JP2002313935A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the problem that the quality of an analogue signal is deteriorated by receiving digital noise from a crystal-oscillator circuit when one chip is formed by an analogue circuit and a crystal-oscillator. SOLUTION: A crystal-oscillator circuit 5 generating a digital pulse signal for controlling a frequency changing circuit 3, for example, is disposed at a position that is furthermost from an RF circuit 2 handling high-frequency signals in an IC chip 1. Consequently, a high-frequency wave from the crystal-oscillator circuit 5 is attenuated at a rate of one for square of the distance, thereby preventing the problem that the high-frequency wave is superimposed on an analogue signal processed in the RF circuit 2 as digital noise.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device,
In particular, the present invention is suitable for use in a semiconductor device in which an analog circuit and an oscillation circuit are mounted in one semiconductor chip or one module.

[0002]

2. Description of the Related Art Radio receivers, portable telephone devices, PDAs
Background of the Invention With the spread of wireless communication terminals such as (Personal Digital Assistants), high integration of ICs and miniaturization of semiconductor elements have been rapidly advanced for the purpose of reducing the size and weight of these terminals. Under such circumstances, an attempt has been made to make a wireless circuit including passive components such as a capacitor into an IC (one chip) or one module.

Recently, there has been an increasing demand for mounting analog circuits and digital circuits in one chip or one module. For example, a radio receiver,
A wireless circuit (analog circuit) for transmitting and receiving an analog signal in a mobile phone device, a short-range wireless data communication technology such as Bluetooth and a wireless LAN, and a PL for channel selection.
Attempts have been actively made to integrate an L (Phase Locked Loop) frequency synthesizer circuit (digital circuit) and a baseband signal processing circuit (digital circuit) for digitally processing signals to be transmitted and received into one chip or one module. ing.

[0004]

In order to control these analog circuits or digital circuits, a crystal oscillation circuit for generating a digital control signal according to the oscillation frequency of the crystal oscillator is provided in the same chip as the analog circuit or the digital circuit. Often provided in the same module.

However, when an analog circuit and a crystal oscillation circuit are mounted in one chip or one module, harmonic components of a digital control signal such as a system clock generated from the crystal oscillation circuit are converted into analog noise as digital noise. There is a problem that the signal jumps into the circuit and deteriorates the characteristics of the analog signal to be transmitted and received. For example, when transmitting and receiving an audio signal, the sound quality is significantly degraded, making it very difficult to hear.

For example, as shown in FIG. 5, if the oscillation frequency of the crystal oscillator is 10 MHz, the second harmonic at 20 MHz, the third harmonic at 30 MHz, and the nth harmonic such as. Wave components are generated. These harmonics have relatively small attenuation even when the order increases.

On the other hand, taking an FM radio receiver as an example,
Japanese FM broadcast signals use a frequency band of 76 MHz to 90 MHz as a reception band. Therefore, in this case F
The eighth and ninth harmonics of the system clock generated from the crystal oscillation circuit are superimposed on the RF (Radio Frequency) analog signal in the M broadcast wave band. This causes a reduction in sensitivity of a signal to be originally received.

As described above, when an analog circuit such as an RF circuit and a crystal oscillation circuit are formed into one chip or one module, the frequency of the n-th harmonic of the digital pulse signal generated from the crystal oscillation circuit and the RF If the frequency of the analog signal handled by the circuit becomes substantially the same, the n-th harmonic will result in interfering with the analog signal, and the quality of the analog signal will be degraded.

The present invention has been made in order to solve such a problem. When an analog circuit and a crystal oscillation circuit are integrated into one chip or one module, digital noise is received from the crystal oscillation circuit. It is possible to suppress the inconvenience that the quality of the analog signal is deteriorated.

[0010]

According to the present invention, there is provided a semiconductor device comprising:
An analog circuit that performs processing related to a signal in a desired frequency band, and an oscillation circuit that generates a signal in which a harmonic of an oscillation frequency may exist in the desired frequency band are provided in one semiconductor chip. The oscillation circuit is arranged at a position farthest from the analog circuit or the input circuit for a signal in the desired frequency band.

According to another aspect of the present invention, there is provided a semiconductor device in which an analog circuit for performing a process related to a high-frequency signal in a desired frequency band and a digital circuit are mounted on one semiconductor chip. An oscillation circuit for generating a digital pulse signal according to an oscillation frequency is provided, and the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip.

According to another aspect of the present invention, there is provided an analog circuit for processing a high-frequency signal in a desired frequency band, a digital circuit for performing predetermined digital signal processing, a crystal oscillator oscillating at a predetermined frequency, An oscillation circuit for generating a digital pulse signal in accordance with the oscillation frequency of the oscillator, wherein the oscillation circuit is arranged at a position farthest from the analog circuit.

According to another aspect of the present invention, the crystal oscillator is arranged near the oscillation circuit.

According to another aspect of the present invention, there is provided a semiconductor device having a semiconductor chip in which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein a crystal oscillator oscillating at a predetermined frequency is provided. And an oscillation circuit in the semiconductor chip for generating a digital pulse signal according to the oscillation frequency of the crystal oscillator, wherein the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip. And

According to another aspect of the present invention, there is provided a semiconductor device having a semiconductor chip on which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein a crystal oscillator oscillating at a predetermined frequency is provided. And an oscillation circuit in the semiconductor chip that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator, and the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip, and A crystal oscillator is arranged near the oscillation circuit.

In another aspect of the present invention, the analog circuit is a wireless circuit for transmitting and / or receiving an analog signal wirelessly.

In another aspect of the present invention, an analog high-frequency circuit for wirelessly transmitting and / or receiving a high-frequency signal in a desired frequency band, and an oscillating circuit for generating a digital pulse signal according to the oscillation frequency of a crystal oscillator And 1
Wherein the oscillation circuit is provided at a position farthest from the high-frequency circuit in the semiconductor chip.

According to another aspect of the present invention, there is provided a semiconductor device having a semiconductor chip in which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein the high-frequency signal is transmitted wirelessly. And / or an analog high-frequency circuit for receiving, and an oscillation circuit for generating a digital pulse signal according to the oscillation frequency of the crystal oscillator, wherein the oscillation circuit is arranged at a position farthest from the high-frequency circuit in the semiconductor chip. It is characterized by the following.

In another aspect of the present invention, the oscillation circuit and the high-frequency circuit are arranged at diagonal positions of the semiconductor chip.

According to another aspect of the present invention, an analog circuit for processing a high-frequency signal in a desired frequency band, a crystal oscillator oscillating at a predetermined frequency, and a digital pulse signal generated according to the oscillation frequency of the crystal oscillator And an oscillator circuit for performing the operation in a single module, wherein the crystal oscillator and the oscillator circuit are arranged at a position farthest from the analog circuit in the module.

According to another aspect of the present invention, there is provided a semiconductor device in which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted in a single module, wherein the module has a predetermined frequency. A crystal oscillator that oscillates, and an oscillation circuit that generates a digital pulse signal in accordance with the oscillation frequency of the crystal oscillator, wherein the crystal oscillator and the oscillation circuit are arranged at a position farthest from the analog circuit in the module. It is characterized by the following.

In another aspect of the present invention, the module has one or more semiconductor chips, the analog circuit and the oscillation circuit are provided in the same semiconductor chip,
The oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip.

According to another aspect of the present invention, an analog circuit for processing a high-frequency signal in a desired frequency band, a crystal oscillator oscillating at a predetermined frequency, and a digital pulse signal generated according to the oscillation frequency of the crystal oscillator An oscillator circuit for performing the above-described operations is provided on one module, and the analog circuit, the crystal oscillator, and the oscillator circuit are separately arranged on both sides of a module substrate.

According to another aspect of the present invention, there is provided a semiconductor device in which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted in a single module, wherein the module has a predetermined frequency. A crystal oscillator that oscillates, and an oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator. The analog circuit, the crystal oscillator, and the oscillation circuit are separately arranged on both sides of a module substrate. It is characterized by the following.

In another aspect of the present invention, the analog circuit is a wireless circuit for transmitting and / or receiving an analog signal wirelessly.

The present invention comprises the above technical means. For example, in a semiconductor device in which an analog circuit for handling a high-frequency signal and an oscillation circuit for generating a digital pulse signal are mounted on one chip or one module, By arranging the oscillation circuit, which is the source of signal harmonics, as far as possible from the analog circuit, the harmonics from the oscillation circuit are attenuated at a ratio of one half of the distance,
It is possible to suppress the inconvenience that the harmonic from the oscillation circuit is superimposed as digital noise on the high-frequency analog signal processed by the analog circuit.

According to another feature of the present invention, for example, in a semiconductor device in which an analog circuit for handling a high-frequency signal and an oscillation circuit for generating a digital pulse signal are mounted on one module, the analog circuit and the digital pulse signal By arranging the oscillation circuit that is the source of the harmonics on a different module substrate surface, it is possible to shield the harmonics by the module substrate surface so that the harmonics from the oscillation circuit do not enter the analog circuit. Become.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration example of a semiconductor chip (IC chip) implementing a semiconductor device of the present invention.

In FIG. 1, an IC chip 1 according to this embodiment is shown.
Are related to an RF circuit 2 for performing processing relating to transmission and / or reception of a high-frequency signal via an antenna 7, a frequency conversion circuit 3 for converting the frequency of the signal to generate an intermediate frequency signal from the high-frequency signal, and an intermediate frequency signal. IF for processing
(Intermediate Frequency) circuit 4 and a crystal oscillation circuit 5 that generates a digital pulse signal for controlling the frequency conversion circuit 3. A crystal oscillator 6 that oscillates at a predetermined oscillation frequency is connected to the crystal oscillation circuit 5.

In the IC chip 1 having such a configuration,
The crystal oscillation circuit 5 and the crystal oscillator 6 are located farthest from the RF circuit 2, that is, the frequency conversion circuit 3 and the IF
It is arranged on the opposite side of the RF circuit 2 with the circuit 4 interposed. By arranging the crystal oscillation circuit 5 and the crystal oscillator 6 at such positions, the crystal oscillation circuit 5 and the crystal oscillator 6 that generate harmonics of the digital pulse signal can be connected to the RF circuit 2.
Can be arranged as far as possible.

Generally, an electromagnetic wave is two distances away from its source.
It attenuates at a rate of one power. Therefore, by disposing the crystal oscillation circuit 5 and the crystal oscillator 6 as far as possible from the RF circuit 2, the harmonic components of the digital pulse signal generated from the crystal oscillation circuit 5 can be sufficiently transmitted to reach the RF circuit 2. Attenuate the analog signal handled by the RF circuit 2 to n
The superimposition of the second harmonic can be suppressed. As a result, it is possible to suppress sound quality deterioration due to noise mixing in the analog signal.

Incidentally, an antenna 7 is usually connected to the RF circuit 2. Since the position near the antenna 7 is particularly easy to pick up electromagnetic waves in the RF circuit 2, it is preferable to dispose the crystal oscillation circuit 5 and the crystal oscillator 6 farthest from the antenna 7. That is, for example, when the antenna 7 is provided near one corner of the IC chip 1, it is preferable to dispose the crystal oscillation circuit 5 and the crystal oscillator 6 at diagonal positions as shown in FIG.

FIG. 2 is a diagram showing another example of the configuration of the IC chip 1, in which a mixed circuit of an analog circuit and a digital circuit is shown. An IC chip 10 shown in FIG. 2 includes an analog circuit 11 for processing an analog signal, a digital circuit 12 for processing a digital signal, and a crystal for generating a system clock (digital pulse signal) for controlling the analog circuit 11 or the digital circuit 12. An oscillation circuit 13 is provided. A crystal oscillator 14 that oscillates at a predetermined frequency is connected to the crystal oscillation circuit 13.

When the IC chip 10 has a function such as a radio receiver, a mobile phone, a wireless LAN, a Bluetooth interface, etc., the analog circuit 1
1 includes a wireless circuit (RF circuit, IF circuit, or the like) for transmitting and / or receiving an analog signal via the antenna 15. The digital circuit 12 includes a baseband signal processing circuit for digitally processing signals transmitted and received by the analog circuit 11.

In the present embodiment, as shown in FIG. 2, the analog circuit 11 and the digital circuit 12 are physically divided into two regions in the IC chip 10. In the example of FIG. 2A, the IC chip 10 is divided into regions in the vertical direction (or the horizontal direction), and the analog circuit 11 is arranged in one region.
The digital circuit 12 is arranged in the other area. The difference in the layout area between the analog circuit 11 and the digital circuit 12 is due to the difference in the scale of the built-in circuit.

In such an arrangement of the analog circuit 11 and the digital circuit 12, the crystal oscillation circuit 13 and the crystal oscillator 14 are located farthest from the analog circuit 11, that is, on the opposite side of the analog circuit 11 with respect to the digital circuit 12. Has been placed. In such a position, the crystal oscillation circuit 1
By arranging the crystal oscillator 3 and the crystal oscillator 14, the crystal oscillation circuit 13 and the crystal oscillator 14 that generate harmonics of the system clock can be arranged as far away from the analog circuit 11 as possible.

Therefore, the harmonic component of the digital pulse signal generated from the crystal oscillation circuit 13 is
In this case, the signal is sufficiently attenuated until the signal reaches 1 and the superimposition of the nth harmonic on the analog signal handled by the analog circuit 11 can be suppressed. As a result, it is possible to suppress sound quality deterioration due to noise mixing in the analog signal.

When the analog circuit 11 is constituted by a radio circuit as described above, it is usual that the antenna 15 is connected to this. The position near the antenna 15 is
Since the electromagnetic wave is particularly easily picked up in the analog circuit 11, it is preferable to dispose the crystal oscillation circuit 13 and the crystal oscillator 14 farthest from the antenna 15. That is, for example, when the antenna 15 is provided near one corner of the IC chip 10, it is preferable to dispose the crystal oscillation circuit 13 and the crystal oscillator 14 at diagonally opposite positions as shown in FIG.

FIG. 2B is a diagram showing another example of the arrangement of the analog circuit 11 and the digital circuit 12 in the IC chip 10. In the example of FIG. 2B, the analog circuit 11 is arranged in a region near one corner of the IC chip 10,
The digital circuit 12 is arranged in the remaining area (in this case, an L-shaped area surrounding the analog circuit 11). The crystal oscillation circuit 13 and the crystal oscillator 14
Is disposed at a position farthest from the analog circuit 11, that is, at a position diagonally opposite to the area of the analog circuit 11.

With this arrangement, the crystal oscillation circuit 13 and the crystal oscillator 14 can be arranged as far away from the analog circuit 11 as possible. Thus, it is possible to prevent harmonics of the digital pulse signal generated from the crystal oscillation circuit 13 from being superimposed on the analog signal handled by the analog circuit 11, thereby reducing digital noise. In particular, the antenna 15 and the crystal oscillation circuit 1
By arranging the crystal resonator 3 and the crystal oscillator 14 on the diagonal of the IC chip 10 so that the distance between them is maximized, it is possible to efficiently suppress interference with analog signals.

FIG. 3 is a diagram showing a specific example of an IC chip in which an analog circuit and a digital circuit are mounted together. This figure 3
Shows an example in which the function of the radio receiver is integrated into one chip. The IC chip 20 shown in FIG. 3 includes an RF amplifier 21, a mixer 22, and a local oscillator (OS
C) 23, an IF amplifier 24, a detection circuit 25, an audio amplifier 26, a PLL circuit 27, and the like.

The RF amplifier 21 receives a radio signal (high frequency signal) in the FM or AM broadcast wave band via the antenna 40 and the antenna filter 41 and amplifies the radio signal. The mixer 22 generates an intermediate frequency (IF) signal by mixing a high frequency signal output from the RF amplifier 21 and a signal having a local oscillation frequency output from the local oscillator 23, and supplies the intermediate frequency (IF) signal to the IF amplifier 24 in the next stage. Output.

The local oscillator 23 generates a signal of the frequency according to the local oscillation frequency controlled by the PLL circuit 27 according to the set desired reception frequency, and
Feed to 2. The reference frequency from which the local oscillation frequency is generated by the PLL circuit 27 is determined by the oscillation frequency of the crystal oscillator 31.

The IF amplifier 24 performs predetermined processing such as amplification on the IF signal output from the mixer 22 and outputs the result to a detection circuit 25 at the next stage. The detection circuit 25 detects the IF signal output from the IF amplifier 24 and outputs the result to the audio amplifier 26. The audio amplifier 26 amplifies and outputs the detection output from the detection circuit 25.

The IC chip 20 shown in FIG. 3 has, as digital circuits, for example, a crystal oscillation circuit 32, a digital counter 33, a digital controller 34, and a DARC (Da
Decoder 35 for ta Radio Channel (FM data broadcasting)
And so on. The crystal oscillation circuit 32 uses the crystal oscillator 31 that oscillates at a predetermined frequency to generate a system clock (digital pulse signal) for controlling the entire analog circuit and digital circuit.

The digital counter 33 includes the crystal oscillation circuit 3
The system clock is counted by the system controller 2 and the count value is supplied to, for example, the digital controller 34 and used to control a digital circuit. The digital controller 34 controls the entire digital circuit including the DARC decoder 35.

The DARC decoder 35 receives and decodes data transmitted by FM data broadcasting (mobile FM multiplex broadcasting). Here, processing such as error correction of received data based on the error correction code included in the transmission data is also performed.

It should be noted that the configuration inside the IC chip 20 shown here is merely an example, and it is not always necessary to provide all of these configurations. In addition to the configuration shown in FIG. 3, the antenna 4 includes a synthesizer for selecting a channel (selection of a reception frequency) and a volume circuit for adjusting a volume.
Other circuits necessary for processing the radio broadcast signal received at 0 may be provided.

As described above, in the IC chip 20 of the radio receiver in which the analog circuit and the digital circuit are mixedly mounted, the crystal oscillator 31 and the crystal oscillation circuit 32 are the RF amplifiers 21 which are particularly easy to pick up electromagnetic waves among the analog circuits.
, That is, the diagonal position of the IC chip 20 when viewed from the RF amplifier 21.

By arranging the crystal oscillator 31 and the crystal oscillation circuit 32 at such positions, it is possible to arrange a source of a harmonic that causes noise as far away from the RF amplifier 21 as possible. As a result, it is possible to suppress the inconvenience that the harmonic of the digital pulse signal generated from the crystal oscillation circuit 32 is superimposed on the high-frequency signal transmitted and received by the RF amplifier 21, and it is possible to reduce noise and suppress sound quality deterioration. it can.

In the example of FIG. 3, the RF amplifier 21 and
The crystal oscillator 31 and the crystal oscillation circuit 32
Although arranged at diagonal positions of the C chip 20, the present invention is not limited to this example. For example, RF amplifier 2
When 1 is arranged along one side of the IC chip 20,
The crystal oscillator 31 and the crystal oscillation circuit 32 may be arranged along one side (opposite side) on the opposite side. In short, the present invention is included in a case where the crystal oscillation circuit 32 is arranged at a position as far as possible from the RF amplifier 21 in the IC chip 20.

Although the crystal oscillator is shown as an external component of the IC chip in the examples of FIGS. 1 to 3, the crystal oscillator may be built in the IC chip. Also,
The oscillator and the oscillation circuit need not necessarily be made of quartz.

FIG. 4 is a diagram showing an example of the configuration of a module implementing the semiconductor device of the present invention. A module (a functional module such as a radio receiver, a mobile phone, a wireless LAN, and a Bluetooth interface) 50 mounted on one printed circuit board is an analog wireless circuit that transmits and / or receives a high-frequency signal. (Including an RF amplifier and an IF amplifier) 51 and the wireless circuit 5
1 includes a digital signal processing circuit (for example, a baseband signal processing circuit or the like) 52 for performing digital signal processing on a signal transmitted / received in 1, a crystal oscillator 53, and a crystal oscillation circuit 54.

The wireless circuit 51 is disposed near the antenna 55. Also, the digital signal processing circuit 52
Are arranged in an area adjacent to the wireless circuit 51. Further, the crystal oscillator 53 and the crystal oscillation circuit 54 are arranged in the module 50 at the position farthest from the analog radio circuit 51 (particularly, the RF amplifier), that is, on the opposite side of the radio circuit 51 with the digital signal processing circuit 52 interposed therebetween. are doing.
As described above, since the antenna 55 is disposed near the radio circuit 51, the crystal oscillator 53 and the crystal oscillation circuit 54
Is arranged at a position farthest from the antenna 55.

As a result, the crystal oscillator 53 and the crystal oscillation circuit 54, which are the sources of harmonics that cause interference with the analog signal, are replaced with the radio circuit 51 that easily picks up electromagnetic waves.
Can be arranged as far as possible. By arranging the crystal oscillator 53 and the crystal oscillation circuit 54 as far as possible from the wireless circuit 51 as described above, the crystal oscillation circuit 5
4 can be prevented from being superimposed on the analog signal transmitted and received by the wireless circuit 51, thereby reducing noise.

In the example of FIG. 4, the crystal oscillator 53
Although the example in which the crystal oscillation circuit 54 is arranged at the position farthest from the analog wireless circuit 51 in the module 50 has been described, the circuit is arranged by using both sides of the printed circuit board of the module 50, The 51, the crystal oscillator 53, and the crystal oscillation circuit 54 may be arranged on different surfaces. By doing so, the harmonics (electromagnetic waves) generated from the crystal oscillation circuit 54 can be shielded by the arrangement pattern (PCB pattern) of the printed circuit board, and can be prevented from reaching the wireless circuit 51.

As described above, the radio circuit 51 and the crystal oscillator 53
Even when the crystal oscillation circuit 54 and the crystal oscillation circuit 54 are arranged on different surfaces, it is preferable that the radio circuit 51 and the crystal oscillator 53 and the crystal oscillation circuit 54 are arranged at positions as far as possible. By doing so, it is possible to more reliably prevent the harmonics of the digital pulse signal generated from the crystal oscillation circuit 54 from being superimposed on the analog signal transmitted and received by the wireless circuit 51.

In FIG. 4, an analog circuit (wireless circuit 51) and a digital circuit (digital signal processing circuit 5) are shown.
2) has been described on a single module 50. However, as in the case of the IC chip 1 shown in FIG. 1, on a module on which only an analog circuit is mounted, a crystal oscillation is provided at a position farthest from the analog circuit. A crystal and a crystal oscillation circuit may be arranged.

In the above embodiment, the IC chips 1, 10,
Although the case where the analog circuit in the module 20 or the analog circuit in the module 50 is a wireless circuit has been described, the present invention is not particularly limited to this example. That is, the present invention can be applied to any analog circuit including a circuit that easily picks up electromagnetic waves.

In the above-described embodiment, an example has been described in which the analog circuit and the digital circuit are physically divided into regions and arranged. However, at least a circuit that easily picks up electromagnetic waves is located at a position far from the crystal oscillator and the crystal oscillation circuit as far as possible. , An analog circuit and a digital circuit may be mixed.

In addition, the above-described embodiment is merely an example of the embodiment for carrying out the present invention, and the technical scope of the present invention should not be interpreted in a limited manner. It is. That is, the present invention can be embodied in various forms without departing from the spirit or main features thereof.

[0062]

As described above, according to the present invention,
Analog circuit and oscillation circuit in one chip or one
In a semiconductor device mounted in one module, an oscillation circuit serving as a source of generation of harmonics of a digital pulse signal can be arranged as far as possible from an analog circuit. As a result, it is possible to suppress the inconvenience that harmonics from the oscillation circuit are superimposed as digital noise on an analog signal processed by the analog circuit without providing a special member for preventing noise. For example, when a voice signal is handled as an analog signal, the sound quality can be improved.

According to another feature of the present invention, in a semiconductor device in which an analog circuit and an oscillation circuit are mounted in one module, an analog circuit and an oscillation circuit serving as a generation source of a harmonic of a digital pulse signal are provided. By arranging on a different module substrate surface, it is possible to shield harmonics by the module substrate surface so that harmonics from the oscillation circuit do not jump into the analog circuit. As a result, it is possible to suppress the inconvenience that harmonics from the oscillation circuit are superimposed as digital noise on an analog signal processed by the analog circuit without providing a special member for preventing noise. In this case, by arranging the oscillation circuit on the back surface as far as possible from the analog circuit, it is possible to more reliably prevent the harmonics generated from the oscillation circuit from being superimposed on the analog signal processed by the analog circuit. become able to.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a circuit arrangement in an IC chip implementing a semiconductor device of the present invention.

FIG. 2 is a diagram showing another configuration example of an IC chip implementing the semiconductor device of the present invention.

FIG. 3 is a diagram showing an example of a circuit arrangement in an IC chip of a radio receiver implementing the semiconductor device of the present invention.

FIG. 4 is a diagram showing an example of a circuit arrangement in a module implementing the semiconductor device of the present invention.

FIG. 5 is a diagram showing a frequency spectrum for explaining a conventional problem.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 IC chip 2 RF circuit 3 Frequency conversion circuit 4 IF circuit 5 Crystal oscillator circuit 6 Crystal oscillator 7 Antenna 10 IC chip 11 Analog circuit 12 Digital circuit 13 Crystal oscillator circuit 14 Crystal oscillator 15 Antenna 20 IC chip 21 RF amplifier 22 Mixer Reference Signs List 23 Local oscillator 24 IF amplifier 25 Detection circuit 26 Audio amplifier 27 PLL circuit 31 Crystal oscillator 32 Crystal oscillation circuit 33 Digital counter 34 Digital controller 35 DARC decoder 40 Antenna 41 Antenna filter 50 Module (printed circuit board) 51 Radio circuit 52 Digital signal Processing circuit 53 Crystal oscillator 54 Crystal oscillation circuit 55 Antenna

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F038 CA02 CA03 CA06 DF12 5K011 DA01 DA03 DA06 DA13 GA05 GA06 JA01 KA04 5K052 AA02 BB02 BB07 DD16 FF35

Claims (16)

[Claims] An analog circuit for performing processing relating to a signal in a desired frequency band, and an oscillating circuit for generating a signal in which a harmonic of an oscillating frequency may exist in the desired frequency band are provided in a single semiconductor chip. A semiconductor device, wherein the oscillation circuit is arranged at a position farthest from the analog circuit or the input circuit for a signal in a desired frequency band in the semiconductor chip. 2. A semiconductor device in which an analog circuit for performing a process related to a high-frequency signal in a desired frequency band and a digital circuit are mounted on one semiconductor chip, wherein the semiconductor chip has a digital pulse signal according to a predetermined oscillation frequency. A semiconductor device, comprising: an oscillation circuit that generates the signal; and arranging the oscillation circuit at a position farthest from the analog circuit in the semiconductor chip. 3. An analog circuit for processing a high-frequency signal in a desired frequency band, a digital circuit for performing predetermined digital signal processing, a crystal oscillator oscillating at a predetermined frequency, and an oscillation frequency of the crystal oscillator An oscillation circuit for generating a digital pulse signal, wherein the oscillation circuit is arranged at a position farthest from the analog circuit. 4. The semiconductor device according to claim 3, wherein said crystal oscillator is arranged near said oscillation circuit. 5. A semiconductor device having a semiconductor chip in which an analog circuit for processing a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein the crystal oscillator oscillates at a predetermined frequency; An oscillation circuit in the semiconductor chip for generating a digital pulse signal in accordance with the oscillation frequency of the element, wherein the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip. 6. A semiconductor device having a semiconductor chip on which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein the crystal oscillator oscillates at a predetermined frequency; An oscillation circuit in the semiconductor chip for generating a digital pulse signal in accordance with the oscillation frequency of the oscillator, wherein the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip, and the crystal oscillator is A semiconductor device which is arranged near a circuit. 7. The semiconductor device according to claim 1, wherein the analog circuit is a wireless circuit for transmitting and / or receiving an analog signal wirelessly. 8. A semiconductor chip comprising: an analog high-frequency circuit for wirelessly transmitting and / or receiving a high-frequency signal in a desired frequency band; and an oscillation circuit for generating a digital pulse signal according to the oscillation frequency of a crystal oscillator. Wherein the oscillation circuit is arranged at a position farthest from the high-frequency circuit in the semiconductor chip. 9. A semiconductor device having a semiconductor chip on which an analog circuit for performing a process related to a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein the semiconductor device is configured to wirelessly transmit and / or receive the high-frequency signal. A semiconductor, comprising: an analog high-frequency circuit; and an oscillation circuit that generates a digital pulse signal in accordance with the oscillation frequency of the crystal oscillator, wherein the oscillation circuit is arranged at a position farthest from the high-frequency circuit in the semiconductor chip. apparatus. 10. The semiconductor device according to claim 8, wherein said oscillation circuit and said high-frequency circuit are arranged at diagonal positions of said semiconductor chip. 11. An analog circuit that performs a process related to a high-frequency signal in a desired frequency band, a crystal oscillator that oscillates at a predetermined frequency, and an oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator. A semiconductor device provided in one module, wherein the crystal oscillator and the oscillation circuit are arranged at a position farthest from the analog circuit in the module. 12. A semiconductor device in which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted in one module, wherein the module includes a crystal oscillator that oscillates at a predetermined frequency. An oscillation circuit that generates a digital pulse signal in accordance with the oscillation frequency of the crystal oscillator, wherein the crystal oscillator and the oscillation circuit are arranged at a position farthest from the analog circuit in the module. apparatus. 13. The module has one or more semiconductor chips, wherein the analog circuit and the oscillation circuit are provided in the same semiconductor chip, wherein the oscillation circuit is located farthest from the analog circuit in the semiconductor chip. The semiconductor device according to claim 11, wherein the semiconductor device is arranged in a semiconductor device. 14. An analog circuit for processing a high-frequency signal in a desired frequency band, a crystal oscillator oscillating at a predetermined frequency, and an oscillator circuit for generating a digital pulse signal according to the oscillation frequency of the crystal oscillator. A semiconductor device provided on one module, wherein the analog circuit, the crystal oscillator, and the oscillation circuit are separately arranged on both sides of a module substrate. 15. A semiconductor device in which an analog circuit for performing processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted in one module, wherein the module includes a crystal oscillator that oscillates at a predetermined frequency. A semiconductor circuit comprising: an oscillation circuit that generates a digital pulse signal in accordance with the oscillation frequency of the crystal oscillator; wherein the analog circuit, the crystal oscillator, and the oscillation circuit are separately arranged on both sides of a module substrate. apparatus. 16. The semiconductor device according to claim 11, wherein said analog circuit is a wireless circuit for transmitting and / or receiving an analog signal wirelessly.