JP2002329967A - Method of manufacturing multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board which can avoid a dimensional change or thermal deterioration of an inner layer plate, can avoid a positional shift between layers, can simplify its process, and can have high accuracy, high density and high reliability. SOLUTION: One or more first stacking units including a single insulating layer of a thermosetting resin sheet containing a reinforcing material and having a wiring layer on its both sides; one or more second stacking units having an insulating layer laminated on one surface of the first unit, having a wiring layer on one major surface and an exposed interlayer connection conductor on the other major surface; and one or more third stacking units having insulating layers laminated on both surfaces of the first unit and having exposed interlayer connection conductors on its two major surfaces; are positioned and laminated so that the interlayer connection conductors and wiring layers are alternately placed in the lamination direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board using laser drilling.

[0002]

2. Description of the Related Art Conventionally, a multilayer wiring printed circuit board is, for example,
It is manufactured by the method disclosed in JP-A-9-246728. That is, a varnish is applied on the metal foil, and the solvent is dried and removed to form an insulating adhesive layer serving as an insulating layer. Next, after attaching a cover film on the insulating adhesive layer, a laser beam is irradiated from the cover film surface to form a non-through hole reaching the metal foil. Next, the non-through hole is filled with a conductive paste and heated to make the conductive paste semi-cured. Thereafter, the cover film is peeled off to obtain a material for a multilayer printed wiring board. This material for a multilayer printed wiring board is positioned and laminated on the surface of the inner layer board on which the inner layer circuit is formed so that the metal foil is on the outside, and is integrated by pressing and heating. Next, the metal foil is etched to form a conductor pattern. By repeating these steps, a multilayer printed wiring board is obtained.

[0003]

However, the conventional manufacturing method has a problem in that when the layers are heated after lamination, the printed wiring board is warped and the reliability of the joints of the mounted components is reduced. Further, since the materials for the multilayer printed wiring board are laminated one by one to form a multilayer, heat history to the inner layer board is applied every laminating step, so that there is a problem that dimensional change of the inner layer board and thermal deterioration occur.

Accordingly, the present invention has been made to solve the above-mentioned problems, and to provide a method of manufacturing a multilayer printed wiring board capable of improving the reliability of a joint portion of a mounted component and suppressing dimensional change and thermal deterioration of an inner layer board. The purpose was.

[0005]

In order to solve the above-mentioned problems, a method of manufacturing a multilayer printed wiring board according to the present invention comprises the steps of: laminating a plurality of wiring layers with an insulating layer interposed therebetween; In a method for manufacturing a multilayer printed wiring board electrically connected by an interlayer connection conductor filled in one or more provided through holes, the insulating layer is a thermosetting resin sheet containing a reinforcing material. , Having wiring layers on both sides
At least one first laminated unit comprising a plurality of insulating layers, and the insulating layer laminated on one side of the first laminated unit;
A wiring layer on one main surface, one or more second laminated units having exposed interlayer connection conductors on the other main surface, and the insulating layer laminated on both surfaces of the first laminated unit; One or more third laminated units having exposed interlayer connection conductors on two main surfaces are aligned and laminated so that interlayer connection conductors and wiring layers are alternately arranged in the lamination direction. Features.

According to the manufacturing method of the present invention, since the insulating layer contains a reinforcing material to increase the rigidity and reduce the difference in thermal expansion between the laminated units, even if a plurality of laminated units are laminated and heated. No warpage occurs on the printed wiring board. In addition, since the laminated unit including two or three insulating layers and the laminated unit including one insulating layer are combined and laminated, the number of heating steps is reduced as compared with the case where the insulating layers are laminated one by one. Thus, the dimensional change and thermal deterioration of the printed wiring board can be suppressed.

Further, the production method of the present invention comprises a step of bringing a first conductive film into close contact with one main surface of a thermosetting resin sheet to integrate the first conductive film and a step of forming a through hole from the other main surface. And a step of filling the through hole with a conductive paste to form an interlayer connection conductor, and a step of bringing the second conductor film into close contact with the other main surface of the thermosetting resin sheet to integrate them.
Forming the first laminated unit by a method including a step of curing the thermosetting resin sheet and the conductive paste, and a step of patterning the first and second conductive films to form a wiring layer. it can.

[0008] Further, the manufacturing method of the present invention comprises a step of bringing a thermosetting resin sheet containing a reinforcing material into close contact with one surface of the first laminated unit to integrate the thermosetting resin sheet with the first laminated unit; Forming a second laminated unit by a method including a step of forming a through hole exposing an interlayer connecting conductor of the laminated unit and a step of filling the through hole with a conductive paste to form an interlayer connecting conductor. Can be.

[0009] Further, the production method of the present invention comprises the steps of: adhering and integrating a thermosetting resin sheet containing a reinforcing material on both surfaces of the first laminated unit; Forming a through hole exposing the interlayer connection conductor of the laminated base material; and filling the through hole with a conductive paste to form an interlayer connection conductor.
Can be formed.

[0010] In the production method of the present invention, it is preferable that the conductive paste is semi-cured before the second conductive film is brought into close contact with the other main surface of the thermosetting resin sheet.

Further, in the manufacturing method of the present invention, in the method of forming the first, second and third laminated units, before the step of forming the through-hole in the thermosetting resin sheet, the upper surface of the thermosetting resin sheet is formed. And a step of peeling off the protective sheet after forming the interlayer connection conductor.

Further, in the production method of the present invention, the reinforcing material is preferably fibrous, and it is preferable to use either glass fiber or liquid crystal polymer.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. (Formation of Laminated Unit) FIGS. 1, 2 and 3 are schematic cross-sectional views showing manufacturing steps of a first laminated unit, a second laminated unit, and a third laminated unit, respectively.
First, a method for forming the first stacked unit will be described. The thermosetting resin sheet 1 is sandwiched between a cover film 4 which is a non-adhesive protective sheet and a first conductive film 2 made of a metal foil, laminated and integrated with a laminator or the like (FIGS. 1a and 1b). . Next, a through hole 5 having a reverse tapered cross section reaching the first conductive film 3 is formed in the thermosetting resin sheet 1 from the cover film 4 side by laser (FIG. 1C). The through holes 5 are filled with a conductive paste to form interlayer connection conductors 6 (FIG. 1d). At this time, the conductive paste is heated to a semi-cured state. Next, the cover film 4 is peeled off to obtain the thermosetting resin sheet 1 having the interlayer connection conductor 6 with one end of the interlayer connection conductor 6 exposed on one side (FIG. 1e). Next, a second conductive film 3 made of a metal foil is laminated on the thermosetting resin sheet 1 having the interlayer connection conductor 6 and integrated with a laminator or the like to form a thermosetting resin having the second conductive film on both surfaces. A resin sheet 1 is obtained (FIGS. 1f and 1g). Next, the first and second conductive films are patterned by etching or the like so as to have a desired circuit pattern, thereby forming wiring layers 7 and 8, and forming the first and second conductive films.
Is obtained.

Next, a method of forming the second laminated unit will be described. The thermosetting resin sheet 1 and the cover film 4 are laminated on one side of the first laminated unit 10, and are integrally molded with a laminator or the like (FIGS. 2A and 2B). Next, a through hole 11 having a reverse tapered cross section reaching the wiring layer 7 is formed in the thermosetting resin sheet 1 from the cover film 4 side by laser (FIG. 2C). The through holes 11 are filled with a conductive paste to form interlayer connection conductors 12 (FIG. 2D). At this time, the conductive paste is heated to a semi-cured state. Next, the cover film 4 is peeled off to obtain the second laminated unit 20 (FIG. 2E). The second laminated unit 20 has the wiring layer 8 on one main surface, and one end of the interlayer connection conductor 12 is exposed on the other main surface.

Next, a method of forming the third laminated unit will be described. The thermosetting resin sheet 1 and the cover film 4 are respectively laminated on both surfaces of the first laminated unit 10,
It is integrally molded with a laminator or the like (FIGS. 3A and 3B).
Next, through holes 21 and 22 having reverse tapered cross sections reaching the wiring layers 7 and 8 are formed in the thermosetting resin sheet 1 from the cover film 4 side by laser (FIG. 3C). The through holes 21 and 22 are filled with a conductive paste to form interlayer connection conductors 23 and 24 (FIG. 3).
d). At this time, the conductive paste is heated to a semi-cured state. Next, the cover film 4 is peeled off to obtain a third laminated unit 30 (FIG. 3E). Third laminated unit 3
0, one end of the interlayer connection conductors 21 and 22 is exposed on both surfaces.

(Method 1 of Forming Multilayer Printed Wiring Board) FIG. 4 is a schematic cross-sectional view showing an example of a manufacturing process of a multilayer printed wiring board using a laminated unit. The third laminated unit 30 is used as an inner layer plate, and the first laminated unit 10 to be an outer layer plate is placed on the front and back surfaces of the third laminated unit 30 so that connection conductors and wiring layers are alternately arranged in the laminating direction. Laminate (FIG. 4a). Then, the laminate is pressed and heated,
A multilayer printed wiring board 50 having six wiring layers is obtained (FIG. 4B).

(Method 2 of Forming Multilayer Printed Wiring Board) FIG. 5 is a schematic cross-sectional view showing another example of the manufacturing process of a multilayer printed wiring board using a laminated unit. The third laminated unit 30 is used as an inner layer plate, and the second laminated unit 20 to be an outer layer plate is formed on the front and back surfaces of the third laminated unit 30 so that connection conductors and wiring layers are alternately arranged in the laminating direction. The first conductor film 2 made of a metal foil is further laminated on the outermost layer (FIG. 5A). Next, press the laminate to
Heat and integrate (FIG. 5b). Next, the first conductive film 2 made of the outermost metal foil is patterned into a desired circuit pattern to form the wiring layers 17 and 18 to obtain a multilayer printed wiring board 60 having eight wiring layers (FIG. 5).
c).

Method 1 for forming the above-mentioned multilayer printed wiring board
As is clear from the descriptions of and 2, the laminated unit having at least one side of the wiring layer is used as the outer layer plate, and the laminated unit having the interlayer connecting conductor exposed on both sides is used as the inner layer plate, and the wiring layer and the interlayer connecting conductor are stacked in the stacking direction. By alternately arranging the insulating layers and pressing and heating the outer layer plate and the inner layer plate at a time, the number of laminating steps can be reduced as compared with the case where the insulating layers are laminated one by one. Thereby, the heat load on the inner layer plate is reduced, and the dimensional change and thermal deterioration of the inner layer plate can be suppressed. In addition, since the first laminated unit having the wiring on both sides is used as the outer layer plate, it is not necessary to newly provide a wiring layer on the outermost layer, so that the process can be further simplified.

Here, the above-described methods 1 and 2 for forming a multilayer printed wiring board are for the case where the total number of insulating layers of the laminated unit to be laminated is an odd number. In this case, a printed wiring board having an even number of wiring layers is formed. can do. When the total number of insulating layers of the laminated units to be laminated is an even number, a printed wiring board having an odd number of wiring layers can be formed. For example, when the first laminated unit is laminated as an outer layer plate and the third laminated unit is laminated as an inner layer plate, and a wiring layer is formed on one surface of the third laminated unit, the total number of insulating layers becomes 4, and the wiring of 5 layers is formed. A printed wiring board having layers can be formed. In addition, the first laminated block and the second laminated block are laminated as an outer layer plate, the third laminated block is laminated as an inner layer plate, and a wiring layer is formed on one surface of the second laminated block. As a result, the printed wiring board having seven wiring layers can be formed.

In the thermosetting resin sheet containing a reinforcing material usable in the present invention, it is preferable to use fibers or fillers as the reinforcing material. By reinforcing the thermosetting resin sheet with a reinforcing material, the printed wiring board has low thermal expansion,
Rigidity is provided and surface mounting reliability is improved.

As the filler, a spherical or fibrous substance can be used. From the viewpoint of controlling the fluidity of the resin, a fibrous substance is preferably used. The content of the filler is
20% by weight to 7% due to workability and fluidity of resin during heating under pressure
About 0% by weight is preferable. If the content is less than 20% by weight, cracks and the like are likely to occur in the resin sheet, which causes problems in handling properties and also makes it difficult to control the fluidity of the resin during heating under pressure. On the other hand, when the content of the filler exceeds 70% by weight, the amount of the resin decreases, the adhesiveness of the thermosetting resin sheet decreases, and at the same time, the piercing property by laser decreases.

On the other hand, the fiber is preferably a glass cloth, a glass nonwoven fabric made of glass fiber, or a fiber mainly composed of a liquid crystal polymer such as wholly aromatic polyamide or polyarylate. By using a glass nonwoven fabric or a liquid crystal polymer nonwoven fabric obtained by straining glass fiber as a fiber, a printed wiring board having good surface smoothness, low thermal expansion, and high rigidity can be obtained. If a non-woven fabric of liquid crystal polymer such as wholly aromatic polyamide or polyarylate is used, the weight of the printed wiring board can be reduced.

As the thermosetting resin containing a filler or a fiber, one or a mixture of two or more of an epoxy resin, a BT resin, a polyimide resin, a Teflon resin, and a PPE resin is used.

The thickness of the thermosetting resin sheet is related to the pattern thickness of the inner layer board and the like, and needs to be at least equal to or larger than the pattern thickness of the inner layer board in view of the filling property of the inner layer board. Generally, the thickness of the thermosetting resin sheet is 20 to 200 μm.
m is preferable, but especially when the interlayer thickness is thinner than 40 μm, and when it is not necessary to impart sufficient low thermal expansion properties and rigidity to the printed wiring board, a thermosetting resin sheet in which a filler is dispersed is preferably used. Can be used.

It is preferable that the thermosetting resin sheet containing the fiber is manufactured by impregnating the fiber with a thermosetting resin previously melted in a solvent and then passing through a drying oven. This allows the residual solvent to be reduced to 0.
It is possible to suppress it to 5% or less. When the amount of the residual solvent is increased, the residual solvent is vaporized during the pressurizing and heating step for manufacturing the printed wiring board, so that separation between the layers of the printed wiring board occurs, and the possibility of causing a problem increases.

Further, it is necessary that the cover film can be easily drilled with a laser. Further, since there is a step of semi-curing the conductive paste by heating, heat resistance is also required. Examples of such a cover film include polytetrafluoroethylene, polyethylene terephthalate, polypropylene, polyvinylidene fluoride, and polyfluoroethylene having a release agent and an adhesive applied to the surface as needed. The thickness of these cover films is
5 μm or more is required because it can be bonded without wrinkles or the like. Further, it is desirable that the thickness be thin in terms of laser processing speed. In addition, a certain thickness is required in terms of handling. From such a point, the thickness of the cover film is preferably about 10 μm to 70 μm.

When a laminate is used in an integration step of obtaining various printed wiring board materials, such as integrating a thermosetting resin sheet and the above cover film on a metal foil, an apparatus for suppressing the generation of voids may be used. A vacuum laminator device is preferably used.

It is preferable to use laser processing as a method of forming the through holes. As a processing laser,
There are an excimer laser, a YAG laser, a carbon dioxide laser, and the like, and a carbon dioxide laser is preferably used from the viewpoint of a processing speed and a processing cost. The diameter of the through hole is 40 to 200μ
A diameter of about m is preferred.

When a through hole is formed by a carbon dioxide laser,
Since there is a possibility that a resin residue remains on the land surface of the inner layer plate, a process for removing the resin, which is generally called desmearing, is performed. As the desmear treatment of the through holes, cleaning using a plasma device is preferable.

The position accuracy of the through-hole is automatically recognized by an optical method such as a CCD camera mounted on the laser device, so that the position of the land of the inner plate is misaligned between the through-hole and the land of the inner plate. Can be almost completely prevented. This makes it possible to make the land diameter of the inner layer plate close to the diameter of the through hole, and to increase the density of the circuit pattern.

The metal foil used in the present invention is a foil of copper, nickel, aluminum or the like, and a copper metal foil is preferably used as a printed wiring board. Metal foil thickness is 3
About 100 μm is preferable. A thickness of less than 3 μm is advantageous for fine patterns, but causes problems in laser light penetration and handling. If it exceeds 100 μm, it is difficult to miniaturize the circuit pattern.

As a method of filling the conductive paste into the through-holes, a screen printing, a roll coater, a pressure discharge method and the like are suitably used. Excess conductive paste applied to the periphery of the through hole at the time of filling can be easily removed by peeling off the cover film. The conductive material used for the conductive paste is Cu, Ag, S
Since n, Au and their alloy powders are the main components, stable conduction can be obtained.

[0033]

EXAMPLES Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples. Embodiment 1 FIG. As the reinforcing fiber, an organic nonwoven fabric (thickness: 70 μm, surmount: manufactured by DuPont Teijin Advanced Paper Co., Ltd.) made of para-based wholly aromatic polyamide fiber was used. The epoxy resin varnish impregnated in the organic nonwoven fabric is as follows: 90 parts by weight of epoxy resin Epicoat 5046 (manufactured by Japan Epoxy Resin), 10 parts by weight of Epicoat 5048 (manufactured by Japan Epoxy Resin), and dicyandiamide (manufactured by Nippon Carbide) 2 as a curing agent. After mixing by weight, methyl ethyl ketone was added using imidazole as a catalyst, and a varnish was prepared so as to have a solid content of 50 parts by weight. After impregnating the organic woven fabric with this varnish, it is dried in a drying oven at a temperature of about 130 ° C. to 140 ° C. for about 7 to 15 minutes, and the removal of the solvent and the reaction of the impregnated resin proceed.
A thermosetting resin sheet (hereinafter, referred to as a prepreg sheet) was obtained.

The prepreg sheet is made of a metal foil having a roughened surface of an electrolytic copper foil having a thickness of 18 μm and a metal foil having a releasable thickness of 16 μm.
After sandwiching it with a cover film of a polyethylene terephthalate film of μm and integrating using a vacuum laminator, a carbon dioxide laser (6054GTX: manufactured by Mitsubishi Electric Corporation)
After forming a through hole having a diameter of 100 μm at a predetermined position of the prepreg sheet, a plasma cleaning process was performed to remove a residual film in the through hole.

Next, a conductive paste (DD-1801: manufactured by Kyoto Elex Co., Ltd.) is filled into the through holes from the polyethylene terephthalate film side by a vacuum screen printing method, and heated at 110 ° C. for 15 minutes so that the conductive paste is in a semi-cured state. After that, the cover film was peeled off.

Next, an electrolytic copper foil having a thickness of 18 μm is aligned and overlapped so that the roughened surface is opposed to the surface of the conductive paste in the through hole where the conductive paste is projected from the prepreg sheet.
They were integrated using a vacuum laminator device.

Thereafter, the land diameter is 150 μm and the line / space is 40 μm /
A first laminated unit having a circuit pattern of 40 μm was obtained. The prepreg sheet and the cover film were laminated and integrated on both surfaces of the first laminated unit by a vacuum laminator device. Next, after a through hole having a diameter of 100 μm was formed on both sides of the land provided in the first stacked unit by a carbon dioxide laser, plasma cleaning was performed on both sides to remove a residual film in the through hole.

Next, a conductive paste (DD-1801: manufactured by Kyoto Elex Co., Ltd.) was filled into the through holes on both sides of the cover film by a vacuum screen printing method.
After heating the conductive paste to a semi-cured state by heating for 5 minutes, the cover films on both sides were peeled off to obtain a third laminated unit.

After stacking the first stack on the front and back surfaces of the third stack unit by caulking or the like, the first stack is pressed under vacuum at a pressure of 30 kg / cm ^{2 at} a temperature of 175 ° C. under a pressure of 9 kg.
The mixture was heated under pressure for 0 minutes to obtain a 6-layer printed wiring board at once.
The flexural modulus of the obtained six-layer printed wiring board is 1240k.
gf / mm ² , thickness 0.32 mm, thermal expansion coefficient in the plane direction was 10.9 ppm / ° C., and a high bending elastic modulus and a high thermal expansion coefficient were obtained.

Embodiment 2 FIG. First and third laminated units were formed in the same manner as in Example 1 except that an organic nonwoven fabric (Veculus: manufactured by Kuraray Co., Ltd.) made of a polyacrylate-based liquid crystal polymer fiber was used as the reinforcing fiber. Further, a prepreg sheet and a cover film were laminated and integrated on one surface of the first laminated unit by a vacuum laminator device. Next, a through hole having a diameter of 100 μm was formed on one surface of the land provided in the second stack unit by a carbon dioxide gas laser, and a plasma cleaning process was performed on one surface to remove a residual film in the through hole.

Next, a conductive paste (DD-1801: manufactured by Kyoto Elex Co., Ltd.) was filled into the through holes from the cover film surface by a vacuum screen printing method, and heated at 110 ° C. for 15 minutes to make the conductive paste into a semi-cured state. Thereafter, the cover film was peeled off to obtain a second laminated unit.

The second laminated unit is laminated on the front and back surfaces of the third laminated unit, and 1
An electrodeposited copper foil having a thickness of 2 μm is arranged, and all are positioned by caulking or the like, and then the pressure is reduced to 30 kg / vacuum using a press.
cm ^{2 at} a temperature of 175 ° C. for 90 minutes and pressurized for 8
A copper clad laminate was obtained. Thereafter, the outermost copper foil is etched to make the line / space of the circuit pattern 35 μm / 35.
An 8-layer printed wiring board of μm was obtained. The obtained eight-layer printed wiring board has a flexural modulus of 1020 kgf / mm ² , a thickness of 0.43 mm, and a thermal expansion coefficient in the plane direction of 14.3 ppm /.
° C, and a high flexural modulus and a high coefficient of thermal expansion were obtained.

[0043]

As described above, according to the method for manufacturing a multilayer printed wiring board of the present invention, the reinforcing layer is contained in the insulating layer to increase the rigidity and reduce the difference in thermal expansion between the laminated units. Warpage does not occur, and misalignment between the wiring layer and the interlayer connection conductor is prevented. This makes it possible to increase the density of the wiring and improve the reliability. In addition, an arbitrary number of combinations of the second stacked unit including two insulating layers, the third stacked unit including three insulating layers, and the first stacked unit including one insulating layer are stacked and integrated by batch pressing. As a result, the dimensional change and thermal deterioration of the printed wiring board can be suppressed, and the process can be simplified.

In the manufacturing method of the present invention, the first laminated unit is formed by using a thermosetting resin sheet containing a reinforcing material. Warpage can be prevented.

Further, in the manufacturing method of the present invention, a thermosetting resin sheet containing a reinforcing material is brought into close contact with one surface of the first laminated unit and integrated to form a second laminated unit. In addition, it is possible to prevent the second stacked unit from warping due to heating during stacking.

Further, in the manufacturing method of the present invention, a thermosetting resin sheet containing a reinforcing material is brought into close contact with both surfaces of the first laminated unit and integrated to form a third laminated unit. In addition, it is possible to prevent the third stacked unit from warping due to heating during stacking.

Further, in the manufacturing method of the present invention, the conductive paste is semi-cured before the second conductive film is brought into close contact with the other main surface of the thermosetting resin sheet.
Since the conductive paste does not flow, the accuracy of alignment with the wiring layer can be improved.

Further, in the manufacturing method of the present invention, since the thermosetting resin sheet is covered with the cover film, no extra conductive paste adheres to the periphery of the through hole.
It is possible to increase the wiring density.

Further, according to the manufacturing method of the present invention, since the glass fiber or the liquid crystal polymer is used as the reinforcing material of the insulating layer, a printed wiring board having good surface smoothness, low thermal expansion and high rigidity can be provided. .

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a manufacturing process of a first laminated unit used in an embodiment of the present invention.

FIG. 2 is a schematic sectional view illustrating a manufacturing process of a second laminated unit used in the embodiment of the present invention.

FIG. 3 is a schematic sectional view illustrating a manufacturing process of a third laminated unit used in the embodiment of the present invention.

FIG. 4 is a diagram illustrating a batch press 6 according to an embodiment of the present invention.
It is a schematic cross section which shows the manufacturing process of a layer printed wiring board.

FIG. 5 is a diagram illustrating a collective press 8 according to an embodiment of the present invention.
It is a schematic cross section which shows the manufacturing process of a layer printed wiring board.

[Explanation of symbols]

1 thermosetting resin sheet, 2 first conductive film,
3 second conductor film, 4 cover film,
5 through-hole, 6,12,23,24 interlayer connection conductor,
7, 8, 17, 18 wiring layer, 10 first laminated unit, 20 second laminated unit, 30 third laminated unit, 506 printed wiring board, 608 printed wiring board.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/40 H05K 3/40 K (72) Inventor Yasuo Kawashima 2-3-2 Marunouchi 2-chome, Chiyoda-ku, Tokyo (72) Inventor Takeshi Muraki 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term (reference) 5E314 FF05 GG17 GG24 5E317 BB02 BB12 CC22 CC25 CD25 GG14 GG16 GG20 5E346 AA43 CC05 CC09 CC32 DD12 FF18 HH11 HH32

Claims (7)

[Claims] 1. A semiconductor device comprising: a plurality of wiring layers laminated via an insulating layer; and the wiring layers are electrically connected by an interlayer connection conductor filled in one or more through holes provided in the insulating layer. In the method for manufacturing a multilayer printed wiring board, the insulating layer is a thermosetting resin sheet containing a reinforcing material, and at least one first laminated unit including one insulating layer having wiring layers on both surfaces. One or more second laminated units having a wiring layer on one main surface and an exposed interlayer connection conductor on the other main surface. And at least one third laminated unit having the insulating layer laminated on both surfaces of the first laminated unit and having exposed interlayer connection conductors on two main surfaces, comprising: an interlayer connection conductor, a wiring layer, Are aligned so that they are alternately arranged in the stacking direction. Method for manufacturing a multilayer printed wiring board, which comprises laminating. 2. A method for forming the first laminated unit includes: a step of bringing a first conductive film into close contact with one main surface of the thermosetting resin sheet to integrate the first conductive film; A step of forming the through-hole, a step of filling the through-hole with a conductive paste to form an interlayer connection conductor, and a step of bringing the second conductor film into close contact with the other main surface of the thermosetting resin sheet to form an integrated body. A step of curing the thermosetting resin sheet and the conductive paste, and a step of patterning first and second conductive films to form the wiring layer. The manufacturing method according to claim 1, wherein 3. A method of forming the second laminated unit, comprising: bringing a thermosetting resin sheet containing a reinforcing material into close contact with one surface of the first laminated unit to integrate the thermosetting resin sheet; Forming a through hole exposing the interlayer connection conductor of the first laminated unit in the conductive resin sheet; and filling the through hole with a conductive paste to form an interlayer connection conductor. The manufacturing method according to claim 1, wherein 4. A method of forming the third laminated unit, comprising: bringing a thermosetting resin sheet containing a reinforcing material into close contact with both surfaces of the first laminated unit to integrate them; Forming a through hole exposing the interlayer connection conductor of the first laminated base material in the conductive resin sheet; and forming an interlayer connection conductor by filling the through hole with a conductive paste. The method according to claim 1, wherein: 5. The method according to claim 1, wherein the conductive paste is semi-cured before the second conductive film is brought into close contact with the other main surface of the thermosetting resin sheet. The manufacturing method described in (1). 6. The method of forming the first, second and third laminated units, wherein the step of forming the through-hole in the thermosetting resin sheet includes the step of forming a non-adhesion on the thermosetting resin sheet. 5. The method according to claim 2, further comprising the step of: stacking a protective sheet having a property, and further forming the interlayer connection conductor, and then peeling the protective sheet. 6. 7. The method according to claim 1, wherein the reinforcing material is fibrous and includes one of glass fiber and a liquid crystal polymer.