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JP2004281994A - Package for storing light emitting element and light emitting device - Google Patents

Package for storing light emitting element and light emitting device Download PDF

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Publication number
JP2004281994A
JP2004281994A JP2003146633A JP2003146633A JP2004281994A JP 2004281994 A JP2004281994 A JP 2004281994A JP 2003146633 A JP2003146633 A JP 2003146633A JP 2003146633 A JP2003146633 A JP 2003146633A JP 2004281994 A JP2004281994 A JP 2004281994A
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Japan
Prior art keywords
emitting element
light emitting
package
light
insulating base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003146633A
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Japanese (ja)
Inventor
Yoshinori Maekawa
義紀 前川
Sadamu Kajisa
定 加治佐
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Kyocera Corp
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Kyocera Corp
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Priority to JP2003146633A priority Critical patent/JP2004281994A/en
Publication of JP2004281994A publication Critical patent/JP2004281994A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for storing a light emitting element, and a light emitting device which can be strongly joined on a wiring conductor of an external electric circuit board and can be easily manufactured with high reliability. <P>SOLUTION: On the topside of a parallelepiped insulating substrate 1, a recess 4 is provided for storing a light emitting element 3 and on the base of the recess 4, a packaging part 2 for the light emitting element 3 and wiring layers 5a, 5b for connecting electrodes of the light emitting element 3 are formed. In notched portions 8a-8d formed in four corners of the insulating substrate to extend vertically, lateral side conductor layers 9a, 9b are formed being electrically connected with the packaging part 2 or with the wiring layers 5a, 5b. In the notched portions 8a-8d, the notched portion on one lateral side of the insulating substrate 1 is formed wider than the notched portions on the other lateral sides. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード等の発光素子を用いた表示装置等に用いられる、発光素子を収納するための発光素子収納用パッケージおよび発光装置に関する。
【０００２】
【従来の技術】
従来、発光ダイオード等の発光素子を収納するための発光素子収納用パッケージ（以下、パッケージともいう）として、セラミック製のパッケージが用いられており、その一例を図１４に示す（例えば、下記の特許文献１参照）。同図に示すように、従来のパッケージは、複数のセラミック層が積層されているとともに上面に凹部２４が形成されている直方体状の絶縁基体の凹部２４の底面の発光素子２３搭載される部位に導体層から成る搭載部２２が設けられた基体２１と、基体２１の搭載部２２およびその周辺から基体２１の下面に形成され、搭載部２２に一方が電気的に接続された一対の配線層２５とから主に構成されている。
【０００３】
そして、搭載部２２上に発光素子２３を導電性接着剤、半田等を介して載置固定するとともに、発光素子２３の電極と一対の配線層２５の他方とをボンディングワイヤ２６を介して電気的に接続し、しかる後、基体２１の凹部２４内に樹脂（透明樹脂）を充填して発光素子２３を封止することによって、発光装置が作製される。
【０００４】
また、凹部２４の内面で発光素子２３の光を反射させてパッケージの上方に光を放射させるために、凹部２４の内面にニッケル（Ｎｉ）めっき層や金（Ａｕ）めっき金属層を表面に有するメタライズ金属層からなる金属層２７を被着させていることもある。
【０００５】
また、上記のパッケージはセラミックグリーンシート積層法により以下のようにして製作される。まず、基体２１の搭載部２２（搭載部２２から下側）を形成するためのセラミックグリーンシート（以下、グリーンシートともいう）と、基体２１の凹部２４を形成するためのグリーンシートとを準備し、これらのグリーンシートに配線層２５を導出させるための貫通孔や凹部２４となる貫通穴を打ち抜き法で形成する。
【０００６】
次に、搭載部２２を形成するためのグリーンシートの積層体Ａの貫通孔および所定の部位にメタライズ層から成る配線層を形成するための導体ペーストをスクリーン印刷法等で印刷塗布し、また凹部２４の内面にメタライズ金属層を被着する場合、凹部２４を形成するためのグリーンシートの積層体Ｂの貫通穴内面にメタライズ金属層形成用の導体ペーストをスクリーン印刷法等で印刷塗布する。
【０００７】
次に、積層体Ａと積層体Ｂとを重ねて接着して基体２１を形成するための積層体とし、これを所定寸法に切断して成形体となし、高温（１６００℃程度）で焼成して焼結体となす。その後、配線層およびメタライズ金属層の露出表面にニッケル，金，パラジウム，白金等の金属から成るめっき金属層を無電解めっき法や電解めっき法により被着させることによって、パッケージが製作される。
【０００８】
このようなパッケージは、その製造工程において、パッケージ１個の形状が非常に小型で取り扱いが困難であることから、取り扱いを容易とするために、また多数の小型のパッケージを同時に効率よく製造するために、グリーンシート上に複数のパッケージが縦横に配列するように貫通孔を形成して導体ペーストを印刷し、これらのグリーンシートを積層した積層体に分割溝を形成し、これを焼結体とする、いわゆる多数個取り用の基板を作製した後、分割溝に沿って分割して個々のパッケージを得るという方法で作製されることが多い。
【０００９】
また、発光装置が携帯電話のバックライト等として用いられる場合、その側面をプリント配線基板の主面に略平行とし、その側面を外部電気回路基板の主面に接合して実装（側面実装）する場合がある。このような側面実装する場合において、外部電気回路基板との接合を強固にするために、絶縁基体２１の側面に配線層２５を形成する必要がある。配線層２５を絶縁基体２１の側面に形成する方法として、絶縁基体２１の側面に配線層２５となる導体ペーストを印刷塗布して形成する方法や、絶縁基体２１の角部に切欠き部を形成してその側面に配線層２５を形成する方法等がある。
【００１０】
【特許文献１】
特開２００２−２３２０１７号公報
【００１１】
【発明が解決しようとする課題】
しかしながら、上記従来のパッケージにおいては、絶縁基体２１の側面に配線層２５となる導体ペーストを印刷塗布して形成する方法は、個々の絶縁基体２１の側面に導体ペーストを印刷塗布するので、工程が煩雑になりやすいという問題点を有していた。
【００１２】
また、絶縁基体２１の角部に円弧状の切欠き部を形成してその側面に配線層２５を形成する方法では、外部電気回路基板との接合強度を向上するために、４つの角部に広領域に切欠き部を形成すると、絶縁基体２１の機械的強度が低下したり、凹部２４の領域が小さくなってしまい、また、絶縁基体２１の機械的強度を向上させたり、凹部２４の搭載領域を確保しようとすると、パッケージが大型化するという問題点を有していた。
【００１３】
従って、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、外部電気回路基板の配線導体に強固に接合することができ、信頼性が高いとともに、簡便に作製することができる発光素子収納用パッケージおよび発光装置を提供することにある。
【００１４】
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、直方体状の絶縁基体の上面に発光素子を収容するための凹部が設けられ、該凹部の底面に前記発光素子が搭載される搭載部および前記発光素子の電極が接続される配線層が形成されているとともに、前記絶縁基体の４つの角部に上下方向に延びるように形成された切欠き部に前記搭載部または前記配線層と電気的に接続された側面導体層が形成されている発光素子収納用パッケージであって、前記切欠き部は、前記絶縁基体の一側面の両端にあるものが他側面の両端にあるものよりも幅が大きいことを特徴とする。
【００１５】
本発明の発光素子収納用パッケージによれば、切欠き部は、絶縁基体の一側面の両端にあるものが他側面の両端にあるものよりも幅が大きいことから、絶縁基体の幅の大きい切欠き部を両端に有する一側面を外部電気回路基板の配線導体に載置し、半田等を介して接合することで、幅の大きい切欠き部の側面導体層と外部電気回路基板の配線導体との間に半田等の大きなメニスカスを形成して、半田等による接合面積を大きくでき、外部電気回路基板に強固に接合することができる。
【００１６】
発明の発光装置は、本発明の発光素子収納用パッケージと、前記凹部に収容され搭載されるとともに前記配線層に電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備したことを特徴とする。
【００１７】
本発明の発光装置は、上記の構成により、外部電気回路基板の配線導体に強固に接合することができる信頼性の高いものとなる。
【００１８】
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は、本発明のパッケージについて実施の形態の一例を示す正面図であり、図２は図１のＸ１−Ｘ１線における断面図、図３は図１のＸ２−Ｘ２線における断面図であり、これらの図において、１は絶縁基体、２は発光素子３が搭載される搭載部、３は発光素子、４は発光素子３を収容するための凹部である。
【００１９】
本発明のパッケージは、直方体状の絶縁基体１の上面に発光素子３を収容するための凹部４が設けられ、凹部４の底面に発光素子３が搭載される搭載部２および発光素子３の電極が接続される配線層５ａ，５ｂが形成されているとともに、絶縁基体１の４つの角部に上下方向に延びるように形成された切欠き部８ａ〜８ｄに搭載部２または配線層５ａ，５ｂと電気的に接続された側面導体層９ａ，９ｂが形成されているものであって、切欠き部８ａ〜８ｄは、絶縁基体１の一側面の両端にあるものが他側面の両端にあるものよりも幅が大きい構成である。
【００２０】
本発明の絶縁基体１はセラミックスや樹脂から成り、セラミックスからなる場合、例えば酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス質焼結体等のセラミックスから成る絶縁層を複数層積層してなる直方体状の箱状であり、この上面の中央部に発光素子３を収容するための凹部４が形成されている。
【００２１】
絶縁基体１が酸化アルミニウム質焼結体から成る場合、酸化アルミニウム，酸化珪素，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダー，溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してセラミックグリーンシート（セラミック生シートで、以下、グリーンシートともいう）を得、しかる後、グリーンシートに凹部４用の貫通孔を打ち抜き加工で形成し、発光素子３を搭載するためのグリーンシートと凹部４用のグリーンシートとを複数枚積層し、高温（約１６００℃）で焼成し一体化することで形成される。
【００２２】
また、凹部４の底面には発光素子３を搭載するための導体層から成る搭載部２が形成されており、搭載部２はタングステン（Ｗ），モリブデン（Ｍｏ），銅（Ｃｕ），銀（Ａｇ）等の金属粉末のメタライズ層から成っている。
【００２３】
また、絶縁基体１は、搭載部２およびその周辺から絶縁基体１の側面に形成された側面導体層９ａ，９ｂに電気的に接続された配線層５ａ，５ｂが被着形成されている。配線層５ａ，５ｂは、ＷやＭｏ等の金属粉末のメタライズ層から成り、凹部４に収容する発光素子３を外部に電気的に接続するための導電路である。
そして、搭載部２には発光ダイオード（ＬＥＤ），半導体レーザ（ＬＤ）等の発光素子３が金（Ａｕ）−シリコン（Ｓｉ）合金やＡｇ−エポキシ樹脂等の導電性接合材により固着されるとともに、配線層５ｂには発光素子３の電極がボンディングワイヤ６を介して電気的に接続されている。また、発光素子３は搭載部２および配線層５ｂにフリップチップ実装により接続されても構わない。
【００２４】
配線層５ａ，５ｂは、例えばＷやＭｏ等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た導体ペーストを絶縁基体１となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって、絶縁基体１の所定位置に被着形成される。
【００２５】
なお、配線層５ａ，５ｂおよび搭載部２の露出する表面に、ニッケル（Ｎｉ），金（Ａｕ），Ａｇ等の耐蝕性に優れる金属を１〜２０μｍ程度の厚みで被着させておくのがよく、配線層５ａ，５ｂおよび搭載部２が酸化腐蝕するのを有効に防止できるとともに、搭載部２と発光素子３との固着および配線層５ｂとボンディングワイヤ６との接合を強固にすることができる。従って、配線層５ａ，５ｂおよび搭載部２の露出表面には、厚さ１〜１０μｍ程度のＮｉめっき層と厚さ０．１〜３μｍ程度のＡｕめっき層またはＡｇめっき層とが、電解めっき法や無電解めっき法により順次被着されていることがより好ましい。
【００２６】
また、凹部４の内周面にはメタライズ金属層および発光素子３が発光する光に対する反射率が８０％以上であるめっき金属層を被着した金属層７が形成されていることが好ましい。この金属層７は、例えば、ＷやＭｏ等からなるメタライズ金属層上にＮｉ，Ａｕ，Ａｇ等のめっき金属層を被着させてなり、これにより発光素子３が発光する光に対する反射率を８０％以上とすることができる。発光素子３が発光する光に対する反射率が８０％未満であると、凹部４に収容された発光素子３が発光する光を良好に反射することが困難となる。
【００２７】
また、凹部４の内周面は、傾斜面となっているとともに凹部４の底面から絶縁基体１の上面に向けて３５〜７０°の角度で外側に広がっていることが好ましい。角度θが７０°を超えると、凹部４内に収容された発光素子３が発光する光を外部に対して良好に反射することが困難となる傾向にある。一方、角度θが３５°未満であると、凹部４の内周面をそのような角度で安定かつ効率良く形成することが困難となる傾向にあるとともに、パッケージが大型化してしまう。
【００２８】
また、凹部４の内周面の金属層７の表面の算術平均粗さはＲａは１〜３μｍが好ましい。１μｍ未満であると、凹部４内に収容された発光素子３が発光する光を均一に反射させることが難しくなり、反射する光の強さに偏りが発生し易くなる。３μｍを超えると、凹部４内に収容された発光素子３が発光する光が散乱し、反射光を高い反射率で外部に均一に放射することが困難になる。
【００２９】
また凹部４は、その横断面形状は円形状、楕円形状、長円形状、四角形状等の種々の形状とし得るが、円形状であることが好ましい。この場合、凹部４に収容された発光素子３が発光する光を、凹部４の内周面の金属層７表面のめっき層でパッケージの上方に満遍なく反射させて外部に極めて均一に放射することができるという利点がある。
【００３０】
また、絶縁基体１の４つの角部に上下方向に延びるように切欠き部８ａ〜８ｄが形成されており、切欠き部８ａ〜８ｄには、それぞれ搭載部２および配線層５ａ，５ｂと電気的に接続された側面導体層９ａ，９ｂが形成されている。そして、本発明においては、絶縁基体１の一側面の両端にある切欠き部８ａ，８ｂが他側面の両端にある切欠き部８ｃ，８ｄよりも幅が大きく形成されている。
【００３１】
これにより、切欠き部８ａ，８ｂを両端に有する一側面を外部電気回路基板の配線導体に載置し、半田等を介して接合することで、幅の大きい切欠き部８ａ，８ｂの側面導体層９ａ，９ｂと外部電気回路基板の配線導体との間に半田等の大きなメニスカスを形成して、半田等による接合面積を大きくでき、外部電気回路基板に強固に接合することができる。
【００３２】
これらの側面導体層９ａ，９ｂは、ＷやＭｏ等の金属粉末のメタライズ層から成り、凹部４に収容する発光素子３を外部に電気的に接続するための導電路である。側面導体層９ａ，９ｂが外部電気回路基板の配線導体に接続されることで、搭載部２および配線層５ａ，５ｂを介して発光素子３の各電極と電気的に接続され、発光素子３へ電力や駆動信号が供給される。
【００３３】
そして、側面導体層９ａ，９ｂは、ＷやＭｏ等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た導体ペーストを絶縁基体１となるグリーンシートの切欠き部８ａ〜８ｄの位置にスクリーン印刷法により所定パターンに印刷塗布しておくことによって、切欠き部８ａ〜８ｄの所定位置に被着される。
【００３４】
また、側面導体層９ａ，９ｂの露出する表面に、Ｎｉ，Ａｕ，Ａｇ等の耐食性に優れる金属を１〜２０μｍ程度の厚みで被着させておくのが良く、側面導体層９ａ，９ｂが酸化腐食するのを有効に防止できるとともに、側面導体層９ａ，９ｂと外部電気回路回路基板の配線導体との接合を強固にすることができる。従って、側面導体層９ａ，９ｂの露出表面には、厚さ１〜１０μｍ程度のＮｉめっき層と厚さ０．１〜３μｍ程度のＡｕめっき層またはＡｇめっき層とが、電界めっき法や無電解めっき法により順次被着されていることがより好ましい。
【００３５】
そして、このような切欠き部８ａ〜８ｄが形成されたパッケージを製作する場合、例えば図１のパッケージを製作する場合について、図４に従って説明する。
セラミック層１ａ，１ｂを形成するためのグリーンシート１１ａ，１１ｂは、例えば絶縁基体１が酸化アルミニウム質焼結体（アルミナセラミックス）から成る場合、酸化アルミニウム，酸化珪素，酸化カルシウム，酸化マグネシウム等のセラミック原料粉末に適当な有機バインダー，溶剤，可塑剤，分散剤等を添加混合して泥漿状となし、これをドクターブレード法等のシート成形技術によって所定厚みのシート状とすることにより製作される。
【００３６】
次に、図４（ａ）に示すように、グリーンシート１１ａに凹部４を形成するための貫通孔１２を金型等で打ち抜いて形成し、グリーンシート１１ｂに配線層５ａ，５ｂを絶縁基体１の搭載部２から下面に導出させるための貫通孔を打ち抜いた後、グリーンシート１１ｂの貫通孔内またはその上下面に、配線層５ａ，５ｂおよび搭載部２を形成するための導体ペーストをスクリーン印刷法で所定パターンに印刷塗布する。
【００３７】
次に、図４（ｂ）に示すように、グリーンシート１１ａに長円形状の貫通孔１３ａを金型等で打ち抜いて形成した後、貫通孔１２の内面に金属層７を形成するための導体ペーストおよび貫通孔１３ａの内面に内面導体層１４ａを形成するための導体ペーストをそれぞれ所定パターンに印刷塗布する。同様に、グリーンシート１１ｂに長円形状の貫通孔１３ｂを金型等で打ち抜いて形成した後、貫通孔１３ｂの内面に内面導体層１４ｂを形成するための導体ペーストを所定パターンに印刷塗布する。
【００３８】
次に、図４（ｃ）に示すように、グリーンシート１１ａ，１１ｂを積層することで、貫通孔１３ａ，１３ｂおよび内面導体層１４ａ，１４ｂを重ねて成る貫通孔１３および内面導体層１４、凹部４が形成されたグリーンシート積層体１１が形成される。このグリーンシート積層体１１に、絶縁基体１となる領域を個々に区切るように行列状に並んだ複数の貫通孔１３および内面導体層１４を縦横に跨る分割線であって、切欠き部８ａ〜８ｄおよび側面導体層９ａ，９ｂを形成するための分割溝１５を、切欠き部８ａ〜８ｄが絶縁基体１の一側面にある切欠き部８ａ，８ｂが他方にある切欠き部８ｃ，８ｄよりも幅が大きくなるように形成する。その後、グリーンシート積層体１１およびこれに塗布された導体ペースト層を高温（約１６００℃程度）で焼成することによって、セラミック層１ａ，１ｂからなる焼結体を得、この焼結体の導電層の露出表面に電解めっき法や無電解めっき法によりニッケル，金，白金，パラジウム等のめっき金属層を被着し、これを分割溝１５に沿って個々に分割することによって、絶縁基体１の４つの角部に上下面間にわたって切欠き部８ａ〜８ｄおよび側面導体層９ａ，９ｂが形成され、縁基体１の一側面にある切欠き部８ａ，８ｂが他方にある切欠き部８ｃ，８ｄよりも幅が大きいパッケージが完成する（図４（ｄ））。
【００３９】
上記のような方法で製作することで、切欠き部８ａ〜８ｄおよび側面導体層９ａ，９ｂの形成と、載置部２、配線層５ａ，５ｂ、金属層７および側面導体層９ａ，９ｂへのめっき層の被着も一括的に行うことができ、簡便に製作することができる。
【００４０】
また、図４（ａ），（ｂ）の方法において、例えば、図４（ｂ）の工程を経た後に図４（ａ）の工程を行なっても良く、グリーンシート１１ａに貫通孔１２と貫通孔１３ａとを金型等で同時に打ち抜いて形成したり、グリーンシート１１ｂに配線層５ａ，５ｂを絶縁基体１の搭載部２から下面に導出させるための貫通孔と貫通孔１３ｂとを金型等で同時に打ち抜いて形成したりする方法でも良く、この場合も簡便に製作することができる。
【００４１】
また、側面導体層９の形成方法としては、グリーンシート１１ａ，１１ｂに貫通孔１３ａ，１３ｂをそれぞれ形成した後、貫通孔１３ａ，１３ｂに導体ペーストを充填させた後、貫通孔１３ａ，１３ｂに充填した導体ペーストの一部を金型等で打ち抜いたり、レーザ光等で打ち抜くことで側面導体層９を形成しても構わない。
【００４２】
また、グリーンシート１１ａ，１１ｂを積層し、グリーンシート積層体１１を形成した後に貫通孔１３を一括して打ち抜いて形成して側面導体層９ａ，９ｂを形成する方法を用いても構わない。
【００４３】
また、グリーンシート積層体１１に分割溝１５を形成せずに焼結し、焼結体の導電層の露出表面にめっき金属層を被着した後、スライシング法等を用いて分割して、パッケージとして完成させることもできる。
【００４４】
また、図５，図６は本発明のパッケージについて実施の形態の他の例を示すものであり、図５は、図１のＸ１−Ｘ１線における断面図であり、図６は、図１のＸ２−Ｘ２線における断面図である。図５，図６に示すように、配線層５ａ，５ｂは、凹部４の底面から絶縁基体１の下面に向けて絶縁基体１内部の途中まで導出され、そこから絶縁基体１の側面の切欠き部８ａ〜８ｄに延出されて側面導体層９ａ，９ｂに電気的に接続されていても良い。
【００４５】
また、図７，図８は本発明のパッケージについて実施の形態の他の例を示すものであり、図７はパッケージの正面図、図８は図７のＸ−Ｘ線における断面図である。これらの図に示すように、搭載部２および導体層５ａ，５ｂを凹部４の底面から絶縁基体１の側面に延出させて側面導体層９ａ，９ｂに電気的に接続しても良い。
【００４６】
また、図９に示すように、側面導体９ａ，９ｂと電気的に接続された配線層５ａ，５ｂを絶縁基体１の上面および／または下面に延出させても良い。
【００４７】
また、切欠き部８ａ〜８ｄは、セラミック層１ａ，１ｂにおいて横断面における幅や大きさが異なっていてもよく、またセラミック層１ａ，１ｂのどちらか一方に形成されていても良い。また、切欠き部８ａ〜８ｄは、セラミック層１ａ，１ｂに形成されて絶縁基体１の上下面間にわたって形成されていてもよい。図１０は、セラミック層１ｂのみに切欠き部８ａ〜８ｄを形成した例の断面図である。また、同図に示すように、切欠き部８ａ〜８ｄの底面に配線層５ａ，５ｂを延出させても良い。
【００４８】
また、図１においては、凹部４が絶縁基体１の上面に中央部に形成されて、凹部４と切欠き部８ａ，８ｂとの間の距離が凹部４と切欠き部８ｃ，８ｄとの間の距離と異なっているが、図１１に示すように、凹部４と切欠き部８ａ，８ｂとの間の距離が凹部４と切欠き部８ｃ，８ｄとの間の距離と同じになるようにしてもよい。この場合、多数個取り配線基板において凹部４を切欠き部８ａ〜８ｄとなる貫通孔同士の間の中間に形成し、切欠き部８ａ，８ｂの幅と切欠き部８ｃ，８ｄの幅とが異なるように分割することで、図１１のようにすることができる。
【００４９】
また、切欠き部８ａ〜８ｄとなる貫通孔１３は、開口形状が図４のような長円形状に限らず、円形状、楕円形状、四角形状であっても良く、図１２は四角形状の貫通孔１３から四角形状の切欠き部８ａ〜８ｄを形成した例である。
【００５０】
また、図１３は凹部４の横断面形状が円形状である場合の正面図である。
【００５１】
また、本発明の発光装置は、本発明の発光素子収納用パッケージと、凹部４に収容され搭載されるとともに配線層５ａ，５ｂに電気的に接続された発光素子３と、発光素子３を覆う透明樹脂とを具備している。
【００５２】
本発明の発光装置は、上記の構成により、外部電気回路基板の配線導体に強固に接合することができる信頼性の高いものとなる。
【００５３】
なお、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。例えば、図１５のパッケージの断面図、図１５のパッケージのＸ１−Ｘ１線における断面図である図１６、図１５のパッケージのＸ２−Ｘ２線における断面図である図１７に示すように、搭載部２を導体層として形成せずに、発光素子３を凹部４の底面に直接搭載し、その周囲に発光素子３の電極と電気的に接続される配線層５ａ，５ｂを形成してもよい。この場合、発光素子３が搭載部２に搭載されるとともに、発光素子３の電極と配線層５ａ，５ｂとがボンディングワイヤ６ａ，６ｂ等を介して、電気的に接続されることとなる。
【００５４】
【発明の効果】
本発明の発光素子収納用パッケージは、絶縁基体の４つの角部に上下方向に延びるように形成された形成された切欠き部は、絶縁基体の一側面の両端にあるものが他側面の両端にあるものよりも幅が大きいことから、絶縁基体の幅の大きい切欠き部を両端に有する一側面を外部電気回路基板の配線導体に載置し、半田等を介して接合することで、幅の大きい切欠き部の側面導体層と外部電気回路基板の配線導体との間に半田等の大きなメニスカスを形成して、半田等による接合面積を大きくでき、外部電気回路基板に強固に接合することができる。
【００５５】
発明の発光装置は、本発明の発光素子収納用パッケージと、凹部に収容され搭載されるとともに配線層に電気的に接続された発光素子と、発光素子を覆う透明樹脂とを具備したことにより、外部電気回路基板の配線導体に強固に接合することができる信頼性の高いものとなる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージについて実施の形態の一例を示す正面図である。
【図２】図１の発光素子収納用パッケージのＸ１−Ｘ１線における断面図である。
【図３】図１の発光素子収納用パッケージのＸ２−Ｘ２線における断面図である。
【図４】（ａ）〜（ｄ）は図１の発光素子収納用パッケージの各製造工程におけるセラミックグリーンシートの平面図および発光素子収納用パッケージの正面図である。
【図５】本発明の発光素子収納用パッケージについて実施の形態の他の例を示し、図１のＸ１−Ｘ１線における断面図である。
【図６】本発明の発光素子収納用パッケージについて実施の形態の他の例を示し、図１のＸ２−Ｘ２線における断面図である。
【図７】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す正面図である。
【図８】図７の発光素子収納用パッケージのＸ−Ｘ線における断面図である。
【図９】本発明の発光素子収納用パッケージについて実施の形態の他の例を示し、図７のＸ−Ｘ線における断面図である。
【図１０】本発明の発光素子収納用パッケージについて実施の形態の他の例を示し、図７のＸ−Ｘ線における断面図である。
【図１１】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す正面図である。
【図１２】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す正面図である。
【図１３】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す正面図である。
【図１４】従来の発光素子収納用パッケージの断面図である。
【図１５】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す正面図である。
【図１６】図１５の発光素子収納用パッケージのＸ１−Ｘ１線における断面図である。
【図１７】図１５の発光素子収納用パッケージのＸ２−Ｘ２線における断面図である。
【符号の説明】
１：絶縁基体
２：搭載部
３：発光素子
４：凹部
５ａ，５ｂ：配線層
８ａ〜８ｄ：切欠き部
９ａ，９ｂ：側面導体層[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting element housing package for housing a light emitting element and a light emitting device used for a display device or the like using a light emitting element such as a light emitting diode.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also referred to as a package) for housing a light emitting element such as a light emitting diode, and an example thereof is shown in FIG. Reference 1). As shown in FIG. 1, the conventional package has a plurality of ceramic layers stacked and a concave portion 24 formed on the upper surface. A base 21 provided with a mounting portion 22 made of a conductor layer; and a pair of wiring layers 25 formed on the lower surface of the base 21 from the mounting portion 22 of the base 21 and the periphery thereof, and one of which is electrically connected to the mounting portion 22. It is mainly composed of
[0003]
Then, the light emitting element 23 is mounted and fixed on the mounting portion 22 via a conductive adhesive, solder, or the like, and the electrodes of the light emitting element 23 and the other of the pair of wiring layers 25 are electrically connected via the bonding wires 26. Then, a resin (transparent resin) is filled in the concave portion 24 of the base 21 and the light emitting element 23 is sealed, whereby a light emitting device is manufactured.
[0004]
Further, in order to reflect the light of the light emitting element 23 on the inner surface of the concave portion 24 and emit light above the package, a nickel (Ni) plated layer or a gold (Au) plated metal layer is provided on the inner surface of the concave portion 24. A metal layer 27 made of a metallized metal layer may be applied.
[0005]
The above package is manufactured by the ceramic green sheet laminating method as follows. First, a ceramic green sheet (hereinafter, also referred to as a green sheet) for forming the mounting portion 22 (below the mounting portion 22) of the base 21 and a green sheet for forming the concave portion 24 of the base 21 are prepared. Through holes for forming the wiring layers 25 and the recesses 24 are formed in these green sheets by a punching method.
[0006]
Next, a conductor paste for forming a wiring layer made of a metallized layer is printed and applied to the through-holes and predetermined portions of the green sheet laminate A for forming the mounting portion 22 by a screen printing method or the like. When the metallized metal layer is applied to the inner surface of the green sheet 24, a conductor paste for forming the metallized metal layer is printed and applied to the inner surface of the through-hole of the green sheet laminate B for forming the recess 24 by a screen printing method or the like.
[0007]
Next, the laminate A and the laminate B are overlapped and bonded to form a laminate for forming the base 21, which is cut into a predetermined size to form a molded body, and fired at a high temperature (about 1600 ° C.). To form a sintered body. Thereafter, a package is manufactured by applying a plating metal layer made of a metal such as nickel, gold, palladium, and platinum on the exposed surfaces of the wiring layer and the metallized metal layer by an electroless plating method or an electrolytic plating method.
[0008]
Such a package has a very small size and is difficult to handle in the manufacturing process, so that it is easy to handle and many small packages are simultaneously and efficiently manufactured. On the green sheet, a through hole is formed so that a plurality of packages are arranged vertically and horizontally, a conductor paste is printed, and a division groove is formed in a laminated body in which these green sheets are laminated, and this is formed as a sintered body. In many cases, a so-called multi-piece substrate is manufactured, and then divided along the dividing grooves to obtain individual packages.
[0009]
When the light emitting device is used as a backlight of a mobile phone or the like, its side surface is substantially parallel to the main surface of the printed wiring board, and the side surface is bonded to the main surface of the external electric circuit board and mounted (side mounting). There are cases. In the case of such side mounting, it is necessary to form the wiring layer 25 on the side surface of the insulating base 21 in order to strengthen the bonding with the external electric circuit board. As a method of forming the wiring layer 25 on the side surface of the insulating base 21, a method of printing and applying a conductive paste to be the wiring layer 25 on the side surface of the insulating base 21, or a method of forming a notch at a corner of the insulating base 21. Then, there is a method of forming the wiring layer 25 on the side surface.
[0010]
[Patent Document 1]
JP 2002-232017 A
[Problems to be solved by the invention]
However, in the above-mentioned conventional package, the method of printing and applying a conductive paste to be the wiring layer 25 on the side surface of the insulating base 21 is performed by printing and applying the conductive paste on the side surface of each insulating base 21. There was a problem that it became complicated easily.
[0012]
In the method of forming an arc-shaped notch at a corner of the insulating base 21 and forming the wiring layer 25 on the side surface, the four corners are formed to improve the bonding strength with an external electric circuit board. If a notch is formed in a wide area, the mechanical strength of the insulating base 21 is reduced, the area of the recess 24 is reduced, and the mechanical strength of the insulating base 21 is improved. There is a problem that the package becomes large in size to secure the area.
[0013]
Therefore, the present invention has been completed in view of the above-mentioned conventional problems, and an object of the present invention is to make it possible to firmly join to a wiring conductor of an external electric circuit board, to have high reliability, and to make it simple. It is an object of the present invention to provide a light-emitting element storage package and a light-emitting device that can be used.
[0014]
[Means for Solving the Problems]
The light-emitting element housing package of the present invention is provided with a recess for housing the light-emitting element on an upper surface of a rectangular parallelepiped insulating base, a mounting portion on which the light-emitting element is mounted on the bottom of the recess, and an electrode of the light-emitting element And a side surface electrically connected to the mounting portion or the wiring layer at a cutout portion formed at four corners of the insulating base so as to extend in a vertical direction. In the light emitting element housing package in which a conductor layer is formed, the notch has a larger width at both ends of one side of the insulating base than at both ends of the other side. I do.
[0015]
According to the light-emitting element housing package of the present invention, the notch is wider at both ends of one side of the insulating base than at both ends of the other side. One side having the notch at both ends is placed on the wiring conductor of the external electric circuit board and joined via solder or the like, so that the side conductor layer of the wide notch and the wiring conductor of the external electric circuit board can be connected. A large meniscus of solder or the like is formed between them, so that the bonding area of the solder or the like can be increased, and it can be firmly bonded to the external electric circuit board.
[0016]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element housed and mounted in the recess and electrically connected to the wiring layer, and a transparent resin covering the light-emitting element. It is characterized by the following.
[0017]
The light emitting device of the present invention has high reliability that can be firmly joined to the wiring conductor of the external electric circuit board by the above configuration.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. 1 is a front view showing an example of an embodiment of the package of the present invention, FIG. 2 is a cross-sectional view taken along line X1-X1 in FIG. 1, and FIG. 3 is a cross-sectional view taken along line X2-X2 in FIG. In these figures, 1 is an insulating base, 2 is a mounting portion on which the light emitting element 3 is mounted, 3 is a light emitting element, and 4 is a recess for accommodating the light emitting element 3.
[0019]
In the package of the present invention, a concave portion 4 for accommodating the light emitting element 3 is provided on the upper surface of the rectangular parallelepiped insulating base 1, and the mounting portion 2 on which the light emitting element 3 is mounted on the bottom surface of the concave portion 4 and the electrode of the light emitting element 3. Are formed, and the mounting portion 2 or the wiring layers 5a, 5b are formed in notches 8a to 8d formed at four corners of the insulating base 1 so as to extend in the vertical direction. Side conductor layers 9a and 9b electrically connected to the insulating base 1 are formed, and the cutouts 8a to 8d are formed at both ends of one side of the insulating base 1 at both ends of the other side. The configuration is wider than the width.
[0020]
The insulating substrate 1 of the present invention is made of ceramic or resin. When made of ceramic, for example, aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, mullite sintered body, glass ceramic sintered body, etc. It has a rectangular parallelepiped box shape formed by laminating a plurality of insulating layers made of ceramics, and a concave portion 4 for accommodating the light emitting element 3 is formed at the center of the upper surface.
[0021]
When the insulating substrate 1 is made of an aluminum oxide sintered body, an appropriate organic binder, a solvent or the like is added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc., and the mixture is formed into a slurry. It is formed into a sheet by a well-known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (a green ceramic sheet, hereinafter also referred to as a green sheet), and thereafter, a through hole for the recess 4 is punched in the green sheet. It is formed by processing, laminating a plurality of green sheets for mounting the light emitting elements 3 and green sheets for the concave portions 4, and firing and integrating them at a high temperature (about 1600 ° C.).
[0022]
A mounting portion 2 made of a conductor layer for mounting the light emitting element 3 is formed on the bottom surface of the concave portion 4, and the mounting portion 2 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver ( Ag) and other metal powder layers.
[0023]
The insulating base 1 is formed with wiring layers 5a and 5b electrically connected to the side surface conductor layers 9a and 9b formed on the side surface of the insulating base 1 from the mounting portion 2 and its periphery. The wiring layers 5a and 5b are formed of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 housed in the recess 4 to the outside.
A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 2 by a conductive bonding material such as a gold (Au) -silicon (Si) alloy or an Ag-epoxy resin. The electrode of the light emitting element 3 is electrically connected to the wiring layer 5b via the bonding wire 6. Further, the light emitting element 3 may be connected to the mounting section 2 and the wiring layer 5b by flip chip mounting.
[0024]
The wiring layers 5a and 5b are printed and coated in a predetermined pattern by a screen printing method in advance on a green sheet serving as the insulating substrate 1 with a conductive paste obtained by adding a suitable organic solvent and a solvent to a metal powder such as W or Mo. By doing so, it is adhered and formed at a predetermined position on the insulating base 1.
[0025]
It is preferable that a metal having excellent corrosion resistance, such as nickel (Ni), gold (Au), or Ag, be applied to the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2 in a thickness of about 1 to 20 μm. In addition, it is possible to effectively prevent the wiring layers 5a and 5b and the mounting portion 2 from being oxidized and corroded, and to firmly bond the mounting portion 2 to the light emitting element 3 and bond the wiring layer 5b and the bonding wire 6. it can. Therefore, on the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by an electrolytic plating method. More preferably, they are sequentially applied by an electroless plating method.
[0026]
In addition, it is preferable that a metal layer 7 coated with a metallized metal layer and a plated metal layer having a reflectance of 80% or more with respect to light emitted by the light emitting element 3 is formed on the inner peripheral surface of the recess 4. The metal layer 7 is formed by depositing a plated metal layer of Ni, Au, Ag or the like on a metallized metal layer made of, for example, W or Mo, so that the light emitting element 3 has a reflectivity of 80 for light emitted. % Or more. If the reflectance for the light emitted by the light emitting element 3 is less than 80%, it becomes difficult to satisfactorily reflect the light emitted by the light emitting element 3 accommodated in the recess 4.
[0027]
It is preferable that the inner peripheral surface of the concave portion 4 is an inclined surface and extends outward at an angle of 35 to 70 ° from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1. If the angle θ exceeds 70 °, it tends to be difficult to favorably reflect light emitted by the light emitting element 3 housed in the recess 4 to the outside. On the other hand, if the angle θ is less than 35 °, it tends to be difficult to form the inner peripheral surface of the concave portion 4 stably and efficiently at such an angle, and the package becomes large.
[0028]
The arithmetic average roughness Ra of the surface of the metal layer 7 on the inner peripheral surface of the concave portion 4 is preferably Ra of 1 to 3 μm. When the thickness is less than 1 μm, it is difficult to uniformly reflect the light emitted from the light emitting element 3 accommodated in the recess 4, and the intensity of the reflected light tends to be uneven. When the thickness exceeds 3 μm, the light emitted from the light emitting element 3 accommodated in the concave portion 4 is scattered, and it is difficult to uniformly emit the reflected light to the outside with a high reflectance.
[0029]
Further, the cross section of the recess 4 may be various shapes such as a circular shape, an elliptical shape, an elliptical shape, and a square shape, but is preferably a circular shape. In this case, the light emitted by the light emitting element 3 housed in the concave portion 4 can be uniformly reflected above the package by the plating layer on the surface of the metal layer 7 on the inner peripheral surface of the concave portion 4 and emitted to the outside very uniformly. There is an advantage that you can.
[0030]
Notches 8a to 8d are formed at four corners of the insulating base 1 so as to extend in the vertical direction, and the notches 8a to 8d are respectively provided with the mounting portion 2 and the wiring layers 5a and 5b. Side conductor layers 9a and 9b which are electrically connected are formed. In the present invention, the notches 8a and 8b at both ends of one side of the insulating base 1 are formed to be wider than the notches 8c and 8d at both ends of the other side.
[0031]
Thereby, one side surface having the notches 8a and 8b at both ends is placed on the wiring conductor of the external electric circuit board and joined via solder or the like, so that the side conductors of the wide notches 8a and 8b are formed. A large meniscus of solder or the like is formed between the layers 9a and 9b and the wiring conductors of the external electric circuit board, so that the bonding area of the solder or the like can be increased and the semiconductor device can be firmly joined to the external electric circuit board.
[0032]
These side conductor layers 9a and 9b are formed of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 housed in the recess 4 to the outside. By connecting the side conductor layers 9a and 9b to the wiring conductors of the external electric circuit board, the side conductor layers 9a and 9b are electrically connected to the respective electrodes of the light emitting element 3 via the mounting portion 2 and the wiring layers 5a and 5b, and to the light emitting element 3. Power and drive signals are supplied.
[0033]
The side surface conductor layers 9a and 9b are formed by adding a suitable organic solvent and a solvent to a metal powder such as W or Mo and mixing the conductor paste obtained therefrom with the cutout portions 8a to 8d of the green sheet serving as the insulating base 1. Is printed and applied in a predetermined pattern by a screen printing method, thereby being attached to predetermined positions of the notches 8a to 8d.
[0034]
Further, a metal having excellent corrosion resistance, such as Ni, Au, or Ag, having a thickness of about 1 to 20 μm is preferably applied to the exposed surfaces of the side conductor layers 9a and 9b, and the side conductor layers 9a and 9b are oxidized. Corrosion can be effectively prevented, and the bonding between the side conductor layers 9a and 9b and the wiring conductor of the external electric circuit board can be strengthened. Therefore, on the exposed surfaces of the side conductor layers 9a and 9b, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by an electroplating method or an electroless plating method. More preferably, they are sequentially applied by a plating method.
[0035]
A case in which a package in which such notches 8a to 8d are formed, for example, a case in which the package in FIG. 1 is manufactured will be described with reference to FIG.
The green sheets 11a and 11b for forming the ceramic layers 1a and 1b are made of ceramic such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide when the insulating base 1 is made of an aluminum oxide sintered body (alumina ceramic). An appropriate organic binder, solvent, plasticizer, dispersant, and the like are added to the raw material powder and mixed to form a slurry, which is formed into a sheet having a predetermined thickness by a sheet forming technique such as a doctor blade method.
[0036]
Next, as shown in FIG. 4A, a through hole 12 for forming the concave portion 4 is formed in the green sheet 11a by punching with a mold or the like, and the wiring layers 5a, 5b are formed in the green sheet 11b. After punching a through hole for leading out from the mounting portion 2 to the lower surface, a conductor paste for forming the wiring layers 5a, 5b and the mounting portion 2 is screen-printed in the through hole of the green sheet 11b or on the upper and lower surfaces thereof. Printing and applying in a predetermined pattern by the method.
[0037]
Next, as shown in FIG. 4B, after forming an elliptical through-hole 13a in the green sheet 11a by punching with a mold or the like, a conductor for forming the metal layer 7 on the inner surface of the through-hole 12 is formed. A paste and a conductor paste for forming the inner conductor layer 14a on the inner surface of the through hole 13a are applied by printing in a predetermined pattern. Similarly, after forming an elliptical through hole 13b in the green sheet 11b by punching with a mold or the like, a conductor paste for forming the inner conductor layer 14b is printed and applied on the inner surface of the through hole 13b in a predetermined pattern.
[0038]
Next, as shown in FIG. 4C, by laminating the green sheets 11a and 11b, the through holes 13 and the inner conductor layer 14, which are formed by overlapping the through holes 13a and 13b and the inner conductor layers 14a and 14b, The green sheet laminate 11 on which the substrate 4 is formed is formed. In the green sheet laminate 11, a plurality of notch portions 8a to 8 are formed by dividing the plurality of through-holes 13 and the inner conductor layer 14 arranged in a matrix so as to individually divide the region serving as the insulating substrate 1. 8d and the dividing grooves 15 for forming the side conductor layers 9a and 9b are separated from the notches 8c and 8d in which the notches 8a and 8b on one side of the insulating base 1 have the notches 8a to 8d on the other side. Are also formed to have a large width. Thereafter, the green sheet laminate 11 and the conductive paste layer applied thereto are fired at a high temperature (about 1600 ° C.) to obtain a sintered body composed of the ceramic layers 1a and 1b. A plating metal layer made of nickel, gold, platinum, palladium or the like is applied to the exposed surface of the insulating substrate 1 by an electrolytic plating method or an electroless plating method, and the plated metal layer is divided along the dividing grooves 15 to thereby form the insulating substrate 1. Notches 8a to 8d and side conductor layers 9a and 9b are formed at the corners between the upper and lower surfaces, and the notches 8a and 8b on one side of the edge substrate 1 are formed from the notches 8c and 8d on the other side. Thus, a package having a large width is completed (FIG. 4D).
[0039]
By manufacturing in the above-described manner, the notch portions 8a to 8d and the side conductor layers 9a and 9b are formed, and the mounting portion 2, the wiring layers 5a and 5b, the metal layer 7, and the side conductor layers 9a and 9b are formed. Can be applied collectively and can be easily manufactured.
[0040]
In the method of FIGS. 4A and 4B, for example, the step of FIG. 4A may be performed after the step of FIG. 4B, and the through-hole 12 and the through-hole may be formed in the green sheet 11a. 13a and a through-hole for leading the wiring layers 5a and 5b from the mounting portion 2 of the insulating base 1 to the lower surface of the green sheet 11b. A method of punching and forming at the same time may be used, and also in this case, it can be easily manufactured.
[0041]
The side conductor layer 9 is formed by forming through holes 13a and 13b in the green sheets 11a and 11b, filling the through holes 13a and 13b with a conductive paste, and then filling the through holes 13a and 13b. The side conductor layer 9 may be formed by punching out a part of the conductive paste thus obtained using a mold or the like, or punching out using a laser beam or the like.
[0042]
Alternatively, a method may be used in which the green sheets 11a and 11b are stacked, the green sheet laminate 11 is formed, and then the through holes 13 are punched out and formed at a time to form the side conductor layers 9a and 9b.
[0043]
Further, the green sheet laminate 11 is sintered without forming the dividing grooves 15, a plated metal layer is applied to the exposed surface of the conductive layer of the sintered body, and then divided by using a slicing method or the like, and the package is divided. It can also be completed as
[0044]
5 and 6 show another example of the embodiment of the package of the present invention. FIG. 5 is a cross-sectional view taken along line X1-X1 of FIG. 1, and FIG. It is sectional drawing in the X2-X2 line. As shown in FIGS. 5 and 6, the wiring layers 5 a and 5 b are led out from the bottom surface of the recess 4 toward the lower surface of the insulating base 1 to a part of the inside of the insulating base 1, and the notches on the side surfaces of the insulating base 1 therefrom. It may be extended to the parts 8a to 8d and electrically connected to the side conductor layers 9a and 9b.
[0045]
7 and 8 show another example of the embodiment of the package of the present invention. FIG. 7 is a front view of the package, and FIG. 8 is a sectional view taken along line XX of FIG. As shown in these figures, the mounting portion 2 and the conductor layers 5a and 5b may extend from the bottom surface of the concave portion 4 to the side surface of the insulating base 1 and may be electrically connected to the side conductor layers 9a and 9b.
[0046]
9, the wiring layers 5a and 5b electrically connected to the side conductors 9a and 9b may extend to the upper surface and / or lower surface of the insulating base 1.
[0047]
The cutouts 8a to 8d may have different widths and sizes in the cross section in the ceramic layers 1a and 1b, or may be formed in one of the ceramic layers 1a and 1b. Notches 8a to 8d may be formed in ceramic layers 1a and 1b and formed between upper and lower surfaces of insulating base 1. FIG. 10 is a cross-sectional view of an example in which cutout portions 8a to 8d are formed only in ceramic layer 1b. In addition, as shown in the figure, the wiring layers 5a and 5b may be extended to the bottom surfaces of the notches 8a to 8d.
[0048]
In FIG. 1, a concave portion 4 is formed at the center of the upper surface of the insulating base 1, and the distance between the concave portion 4 and the cutout portions 8a and 8b is between the concave portion 4 and the cutout portions 8c and 8d. However, as shown in FIG. 11, the distance between the recess 4 and the notches 8a and 8b is made equal to the distance between the recess 4 and the notches 8c and 8d. You may. In this case, in the multi-cavity wiring board, the concave portion 4 is formed in the middle between the through holes that become the cutout portions 8a to 8d, and the width of the cutout portions 8a and 8b and the width of the cutout portions 8c and 8d are reduced. By dividing the image differently, the image can be made as shown in FIG.
[0049]
Further, the opening shape of the through-holes 13 serving as the notches 8a to 8d is not limited to the elliptical shape as shown in FIG. 4, but may be a circular shape, an elliptical shape, or a square shape. This is an example in which rectangular notches 8a to 8d are formed from the through holes 13.
[0050]
FIG. 13 is a front view when the cross section of the recess 4 is circular.
[0051]
Further, the light emitting device of the present invention covers the light emitting element housing package of the present invention, the light emitting element 3 housed and mounted in the recess 4 and electrically connected to the wiring layers 5a and 5b, and covers the light emitting element 3. And a transparent resin.
[0052]
The light emitting device of the present invention has high reliability that can be firmly joined to the wiring conductor of the external electric circuit board by the above configuration.
[0053]
Note that the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention. For example, as shown in the cross-sectional view of the package of FIG. 15, FIG. 16 which is a cross-sectional view of the package of FIG. 15 taken along line X1-X1, and FIG. 17 which is a cross-sectional view of the package of FIG. Instead of forming the light emitting element 2 as a conductor layer, the light emitting element 3 may be directly mounted on the bottom surface of the concave portion 4 and wiring layers 5a and 5b electrically connected to the electrodes of the light emitting element 3 may be formed therearound. In this case, the light emitting element 3 is mounted on the mounting portion 2, and the electrodes of the light emitting element 3 and the wiring layers 5a, 5b are electrically connected via the bonding wires 6a, 6b and the like.
[0054]
【The invention's effect】
In the light-emitting element housing package of the present invention, the cutouts formed at the four corners of the insulating base so as to extend in the vertical direction are provided at both ends of one side of the insulating base. Since the width is larger than that of the insulating substrate, one side of the insulating base having a notch having a large width at both ends is placed on the wiring conductor of the external electric circuit board, and the width is obtained by joining with solder or the like. Forming a large meniscus of solder etc. between the side conductor layer of the notch with a large notch and the wiring conductor of the external electric circuit board, the joining area by solder etc. can be increased, and it can be firmly joined to the external electric circuit board Can be.
[0055]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element housed and mounted in the recess and electrically connected to the wiring layer, and a transparent resin covering the light-emitting element. It is highly reliable and can be firmly joined to the wiring conductor of the external electric circuit board.
[Brief description of the drawings]
FIG. 1 is a front view showing an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a cross-sectional view taken along line X1-X1 of the light emitting element housing package of FIG.
FIG. 3 is a cross-sectional view of the light emitting element housing package of FIG. 1 taken along line X2-X2.
4 (a) to 4 (d) are a plan view of a ceramic green sheet and a front view of the light emitting element housing package in each manufacturing process of the light emitting element housing package of FIG.
FIG. 5 is a cross-sectional view taken along line X1-X1 of FIG. 1, showing another example of the embodiment of the light-emitting element housing package of the present invention.
FIG. 6 is a cross-sectional view taken along line X2-X2 of FIG. 1, showing another example of the embodiment of the light-emitting element housing package of the present invention.
FIG. 7 is a front view showing another example of the embodiment of the light emitting element housing package of the present invention.
8 is a cross-sectional view of the light emitting element housing package of FIG. 7 taken along line XX.
9 shows another example of the embodiment of the light emitting element housing package of the present invention, and is a cross-sectional view taken along line XX of FIG.
FIG. 10 is a cross-sectional view taken along line XX of FIG. 7, showing another example of the embodiment of the light-emitting element housing package of the present invention.
FIG. 11 is a front view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 12 is a front view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 13 is a front view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 14 is a cross-sectional view of a conventional light emitting element storage package.
FIG. 15 is a front view showing another example of the embodiment of the light emitting element housing package of the present invention.
16 is a cross-sectional view of the light emitting element housing package of FIG. 15 taken along line X1-X1.
17 is a cross-sectional view of the light emitting element housing package of FIG. 15 taken along line X2-X2.
[Explanation of symbols]
1: Insulating base 2: Mounting part 3: Light emitting element 4: Depressions 5a, 5b: Wiring layers 8a to 8d: Notches 9a, 9b: Side conductor layer

Claims (2)

直方体状の絶縁基体の上面に発光素子を収容するための凹部が設けられ、該凹部の底面に発光素子が搭載される搭載部および前記発光素子の電極が接続される配線層が形成されているとともに、前記絶縁基体の４つの角部に上下方向に延びるように形成された切欠き部に前記搭載部または前記配線層と電気的に接続された側面導体層が形成されている発光素子収納用パッケージであって、前記切欠き部は、前記絶縁基体の一側面の両端にあるものが他側面の両端にあるものよりも幅が大きいことを特徴とする発光素子収納用パッケージ。A concave portion for accommodating the light emitting element is provided on the upper surface of the rectangular parallelepiped insulating base, and a mounting portion on which the light emitting element is mounted and a wiring layer to which the electrode of the light emitting element is connected are formed on the bottom surface of the concave portion. And a side conductor layer electrically connected to the mounting portion or the wiring layer is formed in a notch formed at four corners of the insulating base so as to extend in a vertical direction. The package for light-emitting element storage, wherein the notch has a width at one end of one side of the insulating base larger than that at both ends of the other side. 請求項１記載の発光素子収納用パッケージと、前記搭載部に搭載されるとともに前記配線層に電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする発光装置。2. The light-emitting element storage package according to claim 1, comprising: a light-emitting element mounted on the mounting portion and electrically connected to the wiring layer; and a transparent resin covering the light-emitting element. Light emitting device.
JP2003146633A 2003-01-24 2003-05-23 Package for storing light emitting element and light emitting device Pending JP2004281994A (en)

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JP2008147605A (en) * 2006-11-14 2008-06-26 Harison Toshiba Lighting Corp Light-emitting device, method of manufacturing the same and mounting board
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