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JP2001200138A - High-strength glass fiber-filled phenol resin molding material - Google Patents

High-strength glass fiber-filled phenol resin molding material

Info

Publication number
JP2001200138A
JP2001200138A JP2000012834A JP2000012834A JP2001200138A JP 2001200138 A JP2001200138 A JP 2001200138A JP 2000012834 A JP2000012834 A JP 2000012834A JP 2000012834 A JP2000012834 A JP 2000012834A JP 2001200138 A JP2001200138 A JP 2001200138A
Authority
JP
Japan
Prior art keywords
weight
molecular weight
molding material
phenol resin
glass fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000012834A
Other languages
Japanese (ja)
Inventor
Tadatoshi Tsuruta
忠利 鶴田
Yasutaka Kimura
康孝 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2000012834A priority Critical patent/JP2001200138A/en
Publication of JP2001200138A publication Critical patent/JP2001200138A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a glass fiber-containing phenol resin molding material excellent in mechanical strengths at normal temperature and in heating and deterioration of heat resistance and suitable as a material alternate to metal in automobiles and electric and electronic fields. SOLUTION: This phenol resin molding material containing glass fiber comprises (a) 20-40 wt.% high-molecular weight novolak type phenol resin in which the weight average molecular weight when polystyrene is used as a standard substance is >=50,000, (b) 10-40 wt.% phenol resin in which the weight average molecular weight when polystyrene is used as a standard substance is <50,000, (c) 3-18 wt.% hexamethylenetetramine as a curing agent and (d) 40-60 wt.% glass fiber as essential components.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、引っ張り強度、衝
撃強度、曲げ強度等の機械的強度に優れており、更に熱
時の機械的強度に優れたガラス繊維入りフェノール樹脂
成形材料を提供するものである。
TECHNICAL FIELD The present invention provides a phenolic resin molding material containing glass fiber which has excellent mechanical strength such as tensile strength, impact strength and bending strength, and further has excellent mechanical strength when heated. It is.

【0002】[0002]

【従来技術】ガラス繊維入りフェノール樹脂成形材料は
耐熱性、寸法安定性、成形性等に優れ、自動車分野、電
気分野、電子分野等の基幹産業分野で長期に渡り使用さ
れている実績を有する。特に、近年は、金属部品で使用
されているものをガラス繊維で強化したフェノール樹脂
成形品に置き換えることで、大幅なコストダウンが可能
となる。そのため、積極的な代替検討が行われている。
更なる金属代替を進めるには、ガラス繊維入りフェノー
ル樹脂成形材料に対して特性の向上が求められている
が、特に、自動車部品などの基幹部品の分野では常温で
の強度だけでなく熱時での強度向上や熱による劣化の抑
制が必要となってきている。
2. Description of the Related Art Phenolic resin molding materials containing glass fibers are excellent in heat resistance, dimensional stability, moldability, and the like, and have a long track record of being used in key industrial fields such as automobiles, electrics, and electronics. In particular, in recent years, by replacing those used for metal parts with phenolic resin molded products reinforced with glass fiber, it is possible to significantly reduce costs. Therefore, aggressive alternatives are being considered.
In order to promote further metal substitution, it is necessary to improve the properties of phenolic resin molding materials containing glass fibers.In particular, in the field of core parts such as automobile parts, not only strength at room temperature but also heat It has become necessary to improve the strength of steel and to suppress deterioration due to heat.

【0003】[0003]

【発明が解決しようとする課題】本発明は、前述のよう
な、従来のガラス繊維で強化した高強度フェノール樹脂
成形材料に比べて常温及び熱時の機械強度に優れ、耐熱
劣化に優れたフェノール樹脂成形材料を供給するもので
ある。
DISCLOSURE OF THE INVENTION The present invention relates to a phenol having excellent mechanical strength at normal temperature and heat and excellent heat deterioration as compared with the conventional high-strength phenol resin molding material reinforced with glass fiber as described above. It supplies resin molding material.

【0004】[0004]

【課題を解決するための手段】本発明は、成形材料全体
に対して、(a)ポリスチレンを基準物質としたときの
重量平均分子量が 50,000以上である高分子量ノボ
ラック型フェノール樹脂20〜40重量%、(b)ポリ
スチレンを基準物質としたときの重量平均分子量が 5
0,000未満のフェノール樹脂10〜40重量%、
(c)硬化剤としてヘキサメチレンテトラミン3〜18
重量%、及び(d)ガラス繊維を40〜60重量%を必
須成分として含有することを特徴とするフェノール樹脂
成形材料である。
According to the present invention, (a) a high molecular weight novolak type phenol resin having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance is 20 to 40 with respect to the whole molding material. % By weight, and (b) a weight average molecular weight of 5 based on polystyrene as a reference substance.
10 to 40% by weight of a phenolic resin of less than 000,
(C) Hexamethylenetetramine 3 to 18 as a curing agent
It is a phenol resin molding material characterized by containing 40 to 60% by weight of glass fiber and (d) glass fiber as essential components.

【0005】本発明に用いられる高分子量ノボラック型
フェノール樹脂(a)は3官能フェノール類とホルムア
ルデヒドの重縮合物であり、ポリスチレンを基準物質と
したときの重量平均分子量が 50,000以上である。
そして、成形材料を速硬化性にするためにはフェノール
水酸基に対してオルソ−オルソ位でのメチレン結合が全
メチレン結合の60%以上であるものが好ましい。更
に、成形材料化の際の作業性から 50,000以上20
0,000以下のものが好ましい。
The high molecular weight novolak type phenol resin (a) used in the present invention is a polycondensate of a trifunctional phenol and formaldehyde, and has a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance.
In order to make the molding material quick-curing, it is preferable that the methylene bond at the ortho-ortho position relative to the phenolic hydroxyl group is 60% or more of all methylene bonds. Furthermore, from the viewpoint of workability in forming a molding material, 50,000 to 20
Those having a molecular weight of not more than 000 are preferred.

【0006】一方、本発明に用いられるポリスチレンを
基準物質としたときの重量平均分子量が 50,000未
満のフェノール樹脂(b)はノボラック樹脂、レゾール
樹脂のどちらでも使用することができるが、成形材料化
の際の作業性から1,500〜30,000のものが好ま
しい。
On the other hand, the phenolic resin (b) having a weight-average molecular weight of less than 50,000 based on polystyrene used in the present invention can be either a novolak resin or a resol resin. Those having a workability of 1,500 to 30,000 are preferred.

【0007】本発明においては、ポリスチレンを基準物
質としたときの重量平均分子量が50,000以上であ
る高分子量ノボラック型フェノール樹脂(a)と、 5
0,000未満のフェノール樹脂(b)とを使用する
が、かかる分子量の異なるフェノール樹脂を併用するこ
とにより、成形材料の溶融時の粘度を極端に高めること
なく、高分子量フェノール樹脂の特長である耐熱性を良
好にすることができる。
In the present invention, a high molecular weight novolak type phenol resin (a) having a weight average molecular weight of 50,000 or more based on polystyrene as a reference material,
Although the phenolic resin (b) having a molecular weight of less than 000 is used, the phenolic resin having such a different molecular weight is used in combination, so that the viscosity of the molding material at the time of melting is not extremely increased, which is a characteristic of the high molecular weight phenolic resin. Heat resistance can be improved.

【0008】両フェノール樹脂の配合量は、成形材料全
体に対して、(a)高分子量ノボラック型フェノール樹
脂20〜40重量%、及び(b)重量平均分子量 50,
000未満のフェノール樹脂10〜40重量%である。
高分子量ノボラック型フェノール樹脂が20重量%未満
あるいは重量平均分子量 50,000未満のフェノール
樹脂が40重量%を越える場合、耐熱性の効果が小さく
なり、高分子量ノボラック型フェノール樹脂が40重量
%を越える場合あるいは重量平均分子量 50,000未
満のフェノール樹脂が10重量%未満の場合、成形材料
の溶融時の粘度が高くなり、成形性が低下するようにな
る。
The mixing amounts of both phenol resins are (a) 20 to 40% by weight of a high molecular weight novolak type phenol resin and (b) a weight average molecular weight of 50,
It is 10 to 40% by weight of a phenol resin having a molecular weight of less than 000.
When the amount of the high molecular weight novolak phenolic resin is less than 20% by weight or the amount of the phenolic resin having a weight average molecular weight of less than 50,000 exceeds 40% by weight, the effect of heat resistance is reduced, and the amount of the high molecular weight novolak phenolic resin exceeds 40% by weight. In the case where the phenolic resin having a weight average molecular weight of less than 50,000 is less than 10% by weight, the viscosity of the molding material at the time of melting is increased, and the moldability is reduced.

【0009】本発明において、硬化剤としてヘキサメチ
レンテトラミン(c)を、成形材料全体に対して3〜1
8重量%使用する。3重量%未満では、硬化が不十分と
なり、18重量%を越えて配合しても硬化性はこれ以上
良くなることはなく、逆に分解ガス等により成形不良の
原因となりやすい。
In the present invention, hexamethylenetetramine (c) is used as a curing agent in an amount of 3 to 1 with respect to the whole molding material.
Use 8% by weight. If the amount is less than 3% by weight, the curing will be insufficient, and if the amount exceeds 18% by weight, the curability will not be further improved, and conversely, decomposition gas or the like tends to cause molding failure.

【0010】本発明に用いるガラス繊維(d)について
は、繊維径が10〜15μm、繊維長が1〜3mmのも
のを使用することが成形材料化段階での作業性、得られ
た成形物の強度が比較的良好であり、配合量については
成形材料全体に対し40〜60重量%が好ましい。40
重量%未満では満足し得る強度が得られにくく、寸法変
化が大きくなり、60重量%を超えると成形材料化段階
での作業性が困難であり、強度低下につながることがあ
る。
As for the glass fiber (d) used in the present invention, a glass fiber having a fiber diameter of 10 to 15 μm and a fiber length of 1 to 3 mm is required to be workable at the stage of forming a molding material and to obtain an obtained molded product. The strength is relatively good, and the compounding amount is preferably 40 to 60% by weight based on the whole molding material. 40
If the amount is less than 60% by weight, satisfactory strength is hardly obtained, and the dimensional change becomes large. If the amount exceeds 60% by weight, workability at the stage of forming a molding material is difficult, which may lead to a decrease in strength.

【0011】本発明のフェノール樹脂成形材料を得る場
合、上記原料を均一に混合後、ロール、コニーダ、二軸
押出し機等の混練機単独又はロールと他の混合機との組
合せで加熱混練し、粉砕して得られる。本発明のフェノ
ール樹脂成形材料は、高い機械的強度及び熱時の機械強
度を有しており、自動車、電気、電子等の金属部品の代
替に適用できる。
When the phenolic resin molding material of the present invention is obtained, the above-mentioned raw materials are uniformly mixed and then kneaded with a kneading machine such as a roll, a co-kneader, a twin-screw extruder alone or a combination of a roll and another mixer. Obtained by grinding. The phenolic resin molding material of the present invention has high mechanical strength and mechanical strength when heated, and can be used as a substitute for metal parts such as automobiles, electricity, and electronics.

【0012】以下、実施例により本発明を説明する。特
性評価用試験片はトランスファー成形により作成し、評
価方法はJIS K 6911に基づいて行った。その結
果を表2に示す。
Hereinafter, the present invention will be described with reference to examples. The test piece for characteristic evaluation was prepared by transfer molding, and the evaluation method was based on JIS K 6911. Table 2 shows the results.

【0013】実施例1 フェノール22.0Kgを熱交換器、加熱装置及び同径
の2段タービン型攪拌羽根を有した容量50Lの高圧反
応器内に入れ180℃まで加熱し、窒素ガスにて0.8
MPa迄加圧した後、ダイアフラム式高圧定量ポンプに
て予めイオン交換樹脂処理により蟻酸含有量を50PP
Mまで低減した40%ホルマリン13.3Kgを60分
間掛けて反応器下部より逐次添加し付加縮合反応をさせ
た。この間の反応温度が180〜200℃となるように
反応器のジャケット部の温度及び添加速度を調整した。
添加終了後5分間その温度を保ち自己発熱が起こらない
ことを確認後、更に220〜230℃を保つように加熱
しながら、熱交換器経由で30分間掛けて常圧に戻しな
がら脱水反応を行った。更にこの後1.3KPaまで減
圧し30分間未反応フェノールの除去を行い、冷却バッ
ト上に取り出しポリスチレン換算で重量平均分子量が
52,000のノボラック型フェノール樹脂20.0K
gを得た。
Example 1 22.0 kg of phenol was placed in a 50 L high-pressure reactor having a heat exchanger, a heating device and a two-stage turbine type stirring blade of the same diameter, heated to 180 ° C., and heated to 0 ° C. with nitrogen gas. .8
After pressurizing to MPa, the formic acid content was previously reduced to 50 PP by ion exchange resin treatment with a diaphragm type high pressure metering pump.
13.3 Kg of 40% formalin reduced to M was added sequentially from the lower part of the reactor over 60 minutes to cause an addition condensation reaction. The temperature and the addition rate of the jacket of the reactor were adjusted so that the reaction temperature during this time was 180 to 200 ° C.
After completion of the addition, the temperature was maintained for 5 minutes, and after confirming that self-heating did not occur, a dehydration reaction was performed while returning to normal pressure over 30 minutes via a heat exchanger while heating to further maintain the temperature at 220 to 230 ° C. Was. Thereafter, the pressure was reduced to 1.3 KPa, and the unreacted phenol was removed for 30 minutes. The unreacted phenol was removed and taken out on a cooling vat, and the weight average molecular weight was reduced to polystyrene.
52,000 novolak phenolic resin 20.0K
g was obtained.

【0014】この重量平均分子量 52,000のノボラ
ック型フェノール樹脂とポリスチレン換算で重量平均分
子量が 8,000のノボラック型フェノール樹脂、ガラ
ス繊維、ヘキサメチレンテトラミン、硬化助剤、滑剤、
着色剤等を表1の割合に示す重量割合にて混合し、2軸
ロールにて溶融混練し成形材料化を行った。得られた成
形材料について25、100、150、200℃の機械
的強度を評価した。また、200℃において250、5
00、1000時間処理したものの機械的強度を評価し
た。これらの結果を表2に示す。
The novolak type phenol resin having a weight average molecular weight of 52,000 and the novolak type phenol resin having a weight average molecular weight of 8,000 in terms of polystyrene, glass fiber, hexamethylenetetramine, a curing aid, a lubricant,
A coloring agent and the like were mixed at a weight ratio shown in Table 1 and melt-kneaded with a biaxial roll to form a molding material. The obtained molding materials were evaluated for mechanical strength at 25, 100, 150 and 200 ° C. At 200 ° C., 250, 5
The mechanical strength of the samples treated for 00 and 1000 hours was evaluated. Table 2 shows the results.

【0015】実施例2 反応器内にフェノール20.0Kgを入れ、アルデヒド
類として88%パラホルムアルデヒド8.9Kgを使用
し、更にこのパラホルムアルデヒドは8.0Kgのフェ
ノールと事前に混合し、懸濁状態液となったものをプラ
ンジャー式高圧定量ポンプにて反応器下部より供給する
ことと減圧での未反応フェノール除去を行わない事、反
応温度が200〜220℃である事以外は、すべて実施
例1と同様の方法で反応を行い、ポリスチレン換算で重
量平均分子量が102,000のノボラック型フェノー
ル樹脂27.0Kgを得た。
Example 2 20.0 kg of phenol was placed in a reactor, 8.9 kg of 88% paraformaldehyde was used as an aldehyde, and this paraformaldehyde was previously mixed with 8.0 kg of phenol to form a suspension. Except that the liquid was supplied from the lower part of the reactor with a plunger-type high-pressure metering pump, unreacted phenol was not removed under reduced pressure, and the reaction temperature was 200 to 220 ° C. The reaction was carried out in the same manner as in Example 1 to obtain 27.0 kg of a novolak phenol resin having a weight average molecular weight of 102,000 in terms of polystyrene.

【0016】この重量平均分子量 102,000のノボ
ラック型フェノール樹脂とポリスチレン換算で重量平均
分子量が 8,000のノボラック型フェノール樹脂、ガ
ラス繊維、ヘキサメチレンテトラミン、硬化助剤、滑
剤、着色剤等を表1の割合に示す重量割合にて混合し、
2軸ロールにて溶融混練し成形材料化を行った。得られ
た成形材料について25、100、150、200℃の
機械的強度を評価した。また、200℃において25
0、500、1000時間処理したものの機械的強度を
評価した。これらの結果を表2に示す。
The novolak type phenol resin having a weight average molecular weight of 102,000, the novolak type phenol resin having a weight average molecular weight of 8,000 in terms of polystyrene, glass fiber, hexamethylenetetramine, a curing aid, a lubricant, a coloring agent, and the like are shown. Mix at the weight ratio shown in the ratio of 1,
The mixture was melted and kneaded with a biaxial roll to form a molding material. The obtained molding materials were evaluated for mechanical strength at 25, 100, 150 and 200 ° C. At 200 ° C., 25
The mechanical strength of the samples treated for 0, 500, and 1000 hours was evaluated. Table 2 shows the results.

【0017】比較例1 ポリスチレン換算で重量平均分子量が 8,000のノボ
ラック型フェノール樹脂、ガラス繊維、ヘキサメチレン
テトラミン、硬化助剤、滑剤、着色剤等を表1の割合に
示す重量割合にて混合し、2軸ロールにて溶融混練し成
形材料化を行った。得られた成形材料について25、1
00、150、200℃の機械的強度を評価した。ま
た、200℃において250、500、1000時間処
理したものの機械的強度を評価した。これらの結果を表
2に示す。
Comparative Example 1 A novolak-type phenol resin having a weight-average molecular weight of 8,000 in terms of polystyrene, glass fiber, hexamethylenetetramine, a curing aid, a lubricant, a colorant, and the like were mixed in a weight ratio shown in Table 1. Then, the mixture was melt-kneaded with a biaxial roll to form a molding material. 25, 1
The mechanical strength at 00, 150 and 200 ° C. was evaluated. In addition, the mechanical strength of those treated at 200 ° C. for 250, 500, and 1000 hours was evaluated. Table 2 shows the results.

【0018】[0018]

【表1】 [Table 1]

【0019】[0019]

【表2】 [Table 2]

【0020】[0020]

【発明の効果】以上の実施例及び比較例から明らかなよ
うに、本発明のフェノール樹脂成形材料は、引っ張り強
度、衝撃強度、曲げ強度のような機械的強度に優れてお
り、更に熱時の機械的強度に優れている。更に耐熱劣化
にも優れている。そのため自動車、電気、電子分野等に
おける金属代替を大幅に促進するものであり、その他各
種の耐熱性を要求される成形品分野に適用ができる。
As is apparent from the above Examples and Comparative Examples, the phenolic resin molding material of the present invention is excellent in mechanical strength such as tensile strength, impact strength and bending strength, and furthermore when heated. Excellent mechanical strength. Further, it is excellent in heat deterioration. Therefore, it greatly promotes metal substitution in the fields of automobiles, electricity, and electronics, and can be applied to other various molded article fields requiring heat resistance.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 成形材料全体に対して、(a)ポリスチ
レンを基準物質としたときの重量平均分子量が 50,0
00以上である高分子量ノボラック型フェノール樹脂2
0〜40重量%、(b)ポリスチレンを基準物質とした
ときの重量平均分子量が50,000 未満のフェノール
樹脂10〜40重量%、(c)硬化剤としてヘキサメチ
レンテトラミン3〜18重量%、及び(d)ガラス繊維
40〜60重量%を含有することを特徴とするガラス繊
維入りフェノール樹脂成形材料。
1. The weight average molecular weight of (a) polystyrene as a reference substance is 50,0 based on the whole molding material.
High molecular weight novolak type phenolic resin 2 having a molecular weight of 00 or more
0 to 40% by weight, (b) 10 to 40% by weight of a phenol resin having a weight average molecular weight of less than 50,000 based on polystyrene as a reference material, (c) 3 to 18% by weight of hexamethylenetetramine as a curing agent, and (D) A phenolic resin molding material containing glass fiber, which contains 40 to 60% by weight of glass fiber.
【請求項2】 成形材料全体に対して、(a)ポリスチ
レンを基準物質としたときの重量平均分子量が 50,0
00以上である高分子量ノボラック型フェノール樹脂2
0〜45重量%、(b)ポリスチレンを基準物質とした
ときの重量平均分子量が 50,000未満のフェノール
樹脂5〜40重量%、(c)硬化剤としてヘキサメチレ
ンテトラミン3〜12重量%、及び(d)有機充填材及
び又は無機充填材30〜60重量%を含有する請求項1
記載のフェノール樹脂成形材料。
2. The weight average molecular weight of (a) polystyrene as a reference substance is 50,0 based on the whole molding material.
High molecular weight novolak type phenolic resin 2 having a molecular weight of 00 or more
0 to 45% by weight, (b) 5 to 40% by weight of a phenol resin having a weight average molecular weight of less than 50,000 based on polystyrene, (c) 3 to 12% by weight of hexamethylenetetramine as a curing agent, and (D) An organic filler and / or an inorganic filler is contained in an amount of 30 to 60% by weight.
The phenolic resin molding material according to the above.
JP2000012834A 2000-01-21 2000-01-21 High-strength glass fiber-filled phenol resin molding material Pending JP2001200138A (en)

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