JP2001358175A - Method of mounting electronic component and electronic component mounting unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of mounting electronic components and an electronic component mounting unit, which can uniformize distribution, of a bonding material in bonding surfaces of the electronic components with respect to a circuit forming block and enhance the reliability of bonding and sealing. SOLUTION: Electronic components 1, 51 are bonded to circuit-forming blocks 6, 56 via resin-containing bonding materials 5, 55, with bumps 2, 52 on electronic component bonding surfaces making electrically contact electrodes 7, 57 of the circuit form blocks, and they are bonded thermally to cause the bonding materials to harden, while a bonding material flow regulating members 3, 53 on the electronic component bonding surfaces regulate the flow or the bonding materials toward the peripheral parts of the electronic component bonding surfaces.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component such as a semiconductor element on a circuit formed body such as a substrate by using a bonding material containing at least a resin, and an electronic component mounted body manufactured by the method. About.

[0002]

2. Description of the Related Art Conventionally, a bump formed on an electrode on a bonding surface of a rectangular IC chip is brought into contact with an electrode of a circuit board, and a bonding material is arranged between the IC chip and the circuit board. In some cases, an IC chip is bonded and held on a circuit board.

[0003]

However, in the above-described structure, when the bumps are arranged in a large gap between the bumps arranged on the bonding surface of the rectangular IC chip, or when the bumps are arranged on the sides of the rectangle. When bonding an IC chip to a circuit board via a bonding material in a corner gap where no bumps are arranged, the bonding material sandwiched between the IC chip and the circuit board may cause the bonding material between the bumps of the IC chip. To escape to the surrounding area of the IC chip through the gap,
In the central portion of the IC chip, the density of the bonding material tends to be low, and the bonding force and the sealing force may be reduced.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and to achieve a uniform distribution of a bonding material in a bonding surface of an electronic component at the time of bonding to a circuit forming body, and to perform bonding and sealing. An object of the present invention is to provide an electronic component mounting method and an electronic component mounted body that can enhance reliability.

[0005]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a step of supplying a bonding material containing at least a resin to a circuit forming body or an electronic component, and a method of forming a plurality of convex electrodes on a bonding surface of the electronic component and the circuit forming body. A positioning step of positioning the electronic component and the circuit forming body via the bonding material so that the electrodes can be electrically contacted, and thermocompression-bonding the electronic component by heating and pressurizing; Main bonding step of curing the bonding material between the bonding surface of the electronic component and the circuit forming body in a state where the convex electrodes and the electrodes of the circuit forming body are in electrical contact with each other. In the final pressure bonding step, the joining material flow regulating member provided on the joining surface of the electronic component regulates the flow of the joining material toward the periphery of the joining surface of the electronic component. Characterized by To provide a method for mounting components.

According to a second aspect of the present invention, a step of supplying a bonding material containing at least a resin to a circuit-forming body or an electronic component; A positioning step of positioning the electronic component and the circuit formed body via the bonding material so that the electrodes of the formed body can be electrically contacted, and thermocompression-bonding the electronic component by heating and pressing, A book for curing the bonding material between the bonding surface of the electronic component and the circuit forming body in a state where the bumps on the electrodes of the electronic component and the electrodes of the circuit forming body are in electrical contact with each other. A pressure bonding step, wherein in the final pressure bonding step, a flow of the bonding material toward a peripheral portion side of the bonding surface of the electronic component is controlled by a bonding material flow control member provided on the bonding surface of the electronic component. As Provides a method of mounting an electronic component, characterized in that the.

According to a third aspect of the present invention, the joining material flow regulating member is provided at a wide interval where the interval between adjacent bumps on the joining surface of the electronic component is larger than the interval between other adjacent bumps. The electronic component according to the second aspect, wherein the dummy bumps are used, and in the final compression bonding step, the dummy bumps restrict the flow of the bonding material to a peripheral portion of the bonding surface of the electronic component in the wide gap portion. Provide an implementation method for.

According to a fourth aspect of the present invention, the bonding material flow regulating member is provided in a case where the plurality of bumps are formed in a row on two opposing sides of a rectangular bonding surface of the electronic component. There are a plurality of dummy bumps as a bonding material flow control member provided in a row on each of the other two opposite sides without bumps.
The electronic component mounting method according to the second aspect, wherein the dummy bumps restrict the flow of the bonding material toward the peripheral portion of the bonding surface of the electronic component on the other two opposite sides.

According to a fifth aspect of the present invention, the bonding material flow regulating member is provided in a case where the plurality of bumps are formed on each of two opposing sides of a rectangular bonding surface of the electronic component. A dummy bump as a bonding material flow control member provided at a corner portion having no bump,
The electronic component mounting method according to the first aspect, wherein, in the final pressure bonding step, the dummy bumps restrict the flow of the bonding material to a peripheral portion of the bonding surface of the electronic component at the corner portion. .

According to a sixth aspect of the present invention, when the plurality of bumps are formed in a row at the center of the rectangular joining surface of the electronic component, the joining material flow regulating member has no bump. A dummy bump as the bonding material flow regulating member provided in the portion, and in the main bonding step, the dummy bump causes the bonding material to flow toward the peripheral portion of the bonding surface of the electronic component at the corner portion. A method for mounting an electronic component according to the first aspect is provided.

According to a seventh aspect of the present invention, before the step of supplying the bonding material to the circuit forming body, the method further comprises the step of forming the plurality of bumps on the bonding surface of the electronic component. In the forming step, as the bonding material flow regulating member, a second bump formed between the adjacent bumps on the bonding surface of the electronic component at a wide interval portion larger than the interval between other adjacent bumps is provided with a dummy bump. 6
The electronic component mounting method according to any one of the above aspects is provided.

According to an eighth aspect of the present invention, the maximum pitch Pmax and the minimum pitch P of the pitches between the bumps of the electronic component or between the bumps and the dummy bumps.
When α is an arbitrary value of 1 to 6,
An electronic component mounting method according to any one of the second to seventh aspects, wherein a dummy bump is provided so that Pmax ≦ (Pmin × 2α).

According to a ninth aspect of the present invention, the joining material flow regulating member includes a passivation film in a rectangular area inside the row of the plurality of bumps near each side of the joining surface of the electronic component. In the case where the electronic component is provided, the electronic component is a bonding material flow control film provided in a portion where the passivation film is not provided on the bonding surface. The electronic component mounting method according to any one of the second to eighth aspects, wherein an increase in the flow speed of the bonding material in a portion where the passivation film is not provided on the bonding surface is provided.

According to a tenth aspect of the present invention, the joining material flow regulating member includes a passivation film in a rectangular area inside the row of the plurality of bumps near each side of the joining surface of the electronic component. If provided, the electronic component is an auxiliary passivation film provided in a rectangular frame region of a peripheral portion outside the row of bumps near the side of each side of the bonding surface of the electronic component. The auxiliary passivation film restricts an increase in the flow rate of the bonding material in a rectangular frame area around the outer side of the bump row near each side of the bonding surface of the electronic component. The electronic component mounting method according to any one of the above aspects is provided.

According to an eleventh aspect of the present invention, the bonding material flow regulating member includes a passivation film in a rectangular area inside the row of the plurality of bumps near each side of the bonding surface of the electronic component. If provided, it is a substantially rectangular auxiliary passivation film provided only at each corner of the outer peripheral portion of the row of bumps near the side of the bonding surface of the electronic component, and in the final pressure bonding step, The auxiliary passivation film regulates the flow rate of the bonding material at each corner of an outer peripheral portion of the row of bumps near the side of each side of the bonding surface of the electronic component. 8 provides a mounting method of the electronic component according to any one of aspects.

According to a twelfth aspect of the present invention, the joining material flow regulating member includes a passivation film in a rectangular region inside the row of the plurality of bumps near each side of the joining surface of the electronic component. If provided, a peripheral portion outside the row of bumps in the vicinity of each side of the bonding surface of the electronic component, and a region from a corner portion of the passivation film region to a corner portion of the outer peripheral portion. The auxiliary passivation film of a substantially rectangular shape provided in the, in the main compression bonding step, by the auxiliary passivation film, a peripheral portion outside the row of the bumps near the side of each side of the bonding surface of the electronic component with the electronic component The second to the second to regulate the rise of the flow velocity of the bonding material in the region from the corner of the passivation film region to the corner of the outer peripheral portion.
8 provides a mounting method of the electronic component according to any one of aspects.

According to a thirteenth aspect of the present invention, the joining material flow regulating member includes a passivation film in a rectangular region inside the row of the plurality of bumps near each side of the joining surface of the electronic component. If provided, it is an auxiliary passivation film provided in all regions other than the bumps on the bonding surface of the electronic component, and in the main compression bonding step, the auxiliary passivation film allows the bonding surface of the electronic component to An electronic component mounting method according to any one of the second to eighth aspects, wherein an increase in the flow rate of the bonding material in all regions other than the bumps is restricted.

According to a fourteenth aspect of the present invention, before the step of supplying the bonding material to the circuit forming body, the method further comprises the step of forming the passivation film on the bonding surface of the electronic component. In the forming process,
The method for mounting an electronic component according to any one of the tenth to thirteenth aspects, wherein an auxiliary passivation film is formed as a region where the passivation film is not formed on the bonding surface of the electronic component as the bonding material flow regulating member. I will provide a.

According to the fifteenth aspect of the present invention, in a state where the plurality of bumps of the plurality of electrodes on the bonding surface of the electronic component are in electrical contact with the electrodes of the circuit forming body, the bonding is performed via the bonding material containing at least resin. An electronic component mounting body constituted by joining the electronic component to the circuit forming body, wherein a joining material flow regulating member for regulating a flow of the joining material to a peripheral portion side of the joining surface of the electronic component. Is provided on the bonding surface of the electronic component.

According to a sixteenth aspect of the present invention, the joining material flow regulating member is provided at a wide interval where the interval between adjacent bumps on the joining surface of the electronic component is larger than the interval between other adjacent bumps. The electronic component package according to the fifteenth aspect, wherein the electronic component package is a dummy bump.

According to a seventeenth aspect of the present invention, the bonding material flow regulating member is provided in a case where the plurality of bumps are formed in a row on two opposing sides of a rectangular bonding surface of the electronic component. The electronic component package according to the fifteenth aspect, wherein the plurality of dummy bumps as the bonding material flow control members provided in rows on the other two opposing sides without bumps.

According to an eighteenth aspect of the present invention, the bonding material flow restricting member is provided in a case where the plurality of bumps are formed on two opposing sides of a rectangular bonding surface of the electronic component. The electronic component package according to the fifteenth aspect, which is a dummy bump as a bonding material flow control member provided at a corner portion having no bump.

According to a nineteenth aspect of the present invention, the joining material flow regulating member is a corner having no bump when a row of the plurality of bumps is formed at the center of the rectangular joining surface of the electronic component. The electronic component package according to the fifteenth aspect, wherein the electronic component package is a dummy bump as a bonding material flow regulating member provided in a portion.

According to a twentieth aspect of the present invention, the bonding material flow regulating member is a dummy bump, and the maximum pitch Pmax of the pitch between the bumps of the electronic component or the pitch between the bump and the dummy bump is equal to the maximum pitch Pmax. Minimum pitch P
When α is an arbitrary value of 1 to 6,
The electronic component package according to any one of the fifteenth to nineteenth aspects, wherein a dummy bump is provided so that Pmax ≦ (Pmin × 2α).

According to a twenty-first aspect of the present invention, a passivation film is provided in a rectangular area inside the row of the plurality of bumps near the side of each side of the bonding surface of the electronic component, and In a portion of the bonding surface where the passivation film is not provided, as the bonding material flow regulating member,
Any one of the fifteenth to twentieth to the fifteenth to twentieth to the eleventh to twentieth to the eleventh to twentieth having a bonding material flow regulating film for restricting an increase in the flow speed of the bonding material in a portion of the electronic component where the passivation film is not provided.
An electronic component package according to one aspect is provided.

According to a twenty-second aspect of the present invention, the bonding material flow control film as the bonding material flow control member is provided outside the bump row near each side of the bonding surface of the electronic component. 21. The electronic component mounted body according to the twenty-first aspect, wherein the electronic component mounted body is an auxiliary passivation film provided in a rectangular frame region of a peripheral portion of the electronic component mounted on the electronic component.

According to a twenty-third aspect of the present invention, the bonding material flow control film as the bonding material flow control member includes a peripheral portion outside the row of bumps near a side of the bonding surface of the electronic component. 21. The electronic component mounted body according to the twenty-first aspect, wherein the substantially rectangular auxiliary passivation film is provided only at each corner.

According to a twenty-fourth aspect of the present invention, the joining material flow regulating film as the joining material flow regulating member is provided outside the row of bumps near each side of the joining surface of the electronic component. 21. The electronic component package according to the twenty-first aspect, wherein the electronic component mounted body is a substantially rectangular auxiliary passivation film provided in a region from a corner portion of the passivation film region to a corner portion of the outer peripheral portion. .

According to a twenty-fifth aspect of the present invention, the bonding material flow control film as the bonding material flow control member is an auxiliary passivation film provided in all regions other than the bumps on the bonding surface of the electronic component. The electronic component package according to the twenty-first aspect is provided.

According to a twenty-sixth aspect of the present invention, there is provided the electronic component package according to the twenty-first aspect, wherein the joining material flow regulating film as the joining material flow regulating member is:

According to the twenty-seventh aspect of the present invention, the second to fourteenth aspects
An electronic component mounted body manufactured by the electronic component mounting method according to any one of the above aspects.

According to a twenty-eighth aspect of the present invention, a plurality of bumps are provided on the plurality of electrodes on the bonding surface, and the flow of the bonding material toward the peripheral portion of the bonding surface of the electronic component is formed on the bonding surface. With a joining material flow regulating member that regulates
In a state where the plurality of bumps of the plurality of electrodes on the bonding surface are in electrical contact with the electrodes of the circuit forming body, the electronic component mounted body is bonded to the circuit forming body via a bonding material containing at least a resin. Provided is an electronic component characterized by comprising.

According to a twenty-ninth aspect of the present invention, the joining material flow regulating member is provided at a wide interval where the interval between adjacent bumps on the joining surface of the electronic component is larger than the interval between other adjacent bumps. The electronic component according to the twenty-eighth aspect, wherein the electronic component is a dummy bump.

According to the thirtieth aspect of the present invention, a passivation film is provided in a rectangular area inside the row of the plurality of bumps near the side of each side of the bonding surface of the electronic component, and In a portion of the bonding surface where the passivation film is not provided, as the bonding material flow regulating member,
The electronic component according to the twenty-eighth or twenty-ninth aspect, further comprising a bonding material flow control film that controls an increase in a flow speed of the bonding material in a portion of the electronic component where the passivation film does not exist on the bonding surface.

[0036]

Embodiments of the present invention will be described below in detail with reference to the drawings. In each plan view, each bump and dummy bump are shown as rectangles for simplification, but the actual shape is not limited to this.

(First Embodiment) As an example of an electronic component mounting method according to a first embodiment of the present invention and an electronic component mounting body manufactured by the method, an IC chip mounting method and an IC chip manufactured by the method are manufactured. An IC chip mounted body will be described with reference to FIGS. FIGS. 1A and 1B are a side view and a back view of the IC chip before a bonding step of the IC chip mounting method according to the first embodiment, and FIG.
FIG. 2 is a side view of an IC chip, a circuit board, and a bonding material in a bonding process. FIG. 2 shows a flow state of the bonding material in a pressure bonding process, and shows movement of the bonding material on the circuit board through the IC chip. FIG. FIGS. 3A and 3B are a side view and a back view of the IC chip before a bonding step of a method of mounting an electronic component according to a conventional example for explaining the first embodiment. FIG. 4A is a side view of an IC chip, a circuit board, and a bonding material in a bonding step, and FIG. 4B shows a flow state of the bonding material in a pressure bonding step. It is a top view which shows the movement of a joining material.

As shown in FIG. 1 and FIG. 2, the mounting method of the above-described IC chip is as follows: a bonding surface of a square or rectangular IC chip 1 (square IC chip 1 in FIG. A row of bumps 2,..., 2 in a row near the edge of each of the four sides except for the corners of the four corners, being substantially parallel to the side and at substantially equal intervals. In the vicinity of the above-mentioned side, there is no bump 2 (in FIG. 1B, there is no bump 2 in the vicinity of the upper and lower two sides of the four sides of the IC chip 1), and the flow of the bonding material is restricted. A dummy bump 3 as an example of a member is formed, and the flow of the bonding material 5 is regulated by the dummy bump 3.

Conventionally, as shown in FIG. 3 and FIG. 4, the electrode 1 is placed near two opposing sides of the square IC chip 101 (upper and lower sides in FIG. 3B).
, 104 are arranged at substantially equal intervals, the position 103 where the bump 102 is missing, in other words, the adjacent bump 102, 1
It is assumed that there is a wide interval portion 103 in which the interval from the distance 02 is larger than the other intervals. Thus, the bump 10
After the bonding material 105 is supplied to the circuit board 106 in a state where the IC chips 101 are arranged on the IC chip 101, as shown in FIG. The bump 102 on the electrode 104 of the IC chip 101 and the electrode 107 of the circuit board 106 are electrically contacted between the bonding surface of the chip 101 and the circuit board 106 via the bonding material 105. The circuit board 106 is placed on a base 110, and the IC chip 101 is pressed and heated by pressing the heated pressing member 108 against the IC chip 101. Is pressed to cure the bonding material 105 between the bonding surface of the IC chip 101 and the circuit board 106. In such a case, the bonding material 105 is applied to the periphery of the bonding surface of the IC chip 101 from the wide space 103 where the bump 102 is missing, rather than the gap between the bumps 102,... IC chip 1
In the central portion of No. 01, the density of the bonding material 105 is lower than in the other portions, and the bonding force and the sealing force are reduced.

In order to prevent such a decrease in the bonding force and the sealing force, in the first embodiment, before the bonding material supplying step, as shown in FIGS. 1
Of the four sides (the upper and lower two sides in FIG.
In each of the neighborhoods of the sides of the (side), the bumps 2,.
Are arranged at substantially equal intervals, and a wide interval portion where the bump 2 is missing (see 103 in FIGS. 3 and 4), in other words, the interval between the adjacent bumps 2 and 2 is larger than other intervals. Place the dummy bump 3 in the other bump 2
And the bumps 2 are arranged at substantially equal intervals. As a result, the two opposite sides of the IC chip 1 (the upper and lower sides in FIG. 1B) are the other two opposite sides of the IC chip 1 (the left and right sides in FIG. 1B). In the vicinity of each part, a state similar to the state in which the bumps 2,.

As a method for forming each bump 2 and each dummy bump 3, there is a bump forming method shown in FIG.

With the bumps 2,..., 2 thus formed, in the bonding material supply step, the IC chip 1
Of the circuit board 6 as an example of the bonding surface of
A bonding material 5 containing at least an insulating thermosetting resin is supplied to at least one of the C chip bonding regions 6a. When the bonding material 5 is liquid, it is applied by applying, and when the bonding material 5 is a solid such as a sheet, it is mounted or attached.

Examples of the bonding material include an anisotropic conductive paste or a sealing resin paste in a liquid state, and a sheet-like anisotropic conductive film or a sealing resin film in a solid state. There is.

In this specification, a circuit-formed body is a circuit board such as a resin board, a paper-phenol board, a ceramic board, a film board, a glass epoxy (glass epoxy) board, a film board, a single-layer board or a multilayer board. Means an object on which a circuit is formed, such as a circuit board, a component, a housing, or a frame.

Then, in the bonding step, the IC chip bonding region 6a of the circuit board 6 is sandwiched with the bonding material 5 therebetween.
The bonding surfaces of the chip 1 are overlapped, and the bonding material 5 is interposed between the bonding surface of the IC chip 1 having the bumps 2 formed on the electrodes 4 and the IC chip bonding region 6 a of the circuit board 6. Then, the bumps 2 on the electrodes 4 of the IC chip 1 and the electrodes 7 of the circuit board 6 are positioned so as to be in electrical contact with each other and then joined. This bonding step may be performed in a state where the circuit board 6 is mounted on the base 10 or at another place via the bonding material 5 through the IC.
After the chip 1 is superimposed on the circuit board 6 and subjected to the bonding step, in the final pressure bonding step, the IC 1
The circuit board 6 on which the chip 1 is superimposed may be placed on the base 10.

Next, in the final pressing step, the pressing member 8
Is brought into contact with the IC chip 1 and the IC
A pressing force is applied from the pressing member 8 to the base 10 on which the circuit board 6 on which the chip 1 is superimposed is placed, and the heat of the heater built in the pressing member 8 is transferred from the pressing member 8 to the IC chip. Transmit to 1. As a result, by applying a predetermined pressing force while applying a predetermined temperature to press the bonding surface of the IC chip 1 against the IC chip bonding region 6a of the circuit board 6, the bonding surface of the IC chip 1 Bump 2 contacts each electrode 7 in the IC chip bonding area 6a of the circuit board 6 more than in the bonding step. At this time, the bonding material 5 between the bonding surface of the IC chip 1 and the IC chip bonding area 6a of the circuit board 6 is transferred to the IC chip.
An attempt is made to extrude the chip 1 from the center to the periphery of the bonding surface. Here, as described above, as a result of the dummy bumps 3 being arranged in the wide gap portions where the bumps 2 are missing, in the vicinity of the sides of each side of the bonding surface of the IC chip 1, Also in the vicinity, the bumps 2,..., 2 and the dummy bumps 3 are similarly arranged at substantially equal intervals, and similarly from the center to the periphery of the bonding material 5 in the vicinity of each side as shown by arrows in FIG. The flow of the bonding material 5 is regulated to prevent the bonding material 5 from flowing unevenly, and the bonding material 5 is distributed and maintained substantially uniformly over at least the entire bonding surface of the IC chip 1 and is cured by the heat. An IC chip mounted body can be manufactured. That is, in the final press-bonding step, the dummy bumps 3 provided on the IC chip 1 restrict the uneven extrusion of the bonding material 5 when the IC chip 1 is bonded from the central portion to the peripheral portion of the bonding surface. can do.

The height of each of the dummy bumps 3 as an example of the above-mentioned bonding material flow control member is one of the distance between the IC chip 1 and the circuit board 6 after the bonding between the IC chip 1 and the circuit board 6.
0% to 30% is preferable, and 20% is preferable as an example. As a specific numerical example, the height of the gap between the IC chip 1 and the circuit board 6 after bonding is 30 μm to 40 μm.
In this case, the height of the dummy bumps 3 is about 7 μm.

Each of the dummy bumps 3 preferably has heat resistance. As an example of the heat resistance, it means a property of withstanding heat at 200 ° C. for 20 seconds when the reflow step is unnecessary, and at 250 ° C. for about 10 seconds when passing through the reflow step.

Further, the bonding material 5 is not limited to a material composed of only an insulating thermosetting resin, but may include a conductive material containing conductive particles in the insulating resin, or may include an inorganic filler. It may be included. Thus, even when the conductive material or the inorganic filler is included in the bonding material 5, the flow of the resin is uniformized in the bonding surface of the IC chip 1 at the time of the pressure bonding by the dummy bumps 3, and the conductive material or the inorganic filler is removed. They can be arranged uniformly.
On the other hand, in the case where the dummy bump 3 is not provided, in the resin to which the inorganic filler is added, if the flow of the resin at the time of pressure bonding becomes uneven, the inorganic filler becomes coarse and dense, and the resin properties are partially different. The quality may be easily deteriorated, and in the case of a resin to which a conductive material has been added, if the flow of the resin at the time of press bonding becomes uneven, the conductive material may become coarse and dense, causing a partial short circuit.

In the above description, in the bonding process, each bump 2 of the IC chip 1 and each electrode 7 of the circuit board 6 are used.
However, the present invention is not limited to this. Each bump 2 of the IC chip 1 does not come into contact with each electrode 7 of the circuit board 6 in the bonding step, and the first pressing is performed in the final pressure bonding step.
Each bump 2 of the C chip 1 and each electrode 7 of the circuit board 6 may be in contact with each other.

According to the first embodiment, on the bonding surface of the square or rectangular IC chip 1, one row of bumps 2, , 2 and the IC chip 1
By forming a dummy bump 3 in a portion where the bump 2 does not exist near the side of the above-mentioned side of the bonding surface of the bump 2,
, 2 can be made substantially the same in the vicinity of each side of the IC chip 1, and the I
When the bonding material 5 flows from the central portion to the peripheral portion of the bonding material 5 between the bonding surface of the C chip 1 and the IC chip bonding region 6a of the circuit board 6, the dummy bump 3 functions as a bonding material flow regulating member. The flow of the bonding material 5 from the central portion to the peripheral portion in the vicinity of each side of the IC chip 1 is substantially uniform, and the distribution of the bonding material 5 in the bonding surface of the IC chip 1 Can be achieved, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

The position of the dummy bump as an example of the bonding material flow regulating member on the bonding surface of the IC chip 1 is not limited to the vicinity of the pair of opposing sides, but may be the vicinity of any one of the sides. In the row of bumps 2,... 2, the dummy bump 3 is placed at a position where the distance between the adjacent bumps 2, 2 is larger than the other distance.
And the bumps 2 may be arranged at substantially equal intervals.

The present invention is not limited to the above embodiment, but can be implemented in various other modes as described below.

(Second Embodiment) An IC chip mounting method as an example of an electronic component mounting method according to a second embodiment of the present invention and an electronic component mounted body manufactured by the method, and an electronic component mounted body manufactured by the method. An IC chip mounted body will be described with reference to FIG. FIGS. 5A and 5B are a side view and a back view of the IC chip before the bonding step in the method for mounting an IC chip according to the second embodiment, and FIG. 5C shows the IC chip and circuit in the bonding step. It is a side view of a board | substrate and a joining material, (d) shows the flow state of the joining material in a press bonding process,
FIG. 4 is a plan view showing movement of a bonding material on a circuit board through an IC chip. FIGS. 6A and 6B show the second example.
It is a side view and a back view of the above-mentioned IC chip before a joining process of a mounting method of an IC chip concerning a conventional example for explaining an embodiment. It is a side view, (d) is a top view which shows the flow state of the bonding material in a press-fitting process, and shows the movement of the bonding material on a circuit board through an IC chip.

In the first embodiment, the bumps 2,..., 2 are arranged in a row near the four sides of the square or rectangular IC chip 1. However, the present invention is not limited to this. is not. For example, in the second embodiment, as shown in FIG. 5, on a bonding surface of a rectangular IC chip 11 as an example of an electronic component, two opposing sides (four left and right sides in FIG. ), A row of bumps 12,...
12 near the remaining two sides (upper and lower sides in FIG. 5B) of the bonding surface of the IC chip 11,
That is, as an example of a bonding material flow control member, a row of dummy bumps 13,..., 13 is formed substantially in parallel with the sides and at substantially equal intervals only at portions where no bumps 12 are provided. It regulates the flow.

Conventionally, as shown in FIG.
The electrodes 114,..., In the vicinity of two opposing sides (two right and left sides in FIG.
The bumps 112,..., 112 are arranged on the 114 at substantially equal intervals, while the other two sides (the upper and lower sides in FIG.
Assume that 113 has no bumps 112 at all. In a state where the bumps 112,..., 112 are arranged on the IC chip 111, the bonding material 115 is applied to the circuit board 116.
And then the bumps 112 are formed on the electrodes 114 on the bonding surface.
The bump 11 on the electrode 114 of the IC chip 111 is interposed between the bonding surface of the IC chip 111 on which the
2 and the electrodes 117 of the circuit board 116 are joined so as to be in electrical contact with each other.
And the pressing member 11 heated on the IC chip 111
8 is pressed against the IC chip 111 in a heated and pressurized state.
The bonding material 115 between the bonding surface 1 and the circuit board 116 is cured. In such a case, the bonding material 115 is applied to the IC chip from the vicinity of the side of the position 113 where the bump 112 is missing rather than the vicinity of the side where the bumps 112,... 111 flows largely to the periphery of the above-mentioned bonding surface,
In the central portion of the C chip 111, the density of the bonding material 115 becomes low, and the bonding force and the sealing force decrease.

In order to prevent such a decrease in the joining force and the sealing force, in the second embodiment, as shown in FIGS. IC
The two opposing sides of the chip 11 without the bumps 12 (FIG. 5)
In (a) and (b), near each side of the upper and lower long sides (near sides), dummy bumps 13,..., And other bumps 12,. As in the vicinity of the short side, which is close to the short side, they are formed in a line at substantially equal intervals. As a result, the vicinity of the two opposing sides of the rectangular IC chip 11 (the two short sides on the left and right in FIG. 5B) and the other two opposing sides of the rectangular IC chip 11 (FIG. In b), there is no absence of the bumps 12 in the vicinity of the upper and lower long sides (two sides).
, 12 or the dummy bumps 13,..., 13 are arranged in a line.

Each bump 12 and each dummy bump 1
The method for forming 3 is the same as in the first embodiment.

In this manner, the bumps 12,..., 12 or the dummy bumps 13,.
In the bonding material supply step, the IC chip bonding region 16a of the circuit board 16 as an example of the bonding surface of the IC chip 11 or the circuit forming body is formed in the vicinity of each side of the IC chip.
Is supplied with a bonding material 15 containing at least an insulating thermosetting resin. Joining material 15
Is the same as in the first embodiment.

Next, in the joining step, the joining material 15
IC chip bonding area 16a of circuit board 16 with
The bonding surface of the IC chip 11 in which the bumps 12 are formed on the respective electrodes 14 and the IC chip bonding region 16a of the circuit board 16 are overlapped.
And the IC chip 1 via the bonding material 15.
The bumps 12 on each of the electrodes 14 and the electrodes 17 on the circuit board 16 are positioned so as to be in electrical contact with each other, and then joined. This bonding step may be performed in a state where the circuit board 16 is placed on the base 20, or the IC chip 11 is superimposed on the circuit board 16 via a bonding material 15 at another place and bonded. After performing the process,
In the final pressure bonding step, the circuit board 16 on which the IC chip 11 is superimposed via the bonding material 15 may be placed on the base 20.

Next, in the final pressing step, the pressing member 1
8 is brought into contact with the IC chip 11, and a pressing force is applied from the pressing member 18 to the base 20 on which the circuit board 16 on which the IC chip 11 is superimposed is placed via the bonding material 15, The heat of the heater built in the pressing member 18 is transmitted from the pressing member 18 to the IC chip 11.
As a result, the bonding surface of the IC chip 11 is pressed against the IC chip bonding region 16a of the circuit board 16 by applying a predetermined pressing force while applying a predetermined temperature, so that the IC chip 1
The bump 12 on each electrode 14 on the bonding surface of the first
Contact each electrode 17 in the IC chip bonding region 16a. At this time, the bonding material 15 between the bonding surface of the IC chip 11 and the IC chip bonding region 16a of the circuit board 16 is pushed from the center of the bonding surface of the IC chip 11 to the periphery. Try to get out. Here, as a result of arranging the dummy bumps 13 at the positions where the bumps 12 are missing as described above, the vicinity of each side of the bonding surface of the IC chip 11 is close to the vicinity of any side. Similarly, the bumps 12,..., 12 and the dummy bumps 13 are arranged at substantially equal intervals. Similarly, as shown by arrows in FIG. To prevent the bonding material 15 from flowing non-uniformly, and at least the bonding material 1 on the entire bonding surface of the IC chip 11.
5 are kept substantially uniformly distributed and cured by the above-mentioned heat, so that an IC chip mounted body can be manufactured. That is, in the final press-bonding step, the dummy bumps 13,..., 13 provided on the IC chip 11 cause the bonding material 15 to be uneven when the IC chip 11 is pressed from the central portion to the peripheral portion of the bonding surface. Extrusion can be regulated.

The height of each dummy bump 13, the heat resistance of each dummy bump 13, and the example of the bonding material 15 as examples of the above-mentioned bonding material flow regulating member are the same as in the first embodiment.

In the above description, each bump 12 of the IC chip 11 and each electrode 17 of the circuit board 16 are described to be in contact with each other in the bonding step. However, the present invention is not limited to this. The bumps 12 of the chip 11 and the electrodes 17 of the circuit board 16 may not be in contact with each other, and the bumps 12 of the IC chip 11 may be in contact with the electrodes 17 of the circuit board 16 for the first time in the final pressing step.

According to the second embodiment, on the bonding surface of the rectangular IC chip 11, a row of bumps 1 is provided at approximately equal intervals near the sides of the four sides excluding the four corners.
The dummy bumps 13,..., 13 are formed at positions where there is no bump 12 near the above-mentioned side of the bonding surface of the IC chip 11,
The arrangement state of the bumps 12,..., 12 can be substantially the same in the vicinity of each side of the IC chip 11, and the bonding surface of the IC chip 11 and the IC When the bonding material 15 flows from the central portion to the peripheral portion of the bonding material 15 between the chip bonding region 16a and the peripheral portion, the dummy bump 13 functions as a bonding material flow restricting member. The flow of the joining material 15 from the central portion to the peripheral portion is substantially uniformed,
In addition, the distribution of the bonding material 15 within the bonding surface of the IC chip 11 can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

The spacing between the dummy bumps 13,..., 13 is substantially the same as the spacing between the bumps 12,.
2,..., 12 are formed, the flow of the bonding material 15 from the central portion to the peripheral portion can be substantially uniformed, and the bonding material 15 can be formed within the bonding surface of the IC chip 11. The distribution of the bonding material 15 can be further uniformized. However, the present invention is not limited to this, and the dummy bumps 1,.
, 13 may be greater than the spacing between the bumps 12,.

(Third Embodiment) A mounting method of an IC chip as an example of an electronic component mounting method according to a third embodiment of the present invention and an electronic component mounted body manufactured by the method, and a manufacturing method of the IC chip manufactured by the method. An IC chip mounted body will be described with reference to FIGS. FIG. 7 (a) and (b)
FIGS. 7A and 7B are a side view and a back view of the IC chip before a bonding step of the IC chip mounting method according to the third embodiment;
FIG. 8C is a side view of the IC chip, the circuit board, and the bonding material in the bonding step. FIG. 8 shows the flow state of the bonding material in the pressure bonding step, and shows the bonding material on the circuit board through the IC chip. It is a top view which shows the movement of. FIGS. 9A and 9B are a side view and a back view of the IC chip before a bonding step of the IC chip mounting method according to the conventional example for explaining the third embodiment, and FIG. FIG. 3 is a side view of an IC chip, a circuit board, and a bonding material in a bonding step, and FIG. 4D shows a flow state of the bonding material in a pressure bonding step, and shows movement of the bonding material on the circuit board through the IC chip. FIG.

In the first and second embodiments, a row of bumps 2,..., 2; 12,..., 1 near the four sides of the square or rectangular IC chips 1 and 11 is provided.
The dummy bumps 3 and 13 are arranged at positions where a row of bumps are missing near the side of each side, but the present invention is not limited to this. For example, in the third embodiment, as shown in FIGS. 7A and 7B, on the bonding surface of the square IC chip 21, the vicinity of each of the four sides except for the vicinity of the four corners is provided. 22. A dummy bump 23 is formed as an example of a bonding material flow control member in the vicinity of each of the four corners of the bonding surface of the IC chip 21, that is, in a portion having no bumps. Thus, the flow of the bonding material 25 is regulated by the dummy bumps 23.

Conventionally, as shown in FIG.
, 124 on the electrodes 124,..., 124 near the sides of the bonding surface of the C chip 121, respectively.
122 are arranged in a line at substantially equal intervals,
It is assumed that there are no bumps 122 near the four corners of the bonding surface of the chip 121. In this way, bump 1
After the bonding material 125 is supplied to the circuit board 126 in a state where 22, 22,..., 122 are arranged on the IC chip 121, the bonding surface of the IC chip 121 in which the bumps 122 are formed on the electrodes 124 on the bonding surface. The IC chip 1 is connected to the circuit board 126 via the bonding material 125.
The bumps 122 on the electrodes 124 and the electrodes 127 of the circuit board 126 are joined so as to be in electrical contact with each other, and the circuit board 126 is placed on a
By pressing the heated pressing member 128 against the C chip 121 and pressurizing the same, the IC chip 121 is press-bonded in a heated and pressurized state, and between the bonding surface of the IC chip 121 and the circuit board 126. Is hardened. In such a case, the bonding material 125 is applied to the IC from the position where the bump 122 is missing, that is, near each corner 123, rather than the vicinity of the side where the bumps 122,... In order to largely flow out to the peripheral portion of the bonding surface of the chip 121,
In the central portion of the IC chip 121, the density of the bonding material 125 is reduced, and the bonding force and the sealing force are reduced.

In order to prevent such a decrease in the joining force and the sealing force, in the third embodiment, before the joining material supplying step, as shown in FIGS. IC
Near each corner portion 123 of the chip 21 where there is no bump 22
, One or more dummy bumps 23 are arranged. Here, the dummy bumps 23 are formed near the corners 123.
26, as shown in FIG. 26, the extension lines L1 and L2 of the row of bumps 22,... At the corner of the bonding surface of the IC chip 21 at 23A, 23A in the outer region R1 of the intersection region.
B, or in a region R2 surrounded by reference lines L3, L4 passing through the bumps 22 closest to the corners of each row and orthogonal to the extended lines L1, L2, respectively.
A, 23B, and 23C.
As a result, the bumps also exist near the corners of the square IC chip 21, and the bumps 22 and the bumps 22 are almost uniformly formed near all sides and near the corners.
, 22 or the dummy bumps 23,..., 23 are arranged.

Each bump 22 and each dummy bump 2
The method for forming 3 is the same as in the first embodiment.

In this way, the bumps 22,..., 22 or the dummy bumps 23,.
In the bonding material supply step, the IC chip bonding area 26a of the circuit board 26 as an example of the circuit forming body or the bonding surface of the IC chip 21 is formed in the vicinity of each side of the IC chip 21.
Is supplied with a bonding material 25 including at least an insulating thermosetting resin. Joining material 25
Is the same as in the first embodiment.

Next, in the joining step, the joining material 25
IC chip joining area 26a of circuit board 26 with
The bonding surface of the IC chip 21 on which the bumps 22 are formed on the respective electrodes 24 and the IC chip bonding region 26a of the circuit board 26 are overlapped.
And the IC chip 2 via the bonding material 25.
The bumps 22 on each of the electrodes 24 and the electrodes 27 on the circuit board 26 are positioned so as to be in electrical contact with each other and then joined. This joining step may be performed in a state where the circuit board 26 is placed on the base 30,
After the IC chip 21 is superimposed on the circuit board 26 via the bonding material 25 at another location and the bonding process is performed, the IC chip 21 is bonded via the bonding material 25 in the final pressing process.
May be mounted on the base 30.

Next, in the final pressure bonding step, the pressing member 2
8 is brought into contact with the IC chip 21, and a pressing force is applied from the pressing member 28 to the base 30 on which the circuit board 26 on which the IC chip 21 is superimposed is placed via the bonding material 25, The heat of the heater built in the pressing member 28 is transmitted from the pressing member 28 to the IC chip 21.
As a result, the bonding surface of the IC chip 21 is pressed against the IC chip bonding region 26a of the circuit board 26 by applying a predetermined pressing force while applying a predetermined temperature, whereby the IC chip 2
The bump 22 on each electrode 24 on the bonding surface of the first
To each electrode 27 in the IC chip bonding area 26a of the first contact area. At this time, the bonding material 25 between the bonding surface of the IC chip 21 and the IC chip bonding region 26a of the circuit board 26 is pushed from the center of the bonding surface of the IC chip 21 to the periphery. Try to get out. Here, as described above, as a result of the dummy bumps 23 being arranged at the positions where the bumps 22 are missing, that is, near the corners, any of the sides near the corners of the bonding surface of the IC chip 21 are also considered. Bump 2 as in the vicinity
, 22 and the dummy bumps 23 are arranged at substantially equal intervals. Similarly, as indicated by arrows in FIG. The bonding material 25 is prevented from flowing non-uniformly, and the bonding material 25 is substantially uniformly distributed and maintained at least over the entire bonding surface of the IC chip 21 and is cured by the heat. Thus, an IC chip mounted body can be manufactured. That is, in the final press-bonding step, the bonding material 2 at the time of press-bonding from the center to the periphery of the bonding surface of the IC chip 21 by the dummy bumps 23,.
5 can be controlled.

The height of each dummy bump 23 as an example of the bonding material flow regulating member, the heat resistance of each dummy bump 23, and the example of the bonding material 25 are the same as in the first embodiment.

In the above description, each bump 22 of the IC chip 21 and each electrode 27 of the circuit board 26 are described to be in contact with each other in the bonding step. However, the present invention is not limited to this. The bumps 22 of the chip 21 and the electrodes 27 of the circuit board 26 may not be in contact with each other, and the bumps 22 of the IC chip 21 may be in contact with the electrodes 27 of the circuit board 26 for the first time in the final press bonding step.

According to the third embodiment, in the bonding surface of the square IC chip 21, one row of bumps 2 are arranged at substantially equal intervals near the four sides except for the four corners.
, 22 in the vicinity of the above-mentioned side of the bonding surface of the IC chip 21 where the bumps 22 are not formed.
The arrangement state of the bumps 22,..., 22 can be made substantially the same in the vicinity of each side and each corner of the IC chip 21. IC chip bonding area 2 of circuit board 26
When the bonding material 25 flows from the central portion to the peripheral portion of the bonding material 25 between the bonding material 6a and the dummy bump 23, the dummy bump 23 functions as a bonding material flow restricting member, and the vicinity of each side and each corner of the IC chip 21. The flow of the bonding material 25 from the central part to the peripheral part is substantially uniform, and the IC
The distribution of the bonding material 25 within the bonding surface of the chip 21 can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

The spacing between the dummy bumps 23 arranged at the corners and the bumps 22, 22 adjacent to the dummy bumps 23 is substantially the same as the spacing between the bumps 22,. The bumps 22,..., 22 are similarly formed from the vicinity of the part to the corner part, and the flow of the bonding material 25 from the central part to the peripheral part can be further substantially uniformed.
In addition, the distribution of the bonding material 25 in the bonding surface of the IC chip 21 can be further uniformed. However, the present invention is not limited to this. In order to improve the uniformity as compared with the case where the dummy bumps 23,... Bump 2
, 22 may be larger than the arrangement interval.

(Fourth Embodiment) A mounting method of an IC chip as an example of an electronic component mounting method according to a fourth embodiment of the present invention and an electronic component mounting body manufactured by the method, and an electronic component mounted body manufactured by the method. An IC chip mounted body will be described with reference to FIG. FIGS. 10A and 10B are a side view and a back view of the IC chip before the bonding step of the IC chip mounting method according to the fourth embodiment, and FIG. 10C shows the IC chip and the circuit in the bonding step. It is a side view of a board | substrate and a bonding material, (d) is a top view which shows the flow state of the bonding material in a press-fitting process, and shows movement of the bonding material on a circuit board through an IC chip. Also, FIGS. 11A and 11B
FIGS. 7A and 7B are a side view and a rear view of the IC chip before a bonding step in a method of mounting an IC chip according to a conventional example for explaining the fourth embodiment, and FIG. FIG. 3D is a side view of the bonding material, and FIG. 4D is a plan view illustrating a flow state of the bonding material in a pressure bonding step and showing movement of the bonding material on a circuit board through an IC chip.

In the third embodiment, the square I
Although the bump 13 is provided near each of the four corners of the C chip 13, the present invention is not limited to this.
For example, in the fourth embodiment, as shown in FIGS. 10A and 10B, at the joining surface of the rectangular IC chip 31,
A row of bumps 32,.
A dummy bump 33 is formed as an example of a bonding material flow control member in the vicinity of each of the four corners of the bonding surface of the IC chip 31, that is, a portion having no bump, and the flow of the bonding material 35 is controlled by the dummy bump 33. It is.

Conventionally, as shown in FIG. 11, bumps 132,..., 132 are formed on electrodes 134,.
Are arranged in a line at substantially equal intervals, and bumps 1 are provided near the four corners of the bonding surface of the IC chip 131.
Assume that there is no 32 at all. Thus, the bump 132,
, 132 are arranged on the IC chip 131, and after the bonding material 135 is supplied to the circuit board 136,
IC having bumps 132 formed on electrodes 134 on the bonding surface
The IC chip 131 is provided between the bonding surface of the chip 131 and the circuit board 136 via the bonding material 135.
The bumps 132 on the electrodes 134 and the electrodes 137 on the circuit board 136 are joined so as to be in electrical contact with each other, and the circuit board 136 is mounted on a base 140, and an IC
By pressing the heated pressing member 138 against the chip 131 and pressurizing the same, the IC chip 131 is crimped in a heated and pressurized state, and the gap between the bonding surface of the IC chip 131 and the circuit board 136 is formed. The bonding material 135 is cured. In such a case, the bonding material 135 is removed from the IC 133 at a position where the bump 132 is missing, that is, near each corner 133, rather than near the side where the bumps 132,. Since a large amount flows out to the periphery of the bonding surface of the chip 131,
In the central portion of the C chip 131, the density of the bonding material 135 is reduced, and the bonding force and the sealing force are reduced.

In order to prevent such a decrease in the joining force and the sealing force, in the fourth embodiment, before the joining material supplying step, as shown in FIGS. I
Near each corner 13 where no bump 32 of C chip 31 exists 13
In 3, one or more dummy bumps 33 are formed. As a result, the bumps also exist near the corners of the rectangular IC chip 31, and the bumps 3 are almost uniformly formed near all sides and near the corners.
, 32 or the dummy bumps 33,..., 33 are arranged respectively.

Each bump 32 and each dummy bump 3
The method for forming 3 is the same as in the first embodiment.

In this manner, the bumps 32,..., 32 or the dummy bumps 33,.
In the bonding material supply step, the IC chip bonding region 36a of the circuit board 36 as an example of the circuit forming body is formed in the bonding material supply step.
Is supplied with a bonding material 35 containing at least an insulating thermosetting resin. Joining material 35
Is the same as in the first embodiment.

Next, in the joining step, the joining material 35
IC chip bonding area 36a of the circuit board 36 with the
The bonding surface of the IC chip 31 on which the bump 32 is formed on each of the electrodes 34 is overlapped with the bonding surface of the IC chip 31 and the IC chip bonding region 36 a of the circuit board 36.
And the IC chip 3 via the bonding material 35.
The bumps 32 on each of the electrodes 34 and the electrodes 37 on the circuit board 36 are positioned so as to be in electrical contact with each other and then joined. This bonding step may be performed in a state where the circuit board 36 is mounted on the base 40,
At another location, the IC chip 31 is superimposed on the circuit board 36 via the bonding material 35 to perform a bonding process.
May be placed on the base 40.

Next, in the final pressing step, the pressing member 3
8 is brought into contact with the IC chip 31, and a pressing force is applied from the pressing member 38 toward the base 40 on which the circuit board 36 on which the IC chip 31 is superimposed is placed via the bonding material 35, The heat of the heater built in the pressing member 38 is transmitted from the pressing member 38 to the IC chip 31.
As a result, by applying a predetermined pressing force while applying a predetermined temperature, the bonding surface of the IC chip 31 is pressed against the IC chip bonding region 36a of the circuit board 36, whereby the IC chip 3
The bump 32 on each electrode 34 on the bonding surface of the first
To the respective electrodes 37 in the IC chip bonding area 36a of FIG. At this time, the bonding material 35 between the bonding surface of the IC chip 31 and the IC chip bonding region 36a of the circuit board 36 is pushed from the center of the bonding surface of the IC chip 31 to the peripheral portion. Try to get out. Here, as described above, as a result of the dummy bumps 33 being arranged at the positions where the bumps 32 are missing, that is, near the corners, any of the sides near the corners of the bonding surface of the IC chip 31 is also considered. Bump 3 as in the vicinity
32, and the dummy bumps 33 are arranged at substantially equal intervals. As shown by arrows in FIG. 10D, the center of the bonding material 35 is also similarly formed near the sides of each side and near each corner. The flow from to the periphery is regulated,
It is possible to prevent the bonding material 35 from flowing non-uniformly and to maintain the bonding material 35 in a substantially uniform distribution at least over the entire bonding surface of the IC chip 31 and to cure the bonding material 35 by the heat to manufacture an IC chip mounted body. it can. That is,
In the final press bonding step, the dummy bumps 33,...
(1) Non-uniform extrusion of the bonding material 35 at the time of press bonding from the central portion to the peripheral portion of the bonding surface can be restricted.

The height of each dummy bump 33 as an example of the bonding material flow control member, the heat resistance of each dummy bump 33, and the example of the bonding material 35 are the same as in the first embodiment.

In the above description, each bump 32 of the IC chip 31 and each electrode 37 of the circuit board 36 are described to be in contact with each other in the bonding step. However, the present invention is not limited to this. The bumps 32 of the chip 31 and the electrodes 37 of the circuit board 36 may not be in contact with each other, and the bumps 32 of the IC chip 31 may be in contact with the electrodes 37 of the circuit board 36 for the first time in the final pressing step.

According to the fourth embodiment, in the bonding surface of the rectangular IC chip 31, one row of bumps 3 is provided at substantially equal intervals near the four sides except for the four corners.
, 32, and the dummy bumps 33,..., 33 are formed at locations where there is no bump 32 near the above-mentioned side of the bonding surface of the IC chip 31.
The arrangement state of the bumps 32,..., 32 can be made substantially the same in the vicinity of each side and each corner of the IC chip 31. IC chip bonding area 3 of circuit board 36
The dummy bump 33 functions as a bonding material flow regulating member when the bonding material 35 flows from the central portion to the peripheral portion of the bonding material 35 between the IC chip 31 and the vicinity of each side and each corner of the IC chip 31. The flow of the bonding material 35 from the central part to the peripheral part is substantially uniform, and the IC 35
The distribution of the bonding material 35 in the bonding surface of the chip 31 can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

Incidentally, if the interval between the dummy bumps 33 arranged at the corners and the bumps 32 adjacent to the dummy bumps 33 is substantially the same as the interval between the bumps 32,. The bumps 32,..., 32 are similarly formed from the vicinity of the portion to the corners, so that the flow of the bonding material 35 from the central portion to the peripheral portion can be further substantially uniformed.
In addition, the distribution of the bonding material 35 in the bonding surface of the IC chip 31 can be made even more uniform. However, the present invention is not limited to this. In order to improve the uniformity as compared with the case where the dummy bumps 33,..., 33 do not exist at all, the arrangement interval between the dummy bumps 33 and the bumps 32, 32 adjacent to the dummy bumps 33 is Bump 3
, 32 may be larger than the arrangement interval.

(Fifth Embodiment) A mounting method of an IC chip as an example of an electronic component mounting method and an electronic component mounting body manufactured by the method according to a fifth embodiment of the present invention, and a manufacturing method of the IC chip. An IC chip mounted body will be described with reference to FIGS. FIGS. 12A and 12B are a side view and a rear view of the IC chip before the bonding step in the method for mounting an IC chip according to the fifth embodiment, and FIGS. FIG. 13 is a side view and a front view of an IC chip, a circuit board, and a bonding material. FIG. 13 is a plan view showing a flow state of the bonding material in a pressure bonding process, showing movement of the bonding material on the circuit board through the IC chip. FIG. FIGS. 14A and 14B are a side view and a back view of the IC chip before a bonding step of an IC chip mounting method according to a conventional example for explaining the fifth embodiment.
FIGS. 14C and 15A are a side view and a front view of an IC chip, a circuit board, and a bonding material in a bonding process, and FIG. 15B shows a flow state of the bonding material in a pressure bonding process. ,
FIG. 4 is a plan view showing movement of a bonding material on a circuit board through an IC chip.

In the first embodiment, the bumps 2,..., 2 are arranged in a row near the four sides of the square or rectangular IC chip 1. However, the present invention is not limited to this. is not. For example, in the fifth embodiment, as shown in FIG. 12, a bonding surface of a rectangular IC chip 41 as an example of an electronic component has bumps 42,. The dummy bump 43 is formed as an example of a bonding material flow control member only in the vicinity of each corner portion, that is, only in a portion where the bump 42 is not provided, and the flow of the bonding material 45 is controlled by the dummy bump 43.

Conventionally, as shown in FIGS. 14 and 15, on the bonding surface of the rectangular IC chip 141, the bumps 142,... , 142 while no bump 142 exists in the vicinity 143 of each corner of the bonding surface of the IC chip 141. Thus, the bump 14
After the bonding material 145 is supplied to the circuit board 146 in a state where 2, 2,..., 142 are arranged on the IC chip 141, the bonding surface of the IC chip 141 having the bumps 142 formed on the electrodes 144 on the bonding surface. The IC chip 1 is connected to the circuit board 146 via the bonding material 145.
41, the bumps 142 on the electrodes 144 and the electrodes 147 of the circuit board 146 are joined so as to be in electrical contact with each other, and the circuit board 146 is placed on a base 150,
By pressing the heated pressing member 148 against the C chip 141 and pressurizing the same, the IC chip 141 is crimped in a heated and pressurized state, and between the bonding surface of the IC chip 141 and the circuit board 146. Is hardened. In such a case, the bumps 142,..., 142 are arranged in a row at the center in the short direction and arranged at substantially equal intervals in a row extending along the longitudinal direction.
, 142, a rectangular IC chip 141 is supported on the circuit board 146 at one point in the lateral direction, that is, in the width direction, as shown in FIG. It is difficult to equalize the balance of the bonding force between the IC chip 141 and the IC chip 141 inclines with respect to the circuit board 146 and the bumps 142,.
Chip 141 and circuit board 146 on both sides of the row
The gap between them tends to be uneven. As a result, FIG.
As shown by the arrow in FIG. 2B, the bonding material 145 is formed on one side of the row of the bumps 142,.
The large flow to the periphery of the bonding surface of the C chip 141 causes the density of the bonding material 145 to decrease on the one side, thereby lowering the bonding force and the sealing force.

In order to prevent such a decrease in the joining force and the sealing force, in the fifth embodiment, before the joining material supplying step, as shown in FIGS. I
Near each corner of the bonding surface of the C chip 41, that is,
At least one dummy bump 43 is formed in a portion where no bump 42 exists. As a result, the rectangular IC chip 41 is supported on the circuit board 46 at three points in the short direction, that is, in the width direction, and both sides of the row of the bumps 42,. As shown, the IC chip 41
And the balance of the bonding force between the IC chip 4 and the circuit board 46 can be substantially equalized.
1 can be prevented, and the gap between the IC chip 41 and the circuit board 46 can be made substantially uniform on both sides of the row of the bumps 42,.

Each bump 42 and each dummy bump 4
The method for forming 3 is the same as in the first embodiment.

In the state in which the bumps 42,..., 42 or the dummy bumps 43,.
A bonding material 45 including at least an insulating thermosetting resin is supplied to at least one of a bonding surface of the chip 41 and an IC chip bonding region 46a of a circuit board 46 as an example of a circuit forming body. The method of supplying the bonding material 45 is the first method.
This is the same as the embodiment.

Next, in the joining step, the joining material 45
IC chip bonding area 46a of the circuit board 46 with the
The bonding surface of the IC chip 41 is overlapped with the bonding surface of the IC chip 41 in which the bumps 42 are formed on the respective electrodes 44 and the IC chip bonding region 46 a of the circuit board 46.
And the IC chip 4 via the bonding material 45.
The bumps 42 on the electrodes 44 and the electrodes 47 on the circuit board 46 are positioned so as to be in electrical contact with each other, and then joined. This joining step may be performed in a state where the circuit board 46 is placed on the base 50,
After the IC chip 41 is superimposed on the circuit board 46 via the bonding material 45 at another place and the bonding process is performed, the IC chip 41 is bonded via the bonding material 45 in the final pressure bonding process.
May be placed on the base 50.

Next, in the final pressure bonding step, the pressing member 4
8 is brought into contact with the IC chip 41, and a pressing force is applied from the pressing member 48 to the base 50 on which the circuit board 46 on which the IC chip 41 is superimposed is placed via the bonding material 45, The heat of the heater built in the pressing member 48 is transmitted from the pressing member 48 to the IC chip 41.
As a result, by applying a predetermined pressing force while applying a predetermined temperature, the bonding surface of the IC chip 41 is pressed against the IC chip bonding area 46a of the circuit board 46, and thereby the IC chip 4
The bump 42 on each electrode 44 on the bonding surface of the first
To the respective electrodes 47 in the IC chip bonding area 46a of FIG. At this time, the rectangular IC chip 41 is
Are supported at three points in the short direction, that is, in the width direction, and on both sides of the row of bumps 42,.
As shown in FIG. 12D, the balance of the bonding force between the IC chip 41 and the circuit board 46 can be substantially equalized, and the IC chips 141 and the bumps 142 on both sides of the row of bumps 142,. The spacing between the circuit board 146 and the circuit board 146 can be made substantially uniform, and the flow of the bonding material 45 from the center to the periphery in the vicinity of each side as shown by arrows in FIG. It is regulated to prevent the bonding material 45 from flowing non-uniformly, and at least the IC chip 41
The bonding material 45 is distributed and maintained substantially uniformly over the entire bonding surface of the above and is cured by the above-mentioned heat, whereby an IC chip mounted body can be manufactured. That is, in the final press bonding step, the dummy bumps 4 provided on the IC chip 41 are removed.
Due to the use of 3,..., 43, uneven extrusion of the bonding material 45 when the IC chip 41 is pressed from the central portion to the peripheral portion of the bonding surface can be restricted.

The height of each dummy bump 43 as an example of the bonding material flow regulating member, the heat resistance of each dummy bump 43, and the example of the bonding material 45 are the same as in the first embodiment.

In the above description, the bumps 42 of the IC chip 41 and the electrodes 47 of the circuit board 46 are described to be in contact with each other in the bonding step. However, the present invention is not limited to this. The bumps 42 of the chip 41 and the electrodes 47 of the circuit board 46 may not be in contact with each other, and the bumps 42 of the IC chip 41 may be in contact with the electrodes 47 of the circuit board 46 for the first time in the final pressing step.

According to the fifth embodiment, on the joining surface of the rectangular IC chip 41, the rectangular IC chip 41 is supported on the circuit board 46 at three points in the short direction, that is, in the width direction. On both sides of the row of the bumps 42,..., 42, the balance of the bonding force between the IC chip 41 and the circuit board 46 can be made substantially uniform, and the inclination of the IC chip 41 with respect to the circuit board 46 can be prevented. The gap between the IC chip 41 and the circuit board 46 can be made substantially uniform on both sides of the row of the bumps 42,..., 42, and the bonding surface of the IC chip 41 and the circuit board in the crimping step can be formed. Bonding material 4 from the central portion to the peripheral portion of the bonding material 45 between the IC chip bonding region 46a and the IC chip bonding region 46a
5, the dummy bumps 43 function as a bonding material flow restricting member, and the flow of the bonding material 45 from the central portion to the peripheral portion is substantially uniform, and the bonding material 45 in the bonding surface of the IC chip 41 is provided. Distribution can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

Sixth Embodiment A method for mounting an IC chip as an example of an electronic component mounting method according to a sixth embodiment of the present invention and an electronic component mounting body manufactured by the method, and a method for manufacturing an IC component manufactured by the method. An IC chip mounted body will be described with reference to FIGS. 16A and 16B are a side view and a back view of the IC chip before the bonding step in the method for mounting an IC chip according to the sixth embodiment, and FIG. 17 shows the IC chip and the circuit in the bonding step. It is a side view of a board | substrate and a joining material. FIGS. 18A and 18B are a side view and a back view of the IC chip before the bonding step of the IC chip mounting method according to the conventional example for explaining the sixth embodiment, and FIG. It is a side view of an IC chip, a circuit board, and a joining material in the joining process of the above-mentioned conventional example.

In each of the above embodiments, the dummy bump is arranged at a position where the bump is not arranged as an example of the bonding material flow regulating member. However, the present invention is not limited to this. For example, in a case where a passivation film 59 for protecting the active surface (wiring surface) of the IC chip is provided in a rectangular area inside the row of bumps 52,..., 52 near each side of the bonding surface of the IC chip 51. Are bumps 52,..., 5 near each side of the bonding surface of the IC chip 51.
An auxiliary passivation film 53 (a satin area in the figure) is provided as a bonding material flow control film as an example of a bonding material flow control member in a rectangular frame region of a peripheral portion outside the second row. May be performed.

In the prior art, as shown in FIG. 18, one IC chip 151 is provided near each side of the bonding surface of the IC chip 151.
, 152 in rows and at substantially equal intervals, and a passivation film 159 (in the figure, satin area) in a square area surrounded by the four sides of the bumps 152,.
Is located. After the bonding material 155 is supplied to the circuit board 156 while the passivation film 159 is disposed on the IC chip 151 in this manner,
IC having bumps 152 formed on electrodes 154 on the bonding surface
The IC chip 151 is provided between the bonding surface of the chip 151 and the circuit board 156 via the bonding material 155.
The bumps 152 on the electrodes 154 and the electrodes 157 on the circuit board 156 are joined so as to be in electrical contact with each other, and the circuit board 156 is placed on the base 160, and the IC
By pressing the heated pressing member 158 against the chip 151 and pressurizing the same, the IC chip 151 is crimped in a heated and pressurized state, and a gap between the bonding surface of the IC chip 151 and the circuit board 156 is formed. The bonding material 155 is cured. In such a case, the passivation film 159
Are located within the bonding surface of the IC chip 151 on which
The position between the four sides of the bumps 152,..., 152 and the position outside the four sides of the bumps 152,. Since there is no passivation film 159, the flow speed of the bonding material 155 flowing in the relevant portion is increased, and the density of the bonding material 155 is reduced. And peeling will occur. As described above, the bonding material 1 is formed around the bonding surface of the IC chip 151.
When peeling occurs between the IC chip 151 and the semiconductor chip 55, moisture enters the peeled portion, and the IC chip 151 and the like due to moisture absorption corrode.

In order to prevent such a decrease in the joining force and the sealing force, in the sixth embodiment, before the joining material supplying step, as shown in FIGS. I
The passivation film 59 (in the figure, a square area surrounded by bumps 52,..., 52 arranged in a line and at substantially equal intervals in the vicinity of each side of the bonding surface of the C chip 51)
Not only) but also the four side bumps 52,
, 52, that is, an auxiliary passivation film 53 (a satin area in the figure) is disposed at a peripheral portion of the bonding surface. As a result, the four sides of the bumps 5 on the bonding surface of the IC chip 51 on which the passivation film 59 is disposed.
, 52, and four-sided bumps 52 on which the auxiliary passivation film 53 is disposed.
, 52, that is, the flow speed of the bonding material 55 flowing at the outer peripheral portion of the bonding surface is substantially the same, so that the density of the bonding material 55 can be prevented from lowering, and the close contact at the peripheral portion of the bonding surface can be prevented. It is possible to prevent a decrease in the force, that is, the joining force and the sealing force.

The method for forming each bump 52 is as follows.
This is the same as in the first embodiment. As a method for arranging the passivation film 59 and the auxiliary passivation film 53, there is a method of applying a resin for forming a passivation film. The application of the resin for forming a passivation film may be performed before or after the formation of the bumps 52. However, the application before the formation of the bumps 52 is preferable because the bumps 52 are not damaged when the resin for forming the passivation film is applied. The material and forming method of the auxiliary passivation film 53 are the same as those of the passivation film 59. As an example of each of the passivation film 59 and the auxiliary passivation film 53, the organic material is polyimide, the inorganic material is Si ₃ N ₄ , and when the substrate is made of resin and the substrate side is organic, the passivation film 59 and It is preferable that the auxiliary passivation film 53 is also made of an organic material to maintain the adhesiveness. Polyimide is formed by spin-coating a liquid and using a photolithography method.

As described above, the passivation film 59, the auxiliary passivation film 53, and the bumps 52,.
Is formed on the IC chip 51, in the bonding material supply step, at least one of the bonding surface of the IC chip 51 and the IC chip bonding region of the circuit board 56 as an example of a circuit formed body is provided with an insulating material. The bonding material 55 containing the thermosetting resin is supplied. The method of supplying the bonding material 55 is the same as in the first embodiment.

Next, in the joining step, the joining material 55
IC in the IC chip bonding area of the circuit board 56 with the
The bonding surface of the chip 51 is overlapped, and the bonding material 55 is interposed between the bonding surface of the IC chip 51 having the bumps 52 formed on the electrodes 54 and the IC chip bonding region of the circuit board 56. The bumps 52 on the electrodes 54 of the IC chip 51 and the electrodes 57 of the circuit board 56 are positioned so as to be in electrical contact with each other and then joined. This bonding step may be performed in a state where the circuit board 56 is placed on the base 60, or the IC chip 51 is superimposed on the circuit board 56 via a bonding material 55 at another place and bonded. After performing the step, the circuit board 56 on which the IC chip 51 is overlapped via the bonding material 55 may be placed on the base 60 in the final pressure bonding step.

Next, in the final pressure bonding step, the pressing member 5
8 is brought into contact with the IC chip 51, and a pressing force is applied from the pressing member 58 to the base 60 on which the circuit board 56 on which the IC chip 51 is superimposed is placed via the bonding material 55, The heat of the heater built in the pressing member 58 is transmitted from the pressing member 58 to the IC chip 51.
As a result, by applying a predetermined pressing force while applying a predetermined temperature to press the bonding surface of the IC chip 51 against the IC chip bonding region of the circuit board 56, the bonding surface of the IC chip 51 Bump 52 is an IC on circuit board 56
It contacts each electrode 57 in the chip bonding area. At this time,
IC chip 5 on which passivation film 59 is arranged
The flow velocity of the bonding material 55 and the auxiliary passivation film 53 are arranged in a square area surrounded by four side bumps 52,...
The flow velocity of the bonding material 55 at the position outside the side bumps 52,..., 52, that is, at the peripheral portion of the bonding surface becomes substantially the same, thereby preventing the density of the bonding material 55 from decreasing around the bonding surface. It is possible to prevent a decrease in the adhesion force, that is, the bonding force and the sealing force at the peripheral portion of the bonding surface, so that the bonding material 55 is distributed and maintained substantially uniformly over at least substantially the entire bonding surface of the IC chip 51. The composition is cured by the heat to produce an IC chip mounted body. In other words, in the main pressure bonding step, the passivation film 59 originally provided by the auxiliary passivation film 53 provided around the bonding surface of the IC chip 51 is used.
Are arranged on the four sides of the bump 52,
, 52 and a four-sided bump 52,
, 52, that is, the difference in the flow rate of the bonding material 55 between the outer peripheral portion of the bonding surface and the peripheral portion of the bonding surface is eliminated, and the flow speed of the bonding material 55 at the peripheral portion of the bonding surface of the IC chip 51 becomes faster. Can be prevented.

In the above description, each bump 52 of the IC chip 51 and each electrode 57 of the circuit board 56 are described to be in contact with each other in the bonding step. However, the present invention is not limited to this. The bumps 52 of the chip 51 and the electrodes 57 of the circuit board 56 may not be in contact with each other, and the bumps 52 of the IC chip 51 may be in contact with the electrodes 57 of the circuit board 56 for the first time in the final pressing step.

As an example, when the height of the bump 52 is 5
When the thickness is 0 to 75 μm, the thickness of the passivation film 59 and the auxiliary passivation film 53 is preferably 30 to 40 μm.

According to the sixth embodiment, the IC chip 5
In the vicinity of the side of each side of the bonding surface of No. 1, a passivation film 59 is formed in a square area surrounded by bumps 52,...
In addition, the auxiliary passivation film 53 (the satin area in the figure) is arranged at positions outside the four sides of the bumps 52,... The flow velocity of the joining material 55 is substantially the same at the peripheral portion and the peripheral portion, so that the density of the joining material 55 can be prevented from lowering. This can prevent the IC chip 51 and the like from corroding due to moisture absorption as a result of intrusion of moisture. Therefore, the distribution of the bonding material 55 within the bonding surface of the IC chip 51 can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

(Seventh Embodiment) An IC chip mounting method as an example of an electronic component mounting method according to a seventh embodiment of the present invention and an electronic component mounting body manufactured by the method, and an IC chip manufactured by the method. An IC chip mounted body will be described with reference to FIGS. 20A and 20B are a side view and a back view of the IC chip before the bonding step in the method for mounting an IC chip according to the seventh embodiment, and FIG. 21 shows the IC chip and the circuit in the bonding step. It is a side view of a board | substrate and a joining material. FIGS. 18A and 18B are a side view and a back view of the IC chip before a bonding step of an IC chip mounting method according to a conventional example for explaining the seventh embodiment. FIG. It is a side view of an IC chip, a circuit board, and a joining material in the joining process of the above-mentioned conventional example.

In the sixth embodiment, the bumps 52,..., 52 near the side of each side of the bonding surface of the IC chip 51 are provided.
Is provided with a passivation film 53 (a matte region in the figure) as a bonding material flow control film as an example of a bonding material flow control member in a rectangular frame region of a peripheral portion outside the row of the row, but is not limited thereto. is not. For example, in the seventh embodiment, a substantially rectangular auxiliary passivation film 63 (see FIG. 9) is provided only at each corner of the outer peripheral portion of the row of bumps 62,..., 62 near each side of the bonding surface of the IC chip 61. , 63) may be provided as an example of a bonding material flow control member, and the flow of the bonding material 65 may be controlled by the auxiliary passivation films 63,.

In the prior art, as shown in FIG.
, 152 in rows and at substantially equal intervals, and a passivation film 159 (in the figure, satin area) in a square area surrounded by the four sides of the bumps 152,.
Is located. After the bonding material 155 is supplied to the circuit board 156 while the passivation film 159 is disposed on the IC chip 151 in this manner,
IC having bumps 152 formed on electrodes 154 on the bonding surface
The IC chip 151 is provided between the bonding surface of the chip 151 and the circuit board 156 via the bonding material 155.
The bumps 152 on the electrodes 154 and the electrodes 157 on the circuit board 156 are joined so as to be in electrical contact with each other, and the circuit board 156 is mounted on the base 170, and the IC
By pressing the heated pressing member 158 against the chip 151 and pressurizing the same, the IC chip 151 is crimped in a heated and pressurized state, and a gap between the bonding surface of the IC chip 151 and the circuit board 156 is formed. The bonding material 155 is cured. In such a case, the passivation film 159
Are located within the bonding surface of the IC chip 151 on which
The position between the four sides of the bumps 152,..., 152 and the position outside the four sides of the bumps 152,. Since there is no passivation film 159, the flow speed of the bonding material 155 flowing in the relevant portion is increased, and the density of the bonding material 155 is reduced. And peeling will occur. As described above, the bonding material 1 is formed around the bonding surface of the IC chip 151.
When peeling occurs between the IC chip 151 and the semiconductor chip 55, moisture enters the peeled portion, and the IC chip 151 and the like due to moisture absorption corrode.

In order to prevent such a decrease in the joining force and the sealing force, in the seventh embodiment, as shown in FIGS. I
In the vicinity of the side of each side of the bonding surface of the C chip 61, a passivation film 69 (in the figure, a square region surrounded by bumps 62,...
Not only place pearskin area) but also
At the position outside the side bumps 62,..., 62, that is, in the region extending to the corners around the bonding surface, auxiliary passivation films 63,. . The reason that the bumps 62,..., 62 are arranged at the corners of the peripheral portion of the joining surface near the corners of the joining surface is larger than the other portions, so that the joining material 65 easily flows out. Since the flow velocity at the corner of the peripheral portion of the joining surface is more likely to be higher than at other portions, the auxiliary passivation films 63,.
3 is provided to regulate the flow of the bonding material 65. As a result, the four-sided bumps 62, 4 on the bonding surface of the IC chip 61 on which the passivation film 69 is disposed.
, 62 and the four-sided bumps 6 on which the auxiliary passivation films 63,.
The flow velocity of the joining material 65 is substantially the same at the positions outside of the joints 2, that is, at the corners around the joining surface, so that the density of the joining material 65 can be prevented from lowering. It is possible to prevent a decrease in the adhesion, that is, the bonding force and the sealing force at the corners of the peripheral portion.

The method for forming each bump 62 is as follows.
This is the same as in the first embodiment. Further, as a method of disposing the passivation film 69 and the auxiliary passivation films 63,..., 63, there is a method of applying a resin for forming a passivation film. The application of the resin for forming a passivation film may be performed before or after the formation of the bumps 62, but is preferably performed before the formation of the bumps 62 without damaging the bumps 62 when the resin for forming the passivation film is applied. The material and forming method of the auxiliary passivation films 63 are the same as those of the passivation film 69. As an example of each of the passivation film 69 and the auxiliary passivation film 63, the organic material is polyimide, and the inorganic material is Si.
₃ N is _4, when the substrate-side substrate is composed of a resin is organic, the passivation film 69 and the auxiliary passivation layer 63 include an organic material, it is preferable to hold the adhesive. Polyimide is formed by spin-coating a liquid and using a photolithography method.

As described above, the passivation film 69, the auxiliary passivation films 63,.
In a state where the IC chips 61 are formed on the IC chip 61, in the bonding material supply step, at least one of the bonding surface of the IC chip 61 and the IC chip bonding region of the circuit board 66 as an example of a circuit forming body. , A bonding material 65 containing at least an insulating thermosetting resin is supplied.
The method of supplying the bonding material 65 is the same as in the first embodiment.

Next, in the joining step, the joining material 65 is used.
IC in the IC chip bonding area of the circuit board 66 with the
The bonding surfaces of the chip 61 are overlapped, and the bonding material 65 is interposed between the bonding surface of the IC chip 61 having the bumps 62 formed on the electrodes 64 and the IC chip bonding region of the circuit board 66. The bumps 62 on the electrodes 64 of the IC chip 61 and the electrodes 67 of the circuit board 66 are positioned so as to be in electrical contact with each other and then joined. This bonding step may be performed in a state where the circuit board 66 is placed on the base 70, or the IC chip 61 is superimposed on the circuit board 66 via a bonding material 65 at another place and bonded. After performing the step, the circuit board 66 on which the IC chip 61 is overlaid via the bonding material 65 may be placed on the base 70 in the final pressure bonding step.

Next, in the final pressure bonding step, the pressing member 6
8 is brought into contact with the IC chip 61, and a pressing force is applied from the pressing member 68 to the base 70 on which the circuit board 66 on which the IC chip 61 is superimposed is placed via the bonding material 65, The heat of the heater built in the pressing member 68 is transmitted from the pressing member 68 to the IC chip 61.
As a result, by applying a predetermined pressing force while applying a predetermined temperature to press the bonding surface of the IC chip 61 against the IC chip bonding region of the circuit board 66, the bonding surface of the IC chip 61 on each electrode 64 Bump 62 is an IC on circuit board 66
It contacts each electrode 67 in the chip bonding area. At this time,
IC chip 6 on which passivation film 69 is arranged
, 63, the flow speed of the bonding material 65 flowing in the square area surrounded by the four sides of the bumps 62,..., And the auxiliary passivation films 63,. , 62 on the four sides from the corner of the square area
The flow velocity of the bonding material 65 at the outer portion of the bonding material, that is, in the region extending to the corners of the peripheral portion of the bonding surface becomes substantially the same, thereby preventing the density of the bonding material 65 from decreasing at the corners of the peripheral portion of the bonding surface. It is possible to prevent a decrease in the adhesion, that is, the bonding force and the sealing force at the corners of the peripheral portion of the bonding surface, and to make the bonding material 65 substantially uniform over at least substantially the entire bonding surface of the IC chip 61. The distribution is maintained and cured by the above-mentioned heat to obtain I
A C-chip mounted body can be manufactured. That is, in the final pressure bonding step, the auxiliary passivation films 63,..., 63 provided at the corners around the bonding surface of the IC chip 61 provide four sides within the bonding surface where the passivation film 69 is originally disposed. Bumps 62, ...,
A square area surrounded by 62 and four-sided bumps 62,.
The difference in the flow velocity of the bonding material 65 between the position outside the outer periphery 62, that is, the corner portion of the peripheral portion of the bonding surface, is eliminated.
It is possible to prevent the flow speed of the joining material 65 from increasing at the corners around the joining surface of the C chip 61.

In the above description, each bump 62 of the IC chip 61 and each electrode 67 of the circuit board 66 are described to be in contact with each other in the bonding step. However, the present invention is not limited to this. The bumps 62 of the chip 61 and the electrodes 67 of the circuit board 66 may not be in contact with each other, and the bumps 62 of the IC chip 61 may be in contact with the electrodes 67 of the circuit board 66 for the first time in the final pressure bonding step.

As an example, the height of the bump 62 is 5
In the case of 0 to 75 μm, the thickness of the passivation film 69 and the auxiliary passivation film 63 is preferably 30 to 40 μm.

According to the seventh embodiment, the IC chip 6
In the vicinity of the side of each side of the bonding surface of No. 1, a passivation film 69 is formed in a square area surrounded by bumps 62,...
, And a substantially rectangular auxiliary passivation film 63,..., 63 at positions outside the four sides of the bumps 62,.
(The satin area in the figure) is arranged, so that the joining material 6 is formed between the square area and the corner of the peripheral part.
5, the flow speed of the flowing material 5 is substantially the same, and a decrease in the density of the bonding material 65 can be prevented. The occurrence of peeling can be prevented, and corrosion of the IC chip 61 and the like due to moisture absorption as a result of intrusion of moisture can be prevented. Accordingly, the distribution of the bonding material 65 within the bonding surface of the IC chip 61 can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

(Eighth Embodiment) A mounting method of an IC chip as an example of an electronic component mounting method according to an eighth embodiment of the present invention and an electronic component mounted body manufactured by the method, and an electronic component mounted body manufactured by the method. An IC chip mounted body will be described with reference to FIGS. FIGS. 22A and 22B are a side view and a back view of the IC chip before the bonding step in the method for mounting an IC chip according to the eighth embodiment, and FIG. 23 shows the IC chip and the circuit in the bonding step. It is a side view of a board | substrate and a joining material. FIGS. 18A and 18B are a side view and a back view of the IC chip before a bonding step of a method of mounting the IC chip according to a conventional example for explaining the eighth embodiment. FIG. It is a side view of an IC chip, a circuit board, and a joining material in the joining process of the conventional example.

In the sixth embodiment, the bumps 52,..., 52 near the sides of the bonding surface of the IC chip 51 are provided.
The auxiliary passivation film 53 (in the figure, satin area) is provided as a bonding material flow control film as an example of a bonding material flow control member in the rectangular frame region of the outer peripheral portion of the row, but is not limited thereto. Not something. For example, in the eighth embodiment, the sixth embodiment is combined with the seventh embodiment, and the outer side of the row of bumps 82,... Around the
In the region from the corner of the square region of the passivation film 59 to the corner of the outer peripheral portion, that is, the region around the bonding surface and the vicinity of the corner, the auxiliary passivation film 83 (in the figure, satin region) is formed. The auxiliary passivation film 83 may be used to control the flow of the bonding material 85 provided as an example of a bonding material flow restricting member.

In the prior art, as shown in FIG.
, 152 in rows and at substantially equal intervals, and a passivation film 159 (in the figure, satin area) in a square area surrounded by the four sides of the bumps 152,.
Is located. After the bonding material 155 is supplied to the circuit board 156 while the passivation film 159 is disposed on the IC chip 151 in this manner,
IC having bumps 152 formed on electrodes 154 on the bonding surface
The IC chip 151 is provided between the bonding surface of the chip 151 and the circuit board 156 via the bonding material 155.
The bumps 152 on the electrodes 154 and the electrodes 157 on the circuit board 156 are joined so as to be in electrical contact with each other, and the circuit board 156 is mounted on the
By pressing the heated pressing member 158 against the chip 151 and pressurizing the same, the IC chip 151 is crimped in a heated and pressurized state, and a gap between the bonding surface of the IC chip 151 and the circuit board 156 is formed. The bonding material 155 is cured. In such a case, the passivation film 159
Are located within the bonding surface of the IC chip 151 on which
The position between the four sides of the bumps 152,..., 152 and the position outside the four sides of the bumps 152,. Since there is no passivation film 159, the flow speed of the bonding material 155 flowing in the relevant portion is increased, and the density of the bonding material 155 is reduced. And peeling will occur. As described above, the bonding material 1 is formed around the bonding surface of the IC chip 151.
When peeling occurs between the IC chip 151 and the semiconductor chip 55, moisture enters the peeled portion, and the IC chip 151 and the like due to moisture absorption corrode.

In order to prevent such a decrease in the bonding force and the sealing force, in the eighth embodiment, as shown in FIGS. I
In the vicinity of the side of each side of the bonding surface of the C chip 81, a passivation film 89 (in the figure, a square area surrounded by bumps 82,...
Not only) but also bumps 82 on four sides,
, 82, that is, an auxiliary passivation film 83 (a satin area in the figure) is disposed at a peripheral portion of the bonding surface and a corner thereof. The reason for arranging it at the peripheral portion of the joining surface and at the corner thereof is to simultaneously achieve the functions and effects of both the sixth embodiment and the seventh embodiment.
As a result, I where the passivation film 89 is disposed
Within the bonding surface of the C chip 81, four bumps 82,.
The flow of the bonding material 85 flows between the square area surrounded by 82 and the positions outside the four sides of the bumps 82,... The speeds are substantially the same, and a decrease in the density of the bonding material 85 can be prevented.
It is possible to prevent a decrease in the adhesive force at the peripheral portion of the joining surface and at the corner thereof, that is, the joining force and the sealing force.

The method for forming each bump 82 is as follows.
This is the same as in the first embodiment. As a method for arranging the passivation film 89 and the auxiliary passivation film 83, there is a method of applying a resin for forming a passivation film. The application of the resin for forming a passivation film may be performed before or after the formation of the bumps 82, but is preferably performed before the formation of the bumps 82 without damaging the bumps 82 when the resin for forming the passivation film is applied. The material and forming method of the auxiliary passivation film 83 are the same as those of the passivation film 89. As an example of each of the passivation film 89 and the auxiliary passivation film 83, the organic material is polyimide, the inorganic material is Si ₃ N ₄ , and when the substrate is made of resin and the substrate side is organic, the passivation film 89 and the It is preferable that the auxiliary passivation film 83 is also made of an organic material to maintain the adhesiveness. Polyimide is formed by spin-coating a liquid and using a photolithography method.

As described above, the passivation film 89, the auxiliary passivation film 83, and the bumps 82,.
Is formed on the IC chip 81, in the bonding material supplying step, at least one of the bonding surface of the IC chip 81 and the IC chip bonding region of the circuit board 86 as an example of a circuit forming body is provided with an insulating material. The bonding material 85 containing the thermosetting resin is supplied. The method of supplying the bonding material 85 is the same as in the first embodiment.

Next, in the joining step, the joining material 85 is formed.
IC in the IC chip bonding area of the circuit board 86 with the
The bonding surface of the chip 81 is overlapped, and the bonding material 85 is interposed between the bonding surface of the IC chip 81 having the bumps 82 formed on the electrodes 84 and the IC chip bonding region of the circuit board 86. The bumps 82 on the electrodes 84 of the IC chip 81 and the electrodes 87 of the circuit board 86 are positioned so as to be in electrical contact with each other, and then joined. This bonding step may be performed in a state where the circuit board 86 is placed on the base 90, or the IC chip 81 is superimposed on the circuit board 86 via a bonding material 85 at another place and bonded. After performing the step, the circuit board 86 on which the IC chip 81 is overlapped via the bonding material 85 may be placed on the base 90 in the final pressure bonding step.

Next, in the final pressure bonding step, the pressing member 8
8 is brought into contact with the IC chip 81, and a pressing force is applied from the pressing member 88 to the base 90 on which the circuit board 86 on which the IC chip 81 is superimposed is placed via the bonding material 85. The heat of the heater built in the pressing member 88 is transmitted from the pressing member 88 to the IC chip 81.
As a result, by applying a predetermined pressing force while applying a predetermined temperature to press the bonding surface of the IC chip 81 against the IC chip bonding region of the circuit board 86, the bonding surface of the IC chip 81 The bump 82 is an IC of the circuit board 86
It contacts each electrode 87 in the chip bonding area. At this time,
IC chip 8 on which passivation film 89 is arranged
The flow velocity of the bonding material 85 and the auxiliary passivation film 83 are arranged in a square area surrounded by four bumps 82,...
The flow velocity of the bonding material 85 at the position outside the side bumps 82,... 82, that is, the peripheral portion of the bonding surface and the corner thereof becomes substantially the same, and the bonding material 85 at the peripheral portion of the bonding surface and the corner thereof. Of the IC chip 81 can be prevented, and the adhesive force at the peripheral portion of the bonding surface and the corner thereof, that is, the bonding force and the sealing force can be prevented from lowering. In this case, the bonding material 85 is substantially uniformly distributed and maintained, and is cured by the heat, whereby an IC chip mounted body can be manufactured. That is, in the above-mentioned final pressure bonding step,
The auxiliary passivation film 83 provided on the periphery and the corner of the bonding surface of the IC chip 81 is surrounded by four sides of bumps 82,..., 82 within the bonding surface on which the passivation film 89 is originally arranged. .., 82, that is, the bonding material 85 at the positions outside the four sides of the bumps 82,...
Of the bonding material 8 at the peripheral portion of the bonding surface of the IC chip 81 and at the corner thereof.
5 can be prevented from increasing the flowing velocity.

In the above description, each bump 82 of the IC chip 81 and each electrode 87 of the circuit board 86 are in contact with each other in the bonding step. However, the present invention is not limited to this. The bumps 82 of the chip 81 and the electrodes 87 of the circuit board 86 may not be in contact with each other, and the bumps 82 of the IC chip 81 may be in contact with the electrodes 87 of the circuit board 86 for the first time in the final pressing step.

As an example, the height of the bump 82 is 5
When the thickness is 0 to 75 μm, the thickness of the passivation film 89 and the auxiliary passivation film 83 is preferably 30 to 40 μm.

According to the eighth embodiment, the IC chip 8
In the vicinity of the side of each side of the bonding surface of No. 1, a passivation film 89 is formed in a square area surrounded by bumps 82,...
, And a substantially rectangular auxiliary passivation film 83 (a satin area in the figure) at positions outside the four sides of the bumps 82,... Therefore, the flow speed of the joining material 85 in the square area and the peripheral portion and the corner thereof becomes substantially the same, and the joining material 85
Can be prevented, the adhesion at the peripheral portion of the joining surface and the corner thereof, that is, the joining force and the sealing force can be prevented from decreasing, and the occurrence of peeling can be prevented.
Corrosion of the IC chip 81 and the like due to moisture absorption as a result of intrusion of moisture can be prevented. Therefore, the distribution of the bonding material 85 in the bonding surface of the IC chip 81 can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

(Ninth Embodiment) An IC chip mounting method as an example of an electronic component mounting method according to a ninth embodiment of the present invention and an electronic component mounting body manufactured by the method, and an IC chip manufactured by the method. An IC chip mounted body will be described with reference to FIGS. 24 and 25. FIGS. 24A and 24B are a side view and a back view of the IC chip before the bonding step in the IC chip mounting method according to the ninth embodiment, and FIG. 25 shows the IC chip and the circuit in the bonding step. It is a side view of a board | substrate and a joining material. FIGS. 18A and 18B are a side view and a back view of the IC chip before a bonding step of a method of mounting the IC chip according to the conventional example for explaining the ninth embodiment, and FIG. It is a side view of an IC chip, a circuit board, and a joining material in the joining process of the conventional example.

In the sixth embodiment, the bumps 52,..., 52 near the sides of each side of the bonding surface of the IC chip 51 are provided.
The auxiliary passivation film 53 (in the figure, satin area) is provided as a bonding material flow control film as an example of a bonding material flow control member in the rectangular frame region of the outer peripheral portion of the row, but is not limited thereto. Not something. For example, in the ninth embodiment, in addition to the eighth embodiment in which the sixth embodiment and the seventh embodiment are combined, bumps 92,... An auxiliary passivation film 93 (a satin area in the figure) may be provided as an example of a bonding material flow control member also in the gap between the 92, and the flow of the bonding material 95 may be controlled by the auxiliary passivation film 93. That is, in other words, I
An auxiliary passivation film 93 (a satin area in the figure) is provided as an example of a bonding material flow regulating member in all regions other than the bumps 92,..., 92 on the bonding surface of the C chip 91, and the bonding material 95 is formed by the auxiliary passivation film 93. May be performed.

In the prior art, as shown in FIG. 18, one IC chip 151 is formed in the vicinity of each side of the bonding surface of the IC chip 151.
, 152 in rows and at substantially equal intervals, and a passivation film 159 (in the figure, satin area) in a square area surrounded by the four sides of the bumps 152,.
Is located. After the bonding material 155 is supplied to the circuit board 156 while the passivation film 159 is disposed on the IC chip 151 in this manner,
IC having bumps 152 formed on electrodes 154 on the bonding surface
The IC chip 151 is provided between the bonding surface of the chip 151 and the circuit board 156 via the bonding material 155.
The bumps 152 on the electrodes 154 and the electrodes 157 on the circuit board 156 are joined so as to be in electrical contact with each other, and the circuit board 156 is mounted on the
By pressing the heated pressing member 158 against the chip 151 and pressurizing the same, the IC chip 151 is crimped in a heated and pressurized state, and a gap between the bonding surface of the IC chip 151 and the circuit board 156 is formed. The bonding material 155 is cured. In such a case, the passivation film 159
Are located within the bonding surface of the IC chip 151 on which
The position between the four sides of the bumps 152,..., 152 and the position outside the four sides of the bumps 152,. Since there is no passivation film 159, the flow speed of the bonding material 155 flowing in the relevant portion is increased, and the density of the bonding material 155 is reduced. And peeling will occur. As described above, the bonding material 1 is formed around the bonding surface of the IC chip 151.
When peeling occurs between the IC chip 151 and the semiconductor chip 55, moisture enters the peeled portion, and the IC chip 151 and the like due to moisture absorption corrode.

In order to prevent such a decrease in the bonding force and the sealing force, in the ninth embodiment, before the bonding material supply step, as shown in FIGS. I
In the vicinity of the side of each side of the bonding surface of the C chip 91, a passivation film 99 (in the figure, a square area surrounded by bumps 92,...
Not only) but also the four-sided bumps 92,
, 92, that is, the auxiliary passivation film 93 (patterned area in the figure) is provided at the peripheral portion of the bonding surface and at the corner thereof and the portion between the adjacent bumps 92, 92.
Place. The reason for arranging it in the peripheral portion of the joining surface and its corners and also in the portion between the adjacent bumps 92, 92 is that the effects of both the sixth embodiment and the seventh embodiment are simultaneously exhibited. And adjacent bumps 92, 92
The joining material 95 is also provided between the portion between
This is to make the flow speeds of the same the same. As a result, the flow speed of the bonding material 95 in the region other than the portion where the bumps 92,..., 92 are disposed in the bonding surface of the IC chip 91 on which the passivation film 99 is disposed becomes substantially the same. A decrease in the density of the material 95 can be prevented, and a decrease in the adhesion force, that is, the bonding force and the sealing force, at the peripheral portion of the bonding surface and at the corner thereof and at the portion between the adjacent bumps 92, 92 can be prevented. be able to.

The method for forming each bump 92 is as follows.
This is the same as in the first embodiment. As a method for arranging the passivation film 99 and the auxiliary passivation film 93, there is a method of applying a resin for forming a passivation film. The application of the resin for forming a passivation film may be performed before or after the formation of each of the bumps 92. However, the application before the formation of each of the bumps 92 is preferable because the bumps 92 are not damaged when the resin for forming the passivation film is applied. The material and forming method of the auxiliary passivation film 93 are the same as those of the passivation film 99. As an example, an organic film such as polyimide or polybenzoxazole (PBO) is spin-coated to a thickness of, for example, about 3 to 7 μm to form an IC chip 91.
Is applied over the entire surface of the joint. After that, the electrodes 94 necessary for forming the bumps 92 are removed in a dot-like manner to expose the electrodes 94.

As described above, the passivation film 99, the auxiliary passivation film 93, and the bumps 92,.
Is formed on the IC chip 91, in the bonding material supplying step, at least one of the bonding surface of the IC chip 91 and the IC chip bonding region of the circuit board 96 as an example of a circuit forming body is provided with an insulating material. The bonding material 95 containing the thermosetting resin is supplied. The method of supplying the bonding material 95 is the same as in the first embodiment.

Next, in the joining step, the joining material 95
IC is bonded to the IC chip bonding area of the circuit board 96 with the
The bonding surfaces of the chip 91 are overlapped, and the bonding material 95 is interposed between the bonding surface of the IC chip 91 having the bumps 92 formed on the electrodes 94 and the IC chip bonding region of the circuit board 96. The bumps 92 on the electrodes 94 of the IC chip 91 and the electrodes 97 of the circuit board 96 are positioned so as to be in electrical contact with each other, and then joined. This bonding step may be performed in a state where the circuit board 96 is placed on the base 100, or the IC chip 91 is superimposed on the circuit board 96 via a bonding material 95 at another place and bonded. After performing the step, the circuit board 96 on which the IC chip 91 is superimposed may be placed on the base 100 via the bonding material 95 in the final pressure bonding step.

Next, in the final pressure bonding step, the pressing member 9
8 is brought into contact with the IC chip 91, and a pressing force is applied from the pressing member 98 to the base 100 on which the circuit board 96 on which the IC chip 91 is superimposed is mounted via the bonding material 95, The heat of the heater built in the pressing member 98 is transmitted from the pressing member 98 to the IC chip 91. As a result, by applying a predetermined pressure while applying a predetermined temperature, the bonding surface of the IC chip 91 is moved to the IC surface of the circuit board 96.
By pressing against the chip bonding region, the IC chip 91 is pressed.
The bumps 92 on the respective electrodes 94 on the bonding surface of the above contact the respective electrodes 97 in the IC chip bonding area of the circuit board 96. At this time, the flow speed of the bonding material 95 in the square area surrounded by the four bumps 92,..., 92 in the bonding surface of the IC chip 91 on which the passivation film 99 is disposed, and the auxiliary passivation film 93 The flow velocity of the bonding material 95 at the position outside the four sides of the bumps 92,..., 92, that is, at the peripheral portion of the bonding surface and at the corner thereof and between the adjacent bumps 92, 92 is approximately As a result, it is possible to prevent a decrease in the density of the bonding material 95 in a peripheral portion of the bonding surface, a corner thereof, and a portion between the adjacent bumps 92, 92,
It is possible to prevent a decrease in adhesion, that is, a bonding force and a sealing force in a peripheral portion of the bonding surface, a corner thereof, and a portion between the adjacent bumps 92, 92.
The bonding material 95 is substantially uniformly distributed and maintained over substantially the entire bonding surface of the chip 91, and is cured by the above-described heat, whereby an IC chip mounted body can be manufactured. That is,
In the main bonding step, the auxiliary passivation film 93 provided around the bonding surface of the IC chip 91 and the corner thereof provides four bumps 92 on the bonding surface where the passivation film 99 is originally disposed. , 9
Square area surrounded by 2 and bumps 92 on four sides, ..., 9
2, that is, the difference in the flow rate of the bonding material 95 between the peripheral portion of the bonding surface and the corner thereof and the portion between the adjacent bumps 92, 92 is eliminated, and the bonding surface of the IC chip 91 is removed. It is possible to prevent the flow velocity of the bonding material 95 from increasing at the peripheral portion, the corner portion thereof, and the portion between the adjacent bumps 92, 92.

In the above description, the bumps 92 of the IC chip 91 and the electrodes 97 of the circuit board 96 are described to be in contact with each other in the joining step. However, the present invention is not limited to this. The bumps 92 of the chip 91 and the electrodes 97 of the circuit board 96 may not be in contact with each other, and the bumps 92 of the IC chip 91 may be in contact with the electrodes 97 of the circuit board 96 for the first time in the final pressing step.

As an example, the height of the bump 92 is 5
In the case of 0 to 75 μm, the thickness of the passivation film 99 and the auxiliary passivation film 93 is preferably 30 to 40 μm.

According to the ninth embodiment, the IC chip 9
In the vicinity of the side of each side of the bonding surface of No. 1, a passivation film 99 (a matte area in the figure) is arranged in a square area surrounded by bumps 92,...
, The auxiliary passivation film 93 (in the figure, at the position outside the four sides of the bumps 92,... , Satin areas), the flow rate of the joining material 95 in the square area and the peripheral area, the corners thereof, and the area between the adjacent bumps 92, 92 is substantially the same. In addition, a reduction in the density of the bonding material 95 can be prevented, and a reduction in the adhesion force, that is, the bonding force and the sealing force at the peripheral portion of the bonding surface and at the corners thereof and at the portion between the adjacent bumps 92, 92 can be prevented. It is possible to prevent the peeling, and prevent the IC chip 91 and the like from being corroded due to moisture absorption as a result of intrusion of moisture. Therefore, the distribution of the bonding material 95 in the bonding surface of the IC chip 91 can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

In the first to ninth embodiments described above, even when the bonding material contains a conductive material or an inorganic filler, the flow of the resin is uniformized in the bonding surface of the IC chip by the dummy bumps at the time of pressure bonding. In addition, the conductive material or the inorganic filler can be uniformly arranged, and the quality and reliability can be stabilized. On the other hand, when there is no dummy bump, in the case of the resin to which the inorganic filler is added, if the flow of the resin at the time of press bonding becomes uneven, the inorganic filler becomes coarse and dense, and the quality of the resin is partially changed due to the difference in the resin properties. May be easily deteriorated, and in a resin to which a conductive material is added, if the flow of the resin at the time of pressure bonding becomes uneven, the conductive material may become coarse and dense, causing a partial short circuit.

In the first to ninth embodiments, each of the bumps 2, 12, 22, 32, 42, 52,
Reference numerals 62, 82, and 92 indicate that the bumps are brought into contact with the respective electrodes of the circuit board without performing leveling in advance, and the bumps are leveled with the respective electrodes without performing leveling in advance. , A so-called non-stud bump (NSD) type mounting method can be adopted. The non-stud bump (NSD) type mounting method will be described below.

The mounting method of an IC chip (hereinafter, typically indicated by 401) on a circuit board (hereinafter, typically indicated by 406) in each of the above embodiments is shown in FIGS.
This will be described with reference to FIG.

In the IC chip 401 of FIG. 27A, bumps (protruding electrodes) 402 are formed on the Al pad electrodes 404 of the IC chip 401 by the operation shown in FIGS. 30A to 30F using a wire bonding apparatus. . That is, a ball 196 is formed at the lower end of the wire 195 protruding from the holder 193 in FIG.
Then, the holder 193 holding the wire 195 is lowered, and the ball 193 is joined to the electrode 404 of the IC chip 401 to substantially form the shape of the bump 402. In FIG. Ascending starts, and a substantially rectangular loop 199 as shown in FIG.
Then, the holder 193 is moved to form a curved portion 198 above the bump 402 as shown in FIG. 30 (E), and the bump 402 is formed as shown in FIG. 30 (F) by tearing. Alternatively, the wire 195 is clamped by the holder 193 in FIG. 30B, and the gold wire 195 is torn off by raising the holder 193 and pulling it upward, so that the shape of the bump 402 as shown in FIG. It may be formed. Thus, the IC chip 401
FIG. 27 shows a state in which the bump 402 is formed on each electrode 404 of FIG.
It is shown in (B). As an example, each of the dummy bumps is formed similarly to the bump 402.

Next, the circuit board 406 shown in FIG.
27D, a thermosetting resin sheet 405 cut to a size slightly larger than the size of the IC chip 401 is arranged as shown in FIG.
The thermosetting resin sheet 4 as a specific example of the above-mentioned bonding material is applied at a pressure of, for example, about 49 to 98 N (5 to 10 kgf / cm 2) by the attaching tool 408A heated to 20 ° C.
05 is attached on the electrode 407 of the substrate 406. After that, the separator 405a detachably disposed on the tool 408A side of the thermosetting resin sheet 405 is peeled off, thereby completing the step of preparing the substrate 406. The separator 405a is for preventing the thermosetting resin sheet 405 from sticking to the tool 408A. Here, the thermosetting resin sheet 405 is a sheet containing an inorganic filler such as silica (eg, epoxy resin, phenol resin, polyimide, etc.), or a sheet containing no inorganic filler (eg, epoxy resin, phenol resin). , Polyimide, etc.) is preferable, and heat resistance enough to withstand high temperatures in a reflow process in a later process (for example,
(A heat resistance enough to withstand 240 ° C. for 10 seconds).

Next, as shown in FIGS. 27 (E) and 28 (F), the IC chip 401 having the bumps 402 formed on the electrodes 404 in the preceding process is heated by the heated joining tool 408. I of substrate 406 prepared in the previous process
Pressing is performed after positioning on the electrode 407 corresponding to the electrode 404 of the C chip 401. At this time, the bump 402
The head 402a is pressed while being deformed on the electrode 407 of the substrate 406 as shown in FIG. 31 (A) to FIG. 31 (B). At this time, the head 402a faces the bump 402 via the IC chip 401. The load to be applied is
31a, the head 402a of the bump 402, which is bent and overlapped, depends on the diameter of FIG.
It is necessary to apply a load that is deformable as shown in FIG. This load requires at least 196 mN (20 gf). The upper limit of the load is such that the IC chip 401, the bump 402, the circuit board 406, and the like are not damaged.
In some cases, the maximum load is 980 mN (100 g
f) may be exceeded. In addition, 405m and 405s
Is a thermosetting resin being melted in which the thermosetting resin sheet 405 is melted by the heat of the joining tool 408 and a resin thermoset after being melted.

The joining tool 40 heated by a built-in heater such as a ceramic heater or a pulse heater.
8, a positioning step of positioning the IC chip 401 having the bumps 402 formed on the electrodes 404 in the preceding step on the electrodes 407 corresponding to the electrodes 404 of the IC chip 401 on the substrate 406 prepared in the preceding step. And the step of pressing and joining after positioning may be performed by one positioning and pressing joining apparatus. However, in order to improve productivity by simultaneously performing the positioning operation and the press-joining operation in the case of continuously producing a large number of substrates using separate devices, the positioning process is performed by the positioning device, and the press-joining process is performed. You may make it perform with a joining apparatus.

At this time, as an example, the circuit board 406
A glass cloth laminated epoxy substrate (glass epoxy substrate), a glass cloth laminated polyimide resin substrate, or the like is used. These substrates 406 are warped or undulated due to heat history, cutting, and processing, and are not necessarily perfect planes.
In a state where the warpage of the circuit board 406 is corrected, for example, heat at 140 to 230 ° C. is applied to the thermosetting resin sheet 405 between the IC chip 401 and the circuit board 406 for, for example, several seconds to 20 seconds. Thermosetting resin sheet 405
Is cured. At this time, first, the thermosetting resin sheet 4
The thermosetting resin constituting the IC chip 401 flows and the IC chip 401
And seal up to the edge. In addition, since the resin is a resin, when heated, it initially softens spontaneously, and thus has such a fluidity as to flow to the edge. By setting the volume of the thermosetting resin to be larger than the volume of the space between the IC chip 401 and the circuit board, the thermosetting resin flows out of this space to achieve a sealing effect. At this time, the flow control is appropriately performed by the bonding material flow control member of each embodiment described above.

Thereafter, as the heated tool 408 rises, there is no longer a heating source.
And the temperature of the thermosetting resin sheet 405 drops rapidly,
The thermosetting resin sheet 405 loses fluidity, and FIG.
(G) and FIG. 31 (C), the IC chip 40
1 is a circuit board 40 made of a cured thermosetting resin 405s.
6 fixed on. Further, if the circuit board 406 side is heated by the stage 410, the temperature of the joining tool 408 can be set lower.

Further, instead of attaching the thermosetting resin sheet 405, a thermosetting adhesive 405b is applied onto the circuit board 406 by dispensing or the like, or printed or transferred, as shown in FIG. You may do so.
When the thermosetting adhesive 405b is used, basically the same process as the process using the thermosetting resin sheet 405 described above is performed. When the thermosetting resin sheet 405 is used, there is an advantage that it is easy to handle because it is solid, and it can be formed of a polymer because there is no liquid component, and it is easy to form a material having a high glass transition point. On the other hand, when the thermosetting adhesive 405b is used,
Applying, printing,
Or it can be transcribed.

An anisotropic conductive film (ACF) may be used in place of the thermosetting resin. Further, as conductive particles contained in the anisotropic conductive film, nickel powder plated with gold is used. This is preferable because the connection resistance between the electrode 407 and the bump 402 can be reduced.

FIGS. 27A to 27G illustrate the formation of the thermosetting resin sheet 405 on the circuit board 406 side, and FIG. 29H illustrates the thermosetting adhesive 405b. Has been described on the circuit board 406 side, but the present invention is not limited to this.
(I) or as shown in FIG.
It may be formed on one side. In this case, in particular, in the case of the thermosetting resin sheet 405, the IC is attached to the elastic body 117 such as rubber together with the separator 405a detachably disposed on the circuit board side of the thermosetting resin sheet 405.
The chip 401 may be pressed so that the thermosetting resin sheet 405 is attached to the IC chip 401 along the shape of the bump 402.

[0157] Such a non-stud bump (NSD)
In the mounting method of the type, since the tip of each bump is crushed on each electrode of the circuit board, the amount of pushing (the amount of pressing) of the IC chip into the circuit board becomes large. Then, the joining material is changed to I
The force flowing to the peripheral portion side of the bonding surface of the C chip is increased, and the function of restricting the flow of the bonding material by the dummy bumps works more effectively. In the case of NSB (non-stud bump), the restriction effect is further increased.

As an example, non-stud bumps (NS
In the mounting method of the D) type, for example, a bump having a diameter of 75 μm is crushed by pressing against an electrode of a circuit board so as to reduce the height by 35 μm when electrical connection is obtained. At this time, when the IC chip is pressed toward the circuit board, the bonding material is largely extruded from between the two. Therefore, the outflow of the bonding material is restricted and regulated by the bonding material flow regulating member. Can be effectively prevented from lowering the density of the bonding material. Therefore,
In such a non-stud bump type mounting method, a large suppressing effect on the outflow of the bonding material can be expected.

In the first to fifth embodiments,
It is preferable that the shapes of the bumps and the dummy bumps are substantially the same in order to substantially uniformly regulate the flow of the bonding material, but the present invention is not limited to this, and may have different shapes and heights within an allowable range. Good. Further, the material of the bump and the material of the dummy bump may be different.

In the first to fifth embodiments,
Although the description has been made mainly on the case where the distance between the bumps, the distance between the bumps and the dummy bumps, and the distance between the dummy bumps and the dummy bumps are substantially uniform, the present invention is not limited to this. It may be. In this case, the dummy bumps are arranged in portions outside the allowable range.

In the above embodiment, the example in which the dummy bump is formed on the electrode of the IC chip as the bonding material flow regulating member has been described. However, the present invention is not limited to this, and as shown in FIGS. Alternatively, a dummy bump-shaped protrusion 23A having a height substantially equal to that of the dummy bump may be directly formed on the IC chip by printing or dispensing a resin paste.

Although bumps are formed on the electrodes on the joint surface of the electronic component, a convex electrode may be formed on the joint surface of the electronic component so as to protrude above the electrodes.

In the sixth to ninth embodiments,
It is preferable to make the thicknesses of the passivation film and the auxiliary passivation film substantially the same in order to make the flow velocity of the bonding material substantially uniform. However, the thickness is not limited to this, and different thicknesses are allowed within an allowable range. It may be. Further, the material of the passivation film and the material of the auxiliary passivation film may be different, and each film is not limited to one layer but may be a plurality of layers.

In the sixth to ninth embodiments,
As the bonding material flow regulating member, one or more layers having another function may be formed instead of the auxiliary passivation film.

Further, by disposing the bonding material flow restricting member, for example, a dummy bump or an auxiliary passivation film, when bonding the IC chip and the substrate, it protrudes from between the IC chip and the substrate and rises on each side surface of the IC chip. Since the bonding material is subjected to flow control or flow rate increase control by the bonding material flow control member, the bonding material protruding from between the IC chip and the substrate is bumped from the portion where the bonding material flow control member is disposed. Alternatively, the same flow regulation or flow velocity increase regulation as that of the portion where the passivation film is arranged is applied, so that the fillet which is a swelling portion with respect to the side surface of the IC chip can be enlarged, and the side surface of the IC chip is It can be raised to cover about half of the thickness from the substrate side. That is, conventionally, the flow control or the flow rate increase control is performed in the portion where the bump or the passivation film is disposed, but the fillet is not controlled in the portion where the bump or the passivation film is not disposed. Can not be enlarged, for example,
When the thickness of the IC chip was 0.4 mm, a fillet could be formed only about 0.1 mm. However, in each of the above-described embodiments, since the above-described regulation is applied as described above, for example, when the thickness of the IC chip is 0.4 mm, the fillet is formed to a height of 0.2 to 0.3 mm, Fillets can be large. As a result, when the fillet is small, a moisture intrusion path is easily formed at the interface between the IC chip and the bonding material or between the substrate and the bonding material, and the path is short, resulting in poor moisture resistance reliability. And was weak against warpage of the substrate during the heat cycle. However, as a result of the large fillet, it is difficult to form a moisture intrusion path at the interface between the IC chip and the bonding material or between the substrate and the bonding material, and the path can be lengthened, resulting in excellent moisture resistance reliability. And is resistant to warping of the substrate due to heat during a heat cycle of, for example, -65 ° C to 150 ° C.

It is to be noted that by appropriately combining any of the above-described various embodiments, the effects of the respective embodiments can be exhibited.

[0167]

According to the present invention, an electronic component such as an IC chip is pressed against a circuit-forming body such as a circuit board by a pressing force to join the two via a bonding material. Since the joining material flow restricting member is arranged in a portion where the amount of joining material exceeds the allowable amount, when the electronic component is joined to the circuit forming body, the flow of the joining material between the two components is as described above. The amount of the bonding material flowing out of the gap between the joining material flow regulating member and the adjacent bump is regulated by the joining material flow regulating member and is equal to or less than the allowable amount. The amount of the bonding material flowing out of the substrate can be made substantially uniform. Therefore, the flow of the bonding material from the central part to the peripheral part of the bonding surface of the electronic component can be substantially uniform, and the distribution of the bonding material within the bonding surface of the electronic component can be uniform, and the adhesion force can be improved. And the reliability of bonding and sealing can be improved.

According to one aspect of the present invention, a single row of bumps is provided in the vicinity of each of the four sides except for the corners of the four corners on the joining surface of an electronic component such as a square or rectangular IC chip. In the case where a bonding material flow restricting member, for example, a dummy bump is disposed at a position where there is no bump near the side of the side of the bonding surface of the electronic component, the arrangement state of the bumps is set to each side of the electronic component. The vicinity of the side portion can also be made substantially the same, and from the central portion to the peripheral portion of the joining material between the joining surface of the electronic component and the electronic component joining region of the circuit forming body in the crimping step When the bonding material flows, the dummy bump functions as a bonding material flow restricting member to substantially equalize the flow of the bonding material from the central portion to the peripheral portion, and to distribute the bonding material in the bonding surface of the electronic component. Uniformity Is to improve adhesive force, it is possible to enhance the reliability of the bonding and sealing.

According to another aspect of the present invention, a row of bumps is provided near the four sides except for the four corners on the joining surface of an electronic component such as a rectangular IC chip. In the case where a bonding material flow restricting member, for example, a dummy bump is formed in a row at a location where there is no bump near the side of the side of the bonding surface of the electronic component, the arrangement state of the bumps is determined by the side of each side of the electronic component. The vicinity of the portion can be substantially the same, and the joining material is joined from the central portion to the peripheral portion between the joining surface of the electronic component and the electronic component joining region of the circuit forming body in the crimping step. During the flow of the material, the dummy bump functions as a bonding material flow restricting member, and the flow of the bonding material from the central portion to the peripheral portion is substantially uniform, and the distribution of the bonding material within the bonding surface of the electronic component is controlled. Achieve uniformity Adhesion is improved, it is possible to improve the reliability of the bonding and sealing.

According to another aspect of the present invention, a square-shaped electronic component has a row of bumps near the sides of each of the four sides excluding the corners of the four corners on the joint surface, In the case where a bonding material flow regulating member, for example, a dummy bump is formed at a place where there is no bump near the side of the side of the bonding surface of the electronic component, the arrangement state of the bumps is changed to the vicinity of the side of each side of the electronic component and to each The vicinity of the corner can be substantially the same, and the bonding material between the bonding surface of the electronic component and the bonding area of the electronic component in the circuit forming body from the central portion to the peripheral portion in the crimping step When the bonding material flows, the dummy bump functions as a bonding material flow regulating member,
The flow of the bonding material from the central part to the peripheral part is substantially uniform, and the distribution of the bonding material within the bonding surface of the electronic component can be uniform, the adhesion is improved, and the bonding and sealing are improved. Reliability can be improved.

According to another aspect of the present invention, the rectangular electronic component has a row of bumps in the vicinity of each of the four sides except for the four corners on the joint surface of the rectangular electronic component, In the case where a bonding material flow regulating member, for example, a dummy bump is formed at a place where there is no bump near the side of the side of the bonding surface of the electronic component, the arrangement state of the bumps is changed to the vicinity of the side of each side of the electronic component and to each The vicinity of the corner can be substantially the same, and the bonding material between the bonding surface of the electronic component and the bonding area of the electronic component in the circuit forming body from the central portion to the peripheral portion in the crimping step When the bonding material flows, the dummy bump functions as a bonding material flow regulating member,
The flow of the bonding material from the central part to the peripheral part is substantially uniform, and the distribution of the bonding material within the bonding surface of the electronic component can be uniform, the adhesion is improved, and the bonding and sealing are improved. Reliability can be improved.

Further, according to another aspect of the present invention, when the plurality of bumps are formed in a row at the center of the rectangular joining surface of the electronic component, the electronic component is provided at a corner where there is no bump. When the dummy bumps as the bonding material flow regulating members are arranged, the electronic components are supported at three points in the short direction, that is, in the width direction, with respect to the circuit forming body. The balance of the joining force between the component and the circuit-forming body can be substantially equalized, and the inclination of the electronic component with respect to the circuit-forming body can be prevented, so that the electronic component and the circuit-forming body can be positioned on both sides of the row of bumps. Can be substantially uniform, and the joining material can be joined from the central portion to the peripheral portion between the joining surface of the electronic component and the electronic component joining region of the circuit forming body in the crimping step. Material flow In addition, the dummy bumps function as a bonding material flow regulating member, and the flow of the bonding material from the central portion to the peripheral portion can be substantially uniform, and the distribution of the bonding material within the bonding surface of the electronic component can be uniform. , The adhesion is improved,
The reliability of joining and sealing can be improved.

According to another aspect of the present invention, a passivation film is formed in a square area surrounded by bumps arranged in a line and at substantially equal intervals in the vicinity of each side of the bonding surface of the electronic component. In addition, when a bonding material flow regulating member, for example, an auxiliary passivation film is provided at a position outside the four sides of the bumps, that is, at a peripheral portion of the bonding surface, bonding is performed between the square region and the peripheral portion. The flow speed of the material becomes substantially the same, and it is possible to prevent a decrease in the density of the joining material, prevent a decrease in the adhesion force at the peripheral portion of the joining surface, that is, a joining force and a sealing force, and prevent the occurrence of peeling. Thus, the IC chip and the like due to moisture absorption as a result of intrusion of moisture can be prevented from corroding. Therefore, the distribution of the bonding material within the bonding surface of the electronic component can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

Also, a wide interval portion where a bump is missing,
In other words, when a dummy bump is formed in a wide interval where the interval between adjacent bumps is larger than the interval between other adjacent bumps, if the interval between adjacent bumps is not substantially uniform, Dummy bumps may be formed only in portions where the interval exceeds the allowable value. Specifically, the maximum pitch Pma of the pitches between the bumps of the electronic component or between the bumps and the dummy bumps
x and the minimum pitch Pmin are expressed as follows: Pmax ≦ (P
min × 2α) [where α is an arbitrary value of 1 to 6. ], The same effect as described above can be obtained.

According to another aspect of the present invention, the passivation film is formed in a square area surrounded by bumps arranged in a line and at substantially equal intervals in the vicinity of each side of the bonding surface of the electronic component. In addition, when a bonding material flow control member, for example, a substantially rectangular auxiliary passivation film is provided at a position outside the four-sided bumps, that is, at a corner around the bonding surface, the square region is The flow velocity of the joining material at the corners of the peripheral portion is substantially the same, so that the density of the joining material can be prevented from lowering. It is possible to prevent a decrease in stopping power, prevent the occurrence of peeling, and prevent corrosion and the like of electronic components and the like due to moisture absorption as a result of moisture intrusion. Therefore,
The distribution of the bonding material within the bonding surface of the electronic component can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

According to another aspect of the present invention, the passivation film is formed in a square region surrounded by bumps arranged in a line and at substantially equal intervals in the vicinity of each side of the bonding surface of the electronic component. When a bonding material flow control member, for example, a substantially rectangular auxiliary passivation film is provided at positions outside the four-sided bumps, that is, at a peripheral portion of the bonding surface and at a corner thereof, the square region The flow velocity of the joining material at the peripheral portion and the corner thereof is substantially the same, and it is possible to prevent a decrease in the density of the joining material. It is possible to prevent a decrease in force and sealing force, prevent the occurrence of peeling, and prevent corrosion of electronic components and the like due to moisture absorption as a result of intrusion of moisture. Therefore, the distribution of the bonding material within the bonding surface of the electronic component can be made uniform, the adhesion can be improved, and the reliability of bonding and sealing can be improved.

According to another aspect of the present invention, the passivation film is formed in a square area surrounded by bumps arranged in a line and at substantially equal intervals in the vicinity of each side of the bonding surface of the electronic component. In addition to the case where a bonding material flow regulating member, for example, an auxiliary passivation film is disposed at positions outside the four side bumps, that is, at a peripheral portion of the bonding surface and at a corner thereof and a portion between adjacent bumps, The flow rate of the joining material in the square region and the peripheral portion and the corner portion thereof and the portion between the adjacent bumps are substantially the same, and it is possible to prevent a decrease in the density of the joining material, It is possible to prevent a decrease in adhesion force, that is, a bonding force and a sealing force in a peripheral portion of a bonding surface and a corner portion thereof and a portion between adjacent bumps, and to prevent peeling. Can, electronic components due to moisture absorption as a result of moisture penetration can be prevented and corrosion. Therefore, the distribution of the bonding material within the bonding surface of the electronic component can be made uniform,
The adhesion is improved, and the reliability of bonding and sealing can be improved.

[Brief description of the drawings]

FIGS. 1 (a), 1 (b) and 1 (c) are explanatory views for explaining steps of an electronic component mounting method according to a first embodiment of the present invention.

FIG. 2 is an explanatory view following FIG. 1 for explaining steps of an electronic component mounting method according to the first embodiment of the present invention. FIG. 3 is a perspective plan view showing a flow state of a bonding material between the circuit board and the circuit board.

FIGS. 3A and 3B are explanatory views for explaining steps of a method of mounting an electronic component according to a conventional example for explaining the first embodiment of the present invention.

4 (a) and 4 (b) are explanatory views subsequent to FIG. 3 for explaining steps of a conventional method of mounting an electronic component, and are mounted by the above-described method of mounting an electronic component. FIG. 9 is a perspective plan view showing a flowing state of a bonding material between the electronic component and the circuit board at the time.

FIGS. 5A, 5B, and 5C are explanatory diagrams for describing steps of a method for mounting an electronic component according to a second embodiment of the present invention, and FIG. FIG. 4 is a perspective plan view showing a flow state of a bonding material between an electronic component and a circuit board when mounted by the mounting method of FIG.

FIGS. 6 (a), (b), and (c) are explanatory views for explaining steps of an electronic component mounting method according to a conventional example for describing a second embodiment of the present invention, respectively.
(D) is a perspective plan view showing a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component.

FIGS. 7A, 7B, and 7C are explanatory views for explaining steps of a method for mounting an electronic component according to a third embodiment of the present invention.

FIG. 8 is an explanatory view following FIG. 7 for explaining steps of an electronic component mounting method according to a third embodiment of the present invention. FIG. 3 is a perspective plan view showing a flow state of a bonding material between the circuit board and the circuit board.

FIGS. 9A, 9B, and 9C are explanatory views for explaining steps of a method of mounting an electronic component according to a conventional example for explaining a third embodiment of the present invention, respectively.
(D) is a perspective plan view showing a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component.

FIGS. 10A, 10B, and 10C are explanatory views for explaining steps of a method for mounting an electronic component according to a fourth embodiment of the present invention, and FIG. 10D is a view illustrating the electronic component. FIG. 4 is a perspective plan view showing a flow state of a bonding material between an electronic component and a circuit board when mounted by the mounting method of FIG.

FIGS. 11 (a), (b), and (c) are explanatory views for explaining steps of an electronic component mounting method according to a conventional example for describing a fourth embodiment of the present invention;
(D) is a perspective plan view showing a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component.

FIGS. 12A, 12B, and 12C are explanatory views for explaining steps of a method for mounting an electronic component according to a fifth embodiment of the present invention, and FIG. It is an explanatory view for explaining a process seen from a direction different by 90 degrees from (c) in a state of (c).

FIG. 13 is a perspective plan view showing a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component according to the fifth embodiment of the present invention, following FIG. It is.

14 (a), (b), and (c) are explanatory views for explaining steps of an electronic component mounting method according to a conventional example for describing a fifth embodiment of the present invention.

FIG. 15A is an explanatory view following FIG. 14 for explaining steps of an electronic component mounting method according to a conventional example for describing a fifth embodiment of the present invention, and FIG. FIG. 4 is a perspective plan view showing a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component.

FIGS. 16 (a) and (b) are explanatory views for explaining steps of a method of mounting an electronic component according to a sixth embodiment of the present invention.

FIG. 17 is a side view showing a flow state of a bonding material between an electronic component and a circuit board when mounted by the electronic component mounting method according to the sixth embodiment of the present invention, following FIG. 16; .

FIGS. 18 (a) and (b) are sixth to sixth embodiments of the present invention, respectively.
It is explanatory drawing for demonstrating the process of the mounting method of the electronic component concerning the prior art example for demonstrating 9th Embodiment.

FIG. 19 is a joining material between an electronic component and a circuit board when mounted by a conventional electronic component mounting method for describing sixth to ninth embodiments of the present invention following FIG. 18; It is a side view which shows the flowing state of.

FIGS. 20A and 20B are explanatory views for explaining steps of a method of mounting an electronic component according to a seventh embodiment of the present invention.

FIG. 21 is a side view showing a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component according to the seventh embodiment of the present invention, following FIG. 20; .

FIGS. 22A and 22B are explanatory diagrams for explaining steps of a method for mounting an electronic component according to the eighth embodiment of the present invention.

FIG. 23 is a side view following FIG. 22 showing a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component according to the eighth embodiment of the present invention. .

FIGS. 24A and 24B are explanatory views for explaining steps of an electronic component mounting method according to a ninth embodiment of the present invention.

FIG. 25 is a side view following FIG. 24, illustrating a flow state of a bonding material between the electronic component and the circuit board when mounted by the mounting method of the electronic component according to the ninth embodiment of the present invention. .

FIG. 26 is an explanatory diagram for describing a location of a dummy bump in the embodiment.

FIG. 27 (A), (B), (C), (D), (E)
FIG. 4 is an explanatory diagram showing a case where a non-stud bump (NSD) type mounting method is specified as an example of an IC chip mounting method in each of the above embodiments.

FIGS. 28 (F) and 28 (G) are explanatory views each showing a method of mounting an IC chip in the embodiment following FIG. 27;

FIGS. 29 (H), (I) and (J) each show FIG.
It is explanatory drawing which shows the mounting method of an IC chip in the said embodiment following the above.

FIG. 30 (A), (B), (C), (D),
(E), (F), (G) is an explanatory view showing a bump forming step of an IC chip using a wire bonder in the mounting method in the above embodiment.

FIGS. 31 (A), (B), and (C) are explanatory views each showing a bonding step of a circuit board and an IC chip in the mounting method according to the embodiment.

FIGS. 32 (a), (b) and (c) are explanatory views for explaining steps of a method of mounting an electronic component according to a modification of the second embodiment of the present invention.

FIG. 33 is an explanatory view following FIG. 1 for explaining steps of a method of mounting an electronic component according to a modification of the second embodiment of the present invention. FIG. 4 is a perspective plan view illustrating a flow state of a bonding material between the electronic component and the circuit board.

[Explanation of symbols]

1,21,31,41,51,61,81,91 ... IC
Chip, 2, 22, 32, 42, 52, 62, 82, 92 ... bump, 3, 23, 33, 43 ... dummy bump, 4, 24, 34, 44, 54, 64, 84, 94 ... IC
Chip electrodes, 5, 25, 35, 45, 55, 65, 85, 95 ... joining materials, 6, 26, 36, 46, 56, 66, 86, 96 ... circuit boards, 6a, 26a, 36a, 46a ... IC chip bonding area of circuit board 7, 27, 37, 47, 57, 67, 87, 97 ... electrode of circuit board 8, 28, 38, 48, 58, 68, 88, 98 ... pressing member 10, 20, 30, 40, 50, 60, 70, 90, 1
00: base, 23A: dummy bump-shaped protrusion, 53, 63, 83, 93: auxiliary passivation film, 59, 69, 89, 99: passivation film.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Ichimizu Shimizu, 1006 Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Industrial Co., Ltd. (72) Hiroyuki Otani 1006, Kadoma, Kadoma, Kadoma, Osaka Matsushita Electric Industrial Co., Ltd. Term (reference) 4M109 AA01 BA03 CA06 DB17 5E319 AA03 AB05 BB20 CC01 CD04 5E336 AA04 BB00 BB01 BC36 CC34 CC55 CC58 DD22 EE08 GG05 GG11 GG16 5F044 LL07 LL09 LL11 QQ02 RR19

Claims (30)

[Claims] 1. A bonding material (5, 1) containing at least a resin.
5, 25, 35, 45, 55, 65, 85, 95) to the circuit forming bodies (6, 16, 26, 36, 46, 56, 66,
86, 96) or electronic components (1, 11, 21, 31, 31, 4)
1, 51, 61, 81, 91) and a plurality of convex electrodes (4, 14, 2) on the joint surface of the electronic component.
4,34,44,54,64,84,94,2,12,
22, 32, 42, 52, 62, 82, 92) and the electrodes (7, 17, 27, 37, 47, 57, 57,
67, 87, 97), a positioning step of positioning the electronic component and the circuit forming body via the bonding material such that the electronic component can be electrically contacted, and the electronic component is thermocompression-bonded by heating and pressing. A step of curing the bonding material between the bonding surface of the electronic component and the circuit forming body in a state where the convex electrode of the electronic component and the electrode of the circuit forming body are in electrical contact with each other. And a bonding material flow regulating member (3, 13, 23, 2) provided on the bonding surface of the electronic component in the main bonding step.
3A, 33, 43, 53, 63, 83, 93)
A method of mounting an electronic component, wherein a flow of the bonding material to a peripheral portion of the bonding surface of the electronic component is regulated. 2. A bonding material (5, 1) containing at least a resin.
5, 25, 35, 45, 55, 65, 85, 95) to the circuit forming bodies (6, 16, 26, 36, 46, 56, 66,
86, 96) or electronic components (1, 11, 21, 31, 31, 4)
1, 51, 61, 81, 91), and a plurality of electrodes (4, 14, 24,
34, 44, 54, 64, 84, 94) on the plurality of bumps (2, 12, 22, 32, 42, 52, 62, 82,
92) and the electrodes (7, 17, 27, 3) of the circuit forming body
7, 47, 57, 67, 87, 97), a positioning step of positioning the electronic component and the circuit forming body via the bonding material so as to be able to make electrical contact therewith, When the electronic component is thermocompression-bonded, the bump on the electrode of the electronic component and the electrode of the circuit forming body are electrically connected to each other between the bonding surface of the electronic component and the circuit forming body. And a final pressure bonding step of curing the bonding material. In the final pressure bonding step, the bonding material flow regulating members (3, 13, 23, 2) provided on the bonding surface of the electronic component are provided.
3A, 33, 43, 53, 63, 83, 93)
A method of mounting an electronic component, wherein a flow of the bonding material to a peripheral portion of the bonding surface of the electronic component is regulated. 3. The bonding material flow control member according to claim 1, wherein the gap between adjacent bumps on the bonding surface of the electronic component is larger than the gap between other adjacent bumps. 23A, 43), wherein, in the final pressure bonding step, the dummy bumps regulate the flow of the bonding material to the peripheral side of the bonding surface of the electronic component in the wide gap portion. How to mount electronic components. 4. The bonding material flow regulating member, wherein when the plurality of bumps are formed in a row on two opposing sides of a rectangular bonding surface of the electronic component, the other opposing no bumps. A plurality of dummy bumps (1
3) The method according to claim 2, wherein, in the final pressure bonding step, the dummy bumps restrict the flow of the bonding material toward the peripheral portion of the bonding surface of the electronic component on the other two opposite sides. How to mount electronic components. 5. The joining material flow regulating member is provided at a corner portion where there is no bump when the plurality of bumps are formed on two opposing sides of a rectangular joining surface of the electronic component. A dummy bump (23, 23A, 33) as a bonding material flow regulating member that has been provided, and in the final press-bonding step, the dummy bump is used to bond the electronic component to a peripheral side of the bonding surface of the electronic component at the corner. 2. The method for mounting an electronic component according to claim 1, wherein the flow of the material is regulated. 6. The bonding material flow regulating member, wherein when the plurality of bumps are formed in a row at the center of the rectangular bonding surface of the electronic component, the bonding material is provided at a corner where there is no bump. The dummy bump (43) as a flow restricting member, wherein the dummy bump restricts the flow of the bonding material to a peripheral portion of the bonding surface of the electronic component at the corner in the main bonding step. The electronic component mounting method described in the above. 7. A step of forming the plurality of bumps on the bonding surface of the electronic component before the step of supplying the bonding material to the circuit forming body, wherein the bonding material flow is performed in the bump forming step. As the restricting member, dummy bumps (3, 13, 23, 23A, 43) are formed at wide-width portions where the distance between adjacent bumps on the bonding surface of the electronic component is larger than the distance between other adjacent bumps. A method for mounting the electronic component according to claim 2. 8. The relationship between the maximum pitch Pmax and the minimum pitch Pmin of the pitches between the bumps or between the bumps and the dummy bumps of the electronic component is such that α is 1
Pmax ≦ (Pmin ×
The electronic component mounting method according to any one of claims 2 to 7, wherein a dummy bump is provided so as to satisfy 2α). 9. The bonding material flow regulating member is a rectangular area inside a row of the plurality of bumps (52) near a side of each side of a bonding surface of the electronic component (51, 61, 81, 91). In the case where a passivation film (59, 69, 89, 99) is provided on the surface of the electronic component, a bonding material flow control film (53, 63, 83, 93) provided on a portion of the bonding surface of the electronic component where the passivation film is not provided. In the final pressure bonding step, the bonding material flow control film controls an increase in the flow rate of the bonding material in a portion where the passivation film does not exist on the bonding surface of the electronic component.
8. The method for mounting an electronic component according to any one of items 8 to 8. 10. A passivation film (59) in a rectangular area inside a row of the plurality of bumps (52) near a side of each side of a joining surface of the electronic component (51). And the auxiliary passivation film (53) provided in a rectangular frame area around the outer side of the bump row near the side of each side of the bonding surface of the electronic component. In the step, the auxiliary passivation film regulates an increase in the flow rate of the bonding material in a rectangular frame region around a side of each side of the bonding surface of the electronic component and a peripheral portion outside the row of bumps near the side. A method for mounting the electronic component according to claim 2. 11. A passivation film (69) in a rectangular area inside a row of the plurality of bumps (62) near a side of each side of a joining surface of the electronic component (61). And a substantially rectangular auxiliary passivation film (63) provided only at each corner of the outer peripheral part of the row of bumps near the side of the bonding surface of the electronic component. In the pressure bonding step, the auxiliary passivation film regulates an increase in the flow rate of the bonding material at each corner of the outer peripheral portion of the bump row near each side of the bonding surface of the electronic component. The mounting method of the electronic component according to claim 2. 12. A passivation film (89) in a rectangular area inside a row of the plurality of bumps (82) near a side of each side of a bonding surface of the electronic component (81). In the case of including the outer peripheral portion of the row of bumps in the vicinity of the side of each side of the bonding surface of the electronic component, and from the corner of the passivation film region to the corner of the outer peripheral portion A substantially rectangular auxiliary passivation film (83) provided in a region, wherein in the main compression bonding step, the auxiliary passivation film forms an outer side of the bump row near each side of the bonding surface of the electronic component by the auxiliary passivation film; 9. The method according to claim 2, wherein the flow rate of the bonding material in the peripheral portion from the corner portion of the passivation film to the corner portion of the outer peripheral portion is prevented from increasing. The electronic component mounting method according to any one of the above. 13. A passivation film (99) in a rectangular region inside a row of the plurality of bumps (92) near a side of each side of a joining surface of the electronic component (91). In the case where the electronic component is provided, the auxiliary passivation film (93) is provided in all regions except the bumps (92) on the bonding surface of the electronic component. The method of mounting an electronic component according to any one of claims 2 to 8, wherein an increase in the flow rate of the bonding material in all regions other than the bumps (92) on the bonding surface of the component is regulated. 14. The method according to claim 14, further comprising, before the step of supplying the bonding material to the circuit forming body, the step of forming the passivation film on the bonding surface of the electronic component. The auxiliary passivation film (53, 63, 83, 93) is formed as a regulating member in a region where the passivation film is not formed on the bonding surface of the electronic component. How to mount electronic components. 15. An electronic component (1, 11, 21, 31, 4)
1, 51, 61, 81, 91) at a plurality of electrodes (4, 14, 24, 34, 44, 54, 64, 84, 9).
4) A plurality of bumps (2, 12, 22, 32, 42, 5)
2, 62, 82, 92) to the circuit forming body (6, 16, 2)
6, 36, 46, 56, 66, 86, 96) (7, 17, 27, 37, 47, 57, 67, 87, 9)
7) in a state of being in electrical contact with the bonding material (5, 15, 25, 35, 45, 55, 65,
85, 95), the electronic component being mounted on the circuit-formed body via the electronic component mounting body, wherein the flow of the bonding material to the peripheral side of the bonding surface of the electronic component is prevented. Bonding material flow control member (3,13,2)
3, 23A, 33, 43, 53, 63, 83, 93) on the joint surface of the electronic component. 16. The bonding material flow regulating member, wherein the dummy bumps (3,13,23) provided at a wide interval between the adjacent bumps on the bonding surface of the electronic component are larger than the intervals between other adjacent bumps. , 23A, 43). 17. The bonding material flow regulating member, wherein when the plurality of bumps are formed in a row on two opposing sides of the rectangular bonding surface of the electronic component, the other opposing opposing bumps are not provided. A plurality of dummy bumps (1
The electronic component package according to claim 15, which is 3). 18. The bonding material flow restricting member is provided at a corner where there is no bump when the plurality of bumps are formed on two opposing sides of a rectangular bonding surface of the electronic component. The electronic component package according to claim 15, wherein the dummy bumps (23, 23 </ b> A, 33) serve as the bonding material flow control member. 19. The bonding material flow regulating member, wherein when the plurality of bumps are formed in a row at the center of the rectangular bonding surface of the electronic component, the bonding material is provided at a corner where there is no bump. The electronic component package according to claim 15, which is a dummy bump (43) serving as a flow restricting member. 20. The bonding material flow regulating member is a dummy bump, and a relationship between a maximum pitch Pmax and a minimum pitch Pmin of the pitch between the bumps of the electronic component or between the bump and the dummy bump is as follows. α is 1
Pmax ≦ (Pmin ×
20. The electronic component mounted body according to any one of claims 15 to 19, wherein a dummy bump is provided so as to satisfy 2α). 21. The electronic component (51, 61, 81, 9).
The plurality of bumps (5) in the vicinity of the side of each side of the bonding surface of 1).
The passivation film (5) is formed in the rectangular area inside the row of (2).
9, 69, 89, 99), and in the portion of the electronic component where the passivation film does not have the passivation film as the bonding material flow control member, the passivation film of the electronic component has no passivation film. 16. A bonding material flow regulating film (53, 63, 83, 93) for restricting an increase in the flow speed of the bonding material at a portion.
21. The electronic component package according to any one of Items 20 to 20. 22. The bonding material flow control film as the bonding material flow control member is provided in a rectangular frame area in a peripheral portion outside the row of bumps near each side of the bonding surface of the electronic component. Provided auxiliary passivation film (53)
22. The electronic component package according to claim 21, wherein 23. The bonding material flow control film as the bonding material flow control member is provided only at each corner of a peripheral portion outside the row of bumps near a side of the bonding surface of the electronic component. 22. The electronic component package according to claim 21, wherein the auxiliary passivation film is a substantially rectangular auxiliary passivation film. 24. A bonding material flow control film as the bonding material flow control member, comprising: a peripheral portion outside the row of bumps near a side of each side of the bonding surface of the electronic component;
22. The electronic component package according to claim 21, which is a substantially rectangular auxiliary passivation film (83) provided in a region from a corner of the region of the passivation film to a corner of an outer peripheral portion. 25. The bonding material flow control film serving as the bonding material flow control member is an auxiliary passivation film (93) provided in all regions other than the bumps (92) on the bonding surface of the electronic component. An electronic component package according to claim 21. 26. The electronic component package according to claim 21, wherein the bonding material flow control film as the bonding material flow control member is: 27. An electronic component mounted body manufactured by the electronic component mounting method according to claim 2. Description: 28. A plurality of electrodes (4, 14, 2) on a bonding surface.
4, 34, 44, 54, 64, 84, 94) and a plurality of bumps (2, 12, 22, 32, 42, 52, 62, 8).
(2, 92), and a joining material flow regulating member (3, 13, 23, 23A, 33, 33, 33) on the joining surface for regulating the flow of the joining material toward the periphery of the joining surface of the electronic component. 43, 53, 63,
83, 93), and the plurality of bumps of the plurality of electrodes on the bonding surface are connected to the circuit forming body (6, 16, 26, 36, 46, 56, 66, 8).
6,96) electrodes (7,17,27,37,47,5)
7, 67, 87, 97) and a bonding material (5, 15, 25, 35, 35,
45, 55, 65, 85, 95), which are joined to the circuit forming body to form an electronic component mounting body. 29. The bonding material flow restricting member, wherein the dummy bumps (3, 13, 23, 23) provided at a wide interval between the adjacent bumps on the bonding surface of the electronic component are larger than the intervals between other adjacent bumps. 29. The electronic component according to claim 28, wherein the electronic component is an electronic component. 30. The electronic component (51, 61, 81, 9).
The plurality of bumps (5) in the vicinity of the side of each side of the bonding surface of 1).
The passivation film (5) is formed in the rectangular area inside the row of (2).
9, 69, 89, 99), and in the portion of the electronic component where the passivation film does not have the passivation film as the bonding material flow control member, the passivation film of the electronic component has no passivation film. 29. A joining material flow regulating film (53, 63, 83, 93) for regulating an increase in the flow speed of the joining material at a portion.
Or the electronic component according to 29.