JP2003031478A - Development apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform dip development to a substrate on a conveyance path laid in a horizontal direction. SOLUTION: A dip development treating section 130(1) has a frame 126 for forming an outer-periphery wall to the surface of a substrate G on a conveyance path 108 detachably, one or a plurality developer supply nozzles 128 for supplying developer Q onto the substrate G in or inside the frame 126, and a frame placement mechanism 152 for placing the frame 126 onto the substrate G on the conveyance path 108. The frame 126 has a shape, size, and plate thickness that can be placed on the circumferential section of the substrate G.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a development processing apparatus for carrying out a development processing step while horizontally transporting a substrate to be processed.

[0002]

2. Description of the Related Art Recently, LCD (Liquid Crystal Display)
In the resist coating development processing system in manufacturing, LC
As a development method that can advantageously cope with the increase in the size of the D substrate, the so-called flat flow method, in which the development process is performed while the LCD substrate is being conveyed on the conveyance path formed by horizontally arranging the conveyance roller and the conveyance belt, is noted. Has been done. Compared to the spinner method of rotating the substrate, such a flat-flow method has a simpler handling of the substrate and the configuration of the transfer system and the drive system, and has an advantage that mist is not generated or redeposition on the substrate is small. is there.

In the conventional flat-flow developing processing apparatus, a developing solution supply nozzle is arranged at a predetermined position above the conveying path, and the developing solution is dripped from the nozzle onto the upper surface of the substrate passing immediately below, that is, the surface to be processed. It was configured to be supplied by spraying and perform paddle development or spray development on the transport path.

[0004]

As described above, in the flat flow system, any of the conventional development processing apparatuses performs paddle development or spray development, and the dip for dipping the substrate to be processed in the developing solution. No developing device is known.

An object of the present invention is to provide a developing processing apparatus for performing dip development on a substrate to be processed on a transfer path laid horizontally.

Another object of the present invention is to provide a development processing apparatus which can efficiently perform flat-flow type dip development in a small space.

[0007]

In order to achieve the above object, the first development processing apparatus of the present invention lays a carrier for horizontally placing and carrying a substrate to be processed in a horizontal direction. A transport path formed by: a transport drive means for driving the transport body to transport the substrate on the transport path; and a frame for forming an outer peripheral wall on the surface to be processed of the substrate on the transport path. A developing solution supply means for supplying a developing solution to the inside of the frame so that the surface to be processed of the substrate is immersed.

In the above structure, the frame forms the outer peripheral wall with respect to the surface to be processed of the substrate on the transport path, so that the developer supplied by the developer supply means stays in the frame and almost the entire liquid surface. A uniform liquid pool can be formed. As a result, the surface to be processed of the substrate can be fully immersed in the developing solution within the frame to perform dip development.

In the first development processing apparatus, in order to efficiently form the outer peripheral wall around the substrate, the frame preferably has a shape, size and thickness that can be placed on the peripheral portion of the substrate. You may In this case, it is preferable to include a frame mounting means for detachably mounting the frame on the peripheral portion of the substrate. With this frame placing means, when performing dip development, the frame can be placed on the peripheral edge of the substrate, and after completion of the dip development, the frame can be removed from the substrate.

Further, preferably, the developing solution supply means may include one or a plurality of nozzles for discharging the developing solution inside the frame. The nozzle discharges the developing solution inside the frame, so that the developing solution can be rapidly diffused and supplied to the entire surface of the substrate to be processed in the frame.

In the first development processing apparatus, as one mode, the substrate is transported from the predetermined first position on the transport path further from the predetermined position while the surface of the substrate to be processed is immersed in the developing solution. It can be conveyed by a predetermined distance in the direction to a second position on the downstream side. In this case, it is preferable to have a frame collecting means for lifting the frame upward from the substrate at the second position and then returning it to the first position. In this mode, the time during which the substrate is temporarily stopped on the transport path during dip development can be shortened as much as possible.

Further, in the first developing processing apparatus,
By applying vibration by the ultrasonic vibrator to the developing solution in the frame during the dip development, development quality, especially in-plane uniformity on the surface to be processed of the substrate can be improved.

The second development processing apparatus of the present invention conveys the substrate on the conveyance path, and a conveyance path in which a conveyance body for laying and conveying the substrate to be processed is laid in the horizontal direction. In order to drive the transport body, a developer tank provided under the transport path in a predetermined transport section for storing a developer, and a transport drive for the transport body belonging to the transport section. A clutch mechanism for removably connecting to the means, and the carrier and / or the developer tank for immersing the substrate on the carrier belonging to the carrier section in the developer in the developer tank. It is configured to have an elevating means for moving up and down.

In the above structure, the transport member belonging to the transport section can be separated from the transport path by removing it from the transport drive means by the clutch mechanism. Then, by carrying out relative up-and-down movement between the separated and independent carrier and the substrate placed on the carrier and the developer tank arranged directly below the carrier, the carrier and the substrate are moved. It can be fully immersed in the developer in the developer tank, whereby dip development can be carried out.

Also in the above-mentioned second developing processing apparatus, the developing solution in the developing solution layer is vibrated by the ultrasonic vibrator during the dip development to improve the in-plane uniformity of the developing quality on the surface to be processed of the substrate. Can be made.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a coating and developing treatment system as one constitutional example to which the developing treatment apparatus of the present invention can be applied. The coating and developing treatment system 10 is installed in a clean room, and uses, for example, an LCD substrate as a substrate to be treated, and performs various treatments such as cleaning, resist coating, prebaking, developing and postbaking in the photolithography process in the LCD manufacturing process. It is a thing. The exposure process is performed by an external exposure device 12 installed adjacent to this system.

In this coating and developing system 10, a horizontally long process station (P / S) 16 is arranged at the center, and a cassette station (C / S) 14 and an interface station are provided at both ends in the longitudinal direction (X direction). (I / F) 18 are arranged.

The cassette station (C / S) 14 is
A cassette stage 20 which is a cassette loading / unloading port of the system 10 and on which a plurality of cassettes C capable of accommodating a plurality of substrates G can be placed side by side in a horizontal direction, for example, in the Y direction, on the stage 20. And a transport mechanism 22 for loading / unloading the substrate G into / from the cassette C. The transfer mechanism 22 has a means for holding the substrate G, for example, a transfer arm 22a, and can operate on four axes of X, Y, Z, and θ, and the adjacent process station (P / S) 16 side and the substrate G. It can be handed over.

The process station (P / S) 16 is
The processing units are arranged in the order of process flow or steps on a pair of parallel and opposite lines A and B extending in the system longitudinal direction (X direction). More specifically, in the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side, a cleaning process section 24 and a first thermal processing section 26 are provided.
The coating process section 28 and the second thermal processing section 30 are arranged in a horizontal row. On the other hand, from the interface station (I / F) 18 side to the cassette station (C /
S) In the process line B on the downstream side toward the 14 side, the second
The thermal processing section 30, the development processing section 32, the decolorization processing section 34, and the third thermal processing section 36 are arranged in a horizontal row. In this line form, the second thermal processing unit 30
Is located at the end of the upstream process line A and at the beginning of the downstream process line B,
It straddles both lines A and B.

An auxiliary transfer space 38 is provided between the two process lines A and B, and a shuttle 40 capable of horizontally mounting the substrates G one by one is arranged in a line direction (X direction) by a drive mechanism (not shown). You can move in both directions.

In the upstream process line A, the cleaning process unit 24 includes a scrubber cleaning unit (SCR) 4
This includes 2 scrubber cleaning units (SCR)
An excimer UV irradiation unit (e-UV) 41 is arranged in a position adjacent to the cassette station (C / S) 10 in 42. Although not shown, the cleaning section in the scrubber cleaning unit (SCR) 42 brushes the upper surface (processed surface) of the substrate G while horizontally transporting the LCD substrate G by the roller transport or the belt transport in the line A direction. And blow cleaning.

The first thermal processing section 26 adjacent to the downstream side of the cleaning processing section 24 is provided with a vertical transfer mechanism 46 at the center along the process line A, and a plurality of units are provided on both the front and rear sides thereof in multiple stages. Are arranged in layers. For example, as shown in FIG. 2, the upstream multi-stage unit (TB) 44 has a substrate transfer pass unit (PASS) 50,
Heating units (DHP) 52 and 54 for dehydration baking and an adhesion unit (AD) 56 are stacked in order from the bottom. Here, the pass unit (PASS) 50
Is used to transfer the substrate G to and from the scrubber cleaning unit (SCR) 42 side. Further, the downstream multi-stage unit (TB) 48 includes a substrate transfer pass unit (PASS) 60, a cooling unit (CL) 62,
64 and adhesion unit (AD) 66 are stacked in order from the bottom. Here, pass unit (PAS
S) 60 is for transferring the substrate G to and from the coating process unit 28 side.

As shown in FIG. 2, the transport mechanism 46 includes a vertically movable carrier 70 which can be vertically moved along a guide rail 68 extending in the vertical direction, and a rotation or rotation on the vertically movable carrier 70 in the θ direction. It has a rotatable carrier 72 and a carrier arm or tweezers 74 that can move forward and backward or extend and retract while supporting the substrate G on the carrier 72. A drive unit 76 for raising and lowering the elevation carrier 70
Is provided on the base end side of the vertical guide rail 68, and a drive unit 78 for driving the turning carrier 72 to rotate is provided on the vertical carrier 7.
A drive unit 80, which is attached to 0 and drives the transport arm 74 forward and backward, is attached to the rotary transport body 72.
Each drive unit 76, 78, 80 may be composed of, for example, an electric motor or the like.

The transport mechanism 46 constructed as described above is
It is possible to move up and down or rotate at high speed to access an arbitrary unit in the multi-stage unit sections (TB) 44 and 48 on both sides, and to transfer the substrate G to and from the shuttle 40 on the auxiliary transfer space 38 side. .

The coating process unit 28 adjacent to the downstream side of the first thermal processing unit 26 has a resist coating unit (CT) 82 and a reduced pressure drying unit (VD) 8 as shown in FIG.
4 and the edge remover unit (ER) 86 are arranged in a line along the process line A. Although not shown, in the coating process unit 28, the substrate G is provided in these three units (CT) 82, (VD) 84, and (ER) 86.
A transport device is provided for loading and unloading the sheets one by one in the order of steps, and each unit (CT) 82, (VD) 8
4. In the (ER) 86, each process is performed on a substrate-by-substrate basis.

The second thermal processing section 30 adjacent to the downstream side of the coating processing section 28 has the same structure as the first thermal processing section 26, and is located between both process lines A and B. Is provided with a vertical transfer mechanism 90, one multi-stage unit (TB) 88 is provided on the process line A side (last), and the other multi-stage unit (T) is provided on the process line B side (head).
B) 92 is provided.

Although not shown, for example, in the multi-stage unit section (TB) 88 on the process line A side, a substrate transfer pass unit (PASS) is placed at the bottom, and a pre-baking heating unit (PASS) is placed thereon. PREBAKE)
May be stacked in three layers, for example. In the multi-stage unit (TB) 92 on the process line B side, a substrate transfer pass unit (PASS) is placed at the bottom.
For example, a cooling unit (COL) is stacked on top of it, and a heating unit for pre-baking (PREBA) is placed on it.
KE) may for example be stacked in two layers.

The transport mechanism 9 in the second thermal processing section 30.
0 indicates the coating process unit 2 via the respective pass units (PASS) of the multi-stage unit units (TB) 88, 92.
8 and the development process unit 32 and the substrate G can be delivered one by one, and also the shuttle 40 in the auxiliary transfer space 38 and an interface station (I / F) described later.
The substrate 18 can be handed over in a unit of 18.

In the process line B on the downstream side, the developing process section 32 includes a so-called flat-flow developing unit (DEV) 94 which carries out a series of developing processing steps while transporting the substrate G in a horizontal posture. The structure and operation of the developing unit (DEV) 94 will be described later in detail.

A third thermal processing section 36 is arranged downstream of the developing process section 32 with a decolorizing process section 34 interposed therebetween. The decolorization processing unit 34 irradiates the surface to be processed of the substrate G with i-line (wavelength 365 nm) to perform the decolorization process.
A line UV irradiation unit (i-UV) 96 is provided.

The third thermal processing section 36 has the same structure as the first thermal processing section 26 and the second thermal processing section 30, and is of a vertical type along the process line B. Transport mechanism 10
0 and a pair of multi-stage unit parts (TB) 9 on the front and back sides
8, 102 are provided.

Although not shown, for example, a pass unit (PASS) is placed at the bottom of the multistage unit (TB) 98 on the upstream side, and a heating unit (POBAKE) for post-baking is provided on the pass unit (PASS). It may be stacked. In addition, the downstream multi-stage unit (TB) 1
02 has a post-baking unit (PO
BAKE) may be placed on top of which one pass / cooling unit (PASS / COL) for substrate transfer and cooling may be stacked, and two heating units (POBAKE) for post-baking may be stacked thereon.

The transport mechanism 1 in the third thermal processing section 36
00 is an i-ray UV irradiation unit (i-UV) 96 and a cassette station (C / C) via a pass unit (PASS) and a pass cooling unit (PASS / COL) of both multi-stage unit sections (TB) 98 and 102, respectively. S) 14 and the substrate G can be delivered not only in the unit of one sheet, but also the substrate G can be delivered in the unit of one sheet with the shuttle 40 in the auxiliary transport space 38.

Interface station (I / F) 1
8 has a transfer device 104 for exchanging the substrate G with the adjacent exposure device 12, around which a buffer stage (BUF) 105, an extension cooling stage (EXT / COL) 106 and a peripheral device 1 are provided.
07 is arranged. Buffer stage (BUF) 1
In 05, a stationary buffer cassette (not shown) is placed. Extension cooling stage (EXT
COL) 106 is a substrate transfer stage having a cooling function, and includes a process station (P / S) 1
It is used when exchanging the substrate G with the 6 side. The peripheral device 107 may have a structure in which, for example, a titler (TITLER) and a peripheral exposure device (EE) are vertically stacked. The transfer device 104 has a means capable of holding the substrate G, for example, a transfer arm 104a, and is provided with an adjacent exposure device 12 and each unit (BUF) 105, (EXT.COL) 10.
6, (TITLER / EE) 107 and the substrate G can be transferred.

FIG. 3 shows a processing procedure in this coating and developing processing system. First, the cassette station (C
/ S) 14, the transport mechanism 22 takes out one substrate G from the predetermined cassette C on the stage 20,
It is carried into the excimer UV irradiation unit (e-UV) 41 of the cleaning process section 24 of the process station (P / S) 16 (step S1).

Excimer UV irradiation unit (e-UV) 4
In 1 the substrate G is subjected to dry cleaning by UV irradiation (step S2). This ultraviolet cleaning mainly removes organic substances on the substrate surface. After the UV cleaning is completed, the substrate G is transferred to the scrubber cleaning unit (SCR) 42 of the cleaning process unit 24 by the transfer mechanism 22 of the cassette station (C / S) 14.

In the scrubber cleaning unit (SCR) 42, the substrate G is brushed on the upper surface (processed surface) of the substrate G while being horizontally conveyed by the roller conveyance or the belt conveyance in the horizontal direction in the process line A direction as described above. By performing cleaning or blow cleaning, particulate dirt is removed from the substrate surface (step S3). After the cleaning, the substrate G is drained by an air knife or the like while being transported in a uniform flow to dry the substrate G.

The substrate G which has been cleaned in the scrubber cleaning unit (SCR) 42 is passed through the pass unit (P) in the upstream multi-stage unit (TB) 44 of the first thermal processing section 26.
ASS) 50.

In the first thermal processing section 26, the substrate G is rotated by a transfer mechanism 46 in a predetermined unit in a predetermined sequence. For example, the substrate G may be first processed from the pass unit (PASS) 50 to the heating unit (DHP) 52, 5
It is moved to one of 4 and undergoes dehydration treatment there (step S4). Next, the substrate G is cooled by the cooling unit (COL) 6
It is moved to one of the Nos. 2 and 64 and cooled there to a constant substrate temperature (Step S5). Thereafter, the substrate G is transferred to the adhesion unit (AD) 56, where it is subjected to a hydrophobic treatment (step S6). After the completion of the hydrophobic treatment, the substrate G is cooled by one of the cooling units (COL) 62, 64.
Then, it is cooled to a constant substrate temperature (step S7).
Finally, the substrate G is transferred to the pass unit (PASS) 50 belonging to the downstream multi-stage unit section (TB) 48.

As described above, in the first thermal processing section 26, the substrate G has the multi-stage unit section (TB) 44 on the upstream side and the multi-stage unit section (TB) on the downstream side via the transfer mechanism 46.
You can go back and forth between the 48 and the other. The second and third thermal processing units 30 and 36 can perform the same substrate transfer operation.

The substrate G which has been subjected to the series of thermal or thermal processing as described above in the first thermal processing section 26 is a pass unit (PASS) in the downstream side multi-stage unit section (TB) 48.
From 60, it is moved to the resist coating unit (CT) 82 of the coating process unit 28 on the downstream side.

The substrate G is a resist coating unit (CT) 8
In 2, the resist solution is applied to the upper surface (the surface to be processed) of the substrate by, for example, the spin coating method, and immediately after that, the vacuum drying unit (VD) 84 adjacent on the downstream side is subjected to the drying processing under reduced pressure,
Next to the downstream edge remover unit (ER) 8
In step 6, excess (unnecessary) resist on the peripheral portion of the substrate is removed (step S8).

The substrate G that has undergone the resist coating process as described above passes from the reduced pressure drying unit (VD) 84 to the pass unit (TB) 88 belonging to the upstream multi-stage unit (TB) 88 of the adjacent second thermal processing unit 30. PASS).

In the second thermal processing section 30, the substrate G is rotated by the transfer mechanism 90 in a predetermined unit in a predetermined sequence. For example, the substrate G is the first from the pass unit (PASS) to the heating unit (PREBAKE).
And is subjected to baking after resist application (step S9). Next, the substrate G is transferred to one of the cooling units (COL) and cooled there to a constant substrate temperature (step S10). Thereafter, the substrate G is transferred to the path unit (PA) on the downstream multi-stage unit (TB) 92 side.
It is transferred to the extension / cooling stage (EXT / COL) 106 on the side of the interface station (I / F) 18 via the SS) or not.

Interface station (I / F) 1
8, the substrate G is moved from the extension / cooling stage (EXT / COL) 106 to the peripheral device 107.
Is carried into the peripheral exposure apparatus (EE), where it is exposed to remove the resist adhering to the peripheral portion of the substrate G during development, and then sent to the adjacent exposure apparatus 12 (step S11).

In the exposure device 12, a predetermined circuit pattern is exposed on the resist on the substrate G. Then, the substrate G that has undergone the pattern exposure is returned from the exposure device 12 to the interface station (I / F) 18 (step S1).
1) First, the peripheral device 107 Titler (TITLRE
R), where predetermined information is written on a predetermined portion on the substrate (step S12). After that, the substrate G is mounted on the extension / cooling stage (EXT / CO).
L) 106. Substrate G Transport and Exposure Apparatus 1 at Interface Station (I / F) 18
The transfer device 104 exchanges the substrate G with the substrate 2.

In the process station (P / S) 16, the transfer mechanism 90 in the second thermal processing section 30 has the extension / cooling stage (EXT / COL).
The exposed substrate G is received from 106 and is transferred to the development process section 32 via the pass unit (PASS) in the multi-stage unit section (TB) 92 on the process line B side.

In the developing process section 32, the substrate G received from the pass unit (PASS) in the multi-stage unit section (TB) 92 is carried into the developing unit (DEV) 94. In the developing unit (DEV) 94, the substrate G is transported in the horizontal posture in the flat flow direction toward the downstream of the process line B, and a series of developing processing steps of developing, rinsing and drying are performed during the transportation (step S13). .

The substrate G, which has been subjected to the development processing in the development processing section 32, is carried into the decolorization processing section 34 adjacent on the downstream side, where it is subjected to the decolorization processing by i-ray irradiation (step S14).
The substrate G that has been subjected to the decolorization treatment is passed through the pass unit (P) in the upstream multi-stage unit (TB) 98 of the third thermal treatment unit 36.
ASS).

In the third thermal processing section (TB) 98,
The substrate G is first transferred from the pass unit (PASS) to one of the heating units (POBAKE), where it is post-baked (step S15). Next, the substrate G
Is transferred to the pass cooling unit (PASS COL) in the downstream multi-stage unit (TB) 102, where it is cooled to a predetermined substrate temperature (step S16). Third
The transfer of the substrate G in the thermal processing section 36 is performed by the transfer mechanism 10.
Performed by 0.

On the cassette station (C / S) 14 side, the transfer mechanism 22 transfers the substrate G from the pass cooling unit (PASS / COL) of the third thermal processing section 36 to which all the steps of coating / developing processing have been completed. The received substrate G is received and accommodated in any one of the cassettes C (step S
1).

In the coating and developing treatment system 10, for example, the developing unit (DE) of the developing process section 32 is used.
The present invention can be applied to V) 94. Below, FIG.
25 to 25, the present invention is applied to the developing unit (DEV) 9
An embodiment applied to No. 4 will be described.

FIG. 4 schematically shows the entire structure of the developing unit (DEV) 94 according to one embodiment of the present invention. The developing unit (DEV) 94 has a continuous transport path 1 extending in the horizontal direction (X direction) along the process line B.
08 forming a plurality of modules M1 to M6
Are continuously arranged in a line.

Of these six modules M1 to M6,
The first module M1 located at the most upstream end constitutes the substrate loading section 110, the second module M2 constitutes the flat-flow interval adjusting section 112, the third module M2 constitutes the developing section 114, and The fifth module M4 constitutes the rinse section 116, and the fifth module M5 is the drying section 1
18, the module M6 at the end is the substrate unloading unit 1
Make up 20.

The substrate carry-in section 110 is provided with a plurality of lift pins 122 that can move up and down to receive the substrate G handed from an adjacent substrate transfer mechanism (not shown) in a horizontal posture and transfer it onto the transfer path 108. It is provided. Substrate unloading section 11
8 is also provided with a plurality of lift pins 124 that can be raised and lowered to lift the substrate G in a horizontal posture and hand it to an adjacent substrate transfer mechanism (not shown).

The developing section 114 is provided with a below-described dip developing processing section 130 including a frame 126 for performing dip development on the substrate G on the transport path 108 and a developing solution supply nozzle 128. The rinse section 116 is provided with one or a plurality of rinse liquid supply nozzles RN for directing a nozzle discharge port to the transport path 108 side and supplying a rinse liquid such as pure water to the substrate on the transport path 108. The drying unit 118 is provided with one or more pairs of air knives EN for draining the liquid (mainly the rinse liquid) adhering to the substrate G along the transport path 108 with the transport path 108 interposed therebetween. .

The developing section 114 and the rinsing section 116 are provided with pans 132 and 134 for collecting the liquid that has fallen below the transport path 108, respectively. A drainage port is provided at the bottom of each pan 132, 134, and drainage pipes 133, 135 of different drainage systems are connected thereto.

5 to 8 show the structures of the transport path 108 and the substrate loading section 110.

The transport path 108 includes the rotatable shaft 13
6, a pair of conveying rollers 1 fixed at a predetermined interval
38A and 138B are horizontally laid along the process line B to constitute a roller-conveyance type conveyance path.

More specifically, the bearings 142A, 142 are provided on the upper portions of the left and right side walls of each module M or the shaft leg member 140.
B is attached at a constant interval in the direction of the process line B, and the pair of bearings 142A, 142 are arranged so that the transport rollers 138A, 138B are located inside the left and right side walls.
The shaft 136 is rotatably mounted on B. A screw gear 144 is fixed to one end portion of each shaft 136 extending outward from the bearing 142A on one side, and a rotary drive shaft 146 side extending in the process line B direction is attached to each screw gear 144 on the shaft 136 side. The respective screw gears 148 of the above mesh with each other from the right angle direction. Rotary drive shaft 14
6 is coupled to the rotating shaft of the electric motor 150. When the electric motor 150 rotationally drives the rotary drive shaft 146 in a predetermined direction, the rotational driving force is transmitted from each screw gear 148 on the rotary shaft 146 side to the screw gear 144 on the transport shaft 136 side, and the transport rollers on each shaft 136. 138A and 138B move in a predetermined direction (the substrate G is transferred to the transport path 108).
It is designed to rotate in the direction of sending to the front).

In this embodiment, basically, a flat flow method is adopted in which the substrate G is horizontally transported at a substantially constant interval on the transport path 108, but the substrate G is used for dip development in the developing section 114. In order to locally or temporarily stop or stop the roller, the above-mentioned roller transport drive system (150, 14
6, 148, 144) is divided into the developing section 114 and three sections before and after the developing section 114, and the roller transport operation (speed, stop, etc.) in each section is preferably controlled independently.

In the substrate carry-in section 110, the lift pins 122 for delivering the substrate are discretely erected or planted at predetermined intervals on an elevating plate 152 horizontally arranged below the transfer path 108. Below the lift plate 152, a lift drive unit 154 including, for example, an air cylinder (not shown) is installed.

As shown in FIG. 7, when the lift drive unit 154 lifts the lift plate 152 to a predetermined height, the lift pins 1
22 protrudes above the transfer path 108 through the gap between the shafts 136, and at the height position thereof, the substrate G can be received in a horizontal posture from an adjacent substrate transfer mechanism (not shown).

When the substrate G is transferred onto the lift pins 122, the lifting drive unit 154 lowers the lifting plate 152 to the original position as shown in FIG. The width of the transport path 108 (both ends in the width direction) is set on the transport rollers 138A and 138B, so that the substrate G
Are transferred in a horizontal posture on the transport path 108. The outer diameter of each of the transport rollers 138A and 138B is narrowed toward the inside (center side of the shaft), and one end of the substrate G is placed on the small diameter portion 139.

9 to 12 show the construction of the dip development processing section 130 (1) in the development section 114. The dip development processing section 130 (1) is a frame 12 for detachably forming an outer peripheral wall on the surface to be processed of the substrate G on the transport path 108.
6, one or a plurality of developing solution supply nozzles 128 for supplying the developing solution Q onto the substrate G inside or inside the frame 126, and the frame 126 is placed on the substrate G on the transport path 108. And a frame mounting mechanism 152 for.

The frame 126 is made of, for example, a resin-made box-shaped plate member whose upper and lower surfaces are open, and has a shape, size, and plate that can be placed on the peripheral portion of the substrate G or the peripheral exclusion region (non-product region). Have a thickness. Flange portions 126a are formed on both side surfaces in the left-right width direction of the frame 126, and the lower end portions of one or a plurality of vertical support rods 154 are fixed to each flange portion 126a. The upper end of each vertical support rod 154 is connected to an actuator in the frame mounting mechanism 152, for example, a piston rod (not shown) of an air cylinder. When the piston rod of the air cylinder advances (or retracts), the vertical support rod 154
The frame 126 descends (or rises) via the. The frame placement mechanism 152 supports the frame 126 horizontally via the vertical support rods 154, and at a first height position (FIGS. 9 and 1) that is upwardly separated from the substrate G on the transport path 108.
0) and the second height position (FIGS. 11 and 12) placed on the substrate G on the transfer path 108. At the second height position, the frame 126 is preferably placed in close contact with the substrate G, and the frame placement mechanism 152 may include a spring member for elastically pressing the frame 126 against the substrate G. .

In the developing section 114, in order to properly place the frame 126 on the substrate G on the transport path 108, the transport path 1
It is necessary to stop or stop the substrate G conveyed from the upstream side on the 08 at a predetermined position, that is, a position directly below the frame 126. As will be described later, when the substrate G reaches a predetermined position in the developing unit 114 on the transport path 108, a predetermined position sensor (FIG. 23) detects the substrate G and responds to a signal output from the sensor. The control unit of the transport drive system stops the rotation of at least all the transport rollers 138A and 138B in the section to stop the substrate G at the predetermined position.

The developing solution supply nozzle 128 is connected via a developing solution supply pipe 156 to a developing solution supply source (not shown) composed of, for example, a developing solution container and a pump, and a conveying path from the downward discharge port 128. The developing solution is sprayed in a fan shape toward the 108 side. Developer supply pipe 156
An opening / closing valve (not shown) may be provided in the middle of the process, and the opening / closing control of the opening / closing valve may be performed by a controller (not shown) for centrally controlling each unit in the developing unit (DEV) 94.

Next, the operation of the developing unit (DEV) 94 will be described. As described above with reference to FIGS. 7 and 8, the substrate loading unit 110 receives the substrates G in units of one sheet from the adjacent substrate transport mechanism (not shown) and transports the transport path 10.
Reprinted in 8. The transport rollers 138A, 138B of the transport shaft 136 constituting the transport path 108 are rotated by the rotational drive force of the electric motor 150 via the transmission drive mechanism such as the rotary drive shaft 146 and the screw gears 148, 144 as described above. Therefore, the substrate G placed on the transport path 108 is immediately transported to the adjacent flat-flow interval adjusting unit 112.

In the flat flow interval adjusting unit 112, the substrate G
Takes a certain amount of time without undergoing any special treatment,
That is, it is conveyed toward the developing unit 112 on the conveying path 108 so as to catch up just in time immediately after the immediately preceding substrate G undergoing the dip development in the developing unit 112 (FIG. 13).

When the substrate G reaches the developing section 112,
As described above, the position sensor 200 (FIG. 23) is connected to the substrate G.
Is detected, and at that timing, all the transport rollers 138A and 138B in the section stop rotating, so that the substrate G stands still at a predetermined position on the transport path 108 (FIGS. 9 and 10).

Immediately after that, the frame mounting mechanism 152 operates to lower the frame 126 to the second height position (mounting position). Then, since the substrate G is stopped at a predetermined position on the transport path 108 immediately below, the frame 126 is positioned and placed on the peripheral edge of the substrate G. In this way, the outer peripheral wall is formed around the surface to be processed of the substrate G by the frame 126 placed on the peripheral portion of the substrate G.

Then, the developing solution supply section is activated and the developing solution supply nozzle 128 sprays the developing solution Q in the frame 126 (FIGS. 11 and 12). Thus, the developer supply nozzle 128
The sprayed developer Q spreads in all directions on the surface to be processed of the substrate G, and forms a liquid pool having a substantially uniform water depth in the frame 126. The developer supply unit may stop the supply of the developer Q when the water depth of the developer Q in the frame 126 reaches a predetermined value.
Alternatively, if the developer Q leaks out from the bottom of the frame 126, the supply of the developer Q may be continued. The developer Q that has leaked to the outside of the substrate G falls below the transport path 108 and is collected in the developer pan 132.

As described above, the surface to be processed of the substrate G is fully immersed in the developing solution Q in the frame 126 on the transport path 108, whereby the dip development is carried out. Then, after a lapse of a predetermined time, the frame mounting mechanism 152 removes the frame 126 from the substrate G in the first position or the retracted position (FIGS. 9 and 10).
Raise to. When the frame 126 is removed from the substrate G,
Since the developing solution Q in the frame 126 has no outer peripheral wall,
To the outside (four directions) of the developing solution and is collected in the developing solution pan 132.

After the frame 126 is removed from the substrate G as described above, the transport rollers 138A and 138B belonging to the roller transport section around the developing unit 114 restart the rotation operation, so that the substrate G is transported to the transport path 108. It is carried on to the rinse unit 116. As shown in FIG. 13, when the developing unit 114 completes the dip development for the substrate G, the succeeding substrate G arrives near the end of the flat-flow interval adjusting unit 112, and the previous one Substrate G is rinse part 11
6 has finished the rinsing process, or the drying unit 118
Have been brought in.

In the rinse section 116, the rinse liquid supply nozzle RN sprays the rinse liquid, for example, pure water, onto the substrate G which moves on the transport path 108 and moves to the downstream side. Thus
The development is stopped by replacing the developing solution Q with the rinsing solution on the substrate G. The rinse liquid that has fallen outside the substrate G is collected in the rinse liquid pan 134 that is installed below the transport path 108. A rinse liquid supply nozzle (not shown) for cleaning the back surface of the substrate G may be provided below the transport path 108.

The substrate G, which has been subjected to the above-described rinsing process in the rinsing unit 116, rides on the transport path 108 and is dried in the drying unit 118.
Be delivered to. In the drying unit 118, as shown in FIG. 4, the upper and lower air knives EN installed at a predetermined position with respect to the substrate G transported on the transport path 108 have knife-shaped sharp edges on the upper surface (processed surface) and the back surface of the substrate. By applying a gas flow such as air, the liquid (mainly the rinse liquid) adhering to the substrate G is blown off (removed) to the rear of the substrate.

The substrate G drained by the drying unit 118 is sent to the substrate unloading unit 120 along the transport path 108 as it is. The substrate carry-out unit 120 has the same configuration as the substrate carry-in unit 110, and operates in the same manner as the substrate carry-in unit 110 except that the substrate carrying directions are opposite between carrying-in and carrying-out. That is, the lift pins 124 for transferring the substrate are connected to the transport path 108.
The substrate G on the upstream side (drying unit 1
18) Waiting for the flow from the substrate G to lift pin 1
When it reaches a predetermined position immediately above 24, the lift pins 124 are pushed up to lift the substrate G in a horizontal posture, and the substrate G is transferred to an adjacent substrate transfer mechanism (not shown).

In this embodiment, it is preferable to drain the developing solution remaining on the substrate G in the developing section 112 after completing the dip development as described above in the developing section 112. As this type of liquid draining means, for example, the developing unit 1
An air knife mechanism as shown in FIG. 14 may be provided in the vicinity of the boundary between 14 and the rinse portion 116. In FIG. 14, the air knife FN has a myriad of air ejection openings or slit-shaped air ejection openings that extend from one end of the substrate W to the other in the width direction of the transfer path 108, and is located near a predetermined position ( A sharp knife-like gas flow (usually an air flow or a nitrogen gas flow) is applied to the substrate G passing immediately below. As a result, while the substrate G passes through the air knife FN, the developing solution Q on the substrate is swept up to the rear end side of the substrate and is wiped out of the substrate.

As described above, by draining the residual developing solution on the substrate G in the developing section 112, the ratio of the developing solution carried into the rinse section 116 is lowered, and the fractional recovery rate of the processing solution can be increased. it can. Further, since the rinse liquid is supplied to the substrate G immediately after being drained in the rinse unit 116, the replacement with the rinse liquid (development stop) can be performed quickly.

Dip development processing section 1 of the above-described embodiment
In 30 (1), the developing solution is sprayed downward in a fan shape from the developing solution supply nozzle 126 installed at a relatively upper position with respect to the substrate G on the transfer path 108, and the surface to be processed inside the frame 126 is processed. A pool of developing solution for dip development was formed on.

As a modification for forming a similar developer reservoir in the frame 126, as shown in FIG.
It is also possible to provide a developer injection / suction tube 160 extending along the inner wall surface of the. This developer injection / suction tube 16
A large number of nozzle openings 160a are laterally formed at regular intervals on the inner side surface of 0. This developer injection / suction tube 160
a is outside the frame 126 and is, for example, 3 as shown in FIG.
It is adapted to selectively communicate with the developing solution supply pipe 164 on the developing solution supply source side or the eject tube 166 on the vacuum type developing solution recovery section side through a switching valve 162 formed of a directional valve.

When the developing solution is supplied into the frame 126 for the dip development, the switching valve 162 causes the developing solution supply pipe 16 to move.
It is switched to the 4 side, and the developing solution from the developing solution supply source is ejected from each nozzle port 128a of the developing solution ejecting / suction tube 160. When ending the dip development, the switching valve 162 is switched to the eject pipe 166 side, the developing solution in the frame 126 is sucked from each nozzle port 128a of the developing solution jetting / suction tube 160, and the developing solution passes through the eject tube 166. It is recovered in the liquid recovery section. In this way, after completion of the dip development, the developer can be collected and drained in the frame 126 at the same time.

The developing solution jetting / suction tube 160 has a frame 1
It may be integrally attached to the frame 26, or may be a separate body that can be separated from the frame 126. Further, it is possible to use a method of selectively using a nozzle for supplying a developing solution and a nozzle for sucking (recovering) the developing solution. Further, an ultrasonic transducer (not shown) is provided on the inner wall of the frame 126.
Is attached to the container, and the ultrasonic vibrator vibrates the developer pool in the frame 126 during dip development, whereby the stagnation of the developer can be prevented and the uniformity of the development process can be improved. Further, it is possible to adopt a configuration in which an upper lid (not shown) is attached to the frame 126 in order to shield the developer pool in the frame 126 from the surrounding air flow.

17 to 19 show the construction of the main part of the dip development processing section 130 (2) in another embodiment.

The dip development processing section 130 of this embodiment
In (2), in the dip developing section K on the conveying path 108 set in the developing unit 114, each conveying shaft 13
6 is a driving shaft 136a on the side of the transmission gear 144 and a driven shaft 136b on the side of the conveying rollers (138A, 138B).
The shafts 136a and 136b are separated from each other, and the shafts 136a and 136b are detachably connected to each other via a meshing clutch 170.

The driven shaft 136b is used for the both transport rollers 1.
38A and 138B are rotatably supported by a pair of bearings 172A and 172B provided on the outer side in the axial direction. Each bearing 1
72A and 172B are supported via a vertical support rod 176 by a horizontal support member 174 provided right above in parallel with the transport path 108. More specifically, each bearing 172A, 17
The lower end portion of the vertical support rod 176 is fixed to 2B, and the upper end portion of the vertical support rod 176 is fixed to the side surface of the horizontal support member 174 with a pin or bolt 178. Each horizontal support member 174
The cylinder 180 mounted upside down
Is connected to the piston shaft 180a.

In such a configuration, when the clutch 170 is turned on by the clutch driving unit (not shown) to connect the driving shaft 136a and the driven shaft 136b, the electric motor 150 (FIGS. 5 and 6) rotates. The driving force is transmitted to both the transport rollers 138A and 138B via the rotary drive shaft 146, the screw gears 148 and 144, the driving shaft 136a, the clutch 170 and the driven shaft 136b. Therefore, on the transport path 108, the substrate G
Can smoothly enter the dip developing section K from the upstream side, and can smoothly exit from the dip developing section K to the downstream side.

However, when the clutch 170 is turned off to disconnect the driven shaft 136b from the driving shaft 136a, the rotational driving force from the electric motor 150 is applied to the clutch 17.
It will be cut off at 0 and will not be transmitted to the driven shaft 136b. Under this condition, when the cylinder 180 is driven to move the piston shaft 180a forward or backward by a predetermined distance, the horizontal support member 174 descends integrally with the piston shaft 180a, and the vertical support rod 208 is attached to the horizontal support member 174. Each of the transport rollers 138A and 138B hanging through the transport rollers 138A and 138B is also lowered or dropped from the standard height level of the transport path 108.

In this embodiment, the developer tank 182 is provided below the conveying path 108 in the developing section 114, and the conveying rollers 138A and 138B in the dip developing section K are moved by the forward movement of the cylinder 180 as described above. 19 is lowered or dropped, the conveying rollers 138A and 138B are soaked in the developer tank 182 as shown in FIG. Therefore, when the substrate G is stopped or stopped on the transport rollers 138A and 138B in the dip developing section K, the substrate G is also immersed in the developer tank 182 together.

After completion of the dip development, the cylinder 180
By moving back, the horizontal support member 174 rises integrally with the piston shaft 180a, and the respective transport rollers 138A and 138B hanging on the horizontal support member 174 return to the height position of the transport path 108. (Fig. 17,
(Fig. 18). Then, the transport path 10 in the dip developing section K
8 or the transport roller 138 row returns to the horizontal state,
The clutch 170 may be turned on to connect the driven shaft 136b to the driving shaft 136a. The drive shaft 136a may be supported by a bearing portion 1181 installed on the axially outer side of the screw gear 144 (FIG. 18).

A drain port 182a is provided at the bottom of the developer tank 182, and the used developer Q can be discharged from the drain port 182a at any time via the open / close valve 184 and the drain pipe 186. There is. On the other hand, a new developing solution Q can be replenished into the developing solution tank 182 at any time through a developing solution supply pipe 188 from a developing solution supply source (not shown). Further, one or a plurality of ultrasonic vibrators 189 are provided at the bottom of the developing solution tank 182, and the ultrasonic vibrator 189 vibrates the developing solution during dip development, so that the surface to be processed of the substrate G is processed. The in-plane uniformity of the developing process is improved.

20 and 21 show the structure of the main part of the dip development processing section 130 (3) in another embodiment. In this embodiment, the second module M2 and the third module M3 constitute the developing section 114, and the flat flow interval adjusting section 112 (FIG. 4) is omitted. In this dip development processing section 130 (3), as shown in FIG. 21, for example, flanges 126a formed on the left and right side surfaces of the frame 126.
A pair or a plurality of pairs of arms 19 which can be detachably engaged with the arm 19
The frame handling mechanism 190 including the developing unit 114
It is provided above the conveyance path 108 of (M2, M3).

The frame handling mechanism 190 includes the developing unit 11
When the substrate G is carried into the front stage (M2) of No. 4 and stopped at a predetermined position on the transfer path 108, the frame 126 is lowered by the arm 192 from just above and the same as the dip development processing section 130 (3) of the above-described embodiment. A frame 126 is placed on the peripheral portion of the substrate G to form an outer peripheral wall. Immediately thereafter, similarly to the dip development processing section 130 (3), the developing solution is supplied from the developing solution supply nozzle 128 into the frame 126 to form a pool of the developing solution. At this time, the frame handling mechanism 190 once separates the arm 192 from the frame 126, and at the same time, the roller transport drive system around the developing unit 114 operates to move the substrate G to the downstream side on the transport path 108. As a result, the surface to be processed of the substrate G can be immersed in the developer pool in the frame 126 while the substrate G is moved to the downstream side in the transport path 108, and the dip development can be performed.

Then, the substrate G is transferred to the rear stage (M
When the predetermined position of 3) is reached, the frame handling mechanism 190 removes the frame 126 from the substrate G by hooking the hook-shaped locking portion 192a at the tip of the arm 192 to the flange portion 126a of the frame 126 and lifting it at that position. When the frame 126 is removed from the substrate G, the developing solution Q in the frame 126 flows down to the outside (four directions) of the substrate G because the outer peripheral wall disappears, and is collected in the developing solution pan 132. The developer pan 13
2 may have a size that extends over substantially the entire area (M2, M3) of the developing unit 114.

In the module layout of FIG. 20, the frame handling mechanism 190 includes separate arms 192 for the front stage (M2) and the rear stage (M3) of the developing section 114. That is, the frame 126 is removed from the substrate G by using the arm 192 on the downstream side at the end of the dip development on the rear side (M3) side, and at the same time, the dipping is started on the next substrate G on the front side (M2) side. Therefore, another frame 126 is set (placed) on the subsequent substrate G by using the arm 192 on the upstream side. Therefore, in the frame handling mechanism 190,
A mechanism (not shown) is provided for feeding the frame 126 collected by the rear stage (M3) or the downstream arm 192 to the front stage (M2) or the upstream arm 192. With this method,
The time during which the substrate G is stopped on the transport path 108 for dip development can be shortened as much as possible, and the throughput of the flat-flow method can be improved.

Alternatively, as another module layout, a module or section for adjusting the flat flow interval is inserted between the front stage (M2) and the rear stage (M3) of the developing section 114,
Setting (placement) of the frame 126 in the first stage (M2)
The operation and the collecting operation of the frame 126 in the subsequent stage (M3) can be performed with a temporal shift. In the frame handling mechanism 190, one set of arms 192 is configured to be movable parallel to the transport path 108, and the front stage (M2)
And the rear stage (M3) can be moved back and forth, and the frame setting operation in the front stage (M2) and the frame collecting operation in the rear stage (M3) are separated by a time lag.
It is also possible to combine the two. In that case, arm 1
When 92 collects and holds the frame 126 in the latter stage (M3), the frame 126 may be transferred to the former stage (M2) as it is, and the frame 126 may be set on the substrate G after one.

FIG. 22 shows the structure of the main part of the dip development processing section 130 (4) in another embodiment. In this embodiment, the second module M2 constitutes the developing unit 114, and the dip developing processing unit 130 of the above-described embodiment is provided here.
The frame mounting mechanism 152 in (1) is arranged, and the dip development is performed in the same manner as described above. However, the dip development is cut up in a short time, that is, halfway up, the substrate G is transferred to the next module M3, and the developing solution supply nozzle DN drops or sprays the developing solution onto the substrate G moving on the transport path 108. The paddle development or the spray development is carried out by supplying. In this way, it is possible to complete the one development processing step by finishing the dip development halfway and linking it to the paddle development or spray development.

As described above, this developing unit (DE
V) 94, particularly in the dip development processing section 130, a position sensor is used to stop the substrate G transported from the upstream side on the transport path 108 at a predetermined position. As such a position sensor for board arrival detection,
For example, a limit switch 200 as shown in FIG. 23 can be used. In this limit switch 200, when the substrate G approaches a predetermined position on the transport path 108 ((A) in FIG. 23), the roller lever 20 provided there is provided.
The front end of the substrate comes into contact with the front end of the roller lever 202.
Is pulled under the substrate G while being rotated in a predetermined direction (clockwise) around the shaft 206 against the tension coil spring 204 ((B) of FIG. 23). Then, the optical sensor 208 detects the other end of the roller lever 202 and outputs a predetermined board arrival detection signal. The optical sensor 208 is, for example, as shown in (C) of FIG.
The light emitting element 208a and the light receiving element 208b may be arranged so as to face each other with a gap 210 interposed therebetween, and are obtained from the light receiving element 208b when the roller lever 202 enters the gap 210 and blocks the light beam LB from the light emitting element 208a. The output signal obtained may be the board arrival detection signal.

24 and 25 show an example of the construction of a drainage switching mechanism applicable to the processing liquid pan PA (132, 134) provided below the transport path 108 in the developing unit (DEV) 94.

In the configuration example of FIG. 24, two drain ports 212, 21 are provided on the left and right sides of the pan PA with the rotary shaft 210 sandwiched therebetween.
4 is provided, and one lid 216 fixed to the rotary shaft 210 is configured to be rotatable integrally with the rotary drive shaft 210.
The lid 216 is placed over the drainage port 214 when the drainage opening 12 is opened, and the lid 21 is placed when the drainage opening 214 is opened.
6 is put on the drain port 212. Lid 2
A suitable sealing member, such as an O-ring (not shown), may be attached around the periphery of 16 or around the drains 214, 212. The means for rotationally driving the lid body 216 via the rotary drive shaft 210 can be constituted by, for example, a swinging air actuator. The drain ports 212 and 214 have drain pipes 218 leading to different drain processing units (not shown).
220 is connected.

The configuration example of FIG. 25 is obtained by partially modifying the configuration of FIG. 24, and the rotary drive shaft 210 has two lids 21.
6A and 216B are integrally attached, the lid 216B is retracted away from the drain 212 when the lid 216A closes the drain 212, and the lid 216B is retracted when the lid 216B closes the drain 212. 216B is separated from the drainage port 212 and retracted. Other configurations are the same as above.

In this developing unit (DEV) 94, different processing solutions may be collected in the processing solution pan PA (132, 134). For example, the developing solution pan 132 is used for collecting the developing solution during the developing process, but after the developing process is completed or in between, the dip developing processing section 13 as described above is used.
When the frame 126 of 0 is washed, it is used for collecting the cleaning liquid or for the waste liquid. According to the drainage switching mechanism of this embodiment, the used processing liquid received and collected in the pan PA is not drained through the switching valve provided in the middle of the drainage pipe, but the drainage port 212, Since it can be distributed at the stage of 214, that is, at the stage of the inlet of the drainage system, the fractional recovery rate of the treatment liquid can be increased.

In the above-described embodiment, the roller transfer type transfer path 108 is constructed by horizontally laying a pair of transfer rollers 138A and 138B fixed to the rotatable shaft 136 at a predetermined interval. In such a roller transport type transport path, a substrate transport roller may be attached at an intermediate position between both transport rollers 138A and 138B. It is also possible to divide the drive system of the transport path 108 into a plurality in the transport direction and independently control the transport operation (speed, stop, etc.) on each of the split transport paths. Further, a belt-conveying type conveying path in which a pair of belts are laid horizontally in a certain interval is also possible.

In the rinse section 116, the substrate may be processed in a horizontal state or an inclined state. The substrate to be processed in the present invention is not limited to the LCD substrate, and includes any substrate to be processed to which development processing can be applied.

[0107]

As described above, according to the substrate processing apparatus of the present invention, it is possible to perform the dip-type development on the substrate to be processed on the transfer path laid in the horizontal direction. It is also possible to efficiently perform the flat flow dip development in a space-saving manner.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of a coating and developing treatment system to which a developing treatment apparatus of the present invention can be applied.

FIG. 2 is a side view showing a configuration of a thermal processing unit in the coating and developing processing system.

FIG. 3 is a flowchart showing a processing procedure in the coating and developing processing system.

FIG. 4 is a front view showing the overall configuration of a developing unit (at the start of dip development) in one embodiment.

FIG. 5 is a partial cross-sectional front view showing a configuration around a substrate loading section and a pre-wet section in the developing unit.

FIG. 6 is a plan view showing a configuration around a substrate carry-in section and a pre-wet section in the developing unit.

FIG. 7 is a partial cross-sectional side view showing the configuration and operation (substrate transfer) of the substrate loading unit in the developing unit.

FIG. 8 is a partial cross-sectional side view showing the configuration and action (transfer of substrate) of the substrate loading unit.

FIG. 9 is a partial cross-sectional front view showing the configuration (frame retracted state) of the dip development processing section in the developing unit.

FIG. 10 is a partial cross-sectional side view showing the configuration (frame retracted state) of the dip development processing section in the developing unit.

FIG. 11 is a partial cross-sectional front view showing a configuration (frame mounting state) of a dip development processing section in the developing unit.

FIG. 12 is a partial cross-sectional side view showing a configuration (frame mounting state) of a dip development processing section in the developing unit.

FIG. 13 is a front view showing the overall configuration of the developing unit (at the end of dip development).

FIG. 14 is a schematic side view showing the operation of the air knife mechanism in the embodiment.

FIG. 15 is a perspective view illustrating a configuration of a main part of a dip development processing unit according to an embodiment.

FIG. 16 is a partial cross-sectional front view showing the configuration of the main part of the dip development processing unit in the embodiment.

FIG. 17 is a partial cross-sectional front view showing the configuration of the dip development processing unit in one embodiment (before or after the start of dip development).

FIG. 18 is a partial cross-sectional side view showing the configuration (before or after the start of dip development) of the dip development processing unit in the embodiment.

FIG. 19 is a partial cross-sectional front view showing the configuration (dip development) of the dip development processing section in the embodiment.

FIG. 20 is a front view showing the overall configuration of the developing unit in the embodiment.

FIG. 21 is a partial cross-sectional side view showing the configuration of the dip development processing unit in the embodiment.

FIG. 22 is a front view showing the overall configuration of the developing unit in the embodiment.

FIG. 23 is a diagram showing a configuration example of a substrate arrival detection position sensor that can be used in the developing unit of the embodiment.

FIG. 24 is a partial cross-sectional front view showing the configuration of the drainage switching mechanism for the treatment liquid pan in one embodiment.

FIG. 25 is a partial cross-sectional front view showing the configuration of the drainage switching mechanism for the treatment liquid pan in one embodiment.

[Explanation of symbols]

10 Coating and developing system 16 (P / S) process station 32 Development process section 94 development unit 108 transport path 114 Development Department 116 Rinse 118 Drying section 126 frames 128 developer supply nozzle 128 developer drop 130 (1) to 130 (4) Dip development processing section 132 developer pan 134 Rinse pan 136 Transport shaft 138 (138A, 138B) Transport rollers 156 Vertical support rod 160 Developer injection / suction tube 170 clutch 172 (172A, 172B) bearing 174 Horizontal support member 180 cylinders 190 Frame handling mechanism 192 Arm 212 rotary drive shaft 212, 214 Drainage port 216, 216A, 216B lid

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kimio Motoda             TBS release, 5-3-6 Akasaka, Minato-ku, Tokyo             Sending Center Tokyo Electron Limited F-term (reference) 2H096 AA28 GA22 GA24                 5F046 LA09 LA11

Claims (9)

[Claims] 1. A transport path in which a transport body for horizontally placing and transporting a substrate to be processed is laid in a horizontal direction, and a transport for driving the transport body to transport the substrate on the transport path. Drive means, a frame for forming an outer peripheral wall on the surface to be processed of the substrate on the transport path, and a development for supplying a developing solution to the inside of the frame so that the surface to be processed of the substrate is immersed. A development processing apparatus having a liquid supply means. 2. The development processing apparatus according to claim 1, wherein the frame has a shape, size, and thickness that can be mounted on the peripheral portion of the substrate. 3. The development processing apparatus according to claim 2, further comprising a frame mounting means for mounting the frame on the peripheral portion of the substrate in a detachable manner. 4. The development processing apparatus according to claim 1, wherein the developing solution supply unit includes one or a plurality of nozzles for ejecting the developing solution inside the frame. 5. The substrate in the frame is immersed in the developing solution in the surface to be processed, and the substrate is downstream from the predetermined first position on the transfer path by a predetermined distance in the transfer direction. The developing processing apparatus according to claim 1, wherein the developing processing apparatus conveys the developing processing apparatus to the second position. 6. The developing processing apparatus according to claim 5, further comprising a frame collecting unit that lifts the frame upward from the substrate at the second position and then returns the frame to the first position. 7. The development processing apparatus according to claim 1, further comprising an ultrasonic vibrator for applying vibration to the developing solution in the frame. 8. A transfer path in which a transfer body for horizontally mounting and transferring a substrate to be processed is laid in a horizontal direction, and a transfer for driving the transfer body to transfer the substrate on the transfer path. A drive unit, a developer tank provided under the transport path in a predetermined transport section capable of storing a developer, and a transport member for detachably connecting the transport member belonging to the transport section to the transport drive unit. A clutch mechanism, and the carrier and / or the carrier for immersing the substrate on the carrier belonging to the carrier section in the developer in the developer tank.
Alternatively, a development processing apparatus having an elevating means for elevating the developing solution tank. 9. The development processing apparatus according to claim 8, further comprising an ultrasonic vibrator for applying vibration to the developing solution in the frame.