JP2001284521A - Antenna substrate for noncontact ic card and method of manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance bending strength of a noncontact IC chip mounting part so that the basic material of an antenna substrate does not stick to a work table when a noncontact IC chip is mounted onto the antenna substrate. SOLUTION: In the antenna substrate for noncontact IC card, an adhesive layer 12 is formed on the surface and rear surface of a sheet-like basic material 11, a copper foil layer is provided on the adhesive layer 12 and a pattern of specified shape is formed from the copper foil layer by etching. That pattern comprises an antenna part 13a, a noncontact IC chip mounting part 13c coupled electrically with the antenna part 13a, and a noncontact IC chip supporting part 13d provided on a plane opposite to the plane where the noncontact IC chip mounting part 13c is provided while including the region of the noncontact IC chip mounting part 13c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact IC card antenna substrate used for a non-contact IC card having a non-contact IC chip, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Heretofore, a non-contact IC card having a non-contact IC chip mounted thereon has been known, and the following method has been known as a method of manufacturing this non-contact IC card. First, an antenna substrate for a non-contact IC card is manufactured. In the manufacture of this antenna substrate, first, an adhesive layer is formed on the front and back surfaces of a sheet-like base made of resin or the like, and a copper foil layer is formed on the entire area on the adhesive layer. Next, a copper foil layer is formed on a pattern having a predetermined shape, for example, an antenna portion, a capacitor, and a non-contact IC chip mounting portion by etching.

[0003] A non-contact IC is mounted on the non-contact IC chip mounting portion of the antenna substrate manufactured as described above via an adhesive.
The non-contact IC chip is adhered to the antenna substrate by mounting the C chip and applying heat and pressure from above the non-contact IC chip. Then, a non-contact IC card is manufactured by embedding this antenna substrate in a resin layer made of polyvinyl chloride or the like as a card base material.

[0004]

However, the above-mentioned prior art has the following problems. First, in the manufacture of the antenna substrate, the adhesive layer is formed on the entire area of the front and back surfaces of the base material. The agent layer is exposed. For this reason, when the non-contact IC chip is placed on the non-contact IC chip mounting portion of the antenna substrate and heated and pressurized, and the adhesive layer is exposed on the back side, the adhesive layer However, there is a problem in that it adheres to the work table.

Second, if a bending stress is applied to the non-contact IC card, the non-contact IC chip may be damaged, etc., so that the card base material of the non-contact IC card is made of stainless steel or the like. The embedding of reinforcing materials is performed. However, there is a problem that the cost of the reinforcing material is high, and a step of burying the reinforcing material needs to be separately provided, which complicates the manufacturing process. Further, there is a problem that it is difficult to bury the reinforcing material accurately.

SUMMARY OF THE INVENTION Therefore, the problem to be solved by the present invention is to prevent the base material of the antenna substrate from sticking to the work table when mounting the non-contact IC chip on the antenna substrate, and to complicate the manufacturing process and structure. Without increasing the bending strength of the non-contact IC chip mounting portion.

[0007]

According to a first aspect of the present invention, there is provided a non-contact IC card antenna substrate used for a non-contact IC card having a non-contact IC chip. After forming an adhesive layer on the front and back surfaces of the substrate, providing a copper foil layer on the adhesive layer, a pattern of a predetermined shape is formed from the copper foil layer by an etching process, the pattern is, An antenna unit, a non-contact IC chip mounting unit electrically connected to the antenna unit,
And a non-contact IC chip supporting portion provided on a surface opposite to the surface on which the non-contact IC chip mounting portion is provided in a region including the region of the non-contact IC chip mounting portion. .

[0008] The invention of claim 2 provides an adhesive layer forming step of forming an adhesive layer on the front and back surfaces of a sheet-like substrate, a copper foil layer forming step of providing a copper foil layer on the adhesive layer, The copper foil layer formed in the copper foil layer forming step is etched to form an antenna portion, a non-contact IC chip mounting portion electrically connected to the antenna portion, and the non-contact IC chip mounting portion. An etching process for forming a non-contact IC chip support on a surface opposite to the surface on which the non-contact IC chip mounting portion is provided, and the non-contact IC chip formed by the etching process. A non-contact IC chip is mounted on the contact IC chip mounting portion via an adhesive, and the non-contact IC chip is heated and pressed from above the non-contact IC chip to bond the non-contact IC chip on the non-contact IC chip mounting portion. Do Characterized in that it comprises a contact IC chip bonding step.

In the present invention, in a region where the copper foil layer is dissolved and removed by the etching process, the adhesive layer thereunder is exposed. Here, the non-contact IC chip supporting portion is provided on the back surface side of the region where the non-contact IC chip mounting portion is provided, and the copper foil layer remains. Therefore, the adhesive layer is not exposed in this region. Therefore, when the non-contact IC chip is placed on the non-contact IC chip mounting portion and heated and pressed to adhere the non-contact IC chip to the non-contact IC chip mounting portion, the adhesive on the back surface side of the area is used. The layer can be prevented from sticking to the workbench.

In addition, the non-contact IC chip supporting portion increases the bending rigidity of the non-contact IC chip mounting portion. Therefore, in manufacturing the non-contact IC card, it is not necessary to provide a reinforcing material or the like at the mounting portion of the non-contact IC chip.

[0011]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing an embodiment of an antenna substrate for a non-contact IC card (hereinafter, simply referred to as “antenna substrate”) 10 according to the present invention, where (a) is a front view and (b) is a back view. Is shown. FIG. 2 is a cross-sectional view illustrating a layer configuration of the antenna substrate 10.

The antenna substrate 10 is manufactured as follows. First, the adhesive layer 12 is applied on the base material 11 (adhesive layer forming step). Here, the base material 11 is a sheet-like material made of transparent PET (polyethylene terephthalate) or the like.
It is about μm. The adhesive layer 12 is provided on all areas of the front and back surfaces of the base material 11. Its thickness is about 10 μm.

Next, a copper foil layer is formed on the adhesive layer 12 so as to cover the entire area on the front and back surfaces of the adhesive layer 12 (copper foil layer forming step). The thickness of the copper foil layer is about 18 μm. Subsequently, a copper foil layer is formed into a pattern having a predetermined shape by an etching process (etching process step).
That is, unnecessary portions of the copper foil layer are dissolved and removed by a chemical reaction, and in the example of the present embodiment, an electric circuit including the antenna section 13a is formed from the remaining copper foil layer.

Further, the antenna section 13 is formed by a copper foil layer.
Non-contact IC chip mounting portion 13c electrically connected to a
(A region with four contacts) is formed. Furthermore, a non-contact IC chip supporting portion 13d is formed on the back surface side of the region including the non-contact IC chip mounting portion 13c. That is, the copper foil layer is left on the back side of the non-contact IC chip mounting portion 13c. Note that, in the portion where the copper foil layer has been dissolved and removed, the adhesive layer 12 existing below the copper foil layer is exposed.

A non-contact IC chip 21 is mounted on the antenna substrate 10 formed as described above, as shown in FIG. In FIG. 2, the antenna board 10 is
4, the non-contact IC chip 21 is mounted on the non-contact IC chip mounting portion 13c of the antenna substrate 10 via an adhesive (anisotropic conductive adhesive) 22. The non-contact IC chip 21 is bonded to the antenna substrate 10 by heating and pressing from above (non-contact IC chip bonding step). Thus, the non-contact IC chip 21 is mounted on the antenna substrate 10.

Here, when the non-contact IC chip 21 is mounted on the antenna substrate 10, conventionally, if the adhesive layer 12 is exposed on the back side of the area where the non-contact IC chip 21 is mounted, this bonding The agent layer 12 was stuck to the workbench 24 by heating and pressing. However, in the present embodiment, as shown in FIG.
Since the copper foil layer is left as the non-contact IC chip supporting portion 13d on the back surface side of the region, the adhesive layer 12 is not exposed in this region. Thus, the antenna substrate 10 does not stick to the work table 24 when the non-contact IC chip 21 is mounted.

The antenna substrate 10 on which the non-contact IC chip 21 is mounted is buried in a card base made of PVC (polyvinyl chloride resin) or the like. Thereby, a non-contact IC card is manufactured.

Here, the conventional non-contact IC chip 21
In order to prevent the non-contact IC chip 21 from being damaged due to bending stress, a certain strength is secured by embedding a reinforcing plate in the card base material.
However, by providing the non-contact IC chip supporting portion 13d as in the present embodiment, the non-contact IC chip mounting portion 1d is provided.
The bending rigidity of 3c is increased. Therefore, a certain strength can be secured without embedding a reinforcing plate or the like.

[0019]

According to the present invention, when a non-contact IC chip is bonded to a non-contact IC chip mounting portion, it is possible to prevent the adhesive layer on the back surface of the area from sticking to the work table. Can be. Also, without providing a reinforcing material or the like at the mounting portion of the non-contact IC chip,
By forming the C chip supporting portion, the bending rigidity of the non-contact IC chip mounting portion can be increased.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an antenna substrate for a non-contact IC card according to the present invention, wherein FIG.
(B) shows a back view.

FIG. 2 is a cross-sectional view illustrating a layer configuration of a non-contact IC card antenna substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 (For non-contact IC card) Antenna board 11 Base material 12 Adhesive layer 13a Antenna part 13c Non-contact IC chip mounting part 13d Non-contact IC chip support part 21 Non-contact IC chip 22 Adhesive 24 Work bench

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shinya Mogi 4-14-12 Koishikawa, Bunkyo-ku, Tokyo Kyodo Printing Co., Ltd. F-term (reference) 2C005 MA07 NA08 PA01 RA22 5B035 AA07 BA03 BA05 BB09 CA01 CA23

Claims (2)

[Claims] An antenna substrate for a non-contact IC card used for a non-contact IC card having a non-contact IC chip, wherein an adhesive layer is formed on the front and back surfaces of a sheet-like base material, and copper is provided on the adhesive layer. After the foil layer is provided, a pattern having a predetermined shape is formed from the copper foil layer by an etching process. The pattern includes an antenna unit, a non-contact IC chip mounting unit electrically connected to the antenna unit, and The non-contact I
A region including the region of the C chip mounting portion, wherein the non-contact I
An antenna substrate for a non-contact IC card, comprising: a non-contact IC chip supporting portion provided on a surface opposite to a surface on which a C chip mounting portion is provided. 2. An adhesive layer forming step of forming an adhesive layer on the front and back surfaces of a sheet-like substrate, a copper foil layer forming step of providing a copper foil layer on the adhesive layer, and the copper foil layer forming The copper foil layer formed in the step is etched to form an antenna portion, a non-contact IC chip mounting portion electrically connected to the antenna portion, and an area including a region of the non-contact IC chip mounting portion. An etching process for forming a non-contact IC chip supporting portion on a surface opposite to a surface on which the non-contact IC chip mounting portion is provided; and the non-contact IC formed by the etching process.
A non-contact IC chip is placed on the C chip mounting portion via an adhesive, and heated and pressed from above the non-contact IC chip,
Bonding the non-contact IC chip onto the non-contact IC chip mounting portion.