JP2001274523A - Prepreg for printed wiring board - Google Patents
Prepreg for printed wiring boardInfo
- Publication number
- JP2001274523A JP2001274523A JP2000082662A JP2000082662A JP2001274523A JP 2001274523 A JP2001274523 A JP 2001274523A JP 2000082662 A JP2000082662 A JP 2000082662A JP 2000082662 A JP2000082662 A JP 2000082662A JP 2001274523 A JP2001274523 A JP 2001274523A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- fiber
- prepreg
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ポリベンゾオキ
サゾール（PBO）繊維不繊布を基材とするプリント配線
板用プリプレグに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg for a printed wiring board based on a nonwoven fabric of polybenzoxazole (PBO) fiber.
【０００２】[0002]
【従来の技術とその課題】近年、電子機器の小型軽量
化、高密度化の点よりプリント配線板に搭載する電子部
品は、表面実装方式が主流になりつつある。2. Description of the Related Art In recent years, the surface mounting method of electronic parts mounted on a printed wiring board has become mainstream in view of reduction in size, weight, and density of electronic equipment.
【０００３】この方式では、搭載したチップ部品とプリ
ント配線板との半田接合部に冷熱サイクルによるクラッ
クが生じないよう、プリント配線板の材料である金属張
り積層板に対して、そのタテ及びヨコ方向の熱膨張係数
をチップ部品に近づける要求が強くなっている。その要
求に応えるものとして、従来、熱硬化性樹脂を含浸する
基材として負の膨張係数を有する芳香族ポリアミド繊維
を用いた積層板がある。この繊維を補強材とした積層板
は、含浸樹脂の大きな膨張を抑制できるため、積層板と
した時の膨張係数を低くすることができる。In this method, a metal-clad laminate, which is a material of a printed wiring board, is placed in a vertical and horizontal direction so that cracks due to cooling and heating cycles do not occur in a solder joint between a mounted chip component and the printed wiring board. There is an increasing demand for making the thermal expansion coefficient of a semiconductor device close to that of a chip component. In order to meet the demand, there has been a laminated board using an aromatic polyamide fiber having a negative coefficient of expansion as a substrate impregnated with a thermosetting resin. Since the laminate using the fiber as a reinforcing material can suppress a large expansion of the impregnated resin, the coefficient of expansion when the laminate is formed can be reduced.
【０００４】しかしながら、芳香族ポリアミド繊維は、
表面が不活性で、金属張り積層板の基材として広く使用
されているシランカップリング剤によって表面処理した
ガラス繊維の場合と比較して熱硬化性樹脂との接着強度
が低く、また、芳香族ポリアミド繊維自体の吸湿特性が
悪いため、芳香族ポリアミド繊維不織布に熱硬化性樹脂
を含浸したプリプレグを使用した銅張り積層板が、吸湿
によって部品実装時の加熱工程でフクレが生じ易いとい
う欠点があった。[0004] However, aromatic polyamide fibers are
The surface is inert and has lower adhesive strength with thermosetting resin than glass fiber treated with a silane coupling agent, which is widely used as a base material for metal-clad laminates. Because the polyamide fibers themselves have poor moisture absorption properties, copper-clad laminates using prepregs in which an aromatic polyamide fiber nonwoven fabric is impregnated with a thermosetting resin have the disadvantage that blisters are likely to occur in the heating step during component mounting due to moisture absorption. Was.
【０００５】また、芳香族ポリアミド繊維不織布の抄造
に際しては、バインダや分散材が添加され、芳香族ポリ
アミド繊維同士を接着させてシート状の不織布としてい
る。そして、これに用いられるバインダ樹脂は、芳香族
ポリアミド単繊維同士を接着する働きをしているが、完
全硬化状態となっている。そのため、その後の芳香族ポ
リアミド繊維不織布に熱硬化性樹脂を含浸・予備乾操し
て作成されるプリプレグを用いて加熱・加圧して得られ
る積層板では、不織布中にあるバインダ樹脂と含浸樹脂
との接着力が低く、それがフクレの原因となっていた。[0005] Further, at the time of making the aromatic polyamide fiber nonwoven fabric, a binder and a dispersing agent are added, and the aromatic polyamide fibers are bonded to each other to form a sheet-like nonwoven fabric. The binder resin used for this serves to bond the aromatic polyamide single fibers to each other, but is in a completely cured state. Therefore, in a laminate obtained by impregnating a thermosetting resin into a non-woven aromatic polyamide fiber non-woven fabric and heating and pressing using a prepreg prepared by pre-drying, a binder resin and an impregnated resin in the non-woven fabric are used. Had low adhesion, which caused blisters.
【０００６】そこで、この発明は、吸湿率が高く、層間
の接着力が低いことによって加熱時にフクレが生じやす
いという、熱膨張率の低い有機合成繊維による積層板の
欠点をなくすことを課題とするものである。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to eliminate the drawbacks of a laminate made of organic synthetic fibers having a low coefficient of thermal expansion, which has a high moisture absorption and a low adhesive strength between layers, which tends to cause blisters during heating. Things.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、この発明は、プリント配線板用プリプレグを次のよ
うに構成したものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a prepreg for a printed wiring board as follows.
【０００８】まず、この発明では、プリント配線板用プ
リプレグの基材として、吸湿特性に優れたポリベンゾオ
キサゾール（PBO）繊維不織布を用いる。そして、その
抄造時にエポキシ樹脂バインダを、5重量％以上20重量
％以下の割合で含有させ、さらにそのエポキシ樹脂バイ
ンダが、半硬化状態にある状態で、熱硬化性樹脂を含浸
・予備乾操している。First, in the present invention, a polybenzoxazole (PBO) fiber nonwoven fabric having excellent moisture absorption properties is used as a base material of a prepreg for a printed wiring board. Then, at the time of the papermaking, an epoxy resin binder is contained in a ratio of 5% by weight or more and 20% by weight or less, and further, the epoxy resin binder is impregnated with a thermosetting resin in a semi-cured state, and is preliminarily dried. ing.
【０００９】上記エポキシ樹脂バインダの半硬化状態
は、アセトンにて含浸させた時の不織布の引張強度を常
態時の10〜50％となるように、エポキシ樹脂バインダの
硬化度を調整している。In the semi-cured state of the epoxy resin binder, the degree of curing of the epoxy resin binder is adjusted so that the tensile strength of the nonwoven fabric when impregnated with acetone is 10 to 50% of that in a normal state.
【００１０】この発明に用いられるポリベンゾオキサゾ
ール（PBO）繊維は、剛直性高分子繊維であり、熱膨張
率が低く、耐熱性および吸湿特性の優れる有機繊維（例
商品名：東洋紡製ザイロンＡＳ、ＨＭなど）であり、
吸湿量が少なくフクレが発生しにくい。The polybenzoxazole (PBO) fiber used in the present invention is a rigid polymer fiber, an organic fiber having a low coefficient of thermal expansion, excellent heat resistance and excellent moisture absorption properties (eg, trade name: Zylon AS manufactured by Toyobo, HM)
Low moisture absorption and less blistering.
【００１１】ポリベンゾオキサゾール（PBO）繊維の繊
維長は1mmから15mmが望ましい。好ましくは、繊維長が3
mm〜10mmである。繊維長が1mm未満の場合、不織布とし
ての抄紙加工が難しく、機械的物性も低下する。繊維長
が15mmを超えるとポリベンゾオキサゾール（PBO）繊維
が極めて剛直なため、得られるプリプレグのスリッター
およびロールカッターによる切断加工性が短繊維長のも
のより大幅に悪くなる。The fiber length of the polybenzoxazole (PBO) fiber is preferably 1 mm to 15 mm. Preferably, the fiber length is 3
mm to 10 mm. When the fiber length is less than 1 mm, papermaking as a nonwoven fabric is difficult, and the mechanical properties are reduced. If the fiber length exceeds 15 mm, since the polybenzoxazole (PBO) fiber is extremely rigid, the cutability of the obtained prepreg by a slitter and a roll cutter is significantly worse than that of the short fiber length.
【００１２】この発明に用いられるポリベンゾオキサゾ
ール（PBO）繊維不織布は、当該繊維をエポキシ樹脂バ
インダや分散剤と共に抄紙した後に、乾燥及びカレンダ
ー加工して作製されるものであり、その抄造に用いられ
るエポキシ樹脂バインダは、5重量％以上20重量％の添
加量が望ましい。エポキシ樹脂バインダが5重量％未満
の場合は繊維間の接着強度が低く、不織布が切れやす
い。一方、20重量％を越える場合は、有機繊維不織布プ
リプレグを硬化させて得られるプリント配線板の特性に
バインダ樹脂の影響が強く現れ、一般的には、耐熱性や
耐湿性が劣化するので好ましくない。The nonwoven fabric of polybenzoxazole (PBO) fiber used in the present invention is produced by paper-making the fiber together with an epoxy resin binder and a dispersing agent, followed by drying and calendering. The epoxy resin binder is preferably added in an amount of 5% by weight or more and 20% by weight. When the epoxy resin binder is less than 5% by weight, the adhesive strength between the fibers is low, and the nonwoven fabric is easily cut. On the other hand, when the content exceeds 20% by weight, the effect of the binder resin strongly appears on the characteristics of the printed wiring board obtained by curing the organic fiber nonwoven fabric prepreg, and in general, heat resistance and moisture resistance deteriorate, which is not preferable. .
【００１３】一般的にバインダには、エマルジョンタイ
プのエポキシ樹脂と硬化剤を用いている。具体的には、
ビスフェノールＡ型エポキシ樹脂などと、メラミンやイ
ソシアネートなどの硬化剤を用いる。エポキシ樹脂バイ
ンダは、抄造工程での乾操度合いを調整することで、カ
レンダー加工後において半硬化状態とする。エポキシ樹
脂バインダの硬化度の調整は、不織布の引張強度におい
て、アセトンを含浸させた時の値が常態と比較して10〜
50％となるように調整する。50％以上の硬化度では、乾
燥工程での硬化が進み過ぎて、次のカレンダー加工にお
いてエポキシ樹脂バインダが脆くなっており、後工程で
含浸される熱硬化性樹脂との接着性が悪くなる。10％未
満の硬化度では、含浸・乾燥工程での加熱乾燥時の強度
が低く、不織布が切断して、製造ができなくなる。In general, an epoxy resin of an emulsion type and a curing agent are used as a binder. In particular,
A bisphenol A type epoxy resin or the like and a curing agent such as melamine or isocyanate are used. The epoxy resin binder is brought into a semi-cured state after calendering by adjusting the degree of drying in the papermaking process. Adjustment of the degree of curing of the epoxy resin binder, the tensile strength of the nonwoven fabric, the value when impregnated with acetone is 10 to 10
Adjust to 50%. If the degree of curing is 50% or more, the curing in the drying step proceeds excessively, and the epoxy resin binder becomes brittle in the next calendering, and the adhesion to the thermosetting resin impregnated in the subsequent step deteriorates. If the degree of curing is less than 10%, the strength at the time of heating and drying in the impregnation / drying step is low, and the nonwoven fabric is cut, so that production cannot be performed.
【００１４】この発明のポリベンゾオキサゾール（PB
O）繊維不織布に、含浸させる熱硬化性樹脂としては、
特に限定するものではないが、エポキシ樹脂、ポリアミ
ド樹脂、ポリイミド樹脂、熱硬化性ＰＰＥ樹脂等があ
る。The polybenzoxazole (PB) of the present invention
O) The thermosetting resin to impregnate the fiber non-woven fabric
Although there is no particular limitation, there are an epoxy resin, a polyamide resin, a polyimide resin, and a thermosetting PPE resin.
【００１５】尚、ポリベンゾオキサゾール（PBO）繊維
単独では、その剛直性が高いために、レーザー加工性お
よびプリプレグ加工性が芳香族ポリアミド繊維品よりも
若干劣る。このため、その改善策として芳香族ポリアミ
ド繊維（例 商品名：東レデュボン製ケブラー、クラレ
製ベクトランなど）、芳香族ポリエステル繊維と併用す
ることもできる。[0015] Polybenzoxazole (PBO) fibers alone have high rigidity, so that their laser workability and prepreg workability are slightly inferior to those of aromatic polyamide fiber products. For this reason, aromatic polyamide fibers (eg, trade name: Kevlar manufactured by Toray Dubon, Vectran manufactured by Kuraray, etc.) and aromatic polyester fibers can be used in combination as an improvement measure.
【００１６】この発明は、上記のように、有機繊維不織
布が、ポリベンゾオキサゾール（PBO）繊維単独、或い
は、芳香族ポリアミド繊維、芳香族ポリエステル繊維と
の混抄で、抄造乾燥後のバインダの硬化状態を半硬化状
態としておくことにより、有機繊維不繊布に熱硬化性樹
脂を含浸・乾操させたプリプレグを加熱・加圧して積層
板を作成する際に、バインダと熱硬化性樹脂とが共に溶
融して、接着性が向上する。この結果、積層板としての
層間強度が増し、積層板の吸湿及び加熱冷却による膨張
・収縮に伴う有機繊維と熱硬化性樹脂の剥離が起こりに
くくなる。According to the present invention, as described above, the organic fiber nonwoven fabric is made of polybenzoxazole (PBO) fiber alone or mixed with aromatic polyamide fiber or aromatic polyester fiber, and the cured state of the binder after papermaking and drying. Is kept in a semi-cured state, so that the binder and the thermosetting resin melt together when the prepreg impregnated with organic resin nonwoven fabric and dried is heated and pressed to create a laminate. Thus, the adhesiveness is improved. As a result, the interlayer strength of the laminate is increased, and peeling of the organic fiber and the thermosetting resin due to expansion and contraction due to moisture absorption and heating and cooling of the laminate is less likely to occur.
【００１７】[0017]
【実施例】以下、この発明の実施例を説明する。Embodiments of the present invention will be described below.
【００１８】［実施例１］有機繊維不織布として、繊維
長5mmのPBO繊維（商品名：東洋紡製ザイロンＡＳ）を単
体で使用した。Example 1 PBO fiber having a fiber length of 5 mm (trade name: Zylon AS manufactured by Toyobo) was used alone as an organic fiber nonwoven fabric.
【００１９】また、バインダにはエマルジョンタイプの
エポキシ樹脂（商品名：EN−0270大日本インキ化学工業
製）を使用し、バインダ量は10重量部で、抄造・カレン
ダー加工後のバインダの硬化状態はアセトン含浸時の引
張強度が常態時の20％の半硬化状態とした。The binder used was an emulsion type epoxy resin (trade name: EN-0270, manufactured by Dainippon Ink and Chemicals, Inc.), the amount of the binder was 10 parts by weight, and the cured state of the binder after papermaking and calendering was determined. The tensile strength at the time of impregnation with acetone was a semi-cured state of 20% of the normal state.
【００２０】なお、PBO繊維不織布は、重量70ｇ／ｍ2
が、密度0．7ｇ／ｃｍ3 の不織布を使用した。The PBO fiber non-woven fabric has a weight of 70 g / m 2.
However, a nonwoven fabric having a density of 0.7 g / cm 3 was used.
【００２１】エポキシ樹脂（商品名：東都化成製YDB−4
00）100重量部、ジアミノジフェニルスルホン15重量
部、2エチル4メチルイミダゾール0．10重量部を配合し
た組成物を、上記PBO繊維不織布に含浸乾操して、樹脂
量55ｗｔ％のプリプレグを得た。得られたプリプレグを
5枚重ね、その表面に18マイクロメートル厚の銅箔を両
面に配置して、温度180℃、圧力30ｋｇｆ／ｃｍ2 で90
分間加熱加圧成形して、両面銅張り積層板を得た。Epoxy resin (trade name: YDB-4 manufactured by Toto Kasei)
00) A composition containing 100 parts by weight, 15 parts by weight of diaminodiphenylsulfone, and 0.10 parts by weight of 2-ethyl-4-methylimidazole was impregnated into the PBO fiber nonwoven fabric and dried to obtain a prepreg having a resin amount of 55 wt%. . The obtained prepreg
Stacked five, place the 18 micrometer thick copper foil on the surface on both sides, the temperature 180 ° C., at a pressure 30 kgf / cm 2 90
The molded body was heated and pressed for minutes to obtain a double-sided copper-clad laminate.
【００２２】［実施例２］バインダーの硬化度を50％と
した以外は実施例1と同様にして、銅張り積層板を得
た。Example 2 A copper-clad laminate was obtained in the same manner as in Example 1 except that the curing degree of the binder was changed to 50%.
【００２３】［実施例３］バインダ量を15重量部で有機
繊維不織布を抄造し、他は実施例1と同様にして両面銅
張り積層板を得た。Example 3 A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that an organic fiber nonwoven fabric was made with a binder amount of 15 parts by weight.
【００２４】［比較例１］アセトン含浸時の引張強度
を、常態時の60％とした以外は実施例1と同様にして両
面銅張り積層板を得た。Comparative Example 1 A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that the tensile strength at the time of impregnation with acetone was set to 60% of the normal state.
【００２５】［比較例２］バインダ量を3重量部とした
以外は実施例1と同様にして両面銅張り積層板を得た。Comparative Example 2 A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that the amount of the binder was changed to 3 parts by weight.
【００２６】［比較例３］硬化度を10％とした以外は実
施例1と同様にして両面銅張り積層板を得た。Comparative Example 3 A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that the degree of curing was changed to 10%.
【００２７】［比較例４］バインダ量を30重量部とした
以外は実施例1と同様にして両面鋼張り積層板を得た。Comparative Example 4 A double-sided steel-clad laminate was obtained in the same manner as in Example 1 except that the amount of the binder was changed to 30 parts by weight.
【００２８】［比較例５］有機繊維不織布として、芳香
族ポリアミド繊維（商品名：東レデュボン製ケブラー）
を使用し、他は比較例1と同様にして両面銅張り積層板
を得た。[Comparative Example 5] As an organic fiber non-woven fabric, an aromatic polyamide fiber (trade name: Kevlar manufactured by Toray Duvong)
Was used in the same manner as in Comparative Example 1 to obtain a double-sided copper-clad laminate.
【００２９】上記実施例、比較例で得た両面銅張り積層
板で下記項目試験を行った。The following item tests were performed on the double-sided copper-clad laminates obtained in the above Examples and Comparative Examples.
【００３０】［熱衝撃におけるフクレ試験］100mm角の
各試料を270℃の半田浴に1分間、3分間浸漬し、繊維−
熱硬化性樹脂間の剥離によるフクレの発生を調べた。[Swelling Test in Thermal Shock] Each sample of 100 mm square was immersed in a solder bath at 270 ° C. for 1 minute and 3 minutes.
The occurrence of blisters due to peeling between thermosetting resins was examined.
【００３１】［冷熱サイクルにおけるフクレ試験］100m
m角の各試料を−65℃で30分と125℃で30分の冷熱サイク
ルを100サイクル、150サイクル実施した後、繊維−熱硬
化性樹脂間の剥離によるフクレの発生を調べた。[Swelling test in cooling and heating cycle] 100 m
Each sample of m-square was subjected to 100 cycles and 150 cycles of cooling and heating at −65 ° C. for 30 minutes and at 125 ° C. for 30 minutes, and then the occurrence of blisters due to peeling between the fiber and the thermosetting resin was examined.
【００３２】［絶縁抵抗試験］JIS C−6481に従い絶縁
抵抗測定用試料を作成し、121℃、2気圧の飽和水蒸気中
に1時間及び2時間放置した後の絶縁抵抗の劣化を測定し
た。[Insulation Resistance Test] A sample for insulation resistance measurement was prepared in accordance with JIS C-6481, and the deterioration of the insulation resistance was measured after being left in saturated steam at 121 ° C. and 2 atm for 1 hour and 2 hours.
【００３３】［熱膨張係数］巾3mm、長さ10mmの各試料
を、熱分析装置を用いて、熱膨張量の測定を行い、70℃
〜130℃の熱膨張係数の算出を行った。[Coefficient of thermal expansion] The amount of thermal expansion of each sample having a width of 3 mm and a length of 10 mm was measured using a thermal analyzer and measured at 70 ° C.
The coefficient of thermal expansion of ~ 130 ° C was calculated.
【００３４】［穴明け加工性試験］各試料をパンチング
マシーンにて、Φ１．０ｍｍの穴を明け、バリの発生を
調べた。[Drilling Workability Test] Each sample was drilled with a punching machine at a diameter of 1.0 mm, and the occurrence of burrs was examined.
【００３５】［不織布の引っ張り強度試験］幅15m、長
さ120mmの不織布をJISに準拠して、受理状態とアセトン
浸漬後の引っ張り強度を測定した。アセトン浸漬は室温
の5分間とした。硬化度は次の式によって求めた。 硬化度％＝（アセトン浸漬後の引っ張り強度）／（受理
状態の引っ張り強度）×100 上記の試験結果は、表1に示す通りである。[Tensile Strength Test of Non-Woven Fabric] A non-woven fabric having a width of 15 m and a length of 120 mm was measured for a receiving state and a tensile strength after immersion in acetone in accordance with JIS. Acetone immersion was performed at room temperature for 5 minutes. The degree of cure was determined by the following equation. Curing degree% = (tensile strength after immersion in acetone) / (tensile strength in received state) × 100 The test results are as shown in Table 1.
【００３６】[0036]
【表１】 [Table 1]
【００３７】[0037]
【発明の効果】表１の結果からも明らかなように、この
発明によれば、吸水率が低く、且つ有機繊維と熱硬化性
樹脂の接着力をより強くすることができたため、熱衝撃
によるフクレが発生しにくく、また、水の侵入を防止し
て、絶縁抵抗の経時劣化を少なく抑えることができる。
また、熱膨張係数も小さくすることができる。As is clear from the results shown in Table 1, according to the present invention, the water absorption rate is low and the adhesive force between the organic fiber and the thermosetting resin can be further increased. Swelling does not easily occur, and the intrusion of water can be prevented, so that the deterioration with time of the insulation resistance can be suppressed to a small extent.
Further, the coefficient of thermal expansion can be reduced.
Claims (2)
用いた不織布の抄造時におけるエポキシ樹脂バインダの
含有量が5重量％以上20重量％以下で、そのエポキシ樹
脂バインダが半硬化状態にある不織布に、熱硬化性樹脂
を含浸させ予備乾燥させているプリント配線板用プリプ
レグ。1. A non-woven fabric in which the content of an epoxy resin binder is 5% by weight or more and 20% by weight or less and the epoxy resin binder is in a semi-cured state during papermaking of a non-woven fabric using polybenzoxazole (PBO) fiber, Pre-preg for printed wiring boards impregnated with thermosetting resin and pre-dried.
る不織布に、アセトンを含浸させた時の引張強度が常態
時の10〜50％となるように、エポキシ樹脂バインダの硬
化度を調整していることを特徴とする請求項１に記載の
プリント配線板用プリプレグ。2. The degree of curing of the epoxy resin binder is adjusted so that the non-woven fabric in which the epoxy resin binder is in a semi-cured state is impregnated with acetone to have a tensile strength of 10 to 50% of the normal state. The prepreg for a printed wiring board according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000082662A JP2001274523A (en) | 2000-03-23 | 2000-03-23 | Prepreg for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000082662A JP2001274523A (en) | 2000-03-23 | 2000-03-23 | Prepreg for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001274523A true JP2001274523A (en) | 2001-10-05 |
Family
ID=18599435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000082662A Pending JP2001274523A (en) | 2000-03-23 | 2000-03-23 | Prepreg for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001274523A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006022433A (en) * | 2004-07-08 | 2006-01-26 | Tomoegawa Paper Co Ltd | Electric insulating base material and method for producing the same, prepreg using the base material and substrate for printed circuit |
| US7925415B2 (en) * | 2007-10-18 | 2011-04-12 | Fuji Jukogyo Kabushiki Kaisha | Vehicle drive assist system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH036892A (en) * | 1989-05-29 | 1991-01-14 | General Electric Co <Ge> | Multilayer printed wiring board |
| JPH11107187A (en) * | 1997-10-02 | 1999-04-20 | Oji Paper Co Ltd | Nonwoven fabric for highly thermoconductive laminate |
| JPH11207850A (en) * | 1998-01-29 | 1999-08-03 | Hitachi Chem Co Ltd | Resin sheet, metal foil clad laminated board and multi-layer printed-wiring board |
| JP2000043042A (en) * | 1998-07-29 | 2000-02-15 | Asahi Chem Ind Co Ltd | Polyphenylene ether resin prepreg |
| JP2000079612A (en) * | 1998-09-07 | 2000-03-21 | Asahi Chem Ind Co Ltd | Epoxy resin prepreg |
-
2000
- 2000-03-23 JP JP2000082662A patent/JP2001274523A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH036892A (en) * | 1989-05-29 | 1991-01-14 | General Electric Co <Ge> | Multilayer printed wiring board |
| JPH11107187A (en) * | 1997-10-02 | 1999-04-20 | Oji Paper Co Ltd | Nonwoven fabric for highly thermoconductive laminate |
| JPH11207850A (en) * | 1998-01-29 | 1999-08-03 | Hitachi Chem Co Ltd | Resin sheet, metal foil clad laminated board and multi-layer printed-wiring board |
| JP2000043042A (en) * | 1998-07-29 | 2000-02-15 | Asahi Chem Ind Co Ltd | Polyphenylene ether resin prepreg |
| JP2000079612A (en) * | 1998-09-07 | 2000-03-21 | Asahi Chem Ind Co Ltd | Epoxy resin prepreg |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006022433A (en) * | 2004-07-08 | 2006-01-26 | Tomoegawa Paper Co Ltd | Electric insulating base material and method for producing the same, prepreg using the base material and substrate for printed circuit |
| JP4580705B2 (en) * | 2004-07-08 | 2010-11-17 | 株式会社巴川製紙所 | Base material for electrical insulation, method for producing the same, and prepreg and printed wiring board using the base material |
| US7925415B2 (en) * | 2007-10-18 | 2011-04-12 | Fuji Jukogyo Kabushiki Kaisha | Vehicle drive assist system |
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