JP2004516538A - Smart label web and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a method for manufacturing a smart label web (W2). The smart label web includes smart labels (1), which are arranged sequentially and / or adjacent to each other and include a circuit pattern (2) and an on-chip integrated circuit (3) therein. In this method, electrodes are formed between the on-chip integrated circuit (3) and the circuit pattern (2) on the smart label of the smart label web by the following method. That is, the structure (4) separated from the separate carrier web (W1) and containing the on-chip integrated circuit (3) is attached to the smart label. This structure (4) contains a thermoplastic material, which attaches to the smart label (1).
[Selection diagram] Fig. 1

Description

[0001]
The present invention relates to a method for manufacturing a smart label web and a carrier web, a smart label web, and a smart label portion in the smart label web. The smart label web includes a plurality of smart labels, which are arranged sequentially in succession and / or are arranged side by side, and include a circuit pattern and an on-chip integrated circuit therein. In the method of manufacturing a smart label web, an electrode is formed between an on-chip integrated circuit and a circuit pattern of a smart label in the smart label web as follows. That is, the component containing the on-chip integrated circuit is separated from the separate carrier web and attached to a smart label.
[0002]
In this Finnish patent application, English terms are shown in parentheses next to Finnish terms. This is because Finnish terminology in this field has not been established.
[0003]
In order to attach an on-chip integrated circuit to a circuit pattern using electrodes, a method of directly attaching a chip by flip chip technology is known. Alternatively, a method is also known in which a chip is attached to the surface of a separate structure and the chip is attached by connecting the structure to a smart label.
[0004]
U.S. Pat. No. 5,810,959 discloses a method in which a substrate and a silicon chip are attached by heating and pressing with an anisotropically conductive thermosetting adhesive.
[0005]
U.S. Pat. No. 5,918,113 discloses an anisotropically conductive adhesive applied to a circuit board, the adhesive comprising a thermoplastic resin or a thermosetting resin, and a conductive powder dispersed in the resin. Are disclosed. The adhesive layer is softened, and the semiconductor chip is bonded to the semiconductor chip by heating and pressing.
In a manner known from U.S. Pat. No. 5,918,363, an integrated circuit formed on a wafer is tested to determine whether the circuit is functioning, whether an underfill has been applied to the functional integrated circuit, and Some determine whether the chips are separated from each other. The underfill may include a thermoplastic resin material. Thereafter, the silicon chip is connected to its location of use so that the underfill extends around the electrical connection lines.
[0006]
Some electronic circuits known from U.S. Pat. No. 5,936,847 have a non-conductive polymer layer that forms an underfill between the substrate and the chip. The polymer layer has an electrode opening. The substrate is also provided with an opening for spraying a conductive polymer to form an electrode between the substrate and the chip.
[0007]
U.S. Pat. No. 6,040,630 discloses a chip connection method that can be released as needed. A thermoplastic resin film is disposed on the substrate on which the circuit pattern is formed, and has a via hole for exposing the bump of the chip. This thermoplastic resin film forms an underfill for the chip, and connects the chip and the circuit pattern when the film is heated.
[0008]
U.S. Pat. No. 6,077,382 discloses a method in which an anisotropically conductive thermosetting adhesive is placed on a circuit board and the circuit board is brought to a temperature below the curing temperature of the adhesive. Some are heated. The semiconductor chip is arranged at a desired position, and bonded by heating and pressing.
[0009]
Methods based on flip-chip technology have, for example, the following disadvantages:
-Production lines are too complex, expensive and inconvenient in terms of improving this. This is because all processes are integrated on the same line.
-When placing chips on a smart label, the tools used require a long travel distance and the chips must also be placed exactly in the correct position.
[0010]
Smart labels may be provided with a separate structure that contains the on-chip integrated circuits attached to the film material.
[0011]
The electrodes between the on-chip integrated circuit and the circuit pattern of the smart label are formed as follows. That is, a film material of a separate structure is applied to the conductive layer, and the conductive layer is connected to the chip. Is brought into contact with the circuit pattern. That is, the structure does not contact the smart label in the region between the two ends. The structure is attached to one side of the smart label and the circuit pattern is arranged on the other side, thus the chip contacts the smart label.
[0012]
The above method has, for example, the following problems.
-The technology of mounting the structure is unsophisticated and complex.
-The currently used materials require a long processing time, so that the production speed is not significantly different compared to flip chip technology.
-Since the processing speed is slow, even a single process becomes relatively complicated and expensive.
-Mechanical techniques for connecting the structures, such as crimp connections, limit the choice of materials and can also lead to reliability problems.
-With some current smart labels, bending changes the distance between the structure and the circuit pattern and at the same time the distance between the on-chip integrated circuit and the circuit pattern. This is because the structure is not completely attached to the smart label, which changes the stray capacitance that affects the frequency of the electrical oscillating circuit.
-Smart labels have a relatively thick structure, which disadvantages subsequent processes.
[0013]
With the method, the smart label web and the structure according to the invention, it is possible to reduce the above-mentioned problems. The method for producing a smart label web according to the invention is characterized in that the structure comprises a thermoplastic material, by means of which the structure is attached to the smart label.
[0014]
The method for producing a carrier web according to the invention is characterized in that the carrier web comprises a thermoplastic material, on which the on-chip integrated circuits are mounted.
[0015]
The smart label web according to the invention is characterized in that the structure comprises a thermoplastic material, by means of which the structure is attached to the smart label.
[0016]
The structure according to the invention is characterized in that it comprises a thermoplastic material, by means of which it can be attached to a smart label.
[0017]
The use of thermoplastic materials offers, for example, the following advantages:
-The thermoplastic material can be repeatedly molded by heating.
-Thermoset materials do not require common, time-consuming chemical steps and can be mounted quickly.
The material is relatively easy to cut and relatively inexpensive even for large batches;
-Lower processing temperatures than thermosetting materials.
[0018]
The use of separate structures provides, for example, the following advantages:
The chip mounting process is independent of the size and shape of the circuit pattern;
Lifting the chips from the wafer and placing the chips on the carrier web is a simple and fast process. This is because turning tools require only a short travel distance.
Due to the small size of the structure, the structure can store high quality materials, such as relatively expensive but high heat resistant materials and better materials.
The attachment of the structure to the smart label can be carried out with a large tolerance compared to the method of attaching the chip directly to the circuit pattern of the smart label.
[0019]
With the method according to the invention, for example, the following advantages are obtained.
-Efficient and reliable production processes.
-Sufficient reliability and strength of the product;
The fixed cost per smart label web is minimal and can vary.
-Flexible production technology.
− Development performance is maintained.
[0020]
In the present application, a smart label refers to a label including an RF-ID (identification) circuit or an RF-EAS (electronic articulance survey) circuit. A smart label web is one that includes a series of continuous and / or juxtaposed smart labels. Smart labels are printed by printing a circuit pattern on the film with conductive printing ink, etching the circuit pattern on a metal film, stamping the circuit pattern from the metal film, or winding the circuit pattern, for example, copper wire. Can be manufactured. An electrically operated RFID (radio frequency identification) circuit of a smart label is a simple electric oscillation circuit (RCL circuit) operated at a predetermined frequency. This circuit includes coils, capacitors and on-chip integrated circuits. The integrated circuit includes an escort memory and an RF unit configured to communicate with the reader. The capacitors of the RCL circuit can also be integrated on this chip. The smart label web is flexible and suitably rigid, polycarbonate, polyolefin, polyester, polyethylene terephthalate (PET), polyvinyl chloride (PVC), or acrylonitrile / butadiene / styrene copolymer (ABS). Such materials.
[0021]
The wafer is usually supplied for use in the mounting process, such that the chips are separated from each other at the top of the carrier film carried by the frame. Each single chip is separated in this step by mechanically pressing the chip from below the carrier film and by gripping it from the opposite side with a turning tool using negative pressure suction.
[0022]
The thermoplastic material refers to a material that can be molded by heating. At the time of raw materials, the thermoplastic resin film exists as a fluid or as a film, but is preferably a film.
[0023]
The thermoplastic resin film refers to a film having a surface which can be made to adhere to another surface by a thermal effect but is substantially non-adhesive at room temperature. Thermoplastic films can also be heated several times without substantially affecting adhesion.
[0024]
The thermoplastic resin film can be an anisotropically conductive thermoplastic resin film (AFC) or a non-conductive film (NCF). If a thermoplastic film is used, no underfill is required. This is because the thermoplastic resin film forms a sufficiently flexible backing for the chip. The use of a non-conductive thermoplastic resin film somewhat reduces the reliability of the electrode compared to the case of an anisotropically conductive film, but is still sufficient. Substantially the same processing conditions can be used for both anisotropically conductive thermoplastic films and non-conductive thermoplastic films. By way of example, thermoplastic films include 3M anisotropically conductive films 8773 and 8783 (Z-axis adhesive films 8773 and 8783). This film contains conductive particles and has electrical conductivity only in the thickness direction of the film, that is, has no conductivity in the surface direction of the film. Thermoplastic resin films can be made flowable by heating and pressing. Upon cooling, the thermoplastic resin film crystallizes and produces mechanical bond strength. No heat curing is required. The thermoplastic resin film can be, for example, polyester or polyetheramide. The conductive particles typically have a size of 7 to 50 μm and can be, for example, silver-coated glass particles. The thickness of the thermoplastic resin film is typically from 20 to 70 μm. The thermoplastic resin film is usually formed on the surface of a release paper or the like. The release paper can be released from the film when the film is heated.
[0025]
The method according to the invention firstly produces a carrier web comprising a base web and a thermoplastic material on the surface of the base web. This base web can be made of the same material as the smart label web. The surface of the base web is provided with a conductive metal coating for the electrodes of the structure. The thermoplastic material is attached to the side of the base web that has the conductive metal coating for the electrodes of the structure. The on-chip integrated circuits are sequentially and / or juxtaposed and attached to the surface of a thermoplastic material using flip-chip technology, which is preferably a thermoplastic film. Due to the small dimensions of the structure formed by the carrier web, it is possible to arrange the chips relatively close to one another on the carrier web. This also eliminates the need for long travel distances when mounting chips. Since a short moving distance is sufficient, sufficiently accurate positioning can be easily performed as compared with a case where a chip is directly attached to a circuit pattern. Furthermore, the position of the chip can be varied over a wide range.
[0026]
The thermoplastic resin film is usually laminated on the base web by heating or pressing. Each chip is lifted from the silicon wafer by a die sorter, and is continuously arranged on the surface of the thermoplastic resin film. When the chips are in place, the chips are lightly attached to the web prior to final bonding by heating the opposite side of the web including the base web and thermoplastic film. It is also possible to make the thermoplastic resin film sufficiently adhesive after lamination of the chips, in which case the adhesive for the chips can be generated without heating at the same time. Thereafter, the final bonding of the chips is performed by heating and / or pressing. At the same time, it is possible, but not necessary, to laminate a release paper web on the surface of the thermoplastic resin film. Final bonding of the chips is possible by heating and / or pressing, for example by means of a thermal resistor or a series of thermal resistors, or a nip formed by two rolls. In the nip, at least one of the contact surfaces forming the nip is heated and at least one is elastic.
[0027]
In addition to the nip described above, a nip may be formed between the shoe roll and its counter roll. The thermoplastic resin film may also be heated by microwaves, and the film can be selectively heated by simultaneously applying pressure to the joint (the material mixed with the selective adhesive is heated by a microwave electromagnetic field). .
[0028]
In a next step, a plurality of structures including the on-chip integrated circuits are separated from the carrier web, and the structures are attached to the circuit patterns of the smart labels in the web including the plurality of smart labels. The structure is attached to the side of the smart label on which the circuit pattern is provided. At this time, the thermoplastic resin film and the chip contact the smart label, and the side of the base web remains as the outer surface of the structure. The structure is substantially fully attached to the smart label and reliable adhesion is achieved. In the case of bonding, the part of the smart label in the smart label web is heated, and the structure is attached to the part or the structure is heated, so that both surfaces are bonded to each other. The final bonding of the structure is performed by applying heat and / or pressure under similar processing conditions as when bonding the chips. At the same time as mounting the structure, it is possible to simultaneously laminate other web layers from above the structure on both sides of the smart label web, or it is possible to omit those web layers and attach only the structure using the nip. Good. When several layers are combined at the same time, it is also possible to initiate crosslinking of the adhesive layer to provide a more reliable lamination or a more rigid structure.
[0029]
The use of an anisotropically conductive thermoplastic material as the thermoplastic material of the structure makes it possible to insulate the anisotropically conductive material of the structure and the circuit pattern of the smart label from each other, thereby shorting the circuit Danger can be avoided. This is made possible by the following method.
-Pressing the insulator on the surface of the circuit pattern of the smart label where the structure is to be mounted.
-Laminate the insulating film at the appropriate place on the surface of the structure. Or
Cutting the anisotropically conductive material, for example in the form of a film, and placing the conductive particles only where they are needed to form the electrode;
[0030]
The production of the carrier web and the production of the smart label web can be carried out in the same step or can be carried out in separate steps.
[0031]
Hereinafter, the present invention will be described with reference to the accompanying drawings.
[0032]
FIG. 1 shows a smart label web W2 according to the present invention, which comprises a single successive smart label 1. The smart label 1 includes a circuit pattern 2 and an on-chip integrated circuit 3, which is mounted on a surface of a separate structure 4. Electrodes are formed between the circuit pattern 2 and the on-chip integrated circuit 3. The structure 4 includes a basic web 4b, a thermoplastic resin film 4a, and an on-chip integrated circuit 3 (see FIG. 3), and the circuit 3 is mounted on the surface of the thermoplastic resin film. The structure 4 is attached to the smart label 1 by the following method. That is, one side of the structure is attached to the smart label 1 over substantially the entire area by the thermoplastic resin film. The on-chip integrated circuit 3 is left between the smart label 1 and its connection board. The thermoplastic resin film can be an anisotropically conductive thermoplastic resin film (AFC) or a non-conductive film (NCF). If a non-conductive film is used, the structure 4 and / or the circuit pattern 2 of the smart label need to have bumps for electrodes. These bumps can be provided on the same production line before the thermoplastic resin film is laminated, in which the chips are attached to the base web W1 in the following manner. That is, appropriate bumps are formed at both ends of the structure 4 using an appropriate metal as a material. Preferably, so-called stud bumps are formed in this step by a gold wire bonder.
[0033]
Figures 2a, 2b and 3 illustrate several smart label web manufacturing steps. 2a and 2b show the case where the carrier web W1 is first manufactured separately by the process shown in FIG. 2a, and then the smart label web W2 is manufactured by the process shown in FIG. 2b. FIG. 3, on the other hand, shows the process of integrating the production of the base web W1 and the smart label web W2.
[0034]
In the steps shown in FIGS. 2 a and 3, the basic web W 1 of the carrier web is unwound from the reel 5 and the thermoplastic resin film is unwound from the reel 6. The thermoplastic resin film can be an anisotropically conductive film (AFC) or a non-conductive film (NCF). The base web and the thermoplastic film are combined in a nip N1, where at least one of the two contact surfaces is heated. The release paper web of the thermoplastic resin film is wound up on a roll 7.
[0035]
From the wafer, which is separated as a plurality of single chips, individual single chips are lifted, which are placed by a fixing tool 9 on a web consisting of a base web and a thermoplastic film. Generally, the speed at which one chip is lifted from the wafer is about 200 ms. At the same time, the web is heated by the heater 8 from the back side of the web where the chips are located. The heating of the web causes the thermoplastic resin film to become tacky and the chip is thus ready for attachment. The thermoplastic resin film is preferably heated to a temperature of 80-105C.
[0036]
The final bonding of the on-chip integrated circuit 3 is performed by a thermal resistor or a series of thermal resistors 10. Therefore, it is preferable to heat the thermoplastic resin film to a temperature of 140 to 150 ° C. Alternatively, the carrier web W1 may be introduced into the nip, where at least one of the two contact surfaces is heated. The nip is preferably longer than that formed by the hard roll. The nip may be, for example, a nip N1 formed by a heating roll and an elastic roll, which has a lower pressure per unit area than a similar hard nip. One of the contact surfaces forming the nip may be a shoe roll. Heating can be performed before this nip, and the thermoplastic resin film between the circuit pattern of the smart label and the on-chip integrated circuit can be heated by, for example, microwaves. The thermoplastic film thus mixes with the microwave heated additive. After heating by microwaves, the carrier web W1 on which the on-chip integrated circuits are arranged is introduced into a processing step and pressure is applied to the joining surface. Heating by microwaves and pressurization of the joint surface can be performed simultaneously.
[0037]
The force applied to the joint surface is preferably 200-800 g per joint, irrespective of which of the methods described above is used for final chip joining. Generally, the processing time required for bonding is about 2 seconds. Since the size of a single structure is 10 to 20 mm, so as not to limit the period of 200 ms required to lift one chip from the wafer and place it at a predetermined position on the surface of the thermoplastic resin film, The treatment length should be about 200 mm.
[0038]
2a or 3 may include the step of laminating the structure 4 on a thin insulator film (not shown), which film is used as an insulator between the circuit pattern 2 and the chip 3. Where the electrodes are to be provided, the film may be removed, for example, by punching.
[0039]
The completed carrier web W1 is wound up on a roll 15 (FIG. 2a) and sent to the next step (FIG. 2b) or introduced into a subsequent step (FIG. 3). In the step of FIG. 2B, unwinding from the roll 15 is performed. The carrier web W1 is separated by the cutter 11 into a single structure 4. The web including the smart label 1 is unwound from the reel 13. The dispenser 12 aligns and positions each structure 4 on the surface of the web smart label 1 including a plurality of smart labels. The structure 4 can be easily separated even on the surface of the carrier film. The dispenser 12 may be a known one. Dispensers for disposing the structure 4 from the carrier web W1 are known, for example, as special security printing presses, according to which security bands, holograms or metal foils are supplied. On the other hand, if the structure 4 is separated on the surface of the carrier film, for example, a known technique known from labeling can be applied.
[0040]
The web unwound from the roll 13 is heated at the same time that the dispenser 12 places the structure 4 on the smart label 1. If the thermoplastic resin film used is a non-conductive thermoplastic resin film, the circuit pattern of the structure 4 or the smart label must be provided with bumps for placing electrodes between the chip and the circuit pattern. No. If several smart labels 1 are juxtaposed, each parallel row of smart labels is preferably provided with a separate dispenser. The thermoplastic resin film 4a of the structure 4 is bonded to the smart label 1, and the on-chip integrated circuit 3 is left between the smart label 1 and the thermoplastic resin film 4a. The final joining of the structure 4 is performed at the nip N2. The nip N2 may be a single nip, as shown, or a series of nips. Preferably, at least one of the two contact surfaces forming the nip is heated and at least one is elastic. The completed smart label web W2 is taken up on a reel 14.
[0041]
FIG. 4 is a sectional view of the structure 4. The structure includes an on-chip integrated circuit 3, a thermoplastic resin film 4a and a layer 4b, the layer 4b constituting the basic web. On the surface to which the thermoplastic resin film 4a is attached, the layer 4b is provided with a conductive metal coating of the structure.
[0042]
The present invention is not limited by the above-described matter, and the present invention can be modified within the scope of the claims. The production of the carrier web and the production of the smart label web can take place in the same step or in separate steps. The manufacturing process of the smart label web is performed continuously as follows. That is, other layers to be joined to the surface of the smart label web are attached in the same step, and this attachment is performed simultaneously with the final joining of the structure. It is also possible that the chip is only lightly attached to the carrier web and that the final joining of the chip does not take place until the structure is finally attached to the smart label. Thus, the process is simpler and more reliable. This is because the chips are not heated, pressed or bent repeatedly, for example. The thermoplastic material need not necessarily be in the form of a film, but may be, for example, a fluid at the time of the raw material before being placed on the web. The main idea of the invention is that the on-chip integrated circuit can be attached to the smart label in a simple and reliable way as part of a separate structure.
[Brief description of the drawings]
FIG.
1 is a plan view of a smart label web according to the present invention.
FIG. 2 and FIG. 3
3 shows several steps for producing a smart label web according to the present invention.
FIG. 4
It is sectional drawing which shows the structure of a structure.

Claims (22)

A method for producing a smart label web (W2) comprising sequential and / or juxtaposed smart labels (1), said smart labels comprising a circuit pattern (2) and an on-chip integrated circuit (3) attached thereto Forming an electrode between the on-chip integrated circuit (3) and the circuit pattern (2) on a smart label of the smart label web, the formation including the on-chip integrated circuit (3). In a method performed by separating the structure (4) from the separate carrier web (W1) and attaching it to the smart label, the structure (4) comprises a thermoplastic material, by means of which the structure causes the smart label (1). A) producing a smart label web. The method according to claim 1, wherein the thermoplastic material is a thermoplastic film (4a). 3. The method according to claim 2, wherein the thermoplastic resin film (4a) is an anisotropically conductive film or a non-conductive film. 2. The method according to claim 1, further comprising the step of providing a dispenser (12) for aligning the structure and placing it on the smart label (1). Method according to claim 4, characterized in that the structure (4) is attached to the smart label (1) substantially entirely on the side on which the thermoplastic resin film (4a) is provided. . The method according to claim 5, wherein the position of the smart label (1) where the structure (4) is attached is heated such that the thermoplastic resin film (4a) can be adhered to the smart label. A method comprising: Method according to claim 6, characterized in that the smart label web (W2) comprising the smart label (1) with the structure (4) is subjected to a heat and / or pressure treatment. The method according to claim 7, wherein the heat and pressure treatments are performed simultaneously or sequentially. The method according to claim 7, characterized in that the smart label web (W2) is heated and pressed to the web and simultaneously combined with another web layer. The method of claim 7, wherein the smart label web (W2) is heated and pressed in a nip (N2) formed at a contact surface, at least one of the contact surfaces being elastic; A method comprising heating at least one. 8. The method according to claim 7, wherein the heating and pressurizing of the smart label web (W2) first heats the thermoplastic resin film (4a) with microwaves and then the smart label web (W2). A method of applying pressure to an object. A smart label web (W2) comprising sequential and / or juxtaposed smart labels (1) comprising a circuit pattern (2) and an on-chip integrated circuit (3) attached thereto. Wherein the circuit is attached to the smart label by a structure (4) separated from a separate carrier web (W1), wherein the structure (4) comprises a thermoplastic material, whereby the structure comprises A smart label web attached to a smart label. 13. The smart label web according to claim 12, wherein the thermoplastic material is an anisotropically conductive thermoplastic resin film (4a). 14. The smart label web according to claim 13, wherein the structure (4) and the circuit pattern (12) are insulated from each other, the insulation being provided only at the points where the structure and the circuit pattern are precisely defined. A smart label web, which is achieved by having 13. The smart label web according to claim 12, wherein the thermoplastic material is a non-conductive thermoplastic film (4a). The structure (4) comprising the on-chip integrated circuit (3) can be separated from the carrier web, the carrier web comprising the sequential and / or juxtaposed carrier web (W1) comprising the on-chip integrated circuit (3). A method of manufacturing a carrier web, characterized in that the carrier web comprises a thermoplastic material and the on-chip integrated circuit (3) is mounted on a surface of the material. 17. The method according to claim 16, wherein the thermoplastic material is a thermoplastic film (4a). Method according to claim 17, characterized in that the thermoplastic film (4a) is laminated to a base web (4b) before the on-chip integrated circuit (3) is mounted. Method according to one of claims 16 to 18, characterized in that the final bonding of the on-chip integrated circuit (3) is performed by heating and / or pressing. Method according to claim 18, characterized in that the structure (4) is provided with bump electrodes before the thermoplastic resin film (4a) is laminated to the base web (4b). In a structure (4) comprising an on-chip integrated circuit (3) for a smart label (1) in a smart label web (W2), the structure (4) comprises a thermoplastic material, by means of which the structure comprises the smart material. A structure which is attachable to a label (1). 22. The method according to claim 21, wherein the thermoplastic material is an anisotropically conductive film or a non-conductive film.

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