JP2004079478A - Pattern shaping device, pattern forming device and pattern forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern forming device forming a pattern of a high accuracy in a top face and side face shapes on a substrate. <P>SOLUTION: The pattern forming device 1 is provided with a delivery part 42 delivering a pattern-forming material toward the substrate 9, a curing part 43 curing the delivered pattern-forming material and a roller 53 having a plurality of concave parts, which structure moves relatively to the substrate 9 on a stage 3 by a stage movement mechanism. The concave parts of the roller 53 are formed at a position corresponding to a delivery outlet of the discharging part 42. The pattern-forming material delivered from the delivery part 42 is made a semi-cured state by the curing part 43, and then, a part of the top face and the side faces are shaped to form a partitioning pattern with a high accuracy in shape of the top face and the side faces. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for forming a pattern on a substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, sandblasting (also called photolithography), screen printing, lift-off, and the like have been known as a method for forming a pattern of partition walls and electrodes on a panel used for a plasma display device or an organic EL display device. I have. However, these methods are complicated and cause an increase in production cost. Therefore, in recent years, a method of forming a pattern on a substrate by discharging a paste-like pattern forming material from a discharge portion having fine discharge ports has been proposed.
[0003]
[Problems to be solved by the invention]
By the way, for example, in a glass substrate of a plasma display device, when the height of a formed partition pattern varies, crosstalk occurs between discharge spaces formed by overlapping the glass substrates, When the shape of the pattern (particularly, the width of the upper surface) varies, problems such as unevenness of the displayed image occur.
[0004]
Therefore, in JP-A-10-116557 and JP-A-11-16491, a pattern formed on a substrate is pressed by a platen or a press roll to flatten the upper surface of the pattern and suppress variations in the height direction. A technique for performing this is disclosed. Japanese Patent Application Laid-Open No. 2001-118514 discloses a technique for flattening the upper surface of a pattern by mechanical polishing or chemical mechanical polishing. However, these methods cannot control the width of the upper surface of the pattern, and cannot be used as a method for suppressing unevenness of an image displayed on the display device. In addition, these techniques cannot easily increase the accuracy of the distance between the member that smoothes the upper surface of the pattern and the substrate, and it is difficult to control the absolute height of the pattern relative to the substrate surface. It becomes.
[0005]
On the other hand, Japanese Patent Application Laid-Open No. 8-273538 discloses a method of forming a pattern by pressing a mold corresponding to a pattern shape on a pattern forming material applied on a substrate. There are great restrictions on the materials used, for example, it is difficult to secure a space (so-called escape) for the materials to move.
[0006]
The present invention has been made in view of the above problems, and has as its object to form an appropriate pattern on a substrate.
[0007]
[Means for Solving the Problems]
The invention according to claim 1 is a pattern shaping apparatus for shaping a pattern formed on a substrate, comprising: a holding unit for holding the substrate; and a top surface and a side surface of the pattern formed of a pattern forming material on the substrate. And a shaping mechanism for shaping at least a part of the shape into a predetermined shape.
[0008]
The invention according to claim 2 is the pattern shaping device according to claim 1, wherein the shaping mechanism attaches the concave member corresponding to the predetermined shape and the concave member toward the main surface of the substrate. And a biasing mechanism for biasing.
[0009]
The invention according to claim 3 is the pattern shaping device according to claim 1, wherein the shaping mechanism moves the concave member corresponding to the predetermined shape and the concave member along a main surface of the substrate. And a moving mechanism that moves automatically.
[0010]
According to a fourth aspect of the present invention, in the pattern shaping apparatus according to the second or third aspect, the shaping mechanism further includes a temperature adjusting unit for adjusting the temperature of the concave member.
[0011]
The invention according to claim 5 is a pattern forming apparatus for forming a pattern on a substrate, wherein the discharge unit discharges the pattern forming material toward the substrate, and the discharge unit is moved along the main surface of the substrate. A curing mechanism for sequentially curing the pattern forming material discharged onto the substrate, and a shaping mechanism for shaping the pattern cured by the curing unit.
[0012]
The invention according to claim 6 is the pattern forming apparatus according to claim 5, wherein the shaping mechanism shapes the upper surface and at least a part of the side surface of the pattern into a predetermined shape.
[0013]
According to a seventh aspect of the present invention, in the pattern forming apparatus according to the fifth or sixth aspect, a curing condition of the curing unit can be switched between a plurality of conditions.
[0014]
The invention according to claim 8 is a pattern forming method for forming a pattern on a substrate, comprising: a pattern forming step of forming a pattern on a substrate with a pattern forming material; and at least a part of an upper surface and a side surface of the pattern. To a predetermined shape.
[0015]
According to a ninth aspect of the present invention, in the pattern forming method according to the eighth aspect, the pattern forming step includes discharging the pattern forming material from the discharge portion toward the substrate, and setting the discharge portion to the substrate. A discharging step of relatively moving along the main surface; and a curing step of sequentially curing the pattern forming material discharged on the substrate.
[0016]
According to a tenth aspect of the present invention, there is provided the pattern forming method according to the ninth aspect, wherein the curing condition in the curing step can be switched between a plurality of conditions.
[0017]
According to an eleventh aspect of the present invention, in the pattern forming method according to any one of the eighth to tenth aspects, in the shaping step, the concave member corresponding to the predetermined shape faces the main surface of the substrate. Be energized.
[0018]
According to a twelfth aspect of the present invention, in the pattern forming method according to any one of the eighth to tenth aspects, in the shaping step, the concave member corresponding to the predetermined shape is formed along the main surface of the substrate. Move relatively.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a diagram showing a schematic configuration of a pattern forming apparatus 1 according to a first embodiment of the present invention. The pattern forming apparatus 1 is an apparatus for forming a pattern of partition walls extending in the X direction on a glass substrate (hereinafter, referred to as a “substrate”) 9 of a plasma display device. Through the panel (usually a rear panel) which is an assembly part of the plasma display device.
[0020]
In the pattern forming apparatus 1, a stage moving mechanism 2 is provided on a base 11, and the stage 3 holding the substrate 9 can be moved in the X direction shown in FIG. A frame 12 and a frame 13 are fixed to the base 11 so as to straddle the stage 3. A pattern forming head unit 4 is mounted on the frame 12, and a pattern shaping head unit 5 is mounted on the frame 13.
[0021]
The stage moving mechanism 2 has a structure in which a ball screw 22 is connected to a motor 21, and a nut 23 fixed to the stage 3 is attached to the ball screw 22. A guide rail 24 is fixed above the ball screw 22. When the motor 21 rotates, the stage 3 moves smoothly along the guide rail 24 in the X direction together with the nut 23.
[0022]
The pattern forming head unit 4 includes a paste-like pattern forming material (for example, 1 to 30% of a photoinitiator, 5 to 50% of a binder such as an acrylic monomer, and a plurality of types of low softening point glass frit on a substrate 9). 40 to 90%, and a mixture of a solvent and an additive) and a curing unit 43 that emits ultraviolet light toward the substrate 9. The part 43 is detachably attached to a lower part of the base 41 fixed to the frame 12. The ejection unit 42 has a plurality of ejection ports arranged in the Y direction, and the curing unit 43 emits light toward the substrate 9 on the (−X) side of the ejection unit 42, and outputs light corresponding to each ejection port. A spot is formed on the substrate 9.
[0023]
A supply pipe 422 having a check valve 421 is attached to the discharge section 42, and the supply pipe 422 is branched, and one is connected to a pump 423, and the other is a tank that stores a pattern forming material via a control valve 424. 425. The curing unit 43 is connected via an optical fiber 431 to a light source unit 432 that generates ultraviolet rays.
[0024]
The pattern shaping head unit 5 includes a substantially cylindrical shaping member (hereinafter, referred to as a “roller”) 53 formed of a metal such as aluminum, and a support member 52 that rotatably and detachably supports the roller 53. Then, a support member 52 is attached to a lower portion of the base 51 fixed to the frame 13. The roller 53 is provided with a heater and a temperature measurement unit (for example, a thermocouple), and these are connected to the temperature adjustment unit 54 via the support member 52. Then, the surface temperature of the roller 53 is controlled by controlling the electric power supplied to the heater by the temperature adjusting unit 54 based on a signal from the temperature measuring unit.
[0025]
The motor 21, the pump 423, the control valve 424, the light source unit 432, and the temperature adjusting unit 54 of the stage moving mechanism 2 are connected to the control unit 6. A partition pattern is formed on the substrate 9.
[0026]
FIG. 2 is a diagram showing a state when the roller 53 is viewed from the (−X) side in the (+ X) direction. A plurality of concave portions 531 are formed in the roller 53 along the outer periphery in the Y direction. Near the opening end of the concave portion 531, the width of the concave portion 531 in the Y direction gradually increases toward the outside. I have. That is, the width of the bottom surface of the concave portion 531 is smaller than the width of the opening side. The distance between the centers of the concave portions 531 in the Y direction is equal to the distance between the centers of the discharge ports of the discharge unit 42, and the position of the center of each concave portion 531 corresponds to the position of the center of each discharge port of the discharge unit 42. Roller 53 is supported as described above.
[0027]
FIG. 3 is a diagram showing a flow of an operation in which the pattern forming apparatus 1 forms a partition pattern. When the substrate 9 is carried into the pattern forming apparatus 1, the operator selects curing conditions (ultraviolet radiation conditions in the present embodiment) according to the used pattern forming material and the like (step S11). Note that a plurality of curing conditions are stored in the memory of the control unit 6 in advance. Subsequently, the control unit 6 controls the light source unit 432 according to the selected curing condition, so that the emission of the ultraviolet rays from the curing unit 43 is started (step S12).
[0028]
When the emission of the ultraviolet rays is started, the pattern forming material is discharged from the discharge unit 42 toward the substrate 9 (Step S13). The discharge of the pattern forming material from the discharge unit 42 is performed by the check valve 421, the pump 423, and the control valve 424 shown in FIG. First, the pump 423 performs a suction operation in a state where the control valve 424 is opened under the control of the control unit 6. At this time, since the check valve 421 prevents the backflow of the pattern forming material, the pattern forming material is drawn into the pump 423 from the tank 425. Next, the control valve 424 is closed under the control of the control unit 6, and the pump 423 performs the pushing operation. Thus, the pattern forming material is continuously discharged from the discharge unit 42.
[0029]
When the pattern forming material is discharged, the control unit 6 controls the driving of the motor 21 of the stage moving mechanism 2 so that the surface of the substrate 9 moves in the (−X) direction below the discharging unit 42. Then, the stage 3 is continuously moved (step S14). As a result, as shown in FIG. 4, the pattern forming material 91 discharged from the discharge port 426 of the discharge unit 42 is sequentially deposited on the substrate 9 while the traveling direction of the discharge unit 42 (relative traveling direction with respect to the substrate 9). Ultraviolet rays from the cured portion 43 disposed behind the substrate 9 are irradiated to the pattern forming material 91 on the substrate 9. A photoinitiator that starts curing (crosslinking reaction) by ultraviolet light is added to the pattern forming material, and the curing of the pattern forming material according to the curing conditions selected in step S11 is sequentially performed by the curing unit 43.
[0030]
As the curing conditions, for example, the exposure amount is 100 to 1000 mJ / cm. ² The illuminance is 200 to 1000 mW / cm so that ² Irradiation is performed within 0.1 second to several seconds within 1 second after ejection. As a result, the pattern forming material on the substrate 9 is not deformed by gravity or surface tension, and can be easily deformed by external force. Hereinafter, such a state is referred to as a “semi-cured state”. For example, when a pattern forming material containing a solvent is used, a state in which only the surface is cured and a solvent remains in the inside corresponds to a semi-cured state.
[0031]
Subsequently, the semi-cured pattern forming material 91 relatively moves below the roller 53 and is shaped into a predetermined shape by the roller 53. FIGS. 5A to 5C are diagrams for explaining how the pattern forming material 91 is shaped by the roller 53. FIG. FIG. 5A is a diagram illustrating a state immediately before the roller 53 contacts the pattern forming material 91, and FIG. 5B is a diagram illustrating a state where the roller 53 contacts the pattern forming material 91. FIG. 5C is a diagram illustrating a state immediately after the roller 53 is separated from the pattern forming material 91. 5 (a) and 5 (b) show the cross section of the pattern forming material 91 without parallel diagonal lines, and actually move the roller 53 rolling on the substrate 9 in the normal direction of the substrate 9. In a simplified manner.
[0032]
As shown in FIG. 5A, the pattern forming material 91 is located immediately below the plurality of recesses 531, and the shape and height thereof are slightly varied. When the rollers 53 contact the substrate 9 on both sides of the pattern forming material 91 as shown in FIG. 5B, the upper portion of the pattern forming material 91 becomes the bottom surface of the concave portion 531 (that is, the uppermost portion of the concave portion 531 in FIG. 5B). And the surplus pattern forming material 91 moves to the opening of the recess 531. As a result, as shown in FIG. 5C, the upper surface and the upper surface of the side surface of the pattern forming material 91 are shaped into a shape corresponding to the recess 531.
[0033]
As described above, in the pattern forming apparatus 1, the step of moving the stage 3 (the step from step S14 to the stop of the movement) substantially corresponds to the step of shaping the partition pattern. The step of forming the pattern, the step of bringing the partition pattern into a semi-cured state, and the step of shaping the partition pattern are performed in parallel.
[0034]
As described above, the surface temperature of the roller 53 is controlled to an appropriate temperature (for example, a temperature about 10 degrees higher than room temperature) by the temperature adjustment unit 54, and the pattern forming material 91 is in a semi-cured state. The shaping of the forming material 91 is easily and appropriately performed. Further, as shown in FIG. 4, the roller 53 relatively moves while rolling on the substrate 9 to shape the pattern forming material 91, so that the roller 53 and the pattern forming material 91 can be easily separated. Note that the force by which the roller 53 presses the substrate 9 may be only the own weight of the roller 53, or a pressing force may be separately applied.
[0035]
The discharge and shaping of the pattern forming material are continued, and when the end point of the pattern formation on the substrate 9 reaches just below the discharge unit 42, the discharge of the pattern forming material is stopped (step S15). Thereafter, the substrate 9 is further moved to cure and shape the pattern forming material near the end point, and the movement control of the stage 3 and the emission of ultraviolet rays are stopped (steps S16 and S17).
[0036]
The partition wall pattern formed in the above steps is baked in another step to remove the resin component in the pattern forming material, and the low softening point glass frit is fused to form the partition walls. When a pattern forming material containing a large amount of solvent is used, a step of drying and removing the internal solvent is performed before the firing step.
[0037]
As described above, when forming the partition pattern in the pattern forming apparatus 1, by relatively moving the discharge unit 42, the curing unit 43, and the roller 53 as a shaping member along the main surface of the substrate 9, The pattern forming material 91 discharged toward the substrate 9 is sequentially cured according to an appropriate curing condition selected by the operator, and at least a part of the upper surface and the side surface of the pattern forming material 91 (more precisely, the upper surface side of the side surface). ) Is shaped into a predetermined shape corresponding to the concave portion 531. As a result, in the pattern forming apparatus 1, an appropriate partition pattern in which variations in height and side shape are suppressed is formed on the substrate 9.
[0038]
Further, in the pattern forming apparatus 1, when another type of pattern forming material is used, the curing condition is changed by the operator, and the pattern forming and shaping can be appropriately performed on other materials having different curing characteristics and viscosity characteristics. It is possible to do.
[0039]
Note that the roller 53 may be formed of a material excellent in separating a pattern forming material such as silicon rubber, or another material may be used according to the pattern forming material used. Further, the pattern forming head unit 4 and the pattern shaping head unit 5 having a smaller width in the X direction than the substrate 9 are used, and the pattern forming head unit 4 and the pattern shaping head unit 5 are moved in the Y direction with respect to the substrate 9. By moving these heads in the X direction each time the pattern is formed, a partition pattern may be formed on the entire surface of the substrate 9.
[0040]
FIG. 6 is a diagram illustrating a shaping member 53a according to another example of the pattern shaping head unit 5, and shows a state when viewed in the (+ X) direction from the (−X) side in the pattern forming apparatus 1 of FIG. Is shown. The shaping member 53a has a plurality of concave portions 531a extending in the X direction on the bottom surface, and similarly to the roller 53 in FIG. 2, the distance between the centers of the concave portions 531a and the center of the discharge ports 426 of the discharge portion 42 in the Y direction. And are made equal.
[0041]
FIG. 7 is a diagram illustrating a state in which the pattern forming material 91 discharged from the discharge unit 42 is shaped by the shaping member 53a. As shown in FIG. 7, the ejection portion 42 and the curing portion 43 move relative to the substrate 9 in the (+ X) direction, whereby the ejected pattern forming material 91 is sequentially cured, and subsequently, the shaping member As the 53a relatively moves so as to slide on the substrate 9, the pattern forming material 91 in a semi-cured state is shaped by the shaping member 53a.
[0042]
FIGS. 8A and 8B are views for explaining how the pattern forming material 91 is shaped by the shaping member 53a, and FIG. 8A is a diagram in which the pattern forming material 91 is shaped by the shaping member 53a (shaded parallel lines). (Shown in FIG. 2) just before shaping. FIG. 8A shows a state when viewed from the (+ X) side in the (-X) direction. Since the shaping member 53a slides on the substrate 9 in a direction along the pattern forming material 91, the shaping member 53a passes through the position of the pattern forming material 91 shown in FIG. Is removed by shaping or being deformed and peeled off by the shaping member 53a, and as shown in FIG. 8B, the pattern forming material 91 is shaped into a shape corresponding to the concave portion 531a. The removed matter is collected in front of the relative movement direction of the shaping member 53a, and is collected after the pattern forming operation is completed.
[0043]
As described above, in the pattern forming apparatus 1 having the shaping member 53a, only the periphery of the pattern forming material 91 formed in advance by the ejection unit 42 is removed by the shaping member 53a, so that the pattern forming material 91 is uniformly applied on the substrate 9. It is possible to greatly reduce the generation of the removed material as compared with the case where the pattern is formed by shaving the removed material or the like. As a result, it is possible to prevent the removed material from adversely affecting the pattern shaping, and to form an appropriate partition pattern.
[0044]
Note that, in order to more favorably separate the shaping member 53a and the pattern forming material 91, the shaping member 53a has a boiling point sufficiently higher than the surface temperature of the shaping member 53a (that is, is stable even at a high temperature), and Oil that does not dissolve in the forming material may be applied to the surface of the shaping member 53a. The same pattern shaping as that of the shaping member 53a may be performed by sliding the roller 53 on the substrate 9 without rotating.
[0045]
FIG. 9 is a view showing a pattern shaping head unit 5b of the pattern forming apparatus 1 according to the second embodiment of the present invention. The pattern shaping head 5b has a plate-shaped shaping member 53b and a biasing mechanism 55 provided on the upper part of the base 51. The shaping member 53b and the biasing mechanism 55 are connected via the support member 52. You. Further, the urging mechanism 55 is connected to the control unit 6, and the shaping member 53 b descends toward the main surface of the substrate 9 and is urged by the control unit 6 controlling the urging mechanism 55. Other configurations are the same as those of the first embodiment, and are denoted by the same reference numerals.
[0046]
FIG. 10 is a diagram showing a state when the shaping member 53b is viewed from the (−X) side in the (+ X) direction. The shaping member 53b has a plurality of concave portions 531b on the bottom surface extending in the X direction. Like the roller 53 of FIG. 2, each concave portion 531b is formed so that the opening side is widened. The position and the position of the center of the discharged pattern forming material 91 are made substantially equal. Air holes (not shown) are provided on the bottom surface of each recess 531b.
[0047]
FIG. 11 is a diagram showing a flow of an operation of forming a partition pattern by the pattern forming apparatus 1 having the pattern shaping head unit 5b, and is an operation performed after step S17 in FIG. Therefore, the formed partition pattern is not shaped.) That is, the unshaped pattern forming material 91 is formed on the substrate 9 in steps S11 to S15 in FIG. 3, and in step S16, the substrate 9 is stopped below the pattern shaping head 5b, and the emission of ultraviolet rays is stopped. After (Step S17), the operation shown in FIG. 11 is performed.
[0048]
Subsequent to step S17, in the pattern forming apparatus 1, the urging mechanism 55 lowers the shaping member 53b and urges the shaping member 53b toward the substrate 9 for a predetermined time (step S21). Thereby, at least a part of the upper surface and the side surface (more precisely, a part of the upper surface side of the side surface) of the pattern forming material 91 is shaped into a shape corresponding to the concave portion 531b of the shaping member 53b, and the surplus pattern forming material 91 is removed. It moves to the opening side of the concave portion 531b. Thereafter, the urging mechanism 55 separates the shaping member 53b from the substrate 9 (Step S22). Thereby, a partition pattern having an appropriate shape is formed on the substrate 9.
[0049]
In the pattern forming apparatus 1 according to the second embodiment, the surface temperature of the shaping member 53b is controlled to an appropriate temperature by the temperature adjusting unit 54 and the pattern forming material 91 is shaped in a semi-cured state. Shaping can be performed easily. Further, the pattern forming material 91 can be easily separated from the shaping member 53b by the air holes provided on the bottom surface of the concave portion 531b.
[0050]
As described above, in the pattern forming apparatus 1 according to the second embodiment, the shaping member 53b is formed of the pattern forming material 91 on the substrate 9 by urging the shaping member 53b toward the main surface of the substrate 9. At least a part of the upper surface and the side surface of the pattern is shaped into a predetermined shape corresponding to the concave portion 531b, and an appropriate partition pattern with high height and high side shape accuracy can be obtained. Further, by using the pattern shaping head 5b, it is possible to change the shape in the direction along the partition pattern (for example, to slightly lower the height of the end).
[0051]
Note that the force for urging the substrate 9 by the urging mechanism 55 may be changed according to the pattern forming material, the curing conditions of the curing unit 43, or the like, or may be changed along with the time for urging. Further, it may be controlled in synchronization with the temperature adjustment unit 54.
[0052]
When the shaping member 53b is separated from the substrate 9, the shaping member 53b may be lifted at one end in a direction along the partition pattern, and when the shaping member 53b is formed of an elastic body such as rubber, As shown in FIG. 12, the pattern forming material 91 may be peeled from the shaping member 53b so that the shaping member 53b is wound up from the end.
[0053]
The pattern forming apparatus 1 has been described above. The functions of the pattern forming apparatus 1 are, as shown in FIG. 13, a pattern discharging apparatus 82 having a pattern forming head section and a pattern forming apparatus 83 having a pattern forming head section. May be realized as a pattern forming system 8 provided separately.
[0054]
In the pattern forming system 8 shown in FIG. 13, the substrate 9 placed on the substrate carrying-in section 81 is transported by the transport mechanism 80a to the pattern discharging device 82, and the pattern forming material is discharged onto the substrate 9 to be in a semi-cured state. After that, it is sent to the pattern shaping device 83 by the transport mechanism 80b. In the pattern shaping device 83, the pattern forming material is shaped, and the substrate 9 on which the appropriately formed partition wall pattern is formed is transported to the substrate unloading section 84 by the transport mechanism 80c.
[0055]
Note that the substrate processed by the pattern shaping device 83 does not necessarily need to be the substrate processed by the pattern discharge device 82 (that is, the substrate having the pattern forming material discharged by the discharge unit 42), but may be formed by another method ( For example, a substrate on which a pattern is formed by a sandblast method, a screen printing method, or the like may be used. Further, a pattern forming system (or a pattern forming device) may be configured by combining the pattern discharging device 82 with another pattern shaping device.
[0056]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0057]
The pattern forming apparatus 1 may be used for forming a pattern of a partition, a wiring, an electrode, and the like in another type of flat display device (flat panel display) such as an organic EL display device or a liquid crystal display device. The substrate 9 is not limited to a glass substrate, but may be a resin substrate, a semiconductor substrate, or the like.
[0058]
In the above embodiment, the pattern forming head unit 4 and the pattern shaping head unit 5 move relative to the substrate 9 by moving the stage 3, but the stage 3 is fixed and the pattern forming head unit 4 and the pattern forming head unit 4 move. The shaping head unit 5 may move.
[0059]
In the above embodiment, the ultraviolet light from the cured portion 43 is emitted from above to the pattern forming material 91 on the surface of the substrate 9. However, when the substrate 9 is a glass substrate, the ultraviolet light is emitted from the back surface of the substrate 9. It may be irradiated from the side. Also in this case, the ultraviolet irradiation position moves in synchronization with the relative movement of the discharge unit 42 with respect to the substrate 9. Further, the ultraviolet rays may be irradiated from the rear surface side of the substrate 9 to the rear region of the lower surface of the shaping member. This makes it possible to cure the pattern forming material in the course of shaping (when the discharge unit 42 is also irradiated with ultraviolet rays, the pattern forming material in a semi-cured state is further cured).
[0060]
Further, the curing unit 43 does not necessarily need to cure the pattern forming material by ultraviolet rays, and may be cured by applying light, heat, gas, or the like other than ultraviolet rays. The shaping may be performed by hardening the pattern forming material more hardly than in the semi-hardened state and shaving the pattern forming material with a shaping member.
[0061]
In the above embodiment, since the shaping member is relatively moved while being in contact with the substrate 9 or is urged so as to be in contact with the substrate 9, the pattern in which the absolute height is controlled with the surface of the substrate 9 as a reference plane is used. Although shaping is easily realized, a gap is provided between the substrate 9 and the lower surface of the shaping member so that the shaping member moves relative to the substrate 9 or the main surface of the substrate 9 according to the pattern to be shaped. May be biased toward.
[0062]
【The invention's effect】
According to the first to fourth aspects of the present invention, it is possible to precisely shape the upper surface and at least a part of the side surface of the pattern.
[0063]
According to the fourth aspect of the present invention, the pattern can be easily shaped.
[0064]
According to the fifth aspect of the invention, a pattern having an appropriate shape can be formed, and in the sixth to twelfth aspects, the upper surface and at least a part of the side surface of the pattern can be accurately shaped.
[0065]
According to the seventh and tenth aspects of the present invention, a pattern can be appropriately formed according to the characteristics of the pattern forming material.
[Brief description of the drawings]
FIG. 1 is a view showing a schematic configuration of a pattern forming apparatus.
FIG. 2 is a diagram illustrating a roller unit.
FIG. 3 is a diagram showing a flow of an operation for forming a partition pattern.
FIG. 4 is a view showing a state where a partition pattern is formed on a substrate.
FIGS. 5A to 5C are views for explaining how a pattern forming material is shaped.
FIG. 6 is a diagram showing another example of a shaping member.
FIG. 7 is a view showing a state in which a partition pattern is formed on a substrate.
FIGS. 8A and 8B are diagrams for explaining how a pattern forming material is shaped.
FIG. 9 is a diagram illustrating a pattern shaping head unit according to a second embodiment.
FIG. 10 is a view showing a shaping member.
FIG. 11 is a diagram showing a flow of an operation for shaping a partition pattern.
FIG. 12 is a diagram illustrating a state in which a shaping member is separated from a substrate.
FIG. 13 is a diagram showing a configuration of a pattern forming system.
[Explanation of symbols]
1 Pattern forming device
2 Stage moving mechanism
3 stage
5.5b Pattern shaping head
9 Substrate
42 Discharge unit
43 Hardened part
53, 53a, 53b shaping member
54 Temperature control unit
55 biasing mechanism
83 Pattern shaping device
91 Pattern forming material
531, 531 a, 531 b recess
S12 to S17, S21, S22 Step

Claims (12)

A pattern shaping device for shaping a pattern formed on a substrate,
A holding unit for holding the substrate,
A shaping mechanism for shaping at least a part of the upper surface and side surfaces of the pattern formed of the pattern forming material on the substrate into a predetermined shape,
A pattern shaping device comprising: The pattern shaping device according to claim 1,
The shaping mechanism,
A concave member corresponding to the predetermined shape,
An urging mechanism for urging the concave member toward the main surface of the substrate,
A pattern shaping device comprising: The pattern shaping device according to claim 1,
The shaping mechanism,
A concave member corresponding to the predetermined shape,
A moving mechanism for relatively moving the concave member along the main surface of the substrate,
A pattern shaping device comprising: The pattern shaping device according to claim 2 or 3,
The pattern shaping device, wherein the shaping mechanism further includes a temperature adjusting unit for adjusting the temperature of the concave member. A pattern forming apparatus for forming a pattern on a substrate,
A discharge unit that discharges the pattern forming material toward the substrate,
A moving mechanism that relatively moves the discharge unit along the main surface of the substrate,
A curing unit for sequentially curing the pattern forming material discharged on the substrate,
A shaping mechanism for shaping the pattern cured by the curing unit,
A pattern forming apparatus comprising: The pattern forming apparatus according to claim 5,
The pattern forming apparatus, wherein the shaping mechanism shapes an upper surface and at least a part of a side surface of the pattern into a predetermined shape. The pattern forming apparatus according to claim 5, wherein:
A pattern forming apparatus, wherein a curing condition of the curing unit can be switched among a plurality of conditions. A pattern forming method for forming a pattern on a substrate,
A pattern forming step of forming a pattern on the substrate with a pattern forming material,
A shaping step of shaping at least a part of the upper surface and side surfaces of the pattern into a predetermined shape,
A pattern forming method, comprising: It is a pattern formation method of Claim 8, Comprising:
The pattern forming step,
An ejection step of relatively moving the ejection unit along a main surface of the substrate while ejecting the pattern forming material toward the substrate from the ejection unit,
A curing step of sequentially curing the pattern forming material discharged onto the substrate. It is a pattern formation method of Claim 9, Comprising:
A pattern forming method, wherein curing conditions in the curing step can be switched between a plurality of conditions. The pattern forming method according to any one of claims 8 to 10, wherein
In the shaping step, a concave member corresponding to the predetermined shape is urged toward a main surface of the substrate. The pattern forming method according to any one of claims 8 to 10, wherein
The pattern forming method, wherein, in the shaping step, a concave member corresponding to the predetermined shape relatively moves along a main surface of the substrate.

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