子と制御基板とを有する電気制御装置において、請求項１又は２記載のヒートシンクと、該ヒートシンクの切欠き穴に対向して設けられたファンとを備え、前記発熱素子と前記制御基板を電気的に接続し、前記発熱素子を前記ヒートシンクの発熱素子搭載面に搭載し、前記ファンからの風が前記切欠き穴を通してヒートシンクの前記反対面に流れるようにしたことを特徴とする。
請求項４記載の発明は、吸込口と吐出口とを備える制御装置筐体の中に収納された請求項３記載の電気制御装置において、前記切欠き穴を通過した風が前記吐出口へと流れる流路を備えたことを特徴とする。
請求項５記載の発明は、請求項４記載の電気制御装置において、前記吸込口にフィルタを設けたことを特徴とする。
このように、ヒートシンクに発熱素子搭載面と非発熱素子搭載面とを貫通させる切欠き穴を設けたので、ファンからの冷却風が切欠き穴を通って発熱素子の裏面のヒートシンク面に流れるため、発熱素子からの熱はヒートシンクを介して冷却風に伝わり、その冷却風は密集していない流路を通過でき外部へ放出できるため、効率よく放熱が可能になり温度上昇を抑えることが可能になる。その結果、発熱素子を密集して配置しても効率よく放熱ができるので、ユニットの小型化が可能となる。
【０００８】
【発明の実施の形態】
以下、本発明について、図面に基づいて詳しく説明する。
図１は本発明の実施の形態を示す電気制御装置の分解斜視図、図２は図１の制御基板とヒートシンクを組み立てた電気制御装置の斜視図、図３は図２に示す電気制御装置の冷却風の流れを示す側面断面図である。
図１〜図３において、１は発熱素子、２はファン、３は制御基板、４はヒートシンク、
発熱素子１、ファン２、および制御基板３はヒートシンク４の上に搭載されており、ヒートシンク４には切欠き穴４−１が発熱素子搭載面と非搭載面を貫通するように設けられている。そして、この切欠き穴４−１に対向させてファン２を搭載している。したがって、ファン２からの冷却風は切欠き穴４−１を通って非搭載面側に冷却風を流すことになる。搭載面からの冷却風が非搭載面に流れ込むと、発熱素子１の裏側のヒートシンク面を通過するように冷却風は流れていく。このように、発熱素子１からヒートシンク４に伝わった熱が、この流れの冷却風に伝わり、装置外部へ導かれるため、たとえ発熱素子１の搭載側が部品により密集していたとしても、ヒートシンク４を介して十分に放熱することが可能となる。
【０００９】
図４は第２の実施の形態で、図３記載の電気制御装置を内蔵した制御装置筐体の側面断面図である。
図４において、１は発熱素子、２はファン、３は制御基板、４はヒートシンク、４−１は切欠き穴、５は制御装置筐体、５−１は制御装置筐体における空気の吐出口、５−２は制御装置筐体における空気の吸込口である。
図４から判るように、図３の電気制御装置は制御装置筐体５で覆われており、空気の吸込口５−２には防塵用のフィルタを有している。
この場合、冷却風の流れは、まず吸込口５−２からフィルタを介して塵埃の取り除かれた空気が制御装置筐体５の内に取り込まれ、制御基板３の周辺を通過し切欠き穴４−１へと導かれ、切欠き穴４−１を通過し、発熱素子１の裏側のヒートシンク面を通り、吐出口５−１から装置の外部へと流れ出る。
このような冷却風の流れにより、温度上昇のないフィルタからの冷却風はまず制御基板３を冷却し、切り欠き穴４−１へと流れた後、発熱素子裏側のヒートシンク面を通り発熱素子１からの熱を伝え、装置外部へ放出される。
このように、発熱素子１の熱は吐出口５−１の直前で放熱されるため、内部の温度上昇を防ぐことが可能になる。
また、吐出口５−１に防塵用のフィルタを設けて、吐出口５−１からフィルタを介して塵埃の取り除かれた空気を室内に放出するようにしてもよい。
【００１０】
【発明の効果】
以上、本発明によれば、ヒートシンクに発熱素子搭載面と非発熱素子搭載面とを貫通させる切欠き穴を設け、ファンを稼動させると、切欠き穴及び発熱素子を搭載した裏側のヒートシンク面に冷却風が流れるような流路を設けたので、発熱素子側が密集していて冷却風が十分に通過していなくても、発熱素子の裏面のヒートシンク面には冷却風が流れるため、発熱素子からの熱はヒートシンクを介して冷却風に伝わり、その冷却風は密集していない流路を通過でき外部へ放出できるため、効率よく放熱が可能になり温度上昇を抑えることが可能になる。その結果、発熱素子を密集して配置しても効率よく放熱ができるため、ユニットの小型化が可能となる。
【図面の簡単な説明】
【図１】本発明の実施の形態を示す電気制御装置の正面方向の分解斜視図である。
【図２】図１の制御基板とヒートシンクを組み立てた電気制御装置の正面方向の斜視図である。
【図３】図２に示す電気制御装置の冷却風の流れを示す側面断面図である。
【図４】第２の実施の形態で、図３記載の電気制御装置を内蔵した制御装置筐体の側面断面図である。
【図５】本発明の前提となった電気制御装置を示す側面断面図である。
【符号の説明】
１ 発熱素子
２ ファン
３ 制御基板
４ ヒートシンク
４−１ 切欠き穴
５ 制御装置筐体
５−１ 吐出口
５−２ 吸込口[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electric control device having a cooling structure using a fan, and more particularly to an electric control device such as a servo control device.
[0002]
[Prior art]
It is known that cooling air is circulated through cooling fins of a heat sink to which a semiconductor element is attached to perform cooling (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP-A-10-150284
The invention described in Patent Document 1 reliably cools a semiconductor element without increasing the size of a heat sink, and forms a first heat sink having a semiconductor element mounted thereon, a second heat sink having a semiconductor element mounted thereon, and an air tunnel. A first heat sink provided with a second heat sink via a space, and the cover plate covering both heat sinks to form an air tunnel between the first heat sink and the bottom plate; The rectifying plate is made of a member having a hypotenuse portion, and is disposed so as to straddle the side surface of the first heat sink and the side surface of the second heat sink. One end is attached to the side surface of the second heat sink, and the other end is connected to the first side. It is installed on the side of the heat sink.
However, since a separate heat sink is provided for each of the semiconductor elements, a gap is formed between the two heat sinks, and a bottom plate for closing the gap is required separately. Separate plates were required, the number of parts increased, the number of mounting steps increased, and the cost increased.
[0005]
FIG. 5 shows an electric control device on which the present invention is based, which does not require a bottom plate or a cover plate as disclosed in Patent Document 1.
In the figure, 1 is a plurality of heating elements, 2 is a fan, 3 is a control board, and 4 is a heat sink. The plurality of heating elements 1, the fan 2, and the control board 3 are mounted on a common large heat sink 4. Cooling air of the fan 2 of the heat sink 4 is blown to the heating element 1 and the control board 3 to cool them.
According to this, since the plurality of semiconductor elements are mounted on a common large heat sink, there is no gap between the plurality of semiconductor elements, so that a bottom plate is unnecessary, and a cover plate that forms an air tunnel leading to a cooling fan is provided. Is also unnecessary, the number of parts and the number of installation steps are reduced, and the cost is reduced.
However, since the plurality of heating elements 1 are densely arranged including peripheral components, the cooling air to the heating elements 1 is not sufficiently applied, and the heat radiation effect is not sufficient.
[0006]
[Problems to be solved by the invention]
As described above, in the above-described electric control device, when the heat generating element is densely mounted inside the device and other components, the heat dissipation by the heat sink only diffuses the heat, and the active heat to the outside of the device is positive. When using a fan to dissipate heat, the cooling air from the fan does not reach the heating element sufficiently, and the heat dissipation effect is not sufficient for the heating element. However, the rise in temperature could not be suppressed efficiently.
Further, in order to increase the heat radiation effect, it is necessary to increase the interval between the heating elements, and there is a problem that the size cannot be reduced.
[0007]
[Means for Solving the Problems]
In order to solve the above problem, the invention according to claim 1 provides a heat sink on which a heating element is mounted, wherein a notch hole penetrating the heating element mounting surface and the opposite surface is provided near an end portion, and the notch is provided. The holes are formed as flow paths through which cooling air flows.
The invention according to claim 2 is the heat sink according to claim 1, wherein cooling fins are provided on the opposite surface.
According to a third aspect of the present invention, there is provided an electric control device having a heating element and a control board, wherein the heat sink according to the first or second aspect and a fan provided to face the notch hole of the heat sink. Electrically connecting the heating element and the control board, mounting the heating element on the heating element mounting surface of the heat sink, and flowing the wind from the fan to the opposite surface of the heat sink through the notch hole. It is characterized by doing so.
The invention according to claim 4 is the electric control device according to claim 3, which is housed in a control device housing including a suction port and a discharge port, wherein the wind passing through the notch hole is directed to the discharge port. A flow path is provided.
According to a fifth aspect of the present invention, in the electric control device according to the fourth aspect, a filter is provided in the suction port.
As described above, since the notch hole is provided in the heat sink so as to penetrate the heating element mounting surface and the non-heating element mounting surface, the cooling air from the fan flows through the notch hole to the heat sink surface on the back surface of the heating element. The heat from the heating element is transmitted to the cooling air through the heat sink, and the cooling air can pass through the less dense channel and can be released to the outside, enabling efficient heat radiation and suppressing the temperature rise. Become. As a result, even if the heating elements are densely arranged, heat can be efficiently dissipated, so that the unit can be reduced in size.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
1 is an exploded perspective view of an electric control device showing an embodiment of the present invention, FIG. 2 is a perspective view of an electric control device in which a control board and a heat sink of FIG. 1 are assembled, and FIG. 3 is a view of the electric control device shown in FIG. It is a side sectional view showing a flow of cooling air.
1 to 3, 1 is a heating element, 2 is a fan, 3 is a control board, 4 is a heat sink,
The heating element 1, the fan 2, and the control board 3 are mounted on a heat sink 4, and the heat sink 4 is provided with a notch hole 4-1 so as to penetrate the heating element mounting surface and the non-mounting surface. . The fan 2 is mounted so as to face the notch 4-1. Therefore, the cooling air from the fan 2 flows through the notch 4-1 to the non-mounting surface side. When the cooling air from the mounting surface flows into the non-mounting surface, the cooling air flows so as to pass through the heat sink surface on the back side of the heating element 1. As described above, the heat transmitted from the heating element 1 to the heat sink 4 is transmitted to the cooling air of this flow and is guided to the outside of the apparatus. Therefore, even if the mounting side of the heating element 1 is more densely packed with the components, the heat sink 4 It is possible to sufficiently dissipate the heat.
[0009]
FIG. 4 is a side cross-sectional view of a control device housing incorporating the electric control device shown in FIG. 3 according to the second embodiment.
In FIG. 4, 1 is a heating element, 2 is a fan, 3 is a control board, 4 is a heat sink, 4-1 is a notch hole, 5 is a control device housing, and 5-1 is an air discharge port in the control device housing. Reference numeral 5-2 denotes an air suction port in the control device housing.
As can be seen from FIG. 4, the electric control device of FIG. 3 is covered by the control device housing 5, and has a dustproof filter at the air inlet 5-2.
In this case, the flow of the cooling air is such that air from which dust has been removed from the suction port 5-2 via a filter is taken into the control device housing 5, passes around the control board 3, and passes through the notch hole 4. −1, passes through the notch 4-1, passes through the heat sink surface on the back side of the heating element 1, and flows out of the discharge port 5-1 to the outside of the apparatus.
With such a flow of the cooling air, the cooling air from the filter having no temperature rise first cools the control board 3 and flows to the notch 4-1. Then, the cooling air passes through the heat sink surface on the back side of the heating element. The heat is transmitted to the outside of the device.
As described above, since the heat of the heating element 1 is radiated immediately before the discharge port 5-1, it is possible to prevent the internal temperature from rising.
Further, a filter for preventing dust may be provided at the discharge port 5-1 so that air from which dust is removed is discharged from the discharge port 5-1 to the room through the filter.
[0010]
【The invention's effect】
As described above, according to the present invention, the heat sink is provided with a cutout hole that penetrates the heating element mounting surface and the non-heating element mounting surface, and when the fan is operated, the cutout hole and the heat sink surface on the back side where the heating element is mounted are provided. Since the flow path through which the cooling air flows is provided, even if the heating element side is dense and the cooling air does not sufficiently pass, the cooling air flows on the heat sink surface on the back of the heating element. Is transmitted to the cooling air via the heat sink, and the cooling air can pass through the non-dense flow passage and can be released to the outside, so that heat can be efficiently radiated and the temperature rise can be suppressed. As a result, even if the heating elements are densely arranged, heat can be efficiently radiated, and the unit can be reduced in size.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view in the front direction of an electric control device according to an embodiment of the present invention.
FIG. 2 is a front perspective view of the electric control device in which the control board and the heat sink of FIG. 1 are assembled.
FIG. 3 is a side sectional view showing a flow of cooling air of the electric control device shown in FIG. 2;
FIG. 4 is a side cross-sectional view of a control device housing incorporating the electric control device shown in FIG. 3 in the second embodiment.
FIG. 5 is a side sectional view showing an electric control device on which the present invention is based.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 heating element 2 fan 3 control board 4 heat sink 4-1 notch hole 5 control device housing 5-1 discharge port 5-2 suction port
Claims (5)
請求項１又は２記載のヒートシンクと、該ヒートシンクの切欠き穴に対向して設けられたファンとを備え、前記発熱素子と前記制御基板を電気的に接続し、前記発熱素子を前記ヒートシンクの発熱素子搭載面に搭載し、前記ファンからの風が前記切欠き穴を通してヒートシンクの前記反対面に流れるようにしたことを特徴とする電気制御装置。In an electric control device having a heating element and a control board,
3. The heat sink according to claim 1, further comprising: a fan provided to face a notch hole of the heat sink, electrically connecting the heating element to the control board, and heating the heating element by the heat sink. An electric control device mounted on an element mounting surface, wherein wind from the fan flows through the notch hole to the opposite surface of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003146349A JP4269103B2 (en) | 2003-05-23 | 2003-05-23 | Electric control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003146349A JP4269103B2 (en) | 2003-05-23 | 2003-05-23 | Electric control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004349548A true JP2004349548A (en) | 2004-12-09 |
| JP4269103B2 JP4269103B2 (en) | 2009-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003146349A Expired - Fee Related JP4269103B2 (en) | 2003-05-23 | 2003-05-23 | Electric control device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007335669A (en) * | 2006-06-15 | 2007-12-27 | Yaskawa Electric Corp | Motor control device |
| DE112007002094T5 (en) | 2006-09-07 | 2009-07-16 | Kabushiki Kaisha Yaskawa Denki, Kitakyushu | Motor controller |
| DE112007002126T5 (en) | 2006-09-13 | 2009-07-23 | K.K. Yaskawa Denki, Kitakyushu | Motor controller |
| DE112007002035T5 (en) | 2006-09-06 | 2009-07-30 | Kabushiki Kaisha Yaskawa Denki, Kitakyushu | Motor controller |
| DE112007002019T5 (en) | 2006-09-04 | 2009-10-08 | Kabushiki Kaisha Yaskawa Denki, Kitakyushu-Shi | Motor controller |
| WO2021193882A1 (en) * | 2020-03-27 | 2021-09-30 | 株式会社ソニー・インタラクティブエンタテインメント | Electronic apparatus |
| US12075593B2 (en) | 2020-03-27 | 2024-08-27 | Sony Interactive Entertainment Inc. | Electronic apparatus |
-
2003
- 2003-05-23 JP JP2003146349A patent/JP4269103B2/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007335669A (en) * | 2006-06-15 | 2007-12-27 | Yaskawa Electric Corp | Motor control device |
| US7898806B2 (en) | 2006-09-04 | 2011-03-01 | Kabushiki Kaisha Yaskawa Denki | Motor controller |
| DE112007002019T5 (en) | 2006-09-04 | 2009-10-08 | Kabushiki Kaisha Yaskawa Denki, Kitakyushu-Shi | Motor controller |
| DE112007002035T5 (en) | 2006-09-06 | 2009-07-30 | Kabushiki Kaisha Yaskawa Denki, Kitakyushu | Motor controller |
| US7957143B2 (en) | 2006-09-06 | 2011-06-07 | Kabushiki Kaisha Yaskawa Denki | Motor controller |
| DE112007002094T5 (en) | 2006-09-07 | 2009-07-16 | Kabushiki Kaisha Yaskawa Denki, Kitakyushu | Motor controller |
| US7944695B2 (en) | 2006-09-07 | 2011-05-17 | Kabushiki Kaisha Yaskawa Denki | Motor controller |
| DE112007002126T5 (en) | 2006-09-13 | 2009-07-23 | K.K. Yaskawa Denki, Kitakyushu | Motor controller |
| US7817421B2 (en) | 2006-09-13 | 2010-10-19 | Kabushiki Kaisha Yaskawa Denki | Motor controller |
| WO2021193882A1 (en) * | 2020-03-27 | 2021-09-30 | 株式会社ソニー・インタラクティブエンタテインメント | Electronic apparatus |
| JPWO2021193882A1 (en) * | 2020-03-27 | 2021-09-30 | ||
| US12075593B2 (en) | 2020-03-27 | 2024-08-27 | Sony Interactive Entertainment Inc. | Electronic apparatus |
| JP7542608B2 (en) | 2020-03-27 | 2024-08-30 | 株式会社ソニー・インタラクティブエンタテインメント | Electronics |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4269103B2 (en) | 2009-05-27 |
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